LG WB1NP8 User Manual

V1.1

2017.10.26

Date

2017.10.26

Revision

1.1

Page

42

MSL Level

4

PRODUCT APPROVAL DATASHEET

PRODUCT

MODEL NAME

WB1NP8

MCSLogic P/N

MB8675C0

LG P/N

EAT64075301

CUSTOMER

LG Electronics

Checked By

Approved By

Company Seal

Bluetooth Adapter Card

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MCSLOGIC

V1.1

2017.10.26

Revision History

Version

Date

(YY/MM/DD)

Revision Description

1.0

1.1

17/09/18 17/10/26

Initial release

“6. Module Schematic” is updated “7. Electrical Characteristics” is updated “12. Planar figure of parts” is updated

Add LG P/N Add “17.Reliability Test” Add “18.RF Test Data”

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The present condition of RF Certification

MODEL NAME

WB1NP8

LG P/N

EAT64075301

No

Country of RF Certification

Mark of RF Certification

1

Canada(IC)

TBD 2 North America(FCC)

TBD 3 South Korea(KC)

TBD

4

Europe(CE)

TBD 5 Taiwan(NCC)

TBD

6

Japan(TELEC)

TBD

7

China(SRRC)

TBD 8 Argentina(CNC)

TBD

TBD TBD

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Table of Contents

1. GENERAL DESCRIPTION .......................................................................................................................................... 5

2. QUALITY ........................................................................................................................................................................ 5

3. TEST ................................................................................................................................................................................ 5

4. BLOCK DIAGRAM ....................................................................................................................................................... 6

5. PIN DESCRIPTIONS ..................................................................................................................................................... 7

6. MODULE SCHEMATIC ............................................................................................................................................. 10

7. ELECTRICAL CHARACTERISTICS ....................................................................................................................... 11

8. MODULE’S MARKING INFORMATION ............................................................................................................... 15

9. MECHANICAL DIMENSION .................................................................................................................................... 16

10. PCB SMT GUIDE ......................................................................................................................................................... 18

11. BILL OF MATERIALS ............................................................................................................................................... 20

12. PLANAR FIGURE OF PARTS ................................................................................................................................... 22

13. PACKING INFORMATION ....................................................................................................................................... 23

13.1 TRAY ................................................................................................................................................................ ............. 23

13.2 INNER BOX .................................................................................................................................................................. 24

13.3 OUTTER BOX .............................................................................................................................................................. 25

13.4 PACKING PROCESS .................................................................................................................................................. 26

13.5 STATIC SHIELD BAG ................................................................................................................................ ................ 27

14. REFLOW PROFILE .................................................................................................................................................... 28

15. MODULE POSITION GUIDE .................................................................................................................................... 29

16. PCB ANTENNA REPORT .......................................................................................................................................... 30

17. RELIABILITY TEST ................................................................................................................................................... 33

18. RF TEST DATA ............................................................................................................................................................ 38

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1. General Description

WB1NP8 is a fully integrated Bluetooth module. It is based on CSR’s Bluecore 8675 chip with specific interface design to meet LG Electronics’s needs.

WB1NP8 is compatible with Bluetooth specification version 4.2. It integrates RF, Baseband controller, etc., a completed Bluetooth subsystem.

Features :

- Operation Range (Class I)

- Fully Compatible with Bluetooth Specification 4.2

- Dual-mode Bluetooth / Bluetooth low energy

- Operating Temperature Range : -10℃ ~ 70℃

- Operating VDD Range : 3.0 V ~ 3.6V

- Interface : UART/USB

- Internal Antenna

- RoHS Compliant

Applications :

- Consumer Products

2. Quality

Qaulity should meet each condition which mentioned on this specification. However, the items which are not mentioned on this specification follow the inspection agreements and standards which are agree with both companies.

3. Test

Electrical characteristics are tested for every products. However, if there are any objection in judgement, it should be treated with agreements of companies.

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4. Block Diagram

Confidental

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5. Pin Descriptions

Confidental

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