LG W5200, G5200 Service Manual

SERVICE MANUAL MODEL : G5200 / W5200

GSM Phone

SERVICE MANUAL

P/N : MMBD0015801 JUNE, 2002

MODEL : G5200/W5200

- 1 -

1. INTRODUCTION

.......................................

4

1.1 Purpose

..................................................

4

1.2 Regulatory Information

..........................

4

A. Security

..............................................

4

B. Incidence of Harm

..............................

4

C. Changes in Service

............................

4

D. Maintenance Limitations

....................

4

E. Notice of Radiated Emissions

.............

5

F. Pictures

..............................................

5

G. Interference and Attenuation

.............

5

H. Electrostatic Sensitive Devices

..........

5

1.3 Abbreviations

.........................................

6

2. PERFORMANCE

.....................................

8

2.1 H/W Feature

...........................................

8

2.2 Technical Specification

..........................

9

3. TECHNICAL BRIEF

............................

13

3.1 General Descreption

...........................

. 13

3.2 Receiver

...............................................

13

A. RF front end

.....................................

14

B. Demodulator and

baseband processing

......................

14

C. DC Offset Compensation

................

14

3.3 Transmitter Part

...................................

15

A. IF Modulator

...................................

. 15

B. OPLL

...............................................

16

C. Synthesizer

......................................

16

D. TX APC Part

....................................

17

E. Power Amplifier

................................

17

3.4 13 MHz Clock

......................................

18

3.5 Power Supplies and Control Signals

....

18

3.6 Digital Main Processor

.........................

19

3.7 Analog Main Processor

........................

24

3.8 Power Management

..............................

26

3.9 Memories

..............................................

28

3.10 Display and Interfaces

........................

28

3.11 Keypad Switches and Scanning

..........

29

3.12 Microphone

.........................................

30

3.13 Earpiece

.............................................

31

3.14 Hands-free Interface

..........................

32

3.15 Headset Jack Interface

.......................

32

3.16 Key Back-light Illumination

..................

32

3.17 LCD Back-light Illumination

................

33

3.18 Multi-Color LED Illumination

..............

33

3.19 Speaker & MIDI IC

.............................

34

4. TROUBLE SHOOTING

.....................

35

4.1 RF Components

.................................

35

4.2 Tx Trouble

..........................................

44

4.3 Power on Trouble

...............................

60

4.4 Charging Trouble

...............................

62

4.5 LCD Trouble

.......................................

64

4.6 Receiver Trouble .

...............................

66

4.7 Speaker Trouble

.................................

69

4.8 Mic Trouble

..........................................

72

4.9 Vibrator Trouble

.................................

75

4.10 Backlight Trouble

.............................

77

4.11 Folder on/off Trouble

........................

79

4.12 SIM Detect Trouble

..........................

81

4.13 Earphone Trouble

............................

83

4.14 HFK Trouble

.....................................

87

5. ASSEMBLY INSTRUCTION

............

95

5.1 Disassembly

.......................................

95

6. DOWNLOAD

.......................................

102

6.1 Download Setup

...............................

102

6.2 Download Procedure

........................

103

Table Of Contents

- 2 -

7. BLOCK DIAGRAM

.............................

106

7.1 Main Board

.......................................

106

7.2 FPCB

................................................

107

7.3 RF

....................................................

107

8. CIRCUIT DIAGRAM

...........................

109

8.1 Baseband Interface

..........................

109

8.2 MIDI

..................................................

110

8.3 KYE, I/F & LCD CON

.......................

111

8.4 RF

....................................................

112

9. PCB LAYOUT

.....................................

113

10. ENGINEERING MODE

..................

115

10.1 BB Test [MENU 1]

........................

115

10.2 RF Test [MENU 2]

........................

117

10.3 MF Mode [MENU 3]

......................

118

10.4 Trace option [MENU 4]

.................

119

10.5 Call Timer [MENU 5]

.....................

119

10.6 Fact. Reset [MENU 6]

...................

119

10.7 S/W version [MENU 7]

..................

119

11. STAND ALONE TEST

...................

120

11.1 Introduction

...................................

120

11.2 Setting Method

.............................

120

11.3 Means of Test

...............................

120

12. AUTO CALIBRATION

...................

121

12.1 Overview

.......................................

121

12.2 Requirements

...............................

121

12.3 Menu and settings

........................

121

12.4 AGC

..............................................

123

12.5 APC

..............................................

123

12.6 ADC

..............................................

123

12.7 Setting

..........................................

123

12.8 How to do calibration

....................

123

13. EXPLODED VIEW &
REPLACEMENT PART LIST

......

124

13.1 Exploded View

..............................

124

13.2 Accessories

..................................

126

13.3 Replacement Part List

..................

127

- 3 -

REVISED HISTORY

The information in this manual is subject to change without notice and should not be construed as
a commitment by LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make
changes to equipment design as advances in engineering and manufacturing methods warrant.

This manual provides the information necessary to install, program, operate and maintain the
G5200.

DATE ISSUE CONTENTS OF CHANGES S/W VERSION

APRIL/2002 ISSUE 1 Initial Release

1. INTRODUCTION

- 4 -

1. INTRODUCTION

1.1 Purpose

This manual provides the information necessary to repair, calibration, description and download the
features of the G5200.

1.2 Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part
(for example, persons other than your company’s employees, agents, subcontractors, or person
working on your company’s behalf) can result in substantial additional charges for your
telecommunications services. System users are responsible for the security of own system.
There are may be risks of toll fraud associated with your telecommunications system. System users
are responsible for programming and configuring the equipment to prevent unauthorized use. LGE
does not warrant that this product is immune from the above case but will prevent unauthorized use
of common-carrier telecommunication service of facilities accessed through or connected to it. LGE
will not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone
service until repair can be done. A telephone company may temporarily disconnect service as long
as repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If
these changes could reasonably be expected to affect the use of the G5200 or compatibility with
the network, the telephone company is required to give advanced written notice to the user,
allowing the user to take appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on the G5200 must be performed only by the LGE or its authorized agent.
The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the
system and may void any remaining warranty.

1. INTRODUCTION

- 5 -

E. Notice of Radiated Emissions

The G5200 complies with rules regarding radiation and radio frequency emission as defined by
local regulatory agencies. In accordance with these agencies, you may be required to provide
information such as the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.

G. Interference and Attenuation

An G5200 may interfere with sensitive laboratory equipment, medical equipment, etc.
Interference from unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.
Following information is ESD handling:

Service personnel should ground themselves by using a wrist strap when exchange system
boards.

When repairs are made to a system board, they should spread the floor with anti-static mat which
is also grounded.

Use a suitable, grounded soldering iron.
Keep sensitive parts in these protective packages until these are used.
When returning system boards or parts like EEPROM to the factory, use the protective package

as described.

1. INTRODUCTION

- 6 -

1.3 Abbreviations

For the purposes of this manual, following abbreviations apply:

APC Automatic Power Control
BB Baseband
BER Bit Error Ratio
CC-CV Constant Current – Constant Voltage
DAC Digital to Analog Converter
DCS Digital Communication System
dBm dB relative to 1 milliwatt
DSP Digital Signal Processing
EEPROM Electrical Erasable Programmable Read-Only Memory
EL Electroluminescence
ESD Electrostatic Discharge
FPCB Flexible Printed Circuit Board
GMSK Gaussian Minimum Shift Keying
GPIB General Purpose Interface Bus
GPRS General Packet Radio Service
GSM Global System for Mobile Communications
IPUI International Portable User Identity
IF Intermediate Frequency
LCD Liquid Crystal Display
LDO Low Drop Output
LED Light Emitting Diodet
G5200 LG GSM Phone
LGE LG Electronics
OPLL Offset Phase Locked Loop
PAM Power Amplifier Module
PCB Printed Circuit Board
PGA Programmable Gain Amplifier
PLL Phase Locked Loopr
PSTN Public Switched Telephone Network
RF Radio Frequency
RLR Receiving Loudness Rating
RMS Root Mean Square
RTC Real Time Clock
SAW Surface Acoustic Wave
SIM Subscriber Identity Module
SLR Sending Loudness Rating
SRAM Static Random Access Memory
STMR Side Tone Masking Rating
TA Travel Adapter

1. INTRODUCTION

- 7 -

TDD Time Division Duplex
TDMA Time Division Multiple Access
UART Universal Asynchronous Receiver/Transmitter
VCO Voltage Controlled Oscillator
VCTCXO Voltage Control Temperature Compensated Crystal Oscillator
WAP Wireless Application Protocol

2. PERFORMANCE

- 8 -

2. PERFORMANCE

2.1 H/W Features

Item Feature Comment

Li-ion, 750 mAh

Standard Battery Size: 41 73.9 5mm

Weight: 22 g
AVG TCVR Current GSM , EGSM: 243 mA, DCS: 209 mA
Stand by Current < 4 mA
Talk time Up to 3 hours (GSM TX Level 7)
Stand by time Up to 200 hours (Paging Period: 9, RSSI: -85 dBm)
Charging time 2 hours 30mins
RX Sensitivity GSM, EGSM: -108 dBm, DCS: -107 dBm
TX output power GSM, EGSM: 32 dBm (Level 5)

DCS: 29.5 dBm (Level 0)
GPRS compatibility Class 10 (This only applies to G5200)
SIM card type 3V Small
Display 128 128 dots LCD(Main) , 96 64 dotsLCD(Sub)

Soft icons

Key Pad
Status Indicator 0 ~ 9, #, *, Navigation Key, Up/Down Side Key

Side Key, Confirm Key, Clear Key , Hot Key)

Send Key, END/PWR Key
ANT External
EAR Phone Jack Yes
PC Synchronization Yes
Speech coding EFR/FR/HR
Data and Fax Yes
Vibrator Yes
Receiver Yes
Roud Speaker Yes
Voice Recoding Yes
C-Mike Yes
Travel Adapter Yes
Options Hands-free kit, CLA, Data Kit

2. PERFORMANCE

- 9 -

2.2 Technical Specification

Item Description Specification

GSM

TX: 890 + n 0.2 MHz
RX: 935 + n 0.2 MHz (n = 1 ~ 124)

EGSM

1 Frequency Band TX: 890 + (n – 1024) 0.2 MHz

RX: 935 + (n – 1024) 0.2 MHz (n = 975 ~ 1024)

DCS

TX: 1710 + (n – 512) 0.2 MHz
Rx: 1805 + (n – 512) 0.2 MHz (n = 512 ~ 885)

2 Phase Error

RMS < 5 degrees
Peak < 20 degrees

3 Frequency Error < 0.1 ppm

GSM, EGSM

Level Power Toler. Level Power Toler.

5 33 dBm 2dB 13 17 dBm 3dB
6 31 dBm 3dB 14 15 dBm 3dB
7 29 dBm 3dB 15 13 dBm 3dB
8 27 dBm 3dB 16 11 dBm 5dB

9 25 dBm 3dB 17 9 dBm 5dB
10 23 dBm 3dB 18 7 dBm 5dB
11 21 dBm 3dB 19 5 dBm 5dB

4 Power Level 12 19 dBm 3dB

DCS

Level Power Toler. Level Power Toler.

0 30 dBm 2dB 8 14 dBm 3dB

1 28 dBm 3dB 9 12 dBm 4dB

2 26 dBm 3dB 10 10 dBm 4dB

3 24 dBm 3dB 11 8 dBm 4dB

4 22 dBm 3dB 12 6 dBm 4dB

5 20 dBm 3dB 13 4 dBm 4dB

6 18 dBm 3dB 14 2 dBm 5dB

7 16 dBm

3dB 15 0 dBm 5dB

2. PERFORMANCE

- 10 -

Item Description Specification

GSM, EGSM

Offset from Carrier (kHz). Max. dBc

100 +0.5
200 -30
250 -33
400 -60

600 ~ 1,200 -60
1,200 ~ 1,800 -60
1,800 ~ 3,000 -63
3,000 ~ 6,000 -65

5 Output RF Spectrum 6,000 -71

(due to modulation)

DCS

Offset from Carrier (kHz). Max. dBc

100 +0.5
200 -30
250 -33
400 -60

600 ~ 1,200 -60
1,200 ~ 1,800 -60
1,800 ~ 3,000 -65
3,000 ~ 6,000 -65

6,000 -73

GSM, EGSM

Offset from Carrier (kHz) Max. (dBm)

400 -19
600 -21

1,200 -21

6 Output RF Spectrum 1,800 -24

(due to switching transient)

GSM

Offset from Carrier (kHz) Max. (dBm)

400 -22

600 -24
1,200 -24
1,800 -27

7 Spurious Emissions Conduction, Emission Status

2. PERFORMANCE

- 11 -

Item Description Specification

GSM, EGSM

8 Bit Error Ratio

BER (Class II) < 2.439% @-102 dBm

DCS

BER (Class II) < 2.439% @-100 dBm

9 RX Level Report Accuracy 3 dB

10 SLR 8 3 dB

Frequency (Hz) Max.(dB) Min.(dB)

100 -12 ­200 0 ­300 0 -12

11 Sending Response 1,000 0 -6

2,000 4 -6
3,000 4 -6
3,400 4 -9
4,000 0 -

12 RLR 2 3 dB

Frequency (Hz) Max.(dB) Min.(dB)

100 -12 ­200 0 ­300 2 -7
500

*

-5

13 Receiving Response 1,000 0 -5

3,000 2 -5
3,400 2 -10
4,000 2

* Mean that Adopt a straight line in between 300 Hz

and 1,000 Hz to be Max. level in the range.

14 STMR 13 5 dB
15 Stability Margin > 6 dB

dB to ARL (dB) Level Ratio (dB)

-35 17.5

-30 22.5

16 Distortion

-20 30.7

-10 33.3
0 33.7
7 31.7

10 25.5

17 Side Tone Distortion Three stage distortion < 10%
18

System frequency (13 MHz) tolerance

≤ 2.5 ppm

2. PERFORMANCE

- 12 -

Item Description Specification

19 32.768KHz tolerance ≤ 30 ppm

Full power
< 243 mA (GSM, EGSM) ; < 209 mA (DCS)

20 Power Consumption

Standby

- Normal < 4 mA (Max. power)

21 Talk Time

GSM/ Level 7 (Battery Capacity 750mA): Up to 180

Min

GSM/ Level 12 (Battery Capacity 750mA): Up to 300 Min
Under conditions, Up to 200 hours:

1. Brand new and full 750mAh battery

2. Full charge, no receive/send and keep GSM in idle

22 Standby Time mode.

3. Broadcast set off.

4. Signal strength display set at 3 level above.

5. Backlight of phone set off.
At least 80 dB under below conditions:

23 Ringer Volume 1. Ringer set as ringer.

2. Test distance set as 50 cm

24 Charge Voltage

Fast Charge : < 500 mA
Slow Charge: < 60 mA

Antenna Bar Number Power

5 -85 dBm ~
4 -90 dBm ~ -86 dBm

25 Antenna Display 3 -95 dBm ~ -91 dBm

2 -100 dBm ~ -96 dBm
1 -105 dBm ~ -101 dBm
0 ~ -105 dBm

Battery Bar Number Voltage

0 ~ 3.62 V

26 Battery Indicator 1 3.62 ~ 3.73 V

2 3.73 ~ 3.82 V
3 3.82 V ~

27 Low Voltage Warning

3.5 0.03 V (Call)

3.62 0.03 V (Standby)

28 Forced shut down Voltage 3.35 0.03 V

1 Li-ion Battery

29 Battery Type

Standard Voltage = 3.7 V
Battery full charge voltage = 4.2 V
Capacity: 750 mAh
Switching-mode charger

30 Travel Charger Input: 100 ~ 240 V, 50/60 Hz

Output: 5.2 V, 600 mA

3. TECHNICAL BRIEF

- 13 -

3. TECHNICAL BRIEF

3.1 General Descreption

The RF parts consists of a transmitter part,a receiver part,a synthesizer part,a voltage supply part,a
VCTCXO part. And the main RF Chipset CX74017[U411]is a single-chip dual-band transceiver for
the extended global system for mobile communication[E- GSM900MHz]/Digital communication
system[DCS1800MHz] voice and data transfer applications.

This device integrated a direct conversion receiver architecture, which eliminates the need of
Intermediate Frequency, a transmitter based on a modulation loop architecture and fractional-N
synthesizer part with built in TXVCO and Local-VCO.

3.2 Receiver

The Receiver part in CX74017 contains all active circuits completely, full receiver chain with the
exception of discrete front-end RF SAW filters. The filtered and amplified signal is down converted
in the RF-mixer to the baseband output. The receiver path is supported by internal channel filtering.

The RF front-end circuit is shown Figure 3-1.

Figure 3-1. RF front-end circuit.

3. TECHNICAL BRIEF

- 14 -

A. RF front end

RF front end consists of Antenna Switch(U405), dual band LNAs integrated in transceiver(U411).
The Received RF signals (GSM 925MHz ~ 960MHz, DCS 1805MHz ~ 1880MHz) are fed into the
antenna or mobile switch. An antenna matching circuit is between the antenna and the mobile
switch.

The Antenna Switch (U405) is used to control the Rx and TX paths. And, the input signals VC1 and
VC2 of a U405 are connected to 2-Input AND Gates(U401) to switch either TX or RX path on.
When the RX path is turned on, the received RF signal then feeds either Rx_900_RF or
RX_1800_RF path selected by GSM-RX and DCS-RX respectively. This Rx_900_RF path contains
one SAW filter, followed after the Antenna Switch (U405), to filter any unwanted signal apart from
the DCS RX band. And, the RX_1800_RF path is the same case.

The logic and current for Antenna Switch is given below Table 3-1.

Table 3-1. The logic and current

These two paths are then connected to the LNAGSMN (#11) and LNADCSIN (#13) of CX74017
(U411), respectively. A low-noise bipolar RF amplifier, contained within the U411, amplifies the RF
signal. The RF signals from the front-end pass to the receiver mixers within the U411 device.

B. Demodulator and baseband processing

In direct conversion receiver there is only one mixer down-converting received RF signal to BB
signal directly. The gain down converting mixer is 40dB at high gain mode and 22dB at low gain

mode.
The Rx gain setting is done in the AGC algorithm. The nominal gain of the receiver is set as a

function of the expected signal strength at the antenna input so that a desired level is reached at
the Rx I/Q. 7 blocks in the receiver chain have variable gains, LNA, Mixer, LPF1, VGA1, gmC Filter,
Auxiliary gain control and VGA2. The gain settings can be adjustable via 3-wire bus control lines.

The baseband signals pass via integrated low-pass filters to the baseband A/D converters.
The remainder of the channel filtering is performed by the baseband chipset. The demodulator

contains switches to maintain the sense of the baseband I/Q outputs with respect to the incoming
RF signal on both GSM900 and DCS 1800.

C. DC Offset Compensation

Three correction loops ensure that DC offsets, generated in the CX74017, do not overload the
baseband chain at any point.

After compensation, the correction voltages are held on capacitors for the duration of the receive
slot(s). A rising edge on the RXEN signal, selected via the serial interface, placed the DC
compensation circuitry in the track mode.

VC1 VC2 Current

GSM TX 0 V 2.7 V 10.0 mA max
DCS TX 2.7 V 0 V 10.0 mA max
GSM/DCS RX 0 V 0 V < 0.1 mA

3. TECHNICAL BRIEF

- 15 -

3.3 Transmitter Part

The Transmitter part contains CX74017 active parts and PAM, APC IC, coupler and Antenna
Switch. The CX74017 active part consists of a vector modulator and offset phase-locked loop
block(OPLL) including down-converter, phase detector, loop filter and dual band transmit VCO
which can operate at either final RF output frequency. The RF GMSK outputs from the transmit
VCO are fed directly to the RF power amplifiers.

Figure 3-2. Transmitter Block diagram

The peak output power and the profile of the transmitted burst are controlled by means of a closed
feedback loop. A dual band directional coupler is used to sample the RF output from either PA.
The PA outputs from the directional coupler pass to the antenna connector via Antenna Switch.

A. IF Modulator

The baseband converter(BBC) within the GSM chipset generates I and Q baseband signals for the
transmit vector modulator. The modulator provides more than 40dBc of carrier and unwanted side­band rejection and produces a GMSK modulated signal. The baseband software is able to cancel
out differential DC offsets in the I/Q baseband signals caused by imperfections in the D/A
converters.
The TX-Modulator implements a quadrature modulator. The IF-frequency input signal is split into
two precise orthogonal carriers, which are multiplied by the baseband modulation signal IT/ITX and
QT/QTX. It is used as reference signal for the OPLL.

TXIP
TXIN

B. OPLL

The offset mixer down converts the feedback Tx RF signal using LO to generate a IF modulating
signal. The IF signal goes via external passive bandpass filter to one port of the phase detector.

The other side of the phase detector input is LO signal. The phase detector generates an error
current proportional to the phase difference between the modulated signal from the offset mixer and
the reference signal from the LO.

The error current is filtered by a second order low-pass filter to generate an output voltage which
depends on the GMSK modulation and the desired channel frequency. This voltage controls the

transmit VCO such that the VCO output signal, centered on the correct RF channel, is frequency
modulated with the original GMSK data. The OPLL acts as a tracking narrowband band pass filter
tuned to the desired channel frequency. This reduces the wideband noise floor of the modulation
and up-conversion process and provides significant filtering of spurious products.

C. Synthesizer

The CX74017 includes a fully integrated UHF VCO with an on-chip LC tank.
A single sigma-delta fractional-N synthesizer can phase lock the local osillator used in both transmit
and receive path to a precision frequency reference input. Fractional-N operation offers low phase

noise and fast setting times, allowing for multiple slot applications such as GPRS.
The generated frequency is given by the following equation

where : = Generated VCO frequency
N = N-divider ratio integer part
FN = Fractional setting
R = R-divider ratio

= Reference Frequency

3. TECHNICAL BRIEF

- 16 -

=

VCOfVCO

f

3. TECHNICAL BRIEF

- 17 -

The counter and mode settings of the synthesizer are also programmed via 3-wire interface.

Figure 3-3. Synthesizer Block diagram

D. TX APC Part

The AD8315[U412] is a dual band RF power controller for RF power amplifiers operating in the
850MHz to 2GHz range.

The AD8315[U412] controls the power output of the selected RF channel. RF power is controlled by
driving the RF amplifier power control pins and sensing the resultant RF output power via a
directional coupler. The RF sense voltage is peak detected using an on-chip Schottky diode.

This detected voltage is compared to the DAC voltage at the VSET pin to control the output power.
An internal input signal[TXRAMP] is applied to the positive input of the AD8315 amplifier during the

TXEN mode and a directional coupler near the antenna feeds a portion of the RF output signal back
to the AD8315 peak detector converts this signal to a low frequency feedback signal that balances
the amplifier when this signal equals the RAMP input signal level.

E. Power Amplifier

The PF08107B[U409] is Dual band amplifier for E-GSM(880 to 915MHz) and DCS1800(1710 to
1785MHz). The efficiency of module is the 50% at nominal output power for E-GSM and the 43% at
32dBm for DCS1800. This module should be operated under the GSM burst pulse. To avoid
permanent degradation, CW operation should not be applied. To avoid the oscillation at no input
power, before the input is cut off, the control voltage Vapc should be control to less than 0.5V.

We have to improve thermal resistance, the through holes should be layouted as many as possible
on PCB under the module. And to get good stability, all the GND terminals and the metal cap should
be soldered to ground plane of PCB.

13MHz

f

ref

3.4 13 MHz Clock

The 13 MHz clock (VC-TCXO-208C) consists of a TCXO (Temperature Compensated Crystal
Oscillator) which oscillates at a frequency of 13 MHz.

It is used within the CX74017 RF Main Chip, BB Analog chip-set (AD6521), and Digital (AD6522).

Figure 3-4. VCTCXO Circuit.

3.5 Power Supplies and Control Signals

There are two regulators used in the phone to provide RF power. One is contained inside of
ADP3408 (U101), power management IC to provide the power for the VCTXO (X302). The other is
used to provide the power for remaining RF circuits.

Table 3-2.

Figure 3-5. Regulator Circuit.

3. TECHNICAL BRIEF

- 18 -

.

Regulator Voltage Powers Enable Signal

Regulator 1
(U1, 2V7_VTCXO)

2.7 V

0.5 V VCTXO

Regulator 2
(U414, RF2V8)

2.85 V

0.5 V RF circuitry VSYNTHEN

3. TECHNICAL BRIEF

- 19 -

3.6 Digital Main Processor

The AD6522 is an ADI designed processor.

Figure 3-6. Top level block diagram of the AD6522 internal architecture.

BUS Arbitration Subsystem

It is to work as a cross point for data accesses between the three main busses. EBUS is for external
accesses, primarily from Flash memory for code and data. RBUS is for internal RAM access. PBUS
is for access to internal peripheral modules such as UART, RTC or SIM. In addition to the three
main system busses, it has SBUS, IOBUS and DMABUS.

DSP subsystem

It consists of ADI DSP, Viterbi coprocessor, Ciphering unit and a cache memory/controller system.
The DSP can run at a maximum clock frequency of 78 MHz at 2.45 V. The Viterbi and ciphering
accelerators enable a very efficient implementation of the channel equalization, encryption and
decryption tasks.

3. TECHNICAL BRIEF

- 20 -

MCU subsystem

It consists of an ARM7TDMI central processing unit, a boot ROM, a clock generation and access
control module.
The maximum clock frequency for the ARM7TDMI is 39 MHz at 2.45 V.
The main clock is 13MHz and it is provided by VCTCXO. The Clock & BS(Bus Select) generator

make internal clock by multiplying the main clock by 1X, 1.5X, 2X and 3X.
The boot ROM contains MCU code for basic communication between the ARM and one of the serial
ports in the Universal System Connector subsystem.

Peripheral subsystem

It contains four major groups of elements.
The MMI group is a collection of all the functionality that are needed to implement a complete user

interface including keyboard, display, backlight, RTC, general purpose I/O etc.
House Keeping group consists of three different sub-modules: The Watch Dog Timer, the Interrupt

Controller, and the general timers.
GSM system group consists of the time base generation together with the synthesizer interface,

which form the radio control.
Direct Memory Access is located between the three system buses (PBUS, RBUS and EBUS) and

can move any data from any address location on one system bus to any address location on
another system bus.

3. TECHNICAL BRIEF

- 21 -

Figure 3-7. System interconnection of AD6522 external interfaces

3. TECHNICAL BRIEF

- 22 -

Interconnection with external devices

RTC block interface

Countered by external X-TAL
The X-TAL oscillates 32.768KHz

LCD module interface

Controlled by LCD_MAIN/SUB_CS, LCD_RES, LCD_A0, /WR, /RD, DATA [00...07] ports

Table 3-3.

RF interface

The AD6522 control RF parts through TXEN, RXON1, RXON2, AGCEN, SDATA, SCLK, SEN etc.

Table 3-4.

Description

LCD_MAIN_CS
LCD_SUB_CS

LCD chip enable. Each LCD has CS pin

LCD_RES This pin resets LCD module.
LCD_A0

This pin determines whether the data to LCD module is display data or
control data

/WR, /RD Read/Write control
DATA [00...07] Parallel data line

Signal Name

Description

TXEN TX Enable/Disable
RXON1 LNA, Mixer1 On/Off
RXON2 Mixer 2 On/Off
AGCEN AGC Enable/Disable
SDATA Serial Data to PLL
SCLK Clock to PLL
SEN PLL Enable/Disable

3. TECHNICAL BRIEF

- 23 -

SIM interface

The AD6522 check status periodically in call mode if SIM card is inserted or not, but the AD6522
don't check in deep sleep mode.

Interface by SIM_IO, SIM_CLK, SIM_RST

Table 3-5.

Figure 3-8.

Key interface

Include 5 column and 5 row
The AD6522 detect key press by interrupt

ADP3408 interrupt

There are two interrupts EOC and CHARGEDETECT
EOC: End of Charge. Charging would be stopped when AD6522 receive this input.
CHARGEDETECT: This interrupt is generated when charge is inserted.

Description

SIM_IO

This pin receives and sends data to SIM card. G5200 support only 3.0

volt interface SIM card.
SIM_CLK Clock 3.5MHz frequency.
SIM_RST Reset SIM block.

3. TECHNICAL BRIEF

- 24 -

3.7 Analog Main Processor

AD6521

Figure 3-9. AD6521 function block diagram

3. TECHNICAL BRIEF

- 25 -

BB Transmit section

This section generates in-phase and quadrature BB modulated GMSK signals (BT = 0.3) in
accordance with GSM 05.05 Phase 2 specifications

The transmit channel consists of a digital GMSK modulator, a matched pair of 10-bit DACs and a
matched pair of reconstruction filter

BB Receive section

This section consists of two identical ADC channels that process baseband in-phase(I) and
quadrature(Q) input signals.

Each channel consists of a coarse switched capacitor input filter, followed by a high-order sigma­delta modulator and a lowpass digital filter

Auxiliary section

This section contains two auxiliary DACs(AFC DAC, IDAC) for system control.
This section also contains AUX ADC and Voltage Reference
AUX ADC: 6 channel 10 bits
AFC DAC: 13 bits
IDAC: 10 bits

Voiceband section

Receive audio signal from MIC. G5200 use differential configuration.
Send audio signal to Receiver. G5200 use differential configuration.
It interconnect with external device like main microphone, main receiver, ear-phone and Hands free

kit
through the VINNORP, VINNORN, VOUTNORP, VOUTNORN, VINAUXP, VINAUXN,
VOUTAUXP, VOUTAUXN
VINNORP, VINNORN: Main MIC positive/negative terminal.
VOUTNORP, VOUTNORN: Main Receiver positive/negative terminal.
VINAUXP, VINAUXN: Hands free kit mic positive/negative terminal.
VOUTAUXP, VOUTAUXON: Hands free kit speaker positive/negative terminal.

3. TECHNICAL BRIEF

- 26 -

3.8 Power Management

ADP3408

Figure 3-10. ADP3408 inner block diagram.

Power up sequence logic

The ADP3408 controls power on sequence

Power on sequence

If a battery is inserted, the battery powers the 6 LDOs.
Then if PWRONKEY is detected, the LDOs output turn on.
REFOUT is also enabled
Reset is generated and send to the AD6522

LDO block

There are 6 LDOs in the ADP3408

Table 3-6.

Battery charging block

It can be used to charge Lithium Ion and/or Nickel Metal Hydride batteries. G5200 use Li-Ion battery
only. Charger initialization, trickle charging, and Li-Ion charging control are implemented in
hardware.

Charging Process

Check charger is inserted or not
If ADP3408 detects that Charger is inserted, the CC-CV charging starts.
Exception: When battery voltage is lower than 3.2V, the precharge (low current charge mode) starts
firstly.
And the battery voltage reach to 3.2V the CC-CV charging starts.

Pins used for charging

CHARGERDETECT: Interrupt to AD6522 when charger is plugged.
CHARGEEN: Control signal from AD6522 to charge Li+ battery
EOC: Interrupt to AD6522 when battery is fully charged
GATEIN: Control signal from AD6522 to charge NiMH battery. But, not used.
MVBAT: Battery voltage divider. Divide ratio is 1:2.3 and it is sensed in AD6521 AUX_ADC

TA (Travel Adaptor)

Input voltage: AC 85V ~ 260V, 50~60Hz
Output voltage: DC 5.2V ( ±0.2 V )
Output current: Max 850mA ( ±50mA )

Battery

Li-ion battery (Max 4.2V, Nom 4.0V)
Standard battery : Capacity - 750mAh, Li-ion

3. TECHNICAL BRIEF

- 27 -

Description

VSIM 2.86 V (is provided to SIM card)
VCORE 2.45 V (is provided to the AD6522 & AD6521’s digital core)
VRTC 2.45 V (is provided to the RTC and Backup Battery)
VAN 2.45 V (is provided to the AD6521 I/O and used as microphone bias)
VTCXO 2.715 V (is provided to VCTCXO)
VMEM 2.80 V (is provided to Flash)

3. TECHNICAL BRIEF

- 28 -

3.9 Memories

64M flash memory + 16M SRAM
16 bit parallel data bus
ADD01 ~ ADD21.
RF Calibration data are stored in Flash

3.10 Display and Interface

Table 3-7

G5200 has dual type LCD. There are the control output LCD_MAIN/SUB_CS which is derived from
AD6522, this acts as the chip select enable for the Main/Sub LCD. AD6522 uses DATA[00:07] pins
to send data for displaying graphical text onto the each LCD ( Main/Sub ).

Main LCD Sub LCD

Display Format 128 x 128 dots 96 x 64 dots
Back light EL Backlight EL Backlight

3. TECHNICAL BRIEF

- 29 -

3.11 Keypad Switches and Scanning

The key switches are metal domes, which make contact between two concentric pads on the
keypad layer of the PCB when pressed. There are 25switches (S301-S325), connected in a matrix
of 5 rows by 5 columns, as shown in Figure, except for the power switch (S310), which is connected
independently.

Functions, the row and column lines of the keypad are connected to ports of AD6522. The columns
are outputs, while the rows are inputs and have pull-up resistors built in. When a key is pressed, the

corresponding row and column are connected together, causing the row input to go low and
generate an interrupt. The columns/rows are then scanned by AD6522 to identify the pressed key.

Figure 3-11. Keypad Switches and Scanning.

DOWN

0

3. TECHNICAL BRIEF

- 30 -

3.12 Microphone

The microphone is soldered to the main PCB. The audio signal is passed to VINNORP (#K8) and
VINNORN (#K7) pins of AD6522. The voltage supply 2V45_VCORE is output from ADP3408, and is

a bias voltage for both the VINNOR (through R105) and VINAUX (through R104) lines.
The VINNOR or VINAUX signal is then A/D converted by the Voiceband ADC part of AD6521.
The digitized speech is then passed to the DSP section of AD6522 for processing (coding,

interleaving etc.).

Figure 3-12. Microphone.

3. TECHNICAL BRIEF

- 31 -

3.13 Earpiece

The earpiece is driven directly from AD6521 VOUTNORP (#K8) and VOUTNORN (#K7) pins and
the gain is controlled by the PGA in an AD6521. The earpiece is located in the handset floder front
panel, and the signals are routed to it via FPCB connector between Main Board and FPCB board.

But, The VOUTNORP signal has to be selected by the control signal “SPK_EN”. If SPK_EN is low,
VOUTNORP is directly connected to the Earpiece, else VOUTNOTP is connected to the Midi
Chip(U203).

Figure 3-13. Earpiece & Handsfree Interface

3. TECHNICAL BRIEF

- 32 -

3.14 Hands-free Interface

The audio out (VOUTAUXP & VOUTAUXN) to the hands-free kit consists of a pair of differential
signals from AD6521 auxiliary outputs (#K9, #K6), which are tracked down the board to carkit
connector (CN301) at the base of the handset. The DC level of the signal is supplied to the
VOUTAUX pin. And the EXT_IN signal is then input to the VINAUXP (#H10) and VINAUXN (#G10)

of AD6521.

3.15 Headset Jack Interface

Headset Jack has the single-end structure in both audio in and out. The audio out to the headset
jack is used only one line(VOUTAUXP/HEADSET_SPK_P1) which can be connected to the
HEADSET_MIC_P or HFK_SPK_P by the analog switch(U204). If you put in the headset jack in the
top of the handset, HEADSET_SPK_P1(VOUTAUXP) is connected to the HEADSET_SPK_P. And
the audio in from the headset jack has also one line(VINAUXP/HEADSET_MIC_P). If the headset
jack is put in, HEADSET_MIC_P is input from the MIC of headset jack, else HEADSET_MIC_P is
connected to HFK_MIC_P which is input from the Hands-free Kit.

3.16 Key Back-light Illumination

In key back-light illumination, there are 12 Blue LEDs in Main Board, which are driven by
KEY_BACKLIGHT line from AD6522.

Figure 3-14. Key Back-light Illumination.

3. TECHNICAL BRIEF

- 33 -

3.17 LCD Back-light Illumination

In LCD Back-light illumination, there is an EL driver in sub LCD side of LCD Module, which is driven
by BACKLIGHT(EL_EN) line from AD6522.

Figure 3-15. LCD Back-light Illumination.

3.18 Multi-Color LED Illumination

In multi-color LED illumination, there is an LED chip and three TRs in sub LCD side of LCD Module,
which is driven by LED_G, LED_B and LED_Main line from AD6522.

Figure 3-16. Multi-Color LED

3. TECHNICAL BRIEF

- 34 -

3.19 Speaker & MIDI IC

Figure 3-17. Speaker & MIDI IC

MA-3 is a synthesizer LSI for mobile phones that realize advanced game sounds. This LSI has a
built-in speaker amplifier, and thus, is an ideal device for outputting sounds that are used by mobile
phones in addition to game sounds and ringing melodies that are replayed by a synthesizer.
The synthesizer section adopts “stereophonic hybrid synthesizer system” that are given advantages
of both FM synthesizers and Waveform table synthesizers to allow simultaneous generation of up to
thirty-two FM tones and eight Waveform table tones.
Since FM synthesizer is able to present countless tones by specifying parameters with only several
tens of bytes, memory capacity and communication band can be saved, and thus, the device
exhibits the features in operating environment of mobile phones such as allowing distribution of
arbitrary melodies with tones. On the other hand , since Waveform table synthesizer complies with
downloading of tones from host CPU, arbitrary ADCM/PCM tones can be treated from sequencer in
addition to the use of tones that are built-in the LSI.
MA-3 has a built-in circuit for controlling vibrators and LEDs synchronizing with play of music.

- 35 -

4. TROUBLE SHOOTING

4. TROUBLE SHOOTING

4.1 RF Components

RF components

Reference Description Reference Description

U401 AND Gate U412 APC IC
U405 Antenna Switch U413 Inverter
U407 DCS RF SAW Filter U414 LDO
U408 GSM RF SAW Filter SW401 Mobile Switch
U409 PAM Y401 TXVCO
U411 RF Main Chip N401 Coupler

SW401

N401

N409

U412

Y401

U413

U401

U414

U407

U411

U408

U405

4. TROUBLE SHOOTING

- 36 -

RX Check Area

4. TROUBLE SHOOTING

- 37 -

4.1-1 Checking Regulator Circuit

U414.1

U414.6

4.1-2 Checking VCTCXO Circuit

Graph 4-1. VCTCXO 13MHz Graph 4-2. VCTCXO 2.7V

4. TROUBLE SHOOTING

- 38 -

Y401.3

Y401.4

4. TROUBLE SHOOTING

- 39 -

4.1-3 Checking Control Signal

TP409(LE)

TP407(Data) TP408(Clock)

TP4043(RXEN)

Graph 4-3. RF Control Signal

4. TROUBLE SHOOTING

- 40 -

4-1-4 Checking Ant SW & Mobile SW

U401.1

U401.6

R405

SW401.2

SW401.1

U405.11

U405.10 U405.2

U405.1

Table 4-1. ANT SW Control Logic

4. TROUBLE SHOOTING

- 41 -

Graph 4-4. ANT SW Control

GSM. DCS RX Mode

Graph 4-5. Dual AND Gate input

For GSM RX Mode

Table 4-2. ANT SW Control Logic

Graph 4-6. Dual AND Gate input

For DCS RX Mode

4. TROUBLE SHOOTING

- 42 -

4-1-5 Checking Saw Filter Circuit

U407.3 U407.1 U408.3 U408.1

4. TROUBLE SHOOTING

- 43 -

4-1-6 Checking RX IQ

RXIN RXQN
RXIP RXQP

Graph 4-7. RX IQ Signal Graph 4-8. RX I Signal (Extended)

4.2 Tx Trouble

- 44 -

4. TROUBLE SHOOTING

6

1

3

3

4

2

5

Rx Check Area

- 45 -

4. TROUBLE SHOOTING

4-2-1 Checking Regulator Circuit

If you already Check this point while checking RX part, You can Skip this Test

U414. 2

U414.1

U414.6

- 46 -

4. TROUBLE SHOOTING

4-2-2 Checking VCTCXO Circuit

If you already Check this point while checking RX part, You can Skip this Test

Graph 4-9. VCTCXO 13MHz Graph 4-10. VCTCXO 2.7V

Y401. 3

Y401. 4

- 47 -

4. TROUBLE SHOOTING

4-2-3 Checking Control Signal.

Graph 4-11. RF Control Signal Graph 4-12. TXEN, TXRAMP, TXPA

TP409(LE)

TP407(Data)

TP408(Clock)

TXPA
(R405)

TXEN

(R425)

TXRAMP

(R427)

- 48 -

4. TROUBLE SHOOTING

4-2-4 Checking TX IQ

C463
100P

TXQN

TXQP

TXIN

TXIP

C464
100P

TXQN TXIN
TXQP TXIP

Graph 4-13. TX IQ Signal

- 49 -

4. TROUBLE SHOOTING

4-2-5 Checking RF TX Level

N401. 3

U409. 1

R407

R411

U409. 8

R472

N401. 1

L405
L408

C432

U412. 1

- 50 -

4. TROUBLE SHOOTING

4-2-6 Checking Ant SW & Mobile SW

SW401. 2

SW401. 1

U405. 11

U405. 2

U405. 8 U405. 5

U405. 3

U401. 1

R405

U401. 6

Table 4-1. ANT SW Control Logic

4-2-6 Checking Ant SW & Mobile SW

Graph 4-14. ANT SW Control Graph 4-15. ANT SW Control

DCS TX Mode GSM TX Mode

Graph 4-16.Dual AND Gate input Graph 4-17.Dual AND Gate input

For DCS TX Mode For GSM TX Mode

Table 4-3. ANT SW Control Logic

- 51 -

4. TROUBLE SHOOTING

- 52 -

4. TROUBLE SHOOTING

4-2-7 Receiver RF Level

GSM : CH.62, -60dBm

DCS :CH.699, -60dBm

- 53 -

4. TROUBLE SHOOTING

Test Points of Rx Level

13

4

2

4. TROUBLE SHOOTING

- 54 -

4-2-8 Transmitter RF Level

GSM

TXVCO

REFCLK

Base

BaseBase

Base

Band

BandBand

Band

Block

BlockBlock

Block

DCS : X7X0 ~ X785MHz

DCS : X7X0 ~ X785MHzDCS : X7X0 ~ X785MHz

DCS : X7X0 ~ X785MHz

GSM : 880 ~ 9 X5MHz

GSM : 880 ~ 9 X5MHzGSM : 880 ~ 9 X5MHz

GSM : 880 ~ 9 X5MHz

X3MHz

90

0

LF

TXIP

TXIPTXIP

TXIP

TXIN

TXINTXIN

TXIN

TXQP

TXQPTXQP

TXQP

TXQN

TXQNTXQN

TXQN

PFD

Fractional-N

PLL

PLL_LE

PLL_LEPLL_LE

PLL_LE

PLL_CLK

PLL_CLKPLL_CLK

PLL_CLK

PLL_DATA

PLL_DATAPLL_DATA

PLL_DATA

Serial

SerialSerial

Serial

I/O

I/OI/O

I/O

/D2

/DX

X2

DCS

/R

f

vco = (N+3.5+FN/2^22)

f

ref/R

f

vco

f

ref

/3

X2

TXEN

TXENTXEN

TXEN

RXEN

RXENRXEN

RXEN

PLL_PD

PLL_PDPLL_PD

PLL_PD

Serial

SerialSerial

Serial

I/O

I/OI/O

I/O

FEENA

FEENAFEENA

FEENA

BANDSEL2

BANDSEL2BANDSEL2

BANDSEL2

BANDSELX

BANDSELXBANDSELX

BANDSELX

LF

f

TX

f

f

LO

AFC

AFCAFC

AFC

X3MHz

X3MHzX3MHz

X3MHz

2V7_VTCXO

2V7_VTCXO2V7_VTCXO

2V7_VTCXO

COUPLER

(LDCX5D)

PAM(PF08X22B)

ANT

S/W

LMG002S

GSMSEL

GSMSELGSMSEL

GSMSEL

DCSSEL

DCSSELDCSSEL

DCSSEL

TXPA

TXPATXPA

TXPA

VCX

VCXVCX

VCX

VC2

VC2VC2

VC2

GSM : 975(-300mV) ~ X24(300mV)

DCS : 5X2(-750mV) ~ 885(750mV)

ATT

ATT

APCIC(AD83X5)

TXRAMP

TXRAMPTXRAMP

TXRAMP

TXEN

TXENTXEN

TXEN

X0dBm

8dBm

2dBm

0dBm

6

32dBm

34dBm

GSM : 32dBm

DCS : 29dBm

3X.5dBm

33.5dBm

ATT

GSM : X5dBm

DCS : X8dBm

GSM : -6dBm

DCS : -3dBm

1

3

1

3

5

11

87

109

12

2

4

GSM : 32.5dBm

DCS : 29.5dBm

Mobile

S/W

GSM :Pwr Lvl 5,CH.62,32dBm

DCS :Pwr Lvl 5,CH.699, 29dBm

4. TROUBLE SHOOTING

- 55 -

4-2-8 Transmitter RF Level

Test Points of Tx Level

13

11 5

3

1

2

4
6

12

7 , 8 9 , 10

4. TROUBLE SHOOTING

- 56 -

4-2-9 Test Points for RF Components

Test Points for RF components

VC2

U401. 3

VC1

U401. 7

TXPA

(R405)

TXQN

TXQP

RXQN
RXQP

2V7_VCTCXO

13MHz CLock

TXRAMP(R427)

TXEN(R425)

TXIN
TXIP

RXIN
RXIP

RF 2.85V

• Test Points for RF Components

Test Points for RF components

(Keypad Side/Lower)

4. TROUBLE SHOOTING

- 57 -

TP408(PLL_Clock)

TP409(PLL_LE)TP409(PLL_LE)

TP407(PLL_Data)

4. TROUBLE SHOOTING

- 58 -

• Baseband components (Component Side)

Baseband components (Component Side)

U105

U106

CN302

U101

U103

X101

U203

U204

U302

U202

U205

Q302

CN101

U201

D102

D101

U102

Reference Description Reference Description

U101 PMIC U205 LDO
U102 P-Channel FET U302 Analog Switch
U103 Analog Main Processor D101 Diode
U105 Digital Main Processor D102 Dual Diode
U106 Memory X101 X-TAL
U201 Comparator Q302 Dual Transistor
U202 Analog Switch CN101 SIM Connector
U203 MIDI IC CN301 IO Connector
U204 Analog Switch

• Baseband components (Keypad Side)

Baseband components (Keypad Side)

4. TROUBLE SHOOTING

- 59 -

Q101

MIC101

U301

Q301

D301

Reference Description Reference Description

U301 Hall Sensor D301 Dual Diode
Q301 Transistor MIC101 C-MIC
Q302 Transistor

4.3 Power on Trouble

- 60 -

4. TROUBLE SHOOTING

Setting : Connect PIF, and set remote switch off at PIF.

- 61 -

4. TROUBLE SHOOTING

POWER-ON KEY

signal input

This signal should go HIGH when the power-on
procedure is completed.

Pin 25 (VTCXO=2.7V) Pin 22 (VCORE=2.45V)

Pin 21 (VMEM=2.8V)

Pin 6 (VRTC>1.2V)

Pin 2 (Power Key)

Pin 1 (PWRON_EN)

These powers should
be necessary to
power on.

- 62 -

4. TROUBLE SHOOTING

4.4 Charging Trouble

Setting : Connect PIF, and set remote switch off at PIF.

- 63 -

4. TROUBLE SHOOTING

The charging current

will flow into this

direction.

R102

D101

U102

4. TROUBLE SHOOTING

- 64 -

4.5 LCD Trouble

Setting : Connect PIF and power on.

4. TROUBLE SHOOTING

- 65 -

Soldering Check

If the FPCB has a problem, the

control signals for LCD cannot

be transmitted properly.

CN301

4. TROUBLE SHOOTING

- 66 -

4.6 Receiver Trouble

Setting : After initializing GSM MS test equipmemt, connect PIF and power on. Make a test call to 112.

Set audio part at test equipment as PRBS or continuous wave, not echo. Set the volumn max.

The Circuit Diagram of the receiver path. Refer to page 2 of the complete circuit diagram for detail.

4. TROUBLE SHOOTING

- 67 -

RECEIVER

PMIC (U101)

C206

U202. 4

U202. 5

YMU762 (U203)

Soldering

Check

From the

U103(AD6521)

U202

C206

From the

U103(AD6521)

To Receiver at
LCD module via
CN301

4. TROUBLE SHOOTING

- 68 -

The waveforms of the audio signals at each point

U202. 4

U202. 5

C206

(REC-)

4. TROUBLE SHOOTING

- 69 -

4.7 Speaker Trouble

Setting : Connect PIF to the phone, and power on. Enter the engineering mode, and set "Melody on" at

"BB Test-Buzzer" menu.

4. TROUBLE SHOOTING

- 70 -

U203

Pin 26

Pin 25

U205

C221

R222, R227

Soldering Check

in LCD Module

Speaker

C209, C211, R213, R215

CN301

The circuit diagram of the part of the melody IC. Refer to the page 2 of the complete circuit diagram for
detail.

4. TROUBLE SHOOTING

- 71 -

C209, R213, C211, R215

These four components make up the
analog amplifier stage of melody.

U203

U205

C221

R227 R222

This is the melody IC.

To the speaker at LCD

module via CN301.

The Power for analog part of the
melody IC. The voltage is 3.3V

The Power for digital part of the
melody IC. The voltage is 2.8V.
It is from the PMIC(ADP3408, U101)

4.8 Mic Trouble

4. TROUBLE SHOOTING

- 72 -

Setting : After initializing GSM MS test equipment, connect PIF to the phone, and power on. Make a test

call to 112. Make a sound in front of microphone.

4. TROUBLE SHOOTING

- 73 -

C118

R105 R108

R110
R112

Q101.3

MIC101

C132 C129

4. TROUBLE SHOOTING

- 74 -

The waveforms at MIC+ and MIC-

R105

R108

MIC+

MIC+

MIC-

MIC-

C118

MIC101

The voltage at this point
goes to almost 0V when
the mic is activated.

Mic activating signal
Mic is activated when this
signal goes to HIGH

R110, R112
C129, C132

The signal flow of

the microphone to

U103(AD6521)

4. TROUBLE SHOOTING

- 75 -

4.9 Vibrator Trouble

Setting : Connect PIF to the phone, and power on. Enter the engineering mode, and set "Vibrator On" at

"BB Test-Vibrator" menu.

START

Is the voltage at pin 3

of Q301 near 0V?

Yes

Check the soldering of R301

Yes

Check the soldering of CN301

Yes

Check the soldering of

vibratior at LCD module

No

Check the soldering of R309.

Replace Q301.

No

No

No

Yes

Resolder R301.

Resolder CN301.

Resolder vibrator.

No

Resolder R309.

Yes

Replace Vibrator.

VIBRATOR WILL

WORK PROPERLY.

4. TROUBLE SHOOTING

- 76 -

Pin 22

CN301

Soldering Check
in LCD Module

Vibrator

R301

Q301.3

Q301.2

From the vibrator at
LCD module via CN301.

When the vibrator works,
the voltage at this point
goes to almost 0 V.

When the vibrator
works, the current flow
in this directoin.

When the vibrator
works, the signal at this
point goes to 2.8V.

R309

4. TROUBLE SHOOTING

- 77 -

4.10 Backlight Trouble

Setting : Connect PIF to the phone, and power on. Enter engineering mode, and set "Backlight on" at

"BB test-Backlight" menu.

4. TROUBLE SHOOTING

- 78 -

Q302.2R321

R319

4. TROUBLE SHOOTING

- 79 -

4.11 Folder on/off Trouble

Setting : Connect PIF to the phone, and power on.

4. TROUBLE SHOOTING

- 80 -

R310

The voltage at this point
goes from 2.8V to 0 V
when the folder is closed.

To U105(AD6522)

This component operate
when a magnet get close
here.

U301.1

U301.2

4. TROUBLE SHOOTING

- 81 -

4.12 SIM Detect Trouble

Setting : Insert the SIM into CN101. Connect PIF to the phone, and power on.

4. TROUBLE SHOOTING

- 82 -

PIN 5

PIN 3

PIN 1

PIN 7

4. TROUBLE SHOOTING

- 83 -

4.13 Earphone Trouble

Setting : After initializing GSM test equipment, connect PIF to the phone and power on.

4. TROUBLE SHOOTING

- 84 -

4. TROUBLE SHOOTING

- 85 -

4. TROUBLE SHOOTING

- 86 -

4. TROUBLE SHOOTING

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4.14 HFK Trouble

C168

U201.1

R208 R209

R212R210

R211

R230, R231

R104

C117

C124

R201 CN201

L201

U204.1

U204.5

U204.6

R103
R106

4. TROUBLE SHOOTING

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This part makes the
mic bias of the ear-mic.

The direction of the audio

To U103(AD6521)

The voltage input of
ear-mic hook-detect

The voltage input of

ear-mic detect

The reference voltage
for the hook-detect of

The signal flow when the
ear-mic is activated.

U204 selects the path of audio
signal for the ear-mic or the HFK.

The circuit diagram of the ear-mic jack
Refer to the page 2 of the complete circuit diagram for detail.

Refer to the page 2 of the complete circuit diagram
for detail.

The reference voltage
for the detect of ear­mic.

These resistors make
the reference voltage.

Mic bias and path for the ear-mic
Refer to the page 1 of the complete

circuit diagram for detail.

Ear-mic detection part
Refer to the page 2 of the complete

circuit diagram for detail.

4. TROUBLE SHOOTING

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Setting : After initializing GSM test equipment, connect PIF to the phone and power on.

4. TROUBLE SHOOTING

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4. TROUBLE SHOOTING

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4. TROUBLE SHOOTING

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R333 U204.1

U204

U204.5

CN302

C117

C124

CN201

L201

R205

R328

2.8V

R158

R106

R103

R104

C168

CN302.1

R156

C171

R170

CN302.9 ~

CN302.12

Check Point

( 0V when HFK is
activated.)

4. TROUBLE SHOOTING

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The HFK detect signal

R328

R333

CN302

The audio signals
from & to the HFK

The HFK detect signal

This point goes to
0 V when the HFK
is activated.

The circuit diagram of the part of CN302

Refer to the page 3 of the complete circuit diagram.

The HFK detect signal input to U105 (AD6522)
Refer to the page 1 of the complete circuit diagram.

4. TROUBLE SHOOTING

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The direction of the audio

signal from the mic of the HFK

The audio signal from the mic of the HFK to U103(AD6521)
This part is same with that of the ear-mic.
Refer to the page 1 of the complete circuit diagram for detail.

The signal flow when
the HFK is activated.

U204 selects the path of audio
signal for the ear-mic or the HFK.

Refer to the page 2 of the complete circuit diagram
for detail.

To U103

(AD6521)

5. ASSEMBLY INSTRUCTION

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5. ASSEMBLY INSTRUCTION

5.1 Disassembly

1. Remove the battery, antenna and screws as shown above.

Figure 5-1. Removing Battery pack, screws and Antenna

2. Carefully lift up the bottom of Rare Cover first, then hold the covers and twist them.

Figure 5-2. Disassembly of Rear cover and Front cover

1

2

3

5. ASSEMBLY INSTRUCTION

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3.Finally carefully remove the rear-cover from the hooks on the top of front-cover.

Figure 5-3. Disassembly from the hooks

5. ASSEMBLY INSTRUCTION

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4. Remove the pin shown below to unlock the PCB.

Figure 5-4. Unlocking and removing the PCB

5. ASSEMBLY INSTRUCTION

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5. Use a sharp awl to push away the antenna-bushing.

Figure 5-5. Removing Antenna-bushing

6. Use a tweezers to remove the Battery Locker.

Figure 5-6. Removing battery locker

3

1

1

2

5. ASSEMBLY INSTRUCTION

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7. Remove the buttons.

Figure 5-7. Removing buttons

8. Push away the hinge to remove the folder.

Figure 5-8. Detaching Folder