LG W3000 Service Manual

GSM Phone

SERVICE MANUAL

MODEL : W3000

P/N : XXXXX JUNE, 2002

SERVICE MANUAL MODEL : W3000

- 1 -

1. INTRODUCTION

.......................................

4

1.1 Purpose

..................................................

4

1.2 Regulatory Information

..........................

4

A. Security

..............................................

4

B. Incidence of Harm

..............................

4

C. Changes in Service

............................

4

D. Maintenance Limitations

....................

4

E. Notice of Radiated Emissions

.............

5

F. Pictures

..............................................

5

G. Interference and Attenuation

.............

5

H. Electrostatic Sensitive Devices

..........

5

1.3 Abbreviations

.........................................

6

2. PERFORMANCE

.....................................

8

2.1 H/W Feature

...........................................

8

2.2 Technical Specification

..........................

9

3. TECHNICAL BRIEF

............................

13

3.1 General Descreption

...........................

. 13

3.2 Receiver

...............................................

13

A. RF front end

.....................................

14

B. Demodulator and

baseband processing

......................

14

C. DC Offset Compensation

................

14

3.3 Transmitter Part

...................................

15

A. IF Modulator

...................................

. 15

B. OPLL

...............................................

16

C. Synthesizer

......................................

16

D. TX APC Part

....................................

17

E. Power Amplifier

................................

17

3.4 13 MHz Clock

......................................

18

3.5 Power Supplies and Control Signals

....

18

3.6 Digital Main Processor

.........................

19

3.7 Analog Main Processor

........................

24

3.8 Power Management

..............................

26

3.9 Memories

..............................................

28

3.10 Display and Interfaces

........................

28

3.11 Keypad Switches and Scanning

..........

29

3.12 Microphone

.........................................

30

3.13 Earpiece

.............................................

31

3.14 Hands-free Interface

..........................

32

3.15 Headset Jack Interface

.......................

32

3.16 Key Back-light Illumination

..................

32

3.17 LCD Back-light Illumination

................

33

3.18 Multi-Color LED Illumination

..............

33

3.19 Speaker & MIDI IC

.............................

34

4. TROUBLE SHOOTING

.....................

35

4.1 RF Components

.................................

35

4.2 Tx Trouble

..........................................

44

4.3 Power on Trouble

...............................

60

4.4 Charging Trouble

...............................

62

4.5 LCD Trouble

.......................................

64

4.6 Receiver Trouble .

...............................

66

4.7 Speaker Trouble

.................................

69

4.8 Mic Trouble

..........................................

72

4.9 Vibrator Trouble

.................................

75

4.10 Backlight Trouble

.............................

77

4.11 Folder on/off Trouble

........................

79

4.12 SIM Detect Trouble

..........................

81

4.13 Earphone Trouble

............................

83

4.14 HFK Trouble

.....................................

87

5. ASSEMBLY INSTRUCTION

............

95

5.1 Disassembly

.......................................

95

6. DOWNLOAD

.......................................

102

6.1 Download Setup

...............................

102

6.2 Download Procedure

........................

103

Table Of Contents

- 2 -

7. BLOCK DIAGRAM

.............................

106

7.1 Main Board

.......................................

106

7.2 FPCB

................................................

107

7.3 RF

....................................................

107

8. CIRCUIT DIAGRAM

...........................

109

8.1 Baseband Interface

..........................

109

8.2 MIDI

..................................................

110

8.3 KYE, I/F & LCD CON

.......................

111

8.4 RF

....................................................

112

9. PCB LAYOUT

.....................................

113

10. ENGINEERING MODE

..................

115

10.1 BB Test [MENU 1]

........................

115

10.2 RF Test [MENU 2]

........................

117

10.3 MF Mode [MENU 3]

......................

118

10.4 Trace option [MENU 4]

.................

119

10.5 Call Timer [MENU 5]

.....................

119

10.6 Fact. Reset [MENU 6]

...................

119

10.7 S/W version [MENU 7]

..................

119

11. STAND ALONE TEST

...................

120

11.1 Introduction

...................................

120

11.2 Setting Method

.............................

120

11.3 Means of Test

...............................

120

12. AUTO CALIBRATION

...................

121

12.1 Overview

.......................................

121

12.2 Requirements

...............................

121

12.3 Menu and settings

........................

121

12.4 AGC

..............................................

123

12.5 APC

..............................................

123

12.6 ADC

..............................................

123

12.7 Setting

..........................................

123

12.8 How to do calibration

....................

123

13. EXPLODED VIEW &
REPLACEMENT PART LIST

......

124

13.1 Exploded View

..............................

124

13.2 Accessories

..................................

126

13.3 Replacement Part List

..................

127

- 3 -

REVISED HISTORY

The information in this manual is subject to change without notice and should not be construed as
a commitment by LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make
changes to equipment design as advances in engineering and manufacturing methods warrant.

This manual provides the information necessary to install, program, operate and maintain the LG-

W3000.

DATE ISSUE CONTENTS OF CHANGES S/W VERSION

JULY/2002 ISSUE 1 Initial Release

1. INTRODUCTION

- 4 -

1. INTRODUCTION

1.1 Purpose

This manual provides the information necessary to repair, calibration, description and download the
features of the LG-W3000.

1.2 Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for
example, persons other than your company’s employees, agents, subcontractors, or person
working on your company’s behalf) can result in substantial additional charges for your
telecommunications services. System users are responsible for the security of own system. There
are may be risks of toll fraud associated with your telecommunications system. System users are
responsible for programming and configuring the equipment to prevent unauthorized use. LGE does
not warrant that this product is immune from the above case but will prevent unauthorized use of
common-carrier telecommunication service of facilities accessed through or connected to it. LGE
will not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone
service until repair can be done. A telephone company may temporarily disconnect service as long
as repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If
these changes could reasonably be expected to affect the use of the LG-W3000 or compatibility
with the network, the telephone company is required to give advanced written notice to the user,
allowing the user to take appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on the LG-W3000 must be performed only by the LGE or its authorized
agent. The user may not make any changes and/or repairs expect as specifically noted in this
manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of
the system and may void any remaining warranty.

1. INTRODUCTION

- 5 -

E. Notice of Radiated Emissions

The LG-W3000 complies with rules regarding radiation and radio frequency emission as defined by
local regulatory agencies. In accordance with these agencies, you may be required to provide
information such as the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.

G. Interference and Attenuation

An LG-W3000 may interfere with sensitive laboratory equipment, medical equipment, etc.
Interference from unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.
Following information is ESD handling:

Service personnel should ground themselves by using a wrist strap when exchange
systemboards.

When repairs are made to a system board, they should spread the floor with anti-static mat which
is also grounded.

Use a suitable, grounded soldering iron.

Keep sensitive parts in these protective packages until these are used.

When returning system boards or parts like EEPROM to the factory, use the protective package
as described.

1. INTRODUCTION

- 6 -

1.3 Abbreviations

For the purposes of this manual, following abbreviations apply:0

APC Automatic Power Control

BB Baseband

BER Bit Error Ratio

CC-CV Constant Current – Constant Voltage

DAC Digital to Analog Converter

DCS Digital Communication System

dBm dB relative to 1 milliwatt

DSP Digital Signal Processing

EEPROM Electrical Erasable Programmable Read-Only Memory

EL Electroluminescence

ESD Electrostatic Discharge

FPCB Flexible Printed Circuit Board

GMSK Gaussian Minimum Shift Keying

GPIB General Purpose Interface Bus

GSM Global System for Mobile Communications

IPUI International Portable User Identity

IF Intermediate Frequency

LCD Liquid Crystal Display

LDO Low Drop Output

LED Light Emitting Diode

LG-W3000 LG GSM Phone

LGE LG Electronics

OPLL Offset Phase Locked Loop

PAM Power Amplifier Module

PCB Printed Circuit Board

PGA Programmable Gain Amplifier

PLL Phase Locked Loop

PSTN Public Switched Telephone Network

RF Radio Frequency

RLR Receiving Loudness Rating

RMS Root Mean Square

RTC Real Time Clock

SAW Surface Acoustic Wave

SIM Subscriber Identity Module

SLR Sending Loudness Rating

SRAM Static Random Access Memory

STMR Side Tone Masking Rating

TA Travel Adapter

1. INTRODUCTION

- 7 -

TDD Time Division Duplex

TDMA Time Division Multiple Access

UART Universal Asynchronous Receiver/Transmitter

VCO Voltage Controlled Oscillator

VCTCXO Voltage Control Temperature Compensated Crystal Oscillator

WAP Wireless Application Protocol

2. PERFORMANCE

- 8 -

2. PERFORMANCE

2.1 H/W Features

Item Feature Comment

Li-ion, 750 mAh

Standard Battery Size: 41 73.9 5mm

Weight: 22 g

AVG TCVR Current GSM , EGSM: 243 mA, DCS: 209 mA

Stand by Current < 4 mA

Talk time Up to 3 hours (GSM TX Level 7)

Stand by time Up to 200 hours (Paging Period: 9, RSSI: -85 dBm)

Charging time 2 hours 30mins

RX Sensitivity GSM, EGSM: -108 dBm, DCS: -107 dBm

TX output power GSM, EGSM: 32 dBm (Level 5)

DCS: 29.5 dBm (Level 0)

GPRS compatibility Class 10 (This only applies to G5200)

SIM card type 3V Small

Display 128 128 dots LCD(Main) , 96 64 dotsLCD(Sub)

Soft icons

Key Pad

Status Indicator 0 ~ 9, #, *, Navigation Key, Up/Down Side Key

Side Key, Confirm Key, Clear Key , Hot Key)

Send Key, END/PWR Key

ANT External

EAR Phone Jack Yes

PC Synchronization Yes

Speech coding EFR/FR/HR

Data and Fax Yes

Vibrator Yes

Receiver Yes

Roud Speaker Yes

Voice Recoding Yes

C-Mike Yes

Travel Adapter Yes

Options Hands-free kit, CLA, Data Kit

2. PERFORMANCE

- 9 -

2.2 Technical Specification

Item Description Specification

GSM

TX: 890 + n 0.2 MHz

RX: 935 + n 0.2 MHz (n = 1 ~ 124)

EGSM

1 Frequency Band TX: 890 + (n – 1024) 0.2 MHz

RX: 935 + (n – 1024) 0.2 MHz (n = 975 ~ 1024)

DCS

TX: 1710 + (n – 512) 0.2 MHz
Rx: 1805 + (n – 512) 0.2 MHz (n = 512 ~ 885)

2 Phase Error

RMS < 5 degrees
Peak < 20 degrees

3 Frequency Error < 0.1 ppm

GSM, EGSM

Level Power Toler. Level Power Toler.

5 33 dBm 2dB 13 17 dBm 3dB

6 31 dBm 3dB 14 15 dBm 3dB

7 29 dBm 3dB 15 13 dBm 3dB

8 27 dBm 3dB 16 11 dBm 5dB

9 25 dBm 3dB 17 9 dBm 5dB

10 23 dBm 3dB 18 7 dBm 5dB

11 21 dBm 3dB 19 5 dBm 5dB

4 Power Level 12 19 dBm 3dB

DCS

Level Power Toler. Level Power Toler.

0 30 dBm 2dB 8 14 dBm 3dB

1 28 dBm 3dB 9 12 dBm 4dB

2 26 dBm 3dB 10 10 dBm 4dB

3 24 dBm 3dB 11 8 dBm 4dB

4 22 dBm 3dB 12 6 dBm 4dB

5 20 dBm 3dB 13 4 dBm 4dB

6 18 dBm 3dB 14 2 dBm 5dB

7 16 dBm 3dB 15 0 dBm 5dB

2. PERFORMANCE

- 10 -

Item Description Specification

GSM, EGSM

Offset from Carrier (kHz). Max. dBc

100 +0.5

200 -30

250 -33

400 -60

600 ~ 1,200 -60

1,200 ~ 1,800 -60

1,800 ~ 3,000 -63

3,000 ~ 6,000 -65

5 Output RF Spectrum 6,000 -71

(due to modulation)

DCS

Offset from Carrier (kHz). Max. dBc

100 +0.5

200 -30

250 -33

400 -60

600 ~ 1,200 -60

1,200 ~ 1,800 -60

1,800 ~ 3,000 -65

3,000 ~ 6,000 -65

6,000 -73

GSM, EGSM

Offset from Carrier (kHz) Max. (dBm)

400 -19

600 -21

1,200 -21

6 Output RF Spectrum 1,800 -24

(due to switching transient)

GSM

Offset from Carrier (kHz) Max. (dBm)

400 -22

600 -24

1,200 -24

1,800 -27

7 Spurious Emissions Conduction, Emission Status

2. PERFORMANCE

- 11 -

Item Description Specification

GSM, EGSM

8 Bit Error Ratio

BER (Class II) < 2.439% @-102 dBm

DCS

BER (Class II) < 2.439% @-100 dBm

9 RX Level Report Accuracy 3 dB

10 SLR 8 3 dB

Frequency (Hz) Max.(dB) Min.(dB)

100 -12 -

200 0 -

300 0 -12

11 Sending Response 1,000 0 -6

2,000 4 -6

3,000 4 -6

3,400 4 -9

4,000 0 -

12 RLR 2 3 dB

Frequency (Hz) Max.(dB) Min.(dB)

100 -12 -

200 0 -

300 2 -7

500

*

-5

13 Receiving Response 1,000 0 -5

3,000 2 -5

3,400 2 -10

4,000 2

* Mean that Adopt a straight line in between 300 Hz

and 1,000 Hz to be Max. level in the range.

14 STMR 13 5 dB

15 Stability Margin > 6 dB

dB to ARL (dB) Level Ratio (dB)

-35 17.5

-30 22.5

16 Distortion

-20 30.7

-10 33.3

0 33.7

7 31.7

10 25.5

17 Side Tone Distortion Three stage distortion < 10%

18

System frequency (13 MHz) tolerance

≤ 2.5 ppm

2. PERFORMANCE

- 12 -

Item Description Specification

19 32.768KHz tolerance ≤ 30 ppm

Full power

< 243 mA (GSM, EGSM) ; < 209 mA (DCS)

20 Power Consumption

Standby

- Normal < 4 mA (Max. power)

21 Talk Time

GSM/ Level 7 (Battery Capacity 750mA): Up to 180

Min

GSM/ Level 12 (Battery Capacity 750mA): Up to 300 Min

Under conditions, Up to 200 hours:

1. Brand new and full 750mAh battery

2. Full charge, no receive/send and keep GSM in idle

22 Standby Time mode.

3. Broadcast set off.

4. Signal strength display set at 3 level above.

5. Backlight of phone set off.

At least 80 dB under below conditions:

23 Ringer Volume 1. Ringer set as ringer.

2. Test distance set as 50 cm

24 Charge Voltage

Fast Charge : < 500 mA

Slow Charge: < 60 mA

Antenna Bar Number Power

5 -85 dBm ~

4 -90 dBm ~ -86 dBm

25 Antenna Display 3 -95 dBm ~ -91 dBm

2 -100 dBm ~ -96 dBm

1 -105 dBm ~ -101 dBm

0~ -105 dBm

Battery Bar Number Voltage

0~ 3.62 V

26 Battery Indicator 1 3.62 ~ 3.73 V

2 3.73 ~ 3.82 V

3 3.82 V ~

27 Low Voltage Warning

3.5 0.03 V (Call)

3.62 0.03 V (Standby)

28 Forced shut down Voltage 3.35 0.03 V

1 Li-ion Battery

29 Battery Type

Standard Voltage = 3.7 V

Battery full charge voltage = 4.2 V

Capacity: 750 mAh

Switching-mode charger

30 Travel Charger Input: 100 ~ 240 V, 50/60 Hz

Output: 5.2 V, 600 mA

3. TECHNICAL BRIEF

- 13 -

3. TECHNICAL BRIEF

3.1 General Description

The RF parts consists of a transmitter part, a receiver part, a synthesizer part, a voltage supply part,
a VCTCXO part. And the main RF Chipset CX74017[U441]is a single-chip dual-band transceiver for
the extended global system for mobile communication[E-GSM900MHz]/Digital communication
system[DCS1800MHz] voice and data transfer applications.
This device integrated a direct conversion receiver architecture, which eliminates the need of
Intermediate Frequency, a transmitter based on a modulation loop architecture and fractional-N
synthesizer part with built in TXVCO and Local-VCO.

3.2 Receiver

The Receiver part in CX74017 contains all active circuits completely, full receiver chain with the
exception of discrete front-end RF SAW filters. The filtered and amplified signal is down converted
in the RF-mixer to the baseband output. The receiver path is supported by internal channel filtering.
The RF front-end circuit is shown Fig. 3-1.

Figure 3-1. RF front-end circuit.

ANT
S/W

CX74017

Base
Band

Block

DCS : 1805 ~ 1880MHz

GSM : 925 ~ 960MHz

90

0

90

0

2/3

RXIP
RXIN

RXQP

RXQN

4/3

PCS : 1805 ~ 1880MHz

f

vco

GSMSEL
DCSSEL

LMSP54AA-097

FAR-G6CS-1G8425-L257

3. TECHNICAL BRIEF

- 14 -

A. RF front end

RF front end consists of Antenna Switch(FL405), dual band LNAs integrated in transceiver(U441).
The Received RF signals (GSM 925MHz ~ 960MHz, DCS 1805MHz ~ 1880MHz) are fed into the
antenna or mobile switch. An antenna matching circuit is between the antenna and the mobile
switch.
The Antenna Switch (FL405) is used to control the Rx and TX paths. And, the input signals VC1
and VC2 of a FL405 are connected to DCSSEL(GPO_9) and GSMSEL(GPO_11) ports of U103 to
switch either TX or RX path on. When the RX path is turned on, the received RF signal then feeds
either Rx_900_RF or RX_1800_RF path controlled by GSM-RX and DCS-RX respectively. This
Rx_900_RF path contains one SAW filter, followed after the Antenna Switch (FL405), to filter any
unwanted signal apart from the DCS RX band. And, the RX_1800_RF path is the same case.

The logic and current for Antenna Switch is given below Table 3-1.

Table 3-1. The logic and current

These two paths are then connected to the LNAGSMN (#11) and LNADCSIN (#13) of CX74017
(U441), respectively. A low-noise bipolar RF amplifier, contained within the U441, amplifies the RF
signal. The RF signals from the front-end pass to the receiver mixers within the U441 device.

B. Demodulator and baseband processing

In direct conversion receiver there is only one mixer down-converting received RF signal to BB
signal directly. The gain down converting mixer is 40dB at high gain mode and 22dB at low gain
mode.
The Rx gain setting is done in the AGC algorithm. The nominal gain of the receiver is set as a
function of the expected signal strength at the antenna input so that a desired level is reached at
the Rx I/Q. 7 blocks in the receiver chain have variable gains, LNA, Mixer, LPF1, VGA1, gmC Filter,
Auxiliary gain control and VGA2. The gain settings can be adjustable via 3-wire bus control lines.
The baseband signals pass via integrated low-pass filters to the baseband A/D converters.
The remainder of the channel filtering is performed by the baseband chipset. The demodulator
contains switches to maintain the sense of the baseband I/Q outputs with respect to the incoming
RF signal on both GSM900 and DCS1800.

C. DC Offset Compensation

Three correction loops ensure that DC offsets, generated in the CX74017, do not overload the
baseband chain at any point.
After compensation, the correction voltages are held on capacitors for the duration of the receive
slot(s). A rising edge on the RXEN signal, selected via the serial interface, placed the DC
compensation circuitry in the track mode.

VC1 VC2 Current

GSM TX 0 V 2.7 V 10.0 mA max

DCS TX 2.7 V 0 V 10.0 mA max

GSM/DCS RX 0 V 0 V < 0.1 mA

3. TECHNICAL BRIEF

- 15 -

3.3 Transmitter Part

The Transmitter part contains CX74017 active parts, PAM and Antenna Switch. The CX74017
active part consists of a vector modulator and offset phase-locked loop block(OPLL) including
down-converter, phase detector, loop filter and dual band transmit VCO which can operate at either
final RF output frequency. The RF GMSK outputs from the transmit VCO are fed directly to the RF
power amplifiers.

Figure 3-2. Transmitter Block diagram

The peak output power and the profile of the transmitted burst are controlled by means of power
control loop. The power control function is integrated, eliminating the need for directional couplers,
detector diodes, power control IC and other power control circuitry. This allows the module to be
driven directly from the DAC output. The PA outputs from the directional coupler pass to the
antenna connector via Antenna Switch.

A. IF Modulator

The baseband converter(BBC) within the GSM chipset generates I and Q baseband signals for the
transmit vector modulator. The modulator provides more than 40dBc of carrier and unwanted side­band rejection and produces a GMSK modulated signal. The baseband software is able to cancel
out differential DC offsets in the I/Q baseband signals caused by imperfections in the D/A
converters.
The TX-Modulator implements a quadrature modulator. The IF-frequency input signal is split into
two precise orthogonal carriers, which are multiplied by the baseband modulation signal IT/ITX and
QT/QTX. It is used as reference signal for the OPLL.

ANT
S/W

GSM

TXVCO

PAM(RF3110)

CX74017

Base
Band

Block

DCS : 1710 ~ 1785MHz

GSM : 880 ~ 925MHz

90

0

LF

TXIP
TXIN

TXQP
TXQN

PFD

/D2

/D1

X2

DCS

f

vco

/3

X2

f

TX

f

IF

f

LO

GSMSEL

DCSSEL

TXPA

TXRAMP

BANDSEL1

LMSP54AA-097

B. OPLL

The offset mixer down converts the feedback Tx RF signal using LO to generate a IF modulating
signal. The IF signal goes via external passive bandpass filter to one port of the phase detector. The
other side of the phase detector input is LO signal. The phase detector generates an error current
proportional to the phase difference between the modulated signal from the offset mixer and the
reference signal from the LO.
The error current is filtered by a second order low-pass filter to generate an output voltage which
depends on the GMSK modulation and the desired channel frequency. This voltage controls the
transmit VCO such that the VCO output signal, centered on the correct RF channel, is frequency
modulated with the original GMSK data. The OPLL acts as a tracking narrowband band pass filter
tuned to the desired channel frequency. This reduces the wideband noise floor of the modulation
and up-conversion process and provides significant filtering of spurious products.

C. Synthesizer

The CX74017 includes a fully integrated UHF VCO with an on-chip LC tank.
A single sigma-delta fractional-N synthesizer can phase lock the local osillator used in both transmit
and receive path to a precision frequency reference input. Fractional-N operation offers low phase
noise and fast setting times, allowing for multiple slot applications such as GPRS.
The generated frequency is given by the following equation

where : = Generated VCO frequency

N = N-divider ratio integer part

FN = Fractional setting

R = R-divider ratio

= Reference Frequency

3. TECHNICAL BRIEF

- 16 -

=

VCOfVCO

f

3. TECHNICAL BRIEF

- 17 -

The counter and mode settings of the synthesizer are also programmed via 3-wire interface.

Figure 3-3. Synthesizer Block diagram

D. Power Amplifier

The RF3110[U416] is a Dual band amplifier for E-GSM(880 to 915MHz) and DCS1800(1710 to
1785MHz). The efficiency of module is the 50% at nominal output power for E-GSM and the 45%
for DCS1800. This module should be operated under the GSM burst pulse. To avoid permanent
degradation, CW operation should not be applied. To avoid the oscillation at no input power,
before the input is cut off, the control voltage Vapc should be control to less than 0.5V.
We have to improve thermal resistance, the through holes should be layouted as many as
possible on PCB under the module. And to get good stability, all the GND terminals should be
soldered to ground plane of PCB.

GSM

REFCLK

CX74017

Base
Band

Block

13MHz

Fractional-N

PLL

X2

DCS

/R

f

vco = (N+3.5+FN/2^22)fref/R

f

vco

f

ref

/3

LF

f

LO

AFC

13MHz

2V7_VTCXO

GSM

DCS

4/3 2/3

3.4 13 MHz Clock

The 13 MHz clock (VC-TCXO-208C) consists of a TCXO (Temperature Compensated Crystal
Oscillator) which oscillates at a frequency of 13 MHz.
It is used within the CX74017 RF Main Chip, BB Analog chip-set (AD6521), and Digital (AD6522).

Figure 3-4. VCTCXO Circuit.

3.5 Power Supplies and Control Signals

There are two regulators used in the phone to provide RF power. One is contained inside of
ADP3408 (U101), power management IC to provide the power for the VCTXO (X401). The other is
used to provide the power for remaining RF circuits.

Table 3-2.

Figure 3-5. Regulator Circuit.

3. TECHNICAL BRIEF

- 18 -

VC-TCXO-208C

1

5

4

3

CTL

GND OUT

VCC

23

SN74AHC1GU04DCKR

2V7_VTCXO

0R

15k

1n

1n

AFC

42

2.2u

(2012)

1M

1k

13MHz

FREF

ADP3330_2V85

OUT

IN

/ERR

/SD

NR

GND

1

2

3

6

5

4

10u

(2012)

0R

470p

RF2.85V

2.2u

VSYNTHEN

VBAT

Regulator Voltage Powers Enable Signal

Regulator 1
(U101, 2V7_VTCXO)

2.7 V

0.5 V VCTXO

Regulator 2
(U414, RF2V8)

2.85 V

0.5 V RF circuitry VSYNTHEN

3. TECHNICAL BRIEF

- 19 -

3.6 Testing Set-up and Checking Signals

A. Received RF Level and Checks

This section shows the typical RF levels expected throughout the receiver path. A block diagram
showing the locations of the RF measurement points and levels is shown in Fig. 3-11.

Receiver Testing Set-up

To check the receiver the following conditions have to be set:

On a signal generator or a GSM/DCS test box, output a CW signal of amplitude = -60 dBm at either:

947.4 MHz (CH62) when testing the GSM RX path or 1842. 6 MHz (CH699) when testing the DCS
RX path. Set the DC power supply to 4.0 V.

Note: All RF values shown are only intended as a guide figure and may differ from readings taken
with other test equipment and leads. Lead and connector losses should always be taken into
account when performing such RF measurements.

Testing Receiver

Using a suitable high frequency probe measure the RF levels at the relevant points shown in Fig. 3­9 and compare your measurements with those shown in the diagram. If there are any major
difference between the readings taken and those indicated then further investigation of that
particular point will be required. It will also be necessary to ensure that all the following power
supplies and signals are present which control this part of the receiver circuit :

1. The Control Signal of FEM (see Fig. 3-15, 16, 17)

2. RF2V8 (see Fig. 3-12)

3. 2V7_VTCXO (see Fig. 3-13)

4. 13MHz(see Fig. 3-14)

5. CLK, DATA, SEN (see Fig. 3-18)

8. RX IP, IN, QP, QN (see Fig. 3-21)

B. Transmitted RF Level and Checks

This section shows the typical RF levels expected throughout the transmitter path. A block diagram
showing the locations of the RF measurement points and levels is shown in Fig. 3-8.

Transmitter Testing Set-up

To check the transmitter the following conditions have to be set :

1. Set the DC Power supply to 4.0 V.

2. Power up the GSM/DCS test set and then establishing a call with an attached mobile on active
mode.

3. Select Channel, TX Level and Input Level according to which parameter is required.

Note: All RF values shown are only intended as a guide figure and may differ from readings taken
with other test equipment and leads. Lead and connector losses should always be taken into
account when performing such RF measurements.

3. TECHNICAL BRIEF

- 20 -

Testing Transmitter

Using a suitable high frequency probe measure the RF levels at the relevant points shown in Fig. 3­9, 10. and compare your measurements with those shown in the diagram. If there are any major
difference between the readings taken and those indicated then further investigation of that
particular point will be required. It will also be necessary to ensure that all the following power
supplies and signals are present which control this part of the transmitter circuit:

1. The Control Signal of FEM (see Fig. 3-15, 16, 17)

2. RF2V8 (see Fig. 3-12)

3. 2V7_VTCXO (see Fig. 3-13)

4. 13 MHz (see Fig. 3-14)

5. TXEN, TXRAMP, TXPA (see Fig. 3-19)

6. TX IP, IN, QP, QN (see Fig. 3-20)

3. TECHNICAL BRIEF

- 21 -

RF components (Component Side)

Figure 3-6. RF components (Component Side).

Reference Description Reference Description

U441 RF Main Chipset FL406 Dual SAW Filter

CN303 Mobile S/W X401 VCTCXO

FL405 Ant. S/W U414 LDO

U416 PAM U413 Inverter IC

CN303

FL405

U416

FL406

U441

U414

X401

U413

Test point of Rx Levels

Figure 3-7. Test point of Rx Levels.

3. TECHNICAL BRIEF

- 22 -

2

1

3

4

Test point of TX Levels

Figure 3-8. Test point of TX Levels(1).

3. TECHNICAL BRIEF

- 23 -

9 5

6

7

810

3. TECHNICAL BRIEF

- 24 -

Control signal test points (1)

Figure 3-9. Control signal test points (1).

VC2

U448

VC1

U444

RF

2.85V

TXQN TXIN

TXQP TXIP

TXQN TXIN
TXQP TXIP

13MHz
CLock

2V7_VCTCXO

TXRAMP(R401)

TXPA(R404)

3. TECHNICAL BRIEF

- 25 -

Control signal test points (2)

Figure 3-10. Control signal test points (2).

TP409(LE) TP408(Clock) TP407(Data)

TP404(RXEN)

3. TECHNICAL BRIEF

- 26 -

Figure 3-11. Transmitter & Receiver RF Levels

3. TECHNICAL BRIEF

- 27 -

Figure 3-12. Regulator Output (RF2V8).

Figure 3-13. VCTCXO Power Supply (2V7_VTCXO).

3. TECHNICAL BRIEF

- 28 -

Figure 3-14. 13MHz Clock.

Figure 3-15. Control Signal of FEM in Rx mode (GSM,DCS both).

3. TECHNICAL BRIEF

- 29 -

Figure 3-16. Control Signal of FEM in GSM TX mode.

Figure 3-17. Control Signal of FEM in DCS TX mode.

3. TECHNICAL BRIEF

- 30 -

Figure 3-18. LE, Clcok, Data.

Figure 3-19. TXEN, TARAMP, TXPA.

3. TECHNICAL BRIEF

- 31 -

Figure 3-20. TX IQ Signal.

7Figure 3-21. RX IQ Signal.

3. TECHNICAL BRIEF

- 32 -

3.7 Digital Main Processor

The AD6522 is an ADI designed processor.

Figure 3-31. Top level block diagram of the AD6522 internal architecture.

BUS Arbitration Subsystem

It is to work as a cross point for data accesses between the three main busses. EBUS is for external
accesses, primarily from Flash memory for code and data. RBUS is for internal RAM access. PBUS
is for access to internal peripheral modules such as UART, RTC or SIM. In addition to the three
main system busses, it has SBUS, IOBUS and DMABUS.

DSP subsystem

It consists of ADI DSP, Viterbi coprocessor, Ciphering unit and a cache memory/controller system.
The DSP can run at a maximum clock frequency of 78 MHz at 2.45 V. The Viterbi and ciphering
accelerators enable a very efficient implementation of the channel equalization, encryption and
decryption tasks.

AD6522

DSP

Subsystem

DMA and BUS
ARBITRATION

Peripheral

Subsystem

MCU

Subsystem

(ARM7TDMI )

SRAM

FLASH

RF-Control

MMI

USC

AD6521

(VBC)

Serial Link

DSP BUS

PBUS

PBUS

SBUS

EBUS

R

3. TECHNICAL BRIEF

- 33 -

MCU subsystem

It consists of an ARM7TDMI central processing unit, a boot ROM, a clock generation and access
control module.
The maximum clock frequency for the ARM7TDMI is 39 MHz at 2.45 V. The main clock is 13MHz
and it is provided by VCTCXO. The Clock & BS(Bus Select) generator make internal clock by
multiplying the main clock by 1X, 1.5X, 2X and 3X.
The boot ROM contains MCU code for basic communication between the ARM and one of the serial
ports in the Universal System Connector subsystem.

Peripheral subsystem

It contains four major groups of elements. The MMI group is a collection of all the functionality that
are needed to implement a complete user interface including keyboard, display, backlight, RTC,
general purpose I/O etc.
House Keeping group consists of three different sub-modules: The Watch Dog Timer, the Interrupt
Controller, and the general timers. GSM system group consists of the time base generation together
with the synthesizer interface, which form the radio control.
Direct Memory Access is located between the three system buses (PBUS, RBUS and EBUS) and
can move any data from any address location on one system bus to any address location on
another system bus.

Figure 3-32. System interconnection of AD6522 external interfaces

3. TECHNICAL BRIEF

- 34 -

3. TECHNICAL BRIEF

- 35 -

Interconnection with external devices

RTC block interface

Countered by external X-TAL
The X-TAL oscillates 32.768KHz

LCD module interface

Controlled by LCD_MAIN_CS, LCD_RES, LCD_RS, _WR, _RD, DATA [00...07] ports

Table 3-10.

RF interface

The AD6522 control RF parts through TXEN, RXON1, RXON2, AGCEN, SDATA, SCLK, SEN etc.

Table 3-11.

Description

LCD_MAIN_CS LCD chip enable. Each LCD has CS pin

LCD_RES This pin resets LCD module.

LCD_RS

This pin determines whether the data to LCD module is display data or
control data

/WR, /RD Read/Write control

DATA [00...07] Parallel data line

Signal Name

Description

TXEN TX Enable/Disable
RXON1 LNA, Mixer1 On/Off
RXON2 Mixer 2 On/Off
AGCEN AGC Enable/Disable
SDATA Serial Data to PLL
SCLK Clock to PLL
SEN PLL Enable/Disable

SIM interface

The AD6522 check status periodically in call mode if SIM card is inserted or not , but the AD6522
don't check in deep sleep mode. Interface by SIMDATAOP, SIMCLK, SIM_RST(GPIO_23)

Table 3-12.

Figure 3-33.

Key interface

Include 5 column and 5 row
The AD6522 detect key press by interrupt

ADP3408 interrupt

There are two interrupts EOC and CHARGEDET
EOC: End of Charge. Charging would be stopped when AD6522 receive this input.
CHARGEDET: This interrupt is generated when charge is inserted.

3. TECHNICAL BRIEF

- 36 -

Description

SIMDATAOP

This pin receives and sends data to SIM card. LG-W3000 support

only 3.0 volt interface SIM card.
SIMCLK Clock 3.5MHz frequency.
SIM_RST(GPIO_23) Reset SIM block.

3. TECHNICAL BRIEF

- 37 -

3.8 Analog Main Processor

AD6521

Figure 3-34. AD6521 function block diagram

AD6521

BSAEBAND
SERIAL
PORT

FILTER

Q TRANSMIT
DAC

I TRANSMIT
DAC

10 bit
RAMP DAC

JTAG Interface

INTERP

GMSK MOD

32 x 10 bit
RAMP RAM

FILTER

FILTER

I RECEIVE
DAC

Q RECEIVE
DAC

FILTER

FILTER

13 bit
AFC DAC

10 bit
I DAC

10 bit
AUX DAC

VOLTAGE
REFERENCE

AUXILIARY
SERIAL
PORT

CONTROL
REGISTOR

FILTER

PGA

MIC

ADC

DACPGA

VOICEBAND
SERIAL
PORT

SAMPLE
RATE
CONV

SAMPLE
RATE
CONV

FILTER

FILTER

ITXP
ITXN

QTXP
QTXN

RAMPDAC

IRXP

IRXN

QRXP

QRXN

AFCDAC

IDACOUT

IDACREF

AUXADC1

AUXADC2

AUXADC3

AUXADC4

REFOUT

REFCAP

VOUTNORP

VOUTNORN

VOUTAUXP

VOUTAUXN

BUZZER

VINNORP

VINNORN

VINAUXN

VINAUXP

VSDI

VSDO

VSFS

ASDI

ASDO

ASFS

BSDI

BSIFS

TXON

ATSM

RXON

BSDO

BSOFS

ARSM

MCLK

MCLKEN

RESET

TDITDOTMSTCK

BASEB AND TRANSMIT SECTION

BASEB AND RECEIVE SECTION

AUXILIARY SECTION

VOICEBAND SECTION

Dual-Mode Voi ceband B aseban d Codec

for ICO

BB Transmit section

This section generates in-phase and quadrature BB modulated GMSK signals (BT = 0.3) in
accordance with GSM 05.05 Phase 2 specifications The transmit channel consists of a digital
GMSK modulator, a matched pair of 10-bit DACs and a matched pair of reconstruction filter

BB Receive section

This section consists of two identical ADC channels that process baseband in-phase(I) and
quadrature(Q) input signals.
Each channel consists of a coarse switched capacitor input filter, followed by a high-order sigma­delta modulator and a lowpass digital filter

Auxiliary section

This section contains two auxiliary DACs(AFC DAC, IDAC) for system control.
This section also contains AUX ADC and Voltage Reference
AUX ADC: 6 channel 10 bits
AFC DAC: 13 bits
IDAC: 10 bits

Voiceband section

Receive audio signal from MIC. W3000 use differential configuration.
Send audio signal to Receiver. W3000 use differential configuration.
It interconnect with external device like main microphone, main receiver, ear-phone and Hands free
kit through the VINNORP, VINNORN, VOUTNORP, VOUTNORN, VINAUXP, VINAUXN,
VOUTAUXP, VOUTAUXN VINNORP, VINNORN: Main MIC positive/negative terminal.
VOUTNORP, VOUTNORN: Main Receiver positive/negative terminal.
VINAUXP, VINAUXN: Hands free kit mic positive/negative terminal.
VOUTAUXP, VOUTAUXON: Hands free kit speaker positive/negative terminal.

3. TECHNICAL BRIEF

- 38 -

3. TECHNICAL BRIEF

- 39 -

Figure 3-35. AD6521 Circuit diagram

3. TECHNICAL BRIEF

- 40 -

3.9 Power Management

ADP3408

Figure 3-36. ADP3408 inner block diagram.

Power up sequence logic

The ADP3408 controls power on sequence

Power on sequence

If a battery is inserted, the battery powers the 6 LDOs. Then if PWRONKEY is detected, the LDOs
output turn on. REFOUT is also enabled Reset is generated and send to the AD6522

LDO block

There are 6 LDOs in the ADP3408

Table 3-6.

Battery charging block

It can be used to charge Lithium Ion and/or Nickel Metal Hydride batteries. W3000 use Li-Ion battery
only. Charger initialization, trickle charging, and Li-Ion charging control are implemented in
hardware.

Charging Process

Check charger is inserted or not If ADP3408 detects that Charger is inserted, the CC-CV charging
starts.
Exception: When battery voltage is lower than 3.2V, the precharge (low current charge mode) starts
firstly. And the battery voltage reach to 3.2V the CC-CV charging starts.

Pins used for charging

CHRDET: Interrupt to AD6522 when charger is plugged.

CHGEN: Control signal from AD6522 to charge Li+ battery

EOC: Interrupt to AD6522 when battery is fully charged

GATEIN: Control signal from AD6522 to charge NiMH battery. But, not used.

MVBAT: Battery voltage divider. Divide ratio is 1:2.3 and it is sensed in AD6521 AUX_ADC4

TA (Travel Adaptor)

Input voltage: AC 85V ~ 260V, 50 ~ 60Hz

Output voltage: DC 5.2V ( ±0.2 V)

Output current: Max 850mA ( ±50mA)

Battery

Li-ion battery (Max 4.2V, Nom 4.0V)

Standard battery : Capacity - 850mAh, Li-ion

3. TECHNICAL BRIEF

- 41 -

Description

VSIM 2.86 V (is provided to SIM card)
VCORE 2.45 V (is provided to the AD6522 & AD6521’s digital core)
VRTC 2.45 V (is provided to the RTC and Backup Battery)
VAN 2.45 V (is provided to the AD6521 I/O and used as microphone bias)
VTCXO 2.715 V (is provided to VCTCXO)
VMEM 2.80 V (is provided to Flash)

3. TECHNICAL BRIEF

- 42 -

3.10 Memories

32M flash memory + 8M SRAM

16 bit parallel data bus

ADD01 ~ ADD21.

RF Calibration data are stored in Flash

3.11 Display and Interface

Table 3-7

W3000 has single type LCD. There are the control output LCD_CS which is derived from AD6522,
this acts as the chip select enable for the LCD . AD6522 uses DATA[00:07] pins to send data for
displaying graphical text onto the LCD

LCD

Display Format 128 x 64 dots

Back light LED Backlight

3. TECHNICAL BRIEF

- 43 -

3.12 Keypad Switches and Scanning

The key switches are metal domes, which make contact between two concentric pads on the
keypad layer of the PCB when pressed. There are 19switches (S301-S325,not used S303~S309),
connected in a matrix of 5 rows by 5 columns, as shown in Figure, except for the power switch
(S310), which is connected independently. Functions, the row and column lines of the keypad are
connected to ports of AD6522. The columns are outputs, while the rows are inputs and have pull-up
resistors built in. When a key is pressed, the corresponding row and column are connected
together, causing the row input to go low and generate an interrupt. The columns/rows are then
scanned by AD6522 to identify the pressed key.

Figure 3-36. Keypad Switches and Scanning.

3. TECHNICAL BRIEF

- 44 -

3.13 Microphone

The microphone is placed to the front cover and contacted to main PCB. The audio signal is passed
to VINNORP (#J10) and VINNORN (#K10) pins of AD6522. The voltage supply 2V45_VAN is output
from ADP3408, and is a bias voltage for both the VINNORP (through R101) and VINAUX (through
R112) lines. The VINNOR or VINAUX signal is then A/D converted by the Voiceband ADC part of
AD6521. The digitized speech is then passed to the DSP section of AD6522 for processing (coding,
interleaving etc.).

Figure 3-37. Microphone.

3. TECHNICAL BRIEF

- 45 -

3.14 Earpiece

The earpiece is driven directly from AD6521 VOUTNORP (#K8) and VOUTNORN (#K7) pins and
the gain is controlled by the PGA in an AD6521. The earpiece is placed in the front cover and
contacted to main PCB.

Figure 3-38. Earpiece.

3.15 Hands-free Interface

The audio out (VOUTAUXP & VOUTAUXN) to the hands-free kit consists of a pair of differential
signals from AD6521 auxiliary outputs (#K9, #K6), which are tracked down the board to carkit
connector (CN301) at the base of the handset. The DC level of the signal is supplied to the
VOUTAUX pin. And the EXT_IN signal is then input to the VINAUXP (#H10) and VINAUXN (#G10)
of AD6521.

3.16 Headset Jack Interface

3. TECHNICAL BRIEF

- 46 -

3.17 Key Back-light Illumination

In key back-light illumination, there are 12 Blue LEDs in Main Board, which are driven by
KEY_BACKLIGHT line from AD6522.

Figure 3-40. Key Back-light Illumination.

3.18 LCD Back-light Illumination

In LCD Back-light illumination, there is an driver in FPCB Board, which is driven by BACKLIGHT line
from AD6522.

Figure 3-41. LCD Back-light Illumination.

3. TECHNICAL BRIEF

- 47 -

3.19 Speaker & MIDI IC

LG-W3000 don’t use buzzer. Instead use loud speaker and Melody IC which support handsfree
function and various melody sound.

• Melody IC control

5 GPIO is assigned to control melody IC. Melody data is transferred to melody IC and played by
loud phone.

• External 3.3V LDO

The maximum output current of analog amplifier in melody IC is 300mA.

The current can not be fed by internal Omega so external LDO(U303) is included for max power of
loud Speker.

Figure 3-42. Speaker & MIDI IC

3. TECHNICAL BRIEF

- 48 -

MA-3 is a synthesizer LSI for mobile phones that realize advanced game sounds. This LSI has a
built-in speaker amplifier, and thus, is an ideal device for outputting sounds that are used by mobile
phones in addition to game sounds and ringing melodies that are replayed by a synthesizer. The
synthesizer section adopts “stereophonic hybrid synthesizer system” that are given advantages of
both FM synthesizers and Waveform table synthesizers to allow simultaneous generation of up to
thirty-two FM tones and eight Waveform table tones. Since FM synthesizer is able to present
countless tones by specifying parameters with only several tens of bytes, memory capacity and
communication band can be saved, and thus, the device exhibits the features in operating
environment of mobile phones such as allowing distribution of arbitrary melodies with tones. On the
other hand , since Waveform table synthesizer complies with downloading of tones from host CPU,
arbitrary ADCM/PCM tones can be treated from sequencer in addition to the use of tones that are
built-in the LSI.

- 49 -

4. TROUBLE SHOOTING

4. TROUBLE SHOOTING

4.1 POWER ON TROUBLE

START

PIF Power On, Test after Call 112

Battery

voltage

>3.2?

U101 Pin2

From Low to High

Level change?

Pin 10=2.9V
Pin 21=2.8V
Pin 25=2.7V
Pin 6=2.45V

O.K?

Download S/W

Power On Working!

U101 Check!

U101 Check!

Change the Battery

Change U101

Change U101

Yes

Yes

Yes

Yes

No

No

No

4. TROUBLE SHOOTING

- 50 -

Test) U101 (PMIC) Check

A) Check the voltage level of battery.

If voltage level < 3.2V, Charge the battery.

If voltage level > 3.2V, go on to B

B)Check pin 2 of PMIC(U101);POWER ON KEY

4. TROUBLE SHOOTING

- 51 -

4.2 Charge Trouble

START

PIF Power On, Test after Call 112

Connection

OK?

TA Voltage =

5.2V

Check change

after change

U102

Check change

after change

D101

Change working!

CN302 Check!

Check Solderring

Check TA

Yes

Yes

Yes

Yes

No

No

Test) U102 & D101 Check!!

A) Check “Is the battery pack well connected to the phone?”

If not, reassemble battery pack.

B) Check the battery voltage level. (3.2~4.2V)

“Yes” Check multi-color LED in the folder.

“No” Check TA.

C)Check U102, D101.

4. TROUBLE SHOOTING

- 52 -

4. TROUBLE SHOOTING

- 53 -

4.3 LCD Trouble

SETTING : After Initialize Agilent 8960, Test in EGSM, DCS Mode

START

PIF Power On,Test after

Call 11 2

Is the connection of LCD

With LCD connector on

Nain board is OK?

Check the soldering

Of connector at LCD

Check the soldering

Of connector at Board

LCD Working!!

Reassemble LCD

connector

J101

Check

Resolder connector

of LCD module & Main board

Replace LCD module

4. TROUBLE SHOOTING

- 54 -

Test) CN301 Check!!

A) Check the connection between LCD & Main board

B) Check the soldering of LCD& Main board

C) Replace LCD module

4. TROUBLE SHOOTING

- 55 -

4.4 Receiver Trouble

Replace the Main board. 

ABB is out of order.

Replace the V307.

Replace 

the FL301 

is out of 

order. 

START

PIF Power On, Testafter Call 112



Check the signal level of 

“VOUTNORP” at Pin 3 of FL301. Is 

it a few hundred mVAC?

Check the signal level at Pin 2 of
FL301. Is it a few hundred mVAC?

Yes

No

No

No

Yes

Check if the V307 is 

short.



Yes

Check the contact state of 

Reciver.

Replace Receiver.

Reciver will work properly.

SETTING : After Initialize Agilent 8960, Test in EGSM, DCS Mode

4. TROUBLE SHOOTING

- 56 -

Test) The Receiver part Circuit Digram

VOUTNORP

VOUTNORN

FL301 V307

4. TROUBLE SHOOTING

- 57 -

4.5 Speaker Trouble

SETTING : After Initialize Agilent 8960, Test in EGSM, DCS Mode

PIF Power On, Test after Call112

START

Check

Conne ctor

Yes

Check

PIN1, 2 of J302

Yes

SIM Detect

Working!!

J302

Check!!

Speaker

Check!!

No

No

Confirm Speaker

connector

Replace Speaker

Test) Speaker Check!!

A) Check J302, the Speaker connect in the Main board.

B) Check pin 1, 2 of J302 with oscilloscope.

C) Change the speaker

- 58 -

4. TROUBLE SHOOTING

J302

J302

- 59 -

4. TROUBLE SHOOTING

6) Mic. Trouble

SETTING : After Initialize Agilent 8960, Test in EGSM, DCS Mode

START

PIF Power On, Test after Call 112

MIC Bias

voltage

Check if the C114 voltage is

almost 2.2Vdc

Ye s

Is the voltage at Pin 3 of

Q101 almost 0Vdc?

Ye s

Check the signal level

at each side of MIC101. Is it a

few ten mVAC?

Ye s

Check the soldering

of R105, R107, C120, C124,

L101, L102.

Ye s

Replace Main Board.

No

No

No

No

Voltage at

pin 24 of U101 is

2.45Vdc?

Ye s

Replace the R101 & R104.

Replace Q101.

Replace the Microphone,

MIC101.

Replace R105, R107, C120,

C124, L101, L102.

No

Replace

the U101.

Ye s

Reciver will work properly.

- 60 -

4. TROUBLE SHOOTING

Test) MIC101 Check!!

R105, R107,

C120, C124

R104

R101

C114

MIC101

L101,

L102

MIC activating
signal : Mic is
activated when
this signal goes
to high.

The voltage at this
point goes to
almost 0V when the
mic is activated.

The signal
flow of the
microphone
to U103.

- 61 -

4. TROUBLE SHOOTING

C114

R104

R101R101

L101

L102

C124

R107, R105

C120

Q101

- 62 -

4. TROUBLE SHOOTING

7) Vibrator Trouble

SETTING : After Initialize Agilent 8960, Test in EGSM, DCS Mode

START

PIF Power On, Test

after Call 112

CN201
Check!

Check

Vibrator Pad

Ye s

No

Confirm Vibrator Pad

Check Pin1,2

Of Vibrator Pad

Ye s

Vibrator

Working!!

No

Change Vibrator

- 63 -

4. TROUBLE SHOOTING

Test) Vibrator Check!!

A) Check the vibrator pad in the Main board.

B) Check pin 1,2 of CN201.

C) Change the vibrator.

Q203 D302

Q201

- 64 -

4. TROUBLE SHOOTING

8) Backlight LED Trouble

SETTING : After Initialize Agilent 8960, Test in EGSM, DCS Mode

START

PIF Power On, Test

after Call 112

Detect Signal Level?

In D309 ~ D313

Ye s

Check Q201 current

450 ~ 500mA

Ye s

Backlight LED

Working!!

No

J101

Check!!

No

Check Diode

Replace Transistor Q201

Test) D302~D313/Diode & Q201 Check!!

A) Check the diode LD309~LD313.

B) Check the current through Q201.

- 65 -

4. TROUBLE SHOOTING

Q201

- 66 -

4. TROUBLE SHOOTING

9) SIM Detect Trouble

SETTING : After Initialize Agilent 8960, Test in EGSM, DCS Mode

START

PIF Power On, Test

after Call 112

Check SIM card

For 3V ?

Ye s

Check SIM

Connector soldering?

Ye s

SIM Detect Working!!

No

J101

Check!!

No

Change SIM card

Replace SIM

connector J101

- 67 -

4. TROUBLE SHOOTING

Test) SIM Connector Check!!

A) Check the contact between SIM socket and PCB.

2V45_VAN

4. TROUBLE SHOOTING

- 68 -

10) Earphone Trouble

START

PIF Power On, Test

after Call 112

Set the audio part of the

test equipment to echo mode.

Can you hear your

voice from the earphone?

Does the audio profile

of the phone change to the

earphone mode?

Inset the earphone to the phone

Earphone will work propely

Earphone detect problem

Can you hear your voice

from the earphone?

Set the audio part of the test

equipment to PRBS or continuous

wave mode.

Change the earphone and try again.

Audio path problem

4

Ye s

No

No

No

No

Ye s

Ye s

Ye s

3

2

1

Change Earphone.

Earphone sending

path problem

Earphone receiving

path problem

Can you hear your voice

from the earphone?

Voltage at R307 = 0V ?

Earphone detect

problem

1

4

Resolder R307.

No No

Ye s

Change the J301.

Check if between

pin 3 and pin 4 of J301

is open ?

SETTING : After Initialize Agilent 8960, Test in EGSM, DCS Mode

4. TROUBLE SHOOTING

- 69 -

Earphone receiving

path problem

No No

No

No

Ye sYe s

Ye s

Ye s

2

4

Resolder or replace U305.

Re-download software.

Does it work well?

Change the main board.

Is the signal level at

R334 a few tens or hundreds

VAC ?

Is the signal level at pin
6 of U305 a few tens or

hundreds VAC?

Is the signal level at pin
5 of U305 a few tens or

hundreds VAC?

Resolder R334 and J301.

Earphone sending

path problem

Voltage at pin 3 of

U304 = 1.5~1.9VDC?

Is the signal level at pin
6 of U308 a few tens or

hundreds VAC?

Is the signal level at

pin 5 of U308 a few tens or

hundreds VAC?

Resolder C170.

Does it work well?

Re-download software.

Change the main board.

Does it work well?

NoNo

No

No

No

Ye s

Ye s

Ye s

Ye s

Ye s

Ye s

Resolder C145.

3

4

Resolder or replace U308.

Is the signal level

across C145 a few tens or

hundreds VAC?

4. TROUBLE SHOOTING

- 70 -

Q201 U305

U308

4. TROUBLE SHOOTING

- 71 -

C145 C170

J301

R307R334

4. TROUBLE SHOOTING

- 72 -

This part makes the mic bias of t he

ear-mic.

The direction of the audio signal from the ear-

mic

Mic bias and path for the ear-mic

Refer t o the page 1 of the complete circuit diagram

for detail.

To U103

(AD6521)

The voltage inp ut of ear-mic

hook-detect

The voltage inp ut of ear-mic

detect

These resistors make

the reference volt age.

The reference volt age fo r the h ook-

detect of ear-mic.

Ear-mic detection p art

Refer t o the page 2 of t he complete circuit

diagram for detail.

The sig nal flow wh en t he ear-

mic is ac tivated .

Refer to the page 2 of the complete circuit diagram for detail.

The circuit d iagram o f the ear-mic jack

Refer t o t he page 2 of t he complete circuit diagram for detail.

U305 & U308 select the pat h of audio

signal for t he ear-mic or the H FK.

12) HFK Trouble

4. TROUBLE SHOOTING

- 73 -

SETTING : After Initialize Agilent 8960, Test in EGSM, DCS Mode

START

PIF Power On, Test

after Call 112

Check

CN302 ?

Ye s

Check Soldering

R311,C311 ?

Ye s

HFK

Working!!

No

Soldering

Check!!

No

Replace CN302

Replace Resistor & Capicitor

R311, C311

Test) CN302 & R311 Check!!

A) Check the contact between CN302 and HFK jack.

B) Check the R311

- 74 -

4. TROUBLE SHOOTING

R311

R311

- 75 -

4. TROUBLE SHOOTING

5. TROUBLE SHOOTING

6. TEST POINT DATA

7. ASSEMBLY INSTRUCTION

- 76 -

4. TROUBLE SHOOTING

8. BLOCK DIAGRAM

9. COMPONENT LIST

10. DOWNLOAD AND CALIBRATION

10.1 Download

Fig. 9-1 and 9-2 illustrate a download set-up.

Figure 9-1. Download Setup 1.

Download procedure

Access flash loader program in PC.

Select source code you want to download.

Don’t check OWCD AND VERIFY in flash loader window.

Push start button in flash loader window.

Condition

1. Disconnect TA to the Datakit and phone have a battery

a. VBAT < 3.2V

Don’t download to the phone.

b. 3.2V VBAT 3.4 V
First : Connect Datakit to the phone.

Second : Push the power on button until finish download.

c. VBAT > 3.4V

First : Connect Datakit to the phone.

Second : Push the power on button during 1~2second.

- 77 -

4. TROUBLE SHOOTING

Data Cable

LG-W3000

PC

4. TROUBLE SHOOTING

- 78 -

2. Connect TA to the Datakit and phone have a battery

a. VBAT < 3.2V

Don’t download to the phone.

b. VBAT

3.2 V

Connect Datakit to the phone.

3. Download method when battery under 3.2 voltage

First : Remove battery in the phone

Second : Connect TA to the Datakit

Third : Connect phone to the Datakit.

Figure 9-2. Download Setup 2.

LG-W3000

+-

TA

PC

JIG

4. TROUBLE SHOOTING

- 79 -

9.2 Calibration

A. Equipment List

Table 9-1. Calibration Equipment List.

B. Equipment Setup

Equipment for Calibration Type / Model Brand

Wireless Communication Test Set HP-8960 Agilent

RS-232 Cable and Test JIG LG

RF Cable LG

Power Supply HP-66311B Agilent

GPIB interface card HP-GPIB Agilent

Calibration & Final test software LG

Test SIM Card

PC (for Software Installation) Pentium II class above 300MHz

GSM Test Set(8960)

LG -W3000

M obile Switch Cable

Battery S imulator

Jig

GP IB Cable

Pow er Supply

+

-

+-

GP IB
Cable

PC

TA

4. TROUBLE SHOOTING

- 80 -

Figure 9-4. The top view of Test Jig.

C. Test Jig Operation

Table 9-2. Jig Power.

Table 9-3. Jig DIP Switch.

1234

ON

OFF

REMOTE

H/F

DC

PS

ON

TA

POWER

MON
Status

UART
Status

POWER

ON
OFF

JTAG2 JTAG1 AUDIO

MONUART

PHONE

TA

DC IN
12V

PS

+-

Power Supply usually 4.0V

DC Adaptor 9.5V, 500mA

Switch Number Name Description

Switch 1 RPWRON In ON state, phone is awaked.

Switch 2 HF_DETECT Turn on for AUDIO TEST

Switch 3 Power Supply Power is provided for phone from Power Supply

Switch 4 D.C power Power is provided for phone from DC adaptor.

Table 9-4. LED Description.

1. Connect as Fig. 9-3.(RS232 Serial cable is connected between COM port of PC and MON port of
TEST JIG, in general)

2. Set the Power Supply 4.0 V, also DC adaptor may be used

3. Set the 3rd of DIP SW ON state, In case of DC adapter, set 4th ON state

4. Press the Phone power key, If the Remote ON is used, 1st ON state

D. Procedure

1. Connect as Fig. 9-3.(RS232 Serial cable is connected between COM port of PC and MON port of

TEST JIG, in general)

2. POWER ON PC then enter into Windows 98.(Remark: Windows 2000 system could be feasible)

3. Run AUTOCAL.exe, then AUTOCAL application window will be appeared.

4. TROUBLE SHOOTING

- 81 -

Switch Number Name Description

Switch 1 RPWRON In ON state, phone is awaked.

Switch 2 HF_DETECT Turn on for AUDIO TEST

Switch 3 Power Supply Power is provided for phone from Power Supply

Switch 4 D.C power Power is provided for phone from DC adaptor.

DIP SW

DIP SW

DIP SW

DIP SW

DIP SWDIP SW

DIP SWDIP SW

ON

ON

ON

ON

ONON

ONON

OFF

OFF

OFF

OFF

OFFOFF

OFFOFF

1234

1234