LG TCHM-1000, TCHM-1000-R Service manual

SERVICE MANUAL MODEL : TCH-M1000 , TCH-M1000R 

2005

DETACHABLE FRONT
PANEL CAR CD RECEIVER

SERVICE MANUAL

MODEL : TCH-M1000 , TCH-M1000R 

CAUTION

BEFORE SERVICING THE UNIT, READ THE “SAFETY PRECAUTIONS”
IN THIS MANUAL.

- 1-1 -

❍

SECTION 1. SUMMARY

• SERVICING PRECAUTIONS

..........................................................................................................

1-2

• ESD PRECAUTIONS

.......................................................................................................................

1-3

• SPECIFICATIONS

...........................................................................................................................

1-4

❍

SECTION 2. ELECTRICAL

• ELECTRICAL TROUBLESHOOTING GUIDE

.................................................................................

2-1

• CD PART TROUBLESHOOTING GUIDE

.........................................................................................

2-3

• WAVEFORMS OF MAJOR CHECK POINT

..................................................................................

2-11

• INTERNAL BLOCK DIAGRAM of ICs

............................................................................................

2-13

• BLOCK DIAGRAM

.........................................................................................................................

2-25

• SCHEMATIC DIAGRAM

................................................................................................................

2-27

• MAIN SCHEMATIC DIAGRAM

......................................................................................................

2-29

• CDP SCHEMATIC DIAGRAM

.......................................................................................................

2-31

• PRINTED CIRCUIT DIAGRAM

......................................................................................................

2-33

❍

SECTION 3. CABINET MAIN CHASSIS & MECHANISM

• EXPLODED VIEW

...........................................................................................................................

3-1

❍

SECTION 4. REPLACEMENT PARTS LIST

....................................................................

4-1

[CONTENTS]

- 1-2 -

❏ SERVICING PRECAUTIONS

➊ Always disconnect the power source before:

1) Removing or reinstalling any component, circuit board, module or any other instrument assembly.

2) Disconnecting or reconnecting any instrument electrical plug or other electrical connection.

3) Connecting a test substitute in parallel with an electrolytic capacitor in the instrument.

CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in

an explosion hazard.

➋ Do not defeat any plug/socket B+ voltage interlocks with which instruments covered by this service

manual might be equipped.

❸ Do not apply power to this instrument and or any of its electrical assemblies unless all solid-state

device heat sinks are correctly installed.

❹ Always connect a test instrument’s ground lead to the instrument chassis ground before

connecting the test instrument positive lead. Always remove the test instrument ground lead last.

1) The service precautions are indicated or printed on the cabinet, chassis or components. When servicing,
follow the printed or indicated service precautions and service materials.

2) The Components used in the unit have a specified conflammability and dielectric strength. When
replacing any components, use components which have the same ratings. Components marked in
the circuit diagram are important for safety or for the characteristics of the unit. Always replace with the
exact components.

3) An insulation tube or tape is sometimes used and some components are raised above the printed writing
board for safety. The internal wiring is sometimes clamped to prevent contact with heating components.
Install them as they were.

4) After servicing always check that the removed screws, components and wiring have been installed
correctly and that the portion around the service part has not been damaged. Further check the insulation
between the blades of attachment plug and accessible conductive parts.

SECTION 1. SUMMARY

- 1-3 -

❏

ESD PRECAUTIONS

[Electrostatically Sensitive Devices (ESD)]

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such omponents
commonly are called Electrostatically Sensitive Devices (ESD). Examples of typical ESD devices are
integrated circuits and some field-effect transistors and semiconductor chip components. The following
techniques should be used to help reduce the incidence of component damage caused by static electricity.

1) Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain
off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and
wear a commercially available discharging wrist strap device, which should be removed for potential
shock reasons prior to applying power to the unit under test.

2) After removing an electrical assembly equipped with ESD devices, place the assembly on a conductive
surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3) Use only a grounded-tip soldering iron to solder or unsolder ESD devices.

4) Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static”
can generate electrical charges sufficient to damage ESD devices.

5) Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ESD
devices.

6) Do not remove a replacement ESD device from its protective package until immediately before you are
ready to install it. (Most replacement ESD devices are packaged with leads electrically shorted together
by conductive foam, aluminum foil or comparable conductive material).

7) Immediately before removing the protective material from the leads of a replacement ESD device, touch
the protective material to the chassis or circuit assembly into which the device will be installed.

CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8) Minimize bodily motions when handling unpackaged replacement ESD devices. (Otherwise harmless
motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor
can generate static electricity sufficient to damage an ESD device).

[CAUTION. GRAPHIC SYMBOLS]

THE LIGHTNING FLASH WITH APROWHEAD SYMBOL. WITHIN AN EQUILATERAL
TRIANGLE, IS INTENDED TO ALERT THE SERVICE PERSONNEL TO THE PRESENCE
OF UNINSULATED “DANGEROUS VOLTAGE” THAT MAY BE OF SUFFICIENT
MAGNITUDE TO CONSTITUTE A RISK OF ELECTRIC SHOCK.

THE EXCLAMATION POINT WITHIN AN EQUILATERAL TRIANGLE IS INTENDED TO
ALERT THE SERVICE PERSONNEL TO THE PRESENCE OF IMPORTANT SAFETY
INFORMATION IN SERVICE LITERATURE.

- 1-4 -

1. GENERAL

Power requirements

.....................................................................................................................

DC12V~15V

Ground system

...................................................................................................................................

Negative

Dimensions(W x H x D)

......................................................................................................

188 x 58 x 166mm

Weight

..............................................................................................................................................

Net: 1.3kg

2. RADIO SECTION

FM AM(MW)

Frequency range 65.0~74.0MHz(Optional), 522~1,620kHz

87.5~108MHz (Optional:530~1,710kHz/ 520~1,620kHz)

Intermediate frequency 10.8MHz 450kHz

Usable sensitivity 10dBµV 28dBµV

Signal to noise ratio 55dB 45dB

3. COMPACT DISC SECTION

Frequency response

.....................................................................................................................

40Hz~20kHz

Channel separation

......................................................................................................................

50dB(1kHz)

Signal to noise ratio ..................................................................................................................................

60dB

4. AUDIO SECTION

Maximum output power

.......................................................................................................................

50W x 4

Speaker impedance

...............................................................................................................

4Ω x 4 or 8Ω x 4

NOTE: The design and specifications are subject to change without notice in the sourse of product

improvement.

❏

SPECIFICATIONS

- 2-1 -

SECTION 2. ELECTRICAL

❏ ELECTRICAL TROUBLESHOOTING GUIDE

Any Key power on.

Is power turnd on?

DISC loading?

Does initial reading occur?

Can disc be played?

Is audio output supplied?

Check power supply circuitry.

Q260, Q380, Q381, IC401 Pin3

IC201 Pin2

Check loading supply circuitry.

Q350,Q351,PN505, IC401 Pin1

Check laser circuitry.

Q501, IC502

Check focusing circuitry.

Q501,IC502

Check DISC.

Check tracking servo circuitry.

Q501,IC502

Check audio circuitry.

IC502,IC601,IC801

OK

YES

YES

YES

YES

YES

YES

NO

NO

NO

NO

NO

(1) No Power.

- 2-2 -

YES

YES

YES

YES

YES

YES

(2) LCD light abnornal.

Any Key power on.

(without DISC)

Do display LCD then light?

Check voltage in the power

supply circuitry.

Power supply circuitry

defective.

Q380,Q381,IC403

Reset circuit defective.

IC201 Surrounding circuit

defective.

X401, C413,C414 defective.

Q260, PN401 front PCB

pattern defective.

IC401, Pin66, 67, 88, 89 front

PCB pattern defective.

IC901, Surrounding circuit

PCB pattern defective.

Is u-com IC401 reset circuit

normal? Pin10

Is u-com IC401 keyin Pin 9, 37

5volt input?

Is u-com IC401 Pin 66,67,88,89

output waveform normal?

Is IC901 Com1, Com2, Com3

output waveform normal?

Display LCD connector defective.

Is u-com IC401X1, X2 terminal

Pin38, 39 input?

OSC : 9.8304MHz

NO

NO

NO

NO

NO

NO

NO

- 2-3 -

- 2-4 -

- 2-5 -

- 2-6 -

- 2-7 -

- 2-8 -

- 2-9 -

- 2-10 -

- 2-11 -

❏ WAVEFORMS OF MAJOR CHECK POINT

#1. MICOM INTERFACE WAVEFORM

(CN503 1 9,2 1 ,1 8,20) during normal play

#2. SLED DRIVE AND MOTOR WAVEFORM

(IC504 pin5, 1 4) when focus search

#3. FOCUS DRIVE AND MOTOR WAVEFORM

(R5 1 3, IC504 pin 1 5)

• When focus search failed or there is no disc on the
tray

• There is disc on tray and focus search success

- 2-12 -

#4. SPINDLE DRIVE AND MOTOR WAVEFORM

(IC504 pin6, 1 2) when TOC reading

#5. TRACK DRIVE AND MOTOR WAVEFORM

(R508, IC504 pin23) during normal play

#6. RF, TRACKING AND FOCUS ERROR WAVEFORM

(IC502 pin8, 2 1 , 23) during normal play

- 2-13 -

■ IC401 LC875465B

1) PORT ASSIGNMENT

❏

INTERNAL BLOCK DIAGRAM of ICs

- 2-14 -

2) PORT DESCRIPTION

- 2-15 -

Pin I/O

26

I

27

O

28 O

29 O
30

O

31

I

32

O

33 O

34 O

35 I

36 O
37 O
38 O
39 I
40 O
41 I
42 O
43 O
44 ­45 ­46 O
47 O
48 O

49 O
50 O
51 O
52 O
53 O
54 I

55 O
56 I
57 I
58 I
59 I
60 O
61 O
62 O
63 I
64 I
65 I
66 O
67 I
68 O
69 I
70 ­71 ­72 I

P34

P33

PCD_MUTE

CD s audio signal mute output

PDSP_ODA

In MD, motor drive rs power save command ouput
Power Save Mode(High), N ormal Mode(Low)
In MD, all motors output "cut off" command ouput
Cut Off Mode(High), Normal Mode(Low)
Constant velocit y signal input
Ok(High), Not Ok(Low)
DSP chip enable output

In MD, load motor "forward" command output

To DSP, data output
From DSP, data input
Clock output for interface with DSP

In MD, SW2 state input. Refer to CD Player.
DSP power suppler ON ouptut

Description

Beep sound (2KHz) output
To LCD driver, data output
Not to be used
Clock output for interface with LCD driver
Not to be used
Not to be used
Not to be used
Power supply (+5V)
Ground
PLL IC enable output
LCD driver enabl e output
LCD driver r e set output

Normal(High), Reset(Low)
External amplifier ON output

LED flashing control output
Not to be used
Not to be used
Not to be used
Focusing OK signal input

Ok(High), Not Ok(Low)
DSP reset output

Not to be used
Not to be used
Not to be used
Not to be used
To CD changer, data output
For diode option check, s ignal 1 output. Refer to Option Diode.
For diode option check, s ignal 2 output. Refer to Option Diode.
For diode option check, s ignal 1 or 2 input2. Refer to Option Diode.
For diode option check, s ignal 1 or 2 input1. Refer to Option Diode.
For diode option check, s ignal 1 or 2 input0. Refer to Option Diode.
Clock output for interface with PLL IC
From PLL IC, data input
To PLL IC, data output
Telephone mute input
Ground
Power supply (+5V)
Not to be used

P32

PCD_FWD

Name in ModelName in Micom

PCD_SW2P31
PCD_PWR

P10/SO0

PDSP_IDAP11/SI0/SB0
PDSP_OCLKP12/SCK0
PDRV_OPSP13/SO1

PDRV_OMUTEP14/SI1/SB1

PDSP_IFSEQP15/SCK1

PDSP_OCENP16/T1PWML
PBEEP
PFRT_DOSI2P0/SO2
N.CSI2P1/SI2/SB2
PFRT_CLKSI2P2/SCK2
N.CSI2P3/SCK20
N.CPWM1
N.CPWM0
VDDVDD2
GNDVSS2
PPLL_CEP00
PFRT_CEP01
PFRT_RESP02

PREMOTEP03
PLEDP04
N.CP05
N.CP06
N.CP07
PDSP_IDRFP20/INT4/T1IN

PDSP_IRSTP21/INT4/T1IN
N.CP22/INT4/T1IN
N.CP23/INT4/T1IN
N.CP24/INT5/T1IN
N.CP25/INT5/T1IN
PCDC_DOP26/INT5/T1IN
POPT_OUT0P27/INT5/T1IN
POPT_OUT1PB7/D7
POPT_IN2PB6/D6
POPT_IN1PB5/D5
POPT_IN0PB4/D4
PPLL_CLKPB3/D3
PPLL_DIPB2/D2
PPLL_DOPB1/D1
PTEL_MUTEPB0/D0
GNDVSS3
VDDVDD3
N.CPC7/A7

F

LowH

B

H

H

R

H

L

O

LowL

F

P

P

’

’

’

CD_F

ow
ow

igh
igh

CD_R

igh

igh

unction

pen mode

everse

orward

reak mode

P17/T1PWMH/BUZ

- 2-16 -

■ IC501 MN6627933

1) PORT ASSIGNMENT

Pin I /O

73 O

74 O
75

O

76 O

77 I

78 I

79 O

80 I

PC0/A0

PA0/CS2#

PC4/A4
PC3/A3

PC2/A2

PC1/A1

PFRT_DET

Fr ont Pannel Ok(High) , Absent(Low)

Clock for interface wi th vol ume controll er

System Power supplier ON output
On(High), Off(Low)

Description

To volume contr oller, data out put

To power amp, "M UTE" command output
Mute(Hi gh), Sound(Low)

Name in Micom

PPWR_MU TEPC6/A6

PEV_CLKPC5/A5

PPWR

Name i n M odel

PEV_DO

Fr om ISO jack, ACC signal i nput
ACC On(Low), ACC Off(Hi gh)

Not to be used

CD changer power suppl ier ON output
CDC On(High), CDC Off(Low)

PACC

N.C

PCDC_PWR

Fr ont pannel existence signal input

- 2-17 -

2) Block Diagram

- 2-18 -

3) PORT DESCRIPTION

Pin No. Symbol I/O Function

1 D11 I/O DRAM data signal I/O 11
2 D10 I/O DRAM data signal I/O 10
3 D9 I/O DRAM data signal I/O 9
4 D8 I/O DRAM data signal I/O 8
5 UDQM O SDRAM upper byte data mask signal output
6 SDRCK O SDRAM clock signal output
7 A11 O DRAM address signal output 11
8 A9 O DRAM address signal output 9
9 A8 O DRAM address signal output 8

10 A7 O DRAM address signal output 7
11 A6 O DRAM address signal output 6
12 A5 O DRAM address signal output 5
13 A4 O DRAM address signal output 4
14 LDQM O SDRAM lower byte data mask signal output
15 NWE O DRAM write enable signal output
16 NCAS O DRAM CAS control signal output
17 NRAS O DRAM RAS control signal output
18 NCS O SDRAM chip select signal output
19 A3 O DRAM address signal output 3
20 A2 O DRAM address signal output 2
21 A1 O DRAM address signal output 1
22 A0 O DRAM address signal output 0
23 DRVDD1 I Power supply 1 for DRAM interface I/O
24 DVSS1 I Ground 1 for digital circuits
25 A10 O DRAM address signal output 10
26 *BA1 O SDRAM bank selection signal output 1
27 *BA0 O SDRAM bank selection signal output 0
28 DVDD1 I Power supply 1 for internal digital circuits
29 SPOUT O Spindle drive signal output (absolute value)
30 *SPPOL O Spindle drive signal output (polarity)
31 TRVP O Traverse drive signal output (positive polarity)
32 *TRVM O Traverse drive signal output (negative polarity)
33 *TRVP2 O Traverse drive signal output 2 (positive polarity)
34 *TRVM2 O Traverse drive signal output 2 (negative polarity)
35 TRP O Tracking drive signal output (positive polarity)
36 *TRM O Tracking drive signal output (negative polarity)
37 FOP O Focus drive signal output (positive polarity)
38 *FOM O Focus drive signal output (negative polarity)
39 IOVDD1 I Power supply 1 for digital I/O
40 TBAL O Tracking balance adjustment signal output
41 FBAL O Focus balance adjustment signal output
42 FE I Focus error signal input
43 TE I Tracking error signal input
44 ADPVCC I Voltage input for supply voltage monitor
45 RFENV I RF envelope signal input
46 LDON O Laser ON signal output
47 NRFDET I RF detectoion signal input
48 OFT I Off-track signal input
49 BDO I Dropout signal input
50 AVDD1 I Power supply 1 for analog circuits
51 IREF I Analog reference current input
52 ARF I RF signal input
53 DSLF O DSL loop filter pin
54 PWMSEL I PWM output mode selection input Low: Direct High: 3-state
55 PLLF O PLL loop filter pin (for phase comparison)
56 PLLFO O PLL loop filter pin (for speed comparison)
57 AVSS1 I Ground 1 for analog circuits
58 LOOUTL O L-ch audio output for line-out output
59 LOVSS1 I Ground for line-out output

- 2-19 -

Pin No. Symbol I/O Function

60 LOOUTR O R-ch audio output for line-out output
61 LOVDD1 I Power supply for line-out output
62 N.C. - ­63 TMON1 O Test monitor output 1
64 N.C. - ­65 N.C. - ­66 TMON2 O Test monitor output 2
67 DVDD3 I Power supply 3 for digital circuits
68 DVSS2 I Ground 2 for digital circuits
69 *EXT0 I/O Expansion I/O port 0
70 *EXT1 I/O Expansion I/O port 1
71 *EXT2 I/O Expansion I/O port 2
72 MCLK I Microcontroller command clock signal input
73 MDATA I Microcontroller command data signal input
74 MLD I Microcontroller command load signal input
75 *STAT O Status signal output
76 *BLKCK O Subcode block clock signal output
77 *SMCK O 4.2336-/8.4672-MHz clock signal output
78 *PMCK O 88.2-kHz clock signal output
79 *TX O Digital audio interface signal output
80 *FLAG O Flag signal output
81 NRST I LSI reset signal input
82 NTEST I Test mode setting input
83 DVSS3 I Ground 3 for digital circuits
84 X1 I Crystal oscillator circuit input
85 X2 O Crystal oscillator circuit output
86 IOVDD2 I Power supply 2 for digital I/O
87 DVDD2 I Power supply 2 for internal digital circuits
88 D2 I/O DRAM data signal I/O 2
89 D1 I/O DRAM data signal I/O 1
90 D0 I/O DRAM data signal I/O 0
91 D3 I/O DRAM data signal I/O 3
92 D4 I/O DRAM data signal I/O 4
93 D5 I/O DRAM data signal I/O 5
94 D6 I/O DRAM data signal I/O 6
95 D7 I/O DRAM data signal I/O 7
96 D15 I/O DRAM data signal I/O 15
97 D14 I/O DRAM data signal I/O 14
98 DRVDD2 I Power supply 2 for DRAM interface I/O
99 D13 I/O DRAM data signal I/O 13

100 D12 I/O DRAM data signal I/O 12

- 2-20 -

■ IC503 M12L16161A

1) PORT ASSIGNMENT

2) BLOCK DIAGRAM

CLK

ADD

LCKE

LRAS

LCBR LWE

CLK

CKE

CS RAS CAS

WE L(U)DQM

LDQM

LWCBR

LCAS

Bank Select

LWE

LDQM

DQI

Data Input Regidter

512K x 16

512K x 16

Column Decoder

Latency & Burst Length

Programming Register

Timing Register

Address Register

Row Decoder

LCBR

LRAS

Sense AMP

I/O Control

Output Buffer

Col. Buffer

Row Buffer

Refresh Counter

- 2-21 -

Pin Name Input Function

CLK System Clock Active on the positive going edge to sample all inputs.

CS Chip Select

Disables or enables device operation by masking or enabling all inputs except
CLK, CKE and L(U)DQM.
Masks system clock to freeze operation from the next clock cycle. CKE

CKE Clock Enable should be enabled at least one cycle prior to new command. Disable input

buffers for power down in standby.

A0~A10/AP Address

Row/Column addresses are multiplexed on the same pins. Row address:
RA0~RA10, column address: CA0~CA7

BA Bank Select Address

Selects bank to be activated during row address latch time. Selects bank for
read/write during column address latch time.

RAS Row Address Strobe

Latches row addresses on the positive going edge of the CLK with RAS low.
Enables row access & precharge.

CAS Column Address Strobe

Latches column addresses on the positive going edge of the CLK with CAS
low. Enables column access.

WE Write Enable

Enables write operation and row precharge. Latches data in starting from
CAS, WE active.

L(U)DQM Data Input / Output Mask

Makes data output Hi-Z, tSHZ after the clock and masks the output. Blocks
data input when L(U)DQM active.

DQ0~15 Data Input / Output Data inputs/outputs are multiplexed on the same pins.

VDD/VSS Power Supply/Ground Power and ground for the input buffers and the core logic.

VDDQ/VSSQ Data Output Power/Ground

Isolated power supply and ground for the output buffers to provide improved
noise immunity.

N.C/RFU No Connection/ This is recommended to be left No Connection on the

Reserved for Future Use device.

■ PIN Function table

■ IC504 BA5810FM

28

27

26

25 24

23

22

21 20 19 18 17 16 15

1234 5

6

7 8 9 1011121314

++— + —

+ —

+ —

+ —

7.5k

7.5k

7.5k

7.5k

LOADING PRE

FWE REV

X3

POWER

SAVE

16k

16k

16k

16k

PREVCC

(PRE. LODING)

PREVCC12
(CH1. CH2)

CD1~

CB4

MUTE

POWVCC34

(CH3, CH4)

10k

10k

10k 10k

10k

10k

10k

10k

LEVEL
SHIFT

LEVEL
SHIFT

LEVEL
SHIFT

LEVEL
SHIFT

10k

10k

10k

10k

10k

10k

- 2-22 -

■ IC505 AMC1117

■ BLOCK DIAGRAM

- 2-23 -

■ IC601 PT2313L

RB

RB

TREB_RBIN_RBOUT_RLOUDRINROUTREFAGNDVDD

RIN1

RIN1

RIN2

RIN2

RIN3

RIN3

LIN3

LIN3

Input

Selector

& Gain

Control

LIN2

LIN2

LIN1

LOUT LIN LOUD_L BOUT_L BIN_L TREB_L

LFOUT

Mute

Mute

Mute

Mute

Speaker
ATT

Speaker
ATT

Speaker
ATT

Speaker
ATT

LROUT

CLK

DATA

DGND

RFOUT

RROUT

LIN1

2

11

10

9

13

14

15

17 16 12 19

18

4

25

23

28

27

26

24

22

31 7 6 8 21

20

5

Supply

Bass

Serial Bus Decoder & Latches

Bass

Treble

Treble

Voume
&
Loudness

Voume &
Loudness

- 2-24 -

■ IC801 TDA8571J

+

-

+

-

+

-

+

-

+

-

+

-

+

-

+

-

PGND1 PGND2 PGND3 PGND4

MGG153

OUT4

-

OUT4+

OUT3+

DIAGNOSTIC

OUT2+

V

OUT1+

OUT3

-

OUT2

-

OUT1

-

21

20

22

19

17

9

5

7

4

2

23 16

10

11

12

13

14

30 K¥

30 K¥

30 K¥

30 K¥

IN1

MODE

IN2

SGND

IN3

IN4

8 1 15

186

3

ref

V

P1

V

P2

V

P3

V

P4

V

ref

V

DIAG

■ IC901 LC75811

2-25 2-26

❏ BLOCK DIAGRAM

TU101

CET85XX

16,17,
18,19

24,25

10,14

6

13,19

7

11,12

2(LR)

20

4,14

OP AMP

S4560

LINE SW/E.VOLUME

27
28

2

9.4V REG

Q360,ZD361

22,23

10,14

CCNTROL

Q720,721,722,723

2(RL,RR)

2(FL,FR)

2(RL,FR)

MUTE

POWER AMP

TA8275H

11,14

12,15

22

4-CH

(FL,FR,RL,RR)

2, 8, 18, 24

7,9

21,23

17,19

3, 5

L-SPEAKER

FRONT

R-SPEAKER

L-SPEAKER

REAR

R-SPEAKER

LINE-OUT

(OPTION)

CDC SIGNAL

9.4V

RADIO VCC
Q350,ZD313

POWER 5V
Q282,Q283

14V

POWER ON

Q380,381

ANT CONTROL

Q390,391

REMOTE

CONTROL

Q320,321

PN801 #16

BACK_UP

PN801 #10

PWR_ANT

PN801 #6

REMOTE

PICK-UP

CD MECHA

(4404R-C004A)

DSP IC

(MN6627933)

29, 31, 35, 37

5,6,23,26 15,16,17,18

9,10,11,
12,13,14

MOTOR

DRIVE IC

(BA5810FM)

4

58, 60

7,8,20

1,2

RF IC

AN22004A

72, 73, 74,
75, 76, 81

3.3V REG
IC805

24

RESET

IC201

5V CONVERT

Q260, ZD261, D201

REG 10V

IC403

ACC DETECTOR
Q230,D231,D232

PHONE MUTE

Q280,281

PN801 #14

ACC

PN801 #5

PHONE

PN801 #11

DIMMER

7.5V REG

Q310,Q351

32

71,69,68,70

73,74,75,33,34,7

14, 19

29

15, 16, 17, 18

2

10

55

24

11

U-COM

uPD789166

41 42

3 90 5 91 4

43

56, 57

66, 67
88, 89

39

38

KEY MATRIX

RESISTOR

RADER

9.8304MHz

LCD DRIVER

LC75811W

77~80

69~72

1~50

LCD DISPLAY

32.768

❏ MAIN SCHEMATIC DIAGRAM

2-27 2-28

2-29 2-30

❏ FRONT SCHEMATIC DIAGRAM

2-31 2-32

❏ CDP SCHEMATIC DIAGRAM

2-33 2-34

❏ PRINTED CIRCUIT DIAGRAM

1. LED P.C.BOARD
(COMPONENT SIDE)

2. FRONT P.C. BOARD
(COMPONENT SIDE)

2-35 2-36

3. MAIN P.C. BOARD
(SOLDER SIDE)

2-37 2-38

4. CDP P.C. BOARD(COMPONENT SIDE)

2-39 2-40

3-1 3-2

■ EXPLODED VIEW

A40

281

452

282

452

453

450

301

A47

452

286

A26

287

452

283

284

452

A46

454

270

A45

275

277

454

273

276

278

271

272

268

330

451

267

266

A43

265

263

264

256

255

253

269

250

252

262

251

A41

257

258

259

260

261

254

CAUTION

Exposed blade will cause
severe injury

SECTION 3. CABINET MAIN CHASSIS & MECHANISM

290

3-3 3-4