LG TCH-800 Service Manual

- 1-1 -
SECTION 1. SUMMARY
• SERVICING PRECAUTIONS
..........................................................................................................
1-2
• ESD PRECAUTIONS
1-3
• SPECIFICATIONS
...........................................................................................................................
1-4
SECTION 2. ELECTRICAL
• ELECTRICAL TROUBLESHOOTING GUIDE
.................................................................................
2-1
• INTERNAL BLOCK DIAGRAM of ICs
..............................................................................................
2-7
• BLOCK DIAGRAM
.........................................................................................................................
2-23
• MAIN SCHEMATIC DIAGRAM
......................................................................................................
2-25
• CDP SCHEMATIC DIAGRAM
.......................................................................................................
2-27
• PRINTED CIRCUIT DIAGRAM
......................................................................................................
2-29
SECTION 3. CABINET MAIN CHASSIS & MECHANISM
• EXPLODED VIEW
...........................................................................................................................
3-1
SECTION 4. REPLACEMENT PARTS LIST
...................................................................
4-1
[CONTENTS]
- 1-2 -
SERVICING PRECAUTIONS
Always disconnect the power source before:
1) Removing or reinstalling any component, circuit board, module or any other instrument assembly.
2) Disconnecting or reconnecting any instrument electrical plug or other electrical connection.
3) Connecting a test substitute in parallel with an electrolytic capacitor in the instrument.
CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in
an explosion hazard.
Do not defeat any plug/socket B+ voltage interlocks with which instruments covered by this service
manual might be equipped.
Do not apply power to this instrument and or any of its electrical assemblies unless all solid-state
device heat sinks are correctly installed.
Always connect a test instrument’s ground lead to the instrument chassis ground before
connecting the test instrument positive lead. Always remove the test instrument ground lead last.
1) The service precautions are indicated or printed on the cabinet, chassis or components. When servicing, follow the printed or indicated service precautions and service materials.
2) The Components used in the unit have a specified conflammability and dielectric strength. When replacing any components, use components which have the same ratings. Components marked in the circuit diagram are important for safety or for the characteristics of the unit. Always replace with the exact components.
3) An insulation tube or tape is sometimes used and some components are raised above the printed writing board for safety. The internal wiring is sometimes clamped to prevent contact with heating components. Install them as they were.
4) After servicing always check that the removed screws, components and wiring have been installed correctly and that the portion around the service part has not been damaged. Further check the insulation between the blades of attachment plug and accessible conductive parts.
SECTION 1. SUMMARY
- 1-3 -
ESD PRECAUTIONS
[Electrostatically Sensitive Devices (ESD)]
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such omponents commonly are called Electrostatically Sensitive Devices (ESD). Examples of typical ESD devices are integrated circuits and some field-effect transistors and semiconductor chip components. The following techniques should be used to help reduce the incidence of component damage caused by static electricity.
1) Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed for potential shock reasons prior to applying power to the unit under test.
2) After removing an electrical assembly equipped with ESD devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3) Use only a grounded-tip soldering iron to solder or unsolder ESD devices.
4) Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static” can generate electrical charges sufficient to damage ESD devices.
5) Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ESD devices.
6) Do not remove a replacement ESD device from its protective package until immediately before you are ready to install it. (Most replacement ESD devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).
7) Immediately before removing the protective material from the leads of a replacement ESD device, touch the protective material to the chassis or circuit assembly into which the device will be installed.
CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8) Minimize bodily motions when handling unpackaged replacement ESD devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ESD device).
[CAUTION. GRAPHIC SYMBOLS]
THE LIGHTNING FLASH WITH APROWHEAD SYMBOL. WITHIN AN EQUILATERAL TRIANGLE, IS INTENDED TO ALERT THE SERVICE PERSONNEL TO THE PRESENCE OF UNINSULATED “DANGEROUS VOLTAGE” THAT MAY BE OF SUFFICIENT MAGNITUDE TO CONSTITUTE A RISK OF ELECTRIC SHOCK.
THE EXCLAMATION POINT WITHIN AN EQUILATERAL TRIANGLE IS INTENDED TO ALERT THE SERVICE PERSONNEL TO THE PRESENCE OF IMPORTANT SAFETY INFORMATION IN SERVICE LITERATURE.
1. GENERAL
Power requirements
.....................................................................................................................
DC12V~15V
Ground system
...................................................................................................................................
Negative
Dimensions(W x H x D)
...................................................................................................
178 x 50 x 152.5mm
Weight
..............................................................................................................................................
Net: 1.4kg
2. RADIO SECTION
FM AM(MW) LW(Optional)
Frequency range ................................. 65.0~74.0MHz(Optional), 522~1,620kHz 144~281kHz
87.5~108MHz (Optional:530~1,710kHz/ 520~1,620kHz)
Intermediate frequency ....................... 10.7MHz 450kHz 450kHz
Usable sensitivity ................................ 10dBµV 33dBµV 38dBµV
Signal to noise ratio ............................ 60dB 50dB 50dB
3. COMPACT DISC SECTION
Frequency response
.....................................................................................................................
40Hz~20kHz
Channel separation
......................................................................................................................
50dB(1kHz)
Signal to noise ratio ..................................................................................................................................
60dB
4. AUDIO SECTION
Maximum output power
50W x 4
Frequency response
............................................................................................................
40Hz to 14,000Hz
Speaker impedance
...............................................................................................................
4x 4 or 8x 4
Signal to noise ratio
.................................................................................................................................
60dB
NOTE: The design and specifications are subject to change without notice in the sourse of product
improvement.
SPECIFICATIONS
- 1-4 -
- 2-1 -
SECTION 2. ELECTRICAL
ELECTRICAL TROUBLESHOOTING GUIDE
(1) No Power
ANY KEY POWER ON
YES
YES
YES
YES
YES
YES
NO
Check power supply circuitry. Q505, Q506, IC201 Pin 39, Pin 87.
NO
Check Loading supply circuitry. Q401~ Q404, CW001 pin25, IC201 pin44.
NO
Check laser circuitry. CDP P43: TR1, IC101, IC201, IC301
Check focusing circuitry. CDP PCB: IC101, IC201, IC301.
Check DISC.
NO
Check tracking servo circuitry. CDP PCB : IC101, IC201, IC301.
NO
Check audio circuitry. IC201, IC302 CDP PCB: IC101, IC201.
Is power turned on?
DISC loading?
Does initial reading occur?
Can disc be played?
Is audio output supplied?
OK
- 2-2 -
(2) LCD light abnormal
ANY KEY POWER ON
(without DISC)
YES
NO
Check voltage in the power supply circuitry.
YES
Is u-com IC201 reset circuit normal? Pin86
4.8V
0V
NO
Power supply circuitry defective. Q501, Q502, Q506, IC201
NO
Reset circuit defective. IC201, Q505, Q506.
YES
Is u-com IC201 Xin,Xout terminal Pin 1,100 input? OSC : 4.5MHz
NO
CT201, CC201, CC202 defective.
YES
Is u-com IC201 keyin Pin7 Pin45 0volt input?
NO
CN201,front PCB pattern defective.
YES
Is u-com IC201 Pin46, 47, 48 output waveform normal?
5V
NO
IC201 pin46~48,front PCB pattern defective.
Is IC701 com1, com2, com3 output waveform normal?
Display LCD connector defective.
5V
NO
IC701 Surrounding circuit PCB pattern defective.
Do display LCD then light?
- 2-3 -
(3) Initial reading is not carried out (with disc)
DISC loading?
YES
NO
NO
NO
NO
NO
NO
NO
NO
Is IC201 pin21 input waveform normal?
IC201 pin21
open close
YES
Does laser light? CDP PCB: CON1 pin14(LD)
YES
YES
YES YES
Is signal output at tracking output IC501 Pin 53 (CDP PCB)?
Does IC201 Pin25(LKFS) GFS as figure?
Disc initial reading damaged or defective.
Disc defective.
Is rotation normal? Is there any irregularity in frequency?
YES
Is RF signal normal without dropout?
NO
Check voltage in the power supply circuitry . Q505, R506, IC201 pin39, pin87
CDP PCB: IC301.
NO
Leaf SW contact defective. Connector defective. Pattern short.
NO
(A)
(B)
Does disc motor rotate?
Is RF wave output?
RF
Is tracking servo operating? Is the lower envelope of RF waveform flat?
Is signal output at TEO?
Is signal output at IC101 Pin50 (CDP PCB)?
IC501
(CDP PCB)
defective.
Pattern defective.
Connector defective. Pick-up defective.
IC502
(CDP PCB)
defective.
NO
IC201(CDP PCB) defective.
- 2-4 -
(A) when laser does not light.
Is below signal “L” at IC101 Pin 70
(CDP PCB)
?
NO
NO
NO
NO NO
NO
NO
NO
YES
Slide motor defective. Connector defective.
YES
IC301 defective.
IC101defective.
IC101
(CDP PCB)
defective.
Surrounding circuitry defective
TR
(CDP PCB)
defective. Connector defective. Laser defective
Connector defective. Laser defective
IC101,201
(CDP PCB)
defective.
NO
NO
Reset SW defective Connector defective.
NO
IC201 defective.
Has Pick-up returned to the innermost position?
Does pick-up stop after having moved to the innermost position? IC201 Pin 25
Has laser power source returned to the TR1
(CDP PCB)
?
(TR1 collector voltage about
2.2V)
Flow laser current? Both voltage of TR1
(CDP PCB)
is about
1.0V?
NO
YES
R40
(CDP PCB)
R40
(CDP PCB)
Are data transferred from IC201 Pin 27, 28, 37?
Is below signal output at IC201 Pin 26,27
(CDP PCB)
?
Are detect output input at IC101 Pin38
(CDP PCB)
?
- 2-5 -
(B) when laser light.
Do lenses move up and down?
Insert disc and in the case of check of initial leading.
Is RF(HF) signal waveform output?
NO
NO
Is signal output at focus search terminal? IC101 Pin48
(CDP PCB)
NO
IC101
(CDP PCB)
defective.
Is signal output at IC301 Pin1, 2
(CDP PCB)
?
NO
IC301 defective.
YES
YES
YES
Actuator short. Connector short.
IC101
(CDP PCB)
defective.
Connector short.
The waveform of RF(HF) is below figure?
Amplitude
0.5~1.0v
NO
YES
IC101
(CDP PCB)
defective.
TR1, IC101
(CDP PCB)
surrounding circuitry
defective.
Is FOK signal output? RF(HF)
0.4V over OK.
FOK
NO
YES
IC101
(CDP PCB)
defective.
Is FOK signal to IC201 Pin41?
(C)
FOK
NO
YES
Pattern defective.
YES
- 2-6 -
(C)
YES
NO
IC101
(CDP PCB)
defective. Pick-up defective. Connector defective.
Is FE1 signal output ? IC501 Pin59
YES
NO
IC101
(CDP PCB)
defective.
Is FE1 signal output at IC101 (CDP PCB)
Pin31(IST
AT) ?
YES
NO
Pattern defective between IC201 Pin 72, 73, 75, 76 (CDP PCB) and IC201(Main).
Is SMON signal output by IC201 (CDP PCB)
Pin73?
Is SMPO signal output by IC201 (CDP PCB)
Pin75?
YES
NO
IC101,305
(CDP PCB)
defective.
Surrounding circuitry defective.
Has voltage at disc motor?
0v
YES
Disc motor defective. CN101(CDP PCB) connector defective.
IS TAT
FE1
- 2-7 -
INTERNAL BLOCK DIAGRAM of ICs
IC201 LC723764 (Micro-processor IC)
1) PORT ASSIGNMENT
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