This set has been aligned at the factory and normally will not require further adjustment. As a result, it is not
recommended that any attempt is made to modificate any circuit. If any parts are replaced or if anyone tampers
-
with the adjustment, realignment may be necessary.
TEST & ADJUSTMENT POINT
.
L
t ,
I
T201 O ,"
\ 0
l_
0 0
J
IC201
I
IFM]
VR201
6
El
/
-
Figure 1. Main PC. Board (Side A)
r
ORE
TP601 5
FEI FE0
00
TEI TEO
TPGM O"
0
REF
OS0
OGND
1
Figure 2. Main P.C. Board (Side B)
Page 5
TCH-300 1
TUNER ADJUSTMENT
1. FM ADJUSTMENT
-
Power Supply
- 01
STEREO SG
FM SSG
AUDIO OSC
1-n
FM Dummy ANT.
Figure 3. FM Adjustment Connection Diagram
(1) The impedance of FM antenna terminal is 7X&.
Therefore, connect coaxial cable (3C-2V etc.) between FM SG and antenna terminal when wiring.
\
Open indication OdB
type
Load or close OdB
indication type 54dB
(2) There are two kind in indication of FM SG output attenuator.
1) Attenuator with marking of 75Q open...open indication type.
2) Attenuator with marking of 75Q load or close . . . load or close indication type.
(3) FM SG output level in this FM adjustment are described as open indication type. The left table shows
relations among FM SG attenuator indication (dB), available power ratio (dBf) and antenna terminal voltage
(dB/uV) in each indication type.
2. Before adjusting, preset adjustment potentiometers VR601, VR602, VR603 and VR604 center.
3. E-F BALANCE ADJUSTMENT
(1) Connect the oscilloscope to TP602 (TEO and REF).
(2) Load test disc (YEDS-43).
(3) Adjust VR602 so that amplitude above and below the zero DC line becomes equal (amplitude A=B).
Oscilloscope
k REF
4. FOCUS
(1)
(2)
(3)
(4)
OFFSET ADJUSTMENT
Connect the jitter meter to TP601 (HF, REF), set the input selection switch of jitter meter to “1 x ” position.
Load test disc.
Put unit play mode.
Adjust VR601 so that the jitter meter reading is minimum.
Jitter Meter
NOTE: Jitter meter must have a “1 x
input selection switch.
A=B
A
OV DC Mode
B
“
-IO-
Page 8
TCH-300
5. FOCUS GAIN ADJUSTMENT
(1) Connect from gain adjustment jig to wire on the main P.C. Board pin to pin.
(2) Connect audio frequency oscillator to A.F. OSC terminal and GND on the gain adjustment jig.
-
Set the audio frequency oscillator output to 750Hz, ~VRMS.
Low Frequency Oscillator (A.F. OSC)
@@O A.F. OSC
L
GND
(3) Connect oscilloscope to CHI, CH2 and GND on the main P.C. Board. (XV mode)
-----
Oscilloscope
I-O GND
Insert test disc and put unit play mode on track.
(4)
Set switch SW1 on the gain adjustment jig to position
(5)
Adjust VR603 so that the waveform on the oscilloscope looks as shown below.
(6)
Good adjustment
(Optimum focus gain)
Bad adjustment
(Low focus gain)
“F”.
CHI : 20mV/div. AC MODE
CH2 : 2V/div. AC MODE
Bad adjustment
(High focus gain)
-ll-
Page 9
( TCH-300
6. TRACKING GAIN ADJUSTMENT
Connect from gain adjustment jig to wire on the main P.C. Board pin to pin.
(1)
Connect audio frequency oscillator to A.F. OSC terminal and GND on the gain adjustment jig.
(2)
Set the audio frequency oscillator output to 750Hz, ~VRMS.
Low Frequency Oscillator (A.F. OSC)
Connect oscil
Insert test disc and put unit into play mode on track.
(4)
Set switch SW1 on the gain adjustment jig to position
(5)
Adjust VI3604 so that the waveform on the oscilloscope looks as shown below.
(6)
I oscope to CHI, CH2 and GND on the main P.C. Board (XV mode)
CHI : 20mV/div. AC MODE
Oscilloscope
CH2 : 2V/div. AC MODE
“T”.
(Optimum tracking gain)
(Low tracking gain)
-12-
Bad adjustment
(High tracking gain)
Page 10
CD PART
c
CD Function Select
TCH-300
TROUBLESHOOTING
Is power turned ON?
I
YES
I
-
Does initial reading occur?
1
I
YES
NO
NO
m Check power supply circuitry.
.- .
w Check laser circuitry.
.
+ Check focusing circuitry.
w Check disc.
$
Can disc be played?
.
YES
NO
w Check tracking servo circuitry.
Is audio output supplied?
YES
I
OK
NO
- 27 -
Check Audio circuitry.
Page 11
TCH-300
(1) If display LCD lighting is not normal
CD Function Select
I
Do display LCD then light?
(WITHOUT DISC)
I
NO
Check voltage in the power
* supply circuitry.
I
YES
1
Is u-COM IC401 reset circuit
normal? Pin @
YES
I
Is u-COM IC401 C.L.K
terminal Pin @ (OSC)
input?
1 AVEE (R) Analog negative power supply input pin for RF part
2
3 1 CBH 1 Capacitor connection pin of defect bottom-hold
I
4 TESTD 1 Defect test pin
I
5 / TESTM / Mirror test pin
I
6 1 TEST1 / Input pin for test
I
7 PFSET
8 1 SSTOP I Check the position pin of pick-up whether inside or not.
I
9 / DIRC I Direct 1 Track Jump Control Pin
IO I AVCC (s) I Analog positive power supply input pin for SERVO part.
11 WDCH
FrSMPD 1 C
13 1 SMON 1 C
I4 I
CPH
Capacitor connection pin of mirror hold.
Peak frequency setting pin for focus, tracking compensation and fc
I I
(cut off frequency) of CLV LPF.
Auto-sequencer clock-input pin
I I
(Normal speed=88.2kHz, Double speed=1 76.4kHz)
onnection pin of DSP SMPD
onnection pin of DSP SMON, spindle servo ON at
N/C I No connection pin
Description
“H”
-18-
Page 18
ITCH-300
Pin No. 1 Svmbol 1 Description
15
16
-
17
18
TGSW
RTG
LFR Capacitor connection pin to perform rising low bandwidth of focus
FSW
.
19
20 FSCH
21 1 VREGI 1 External reaulator voltage input pin for VCO
22 1
23 I VREG I 3.5~ Reaulator output pin
24 I FVC I
25 I
26 I BPF I
27 1 MCK
28 ) MLT I
29 I MDAT 1 Data input pin from micom
30 I RESET 1 Reset input pin from micom, reset at “~11
31
32 I TRCNT I Track count output pin
33 I ISTAT I Internal status output pin
34 AVEE (S)
35
36 F8M
HFGD
ISET I Determina the peak value of focus search, track jump and SLED kick
SMEF I Providinq an external LPF time constant of CLV SERVO loop
I LOCK I Pin for operation of the sied runaway prevention function at
APDI Input pin of DSP phase comparison output (PHAS)
I I
37 1 AASC 1 Auto-Asvmmetrv control input pin
38 1 EFMO 1 EFM comoarator outout pin
39 ) SLEN 1 N
40 I SLEO
41 1 SLEI 1 Inverting input pin of SLED SERVO amplifier
42 TEST2
I I
43
44 SPDLO Spindle servo amplifier output pin
45 I FCE 1
46 I FSEO I OutDut pin of focus servo amplifer
47 TKEI Non-inverting input pin of tracking servo amplifier
48 / TKEO
SPDI Inverting input pin of spindle servo amplifier
Providing time constant to change the high frequency tracking gain
Capacitor connection pin switch the tracking gain of high frequency
servo loop
High frequency gain of focus servo loop can be changed by FS3
switch ON or OFF
Reducing high frequency gain with capacitor connected between
pin 18 and pin 19.
1 Time constant external pin to qenerate focus search waveform
Pin connected external resistor to adjust free runninq frequency of VCO
Providinq time constant for Loop filter of VCO
_
L
1 Clock input pin from micom
Latch input pin from micom
“L”
Analog negative power supply input pin for SERVO part
Output pin of analog VCO
Normal speed=8.64MHz, Double speed=1 7.28MHz
on-inverting input pin of SLED SERVO amplifier
1 Output pin of SLED SERVO amplifier
Test input pin to change speed mode
Normal speed=
lnvertinq input pin of focus servo complifier.
“H”,
Double speed=
“L”
/ Output pin of tracking servo amplifier
I
19-
Page 19
- TCH-3001
Pin No. Symbol
49
50
I
54 ( TDFCT 1 Capacitor Connection pin for Defect Compensation of tracking servo
55 DVCC(S)
56
N/C
ATS
TEI
FE2
57 FE1
FDFCT
58
59 FOK
60
61
62
63
64 DVEE (S)
65
66
67
68
69
r
r70 1 LD /
72
73
LDON
El
EO
FBIAS
RFI
RF0
RF-
RV
CV
AVCC( R)
N/C No connection
74 PD2
75
76
I
77 E
78 P/N
79
80
PDI
F Inverting input pin of FI-V AMP
DCC2
DCCI
No connection
Anti-shock input pin
Tracking Zero Crossing input pin
Tracking Error Servo input pin
Output pin of trackina Error Amolifer
Digital positive power supply input pin for servo part
Focus error servo input pin
Output pin of focus error Amplifer
Capacitor connection pin for defect compensation of focus servo
Output pin of Focus ok comparator.
Laser diode ON/OFF control pin
Feedback input pin of E I-V amplifier
Output pin of E I-V Amplifier
Bias pin of non-inverting input of focus error amplifier
Digital negative power supply input pin for servo part
Output Signal of RF summing amplifier is inputed through capacitor
Output pin of RF summing amplifier
inverting input pin of RF summing amplifier
Output pin of (AVCC+AVEE)/2 Voltage
Bias input pin of Center Voltage buffer
Output pin of APC amplifier
Input pin of APC amplifier
Analog positive power supply input pin for RF part
~~ r- 71 / PD I
Inverting input pin of RF I-V AMP2
Inverting input pin of RF I-V AMP1
Inverting input pin of E I-V AMP
Selecting P-sub/N-sub of Laser diode
Defect bottom-hold output is inputed through capacitor
1 AVDDI Analog Vcc 1
2
3 DPFIN
4
5 CNTVOL I VCO Control Voltage for master PLL
6 AVSSI
7
I
8
9 XOUT
10 ) WDCHI ( 0 ( Word clock of 48 bit/SLOT
I/O Description
DPDO 1 0 (
I
Charge pump output for master PLL
Filter input for master PLL
’
I
DPFOUT 0 Filter output for master PLL
Analog Ground 1
X-tal oscillator input
DATX
XIN
I I
1 0 1 Digital audio output
X-tal oscillator output
(Normal speed=88.2kHz, Double speed=1 76.4kHz)
- 22 -
-
’
Page 22
9
1 Pin No. 1 Symbol 1 I/O 1 Description
/ 11 1 LRCH 1 0 ( Channelclock of 48 bit/SLOT
(Normal speed=44.1 kHz, Double speed=88.2kHz)
12 1 ADATA 1 0 1 S erial
I
13 DVSSI
I
I I
I I4 I BCK
15 C2PO 1 0 ) ~~ C2 pointer for output audio data
I
16
I
I
I
I
I
I
I
I
I
I VREFL2 I I
17 1 VREFLI ) I ( Input terminal 1 of reference voltage
1 AVDD2 ) 1 Analog VCC2
18
19 I RCHOUT I 0 I Right-channel audio output through D/A convertes
20 LCHOUT
21 AVSS2 I Analog ground 2
22 ) VREFHI I I I Input terminal 1 of reference voltage
23 I VREFH2 ( I
24 EMPH 1 0 1 Emphasis/Non-Emphasis output (
System reset at
SQCK I/O Control (
Clock for output subcode-Q data
Serial output of subcode-Q data
The CRC Check result signal output of subcode-Q
Clock for output subcode- data
Subcode Serial data output
Digital Vcc 1
Mute control Input (
Latch signal input from Micom
Serial data input from Micom
Serial clock input from Micom
SRAM data I/O Port 8 (MSB)
SRAM data I/O Port 7
SRAM data I/O Port 6
SRAM data I/O Port 5
SRAM data I/O Port 4
SRAM data I/O Port 3
SRAM data I/O Port 2
SRAM data I/O Port 1 (LSB)
124405S-I001AMECHANISM ASSEMBLY, CAR CDM-C11001
131MRC0302018 SCREW, 3x124
Page 25
4
SERVICING PRECAUTIONS
NOTES REGARDING HANDLING OF THE PICK-UP
1. Notes for transport and storage
1) The pick-up should always be left in its conductive bag until immediately prior to use.
2) The pick-up should never be subjected to external pressure or impact.
2. Repair notes
1) The pick-up incorporates a strong magnet, and so should never be brought close to magnetic materials.
2) The pick-up should always be handled correctly and carefully, taking care to avoid external pressure and
impact. If it is subjected to strong pressure or impact, the result may be an operational malfunction and/or
damage to the printed-circuit board.
3) Each and every pick-up is already individually adjusted to a high degree of precision, and for that reason
the adjustment point and installation screws should absolutely never be touched.
4) Laser beams may damage the eyes!
Absolutely never permit laser beams to enter the eyes!
Also NEVER switch ON the power to the laser output part (lens, etc.) of the pick-up if it is damaged.
5) Cleaning the lens surface
If there is dust on the lens surface, the dust should be cleaned away by using an air bush (such as used
for camera lens). The lens is held by a delicate spring. When cleaning the lens surface, therefore, a
cotton swab should be used, taking care not to distort this.
6) Never attempt to disassemble the pick-up.
Spring by excess pressure. If the lens is extremely dirty, apply isopropyl alcohol to the cotton swab. (Do
not use any other liquid cleaners, because they will damage the lens.) Take care not to use too much of
this alcohol on the swab, and do not allow the alcohol to get inside the pick-up.
Storage in conductive bag
Drop impact
NEVER look directly at the laser beam, and don
¡˙t let
contact fingers or other exposed skin.
Magnet
How to hold the pick-up
Pressure
Pressure
Cotton swab
Conductive Sheet
Page 26
5
NOTES REGARDING COMPACT DISC PLAYER REPAIRS
1. Preparations
1) Compact disc players incorporate a great many ICs as well as the pick-up (laser diode). These
components are sensitive to, and easily affected by, static electricity. If such static electricity is high
voltage, components can be damaged, and for that reason components should be handled with care.
2) The pick-up is composed of many optical components and other high-precision components. Care must
be taken, therefore, to avoid repair or storage where the temperature of humidity is high, where strong
magnetism is present, or where there is excessive dust.
2. Notes for repair
1) Before replacing a component part, first disconnect the power supply lead wire from the unit
2) All equipment, measuring instruments and tools must be grounded.
3) The workbench should be covered with a conductive sheet and grounded.
When removing the laser pick-up from its conductive bag, do not place the pick-up on the bag. (This is
because there is the possibility of damage by static electricity.)
4) To prevent AC leakage, the metal part of the soldering iron should be grounded.
5) Workers should be grounded by an armband (1MΩ)
6) Care should be taken not to permit the laser pick-up to come in contact with clothing, in order to prevent
static electricity changes in the clothing to escape from the armband.
7) The laser beam from the pick-up should NEVER be directly facing the eyes or bare skin.
Armband
Conductive
Sheet
Resistor
(1 Mohm)
Resistor
(1 Mohm)
Page 27
6
ESD PRECAUTIONS
Electrostatically Sensitive Devices (ESD)
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive Devices (ESD). Examples of typical ESD devices are integrated
circuits and some field-effect transistors and semiconductor chip components. The following techniques should
be used to help reduce the incidence of component damage caused by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off
any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a
commercially available discharging wrist strap device, which should be removed for potential shock reasons
prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ESD devices, place the assembly on a conductive
surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ESD devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static" can
generate electrical charges sufficient to damage ESD devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ESD
devices.
6. Do not remove a replacement ESD device from its protective package until immediately before you are
ready to install it. (Most replacement ESD devices are packaged with leads electrically shorted together by
conductive foam, aluminum foil or comparable conductive materials).
7. Immediately before removing the protective material from the leads of a replacement ESD device, touch the
protective material to the chassis or circuit assembly into which the device will by installed.
CAUTION : BE SURE NO POWER IS APPLIED TO THE CHASSIS OR CIRCUIT, AND OBSERVE ALL OTHER
such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can
generate static electricity sufficient to damage an ESD device).
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