LG ML-042A, 15LW1R Service Manual

LCD TV

SERVICE MANUAL

CAUTION

BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CHASSIS : ML-042A

MODEL: 15LW1R (15LW1R-MD)

website:http://biz.LGservice.com

e-mail:http://www.LGEservice.com/techsup.html

- 2 -

CONTENTS

CONTENTS .............................................................................................. 2

PRODUCT SAFETY ..................................................................................3

SPECIFICATION........................................................................................6

DISASSEMBLY..........................................................................................9

SERVICE TEST PROGRAM....................................................................11

TROUBLE SHOOTING............................................................................16

BLOCK DIAGRAM...................................................................................25

WIRING DIAGRAM..................................................................................30

EXPLODED VIEW .................................................................................. 31

REPLACEMENT PARTS LIST ............................................................... 35

SVC. SHEET ...............................................................................................

- 3 -

SAFETY PRECAUTIONS

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Replacement Parts List.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.

It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.

Keep wires away from high voltage or high temperature parts.

X-RAY Radiation

Warning:

To determine the presence of high voltage, use an accurate high
impedance HV meter.

Adjust brightness, color, contrast controls to minimum.
Measure the high voltage.
The meter reading should indicate

23.5 ¡ 1.5KV: 14-19 inch, 26 ¡ 1.5KV: 19-21 inch,

29.0 ¡ 1.5KV: 25-29 inch, 30.0 ¡ 1.5KV: 32 inch
If the meter indication is out of tolerance, immediate service and
correction is required to prevent the possibility of premature
component failure.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check.

Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to

0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.

Leakage Current Hot Check circuit

The source of X-RAY RADIATION in this TV receiver is the High
Voltage Section and the LCD PANEL.
For continued X-RAY RADIATION protection, the replacement
panel must be the same type panel as specified in the
Replacement Parts List.

IMPORTANT SAFETY NOTICE

0.15uF

To Instrument's
exposed
METALLIC PARTS

AC Volt-meter

1.5 Kohm/10W

Good Earth Ground
such as WATER PIPE,
CONDUIT etc.

- 4 -

CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the

following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.

2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its
assemblies.

4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.

7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.

8. Use with this receiver only the test fixtures specified in this

service manual.

CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the

unit under test.

2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.

4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).

7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500

O

F to 600OF.

2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wire­bristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.

(500

O

F to 600OF)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the
circuitboard printed foil.

6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature

(500

O

F to 600OF)

b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

SERVICING PRECAUTIONS

- 5 -

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.

2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and
solder it.

3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor
Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as
possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.

Power Output, Transistor Device
Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit
board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as
possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit
board.

3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.

Fuse and Conventional Resistor
Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.

2. Securely crimp the leads of replacement component around
notch at stake top.

3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).

1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.

1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

- 6 -

1. Application range

This specification is applied to ML-042A chassis.

2. Requirement for Test

Testing for standard of each part must be followed in below
condition.

(1) Temperature: 25°C ± 2°C
(2) Humidity: 65% ± 10%
(3) Power: Standard input voltage (AC 100-240V, 50/60Hz)
(4) Measurement must be performed after heat-run more than

30min.

(5) Adjusting standard for this chassis is followed a special

standard.

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

.

3.General Specification

4. Mechanical Specification

1

Maker
Type
ActiveDisplay Area
Pixel Pitch [mm]
Electrical Interface
Color Depth
Size [mm]
Surface Treatment
Back light Unit

LPL
TFT Color LCD Module

15.0 inches(380.16mm) diagonal(Aspect 4:3)

0.297mm(H)x0.297mm(V)xRGB
LVDS
6BIT WITH FRC, 16,777,216 colors

304.128(H)x228.096V)
Anti Glare(3H)
4 CCFL

Item Specification Remark

No.

LPL

No Item Content Remark

1 Product Width (W) Length (D) Height (H)

Dimension Before Packing(RX) 454 mm 201 mm 340 mm

With Stand

Before Packing(TX) 110 mm 245 mm 243 mm

2 Product

Before Packing(SET.RX/TX)

5.4kg/1.6kg With battery

Weight

Before Packing(BOX)

10.0kg

- 7 -

5. Engineering Specification

No Item Content Remark

1 Response Time Rise Time (typ) : 5ms
2 TX LED Power LED Blue LED

POWER off mode

Off Off

(No adapter)
POWER off mode

Amber Off

(adapter)
POWER on mode

Green Off

(network disconnected)
POWER on mode

Green Blue

(network connected)

3 RX battery LED Battery

No adapter

Power on 30~100% Green

10~30% Yellow

10% under

Blink Yellow

Power off/idle

XOff

adapter Power

0~97% 0~97%

(charging) On/off

adapter

Power

(charging

On/off

98% over Green

complete)

No battery

-- - Off

4 Rx Wireless Lan Network connectingGreen

LED Network disconnecting off

5 RX Power LED Power on Blue

Dark After 5s

Power off off

6 Operating 1) Temp : 5~35 Deg

Environment 2) Humidity : 85%

7 Storage 1) Temp : -20 ~ 60 deg

Environment 2) Humidity : 85 %

8 MTBF 50,000 Hrs With 90% Confidence Level Lame Life:

40,000 Hr(Min)

9 Rx Specification remark

Normal(Power S/W On)

- Blue ¡´72W Blue

Power Switch Off - OFF ¡´1W OFF

- 8 -

6. Optical Character

No Item Criteria Remark
1 Viewing Angle

Horizontal(R/L) : 65¡£/65¡£(Typ.)

(R¡ˆ10)

Vertical(Top/Bottom) : 45¡£/55¡£(Typ.)

2` Luminance Average Luminance (cd/m2) 450(typ)

Luminance Uniformity(%)

3 Contrast Ratio 400(normal)

5 Grey Level

n Gs (S)

Relative Luminance (%)

Notes

Relative Brightness Typ.

1 L0 0.22
2 L15 0.34
3 L31 0.81
4 L47 2.10
5 L63 4.29
6 L79 7.46
7 L95 11.4
8 L111 16.4

9 L127 22.1
10 L143 28.7
11 L159 36.4
12 L175 45.1
13 L191 55.4
14 L207 66.2
15 L223 78.0
16 L239 90.4
17 L255 100

4 CIE Color Coordinates Min. Normal Max.

White W

X 0.286 0.289 0.292

W

Y

0.301 0.304 0.307

Red R

x 0.616 0.619 0.622

R

Y 0.340 0.343 0.346

Green G

x 0.295 0.298 0.301

R

Y 0.575 0.578 0.581

Blue B

x 0.146 0.149 0.153

B

Y 0.079 0.082 0.085

DISASSEMBLY

- 9 -

1 2

3 4

5 6

- Remove screws attached to stand by coin or (-) driver.

- Disassembly Stand from Set.

- Remove the battery.

- Disassembly Back cover after press the battery as pull the
edge of Back cover by hand as the picture.

- Remove Speaker's screws of both sides.

- Divide all AL TAPES and connectors from Metal Frame.

- Remove the POWER PCB screw.

7 8

-Remove the serews between metal frame and cabinet.

- Press latches on top-center and both side of cabinet and
then disassembly metal frame from the cabinet.

- Remove the screws on both side of metal frame,
disassembly metal frame and module.

AL Tape

AL Tape

- 10 -

DISASSEMBLY

1 2

3 4

5 6

- Remove screws in stand.

- Push the cover to arrow direction.

- Lift cover. - Remove screws.

- Remove antenna and AL Tape as the picture. - Remove screws of Rear shield.

Al tape

7

- Lift Rear shield as the picture.

- 11 -

SERVICE TEST PROGRAM

1. Test Items

(MICOM : 1.3.0, ROMFS : 1.2 12/21 ENG), TX SSID : 80035E

(Rx Micom/Rx Flash/ Version Display), TX SSID display

- LED : Rx LED Operation Test

- Volume : Speaker Operation Test/Headphone Operation

Test(for headphone connection)

-

Brightness/Contrast : Rx SVC Mode Brightness/Contrast control

- Button : Rx Key Control Operation Test

- Remocon : Remocon Operation Test

- Battery : Battery information display

-

RX Longrun : Audio(Continuous Tone)/ Video(straight Color Bar)

- RX Factory Default : RX Flash Data Initialization: Volume,

Brightness

- Initialize SSID : Initialization of TX SSID connected with RX

- TX : Tx SSID Display/VCTI,Tx Flash Version Display Long

Run/Tx VCTI Data Initialization

- S/W Upgrade : Execute Rx Flash Update through AP(Access
Point)

- Canadian VCHIP : Default(No)

- Dot Defect : Full Black/White Pattern to check Dot Defect of the

LCD module

2. SSID input screen

* Screen appearing where SSID is not saved

(1) Test initial screen

- Method to enter into the test screen

: Click the IN-START button of the Adjust Remocon (P/N:105-

201M) in the RX Power ON status(operable 10 seconds after On).

=> Click the Enter button of the REMOCON in order to select

detailed menu

(2) LED Test

- LED Operation Test of Rx

=> Click the Exit button of the REMOCON to return to the

previous initialization menu

(3) VOLUME Test

- Speaker Operation Test

=> Click the Exit button of the REMOCON to return to the

previous initialization menu

Press 'Select' to confirm, 'Exit' to retry

LWTV_8002FE
LWTV_8002EA

Test Items

(MICOM : 1.3.0, ROMFS :

1.2 12/21 ENG), TX SSID :
80035E

* LED
* Volume
* Brightness/Contrast
* Button
* Remocon
* Battery
* RX Longrun
* RX Factory Default
* Initialize SSID
* TX
* S/W Upgrade
* Canadian VCHIP :
* Dot Defect

Version

(Micom/CPU)

Test Items

(MICOM : 1.3.0, ROMFS :

1.2 12/21 ENG), TX SSID :
80035E

* LED
* Volume
* Brightness/Contrast
* Button
* Remocon
* Battery
* RX Longrun
* RX Factory Default
* Initialize SSID
* TX
* S/W Upgrade
* Canadian VCHIP :
* Dot Defect

Version

(Micom/CPU)

Blinking in blue color

Blinking in
Green color

Blinking in Yellow/Green color

Check LEDs are blinking

- Power LED (Blue)

- W-LAN LED (Green)

- Battery LED (Yellow/Green)

Volume is played in the level of 80 values.

Volume Testing..
Current Vol : 80

Test Items

(MICOM : 1.3.0, ROMFS :

1.2 12/21 ENG), TX SSID :
80035E

* LED
* Volume
* Brightness/Contrast
* Button
* Remocon
* Battery
* RX Longrun
* RX Factory Default
* Initialize SSID
* TX
* S/W Upgrade
* Canadian VCHIP :
* Dot Defect

(4) Brightens/Contrast Adjust -1

- Adjust brightness value of the RX terminal

- Contrast has default of "138", not changed.(Number check
requied)

- Brightness Spec : 0.60~0.75 cd/m2

0.65 cd/m2 (Typ)

<-- Measuring value must be near 0.65 cd/m2 (Typ)

- Input signal : None

- Equipment required: Brightness meter (CA-110/210),

- Test conditions: Manufacturing A Line brightness measuring
location (darkroom)

- These data are not reset for the SSID,

- RX Factory Default Initialization.

=> Click the Exit button of the REMOCON to return to the

previous initialization menu

(5) Brightens/Contrast Adjust -2

- Adjust brightness value of the RX terminal when value less than
"-11" is required

- Input signal: None

- Equipment required: Brightness meter (CA-110/210)

- Test conditions: Manufacturing A Line

- Brightness measuring location (darkroom)

<Volume>

<Dot Defect>

- 12 -

1. Measure brightness in the Brightness/Contrast Mode after
aging. If brightness is insufficient, adjust it in following
method:

2. Adjustment method

- Move the cursor to Brightness by pressing arrow key(¡Ł/¡Ø)

- Change and adjust numbers by pressing the arrow key
( / ) so that brightness falls within Spec.
<-- Adjust measuring value near 0.65 cd/m2 (Typ).

- Save the Exit key for escape.

3. Brightness value must be " -10" or more.
(See following chapter for less than "-11")

1. After returning to the SVC mode by pressing the Exit Key
and selecting the DOT Defect Mode, measure brightness
value of the center part in the black screen by pressing the
numeric key "2".

2. Return the Brightness Adjustment Mode again, setup Spec
as below:

Brightness adjusting value +< 0.1~0.15> cd/m2 = Center
value in Dot Defect

Test Items

(MICOM : 1.3.0, ROMFS :

1.2 12/21 ENG), TX SSID :
80035E

* LED
* Volume
* Brightness/Contrast
* Button
* Remocon
* Battery
* RX Longrun
* RX Factory Default
* Initialize SSID
* TX
* S/W Upgrade
* Canadian VCHIP :
* Dot Defect

Contrast 138
Brightness 0

Contrast 138
Brightness 0

Initial Data

Select menu with the Up/Down button.
Change values with the Left/Right button.

Initial Data

Select menu with the Up/Down button
Change value with the Left/Right button

> Check Dot Defect

Press 1 for white, 2 for Black

Test Items

(MICOM : 1.3.0, ROMFS :

1.2 12/21 ENG), TX SSID :
80035E

* LED
* Volume
* Brightness/Contrast
* Button
* Remocon
* Battery
* RX Longrun
* RX Factory Default
* Initialize SSID
* TX
* S/W Upgrade
* Canadian VCHIP :
* Dot Defect

(6) Button Test

- Test whether there is key control operation of the RX

=> Click the Exit button of the REMOCON to return to the

previous initialization menu

(7) REMOCON Test

- Test whether there is key control operation of various keys

=> Click the Exit button of the REMOCON to return to the

previous initialization menu

(7) Battery Test

- Battery information display

=> Click the Exit button of the REMOCON to return to the

previous initialization menu

(8) RX Longrun

- Rx Long Run Mode

<Straight Color Bar Display on the whole of screen>

=> Click the Exit button of the REMOCON to return to the

previous initialization menu

- 13 -

Button name is displayed
whenever pressing the button.
(CH+, CH-, VOL+, VOL-,
MENU, SET, TV/AV)

> Press Button

CH +

Test Items

(MICOM : 1.3.0, ROMFS :

1.2 12/21 ENG), TX SSID :
80035E

* LED
* Volume
* Brightness/Contrast
* Button
* Remocon
* Battery
* RX Longrun
* RX Factory Default
* Initialize SSID
* TX
* S/W Upgrade
* Canadian VCHIP :
* Dot Defect

Remained battery capacity display (%)
Non-mounting of battery: N/A
Battery Error : ERROR

Battery temperature display

Continuous

Tone Play

Display whether there is connection f the adapter
Remained battery capacity display

Remained battery capacity and
voltage display
(Data may be different depending on
operation of the adapter.)

Test whether
there is operation
of the adapter.

> BATTERY Status

LIFE % : 50

AC : ON
TEMP : 20
VOLT : 12657mV

Test Items

(MICOM : 1.3.0, ROMFS :

1.2 12/21 ENG), TX SSID :
80035E

* LED
* Volume
* Brightness/Contrast
* Button
* Remocon
* Battery
* RX Longrun
* RX Factory Default
* Initialize SSID
* TX
* S/W Upgrade
* Canadian VCHIP :
* Dot Defect

Button name is displayed whenever
pressing the REMOCON Button.

(CH+, CH-, VOL+, VOL-, MENU, SET,

TV/AV, ...¶)

> Press Remocon Button

CH +

Test Items

(MICOM : 1.3.0, ROMFS :

1.2 12/21 ENG), TX SSID :
80035E

* LED
* Volume
* Brightness/Contrast
* Button
* Remocon
* Battery
* RX Longrun
* RX Factory Default
* Initialize SSID
* TX
* S/W Upgrade
* Canadian VCHIP :
* Dot Defect

Test Items

(MICOM : 1.3.0, ROMFS :

1.2 12/21 ENG), TX SSID :
80035E

* LED
* Volume
* Brightness/Contrast
* Button
* Remocon
* Battery
* RX Longrun
* RX Factory Default
* Initialize SSID
* TX
* S/W Upgrade
* Canadian VCHIP :
* Dot Defect

AC :CON.
Life % : 100

(9) RX Factory Default

- Rx Factory Mode (Initialization Mode)

=> Click the Exit button of the REMOCON to return to the

previous initialization menu

(10) Initialize SSID

- Delete the Tx SSID registered in the Rx.

=> Click the Exit button of the REMOCON to return to the

previous initialization menu

(11) TX

- TX Version display/Long Run Mode/TX Factory Default
(Initialization Mode)

=> Click the Exit button of the REMOCON to return to the

previous initialization menu

(12) S/W Upgrade

- Execute Rx Flash S/W Update

=> Click the Exit button of the REMOCON to return to the

previous initialization menu

- 14 -

Move the previous menu

Selected only when pressing the ENTER
button.
Move to previous mode after modification
of initialization

>FACTORY Default ?

YES

NO

Test Items

(MICOM : 1.3.0, ROMFS :

1.2 12/21 ENG), TX SSID :
80035E

* LED
* Volume
* Brightness/Contrast
* Button
* Remocon
* Battery
* RX Longrun
* RX Factory Default
* Initialize SSID
* TX
* S/W Upgrade
* Canadian VCHIP :
* Dot Defect

Selected only when pressing
the ENTER button.
Move to the previous mode
after TX Command Sending

Selected only when pressing
the ENTER button.
Move to previous mode after
modification of initialization

TX SSID / TX Version

> TX Testing
(LWTV_800XXX, K 1.8,RAMDISK :1.2)

-> TX Long Run
TX Factory Default

Test Items

(MICOM : 1.3.0, ROMFS :

1.2 12/21 ENG), TX SSID :
80035E

* LED
* Volume
* Brightness/Contrast
* Button
* Remocon
* Battery
* RX Longrun
* RX Factory Default
* Initialize SSID
* TX
* S/W Upgrade
* Canadian VCHIP :
* Dot Defect

Move the previous menu

Selected only when pressing the ENTER
button.
Move to previous mode after modification
of initialization

> SSID Initialize ?

YES

NO

Test Items

(MICOM : 1.3.0, ROMFS :

1.2 12/21 ENG), TX SSID :
80035E

* LED
* Volume
* Brightness/Contrast
* Button
* Remocon
* Battery
* RX Longrun
* RX Factory Default
* Initialize SSID
* TX
* S/W Upgrade
* Canadian VCHIP :
* Dot Defect

Move the previous menu

Selected only when pressing the ENTER
button.
Move to previous mode after modification
of initialization

> S/W Upgrade ?

YES

NO

Test Items

(MICOM : 1.3.0, ROMFS :

1.2 12/21 ENG), TX SSID :
80035E

* LED
* Volume
* Brightness/Contrast
* Button
* Remocon
* Battery
* RX Longrun
* RX Factory Default
* Initialize SSID
* TX
* S/W Upgrade
* Canadian VCHIP :
* Dot Defect

(13) Canadian VCHIP

- Canadian VCHIP Yes/No

=> Click the Exit button of the REMOCON to return to the

previous initialization menu

(14) Dot Defect

- Inspect Dot Defect of LCD Module

=> Click the Exit button of the REMOCON to return to the

previous initialization menu

3. RX/TX Release Mode Initialization

- Release mode initialization

: TX terminal: VCTI EEPROM initialization
:

RX terminal : Initialization of User Flash Data (Volume/Brightness)
except for SSID

- Initialization method

: In use of Test Program

- Select "RX Factory Default" and "TX Factory Default" menu of
the Test Item menu.

4. Complete charging/discharging of
battery and Aging Test

- Battery shipment mode

: Release mode remained: 30% or more
:

Application method

- 100% charging in aging test

- Aging Test time

:

Battery 50% charging time: 2hours

- 15 -

Default : No

Select "Yes" when completing solution of
patent issued in relation with VCHIP
: To be published afterwards

> Enable Canadian VCHIP ?

YES

NO

Test Items

(MICOM : 1.3.0, ROMFS :

1.2 12/21 ENG), TX SSID :
80035E

* LED
* Volume
* Brightness/Contrast
* Button
* Remocon
* Battery
* RX Longrun
* RX Factory Default
* Initialize SSID
* TX
* S/W Upgrade
* Canadian VCHIP :
* Dot Defect

Remocon Button '1' : Full White Mode
Remocon Button '2' : Full Black Mode

> Check Dot Defect

Press 1 for White,2 for black

Test Items

(MICOM : 1.3.0, ROMFS :

1.2 12/21 ENG), TX SSID :
80035E

* LED
* Volume
* Brightness/Contrast
* Button
* Remocon
* Battery
* RX Longrun
* RX Factory Default
* Initialize SSID
* TX
* S/W Upgrade
* Canadian VCHIP :
* Dot Defect

- 16 -

TROUBLESHOOTING

NO POWER
(POWER INDICATOR OFF)

Replace Power Adapter

Fail

1. OUT OF ORDER ON POWER (TX)

Fail

Replace or check soldering
of LCT1628 (U1006)

Fail Fail

Pass

Reprogram or Replace
VCT4973 (U603)

Fail Fail

Pass

Check PWRIN signal

on Main Board

Check 5V signal

VCC5.0V_VCT on Main

Board

Check

PWR_ON signal on

Main Board

Check

VCT4973(U603) on

Main Board

Check

LTC1628(U1006) on

Main Board

Check

16V or Connector(J1007)

on Power Adapter

- 17 -

No Booting

Replace or check soldering
of LCT1628

Fail

2. OUT OF ORDER ON BOOTING (TX)

Fail

Replace or check soldering
of FAN1117(U1001)

Fail

Check Crystal circuit

Fail

Check bonding or part
around signal nSDCS0

Fail

Replace or reprogram of
Flash(U301)

Check Bonding of CPU
(U101)or CPU itself

Fail

Fail

Pass

Check

VCC3.3V signal on Main

Board

Check

6MHz Crystal (X1402)

Line signal on Main

Board

Check

nSDCS0 & SDCLK signal

on Main Board

Check Flash (U301)

If there is no signal on

nSDCS0 or SDCLK signal on Main Board

Check

LTC1628 (U1006) on

Main Board

Check VCC1.8V signal

- 18 -

No MPEG Encoding or
Encoding Error

Replace or check soldering
of FAN1117(U1001)

Fail

3. OUT OF ORDER ON MPEG (TX)

Check 27MHz OSC Block

Fail

Pass

Check bonding of
CX23416 (U502) or
MPEG SDRAM (U501)

Fail

Pass

Check bonding of
MAIN_SCL_1 or
MAIN_SDA_1 circuit

Fail

Pass

Check

VCC1.25V signal on

Main Board

Check

MPEG_27M signal on

Main Board

Check

clock signal (135MHz) of

R509 side on

Main Board

Check

MAIN_SCL_1 or

MAIN_SDA_1 signal on

Main Board