LG ML041D Service Manual
LCD TV
SERVICE MANUAL
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS : ML-041D
MODEL : 27LZ5RV-ZC
website:http://biz.LGservice.com
e-mail:http://www.LGEservice.com/techsup.html
DVD / CD PLAYER
SKIP/
SKIP/
OPEN/
SCAN
SCAN
PLAY
CLOSE
STOP
- 2 -
CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ..................................................................................3
SERVICING PRECAUTIONS.....................................................................4
SPECIFICATION........................................................................................6
ADJUSTMENT INSTRUCTION................................................................11
TROUBLE SHOOTING............................................................................15
BLOCK DIAGRAM...................................................................................21
WIRING DIAGRAM..................................................................................24
EXPLODED VIEW .................................................................................. 25
EXPLODED VIEW PARTS LIST..............................................................26
REPLACEMENT PARTS LIST ............................................................... 27
SVC. SHEET ...............................................................................................
- 3 -
SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Replacement Parts List.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
IMPORTANT SAFETY NOTICE
0.15uF
To Instrument's
exposed
METALLIC PARTS
AC Volt-meter
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
1.5 Kohm/10W
- 4 -
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500
F to 600 F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500
F to 600 F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the
circuitboard printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500
F to 600 F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS
- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
- 6 -
1. Application range
This specification is applied to ML-041D chassis.
2. Requirement for Test
Testing for standard of each part must be followed in below
condition.
(1) Temperature: 25°C ± 5°C
(2) Humidity: 65% ± 10%
(3) Power: Standard input voltage (AC 100-240V, 50/60Hz)
(4) Measurement must be performed after heat-run more than
30min.
(5) Adjusting standard for this chassis is followed a special
standard.
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement
.
3.General Specification(TV)
No Item Specification Remark
1. Video input applicable system PAL-D/K, B/G, I, NTSC-M, SECAM
NTSC 4.43
2. Receivable Broadcasting System 1) PAL/SECAM BG (ZE/TE)
2) PAL/SECAM DK EU/Non-EU
3) PAL I/I (PAL Market)
4) SECAM L/L'
5) NTSC M
6) PAL-N/M 6),7) South America Market
7) NTSC M
7) Except South America NTSC Market (RM)
3. RF Input Channel VHF : E2 ~ E12 PAL
UHF : E21 ~ E69
CATV : S1 ~ S20
HYPER : S21~ S41
L/L' : B, C, D FRANCE
VHF : 2~13 NTSC
UHF : 14~69
CATV : 1~125
VHF Low : 1 ~ M10 JAPAN
VHF High : 4~S22
UHF : S23~62
4. Input Voltage AC 100 ~ 240 V/50Hz, 60Hz
5. Market Worldwide
6. Picture Size 603.22 mm 27 inch
7. Tuning System FVS 100 program PAL, 200 PR.(Option)
FS NTSC
8. Operating Environment 1) Temp : 0 ~ 40 deg
2) Humidity : 85 %
9. Storage Environment 3) Temp : -20 ~ 60 deg
4) Humidity : 85 %
10. Display LCD Module CMO
- 7 -
4.General Specification
NO Item Specification Unit Remark
1 Panel 27" TFT WXGA LCD
2 Frequency range H : 31 ~ 61Khz DVI-I input
V : 56 ~ 75Hz
3 Control Function 1) Contrast/Brightness
2) H-Position / V-Position
3) Tracking : Clock / Phase
4) Auto Configure
5) Reset
4 Comoponent Jack 1 : Y Middle east
3 : Pb / NTSC Area
5 : Pr
7 : Line1 Ready
9 : LINE2
11: LINE3
13: Line3 Ready
D4 Jack 2 : Y GND JAPAN Only
(525i,525p,750p,1125i) 4 : Pb GND
6 : Pr GND
8 : LINE1
10:Line2 Ready
12:SWITCH GND
14: SWITCH
5 H/V-Sync Video Power consumption LED
Power ON ON/ON Active ≤ max 170W W Green
Stand by OFF/ON OFF ≤ 3.0W W Red
DPMS Mode ON/OFF OFF ≤ typ. 35W W Green
Power off - - - W *.
6 LCD Module Type CMO 637.55 x 379.8 x 40.7 mm (H) x (V) x (D)
Size
Pixel Pitch CMO 0.1455 x 0.4365 x RGB mm
Pixel Format 1366 horiz. By 768 vert. Pixels
RGB strip arrangement
Coating Hard coating(3H), Anti-glare
treatment of the front polarizer,
Back Light CMO CCFL
- 8 -
5.Optical Feature(LCD Module)
No Item Specification Remark
CMO
1 Viewing Angle R/L, U/D 176,176
<CR
10>
2 Luminance Luminance (cd/m2) 550 Typical
Variation 1.3 MAX / MIN
3 Contrast Ratio 1000 All white / All black
4 CIE Color Coordinates White WX Typ. 0.284 CMO
WY Typ. 0.295
RED Xr Typ. TBD
Yr Typ. TBD
Green Xg Typ. TBD
Yg Typ. TBD
Blue Xb Typ. TBD
Yb Typ. TBD
6.Feature and Function
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
Teletext
REMOCON
AV input
S-AV input
Component input
PERI TV connector
PERI TV connector
RGB input
RS-232
Discrete IR
D-sub audio input
2 Carrier stereo
NICAM stereo
2 Carrier dual
NICAM dual
DW(Double Window) mode
MW(Multi Window) mode
Film mode
Noise reduction
Progressive scan
Motion detection
SRS WOW
Swivel Speaker
EZ-pip
Local Key
Local key(DVD)
TOP, FLOF
NEC code
1
1
2
Half SCART: 1
Full SCART: 1
1
1
1
1
BG,DK
BG,I,LL’
BG,DK
BG,I,LL’
X
X
O
X
O
O
X
X
X
Pr+/-, vol+/-, ok, menu, tv/av, power
OPEN/CLOSE, PALY, STOP, SKIP/SCEN
Item Specification Remark
No.
Top(option)
PAL/NTSC
Rear(TC/MC)
Side
Side, Rear(TC/MC)
Rear(ZC)
Rear(ZC)
DVI
D-Sub 9 pin(MC)
(MC)
Stereo
- 9 -
7. Component Video Input (Y, PB, PR)
8. PC INPUT Mode table
[Timming chart of Receivable Mode]
No Specification Proposed
Resolution H-freq(kHz) V-freq(Hz)
1. 640x480 15.73 60 SDTV, DVD 480i
2. 640x480 15.63 59.94 SDTV, DVD 480i
3. 720x576 15.625 50.00 SDTV, DVD 625 Line
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed
DVI-PC, Analog RGB, Digital RGB
1 640x480 31.469 59.94 25.17 VESA(VGA)
2 800x600 37.879 60.31 40.00 VESA(SVGA)
3 1024x768 48.363 60.00 65.00 VESA(XGA)
4 1280x768 47.693 60.00 80.125 VESA(WXGA)
5 1360x768 47.649 59.936 84.625 VESA(WXGA)
6 1920x1080 33.75 60.00 86.375 HDCP DVI Digital 1080i(MC only)
7 1280x720 45.00 60.00 74.375 HDCP DVI Digital 720p (MC only)
- 10 -
9. Customer Menu Setup
[shipped condition: PAL]
No Item Condition Remark
1 Power Off
2 Volume Level 30
3 Main Picture Input TV
4 Main Last Channel Pr 01
5 Mute Off
6 ARC 16 : 9
7 Station Auto Program
Manual Program
Program Edit
Favorite Program None
8 Picture PSM Dynamic
Dynamic Contrast 80
Brightness 40
Colour 70
Sharpness 70
Tint 0
NTSC OPTION
9 Sound SSM Flat
AVL Off
Balance 0
10 Special Input TV
Child Lock Off
Auto sleep Off
Language English(Area Management)
11 PC H-Position
V-Position
Variable by each mode
Clock
Phase
Auto Configue
- 11 -
ADJUSTMENT INSTRUCTION
1. Application Object
This instruction is for the application to the LCD TV.
2. Designation
2.1 The adjustment is according to the order which is
designated and which must be followed, according to the
plan which can be changed only on agreeing.
2.2 Power Adjustment : Free Voltage
2.3 Magnetic Field Condition: Nil.
2.4 Input signal Unit : Product specification standard
2.5 Reserve after operation : Above 2 hours
2.6 Adjustment equipments : Pattern Generator( MSPG925F),
DDC Adjustment Jig equipment HDCP Adjustment Jig
equipment.
3. Adjustments
3.1 Adjustment Details
: The machine can be adjusted by itself automatically with
factory automatic equipment, in case error occurs, set
manual adjustment to standard.
3.2 Adjustment signal Composition of The Auto Adjustment
equipment
3.2.1 RS-232C Interchange
9600bps, Pin#2 : Rx, Pin#3 : Tx, 8bit, STOP bit=1, No
Parity
3.2.2 Adjust data save
* Save the adjusted data to the EEPROM with default
value
3.2.3 Adjust OK
3.2.4 Screen Adjustment Instruction Forms
CMD1 CMD2 SetID(0) Value
a. CMD1,CMD2 : Instructions operated by Monitor
b. SetID L 0h Set always 0 in Adjustment
c. VALUE : Adjustment Value
3.3 PC signal Gain/Offset Adjustment
3.3.1 Adjustment Preparation
- Execution of RF no signal during Heat Run over
30min
- Pattern generator signal is connected to the DVI-I
Jack of LCD TV.
3.3.1 Auto Gain/Offset Adjustment .
- To use Pattern Generator(MSPG-925FS), Apply
Model 37, Patten 19 XGA(1024 X 768)60Hz, Half
balck and Half white signal (Don't apply 16 gray
signal)
- Press IN-START Key by using the Remote
Controller(SVC) , after converting to AdjustmentMode, press VOL+ Key consecutively in Auto-Gain
Menu.
- After adjustment is complete, pressing enter key,
stores and completes the process.
* Note) : PC Adjustment must be completed before auto
adjustment.
3.4 Video signal Gain/Offset Adjustment(Auto adjustment)
- Execution of White Pattern during Heat Run over 30min
- Connect to the LCD TV AV1 Scart input terminal with
Patten Generator(MSPG-925FS)
- Convert INPUT MODE to Video&Confirm whether PSM
Mode is Standard
- Connect RS-232C Communication Cable to the Auto
Adjustment Equipment and SET's upgrade Port
3.4.1 Low Gray Adjustment
- Apply Gray-Level Gray-Level (Model : 202, pattern :
59) signal by using Pattern Generator(MSPG925FS)
- Check weather color-coordinates (x:0.280, y : 0.280,
±0.005) is operated by using CA-110 equipment
- If color-coordinates is not in Spec, adjust colorcoordinates(x:0.280, y:0.280, ±0.005)by adjusting
Red Offset, Blue Offset
3.4.2 White Balance Adjustment
- Apply Gray-Level Gray-Level (Model : 202, pattern :
59) signal by using Pattern Generator(MSPG925FS)
- Check weather color-coordinates (x:0.283, y:0.298,
±0.005) is operated by using CA-110 equipment
- If color-coordinates is not in Spec, adjust colorcoordinates(x:0.283, y:0.298, ±0.005)by adjusting
Red Offset, Blue Offset
- All adjustment takes color-coordinates with based on
G, changing R and B. If it is not adjusted, adjust with
fixed B, changing G and R.
3.5 Component signal Gain/Offset Adjustment(Auto adjustment)
- Execution of RF no signal during Heat Run over 30min
- Connect to the LCD TV Component1 terminal with Patten
Generator(MSPG-925FS)
- Convert INPUT MODE to Component1.& Confirm whether
PSM Mode is Standard
- Connect RS-232C Communication Cable to the Auto
Adjustment Equipment and SET's upgrade Port
3.5.1 Low Gray Adjustment
- Apply Gray-Level (Model : 210, pattern : 59)signal by
using Patten Generator(MSPG925FS)
- Check whether color-coordinates (x:0.280, y:0.280,
±0.005) is operated by using CA-110 equipment
- If color-coordinates is not in Spec, adjust color-
coordinates(x:0.280, y : 0.280, ±0.005) by adjusting Red
Offset, Blue Offset
3.5.2 White Balance Adjustment
- Apply full White (Model : 210, pattern : 47) signal by
using Patten Generator(MSPG925FS)
- Check whether color-coordinates (x:0.280, y:0.280,
±0.005) is operated by using CA-110 equipment
- If color-coordinates is not in Spec, adjust colorcoordinates (x:0.283, y:0.298, ±0.005)by adjusting Red
Gain, Blue Gain
- All adjustment takes color-coordinates with based on R,
changing G and B If it is not adjusted, adjust with fixed
G, changing R and R.
ai - 0 - 00
ak - 0 - 00
- 12 -
3.6 EDID (The Extended Display Identification Data)
- Connect D-Sub to DVI-I Cable to DVI-I Jack.
- Confirm the pc display by inputting the Analog signal.
- After displayed, input the Analog EDID data.
- Connect DVI D Cable to DVI Jack.
- Confirm the pc display by inputting the Digital signal.
- After displayed, input the Digital EDID data.
3.6.1 EDID DATA
<DDC DATA Analog Set>
< DDC DATA Digital Set>
3.7 HDCP (High-Bandwidth Digital Contents Protection) Setting
3.7.1 When transmitting HD video source of HD STB through
DVI(Digital Visual Interface), HDCP function is to execute
Display & copy protection for securing contents security.
3.7.2 Confirm whether HDCP function is operated properly by
connecting DVI Cable, after storing HDCP Key value on
EEPROM(AT24C16)[address 0
x4EE] (Refer to Working
Order for Detailed work content ).
* Reference : HDCP adjustment is not use. We are planning
HDCP adjustment from NTSC.
00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F
00 00 FF FF FF FF FF FF 00 1E 6D 45 75 01 01 01 01
10 00 0E 01 03 01 40 26 78 08 B1 DA A1 56 48 98 24
20 13 48 4B 21 08 00 31 40 01 01 01 01 45 40 01 01
30 61 40 81 80 01 01 4E 1F 00 90 51 00 1B 30 40 88
40 13 00 A2 0B 32 00 00 18 1B 21 50 A0 51 00 1E 30
50 48 88 35 00 A2 0B 32 00 00 1C 00 00 00 FD 00 3B
60 3D 1F 30 09 00 0A 20 20 20 20 20 20 00 00 00 FC
70 00 32 37 4C 5A 35 52 56 0A 20 20 20 20 20 00 70
00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F
00 00 FF FF FF FF FF FF 00 1E 6D 46 75 01 01 01 01
10 00 0E 01 03 81 40 26 78 08 B1 DA A1 56 48 98 24
20 13 48 4B 21 08 00 31 40 01 01 01 01 45 40 01 01
30 61 40 81 80 01 01 4E 1F 00 90 51 00 1B 30 40 88
40 13 00 A2 0B 32 00 00 18 1B 21 50 A0 51 00 1E 30
50 48 88 35 00 A2 0B 32 00 00 1C 00 00 00 FD 00 3B
60 3D 1F 30 09 00 0A 20 20 20 20 20 20 00 00 00 FC
70 00 32 37 4C 5A 35 52 56 0A 20 20 20 20 20 00 EF
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