LG MG370, KG370 Service Manual

Date: October, 2007 / Issue 1.0

Service Manual

MG370/KG370

Model : MG370/KG370

- 1 -

LGE Internal Use Only

The information in this manual is subject to change without notice and should not be construed as a commitment by LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes to equipment design as advances in engineering and manufacturing methods warrant.

This manual provides the information necessary to install, program, operate and maintain the MG370.

REVISED HISTORY

Editor Date Issue Contents of Changes S/W Version

- 2 -

LGE Internal Use Only

Only for training and service purposes

- 3 -

Table Of Contents

1. INTRODUCTION ...............................5

1.1 Purpose .................................................. 5

1.2 Regulatory Information............................ 5

1.3 ABBREVIATION ......................................7

2. PERFORMANCE...............................9

2.1 Product Name ..........................................9

2.2 Supporting Standard................................9

2.3 Main Parts: GSM Solution........................9

2.4 H/W Features.........................................10

3. TECHNICAL BRIEF ........................14

3.1 Digital Main Processor(PMB7880).........14

3.2 Power Amplifier Module (SKY77318) ....22

3.3 26 MHz Clock (DCXO)...........................24

3.4 RTC(32.768KHz Crystal) .......................25

3.5 LCD Interface(3-wire SPI interface) .......26

3.6 SIM Card Interface.................................28

3.7 KEYPAD Interface .................................29

3.8 Battery Charging Block Interface ...........30

3.9 RF Interface ...........................................31

3.10 Audio Interface.....................................33

3.11 Key LED Interface................................37

3.12 Vibrator Interface .................................38

3.13 Memory Interface .................................39

3.14 Power Block Interface ..........................40

3.15 MG370a, MG370b,KG370,KG375

Function difference ..............................42

3.16 BOM difference ....................................43

4. TROUBLE SHOOTING ...................44

4.1 Trouble Test Set-up ...............................44

4.2 Power On Trouble..................................45

4.3 Charging Trouble ...................................47

4.4 Vibrator Trouble .....................................49

4.5 SIM Card Trouble...................................51

4.6 KEY backlight Trouble ...........................53

4.7 RTC Trouble ..........................................54

4.8 LCD Trouble...........................................55

4.9 Speaker Trouble ....................................57

4.10 Receiver Trouble..................................59

4.11 Headphone Trouble .............................60

4.12 Microphone Trouble .............................62

4.13 RF Components...................................63

4.14 RX Receiver Part .................................64

4.14 RX Receiver Part .................................66

4.15 TX Transmitter Part..............................67

5. DOWNLOAD.......................................71

5.1 Download Setup.....................................71

5.2 Download Process .................................72

6. BLOCK DIAGRAM ..........................77

7. CIRCUIT DIAGRAM ........................79

8. BGA IC Pin Check .............................83

9. PCB LAYOUT ..................................85

10. Calibration ....................................87

10.1 Calibration Steps..................................87

11. Stand-alone Test ..........................92

11.1 Test Program Setting ...........................92

11.2 Tx Test .................................................94

11.3 Rx Test.................................................95

12. EXPLODED VIEW &

REPLACEMENT PART LIST ....... 97

12.1 Exploded View .................................... 97

12.2 Replacement Parts ..............................99

12.3 Accessory ......................................... 111

Table Of Contents

LGE Internal Use Only

- 4 -

LGE Internal Use Only

Only for training and service purposes

- 5 -

1. INTRODUCTION

1.1 Purpose

This manual provides the information necessary to repair, calibration, description and download the features of the MG370

1.2 Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges you’re your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. LGE does not warrant that this product is immune from the above case but will prevent unauthorized use of common-carrier telecommunication service of facilities accessed through or connected to it. LGE will not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the MG370 or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on the MG370 must be performed only by the LGE or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.

1. INTRODUCTION

LGE Internal Use Only

- 6 -

1. INTRODUCTION

E. Notice of Radiated Emissions

The MG370 complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.

G. Interference and Attenuation

An MG370 may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign. Following information is ESD handling:

• Service personnel should ground themselves by using a wrist strap when exchange system boards.

• When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded.

• Use a suitable, grounded soldering iron.

• Keep sensitive parts in these protective packages until these are used.

• When returning system boards or parts like EEPROM to the factory, use the protective package as described.

LGE Internal Use Only

Only for training and service purposes

- 7 -

2. PERFORMANCE

1.3 ABBREVIATION

For the purposes of this manual, following abbreviations apply:

LGE Internal Use Only

APC Automatic Power Control

BB MG370

BER Bit Error Ratio

CC-CV Constant Current - Constant Voltage

DAC Digital to Analog Converter

DCS Digital Communication System

dBm dB relative to 1 milliwatt

DSP Digital Signal Processing

EEPROM Electrical Erasable Programmable Read-Only Memory

EL Electroluminescence

ESD Electrostatic Discharge

FPCB Flexible Printed Circuit Board

GMSK Gaussian Minimum Shift Keying

GPIB General Purpose Interface Bus

GSM Global System for Mobile Communications

IPUI International Portable User Identity

IF Intermediate Frequency

LCD Liquid Crystal Display

LDO Low Drop Output

LED Light Emitting Diode

OPLL Offset Phase Locked Loop

PAM Power Amplifier Module

PCB Printed Circuit Board

PGA Programmable Gain Amplifier

LGE Internal Use Only

Only for training and service purposes

2. PERFORMANCE

- 8 -

PLL Phase Locked Loop

PSTN Public Switched Telephone Network

RF Radio Frequency

RLR Receiving Loudness Rating

RMS Root Mean Square

RTC Real Time Clock

FEM Front End Module

SIM Subscriber Identity Module

SLR Sending Loudness Rating

SRAM Static Random Access Memory

STMR Side Tone Masking Rating

TA Travel Adapter

TDD Time Division Duplex

TDMA Time Division Multiple Access

UART Universal Asynchronous Receiver/Transmitter

VCO Voltage Controlled Oscillator

VCTCXO Voltage Control Temperature Compensated Crystal Oscillator

WAP Wireless Application Protocol

LGE Internal Use Only

2. PERFORMANCE

- 9 -

2. PERFORMANCE

2.1 Product Name MG370 : Support GSM

2.2 Supporting Standard

2.3 Main Parts: GSM Solution

Item Feature Comment

Supporting Standard GSM850/PCS1900

Dual-Band (850/1900) with seamless handover Phase 2+(include AMR) SIM Toolkit : Class 1,2,3

Frequency Range GSM850 TX : 824 - 849 MHz

GSM850 RX : 869 - 894 MHz PCS1900 TX : 1850 - 1910 MHz PCS1900 RX : 1930 - 1990 MHz

Application Standard SMS : Yes

Item Part Name Comment

Digital Baseband EGOLD voice (PMB7880)

RF Chip SKY77318

2.4 H/W Features

LGE Internal Use Only

Only for training and service purposes

2. PERFORMANCE

- 10 -

Item Feature Comment

Form Factor Clam shell type LCD : 65K CSTN, 128 x128

Capacity Cell Size: Standard

Battery Standard : Li-Ion, 750mAh(Min) 4.9(L)x34.2(W)x46.6(H)mm

Packing Type: Soft Pack

Size Standard: 85.0 x 45.0 x 19.8 mm LxWxH

Weight 68g With Battery

PCB One PCB : 6Layers, 0.8t

AVG TCVR Max : 250 mA (GSM, Power Level 5) current (mA) Max : 120 mA (GSM, Power Level 19)

Standby Current 3 mA @ Paging Period 6

Standby time Up to 250 hours @ Paging Period 6

Charging time Below 3 hours @ Power Off /1000mAh

Talk time Min : 2.5hr@Power Level 5(GSM850) @ 750 mAh

Min : 2.5hr@Power Level 0(PCS)

RX sensitivity GSM 850 : -108 dBm Condition: conducted

PCS : -106 dBm

TX output power GSM 850 : 33 dBm Class4 (GSM850)

PCS : 30 dBm Class1 (PCS)

SIM card type Plug-In SIM 3V

Display

MAIN LCD : 65K Color CSTN (128 X128)

Backlight : White LED

Alphanumeric Key : 12 Function Key:

Keypad

Function Key :10 4 Key Navigation

Total Number of Keys : 22 with Confirm key,

F1, F2, SND, END/PWR, Clear

LGE Internal Use Only

2. PERFORMANCE

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MG370a, MG370b,KG370,KG375 Function difference

Item Feature Comment

Antenna Built in antenna Type Dual-band

System connector 18 Pin

Ear Phone Jack 18 Pin

PC synchronization Yes Data cable (option)

Memory Flash : 64Mbit / UtRAM : 32Mbit SEC (Samsung)

Speech coding FR, EFR, HR, AMR

Data & Fax No

Vibrator Built in Vibrator

MIDI (for Buzzer Function) 16 Poly (ADPCM real music tone )

Voice Recording Yes

Travel Adapter Yes

Ear-Microphone

Options Cigarette Lighter Adapter

Data Cable

GSM900/ DCS1800RF Band

Design

Asia / CISEuropeMarket

Without

FM Radio

Latin

America

-

GSM850/ PCS1900

Latin

America

--KG375

With

FM Radio

MG370aMG370bKG370-

LGE Internal Use Only

Only for training and service purposes

2. PERFORMANCE

- 12 -

Item Feature Comment

RSSI

Battery Charging

Key Volume

Effect sound volume

Audio Volume

Time/Date Display

Multi-language

Quick Access Mode

PC Sync

Speed Dial

Speaker Phone

CLIP/CLIR

Phonebook

0~6 level

0~4 level

0~5 level

Yes

Yes English /Spanish /Portuguese

Yes

Profiles / Phonebook Calendar / Message

Yes

Yes 8EA

Yes

Yes Total 300 members

Last Dial Number

Last Received

Number

Last Missed Number

Search Number/Name

Group

Fixed Dial Number

Service Dial Number

Own Number

Voice Memo

Call Remainder

Network Selection

Yes 10EA

Yes (10) 10EA

Name only

No

Yes

Yes 30sec

Yes

No

LGE Internal Use Only

2. PERFORMANCE

- 13 -

Item Feature Comment

Call Divert

Call Barring

Call Charge (AoC)

Call Duration

SMS

EMS melody/Picture Send/ Receive/ Save

SMS Over GPRS

E-Mail

Long Message

Cell Broadcast

Download Melody /

Wallpaper

Game

Calendar

Memo Pad

Yes

100

No

Yes Max. 459 Characters

Yes

World Clock

Unit Convert

Fax & Data

Wall Paper

WAP Browser

Download

SIM Lock

SIM Toolkit

MMS

AMR

CPHS

Hold / Retrieve

Conference Call

DTMF

Yes

No

Yes Default 3EA

No

Yes Operator Dependent

Class 1, 2, 3

No

Yes

Yes Max. 6

Yes

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3. TECHNICAL BRIEF

3.1 Digital Main Processor(PMB7880)

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

Figure. 3-1 PMB7880 FUNCTIONAL BLOCK DIAGRAM

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3. TECHNICAL BRIEF

3.1.1 Overview of E-GOLDvoice

The E-GOLD voice is a GSM base band modem including RF transceiver covering the low bands GSM850 /GSM900 and high bands GSM1800 / GSM1900 bands. E-GOLD voice is Dual Band, therefore, it supports by default a low / high pair of bands at the same time:

1. GSM850 / GSM1800

2. GSM850 / GSM1900

3. GSM900 / GSM1800

4. GSM900 / GSM1900 The E-GOLD voice is optimized for voice-centric Mobile Phone applications. The E-GOLD voice is designed as a single chip solution that integrates the digital, mixed-signal, RF functionality and a direct-to-battery Power Management Unit.

The transceiver consists of:

• Constant gain direct conversion receiver with an analog I/Q base band interface

• Fully integrated Sigma/Delta-synthesizer capability

• Fully integrated two-band RF oscillator

• Two-band digital GMSK modulator with digital TX interface

• Digitally controlled crystal oscillator generating system clocks.

The E-GOLD voice supports a direct battery connection, hence eliminating the need for an external Power Management Unit. The E-GOLD voice has different power down modes and an integrated power up sequencer.

The E-GOLD voice is powered by the C166®S MCU and TEAKLite® DSP cores. The operating temperature range from -40˚C to 85˚C. It is manufactured using the 0.13 µm CMOS process.

LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

- 16 -

3.1.2 Features

] Baseband

• High performance fixed-point TEAKlite DSP

• C166S high performance microcontroller

• There are several Interfaces:

- I2S interface for DAI connections (for Tape Approval)

- High Speed SSC Interface for connection of external peripherals

- SIM Interface

- Keypad Interface (6x4 or 5x5 keys)

- EBU for external RAM/FLASH connection

- Asynchronous serial interface

- JTAG Interface

- Black & white and color displays are supported

- PWM source to drive vibrator

- Keypad and display backlight supported.

] Receiver

• Constant gain, direct conversion receiver with fully integrated blocking filter

• Two integrated LNAs

• No need of interstage and IF filter

• Highly linear RF quadrature demodulator

• Programmable DC output level

• Very low power budget.

] Transmitter

• Digital Sigma-Delta modulator for GMSK modulation, typical -163.5 dBc/Hz@20 MHz

• Single ended outputs to PA, Pout = +3.5 dBm

• Very low power budget.

] RF-Synthesizer

• Σ∆Synthesizer for multi-slot operation

• Fast lock-in times (< 150 µs)

• Integrated loop filter

• RF Oscillator

• Fully integrated RF VCO.

] Crystal Oscillator

• Fully digital controlled crystal oscillator core with a highly linear tuning characteristic.

- 17 -

3. TECHNICAL BRIEF

] Mixed Signal and Power Management Unit

• DC/DC boost for voltages up to 15V for driving White or Blue LEDs

• 8-Ohm loud speaker driver (250/350mW)

• 16-Ohm earpiece driver

• 32-Ohm headset driver

• 4 measurement interfaces (PA temperature, battery voltage, battery temperature, and ambient temperature)

• Differential microphone input

• System start up circuitry

• Charger circuitry for NiCd, NiMh and LiIon cells

• Integrated regulators for direct connection to battery.

LGE Internal Use Only

Only for training and service purposes

3.1.3 GSM System Description

The E-GOLD voice is suited for mobile stations operating in the GSM850/900/1800/1900 bands. In the receiver path the antenna input signal is converted to the baseband, filtered, and then amplified to target level by the RF transceiver chipset. Two A-to-D converters generate two 6.5 Mbit/s data streams. The decimation and narrowband channel filtering is done by a digital baseband filter in each path.

The DSP performs:

1. The GMSK equalization of the received baseband signal (SAIC support available)

2. Viterbi channel decoding supported by an hardware accelerator.

The recovered digital speech data is fed into the speech decoder. The E-GOLD voice supports fullrate, halfrate, enhanced fullrate and adaptive multirate speech CODEC algorithms. The generated voice signal passes through a digital voiceband filter. The resulting 4 Mbit/s data stream is D-to-A converted by a multi-bit-oversampling converter, postfiltered, and then amplified by a programmable gain stage. The output buffer can drive a handset ear-piece or an external audio amplifier, an additional output driver for external loud speaker is implemented. In the transmit direction the differential microphone signal is fed into a programmable gain amplifier. The prefiltered and A-to-D converted voice signal forms a 2 Mbit/s data stream. The oversampled voice signal passes a digital decimation filter. The E-GOLD voice performs speech and channel encoding (including voice activity detection (VAD) and discontinuous transmission (DTX)) and digital GMSK modulation. In the RF transceiver part, the baseband signal modulates the RF carrier at the desired frequency in the 850 MHz, 900 MHz, 1.8 GHz, and 1.9 GHz bands using an I/Q modulator. The E-GOLD voice supports dual band applications. Finally, an RF power module amplifies the RF transmit signal at the required power level. Using software, the E-GOLD voice controls the gain of the power amplifier by predefined ramping curves (16 words, 11 bits). For baseband operation, the E-GOLD voice supports:

• Making or receiving a voice call

• Sending or receiving an SMS.

3. TECHNICAL BRIEF

- 18 -

LGE Internal Use Only

3. TECHNICAL BRIEF

- 19 -

3.1.4 PMU Details

The E-GOLD voice includes battery charger support (various sensor connections for temperature, battery technology, voltage, etc.) and a ringer buffer. E-GOLD voice avoids the need for an external power management component because its internal power management unit contains:

• Voltage regulators for the On-chip and Off-chip functional blocks

• Charger circuitry for NiCd, NiMh and LiIon cells.

3.1.5 Bus Concept

The E-GOLDvoice has two cores (a microcontroller and a DSP), each with its own bus. There is an interconnection between the TEAKlite bus and the C166S X-Bus.

3.1.6 C166S Buses

The C166S is connected to three buses:

1. Local Memory (LM) bus

2. X-Bus

3. PD-Bus.

3.1.7 TEAKLite Bus

The TEAKlite is connected to the TEAKlite bus.

3.1.8 Bus Interconnections

The interconnection between the X-Bus and the TEAKlite Bus uses:

• Multicore Synchronization

• Shared Memory.

3.1.9 Clock Concept

The E-GOLD voice has a flexible clock control.

3.1.10 Interrupt Concept

The C166 MCU carries out the E-GOLD voice interrupt system.

3.1.11 Debug Concept

The E-GOLD voice includes a multi-core debug. The C166 and TEAKlite cores can be debugged in parallel with:

• A single JTAG port (that is, on a single host)

• Mutual breakpoint control.

LGE Internal Use Only

Only for training and service purposes

3.1.12 C166 Debug Concept

The debugging of the C166 uses the OCDS and the Cerberus.

3.1.13 TEAKLite Debug Concept

TEAKlite debugging uses the OCEM and the SEIB.

3.1.14 Power Management

The E-GOLDvoice provides the power management unit (PMU) for the complete mobile phone application. The integrated PMU is directly connected to the battery and provides a set of linear voltage regulators (LDO’s). These LDO’s generate all required supply voltages and currents needed in a low feature mobile phone. A charger control circuit charges NiCd, NiMH and LiIon batteries. The charger control supports hardware controlled pre-charging and software controlled charging. It offers a wide charger voltage range, making half wave/ full-wave charging with cheap transformers possible. White/blue backlight generation is supported with a special driver for very a low external parts count. Power consumption during operation phases is minimized due to flexible clock switching In the Standby Mode most parts of the device are switched off, only a small part is running at 32kHz and the controller RAM is switched to a power saving mode. The TEAKLite ROM can be switched off during Standby via SW.

3.1.15 On-Chip Security Concept

Secure boot is based on a public/private key approach. Flash images that are not signed with the private key during phone manufacture cannot be loaded. Verification of the Flash code is done with the public key. The public key as well as hash and verify algorithms are stored in the ROM, which ensures a hardware secured boot procedure.

The following security features are supported:

• Prevention of illegal Flash programming

• Flash programming makes use of the E-GOLD voice ID for personalization checks with IMEI and SIM-lock protection

3. TECHNICAL BRIEF

- 20 -

LGE Internal Use Only

3. TECHNICAL BRIEF

- 21 -

The security features use the following mechanism:

• Boot ROM flow:

- Controls the boot transition to external flash

- Controls the flash update

• Flash tied to the individual chip via an ID using e-fuses, that is, each E-GOLD voice chip has its own fused ID.

Further details on the E-GOLD voice security concept are not publicly documented

3.1.16 Asynchronous Operation Mode Concept

The E-GOLD voice can operate in either:

• The traditional synchronous mode with the 26MHz system clock synchronized on the base station

• A special asynchronous mode (XO concept).

In the asynchronous mode the 26MHz clock input is not synchronized with the base station; the residual frequency offset is compensated in the digital signal processing domain. This processing includes frequency and timing compensation of the baseband and voiceband signals.

3.1.17 Receiver Antenna Bar Display

-107dBm~ -103dBm1->0

-103dBm~ -99dBm2->1

-98dBm~ -94dBm3->2

-93dBm~ -89dBm4->3

-88dBm~ -84dBm5->4

Antenna display

RX Power (dBm)Antenna Bar Number

LGE Internal Use Only

Only for training and service purposes

3.2 Power Amplifier Module (SKY77318)

The SKY77318 Power Amplifier Module (PAM) is designed in a low profile (1.2 mm), compact form factor for quad-band cellular handsets comprising GSM850/900, DCS1800, and PCS1900 operation. The PAM also supports Class 12 General Packet Radio Service (GPRS) multi-slot operation.

The module consists of separate GSM PA and DCS1800/PCS1900 PA blocks, impedance-matching circuitry for 50 Ω input and output impedances and a Power Amplifier Control (PAC) block with an internal current-sense resistor. The custom BiCMOS integrated circuit provides the internal PAC function and interface circuitry. Fabricated onto a single Gallium Arsenide (GaAs) die, one Heterojunction Bipolar Transistor (HBT) PA block supports the GSM bands and the other supports the DCS1800 and PCS1900 bands. Both PA blocks share common power supply pins to distribute current.

The GaAs die, the Silicon (Si) die, and the passive components are mounted on a multi-layer laminate substrate. The assembly is encapsulated with plastic overmold. RF input and output ports of the SKY77318 are internally matched to a 50 load to reduce the number of external components for a quad-band design. Extremely low leakage current (2.5 µA, typical) of the dual PA module maximizes handset standby time. The SKY77318 also contains band select switching circuitry to select GSM (logic 0) or DCS/PCS (logic 1) as determined from the Band Select (BS) signal.

3. TECHNICAL BRIEF

- 22 -

Figure. 3-2 SKY77318 FUNCTIONAL BLOCK DIAGRAM

LGE Internal Use Only

3. TECHNICAL BRIEF

- 23 -

In Figure 1 below, the BS pin selects the PA output (DCS/PCS_OUT or GSM_OUT) and the Analog Power Control (VAPC) controls the level of output power.

The VBATT pin connects to an internal current-sense resistor and interfaces to an integrated power amplifier control (iPAC

TM

) function, which is insensitive to variations in temperature, power supply, process, and input power. The ENABLE input allows initial turn-on of PAM circuitry to minimize battery drain.

LGE Internal Use Only

Only for training and service purposes

3.3 26 MHz Clock (DCXO)

DCXO (Digitally Controlled Crystal Oscillator) and VCTCXO (Voltage Controlled Temperature Compensated Crystal Oscillator) are two different techniques used to maintain the mobile’s reference oscillator’s accuracy over time. The reference oscillator’s accuracy over time will vary due to initial crystal frequency offset, temperature drift and aging. These static and dynamic frequency variations have to be compensated, otherwise the mobile would be in danger of losing connection to the network. The technique used to perform the frequency compensation is generally termed Automatic Frequency Control (AFC). To summarize the operation of DCXO, GSM Baseband processor will calculate the AFC compensation (which is continuously updated) required based on the measured frequency error. Then the required AFC compensation is sent to the LUXO (Lineari-Zation Unit of Crystal Oscillator), which in turns control the DCXO core and generates the 26MHz system clock.

3. TECHNICAL BRIEF

- 24 -

Figure. 3-3 E-Glod Voice DCXO Overview

LGE Internal Use Only

3.4 RTC(32.768KHz Crystal)

The integrated Real Time Clock (RTC) is able to provide programmable alarm functions and external interrupts. Due to its extreme low power consumption the RTC can be supplied from a small backup battery. This allows the generation of external interrupts, even when the main PMB7880 supply voltage is switched off. For this purpose the RTC is powered by own voltage supply pins VDD_RTC and VSS_RTC. The RTC shall be driven by a 32.768 kHz (32k) clock which needs to be applied via the PMB7880 F32K and OSC32K pins. The clock can be fed from either an external clock source or use the on chip 32 KHz oscillator module. The low clock frequency and the optimized low power design give the possibility to run the chip with a minimum of power dissipation. For example, for this specific application the 26 MHz reference oscillator can be switched off during system standby and a low- power time reference can be kept when the 32k clock is provided to the RTC. The RTC consists of an PMB7880 specific RTC shell, containing the RTC macro, as well as the 32 kHz oscillator, as described in the following sections. The module RTC Shell solely performs level translation of the 32KHz clock to the VDD_LD1 power supply domain, and is not functionally associated with the RTC.

3. TECHNICAL BRIEF

- 25 -

Figure. 3-4 E-Gold Voice RTC Interface

32.768KHz

MC-146_12_5PFX101

12

3

4

C121

18p

C122

18p

LGE Internal Use Only

Only for training and service purposes

3.5 LCD Interface(3-wire SPI interface)

3. TECHNICAL BRIEF

- 26 -

Figure 3-5-1. LCD Interface

VBAT

10

INOUT_B4

INOUT_B5

9

8

INOUT_B6

7G114

G2

INOUT_A1

1

2

INOUT_A2

3

INOUT_A3

INOUT_A4

4

5

INOUT_A5

INOUT_A6

6

13

INOUT_B1

INOUT_B2

12

INOUT_B3

11

ICVE31186E150R101FR

FL200

18

19

20

21

22

23

24

2 3 4 5 6 7 8 9

16

25

26

27

28

29

30

17

CN200

1

10 11 12 13 14 15

C221

1000p

VA202

2V85_VIO

INOUT_B3

INOUT_B4

10

9

INOUT_B5

INOUT_B6

8

FL201

ICVE31186E150R101FR

G17G2

14

1

INOUT_A1

INOUT_A2

2

INOUT_A3

3

4

INOUT_A4

INOUT_A5

5

6

INOUT_A6

INOUT_B1

13

12

INOUT_B2

11

VA201

0.1uC220

A(7)

IND_LED_B

IND_LED_R

D(0:7)

LCD_RESET

MLED

MLED2

SPK_RCV_N

SPK_RCV_P

MOTOR_P

LCD_ID

MLED1

_LCD_CS

_WR

Figure 3-5-2. Charge pump interface

1u

C205

VBAT

9

C2+

7

C2-

6

8

CP

D1

1 2

D2 D3

3

11

EN_SET

4

GND

IN

5

12

NC

U200 AAT3157ITP-T1

10

C1+

C1-

1u

C203

VA200

C219 27p

C202 0.1u

C217

2.2u

R210

100K

27pC218

MLED1 MLED2

MLED

W_LED_EN

LGE Internal Use Only

The AAT3157 is a low noise, constant frequency charge pump DC/DC converter that uses a tri-mode load switch (1X), fractional (1.5X), and doubling (2X) conversion to maximize efficiency for white LED applications. The AAT3157 is capable of driving up to three channels of LEDs at 20mA per channel from a 2.7V to 5.5V input. The current sinks may be operated individually or in parallel for driving higher current LEDs. A low external parts count (two 1µF flying capacitors and two small 1µF capacitors at VIN and VOUT) make this part ideally suited for small, battery-powered applications. Analogic Tech's S2CwireTM(Simple Serial ControlTM) serial digital input is used to enable, disable, and set current for each LED with 16 settings down to 50µA. The low-current mode supply current can be as low as 50µA to save power.

3. TECHNICAL BRIEF

- 27 -

Figure 3-5-3. Charge pump Output Current

Signals Description

_LCD_CS This signal enable to access to the driver IC of LCD.

D[0:7] This signal transfer 8bit parallel data to driver IC.

A(7) Data / Command switch

LCD_RESET This signal makes driver IC to HW default status.

MLED This signal provide power to white LEDs.

MLED1/2 The white LED current sink ports

2V85_VIO This signal provides power to LCD modules.(2.8V)

Data Output (mA/Ch) Data Output (mA/Ch)

1 20.0 9 5.0

2 17.0 10 4.2

3 14.0 11 3.4

4 12.0 12 2.8

5 10.0 13 1.0

6 8.6 14 0.5

7 7.0 15 0.1

8 6.0 16 0.05

LGE Internal Use Only

Only for training and service purposes

3.6 SIM Card Interface

The E-Gold Voice provides SIM Interface Module. The AD6527 checks status Periodically During established call mode whether SIM card is inserted or not, but it doesn't check during deep sleep mode. In order to communicate with SIM card, 3 signals SIM_DATA, SIM_CLK, SIM_RST.

3. TECHNICAL BRIEF

- 28 -

Figure 3-6. SIM CARD Interface

C124

0.1u

22p

C125

R113

4.7K

CLK

3

4

GND1

GND2

7 8

GND3GND4

9

10

GND5

IO

6

2

RST

1

VCC

VPP

5

J100

2V85_VSIM2V85_VSIM

22p

C123

SIM_DATA SIM_CLK

SIM_RST

Signals Description

SIM_RST This signal makes SIM card to HW default status.

SIM_CLK This signal is transferred to SIM card.

SIM_DATA This signal is interface datum.

LGE Internal Use Only

3.7 KEYPAD Interface

The keypad interface is connected to the X-Bus, together with the XBIU and the shared Memory Register, using a single Bus Interface.

The keypad supports two scan modes:

• By default, the keypad is a 5x5 scan matrix 5 input and 5 output pins).

• To set the keypad to a 5x5 scan matrix (5 input and 5 output pins)

The scan mode should be determined at the very beginning of the system start because changes are not allowed later.

3. TECHNICAL BRIEF

- 29 -

Figure 3-7 KEY MAXTRIX Interface

END

SEL

680

R229

R234

1K

202

UP

100p

C242

MENU

204

R232 680

207

R233 680

201

STAR

R235 680

R228

680

LEFT

CLEAR

680

R227

OK

R230

680 DOWN

R237 680

206 SEND

209

205

RIGHT

203

200

R231 680

R236 680

208

2V0_VRTC

SHARP

KEY_IN(0:4)

KEY_OUT(0:4)

PWRON