LG MG191A Service Manual

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MMG191a

Service Manual

MG191a

P/N : MMBD0048101 Date : April 2005

REVISED HISTORY

Editor Date IssueContents of Changes S/W Version

Y.M. CHO 29/DEC/2003 Issue 0.1 INITIAL RELEASE

Y.M. CHO 25/JAN/2004 Issue 0.2 SECOND RELEASE

* The information in this manual is subject to change without notice and should not be construed as a commitment by LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes to equipment design as advances in engineering and manufacturing methods warrant.

* This manual provides the information necessary to install, program, operate and maintain the MG191a.

Table of Contents

1. Introduction ................................. 5

1.1. Purpose

1.2. Regulatory Information ......................5

1.2.1. Security ...................................... 5

1.2.2. Incidence of Harm ...................... 5

1.2.3. Changes in Service .................... 5

1.2.4. Maintenance Limitations ............. 5

1.2.5. Notice of Radiated Emissions .... 6

1.2.6. Pictures ....................................... 6

1.2.7. Interference and Attenuation ...... 6

1.2.8. Electrostatic Sensitive Devices ... 6

1.3 Abbreviation ....................................... 6

.............................................5

2. General Performance ................. 8

2.1. H/W Feature ..................................... 8

2.2. Technical Specification ................... 10

3.3. Analog Baseband(ABB) Processor.. 23

3.3.1. General Description .................. 23

3.3.2. Audio Signal Processing &

Interface ................................... 24

3.3.3. Baseband Codec (BBC) ........... 25

3.3.4. Voltage Regulation (VREG) ..... 26

3.3.5. ADC Channels .......................... 27

3.3.6. Charging ................................... 28

3.3.7. Switch ON/OFF ......................... 29

3.3.8. Memory

3.3.9. Display & FPC Interface ......... 29

3.3.10. Keypad Switching &

Scanning ................................. 31

3.3.11. Audio ....................................... 32

3.3.12. Keypad back-light

Illumination ............................. 35

3.3.13. LCD Illumination ..................... 35

.................................. 29

3. H/W Circuit Description ............ 15

3.1. RF Circuit ........................................ 15

3.1.1. Front End Part .......................... 15

3.1.2. Receiver Part ............................ 16

3.1.3. Synthesizer Part ....................... 17

3.1.4. Transmitter Part ........................ 17

3.1.5. Power Amplifier ......................... 18

3.1.6. 26 MHz Clock ........................... 18

3.2. Digital Baseband(DBB) Processor

3.2.1. General Description .................. 19

3.2.2. Block Description ...................... 23

3.2.3. External Devices connected to

memory interface ...................... 21

3.2.4. RF Interface

...................... 21

block)

TSP

(TPU,

3.2.5. SIM interface ............................ 21

3.2.6. UART Interface ........................ 22

3.2.7. GPIO map

................................ 23

. 19

3.4. Camera Circuit ................................ 36

A. BaseBand Components

(Component Side)

B. BaseBand Components

(Keypad Side) ................................ 37

Digital Baseband (DBB)

Processor ....................................... 37

D. Analog Main Processor (ABB) ....... 38

E. Memory

F. Voltage Regulation (LDO) .............. 40

G. MIDI ............................................... 41

H. Charging ......................................... 41

I. KEY Back-light Illumination .............. 42

J. SIM

K. Keypad

.......................................... 39

.................................................. 42

........................................... 43

.......................... 36

4. TROUBLE SHOOTING ................ 44

4.1. Baseband Components

(Component Side) ........................... 44

4.2. Baseband Components

(Keypad Side + Button Side) .......... 45

4.3. Power On Trouble ........................... 46

4.4. Charging Trouble ............................ 47

4.5. LCD Display Trouble ....................... 49

4.6. Speaker/Receiver Trouble .............. 51

A. Receiver Trouble ............................ 53

B. Speaker Trouble ............................. 53

4.7. Microphone Trouble ........................ 54

4.8. Vibrator Trouble .............................. 55

4.9. Keypad Backlight Trouble ............... 57

4.10. SIM Detect Trouble ....................... 59

4.11. Earphone Trouble ......................... 61

4.12. The Block Diagram of

the RF Part ................................... 64

4.13. Tx / Rx Part Description ............... 66

9. STAND ALONE TEST &

CALIBRATION ........................ 103

A. What is Standalone Test? ............ 103

B. Standalone Test

Equipment Setup ...............

C. Rx Standalone Test ...................... 104

D. Tx Standalone Test ...................... 104

E. What is Calibration? ..................... 105

F. Calibration program ...................... 106

G. Calibration Equipment Setup ....... 107

H. Calibrate MG191a with ChiWoo ... 108

............... 103

10. EXPLODED VIEW &

REPLACEMENT PART LIST ... 113

10.1. EXPLODED VIEW .......................... 113

10.2. Replacement Parts

<Mechanic component> .................... 115

10.2. Replacement Parts

<Main component> ........................... 117

10.3. Accessory ....................................... 128

4.14. Receiver Part Description ............. 67

4.15. Transmitter Part Description ......... 71

4.16. RX Part Trouble Shooting ............. 74

4.17. TX Part Trouble Shooting ............. 80

5. DOWNLOAD AND

CALIBRATION ............................ 85

6. BLOCK DIAGRAM ...................... 91

7. CIRCUIT DIAGRAM .................... 95

8. PCB LAYOUT............................. 100

- 4 -

1. INTRODUCTION

1. Introduction

1.1. Purpose

This manual provides the information necessary to repair, calibration, description and download the features of the MG191a.

1.2. Regulatory Information

1.2.1. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges you’re your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. LGE does not warrant that this product is immune from the above case but will prevent unauthorized use of common-carrier telecommunication service of facilities accessed through or connected to it. LGE will not be responsible for any charges that result from such unauthorized use.

1.2.2. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. as repair is not done.

A telephone company may temporarily disconnect service as long

1.2.3. Changes in Service

local telephone company may make changes in its communications facilities or procedure. If these

A changes could reasonably be expected to af network, the telephone company is required to give advanced written notice to the user user to take appropriate steps to maintain telephone service.

fect the use of the MG191a or compatibility with the

, allowing the

1.2.4. Maintenance Limitations

Maintenance limitations on the MG191a must be performed only by the LGE or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty

1. INTRODUCTION

APC Automatic Power Control

BB Baseband

BER Bit Error Ratio

CC-CV Constant Current ? Constant Voltage

CLA Cigar Lighter Adapter

DAC Digital to Analog Converter

DCS Digital Communication System

dBm dB relative to 1 milliwatt

DSP Digital Signal Processing

EEPROM Electrical Erasable Programmable Read-Only Memory

1.2.5. Notice of Radiated Emissions

The MG191a complies with rules regarding radiation and radio frequency emission as defined by loca regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.

1.2.6. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.

1.2.7. Interference and Attenuation

An MG191a may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from unsuppressed engines or electric motors may cause problems.

1.2.8. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign. Following information is ESD handling: Service personnel should ground themselves by using a wrist strap when exchange system boards. When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded. Use a suitable, grounded soldering iron. Keep sensitive parts in these protective packages until these are used. When returning system boards or parts such as EEPROM to the

, use the protective package as described.

factory

1.3 Abbreviation

Para os propósitos do manual, a seguir as abreviações aplicadas.

EL Electroluminescence

ESD

Electrostatic Discharge

FPCB

Flexible Printed Circuit Board

GMSK Gaussian Minimum Shift Keying

GPIB General Purpose Interface Bus

GPRS General Packet Radio Service

GSM Global System for Mobile Communications

IPUI International Portable User Identity

IF Intermediate Frequency

LCD Liquid Crystal Display

LDO Low Drop Output

LED Light Emitting Diode

LGE LG Electronics

OPLL Offset Phase Locked Loop

PAM Power Amplifier Module

PCB Printed Circuit Board

PGA Programmable Gain Amplifier

PLL Phase Locked Loop

PSTN Public Switched Telephone Network

RF Radio Frequency

RLR Receiving Loudness Rating

RMS Root Mean Square

RTC Real Time Clock

SAW Surface Acoustic Wave

SIM Subscriber Identity Module

SLR Sending Loudness Rating

SRAM Static Random Access Memory

STMR Side Tone Masking Rating

TA Travel Adapter

TDD Time Division Duplex

TDMA Time Division Multiple Access

UART Universal Asynchronous Receiver/Transmitter

VCO Voltage Controlled Oscillator

VCTCXO Voltage Control Temperature Compensated Crystal Oscillator

WAP Wireless Application Protocol

1. INTRODUCTION

2. General Performance

2.1 H/W Feature

A. Hardware Feature

• GSM 850 / PCS 1900 Dual Band

• Mono(120x64) Single LCD

• 830mAh Li-Ion Battery

• 3V plug-in type SIM card socket

• 40 poly MIDI sound Ring-tone

• Jack type Ear-microphone

• Dimension : 103.3 x 42.8 x 15.5mm, Weight : 68 g

B. Software Feature

• WAP Supported

• GPRS Class 10 Compatible

• FR/EFR Speech Coding

• 5-Level Volume Control (Voice, Ringtone, etc..)

• SMS

• Phone Book

–255 entries

• Language : English & Spanish

• T9 Text

2. General Performance

ItemFeature

Standard Battery Li-ion, 830mAh

AVG TCVR Current GSM850: 250mA, PCS: 200mA

Standby Current < 4.0mA

Talk time < 4 hours (GSM TX Level 7), 3hours 30min

Standby time 200 hours (Paging Period 2, RSSI:-85dBm)

Charging time 2.5 hours

RX Sensitivity GSM850 : -108dBm, PCS : -107dBm

TX output power GSM850: 33dBm (Level 5)

PCS190: 30dBm (Level 0)

GPRS compatibility Class 10

SIM card type 1.8V/3V Small

Display 120 x 64 dots LCD

Soft icons Key Pad

Status Indicator 0 ~ 9, #, *, Navigation Key, Menu Key,

Confirm Key, Send Key, END/PWR Key

ANT Internal

EAR Phone Jack 3 pole earphone jack

PC Synchronization Yes

Speech coding EFR/FR

Data and Fax Yes

Vibrator Yes

Buzzer No

Voice Recoding Yes

C-Mic Yes

Receiver Yes

Travel Adapter Yes

Options No

MP(-104 dBm)

႘௘ၸ

Comment

Size:4.3(T)x34(W)x50(L)mm

Weight: 17g

2. General Performance

Item Description Specification

GSM 850 TX : 824-849Mhz

1 Frequency Band

2 Phase Error

RMS < 5 degrees Peak < 20 degrees

3 < 0.1ppm

GSM850

Level Power Toler. Level Power Toler.

5 33 dBm 2dB 13 17 dBm 3dB

6 31 dBm 3dB 14 15 dBm 3dB

7 29 dBm 3dB 15 13 dBm 3dB

8 27 dBm 3dB 16 11 dBm 5dB

9 25 dBm 3dB 17 9 dBm 5dB

10 23 dBm 3dB 18 7 dBm 5dB

11 21 dBm 3dB 19 5 dBm 5dB

4 12 19 dBm 3dB

PCS

Level Power Toler. Level Power Toler.

0 30 dBm 2dB 8 14 dBm 3dB

1 28 dBm 3dB 9 12 dBm 4dB

2 26 dBm 3dB 10 10 dBm 4dB

3 24 dBm 3dB 11 8 dBm 4dB

4 22 dBm 3dB 12 6 dBm 4dB

5 20 dBm 3dB 13 4 dBm 4dB

6 18 dBm 3dB 14 2 dBm 5dB

7 16 dBm 3dB 15 0 dBm 5dB

Frequency Error

Power Level

GSM 850 RX : 869-894Mhz

PCS 1900 RX : 1930-1990Mhz

PCS 1900 TX : 1850-1910Mhz

2.2 Technical Specification

GSM850

Offset from Carrier (kHz) Max. dBc

100 +0.5

200 -30

250 -33

400 -60

600 ~ 1,200 -60

1,200 ~ 1,800 -60

1,800 ~ 3,000 -63

3,000 ~ 6,000 -65

Output RF Spectrum 6,000 -71

(due to modulation) PCS

Offset from Carrier (kHz) Max. dBc

100 +0.5

200 -30

250 -33

400 -60

600 ~ 1,200 -60

1,200 ~ 1,800 -60

1,800 ~ 3,000 -65

3,000 ~ 6,000 -65

6,000 -73

GSM850

Offset from Carrier (kHz) Max. (dBm)

Output RF Spectrum 400 -19

(due to switching transient) 600 -21

1,200 -21

1,800 -24

Ite

m Description Specification

2. General Performance

PCS

Offset from Carrier (kHz) Max. (dBm)

Output RF Spectrum 400 -22

(due to switching transient) 600 -24

1,200 -24

1,800 -27

7 Spurious Emissions

Conduction, Emission Status

GSM850

8 Bit Error Ratio

BER (Class II) < 2.439% @-102dBm

PCS

BER (Class II) < 2.439% @-100dBm

9 Rx Level Report accuracy 3 dB

10 SRL 8 3 dB

Frequency (Hz) Max.(dB) Min.(dB)

100 -12 /

200 0 /

300 0 -12

11 Sending Response 1,000 0 -6

2,000 4 -6

3,000 4 -6

3,400 4 -9

4,000 0 /

12 RLR 2 3 dB

Frequency (Hz) Max.(dB) Min.(dB)

100 -12 /

200 0 /

300 2 -7

500

-5

13 Receiving Response 1,0000-5

3,000 2 -5

3,400 2 -10

4,000 2

Mean that Adopt a straight line in between 300 Hz and 1,000 Hz to be Max. level in the range.

Item Description Specification

14 STMR 13 5 dB

15 Stability Margin > 6 dB

dB to ARL (dB)Level Ratio (dB)

-35 17.5

-30 22.5

-20 30.7

16 Distortion

-10 33.3

0 33.7

7 31.7

10 25.5

17 Side tone Distortion Three stage distortion < 10%

<Change> System frequency (26 MHz) tolerance

<Change> 32.768KHz tolerance

30ppm

2.5 ppm

Full power

Standby

- Normal Mode 4.0mA(Mix. power)

- Using Test mode on DSP Sleep function 6mA

20 Power consumption

< 250mA (GSM850) ; < 200mA (PCS)

21 Talk Time

GSM850/Lvl 7 (Battery Capacity 830mA):230 min GSM850/Lvl 12(Battery Capacity 830mA):380 min

Under conditions, at least 200 hours:

1. Brand new and full 740mAh battery

22 Standby Time

2. Full charge, no receive/send and keep GSM in idle mode.

3. Broadcast set off.

4. Signal strength display set at 3 level above.

5. Backlight of phone set off.

At least 80 dB under below conditions:

23 Ringer Volume 1. Ringer set as ringer.

2. Test distance set as 50 cm

24 Charge Voltage

Fast Charge : < 500 mA Slow Charge: < 60mA

Antenna Bar Number Power

5-85 dBm ~

4-90 dBm ~ -86 dBm

25 Antenna Display 3-95 dBm ~ -91 dBm

2-100 dBm ~ -96 dBm

1-105 dBm ~ -101 dBm

0 ~ -105 dBm

Item Description Specification

2. General Performance

Item Description Specification

Battery Bar Number Voltage ( 0.03V)

0 3.61V~ 3.50V

26 Battery Indicator 1 3.71V ~ 3.62V

2 3.78V ~ 3.72V

3.92V ~ 3.79V

4.2V ~ 3.93V

27 Low Voltage Warning 3.62V 0.03V (Standby)

28 Forced shut down Voltage 3.35 0.03 V

1 Li-ion Battery

29 Battery Type Standard Voltage = 3.7 V

Battery full charge voltage = 4.2 V Capacity: 830mAh

Switching-mode charger

30 Travel Charger Input: 100 ~ 240 V, 50/60Hz

Out put: 5.2V, 800mA

- 14 -

3. H/W Circuit Description

Table 3-1. The Logic and Current

VC1 CurrentVC2

GSM TX 2.4 ~ 2.8V 0V

2.4 ~ 2.8 V

0 V

8.0mA max

< 0.1mA

PCS TX

GSM/PCS RX

8.0mA max0 V

0 V

3. H/W Circuit Description

3.1. RF Circuit

The RF parts consist of a transmitter part, a receiver part, a frequency synthesizer part and a VCTCXO part. The TexasInstuments transceiver is composed of one RF chipset TRF6151C which is a quadrupleband GSM/GPRS wireless communications. This device integrates a receiver based on direct conversion architecture, a transmitter based on modulation-loop architecture, frequency synthesizing including a 26-MHzVCXO, a main N-integer synthesizer, two main VCOs, a programmable main-loop filter, two TX VCOs, a TX loop filter, voltage regulators to supply on-chip and off-chip RF functions, and a power-amplifier controller.

3.1.1. Front End Part

RF front end consists of Antenna Switch(FL502), dual band LNAs integrated in transceiver The Received RF signals(GSM 869MHz ~ 894MHz, PCS 1930MHz ~ 1990MHz) are fed into the antenna or mobile switch. An antenna matching circuit is between the antenna and the mobile switch. The Antenna Switch is used for control the Rx and Tx paths. And, the input signals VC1 and VC2 of a FL502, 1 are directly connected to baseband controller to switch either Tx or Rx path on. Ant S/W module(FL502) is an antenna switch module for dual band phone. The logic and current is given below Table 1.

RF saw filters consists of FL500, FL501. RF saw filters is Low-loss RF filter for mobile telephone GSM850 and PCS systems. Input port Unbalanced to output port balanced operation.

3. H/W Circuit Description

Figure 1. Receiver Part Block Diagram

U501/TRF6151

Baseband

(TI)

U101

U100

Calypso

Lite

FL500

Antenna Switch

LNA

FL50

SW500 Mobile Switch

0••••/ 90••••

PCS

DCS

GSM

VGA

1VGA3

DAC

Serial interface

Prescaler

64/65

A/B

Count

MAIN VCO1

MAIN VCO2

PFD

REF div

X500

VC-TCXO

26MHz

0 / 90

4: GSM

2: PCS

3.1.2. Receiver Part

• A GSM850 LNA (LNAGSM) with switchable gain

• A PCS1900 LNA (LNAPCS) with switchable gain

• Demodulators for GSM850 (MIXGSM), PCS1900 (MIXPCS) bands with programmable gain

• Two baseband amplifiers with digitally-programmable gain

• Two fully-integrated baseband channel filters

• Two dc-offset compensation systems

• A divider by 4 for LO generation in GSM850 in order to minimize dc offset generated by self- mixing

and the LO reradiation

• A divider by 2 for LO generation in PCS1900 in order to minimize dc offset generated by self-mixing

and LO reradiation

3. H/W Circuit Description

Figure 2. Transmitter Block Diagram

TX Block Diagram (GSM850+PCS1900)

U501/TRF6151

PAM

U503

RF3146

Baseband

(TI)

U101 IOTA

U100

Calypso

Lite

X500

VC-TCXO

26MHz

N Divider

MAIN VCO

Phase Comp

REF div

O · · /

90 · ·

Div

by 13

PAD

TX HB VCO

PFD

TX LB VCO

PCS

GSM

FL500

Antenna Switch

SW500 Mobile Switch

D I P

• 4

: GSM

• 2 : PCS

• 4

: GSM

• 2 : PCS

3.1.3. Synthesizer Part

• A 26-MHz VCXO with external

• A 26-MHz buffer to drive the DBBs

• Two main VCOs fully integrated

• A main N-integer synthesizer

• A programmable main loop filter

• Three voltage regulators to supply

• A digital serial interface

3.1.4. Transmitter Part

• Transceiver Transmit section:

• An offset PLL with post-IQ modulator and post-offset mixer filters fully integrated on the chip

• Two TX VCOs fully integrated on the chip

• A TX loop filter fully integrated on the chip

• A divider by 4 for local oscillator (LO) generation in GSM900 and GSM850

• A divider by 2 for LO generation in DCS1800 and PCS1900

• A programmable M divider for IF generation

• A power-amplifier controller including all the functions required to design a power-sensing control loop, except for the sensing diodes

3. H/W Circuit Description

BAND SELECT

TX ENABLE

VBATT

DCS/PCS IN

VRAMP

GSM IN

DCS/PCS OUT

GSM OUT

Full

y Integrated

Power Control Circuit

Figure 3. Power Amp Block Diagram

AFC

R504

10K

C548

X500

VCONT

GND

26MHz

VCC

OUT

1 3

0.01u

R519

100

R523

TCXOEN

C558 1u

Figure 4. VC-TCXO Circuit

3.1.5. Power Amplifier

The RF3146[U501] is a high-power, high-efficiency power amplifier module with integrated power control. The device is a self-contained 7mmx7mmx0.9mm lead frame module(LFM) with 50 input and output terminals. The power control function is also incorporated, eliminating the need for directional couplers, detector diodes, power control ASICs and other power control circuitry; this allows the module to be driven directly from the DAC output. The device is designed for use as the final RF amplifier in GSM850, EGSM900, DCS and PCS handheld digital cellular equipment and other applications in the 824MHz to 849MHz, 880MHz to 915MHz, 1710MHz to 1785MHz and 1850MHz to 1910MHz bands.

3.1.6. 26 MHz Clock

The 26 MHz clock(X500) consists of a TCXO(Temperature Compensated Crystal Oscillator) which oscillates at a frequency of 13 MHz. It is used within the TRF6151C RF Main Chip, BB Analog chipset(IOTA), Digital chip-set(Calypso Lite).

3.2. Digital Baseband(DBB) Processor

Figure 5. Top level block diagram of the Calypso lite

13 MHz

or 26 MHz TCXO

SLICER

External

ARM7

Momories

DIV-2

DPLL & CLKM

13MHz

WTDOG

INTH

MCU top-cdll

Boot Rom

Memory Protect

nit

MEMIF

Debug Unit

ARM7

I D G E

i t e

b u f .

1 Mbit SRAM

1 Mbit

SRAM

cDSP

S28C128

JTAG

DSP subchip

I D G

DMA (4+)

1NTH

RHEA bus

CRYPT

RIF

MCSI

uWIRE

ARMI

TIMER1

TIMER2

Die ID

RHEA bus

GEA

SPI

Asywchro mms WAKE_UP

ENABLE-CK13Mhz

CK 32Khs

32 Mhz CRYSTAL

Alarm

RTC

ULPD

GSM time

TPU

TSP

SIM

PWL

UART IRDA

PWT

LPG

12C

UART

modem

SK API

3. H/W Circuit Description

3.2.1. General Description

CALYPSO lite is a chip implementing the digital base-band processes of a GSM/GPRS mobile phone. This chip combines a DSP Controller core with emulation facilities (ARM7TDMIE), internal 8Kb of Boot ROM memory, 2M bit SRAM memory, a clock squarer cell, several compiled single-port or 2-ports RAM and CMOS gates. The chip will fully support the Full-Rate, Enhanced Full-Rate and Half-Rate speech coding. CALYPSO lite implements all features for the structural test of the logic (full-SCAN, BIST, PMT, 0JTAG boundary-SCAN).

sub-chip (LEAD2 CPU) with its program and data memories, a Micro- -

3. H/W Circuit Description

3.2.2. Block Description

CALYPSO lite architecture is based on two processor cores ARM7 and DSP using the generic RHEA bus standard as interface with their associated application peripherals. CALYPSO lite is composed from the following blocks:

• ARM7TDMIE : ARM7TDMI CPU core

• DSP subchip

• ARM peripherals: General purpose peripherals

• ARM Memory Interface for external RAM, Flash or ROM

• 2 Mbit Static RAM with write-buffer Application peripherals

• ARM General purposes I/O with keyboard interface and two PWM modulation signals

• UART 16C750 interface (UART_IRDA) with

- IRDA control capabilities (SIR)

- Software flow control (UART mode).

• UART 16C750 interface (UART_MODEM) with

- hardware flow protocol (DCD, CTS/RTS)

- autobaud function

• SIM Interface.

• TPU(Time Processing Unit) : Processing for GSM time base

• TSP(Time Serial Port) : GSM data interface with RF and ABB

* Calypso lite is internally 39MHz machine (25ns machine cycle), so it requires 3 wait-state for 80ns

access(25*4 = 100 ns).

3.2.3. External Devices connected to memory interface

Table 3-2. Memory interface

Device Name MakerWrite Read

Access TimeAccess Time

FLASH 1

SRAM

LCD

Melody IC

TH50VPF5683CDSB

RB187Z10A

YMU762

70ns

50ns

70ns

50ns

70ns

80ns

Toshiba

SII

Yamaha

Interface SPEC

TSP (Time Serial Port)

Resource Interconnection Description

TSPDO ABB & RF main Chip Control Data

TSPEN0 ABB ABB Control Data Enable Signal

TSPEN1 RF main Chip RF Control Data Enable Signal

TPU (Time Processing Unit) Parallel Port

TSPACT00 RESET_RF RF main Chip Reset Signal

TSPACT05 PA_ON Power Amp ON signal

Table 3-3. RF Interface Spec.

3.2.4. RF Interface (TPU, TSP block)

3. H/W Circuit Description

Calypso lite uses this interface to control Nausica_CS(ABB Processor) and Clara(RF Processor) with GSM Time Base

3.2.5. SIM interface

SIM interface scheme is shown in (Figure 6). SIM_IO, SIM_CLK, SIM_RST ports are used to communicate DBB with

ABB and the Charge Pump in

ABB enables 1.8V/3V SIM operation

SIM Interface

] SIM_CLK ------------- SIM card reference clock ] SIM_RST ------------- SIM card async/sync reset ] SIM_IO ---------------- SIM card bidirectional data line ] SIM_PWCTRL ------ SIM card power activation ] SIM_RnW ------------ SIM card data line direction ] SIM_CD -------------- SIM card presence detection

3. H/W Circuit Description

Fig

ure

SIM

Int

erfa

ABB

CARD

VDD

20K

CLK

RST

SIM_PWCTRL

SIM_IO

SIM_CLK

SIM-RST

SIM_CD

SVDO

SRST5

SIO5

SCLK5

SRST5

SIO5

SCLK5

Figure 3-4. UART Interface Spec.

UART MODEM(UART)

Resource Name Remark TX_MODEM TXD Transmit Data RX_MODEM RXD Receive Data

CTS_MODEM CTS ClearTo Sen d

RTS_MODEM RTS RequestTo

Sen

GPIO 3 DSR Data Set Ready

3.2.6. UART Interface

MG191 has two UART Drivers as follow :

- UART : Hardware Flow Control / Fax&Data Modem

I/O # I/O (2) I/O (3) I/O (4) I/O (5)

I/O #

LCD BACKLIGHT

MELODY IRQ

LED ON

DSR

SIM PWCTRL

LCD BACKLIGHT

LCD RESET

LCD BACKLIGHT

MIDI RESET

INLED R

INLED G

PCM SYNC

BHE

BLE

GPIO GPIO GPIO GPIO GPIO

GPIO GPIO GPIO GPIO GPIO GPIO GPIO

SIM

GPIO

MEMORY

HIGH HIGH LOW HIGH

HIGH LOW HIGH LOW LOW HIGH HIGH

HIGH LOW

LOW LOW HIGH LOW

LOW HIGH LOW HIGH HIGH LOW LOW

HIGH HIGH

I/O (6) I/O (7) I/O (8) I/O (9)

I/O (11) I/O (12) I/O (13) I/O (14) I/O (15)

I/O (10)

O O O O

O O

I O O

(Open) (Closed)

I/O # I/OApplication

Resource

State

Inactive

State

Active

State

Table 3-5. GPIO Map Table

3. H/W Circuit Description

3.2.7. GPIO map

In total 16 allowable resources, MG191 is using 13 resources except 3 resources dedicated to SIM and Memory. MG191 GPIO(General Purpose Input/Output) Map, describing application, I/O state, and enable level, is shown in below table.

3.3. Analog Baseband(ABB) Processor

3.3.1. General Description

IOTA is Analog Baseband (ABB)Chip supports GSM900, DCS1800, PCS, GPRS Class 10 with Digital Basband Chip(Calypso G2). IOTA processes GSM modulation/demodulation and power management operations.

Block Description

Audio Signal Processing & Interface

- Baseband in-phase(I), quadrature(Q) Signal Processing

- RF interface with DBB (time serial port)

- Supply voltage regulation

- Battery charging control

- Switch ON/OFF

- 1.8V/3V SIM card Interface

- 4 internal & 4external ADC channels

3. H/W Circuit Description

Figure 7. Audio Interace Block Diagram

HSMICP

10 dB

SLR = (8 dB + 3 dB)

AUXI

4.6 dB or

28.2 dB

MICAMP

25.6 dB

STMR = (13 dB + 5 dB)

AUXAMP

-5 dB

HSOAMP

-5 dB

DAC and Smoothing Filter 0 dB

Digital

Modulator

0 dB

PGA

Gain : 0 dB

-6 dB to 6 dB 1-dB Step

DL Filter

0 dB

Volume Control

0 dB to - 24 dB

+ Mute

3 dBm0

Full Scale

16 Bits

ADC

2.48 dB

VREF 1.75V

UL Filter

3.25 dB

PGA :

Gain : 0dB

12 dB to - 12 dB

1-dB Step

3 dBm0

Full Scale

16 Bits

1b + 1b

620 mV

RMS

365 mV

RMS

78 mV

RMS

Sensitivity

-49.3 dBv/Pa

Sensitivity

106.7 dBspl/Vrm

RLR = (2 dB + 3 dB)

32.5 mV

RMS

1.385 V

RMS

1.237 V

RMS

692 mV

RMS

346 mV

RMS

EARAMP

1 dB

Sidetone :

1 dB to - 23 dB

Mute

3.3.2. Audio Signal Processing & Interface

Audio signal processing is divided Uplink path and downlink path. The uplink path amplifies the audio signal from MIC and converts this analog signal to digital signal and then transmit it to DBB Chip. This transmitted signal is reformed to fit in GSM Frame format and delivered to RF Chip. MICBIAS is 2.0V level. The downlink path amplifies the signal from DBB chip and outputs it to Receiver(or Speaker).

3. H/W Circuit Description

Figure 8. Baseband codec Block Diagram

Output Voltage Usage

VRDBB 1.5V Digital Core of DBB

VRI O 2.8V Peripheraldevices

VRM EM 2.8V External memor y

VRRAM 2.8V LCD & peripheral devices

VRABB 2.8V Analog Block of ABB

VRSIM 2.85 SIM card driver

VRRTC 1.5V RTC & 32kHz-crystal

From TSP

From BSP

Burst

Buffer 1

Timing Control

GMSK

Modulator

6-Bit DAC

Off

set

Offset

Low-Pass

Filter

Low-Pass

Filter

BULQM

BULQP

BULIM

BULIP

16 270 kHz

6-Bit DAC

Burst

Buffer 2

270 kHz

Cosine

Ta b

Sine

Ta ble

10-Bit

DAC

10-Bit

DAC

3.3.3. Baseband Codec (BBC)

Baseband codec is composed of baseband uplink path(BUL) and baseband downlink path(BDL). BUL makes GMSK(Gaussian Minimum Shift Keying) modulated signal which has In-phase(I) component and quadrature(Q) component with burst data from DBB. This modulated signal is transmitted through RF section via air. BDL process is opposite procedure of BUL. Namely, it performs GMSK demodulation with input analog I&Q signal from RF section, and then transmit it to DSP of DBB chip with 270.833kHz data rate through BSP.

Figure 9. Power Supply Scheme

VBAT

ABB

DBB split power

VCMEM

VIMEM

VCDBB

VCIO1

VCIO2

VCABB

VBAT

VBACKUP

BBS

ABB

VRPC core

BACKUP

VCRAM

VRSIM

VRRAM

VRMEM

VDDS-MIF

VLRTC

VDD-RTC

VDDS-RTC

VDD VDDPLL

VDDS1 VDDS2

VSDBB

VRDBB

VRIO1

VRIO2

VRABB

UPR

Power split domain

RSIM

1.8/2.9V 10 mA

SIM CARD

Ext SRAM

FLASH

MEMORY

INTERFACE,

All ASIC modules,

ARM7,

LMM,

Internal SRAM

PLL

IOTA I/O,

RF I/O

13 MHz_IN

13 MHz_Out

RTC

XO32K

(IT WAKEUP,

nRESPWONZ,

ON nOFF)

RRAM

1.8/2.8V 50 mA

RMEM

1.8/2.8V

60 mA

RDBB

1.18/1.4/1.8V 120 mA

RIO

2.8V

100 mA

ABB Digital core io

ABB

Analog core

RABB

2.8V

80 mA

RRTC

1.18/1.4/1.8V 10 uA

1uF

4.7u

4.7uF

10uF

2.2uF

1uF

Sel

2.8V

Sel 1.4V

Sel 1.8V

BK SL SLP

: regulators ON in BACKUP / SLEEP / NORMAL mode : rggulators ON in SLEEP / NORMAL mode : idem SL + reverse current protection : regulators ON in NORMAL mode : reserved for ABB private use only

3. H/W Circuit Description

3.3.4. Voltage Regulation (VREG)

There are 7 LDO(Low Drop Output) regulators in ABB chip. The output of these 7 LDOs are as following table. (Figure 9) shows the power supply related locks of DBB/ABB and their interfaces in MG191.

3. H/W Circuit Description

ADC 8 channels

Resource NameDescription

VCHG VCHG

VBAT VBAT Charging Management

ICHG ICHG

VBACKUP VBACKUP Backup Battery

ADIN1 JACK_DETECT Jack plug-in detect

ADIN2 BATT_TEMP Battery Detect

ADIN3 TEMPSENSE Temperature Sensing

ADIN4 HOOK_DETECT HOOK_DETECT

Table 3-6. ADC Channel Spec.

3.3.5. ADC Channels

ABB ADC block is composed of 4 internal ADC(Analog to Digital Converter) channels and 4 external ADC channel. This block operates charging process and other related process by reading battery voltage and other analog values.

4.2V-3.93V

3.92V-3.79V

3.78V-3.72V

3.71V-3.62V

3.61V-3.50V

Figure 10. Battery Block Indication

3. H/W Circuit Description

3.3.6. Charging

Charging block in ABB processes charging operation by using VBAT, ICHG value through ADC channel. Battery Block Indication and SPEC of MG191 is as follow.

1. Charging method : CC-CV

2. Charger detect voltage : 4.2V

3. Charging time : 2h30min

4. Icon stop current : 100mA

5. Charging current : 500mA

6. CV voltage : 4.2V

7. Cutoff current : 50mA

8. Full charge indication current (icon stop current) : 100mA

9. Recharge voltage : 4.05V

10. Low battery alarm a. Idle : 3.64V b. Dedicated : 3.50V

1. Low battery alarm interval :

a. Idle : 3min b. Dedicated:1min

12. Switch-off voltage : 3.35V

13. Charging temperature adc range a. ~ -2°C : not charging operation.

C : charging.

C ~ 47

b. -2 c. 47°C~ : not charging operation.

3. H/W Circuit Description

No. Pin Name Function

1 Main_CS

2 LCD_RESET

3 A(0)

4WR

5RD

6 D(0)

7 D(1)

8 D(2)

9 D(3)

LCD Chip set

LCD Reset

Address Line

LCD Write Control

LCD Read Control

Date input

Table 3-7. LCD FPC Interface Spec.

3.3.7. Switch ON/OFF

MG191 Power State : Defined 4cases as follow

] Power-ON : mobile is powered by main battery or backup battery. ] Power-OFF : mobile isn’t any battery. ] Switch-ON : mobileis powered and waken up from switch-off state. ] Switch-OFF : mobile is powered to maintain only the permanent function(ULPD).

To enter into Switch-ON state, one of followinf 4 condition is satisfied.

] PWR-ON pushed after a debouncing time of 30ms. ] ON_REMOTE : After debouncing, when a falling edgeis detected on RPWON pin. ] IT_WAKE_UP : When a rising edge is detected on RTC_ALARM pin. ] CHARGER_IC : When a charger voltage is above VBAT+0.4V on VCHG.

3.3.8. Memory

MG191a using 64Mbit Flash + 32Mbit SRAM with 16 bit parallel data bus thru ADD01 ~ ADD22.

3.3.9. Display & FPCB Interface

LCD module include :

Main LCD: 120*64 Mono Scale LCD

Main LCD Backlight : EL-Backlight LCD module is connected to main board with 26 pin FPCB and connected to Speaker, Receiver, Vibrator.

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User Manual