LG MG185C Service Manual

Date: May, 2006 / Issue 1.0

Service Manual

MG185c

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DIGITAL IMAGE ENHANCER

Service Manual

Model : MG185c

- 3 -

1. INTRODUCTION ...............................5

1.1 Purpose .................................................. 5

1.2 Regulatory Information............................ 5

2. PERFORMANCE...............................7

2.1 Product Name ..........................................7

2.2 Supporting Standard................................7

2.3 Main Parts : GSM Solution.......................7

2.4 HW Features............................................8

2.5 S/W Features ...........................................9

3. TECHNICAL BRIEF.........................11

3.1 Baseband Part Technical Brief ..............11

3.1.1 BaseBand Components

(Component Side) ................................11

3.1.2 BaseBand Components (Keypad Side)12

3.1.3 Digital Baseband(DBB) Processor .......13

3.1.4 Analog Main Processor (ABB)..............14

3.1.5 Memory ................................................15

3.1.6 Voltage Regulation (LDO) ....................16

3.1.7 MIDI......................................................17

3.1.8 Charging...............................................18

3.1.9 KEY Back-light Illumination ..................19

3.1.10 CAMERA Interface.............................19

3.1.11 SIM.................................................... 20

3.1.12 Keypad ...............................................21

3.2 RF Part Technical Brief..........................22

3.2.1 RF Part components ............................22

3.2.2 Tx / Rx Part Description .......................23

3.2.3 Receiver Part Description.....................24

3.2.4 Transmitter Part Description.................29

4. TROUBLESHOOTING ....................32

4.1 BaseBand Part Troubleshooting............32

4.2 RF Part Troubleshooting........................65

4.3 TX Part Trouble Shooting ......................70

5. DOWNLOAD ...................................74

5.1 H/W Tool Setup......................................74

5.2 Install & Directory structure....................75

5.3 Configuration setting ..............................76

5.4 Download sequence ..............................79

6. BLOCK DIAGRAM..........................80

6.1 The Block Diagram of the

Baseband Part .......................................80

6.2 The Block Diagram of the RF Part .........81

7. Circuit Diagram ..............................83

8. pcb layout.......................................89

9. Calibration ......................................91

9.1 H/W Tool Setup......................................91

9.2 Test Jig Operation..................................92

9.3 Install & Directory structure....................94

9.4 Others Directory structure of CM_GSM .95

9.5 Cal. Procedure .......................................96

9.6 Cal. sequence ........................................97

10. EXPLODED VIEW &

REPLACEMENT PART LIST ....... 99

10.1 Exploded View .................................... 99

10.2 Replacement Parts ............................101

10.3 Accessory ......................................... 116

Table Of Contents

- 4 -

1. INTRODUCTION

- 5 -

1.1 Purpose

This manual provides the information necessary to repair, calibration, description and download the
features of this model.

1.2 Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system. There are may be risks of toll fraud
associated with your telecommunications system. System users are responsible for programming and
configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this
product is immune from the above case but will prevent unauthorized use of common-carrier
telecommunication service of facilities accessed through or connected to it.
The manufacturer will not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone
service until repair can be done. A telephone company may temporarily disconnect service as long as
repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the this phone or compatibility with the
network, the telephone company is required to give advanced written notice to the user, allowing the
user to take appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on this model must be performed only by the manufacturer or its authorized
agent. The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system
and may void any remaining warranty.

1. INTRODUCTION

1. INTRODUCTION

- 6 -

E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information
such as the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.

G. Interference and Attenuation

Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from
unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.
Following information is ESD handling:

• Service personnel should ground themselves by using a wrist strap when exchange system boards.

• When repairs are made to a system board, they should spread the floor with anti-static mat which is
also grounded.

• Use a suitable, grounded soldering iron.

• Keep sensitive parts in these protective packages until these are used.

• When returning system boards or parts like EEPROM to the factory, use the protective package as
described.

2. PERFORMANCE

- 7 -

2.1 Product Name

MG185C : GPRS Class 10

2.2 Supporting Standard

2.3 Main Parts : GSM Solution

2. PERFORMANCE

Item Feature Comment

900/1800/1900
Tri-Band (900/1800/1900)

Supporting Standard

with seamless handover
Phase 2+(include AMR)
SIM Toolkit : Class 1,2,3,A~E

GSM900 TX : 880 - 915 MHz
GSM900 RX : 925 - 960 MHz

Frequency Range

DCS1800 TX : 1710 - 1785 MHz
DCS1800 RX : 1805 - 1880 MHz
PCS1900 TX : 1850 - 1910 MHz
PCS1900 RX : 1930 - 1990 MHz

WAP 2.0

Application Standard

JAVA 2.0

Digital Baseband Calypso-AMR C035(D751992GHH)

Analog Baseband IOTA(TWL3025)

RF Chip Aero2(SI4210-GM)

- 8 -

2.4 HW Features

Item Feature Comment

Form Factor Bar Type with camera

1) Capacity

Battery

Standard :
Li-Ion, min 830mAh (LGC)

2) Packing Type : Inner Pack

Size Standard : 103.9 X 45.6 X 15.8 mm

Weight 85 g

Volume TBD

PCB One PCB:8 Layers , 1t

Stand by time 200 hrs DRX6

Charging time 3 hrs

Min : about 2.5 hrs

GSM 900MHz

Talk time

Min : about 3.0 hrs

DCS 1800MHz
PCS 1900MHz

GSM 900 : -108 dBm

RX sensitivity DCS 1800 : -107dBm

PCS 1900 : -107 dBm

GSM 900 : 33 dBm Class4 (GSM)

TX output power DCS 1800 : 30dBm

PCS 1900 : 30 dBm Class1 (PCS)

GPRS compatibility GPRS Class 10

SIM card type Plug-In SIM 3V

65K Color STN (128 X 128)

Display

Backlight : White LED

Status Indicator Indicator LED

Alphanumeric Key : 10 0 ~ 9

Keypad

Function Key : 6 Nevi. Key, Soft key, etc
Side Key : 1 camera
Total # of Keys : 22 SND, END/PWR, CLR

ANT Intenna

System connector 24 Pin

Ear Phone Jack 3 Pole (2.5mm)

PC synchronization Yes

Memory

Flash : 128 Mbit Spansion
SRAM : 64 Mbit

Speech coding FR, EFR, HR, AMR

Data & Fax Built in Data & Fax support

Vibrator Built in Vibrator

MIDI(for Buzzer Function) YAMAHA 40Poly

Voice Recording Yes

Speaker Phone Yes

Travel Adapter Yes

CDROM TBD

Options

Ear-Microphone
Data Cable

- 9 -

2.5 S/W Features

Item Feature Comment

RSSI 0 ~ 5 Levels

Battery Charging 0 ~ 4 Levels

Key Volume 0 ~ 5 Level

Audio Volume 1 ~ 5 Level

Time / Date Display Yes NITZ

Multi-Language Yes English / Spanish / France

Quick Access Mode Phone Book / My MEdia / Message /

Java or SIM Toolkit

PC Sync Schedule / Phonebook / MEMO / Photo

Speed Dial Yes (2~9) Voice mail center -> 1 key

CLIP / CLIR Yes (different melody)

Speaker Phone Yes

Phone Book 3 Numbers + 1 Memo + 1 e-mail + Total 255 Member

Group Select + Picture

Last Dial Number Yes (20)

Last Received Number Yes (20)

Last Missed Number Yes (10)

Search by Number / Name Name only

Group 7 Possible Rename

Fixed Dial Number Yes

Service Dial Number Yes

Own Number Yes

Voice Memo Yes

Call Reminder Yes

Network Selection Automatic / Manual

Mute Yes

Call Divert Yes

Call Barring Yes

Call Charge (AoC) No

Call Duration Yes

SMS (EMS) 100 EMS : Release4

(Except Text align)

E-Mail Yes Over SMS

SMS Over GPRS Yes

EMS Melody / Picture Yes

Send / Receive / Save

Long Message MAX 918 Characters

Cell Broadcast Yes

Download Over the WAP

Game Yes TBD

Calendar Yes

Memo 20

2. PERFORMANCE

- 10 -

- Some features depend on requirement.

World Clock Yes

Unit Convert Length/Surface/Volume/Weight

Tip Calculator Yes

Fax & Data Yes

Wall Paper Yes Default 5ea

WAP Browser Over WAP 2.0 w/o HTTP UP Brower 6.2.3

Download Melody /

Yes Over WAP

Wallpaper

SIM Lock Yes Operator Dependent

SIM Toolkit Class 1, 2, 3, A-E

MMS Yes Openwave MMS Client

EONS Yes

CPHS Yes V4.2

ENS Yes

Camera Yes VGA CMOS, Digital 4x

JAVA Yes

CLDC V1.1 / MIDP V2.0
Download Over WAP

Voice Dial Yes

IrDA NO

GPRS Yes Class10

Hold / Retrieve Yes

Conference Call Yes Max. 6

DTMF Yes

Memo pad Yes Yes

TTY NO

AMR Yes

3. TECHNICAL BRIEF

- 11 -

3.1 Baseband Part Technical Brief

3.1.1 BaseBand Components (Component Side)

3. TECHNICAL BRIEF

U102

X101

U101

J201

CN301

U501,U502

U202

J401

U201

U401

U602

FL501

S601

Analog Baseband Chipset (IOTA)

Digital Baseband Chipset (Calypso)

Crystal (32.768KHz Oscillator)

Melody IC (40 Poly)

Memory (128M Flash x 64M pSRAM)

EAR Jack

SIM Connector

Analog Switch (Single)

U101

U102

X101

U201

U401

J201

J401

U202

U501,U502 RF

IO ConnectorCN301

Camera ConnectorS601

3. TECHNICAL BRIEF

- 12 -

3.1.2 BaseBand Components (Keypad Side)

Dome key

Camera hot key

MIC201

3. TECHNICAL BRIEF

- 13 -

3.1.3 Digital Baseband(DBB) Processor

The Internal Architecture of the Calypso G2(HERCROM400G2)

3. TECHNICAL BRIEF

- 14 -

3.1.4 Analog Main Processor (ABB)

➢

Applications include GSM 850, 900, DCS 1800, PCS 1900 Cellular Telephones

➢

Voice Coder/Decoder (CODEC)

➢

Baseband CODEC single and multislot with I/Q RF Interface

➢

Auxiliary RF Converters

➢

SIM Card Interface

➢

Li-Ion or Ni-MH Battery Charging Control

➢

Six Low-DropOut, Low-Noise, Linear Voltage Regulators

➢

Dedicated Low Quiescent Current Mode on Regulators

➢

Voltage Detectors (with Power-Off Delays)

➢

Four Channel Analog-to-Digital Converters (ADC)

➢

Dedicated very low quiescent current domain supply

Figure 3-1. TWL3014 Functional Block Diagram

3. TECHNICAL BRIEF

- 15 -

3.1.5 Memory

➢

Memory used MG185 is designed by SPANSION

➢

Mixed Multi-Chip Package containing a 64M pSRAM and 128M Flash Memory

➢

MCP(Multi-Chip Package) Features

•

Power Supply Voltage of 2.7 to 3.1 V

•

Operating Temperature of -25˚C to 85˚C

➢

pSRAM Features

•

Organization : 4 M x 16 bits

•

Power Dissipation : 50mA max.(Operating), 100µA max.(Standby)

➢

Flash Memory Features

•

Organization : 8M x 16 bits

•

Power Consumption

- 55 mA (Read operation)

- 10uA in standby or automatic sleep mode

Block Diagram

3. TECHNICAL BRIEF

- 16 -

3.1.6 Voltage Regulation (LDO)

➢

V_DBB

•

Provides the power to the DBB(Calypso) Core

•

1.5V / 120mA max.

➢

V_RAM

•

Provides the power to the IC, MIDI, LCD, etc

•

2.8V / 50mA

➢

V_MEM

•

2.8V / 60mA max.

➢

V_ABB

•

Provides the power to the ABB(IOTA) Core

•

2.8V / 50mA max.

➢

V_IO

•

Provides the power to the Analog
S/W,Memory, etc

•

2.8V / 100mA max.

➢

V_RTC

•

Provides the power to the oscillator

•

1.5V / 30uA max.

➢

V_SIM

•

Provides the power to the SIM card

•

2.85V / 10mA max.

3. TECHNICAL BRIEF

- 17 -

3.1.7 MIDI

➢

The ringing source of MG185 is the MIDI.

➢

The MIDI chip which is used in MG185 is YMU762 from YAMAHA.

➢

YMU762 generates 40-poly MIDI sound.

3. TECHNICAL BRIEF

- 18 -

3.1.8 Charging

➢

Charging method : CC-CV

➢

Charger detect voltage : 4.0V

➢

Charging time : about 2h

➢

Icon stop current : 100mA

➢

Charging current : 420mA

➢

CV voltage : 4.2V

➢

Cutoff current : 45mA

➢

Low battery alarm

•

Idle : 3.62V

•

Dedicated : 3.50V

➢

Switch-off voltage : 3.35V

➢

Charging temperature ADC range

•

~ -5˚C : not charging operation.

•

-5˚C ~ 50˚C : charging.

•

50˚C ~ : not charging operation.

4.2V ~ 3.92V 3.91V ~ 3.79V 3.78V ~ 3.72V 3.71V ~ 3.66V 3.65V ~ 3.35V

3. TECHNICAL BRIEF

- 19 -

3.1.9 KEY Back-light Illumination (1)

➢

KEYPAD Back-light Scheme(slide part).

•

There are 12 Deep Blue LEDs in slide Board for ‘Number-key’.

•

Keypad Back-light is driven by ‘LEDB’ line from IOTA .

3.1.10 CAMERA Interface.

Allows you to use the built-in camera to take photos with the phone.

- The phone encodes up to 640 x 480 size with free size support

KEY Backlight

Built-in Camera BLOCK DIAGRAM

300

R303

300

LD302

R304

300

LD303

R305

LD304

300

R302

LEBB-S14H

LEBB-S14H

LD301

R306

300

LD305

R307

300

LD306

R308

300

LD307

R309

300

LD308

KEY BACKLIGHT

300

300

R311

R310

LD309

R351

LD310

300

300

R352

LD312

LD311

LEDB

SP301

CL761A

DBB

Camera IC

Main LCD

Camera

Sensor

3. TECHNICAL BRIEF

- 20 -

3.1.11 SIM

➢

SIM Interface
The Sim Card digital interface in ABB insures the translation of logic levels between DBB and Sim

Card, for the transmission of 3 different signals:

•

A clock derived from a clock elaborated in DBB, to the Sim-Card (DBBSCK -> SIM_CK)

•

A reset signal from DBB to the Sim Card (DBBSRST -> SIM_RST),

•

A serial data from DBB to the Sim Card (DBBSIO -> SIM_IO) and vice-versa.

The SIM card interface can be programmed to drive a 3V Sim Card.

SIM Card connection scheme

3. TECHNICAL BRIEF

- 21 -

3.1.12 Keypad (1)

➢

KEYPAD Scanning Scheme (number -key).
The power key is connected to Calypso(DBB) directly using ‘PWON’.
The other number-key and navigation-key is connected to Calypso(DBB) using:

- KBR (4:0) input pins for row lines

- KBC (4:0) output pins for column lines

Keypad Scanning Scheme

PWON

KBR(1)

KBR(2)

KBR(3)

KBR(4)

KBR(0)

KBC(0)

KBC(1)

KBC(2)

KBC(3)

KBC(4)

R301

680

EVL5M02200

VA301

EVL5M02200

VA302

R315 680

EVL5M02200

VA303

EVL5M02200

VA304

R317 680

EVL5M02200

VA305

EVL5M02200

VA306

R319 680

R320 680

R322 680

680R312

680R316

680R318

680R321

680R323

EVL5M02200

KB302

12

KB306

4

KB310

7

KB314

*

KB318

LEFT

EVL5M02200

EVL5M02200EVL5M02200

VA309

VA308

KB303

KB307

5

KB311

89

KB315

0

KB319

RIGHT

EVL5M02200

VA310

VA311VA307

KB301

POWER ON KEY

PG05DBTFCD351

CAMERA KEY

CN302

1
2
3

D351,D352 : NA

D352 PG05DBTFC

KB304

3

KB308

6

KB312

KB316

#

KB320

UP

KB305KB309

F3

F1

KB313

F2

KB317

SEND

KB321

DOWN

3. TECHNICAL BRIEF

- 22 -

3.2 RF Part Technical Brief

3.2.1 RF Part components

➢

SW501 : Mobile Switch

➢

FL501 : YGHF-S006A

-

FEM

➢

U501 : TQM7M4006

-

Power Amp Module

➢

U502 : SI4210

-

RF Main chip

➢

X501

-

VCTCXO

-

26MHz Clock

SW501

FL501

U501

X501

U502

3. TECHNICAL BRIEF

- 23 -

3.2.2 Tx / Rx Part Description(2)

2. Tx/Rx Part component Description

→ VCTCXO

➢

VCTCXO

-

Produce RF reference clock ­26MHz frequency

3. Tx/Rx Part component Description

→ RF Main Chip (SI4210)

➢

PDNB, _S_EN, S_CLK, S_DATA

-

From DBB Main Chip Set

-

Contains information all about ARFCN, voice
data, user information etc.

-

RF Chips operate according to these signals

X501

26MHz frequency output

U502

S_CLK

(1pin)

_S_EN

(2pin)

S_DATA

(3pin)

PDNB
(9pin)

3. TECHNICAL BRIEF

- 24 -

3.2.3 Receiver Part Description(1)

1. Rx Block Diagram

BASE BAND

SI-4210

RXIN

RXIP

DAC

ADC

PGA

PGA

RXQN

RXQP

DAC

Channel Filter

ADC

AFC

PDNB

S_EN

S_CLK

S_DATA

26MHz TCXO

TCXO OUT

RX/TX Freq. PLAN

RX GSM900 [925.2 ~ 959.8 MHz]

RX DC1800 [1805.2 ~ 1879.8 MHz]

RX PCS1900 [1930.2 ~ 1989.8 MHz]

Low IF

Rx PCS (1900)

SYNTHESIZER

VCO + FREQUENCY

Rx DCS(1800)

Off

Off

Off

Off

Off

On

GSM900 : 925.2~959.8 MHz

DCS1800 : 1805.2~1879.8 MHz

PCS1900 : 1930.2~1989.8 MHz

MOBILE

SWITCH

/ 2

∏

KMS-507

ANTENNA SWITCH

On

Off

Off

Rx GSM

(900)

RX BAND SELECTION PLAN

MG185c

ANT_SW2

ANT_SW3

ANT_SW1

ANT_SW3

ANT_SW2

ANT_SW1

3. TECHNICAL BRIEF

- 25 -

Receiver Part Description( 2)

2. Rx Part component Description

→ Mobile Switch & FEM

➢

FEM (including Ant. SW & SAW filter)

-

Select the Path - GSM / DCS Tx, GSM / DCS
Rx

-

From DBB, three control signals
(ANT_SW1, ANTSW2, ANTSW3)

FL501

MG185d

Tx

(900

Tx

)

(1800/1900)

Rx GSM
(900)

OnOnANT_SW1

OnOffANT_SW2

OnOffANT_SW3

GSM 900 :Rx Path
DCS : Rx Path
PCS : Rx Path
GSM / PCS Rx Path

Off

On

Off

Rx DCS
(1800)

Off

Off

On

Rx PCS
(1900)

Off

Off

Off

3. TECHNICAL BRIEF

- 26 -

Receiver Part Description(3)

3. Rx Part component Description

→ FEM (BSF Output)

➢

Band Selection Filter

-

Cuts the out of band frequency

FL501

BSF

U502

RF

For GSM : 925MHz 960MHz
For DCS : 1805MHz 1880MHz
For PCS : 1930MHz 1990MHz

LNA

Insertion Loss
For GSM : ~-2.5dB
For DCS : ~-3dB

f

3. TECHNICAL BRIEF

- 27 -

Receiver Part Description(4)

2. Rx Part component Description

→ RF Transceiver Chip (LNA Input)

➢

LNA input port of RF Main Chip(SI4210)

-

Balanced-type LNA Input

FL501

GSM900 LNA Input

U502

DCS LNA Input

PCS LNA Input

BSF

Matching

RF

Circuit

LNA

SI4210

3. TECHNICAL BRIEF

- 28 -

Receiver Part Description(5)

2. Rx Part component Description

→ Rx I/Q signal (SI4210)

U502

RXQN RXQP RXIN RXIP

3. TECHNICAL BRIEF

- 29 -

3.2.4 Transmitter Part Description(1)

1. Tx Block Diagram

BASE BAND

SI-4210

TXIN

Divider

TXIP

DET

2, 4

÷

TXQN

TXQP

AFC

XOUT

26MHz TCXO

TX Freq. PLAN

TCXO OUT

TX GSM900 [880.2 ~ 914.8 MHz]

TX DCS [1710.2 ~ 1784.8 MHz]

TX PCS [1850.2 ~ 1909.8 MHz]

/ 2

÷

OnOnPA_ON

OnOffPA_BAND

High_BandLow Band

OnOffANT_SW2

OnOffANT_SW3

OnOnANT_SW1

SYNTHESIZER

VCO + FREQUENCY

Tx (1800/1900)Tx (900)MG185c

TX BAND SELECTION PLAN

PAM

Triquint

AMP

TQM7M4006

EGSM

MOBILE

SWITCH

KMS-507

VBAT

APC

PA_ON

PA_BAND

DCS/PCS

ANTENNA SWITCH

ANT_SW3

ANT_SW2

ANT_SW1

Transmitter Part Description(2)

2. Tx Part component Description

→ Tx I/Q signal from ABB signal

Transmitter Part Description(3)

2. Tx Part component Description

→ PAM - input and output signals

- 30 -

3. TECHNICAL BRIEF

U502

TXQP TXQN TXIN TXIP

PAM

U501

GSM
OUT

PCS
IN

PCS
OUT

VBAT

GSM

IN

➢

Power Amp Module

-

Amplifies Tx Signal from SI4210

➢

Tx Carrier Frequency

-

GSM : 880 ~ 915MHz

-

DCS : 1710 ~ 1785MHz

-

PCS : 1850 ~ 1910MHz

3. TECHNICAL BRIEF

- 31 -

Transmitter Part Description(4)

2. Tx Part component Description

→ PAM - control signals

Transmitter Part Description(5)

2. Tx Part component Description

→ Mobile Switch & FEM

➢

PA_ON

- From DBB Chip Set

-

Enables Tx Path

➢

PA_Band

-

From DBB Chip Set

-

Select PAM operating band

-

Low : GSM selected

-

High : DCS selected

➢

APC

-

From ABB Chip Set

-

Controls Tx rising and falling shape

- APC voltage Controls Tx Output Power

GSM Tx Path (FEM 6 pin)

DCS/PCS Tx Path (FEM 8 pin)

Tx Path

➢

FEM

-

Select the Path - GSM / DCS Tx, GSM / DCS Rx

-

From DBB, three control signals (ANT_SW1,
ANTSW2, ANTSW3) are fed into the DBB

PAM

U501

PA
BAND(3pin)

PA
ON

APC