LG M2380A Schematic

LCD MONITOR TV

SERVICE MANUAL

CAUTION

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CHASSIS : LP92E

MODEL : M2380A

M2380A-PMM

North/Latin America http://aic.lgservice.com Europe/Africa http://eic.lgservice.com Asia/Oceania http://biz.lgservice.com

Internal Use Only

P/NO : MFL63261609(1007-REV00) Printed in Korea

Only for training and service purposes

CONTENTS

CONTENTS .............................................................................................. 2

PRODUCT SAFETY ..................................................................................3

SPECIFICATION ........................................................................................6

ADJUSTMENT INSTRUCTION ...............................................................13

TROUBLE SHOOTING ............................................................................18

BLOCK DIAGRAM...................................................................................32

EXPLODED VIEW .................................................................................. 33

SVC. SHEET ...............................................................................................

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Only for training and service purposes

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PRECAUTION

WARNING FOR THE SAFETY-RELATED COMPONENT.

• There are some special components used in LCD monitor that are important for safety.

These parts are

marked on the schematic diagram and the Exploded View It is essential that these critical parts

should be replaced with the manufacturer’s specified parts to prevent electric shock, fire or other hazard.

• Do not modify original design without obtaining written permission from manufacturer or you will void the original parts and labor guarantee.

TAKE CARE DURING HANDLING THE LCD MODULE WITH BACKLIGHT UNIT.

• Must mount the module using mounting holes arranged in four corners.

• Do not press on the panel, edge of the frame strongly or electric shock as this will result in damage to the screen.

• Do not scratch or press on the panel with any sharp objects, such as pencil or pen as this may result in damage to the panel.

• Protect the module from the ESD as it may damage the electronic circuit (C-MOS).

• Make certain that treatment person’s body are grounded through wrist band.

• Do not leave the module in high temperature and in areas of high humidity for a long time.

• The module not be exposed to the direct sunlight.

• Avoid contact with water as it may a short circuit within the module.

• If the surface of panel become dirty, please wipe it off with a soft material. (Cleaning with a dirty or rough cloth may damage the panel.)

WARNING

BE CAREFUL ELECTRIC SHOCK !

• If you want to replace with the new backlight (CCFL) or inverter circuit, must disconnect the AC adapter because high voltage appears at inverter circuit about 650Vrms.

• Handle with care wires or connectors of the inverter circuit. If the wires are pressed cause short and may burn or take fire.

Leakage Current Hot Check Circuit

• Replaceable batteries

* CAUTION RISK OF EXPLOSION IF BATTERY IS REPLACED BY AN INCORRECT TYPE. DISPOSE OF USED BATTERIES ACCORDING TO THE INSTRUCTIONS

CAUTION

Please use only a plastic screwdriver to protect yourself from shock hazard during service operation.

Ω

0.15uF

AC Volt-meter

Good Earth Ground such as WATER PIPE,

To Instrument's exposed METALLIC PARTS

When 25A is impressed between Earth and 2nd Ground for 1 second, Resistance must be less than 0.1

*Base on Adjustment standard

1.5 Kohm/10W

CONDUIT etc.

Only for training and service purposes

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CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the

following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or re-connecting any receiver electrical plug

or other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its assemblies.

4. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) is opropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

8. Use with this receiver only the test fixtures specified in this

service manual.

CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the

unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500ºF to 600ºF.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature.

(500ºF to 600ºF) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature

(500ºF to 600ºF)

b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

SERVICING PRECAUTIONS

Only for training and service purposes

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IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

Only for training and service purposes

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SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

4. Module Specification

LGD, LM230WF5-TLA3

1. Application Range.

This spec sheet is applied to the 58 cm(23 inch) LCD Monitor TV used LP92E chassis.

2. Specification

Each part is tested as below without special appointment

2.1 Temperature : 25 °C ± 5 °C (77 °F ± 9 °F), CST : 40 °C ± 5° C

2.2 Relative Humidity : 65 % ±10 %

2.3 Power Voltage : Standard input voltage

(100 V - 240 V ~, 50 / 60 Hz)

• Standard Voltage of each products is marked by models

2.4 Specification and performance of each parts are followed

each drawing and specification by part number in accordance with BOM .

2.5 The receiver must be operated for about 5 minutes prior to

the adjustment.

3. Test method

3.1 Performance : LGE TV test method followed.

3.2 Demanded other specification Safety : CE, IEC specification EMC : CE, IEC

Safety : IEC/EN60065 EMI : EN55013 EMS : EN55020

No Item Specification Unit Remark

1 Type TFT Color LCD Module

2 Diagonal Size 584.2mm (23 inche) diagonal

3 Active Display area 509.184(H) x 286.416(V) mm

4 Outline Dimension 533.2(H) x 312.0(V) x 11.5(D) mm Typ.

5 Aspect Ratio 16:9

6 Pixel Number 1920 x RGB x 1080 pixel pixel

7 Pixel Pitch 0.265(H) x 0.265(V) mm

8 Color arrangement RGB vertical Stripe

9 Color Depth 16.7M color (8bit with A-FRC)

10 Electrical Interface LVDS 2port

11 Surface Treatment Hard coating(3H) & Anti-glare(Haze 25)

12 Operating Mode Normally White

13 Backlight Unit WHITE LED (2 CHANNEL)

14 Response Time Rising Time : 1.3 + Falling Time : 3.7 ms Typ.

15 Color Gamut Normal 68% Panel(CIE1931)

5. General Specification

5.1 TV

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Only for training and service purposes

No Item Specification Remarks

1 Market Central and South America

2 Broadcasting system NTSC

PAL-M

PAL-N

BAND NTSC

3 Receiving system VHF 2 ~ 13

UHF 14 ~ 69

CATV 1 ~ 125

4 Receiving system Upper Heterodyne

5 Component Input (1EA) Y/Cb/Cr

Y/Pb/Pr

6 CVBS Input (1EA) PAL, SECAM, NTSC 4 System(Rear) :PAL50, SECAM, NTSC, PAL60

7 RGB Input RGB-PC Analog(D-SUB 15Pin)

8 HDMI Input (1EA) HDMI1-DTV/PC HDMI version 1.3 , Support HDCP

9 Audio Input (3EA) RGB-PC/ DVI Audio

Component L/R Input

CVBS

10 Earphone out (1EA) Antenna, AV, Component,

RGB-PC, HDMI1

No Item Specification Remarks

1 Supported Sync. Type Separate Sync.(RGB), Digital(DVI)

2 Operating Frequency Analog Horizontal 30 ~ 69kHz

Vertical 56 ~ 61 Hz

Digital Horizontal -

Vertical -

3 Resolution Analog Max. 1600x900 @ 60Hz M2080A

Recommend 1600x900 @ 60Hz

Max. 1920x1080 @ 60Hz M2280A / M2380A/

Recommend 1920x1080 @ 60Hz M2380AF

4 Input Voltage Voltage :100 – 240 Vac, 50 or 60Hz

5 Inrush Current Cold Start : 50 A Hot : 120 A

6 Operating Condition Sync (H/V) Video LED Wattage

Power S/W On On Typ. On/On Active Blue 48W

mode Max On/On Active Blue 33W M2380A

Typ. On/On Active Blue 58W

Max On/On Active Blue 33W M2380AF

Sleep mode Off/On

Off Blanking 1W RGB

On/Off

Power S/W Off Off mode - Off Off 0.5W

Just operate power key

and remote controller power button

7 MTBF 30,000 HRS with 50% compared to that of initial value LED Life Time

at the typical LED current on condition

8 Using Altitude 5,000 m (for Reliability) 3,000m(for FOS)

9 Operating Environment Temp : 10°C ~ 35°C

Humidity : 20 % ~ 80 %

10 Storage Environment Temp : -10°C~60°C non condensing

Humidity : 5 % ~ 90 % non condensing

Only for training and service purposes

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5.2 RGB - PC

Only for training and service purposes

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6. Chroma & Brightness

* Optical Test Condition

- Surrounding Brightness Level : dark

- Surrounding Temperature : 25 °C ± 5 °C

- warm-up Time : 30 min

- Contrast, Brightness : Outgoing condition

- *Incase of Vivid Mode, high level saturation may be occurred. Check gray linearity at standard mode.

* Active area

1. Active area of LCD PANEL is in bezel of cabinet.

2. Interval between active area and bezel |A-B|<1.0 mm , |C-D|<1.0 mm A: Interval between left of active area and bezel B: Interval between right of active area and bezel C: Interval between top of active area and bezel D: Interval between bottom of active area and bezel

Active Area

Bezel

No. Item Specification Min. Typ. Max. Remark

1 Viewing Angle[CR>10] Right/Left 70/70 85/85 - CR >10

Up/Down 60/70 75/85

2 Luminance Luminance (cd/m

) 200 250 -

Variation(%) 75 Min/ Max

3 Contrst Ratio CR 700 1000

Full white/Full black

4 Color Coordinates [CIE1931] White W

0.313

Typ. 0.329 Typ.

RED R

-0.03 0.628 +0.03 RGB

0.348 Vivid, 6500K

Green G

0.345

Full white(100IRE)

0.615

Blue B

0.153

0.057

5 Response Time(ms) Rise Time TrR 1.3 2.6

Condition : DVI

or RGB

Decay Time TrD 3.7 7.4

Standard, Backlight100

No Item module Min Typ Max Remark

1 20/22/23 inch

4,000,000:1 5,000,000:1 PC Mode(D-sub) For Checking Black Luminance,

wait for over 1 minute.

Only for training and service purposes

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8. Component Video Input (Y, PB, PR)

7. SET Optical Feature

7.1 PC Mode (Measurement Condition: Full white/ Standard/6500k) ? Measure the black luminance after 30 seconds.)

No Item module

Luminance (cd/m

) C/R(min)

Remark

Min Typ Max Min Typ

1 20/22/23 inch LGD 200 230 - 500:1 700:1

RGB

DFC 5,000,000:1

No.

Specification

Remark

Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz)

1. 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I)

2. 720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I)

3. 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz

4. 720*480 31.47 59.94 27.000 SDTV 480P

5. 720*480 31.50 60.00 27.027 SDTV 480P

6. 720*576 31.25 50.00 27.000 SDTV 576P 50Hz

7. 1280*720 44.96 59.94 74.176 HDTV 720P

8. 1280*720 45.00 60.00 74.250 HDTV 720P

9. 1280*720 37.50 50.00 74.25 HDTV 720P 50Hz

10. 1920*1080 33.72 59.94 74.176 HDTV 1080I

11. 1920*1080 33.75 60.00 74.250 HDTV 1080I

12. 1920*1080 28.125 50.00 74.250 HDTV 1080I 50Hz,

13. 1920*1080 56.25 50 148.5 HDTV 1080P

14. 1920*1080 67.432 59.94 148.350 HDTV 1080P

15. 1920*1080 67.5 60.00 148.5 HDTV 1080P

7.3 Special feature(DFC)

-DFC Working Condition : Full Black Pattern(All Black, No pattern(MSPG Pattern#2)) signal in D-sub

No Item

Luminance(cd/m

) C/R(min)

Remark

Typ Max RF,AV,COMPONENT,HDMI

1 20 inch 170 200 500:1 RF, AV, COMPONENT, HDMI

2 22 inch 170 200 500:1

3 23 inch 170 200 500:1

7.2 AV Mode (Measurement Condition: Full white(100IRE)/ Vivid) ? Measure the black luminance after 30 seconds.

Only for training and service purposes

- 11 -

9. RGB Input ( PC )

No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Remark

1 640*480 31.469 59.94 25.175

2 800*600 37.879 60.317 40.0

3 1024*768 48.363 60.0 65.0

4 1152*864 54.34 60.05 80

5 1280*960 60 60 108.0

6 1280*1024 63.981 60.02 108.0

7 1680*1050 64.674 59.883 119.0

8 1680*1050 65.290 59.954 146.25

9 1920*1080 67.5 60 148.5

10. HDMI Input (DTV)

No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Proposed

1 720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I)

2 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I)

3 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz

4 7Z20*480 31.47 59.94 27.000 SDTV 480P

5 720*480 31.50 60.00 27.027 SDTV 480P

6 720*576 31.25 50.00 27.000 SDTV 576P 50Hz

7 1280*720 44.96 59.94 74.176 HDTV 720P

8 1280*720 45.00 60.00 74.250 HDTV 720P

9 1280*720 37.50 50.00 74.25 HDTV 720P 50Hz

10 1920*1080 33.72 59.94 74.176 HDTV 1080I

11 1920*1080 33.75 60.00 74.250 HDTV 1080I

12 1920*1080 28.125 50.00 74.250 HDTV 1080I 50Hz

13 1920*1080 67.432 59.94 148.350 HDTV 1080P

14 1920*1080 67.5 60 148.5 HDTV 1080P

15 1920*1080 56.250 50 148.5 HDTV 1080P 50Hz

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Only for training and service purposes

11. Mechanical specification

No. Item Content Unit Remark

1. Product Width(W) Length(D) Height(H) mm

Dimension Before Packing 560.8 193.2 427 mm

After Packing 651 456 161 mm

2. Product Only SET 5.6 Kg

Weight With BOX 7.4 Kg

3. Container Individual or 20ft 40ft

Loading Palletizing Indi. Wooden Indi. Wooden

Quantity 630 520 1260 1144

4. Stand

Type Detachable ( Base detachable)

Assy

Size(W x D x H) 271.2x 193.2x 108.4

Tilt Degree -5~15 degree

Tilt force 0.8~3.5kgf

Swivel Degree

none

Swivel Force

5. Appearance General Refer to Standard of LG(55)G1-1020

*Appearance Gap spec

Front: 0.5 mm

Back & Bottom : 1.0 m

Only for training and service purposes

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ADJUSTMENT INSTRUCTION

1. Application

This document is applied to LP92E chassis LCD Monitor TV which is manufactured in Monitor Factory or is produced on the basis of this data.

2. Designation

1) The adjustment is according to the order which is designated and which must be followed, according to the plan which can be changed only on agreeing.

2) Power Adjustment: Free Voltage

3) Magnetic Field Condition: Nil.

4) Input signal Unit: Product Specification Standard

5) Reserve after operation: Above 5 Minutes (Heat Run)

Temperature : at 25 °C ± 5 °C Relative humidity : 65% ±10 % Input voltage : 220V, 60Hz

6) Adjustment equipment: Color Analyzer (CA-210 or CA-

110), Pattern Generator (MSPG-925L or Equivalent), DDC Adjustment Jig equipment, SVC remote controller

3. Adjustment items

PCB assembly adjustment items

1) Download the MSTAR main software (IC603, Mstar ISP Utility)

2) Auto Color Balance(ADC) - RGB

3) Auto Color Balance(ADC) – Component

4) Input Tool-Option/Area option.

5) Check SW Version.

SET assembly adjustment items

1) DDC Data input.

2) HDCP data input

3) Adjustment of White Balance.

4) Preset CH information

5) Factoring Option Data input.

PCB assembly adjustment method

4.1 Input Tool-Option, Area Option

Option adjustment following BOM (Tool Option 1, Area Option) * Required Equipments

- Remote controller for adjustment

* Profile : Must be changed the option value because being

different with some setting value depend on module maker, inch and market.

Adjustment method

The input methods are same as other chassis.(Use IN-START Key on the Adjust Remocon.)

1) Push the IN-START key in the Adjust R/C.

2) Input the Option Number that was specified in the BOM, into the Shipping area.

3) Select “Tool Option/ Area Option” by using

E/D(CH+/-) key

, and press the number key(0~9) consecutively

ex) If the value of Tool Option1 is 7, input the data using

number key “7” (If not changed the option, the input menu can differ from the model spec.) * Refer to Job Expression of each main chassis ass’y

(EBTxxxxxxxx) for Option value

* Before PCB check, you have to change the Tool option,

Areaoption and have to AC off/on (Plug out and in) (If missing this process, set can operate abnormally) * Never push the IN-STOP KEY after completing the function

inspection.

4.2 S/W program download (Using MSTAR Download program)

Profile : This is for downloading the s/w to the flash memory of IC603

Equipment

1) PC

2) ISP_tool program

3) Download jig

Connection structure Connection condition

1) IC name and circuit number : Flash Memory and IC603

2) Use voltage : 3.3V (5 pin)

3) SCL : 15 pin

4) SDA : 12 pin

5) Tact time : about 2min

LW91A LPL L22FHD Main V1.00 HDCP 0 UTT XX

Tool Option 1 37000 Tool Option 2 112 Area Option 20

4.2.1 Preliminary steps

(1) Download method 1 (PCB Assy)

(2) Connect the download jig to D-sub jack

4.2.2 Download Steps

(1) Execute ‘ISP Tool’ program in PC, then a main window will

be opened

(2) Click the connect button and confirm “Dialog Box”.

(3) Click the Config button and Change speed E2PROM Device setting : over the 350Khz

(4) Read and write bin file

Click ”(1)Read” tab, and then load download file(XXXX.bin) by clicking “Read”.

(5) Click “Auto(2)” tab and set as below (6) click “Run(3)”. (7) After downloading, check “OK(4)” message.

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Only for training and service purposes

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