LG LX-EM530A Diagram

- 1-1 -

[CONTENTS]

❍ SECTION 1. GENERAL

• SERVICING PRECAUTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2

• ESD PRECAUTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4

❍ SECTION 2. TROUBLESHOOTING

• ADJUSTMENTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1

• TROUBLESHOOTING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2

• WAVEFORMS OF MAJOR CHECK POINT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-11

• BLOCK DIAGRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-21

• SCHEMATIC DIAGRAMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-23

• WIREING DIAGRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-29

• PRINTED CIRCUIT BOARD DIAGRAMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-31

• INTERNAL BLOCK DIAGRAM OF ICs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-41

❍ SECTION 3. EXPLODED VIEWS

• CABINET AND MAIN FRAME SECTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1

❍ SECTION 4. SPEAKER

• SPEAKER PART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1

❍ SECTION 5. REPLACEMENT PARTS LIST

• REPLACEMENT PARTS LIST . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1

- 1-2 -

SECTION 1. GENERAL

❏ SERVICING PRECAUTIONS

NOTES REGARDING HANDLING OF THE PICK-UP

1. Notes for transport and storage

1) The pick-up should always be left in its conductive bag until immediately prior to use.

2) The pick-up should never be subjected to external pressure or impact.

2. Repair notes

1) The pick-up incorporates a strong magnet, and so should never be brought close to magnetic materials.

2) The pick-up should always be handled correctly and carefully, taking care to avoid external pressure and
impact. If it is subjected to strong pressure or impact, the result may be an operational malfunction and/or
damage to the printed-circuit board.

3) Each and every pick-up is already individually adjusted to a high degree of precision, and for that reason
the adjustment point and installation screws should absolutely never be touched.

4) Laser beams may damage the eyes!
Absolutely never permit laser beams to enter the eyes!
Also NEVER switch ON the power to the laser output part (lens, etc.) of the pick-up if it is damaged.

5) Cleaning the lens surface
If there is dust on the lens surface, the dust should be cleaned away by using an air bush (such as used
for camera lens). The lens is held by a delicate spring. When cleaning the lens surface, therefore, a cotton
swab should be used, taking care not to distort this.

6) Never attempt to disassemble the pick-up.
Spring by excess pressure. If the lens is extremely dirty, apply isopropyl alcohol to the cotton swab. (Do
not use any other liquid cleaners, because they will damage the lens.) Take care not to use too much of
this alcohol on the swab, and do not allow the alcohol to get inside the pick-up.

Storage in conductive bag

Drop impact

NEVER look directly at the laser beam, and don’t let
contact fingers or other exposed skin.

Magnet

How to hold the pick-up

Conductive Sheet

Cotton swab

Pressure

Pressure

- 1-3 -

NOTES REGARDING COMPACT DISC PLAYER REPAIRS

1. Preparations

1) Compact disc players incorporate a great many ICs as well as the pick-up (laser diode). These components
are sensitive to, and easily affected by, static electricity. If such static electricity is high voltage, components
can be damaged, and for that reason components should be handled with care.

2) The pick-up is composed of many optical components and other high-precision components. Care must be
taken, therefore, to avoid repair or storage where the temperature of humidity is high, where strong magnet­ism is present, or where there is excessive dust.

2. Notes for repair

1) Before replacing a component part, first disconnect the power supply lead wire from the unit

2) All equipment, measuring instruments and tools must be grounded.

3) The workbench should be covered with a conductive sheet and grounded.
When removing the laser pick-up from its conductive bag, do not place the pick-up on the bag. (This is
because there is the possibility of damage by static electricity.)

4) To prevent AC leakage, the metal part of the soldering iron should be grounded.

5) Workers should be grounded by an armband (1M Ω)

6) Care should be taken not to permit the laser pick-up to come in contact with clothing, in order to prevent sta­tic electricity changes in the clothing to escape from the armband.

7) The laser beam from the pick-up should NEVER be directly facing the eyes or bare skin.

CLEARING MALFUNCTION

You can reset your unit to initial status if malfunction occur(button malfunction, display, etc.).
Using a pointed good conductor(such as driver), simply short the RESET jump wire on the inside of
the volume knob for more than 3 seconds.
If you reset your unit, you must reenter all its settings(stations, clock, timer)

NOTE: 1.To operate the RESET jump wire, pull the volume rotary knob and release it.

2. If you wish to operate the RESET jump wire, it is necessary to unplug the power cord.

Resistor
(1 Mohm)

Conductive
Sheet

Resistor
(1 Mohm)

Armband

RESET jump wire

VOLUME

VOLUME KNOB

DOWN

UP

- 1-4 -

❏ ESD PRECAUTIONS

Electrostatically Sensitive Devices (ESD)

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive Devices (ESD). Examples of typical ESD devices are integrated
circuits and some field-effect transistors and semiconductor chip components.The following techniques should
be used to help reduce the incidence of component damage caused by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off

any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a
commercially available discharging wrist strap device, which should be removed for potential shock reasons
prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ESD devices, place the assembly on a conductive sur-

face such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ESD devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static" can

generate electrical charges sufficient to damage ESD devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ESD

devices.

6. Do not remove a replacement ESD device from its protective package until immediately before you are

ready to install it. (Most replacement ESD devices are packaged with leads electrically shorted together by
conductive foam, aluminum foil or comparable conductive materials).

7. Immediately before removing the protective material from the leads of a replacement ESD device, touch the

protective material to the chassis or circuit assembly into which the device will by installed.

CAUTION : BE SURE NO POWER IS APPLIED TO THE CHASSIS OR CIRCUIT, AND OBSERVE ALL

OTHER SAFETY PRECAUTIONS.

8. Minimize bodily motions when handing unpackaged replacement ESD devices. (Otherwise harmless motion

such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can gen­erate static electricity sufficient to damage an ESD device).

CAUTION. GRAPHIC SYMBOLS

THE LIGHTNING FLASH WITH APROWHEAD SYMBOL. WITHIN AN EQUILATERAL TRIANGLE,
IS INTENDED TO ALERT THE SERVICE PERSONNEL TO THE PRESENCE OF UNINSULATED
“DANGEROUS VOLTAGE” THAT MAY BE OF SUFFICIENT MAGNITUDE TO CONSTITUTE A
RISK OF ELECTRIC SHOCK.

THE EXCLAMATION POINT WITHIN AN EQUILATERAL TRIANGLE IS INTENDED TO ALERT
THE SERVICE PERSONNEL TO THE PRESENCE OF IMPORTANT SAFETY INFORMATION IN
SERVICE LITERATURE.

- 2-1 -

SECTION 2. ELECTRICAL SECTION

❏ ADJUSTMENTS

This set has been aligned at the factory and normally will not require further adjustment. As a result, it is
not recommended that any attempt is made to modificate any circuit. If any parts are replaced or if any­one tampers with the adjustment, realignment may be necessary.

IMPORTANT

1. Check Power-source voltage.

2. Set the function switch to band being aligned.

3. Turn volume control to minimum unless otherwise noted.

4. Connect low side of signal source and output indicator to chassis ground unless otherwise specified.

5. Keep the signal input as low as possible to avoid AGC and AC action.

TAPE DECK ADJUSTMENT

- 2-2 -

• CD PART

❏ TROUBLESHOOTING

- 2-3 -

• OPEN CLOSE NG

- 2-4 -

• “ READING ” DISPLAY CHECK

(= ONLY “CD “DISPLAY)

- 2-5 -

• READING OK CHECK

(= “NO DISC” DISPLAY)

- 2-6 -

• READING OK CHECK #A

(= “NO DISC” DISPLAY)

- 2-7 -

• READING OK CHECK #B

(= “NO DISC” DISPLAY)

- 2-8 -

• READING OK CHECK #C

(= “NO DISC” DISPLAY)

- 2-9 -

• READING OK CHECK #D

(= “NO DISC” DISPLAY)

- 2-10 -

• READING OK CHECK #E

(= “NO DISC” DISPLAY)

- 2-11 -

❏ WAVEFORMS OF MAJOR CHECK POINT

TP561

- 2-12 -

- 2-13 -

❏ AUDIO PART

- 2-14 -

- 2-15 -

- 2-16 -

- 2-17 -

- 2-18 -

- 2-19 -

- 2-20 -

MEMO

❏ BLOCK DIAGRAM

2-21 2-22

2-23 2-24

❏ SCHEMATIC DIAGRAMS

• MAIN SCHEMATIC DIAGRAMS

2-25 2-26

• FRONT/POWER SCHEMATIC DIAGRAM

2-27 2-28

• CDP SCHEMATIC DIAGRAM

2-29 2-30

❏ WIRING DIAGRAM

2-31 2-32

❏ PRINTED CIRCUIT BOARD DIAGRAMS

• MAIN P.C. BOARD(SOLDER SIDE)

2-33 2-34

• MAIN P.C. BOARD(COMPONENT SIDE)

2-35 2-36

• FRONT/POWER P.C. BOARD (SOLDER SIDE)

2-37 2-38

• FRONT/POWER P.C. BOARD (COMPONENT SIDE)

2-39 2-40

• CD P.C. BOARD (SOLDER SIDE) • CD P.C. BOARD (COMPONENT SIDE)

- 2-41 -

❏ INTERNAL BLOCK DIAGRAM OF ICs

■ KIA6225P/S (IC201)

BIPOLAR LINEAR INTEGRATED CIRCUIT

■ STK403-070(IC701)

Equivalent Block Diagram

- 2-42 -

■ BA3126N (IC202)

2-channel head switch for radio cassette recoreders

■ BA3308 (IC203)

Dual preamplifier with ALC

• Internal circuit configuration

- 2-43 -

■ IC501 MN6627933

1) PORT ASSIGNMENT

- 2-44 -

2) Block Diagram

- 2-45 -

3) PORT DESCRIPTION

Pin No. Symbol I/O Function

1 D11 I/O DRAM data signal I/O 11
2 D10 I/O DRAM data signal I/O 10
3 D9 I/O DRAM data signal I/O 9
4 D8 I/O DRAM data signal I/O 8
5 UDQM O SDRAM upper byte data mask signal output
6 SDRCK O SDRAM clock signal output
7 A11 O DRAM address signal output 11
8 A9 O DRAM address signal output 9
9 A8 O DRAM address signal output 8
10 A7 O DRAM address signal output 7
11 A6 O DRAM address signal output 6
12 A5 O DRAM address signal output 5
13 A4 O DRAM address signal output 4
14 LDQM O SDRAM lower byte data mask signal output
15 NWE O DRAM write enable signal output
16 NCAS O DRAM CAS control signal output
17 NRAS O DRAM RAS control signal output
18 NCS O SDRAM chip select signal output
19 A3 O DRAM address signal output 3
20 A2 O DRAM address signal output 2
21 A1 O DRAM address signal output 1
22 A0 O DRAM address signal output 0
23 DRVDD1 I Power supply 1 for DRAM interface I/O
24 DVSS1 I Ground 1 for digital circuits
25 A10 O DRAM address signal output 10
26 *BA1 O SDRAM bank selection signal output 1
27 *BA0 O SDRAM bank selection signal output 0
28 DVDD1 I Power supply 1 for internal digital circuits
29 SPOUT O Spindle drive signal output (absolute value)
30 *SPPOL O Spindle drive signal output (polarity)
31 TRVP O Traverse drive signal output (positive polarity)
32 *TRVM O Traverse drive signal output (negative polarity)
33 *TRVP2 O Traverse drive signal output 2 (positive polarity)
34 *TRVM2 O Traverse drive signal output 2 (negative polarity)
35 TRP O Tracking drive signal output (positive polarity)
36 *TRM O Tracking drive signal output (negative polarity)
37 FOP O Focus drive signal output (positive polarity)
38 *FOM O Focus drive signal output (negative polarity)
39 IOVDD1 I Power supply 1 for digital I/O
40 TBAL O Tracking balance adjustment signal output
41 FBAL O Focus balance adjustment signal output
42 FE I Focus error signal input
43 TE I Tracking error signal input
44 ADPVCC I Voltage input for supply voltage monitor
45 RFENV I RF envelope signal input
46 LDON O Laser ON signal output
47 NRFDET I RF detectoion signal input
48 OFT I Off-track signal input
49 BDO I Dropout signal input
50 AVDD1 I Power supply 1 for analog circuits
51 IREF I Analog reference current input
52 ARF I RF signal input
53 DSLF O DSL loop filter pin
54 PWMSEL I PWM output mode selection input Low: Direct High: 3-state
55 PLLF O PLL loop filter pin (for phase comparison)
56 PLLFO O PLL loop filter pin (for speed comparison)
57 AVSS1 I Ground 1 for analog circuits
58 LOOUTL O L-ch audio output for line-out output
59 LOVSS1 I Ground for line-out output

- 2-46 -

Pin No. Symbol I/O Function

60 LOOUTR O R-ch audio output for line-out output
61 LOVDD1 I Power supply for line-out output
62 N.C. - ­63 TMON1 O Test monitor output 1
64 N.C. - ­65 N.C. - ­66 TMON2 O Test monitor output 2
67 DVDD3 I Power supply 3 for digital circuits
68 DVSS2 I Ground 2 for digital circuits
69 *EXT0 I/O Expansion I/O port 0
70 *EXT1 I/O Expansion I/O port 1
71 *EXT2 I/O Expansion I/O port 2
72 MCLK I Microcontroller command clock signal input
73 MDATA I Microcontroller command data signal input
74 MLD I Microcontroller command load signal input
75 *STAT O Status signal output
76 *BLKCK O Subcode block clock signal output
77 *SMCK O 4.2336-/8.4672-MHz clock signal output
78 *PMCK O 88.2-kHz clock signal output
79 *TX O Digital audio interface signal output
80 *FLAG O Flag signal output
81 NRST I LSI reset signal input
82 NTEST I Test mode setting input
83 DVSS3 I Ground 3 for digital circuits
84 X1 I Crystal oscillator circuit input
85 X2 O Crystal oscillator circuit output
86 IOVDD2 I Power supply 2 for digital I/O
87 DVDD2 I Power supply 2 for internal digital circuits
88 D2 I/O DRAM data signal I/O 2
89 D1 I/O DRAM data signal I/O 1
90 D0 I/O DRAM data signal I/O 0
91 D3 I/O DRAM data signal I/O 3
92 D4 I/O DRAM data signal I/O 4
93 D5 I/O DRAM data signal I/O 5
94 D6 I/O DRAM data signal I/O 6
95 D7 I/O DRAM data signal I/O 7
96 D15 I/O DRAM data signal I/O 15
97 D14 I/O DRAM data signal I/O 14
98 DRVDD2 I Power supply 2 for DRAM interface I/O
99 D13 I/O DRAM data signal I/O 13
100 D12 I/O DRAM data signal I/O 12

- 2-47 -

■ IC503 BA5810FP

■ IC504 M12L16161A

1) PORT ASSIGNMENT

28

27

26

25 24

23

22

21 20 19 18 17 16 15

1234 5

6

7891011121314

++— + —

+ —

+ —

+ —

7.5k

7.5k

7.5k

7.5k

LOADING PRE

FWE REV

X3

POWER

SAVE

16k

16k

16k

16k

PREVCC

(PRE. LODING)

PREVCC12
(CH1. CH2)

CD1~

CB4

MUTE

POWVCC34

(CH3, CH4)

10k

10k

10k 10k

10k

10k

10k

10k

LEVEL
SHIFT

LEVEL
SHIFT

LEVEL
SHIFT

LEVEL
SHIFT

10k

10k

10k

10k

10k

10k

- 2-48 -

2) BLOCK DIAGRAM

2) PIN Function table

CLK

ADD

LCKE

LRAS

LCBR LWE

CLK

CKE

CS RAS CAS

WE L(U)DQM

LDQM

LWCBR

LCAS

Bank Select

LWE

LDQM

DQI

Data Input Regidter

512K x 16

512K x 16

Column Decoder

Latency & Burst Length

Programming Register

Timing Register

Address Register

Row Decoder

LCBR

LRAS

Sense AMP

I/O Control

Output Buffer

Col. Buffer

Row Buffer

Refresh Counter

Pin Name Input Function

CLK System Clock Active on the positive going edge to sample all inputs.
CS Chip Select Disables or enables device operation by masking or enabling all inputs except

CLK, CKE and L(U)DQM.Masks system clock to freeze operation from the next
clock cycle. CKE

CKE Clock Enable should be enabled at least one cycle prior to new command. Disable input

buffers for power down in standby.

A0~A10/AP

Address Row/Column addresses are multiplexed on the same pins. Row address:

RA0~RA10, column address: CA0~CA7

BA

Bank Select Address

Selects bank to be activated during row address latch time. Selects bank for
read/write during column address latch time.

RAS

Row Address Strobe

Latches row addresses on the positive going edge of the CLK with RAS low.
Enables row access & precharge.

CAS

Column Address Strobe

Latches column addresses on the positive going edge of the CLK with CAS
low. Enables column access.

WE Write Enable Enables write operation and row precharge. Latches data in starting from

CAS, WE active.

L(U)DQM

Data Input / Output Mask

Makes data output Hi-Z, tSHZ after the clock and masks the output. Blocks

data input when L(U)DQM active.
DQ0~15 Data Input / Output Data inputs/outputs are multiplexed on the same pins.
VDD/VSS

Power Supply/Ground

Power and ground for the input buffers and the core logic.
VDDQ/VSSQ Data Output Power/Ground

Isolated power supply and ground for the output buffers to provide improved

noise immunity.
N.C/RFU No Connection/ This is recommended to be left No Connection on the Reserved for Future Use

device.

3-1 3-2

• CABINET AND MAIN FRAME SECTION

SECTION 3. EXPLODED VIEWS

351

301

306

305

A47

TUNER

310

311

A46

A43

303

302

A00

284

250

263

286

279

261

260

264

262

280

273

278

272

271

275

274

276

277

285

315

A26

257

A41

NOTE) Refer to “SECTION 5 REPLACEMENT

PARTS LIST” in order to look for the
part number of each part.

3-3 3-4

• TAPE DECK MECHANISM: SINGLE AUTO REVERSE DECK

011

003

401

801

007

401

002

506

006

037

016

017

018

019

020

022

A01

015

023

403

504

025

021

505

401

009

507

402

502

401

009

013

406

409

036

035

039

031

029

028

027

040

026

028

038

032

501

502

LOCA.NO. PART NO SPECIFICATION

A00 6720AF0002E CRM4212 TOKYO PIGEON L-SINGLE
A01 6768R-UP03A 50-093-4941 PIGEON PWB ASSY UN
002 6768R-BP03A 02-083-4252 PIGEON BELT/FELT C
003 6768R-PP03A 33-160-4309 PIGEON PRESS CASSE
006 6768R-QP03A 50-093-4891 PIGEON MOTOR(ASSY)
007 6768R-GP03B 50-222-4578 PIGEON GEAR IDLER
008 6768R-SP01F 01-082-4598 PIGEON SPRING CWL4
009 6768R-MP01C 50-219-4014 PIGEON MOLD CWL44
011 6768R-SP01A 01-081-4601 PIGEON SPRING CWL4
013 6768R-SP03A 01-082-4686 PIGEON SPRING CRM4
015 6768R-AP01A 50-268-3016 PIGEON ARM CWL44
016 6768R-GP01H 50-093-4503 PIGEON GEAR CRL442
017 6768R-AP01C 50-239-4072 PIGEON ARM CWL44
018 6768R-GP01J 50-222-4428 PIGEON GEAR CRL442
019 6768R-SP01P 01-081-4678 PIGEON SPRING CRL4
020 6768R-BP01C 02-083-4188 PIGEON BELT/FELT C
021 6768R-LP01C 50-223-4429 PIGEON PULLEY/FLYW
022 6768R-VP03A 50-093-4748 PIGEON SOLENOID AS
023 6768R-GP03A 50-093-4810 PIGEON GEAR ASSY C
025 6768R-JP03B 50-093-31009 PIGEON PULLEY/FLY
026 6768R-SP01D 01-080-4609 PIGEON SPRING CWL4
027 6768R-DP01A 50-259-3342 PIGEON LEVER CWL44
028 6768R-RP01A 22-027-41054 PIGEON ROLLER CWL
029 6768R-MP01A 50-219-4033 PIGEON MOLD CWL44
031 6768R-SP04A 01-082-4731 PIGEON SPRING
032 6768R-EP04A 50-093-41007 PIGEON HEAD ASSY
035 6768R-PP04A 50-119-4915 PIGEON PRESS
036 6768R-SP04B 01-081-4730 PIGEON SPRING
037 6768R-JP03A 50-093-4674 PIGEON PULLEY/FLYW
038 6768R-MP01D 50-219-4034 PIGEON MOLD CWL44
039 6768R-MP02A 50-219-3900 PIGEON MOLD
040 6768R-SP01M 01-080-4607 PIGEON SPRING CWL4
401 6768R-CP01B GSE20A2005 PIGEON SCREW CWL44
402 6768R-CP01A GSE10A2003 PIGEON SCREW CWL44
403 6768R-CP01D GSL10A1704 PIGEON SCREW CWL44
406 6768R-CP01G GSE20A2004 PIGEON SCREW CWL44
409 6768R-CP02A GSD10A2016 PIGEON SCREW
501 6768R-WP03A GWN19S035040 PIGEON WASHER CRM
502 6768R-WP03B 03-000-4532 PIGEON WASHER CRM4
504 6768R-WP01D GWP21X045020 PIGEON WASHER CWL
505 6768R-WP01E GWP12X030040S PIGEON WASHER CW
506 6768R-WP01H GWP23X040020 PIGEON WASHER CWL
507 6768R-WP01F GWN21X040040 PIGEON WASHER CWL

3-5 3-6

• TAPE DECK MECHANISM: SINGLE AUTO STOP DECK (OPTIONAL)

401

009

402

003

011

401

009

013

406

407

029

028

401

027

408

030

032

026

023

403

504

025

015

401

008

007

006

016

018

017

019

020

022

A01

021

505

401

002

501

502

3-7 3-8

163

155

156

154

162

165

161

159

158

157

153

152

151

❏ CD MECHANISM

- 4-1 -

SECTION 4. SPEAKER SECTION

❏ MODEL: LXS-EM530

871

873

868

872

870

869

867

865

863

862

861

850

864

866

LOCA.NO. PART NO DESCRIPTION SPECIFICATION REMARKS

850 3701RM0070F NET ASSEMBLY SPK LXS-EM530 JERSEY NET ASSY
861 3508RMP012B DECORATION LXS-E530 MOLD W/F SILVER SPRAY
862 4930RM0003B HOLDER NET (FE-J220, DECO WF)
863 3720RMM005B PANEL,AUDIO SPK LXS-EM330/EM530 MOLD DARK
864 6400SCSX01D SPEAKER,TWEETER FE-576E SAMMI(DT-13A36L-2)DOME
865 353M025F SCREW,DRAWING TAPTITE, 3X8 FZMY
866 353M050C SCREW,DRAWING BH 3.5X16 FBK
867 6400WSMG03A SPEAKER,WOOFER CW-125B60L-3 SAMMI WOOFER 6OHM
868 4766RM0053A FELT DUCT BLACK LXS-E330/E530
869 4766RM0052A FELT W/F BLACK LXS-E330/E530
870 4766RM0051A FELT T/W BLACK LXS-E330/E530
871 3091RMW075B CABINET ASSEMBLY SPK LXS-EM530 DARK SHEET
872 3610RM0009A FOOT LXS-330, EVA(BLACK) PHI15X1T,
873 6871RU9270C PWB(PCB) ASSEMBLY,SUBSET(AUDIO LXS-E330/E530 2.2UF POSITIVE +

- 4-2 -

MEMO