LG LP61C, 32LC2R, 26LC2R Service Manual
LCD TV
SERVICE MANUAL
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS : LP61C
FACTORY MODEL : 26LC2R-TJ / 32LC2R-TJ
MODEL : 26LC2R / 32LC2R
website:http://biz.LGservice.com
e-mail:http://www.LGEservice.com/techsup.html
R
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CONTENTS
CONTENTS .............................................................................................. 2
SAFETY PRECAUTIONS ..........................................................................3
SPECIFICATION........................................................................................6
ADJUSTMENT INSTRUCTION ...............................................................12
TROUBLE SHOOTING............................................................................21
BLOCK DIAGRAM...................................................................................28
WIRING ....................................................................................................30
EXPLODED VIEW .................................................................................. 31
REPLACEMENT PARTS LIST ............................................................... 35
SVC. SHEET ...............................................................................................
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SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Replacement Parts List.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
X-RAY Radiation
Warning:
To determine the presence of high voltage, use an accurate high
impedance HV meter.
Adjust brightness, color, contrast controls to minimum.
Measure the high voltage.
The meter reading should indicate
23.5
1.5KV: 14-19 inch, 26 1.5KV: 19-21 inch,
29.0
1.5KV: 25-29 inch, 30.0 1.5KV: 32 inch
If the meter indication is out of tolerance, immediate service and
correction is required to prevent the possibility of premature
component failure.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
The source of X-RAY RADIATION in this TV receiver is the High
Voltage Section and the LCD PANEL.
For continued X-RAY RADIATION protection, the replacement
panel must be the same type panel as specified in the
Replacement Parts List.
IMPORTANT SAFETY NOTICE
0.15uF
To Instrument's
exposed
METALLIC PARTS
AC Volt-meter
1.5 Kohm/10W
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
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CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500
F to 600 F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500
F to 600 F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the
circuitboard printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500
F to 600 F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS
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IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
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1. Application range
This specification is applied to LP61C chassis.
2. Requirement for Test
Testing for standard of each part must be followed in below
condition.
(1) Temperature : 25°C±5°C(77±9°F), CST : 40±5
(2) Humidity : 65%±10%
(3) Power : Standard input voltage (AC 100-240V, 50/60Hz)
*Standard Voltage of each products is marked by models
(4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
(5) The receiver must be operated for about 20 minutes prior
to the adjustment.
3. Test method
3.1 Performance : LGE TV test method followed
3.2 Demanded other specification
Safety : CE, IEC Specification
EMC : CE, IEC
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement
.
4. Electrical Specification
4.1 Module Specification
4.1.1 General Specification(26/32/37" LCD MODULE)
No Item Specification Remark
1. Display Screen Device 26/32inch wide Color Display Module LCD
2. Aspect Ratio 16:9
3. LCD Module 26/32 TFT WXGA LCD MAKER : AUO/CMO/LPL
4. Operating Environment 1) Temp. : 0 ~ 40 deg LGE SPEC
2) Humidity : 0 ~ 85%
5. Storage Environment 3) Temp. : -20 ~ 60 deg
4) Humidity : 0 ~ 85 %
6. Input Voltage AC100 ~ 240V, 50/60Hz
7. Power Consumption Power on (White) Volume: 1/8 volume of sound distortion point
≤ max 160W (32")
≤ max 130W (26")
St-By (Red) : 1.0 W
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4.2 Model Specification
4.2.1 NON-EU / CHINA (TJ/CJ)
No Item Specification Remark
1. Market NON EU / CHINA 26/32LC2R-TJ
26/32/37LC2R-CJ
2. Broadcasting system PAL BG/DK, PAL I/II, NTSC-M
3. Available Channel BAND PAL NTSC
VHF/UHF C1~C69 2~83
CATV S1~S47 1~71
4. Receiving system Upper Heterodyne
5. Video Input (2EA) PAL, SECAM, NTSC 4 System :
PAL, SECAM, NTSC, PAL60
6. Monitor Output (1EA) PAL, SECAM, NTSC 4 System :
PAL, SECAM, NTSC, PAL60
7. S-Video Input (1EA) PAL, SECAM, NTSC 4 System : S-video Priority
PAL, SECAM, NTSC,
PAL60
8. Component Input (2EA) Y/Cb/Cr, Y/ Pb/Pr
9. RGB Input (1EA) RGB-PC, RGB-DTV
10. HDMI Input (1EA) HDMI-DTV EXCEPT 26/32/37LC2R - CJ
(CJ : NO HDMI - Spec. Out)
11. Audio Input (5 EA) PC Audio, Component (2EA), AV (2EA) L/R Input
12. Wired Control (1EA)
13. Variable Audio out(1EA)
5. Chroma & Brightness (Optical)
5.1 LCD Module
No Item Min Typ Max Unit Maker Remark
1 Luminance 350 500 cd/m
2
AUO 26", 32", 37" -50cm from the surface
LPL 26", 32" - Full White Pattern
550 CMO 27", 32"
2 View angle (R/L, U/D) 176/176 degree AUO 26" - CR >10
170/170 AUO 32"
176/176 AUO 37"
170/170 CMO 27"
176/176 CMO 32" - CR > 20
178/178 LPL 26", 32" - CR > 10
3 Color White X Typ. 0.280 Typ. - CIE 1393
Coordinate Y -0.03 0.290 +0.03 AUO 26, 37" (32")
Red X 0.640
Y 0.330
Green X 0.290
(0.270)
Y 0.600
Blue X 0.150
Y 0.060
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No Item Min Typ Max Unit Maker Remark
White X Typ. 0.285 Typ. CMO 27"
-0.03 +0.03 (32")
Y 0.293
Red X 0.646
(0.652)
Y 0.332
Green X 0.269
(0.270)
Y 0.600
(0.589)
Blue X 0.142
(0.141)
Y 0.072
(0.068)
White X Typ. 0.275 Typ. LPL 26"
-0.03 (0.285) +0.03 (32")
Y 0.279
(0.293)
Red X 0.630
(0.640)
Y 0.338
(0.343)
Green X 0.283
(0.280)
Y 0.607
(0.605)
Blue X 0.147
(0.145)
Y 0.064
(0.065)
4 Contrast ratio 800 / 1200 AUO 26"/ 32" / 37"
/ 1000
600 / 1000 CMO 27" / 32"
800 (1600) LPL 26, 32" (with AI)
5 Color Normal 8300 9300 10300 - 85IRE Full White Pattern
Temperature Warm 6200 7200 8200
Cool 10000 11000 12000
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6. Component Video Input (Y, PB, PR)
No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remarks
1. 720x480 15.73 59.94 13.500 SDTV, DVD 480I(525I)
2. 720x480 15.75 60.00 13.514 SDTV, DVD 480I(525I)
3. 720x576 15.625 50.00 13.500 SDTV, DVD 576I(625I), 50Hz
4. 720x480 31.47 59.94 27.000 SDTV 480P
5. 720x480 31.50 60.00 27.027 SDTV 480P
6. 720x576 31.25 50.00 27.000 SDTV 576P 50Hz
7. 1280x720 44.96 59.94 74.176 HDTV 720P
8. 1280x720 45.00 60.00 74.250 HDTV 720P
9. 1280x720 37.50 50.00 74.25 HDTV 720P 50Hz
10. 1920x1080 33.72 59.94 74.176 HDTV 1080I
11. 1920x1080 33.75 60.00 74.250 HDTV 1080I
12. 1920x1080 28.125 50.00 74.250 HDTV 1080I 50Hz,
7. RGB Input (Analog PC )
No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remarks
1. 640x350 31.468 70.80 25.17 EGA
2. 720x400 31.469 70.80 28.321 DOS
3. 640x480 31.469 59.94 25.17 VESA(VGA)
4. 800x600 37.879 60.31 40.00 VESA(SVGA)
5. 1024x768 48.363 60.00 65.00 VESA(XGA)
6. 1280x768 47.776 59.87 79.50 WXGA XGA only
7. 1360x768 47.720 59.799 84.75 WXGA XGA only
8. 1366x768 47.720 59.799 84.75 WXGA XGA only
No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remarks
1. 720x480 31.47 59.94 27.000 SDTV 480P
2. 720x480 31.50 60.00 27.027 SDTV 480P
3. 720x576 31.25 50.00 27.000 SDTV 576P 50Hz
4. 1280x720 44.96 59.94 74.176 HDTV 720P
5. 1280x720 45.00 60.00 74.250 HDTV 720P
6. 1280x720 37.50 50.00 74.25 HDTV 720P 50Hz
7. 1920x1080 33.72 59.94 74.176 HDTV 1080I
8. 1920x1080 33.75 60.00 74.250 HDTV 1080I
9. 1920x1080 28.125 50.00 74.250 HDTV 1080I 50Hz
8. RGB input ( DTV )
No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remarks
1. 720x480 15.75 60.00 13.514 SDTV, DVD 480I(525I)
2. 720x480 15.73 59.94 13.500 SDTV, DVD 480I(525I)
3. 720x576 15.625 50.00 13.500 SDTV, DVD 576I(625I), 50Hz
4. 720x480 31.47 59.94 27.000 SDTV 480P.
5. 720x480 31.50 60.00 27.027 SDTV 480P
6. 720x576 31.25 50.00 27.000 SDTV 576P 50Hz
7. 1280x720 44.96 59.94 74.176 HDTV 720P
8. 1280x720 45.00 60.00 74.250 HDTV 720P
9. 1280x720 37.50 50.00 74.25 HDTV 720P 50Hz
10. 1920x1080 33.72 59.94 74.176 HDTV 1080I
11. 1920x1080 33.75 60.00 74.250 HDTV 1080I
12. 1920x1080 28.125 50.00 74.250 HDTV 1080I 50Hz
9. HDMI input ( DTV )
- 10 -
10. SET factoring condition
No Item Setting Remarks
1. Station Auto Programme System BG
Storage from 1
Search To start
Manual Programme Storage 1
System BG
Band V/UHF
Channel 69
Fine
/
Search /
Name _ _ _ _ _
Programme Edit To set
Favorite programme -- ----Ch memory TBD TBD
2. Picture PSM Dynamic
CSM Normal For ZJ
Cool For TJ, CJ
For MJ
XD Auto
Advanced Cinema : Off
Black Level : Low
Reset
3. Sound SSM Flat
AVL Off
TV Speaker On
4. Time Clock --: -Off Time --: --
Off
On Time --: --
PR 1
Vol. 30
Off
Auto Sleep Off
5. Special Language English Following Buyer's demand, PR
Child Lock Off
Set ID 1
XD Demo To Start
6. Screen Auto Config. Available For RGB-PC mode
Manual Config. Phase 0 Available For RGB-PC mode
Clock 0
H-Position 0 Available For RGB mode
V-Position 0
XGA Mode 1024x768 Available for RGB-PC XGA 60Hz
ARC 16:9
Reset To set
11. Mechanical Specification
11.1 26LC2R
11.2 32LC2R
- 11 -
No Item Content Remark
1. Product Width Length Height Unit
Dimension Before Packing 681 235 550 mm SET(With Stand)
After Packing 749 275 640 mm
2. Product Only SET 16.8 Kg
Weight With BOX 18.9 Kg
No Item Content Remark
1. Product Width Length Height Unit
Dimension Before Packing 811 235 630 mm SET(With Stand)
After Packing 896 300 720 mm
2. Product Only SET 22 Kg
Weight With BOX 25.5 Kg
- 12 -
ADJUSTMENT INSTRUCTION
1. Application Range
This spec sheet is applied all of the26/32" LCD TV, LP61A/C,
LN61A chassis(HURRICANE 3 MIDDLE) by manufacturing
LG TV Plant all over the world.
2. Specification
2.1 Because this is not a hot chassis, it is not necessary to
use an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
2.2 Adjustment must be done in the correct order.
2.3 The adjustment must be performed in the circumstance of
25±5°C of temperature and 65±10% of relative humidity if
there is no specific designation.
2.4 The input voltage of the receiver must keep 100~220V,
50/60Hz.
2.5 Before adjustment, execute Heat-Run for 30 minutes at
RF no signal.
3. Adjustment items
3.1 PCB assembly adjustment items
• Download the VCTP main software (IC601,VCPT)
• Channel memory (IC603,EEPROM)
• Colorcarrier Adjustment
3.2 SET assembly adjustment items
• DDC Data input.
• Adjustment of White Balance.
• Factoring Option Data input.
4. PCB assembly adjustment
4.1 PCB assembly adjustment method
(Using VCTP Download program)
4.1.1.Download program installation
(1) Extract a Zip file
(2) Visual I2C & LPT Driver Installation
LPT Port Driver (LptDrv) Setups : Program Files > Micronas >
Visual I2C > Port_Driver
*Use for Windows 95/98 : Setup_LptDrv_v0104_9x.exe
*Use for Windows 2000/XP : Setup_LptDrv_v0202_XP_2000.exe
*
Use for Windows NT : Setup_LptDrv_v0104_NT.exe
(3) Verification (Start > Programs > Micronas > Visual
I2C or LptDrv)
(4) LPT delay setting (File > Preference > LPT
preferences)
(5) Exchange the bootloader.bat file
Install the LPT Driver
Install the Visual I2C
*LPT SETTING
- Delay => 1
- Timeout => 500 ms
=> Double click the Box area.
=> Double click the Box area.
- 13 -
4.1.2. S/W program download
• Preliminary steps
4.1.2.1 Download method 1 (PCB Ass’y)
(1) Connect the download jig to D-sub jack
(2) Execute ‘Download.vi2c’ program in PC, then a main
window will be opened
(3) Double click the blue box and confirm "Bootloader
Version" as 40.
(4) Click the "Erase Flash" button
(5) Double click the download file low, then "edit"
window will be opened
(6) Click the choice button in the "edit window", then
"file choice window" will be opened
(7)Choose the Hex file in folder and execute
downloading with click " open" button.
=> Select the "Bootloader.bat" file(install >
VCTP_download > Bootloader)
=> Push "OK"
=> Finish the program, after saving the file
"download_cs.vi2c"
(if you click , the massage appears automatically)
x
- 14 -
(8) Click OK button at the "edit window"
(9) Under Downloading process
(10) If download is failed, for example "No acknowledge
from slave". Execute download again from(1)
4.1.2.2 Download method 2 (AV Plate Ass’y)
(1) Push S/W ‘ON" (connect SCL to GND using switch
at Jig ) and connect the download jig to D-sub jack
(2) Supply the power (Stand-by 5V) and wait for 3
seconds.
(3) Push the S/W off (Disconnect SCL to GND using
switch at jig)
(4) Execute ‘Download.vi2c’ program in PC, then a main
widow will be opened.
(5) Double click the blue box and confirm "Bootloader
Version" as 40.
Push S/W
Double click
Push S/W
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