LG LP61C, 32LC2R, 26LC2R Service Manual

LCD TV

SERVICE MANUAL

CAUTION

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CHASSIS : LP61C FACTORY MODEL : 26LC2R-TJ / 32LC2R-TJ

MODEL : 26LC2R / 32LC2R

website:http://biz.LGservice.com

e-mail:http://www.LGEservice.com/techsup.html

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CONTENTS

CONTENTS .............................................................................................. 2

SAFETY PRECAUTIONS ..........................................................................3

SPECIFICATION........................................................................................6

ADJUSTMENT INSTRUCTION ...............................................................12

TROUBLE SHOOTING............................................................................21

BLOCK DIAGRAM...................................................................................28

WIRING ....................................................................................................30

EXPLODED VIEW .................................................................................. 31

REPLACEMENT PARTS LIST ............................................................... 35

SVC. SHEET ...............................................................................................

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SAFETY PRECAUTIONS

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Replacement Parts List. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.

It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep the resistor 10mm away from PCB.

Keep wires away from high voltage or high temperature parts.

X-RAY Radiation

Warning:

To determine the presence of high voltage, use an accurate high impedance HV meter.

Adjust brightness, color, contrast controls to minimum. Measure the high voltage. The meter reading should indicate

23.5

1.5KV: 14-19 inch, 26 1.5KV: 19-21 inch,

29.0

1.5KV: 25-29 inch, 30.0 1.5KV: 32 inch If the meter indication is out of tolerance, immediate service and correction is required to prevent the possibility of premature component failure.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1MΩ and 5.2MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check.

Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to

0.5mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit

The source of X-RAY RADIATION in this TV receiver is the High Voltage Section and the LCD PANEL. For continued X-RAY RADIATION protection, the replacement panel must be the same type panel as specified in the Replacement Parts List.

IMPORTANT SAFETY NOTICE

0.15uF

To Instrument's exposed METALLIC PARTS

AC Volt-meter

1.5 Kohm/10W

Good Earth Ground such as WATER PIPE, CONDUIT etc.

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CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the

following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power

source before; a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2. Test high voltage only by measuring it with an appropriate high

voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its

assemblies.

4. Unless specified otherwise in this service manual, clean

electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which

receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its

electrical assemblies unless all solid-state device heat sinks are correctly installed.

7. Always connect the test receiver ground lead to the receiver

chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

8. Use with this receiver only the test fixtures specified in this

service manual.

CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or

semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the

unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500

F to 600 F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature.

(500

F to 600 F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuitboard printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature

(500

F to 600 F)

b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

SERVICING PRECAUTIONS

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IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

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1. Application range

This specification is applied to LP61C chassis.

2. Requirement for Test

Testing for standard of each part must be followed in below condition.

(1) Temperature : 25°C±5°C(77±9°F), CST : 40±5 (2) Humidity : 65%±10% (3) Power : Standard input voltage (AC 100-240V, 50/60Hz)

*Standard Voltage of each products is marked by models

(4) Specification and performance of each parts are followed

each drawing and specification by part number in accordance with BOM.

(5) The receiver must be operated for about 20 minutes prior

to the adjustment.

3. Test method

3.1 Performance : LGE TV test method followed

3.2 Demanded other specification Safety : CE, IEC Specification EMC : CE, IEC

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

4. Electrical Specification

4.1 Module Specification

4.1.1 General Specification(26/32/37" LCD MODULE)

No Item Specification Remark

1. Display Screen Device 26/32inch wide Color Display Module LCD

2. Aspect Ratio 16:9

3. LCD Module 26/32 TFT WXGA LCD MAKER : AUO/CMO/LPL

4. Operating Environment 1) Temp. : 0 ~ 40 deg LGE SPEC

2) Humidity : 0 ~ 85%

5. Storage Environment 3) Temp. : -20 ~ 60 deg

4) Humidity : 0 ~ 85 %

6. Input Voltage AC100 ~ 240V, 50/60Hz

7. Power Consumption Power on (White) Volume: 1/8 volume of sound distortion point

≤ max 160W (32") ≤ max 130W (26")

St-By (Red) : 1.0 W

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4.2 Model Specification

4.2.1 NON-EU / CHINA (TJ/CJ)

No Item Specification Remark

1. Market NON EU / CHINA 26/32LC2R-TJ 26/32/37LC2R-CJ

2. Broadcasting system PAL BG/DK, PAL I/II, NTSC-M

3. Available Channel BAND PAL NTSC

VHF/UHF C1~C69 2~83 CATV S1~S47 1~71

4. Receiving system Upper Heterodyne

5. Video Input (2EA) PAL, SECAM, NTSC 4 System : PAL, SECAM, NTSC, PAL60

6. Monitor Output (1EA) PAL, SECAM, NTSC 4 System : PAL, SECAM, NTSC, PAL60

7. S-Video Input (1EA) PAL, SECAM, NTSC 4 System : S-video Priority PAL, SECAM, NTSC, PAL60

8. Component Input (2EA) Y/Cb/Cr, Y/ Pb/Pr

9. RGB Input (1EA) RGB-PC, RGB-DTV

10. HDMI Input (1EA) HDMI-DTV EXCEPT 26/32/37LC2R - CJ (CJ : NO HDMI - Spec. Out)

11. Audio Input (5 EA) PC Audio, Component (2EA), AV (2EA) L/R Input

12. Wired Control (1EA)

13. Variable Audio out(1EA)

5. Chroma & Brightness (Optical)

5.1 LCD Module

No Item Min Typ Max Unit Maker Remark

1 Luminance 350 500 cd/m

AUO 26", 32", 37" -50cm from the surface LPL 26", 32" - Full White Pattern

550 CMO 27", 32"

2 View angle (R/L, U/D) 176/176 degree AUO 26" - CR >10

170/170 AUO 32" 176/176 AUO 37" 170/170 CMO 27" 176/176 CMO 32" - CR > 20 178/178 LPL 26", 32" - CR > 10

3 Color White X Typ. 0.280 Typ. - CIE 1393

Coordinate Y -0.03 0.290 +0.03 AUO 26, 37" (32")

Red X 0.640

Y 0.330

Green X 0.290

(0.270)

Y 0.600

Blue X 0.150

Y 0.060

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No Item Min Typ Max Unit Maker Remark

White X Typ. 0.285 Typ. CMO 27"

-0.03 +0.03 (32")

Y 0.293

Red X 0.646

(0.652)

Y 0.332

Green X 0.269

(0.270)

Y 0.600

(0.589)

Blue X 0.142

(0.141)

Y 0.072

(0.068)

White X Typ. 0.275 Typ. LPL 26"

-0.03 (0.285) +0.03 (32")

Y 0.279

(0.293)

Red X 0.630

(0.640)

Y 0.338

(0.343)

Green X 0.283

(0.280)

Y 0.607

(0.605)

Blue X 0.147

(0.145)

Y 0.064

(0.065)

4 Contrast ratio 800 / 1200 AUO 26"/ 32" / 37"

/ 1000 600 / 1000 CMO 27" / 32" 800 (1600) LPL 26, 32" (with AI)

5 Color Normal 8300 9300 10300 - 85IRE Full White Pattern

Temperature Warm 6200 7200 8200

Cool 10000 11000 12000

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6. Component Video Input (Y, PB, PR)

No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remarks

1. 720x480 15.73 59.94 13.500 SDTV, DVD 480I(525I)

2. 720x480 15.75 60.00 13.514 SDTV, DVD 480I(525I)

3. 720x576 15.625 50.00 13.500 SDTV, DVD 576I(625I), 50Hz

4. 720x480 31.47 59.94 27.000 SDTV 480P

5. 720x480 31.50 60.00 27.027 SDTV 480P

6. 720x576 31.25 50.00 27.000 SDTV 576P 50Hz

7. 1280x720 44.96 59.94 74.176 HDTV 720P

8. 1280x720 45.00 60.00 74.250 HDTV 720P

9. 1280x720 37.50 50.00 74.25 HDTV 720P 50Hz

10. 1920x1080 33.72 59.94 74.176 HDTV 1080I

11. 1920x1080 33.75 60.00 74.250 HDTV 1080I

12. 1920x1080 28.125 50.00 74.250 HDTV 1080I 50Hz,

7. RGB Input (Analog PC )

No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remarks

1. 640x350 31.468 70.80 25.17 EGA

2. 720x400 31.469 70.80 28.321 DOS

3. 640x480 31.469 59.94 25.17 VESA(VGA)

4. 800x600 37.879 60.31 40.00 VESA(SVGA)

5. 1024x768 48.363 60.00 65.00 VESA(XGA)

6. 1280x768 47.776 59.87 79.50 WXGA XGA only

7. 1360x768 47.720 59.799 84.75 WXGA XGA only

8. 1366x768 47.720 59.799 84.75 WXGA XGA only

No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remarks

1. 720x480 31.47 59.94 27.000 SDTV 480P

2. 720x480 31.50 60.00 27.027 SDTV 480P

3. 720x576 31.25 50.00 27.000 SDTV 576P 50Hz

4. 1280x720 44.96 59.94 74.176 HDTV 720P

5. 1280x720 45.00 60.00 74.250 HDTV 720P

6. 1280x720 37.50 50.00 74.25 HDTV 720P 50Hz

7. 1920x1080 33.72 59.94 74.176 HDTV 1080I

8. 1920x1080 33.75 60.00 74.250 HDTV 1080I

9. 1920x1080 28.125 50.00 74.250 HDTV 1080I 50Hz

8. RGB input ( DTV )

No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remarks

1. 720x480 15.75 60.00 13.514 SDTV, DVD 480I(525I)

2. 720x480 15.73 59.94 13.500 SDTV, DVD 480I(525I)

3. 720x576 15.625 50.00 13.500 SDTV, DVD 576I(625I), 50Hz

4. 720x480 31.47 59.94 27.000 SDTV 480P.

5. 720x480 31.50 60.00 27.027 SDTV 480P

6. 720x576 31.25 50.00 27.000 SDTV 576P 50Hz

7. 1280x720 44.96 59.94 74.176 HDTV 720P

8. 1280x720 45.00 60.00 74.250 HDTV 720P

9. 1280x720 37.50 50.00 74.25 HDTV 720P 50Hz

10. 1920x1080 33.72 59.94 74.176 HDTV 1080I

11. 1920x1080 33.75 60.00 74.250 HDTV 1080I

12. 1920x1080 28.125 50.00 74.250 HDTV 1080I 50Hz

9. HDMI input ( DTV )

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10. SET factoring condition

No Item Setting Remarks

1. Station Auto Programme System BG Storage from 1 Search To start

Manual Programme Storage 1

System BG Band V/UHF Channel 69 Fine

/ Search / Name _ _ _ _ _

Programme Edit To set Favorite programme -- ----Ch memory TBD TBD

2. Picture PSM Dynamic CSM Normal For ZJ

Cool For TJ, CJ

For MJ XD Auto Advanced Cinema : Off

Black Level : Low

Reset

3. Sound SSM Flat AVL Off TV Speaker On

4. Time Clock --: -Off Time --: --

Off

On Time --: --

PR 1 Vol. 30 Off

Auto Sleep Off

5. Special Language English Following Buyer's demand, PR Child Lock Off Set ID 1 XD Demo To Start

6. Screen Auto Config. Available For RGB-PC mode Manual Config. Phase 0 Available For RGB-PC mode

Clock 0 H-Position 0 Available For RGB mode

V-Position 0 XGA Mode 1024x768 Available for RGB-PC XGA 60Hz ARC 16:9 Reset To set

11. Mechanical Specification

11.1 26LC2R

11.2 32LC2R

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No Item Content Remark

1. Product Width Length Height Unit Dimension Before Packing 681 235 550 mm SET(With Stand)

After Packing 749 275 640 mm

2. Product Only SET 16.8 Kg Weight With BOX 18.9 Kg

No Item Content Remark

1. Product Width Length Height Unit Dimension Before Packing 811 235 630 mm SET(With Stand)

After Packing 896 300 720 mm

2. Product Only SET 22 Kg Weight With BOX 25.5 Kg

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ADJUSTMENT INSTRUCTION

1. Application Range

This spec sheet is applied all of the26/32" LCD TV, LP61A/C, LN61A chassis(HURRICANE 3 MIDDLE) by manufacturing LG TV Plant all over the world.

2. Specification

2.1 Because this is not a hot chassis, it is not necessary to use an isolation transformer. However, the use of isolation transformer will help protect test instrument.

2.2 Adjustment must be done in the correct order.

2.3 The adjustment must be performed in the circumstance of 25±5°C of temperature and 65±10% of relative humidity if there is no specific designation.

2.4 The input voltage of the receiver must keep 100~220V, 50/60Hz.

2.5 Before adjustment, execute Heat-Run for 30 minutes at RF no signal.

3. Adjustment items

3.1 PCB assembly adjustment items

• Download the VCTP main software (IC601,VCPT)

• Channel memory (IC603,EEPROM)

• Colorcarrier Adjustment

3.2 SET assembly adjustment items

• DDC Data input.

• Adjustment of White Balance.

• Factoring Option Data input.

4. PCB assembly adjustment

4.1 PCB assembly adjustment method (Using VCTP Download program)

4.1.1.Download program installation

(1) Extract a Zip file

(2) Visual I2C & LPT Driver Installation

LPT Port Driver (LptDrv) Setups : Program Files > Micronas >

Visual I2C > Port_Driver *Use for Windows 95/98 : Setup_LptDrv_v0104_9x.exe *Use for Windows 2000/XP : Setup_LptDrv_v0202_XP_2000.exe *

Use for Windows NT : Setup_LptDrv_v0104_NT.exe

(3) Verification (Start > Programs > Micronas > Visual

I2C or LptDrv)

(4) LPT delay setting (File > Preference > LPT

preferences)

(5) Exchange the bootloader.bat file

Install the LPT Driver Install the Visual I2C

*LPT SETTING

- Delay => 1

- Timeout => 500 ms

=> Double click the Box area.

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4.1.2. S/W program download

• Preliminary steps

4.1.2.1 Download method 1 (PCB Ass’y)

(1) Connect the download jig to D-sub jack (2) Execute ‘Download.vi2c’ program in PC, then a main

window will be opened

(3) Double click the blue box and confirm "Bootloader

Version" as 40.

(4) Click the "Erase Flash" button

(5) Double click the download file low, then "edit"

window will be opened

(6) Click the choice button in the "edit window", then

"file choice window" will be opened

(7)Choose the Hex file in folder and execute

downloading with click " open" button.

=> Select the "Bootloader.bat" file(install >

VCTP_download > Bootloader)

=> Push "OK"

=> Finish the program, after saving the file

"download_cs.vi2c"

(if you click , the massage appears automatically)

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(8) Click OK button at the "edit window"

(9) Under Downloading process

(10) If download is failed, for example "No acknowledge

from slave". Execute download again from(1)

4.1.2.2 Download method 2 (AV Plate Ass’y)

(1) Push S/W ‘ON" (connect SCL to GND using switch

at Jig ) and connect the download jig to D-sub jack

(2) Supply the power (Stand-by 5V) and wait for 3

seconds.

(3) Push the S/W off (Disconnect SCL to GND using

switch at jig)

(4) Execute ‘Download.vi2c’ program in PC, then a main

widow will be opened.

(5) Double click the blue box and confirm "Bootloader

Version" as 40.

Push S/W

Double click

Push S/W

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