LG LN-15A10 Schematic

LCD TV SERVICE MANUAL
CAUTION
BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS : NF-99LA
MODEL : LN-15A10
CONTENTS
Contents .................................................................................................. 2
Safety Precautions ..................................................................................3
Servicing Precautions ............................................................................ 4
Adjustment Instruction ............................................................................6
Troubleshooting .......................................................................................8
Exploded View ...................................................................................... 10
Exploded View Parts List.......................................................................11
Replacement Parts List ........................................................................ 12
SVC. Sheet .................................................................................................
SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Replacement Parts List. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
General Guidance
An lsolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.
It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitary that may be inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Due to high vacuum and large surface area of picture tube, extreme care should be used in handling the Picture Tube. Do not lift the Picture tube by it's Neck.
X-RAY Radiation
Warning:
To determine the presence of high voltage, use an accurate high impedance HV meter.
Adjust brightness, color, contrast controls to minimum. Measure the high voltage. The meter reading should indicate
23.5
!1.5KV: 14-19 inch, 26!1.5KV: 19-21 inch,
29.0
!1.5KV: 25-29 inch, 30.0 ! 1.5KV: 32 inch
If the meter indication is out of tolerance, immediate service and correction is required to prevent the possibility of premature component failure.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on positioin, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1MΩ and 5.2MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each esposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to 0.5mA. In case any measurement is out of the limits sepcified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.
Leakage Current Hot Check circuit
The source of X-RAY RADIATION in this TV receiver is the High Voltage Section and the Picture Tube. For continued X-RAY RADIATION protection, the replacement tube must be the same type tube as specified in the Replacement Parts List.
IMPORTANT SAFETY NOTICE
0.15uF
AC Volt-meter
To Instrument's exposed METALLIC PARTS
Good Earth Ground such as WATER PIPE, CONDUIT etc.
1.5 Kohm/10W
CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS
on page 3 of this publication.
NOTE:
If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC
power source before; a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug
or other electrical connection.
c.
Connecting a test substitute in parallel with an electrolytic capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.
d. Discharging the picture tube anode.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".
3. Discharge the picture tube anode only by (a) first connecting
one end of an insulated clip lead to the degaussing or kine aquadag grounding system shield at the point where the picture tube socket ground lead is connected, and then (b) touch the other end of the insulated clip lead to the picture tube anode button, using an insulating handle to avoid personal contact with high voltage.
4. Do not spray chemicals on or near this receiver or any of its
assemblies.
5. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable nonabrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required.
6. Do not defeat any plug/socket B+ voltage interlocks with
which receivers covered by this service manual might be equipped.
7. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are correctly installed.
8. Always connect the test receiver ground lead to the
receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.
9.
Use with this receiver only the test fixtures specified in this service manual.
CAUTION: Do not connect the test fixture ground strap to any heatsink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices.
Examples of
typical ES devices are integrated circuits and some fieldeffect
transistors and semicounductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficent to demage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a repalcement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).
7. Immediately before removing the protective material from the ieads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION:Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the bruching together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintan tip temperature within the range or 500
cF to 600cF.
2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thorohly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature.
(500cF to 600cF) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static,
suction-type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the
circuiboard printed foil.
6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal
temperature (500cF to 600cF)
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
SERVICING PRECAUTIONS
c. Qulckly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.
d. Closely inspect the solder area and remove any excess
or splashed solder with a small wire-bristle brush.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in parapraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.
2. Draw away the melted solder with an anti-static suction­type solder removal device (or with solder braid) before removing the IC.
Replacement
1. Carefully insert the replacement IC in the circuit boare.
2. Carefully bend each IC lead against the circuit foil pad and solder it.
3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.
Power Output, Transistor Device Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heatsink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heatsink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicula y to the circuit board.
3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.
Fuse and Conventional Resistor Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow stake.
2. Securely crimp the leads of replacement component around notch at stake top.
3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involoves the installation of a jumper wire on the component side of the circuit board.
1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.
1. Application Object
This instruction is for the application to the LCD TV.
2. Notes
(1) This set uses an adapter, so connect the adapter and the
set correctly before adjustment.
(2) The adjustment must be performed under the correct
sequence.
(3) The adjustment must be performed in the circumstance of
25!5cC of temperature and 65!10% of relative humidity if there is no specific designation.
(4) The input voltage of the receiver must keep 220V, 60Hz in
adjusting.
(5) The set must be operated for 30 minutes preliminarily
before adjustment if there is no specific designation.
[ ‘Heat Run’ must be performed with the full white signal or TV
noise signal in the internal part of the set.
[ The time for ‘Heat Run’ can be changed owing to production
plan.
3. TV Mode Adjustment
Before entering into the adjustment mode set the TV up with the MENU button as below.
Contrast 85 Brightness 100 Saturation 50 Tint 0
3-1. White Balance Adjustment
3-1-1. Required Test Equipment
(1) A Remote Control (2) A Color Analyzer for LCD : CA-110 (3) A TV Signal Generator : Pattern of 64 (128) tones or Ch. 13
in the company.
3-1-2. Preparation for Adjustment
(1) This adjustment should be performed 30 minutes later
after ‘Heat Run’.
(2) This adjustment should be performed in a darkroom or in
the simmilar condition.
3-1-3. Low Light Adjustment
(1) Seletc Ch.13 in the company. (2) Enter into the adjustment mode with the ADJ button. (3) Select the Sub-bright and stop adjusting at the moment
when Gray 0 and 1 aren’t distinguished.
4. PC Input Mode Adjustment
4-1. Required Test Equipment
(1) A pattern generator being in proportion to VG819 ; Pattern
of 64 tones
(2) A remote control
4-2. Preparation for Adjustment
(1) Perform ‘Heat Run’ for more than 30 minutes in white
pattern. (2) Connect the signal of pattern generator with LCD TV. (3) Lean the set 45° backward. (Adjustment is easy.)
(4) Set the PC mode menu as below.
4-3. White Adjustment
(1) Approve the signal of 64 tones of XGA(1024 * 768). (2) Select all the gain of R, B and G with using ADJ of remote
control. (3) After making 62 tones, 63 tones and 64 tones not
distinguished with using each signal of R, G and B, finish
adjusting at the moment when the signal 62, 63 and 64 is
distinguished.
ADJUSTMENT INSTRUCTION
IC VPC3230D VPC3230D VPC3230D
Name
BR
ACC_Sat
Tint
Default
0
2930
0
Unit-Decimal
Adj. Mode
No.304
No.236~237
No.248
IIC Type
IIC 0x52/7:0/
IIC 0x30/11:0/
Fp 0xDC
Low Light(Black)
3 x 3 y
Brightness:[cd/m^2]
Blue
0.14
0.10
Green
0.30
0.60
White
0.32
0.34
150[cd/m^2]
Red
0.63
0.34
45°
Initial Value
Contrast
70
Brightness
100
R
0.63 0.34 0x02
G
0.30 0.60 0x03
B
0.14 0.10 0x04
Error
! 0.03
Register
Color Coordinates(x,y)
AD9884
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