Width: 364.5 mm (14.35'')
Depth: 180 mm (7.09'')
Height: 378.2 mm (14.89'')
L1952T
Width: 402 mm (15.83'')
Depth: 180 mm (7.09'')
Height: 407.5 mm (16.04'')
8. WEIGHT (with TILT/SWIVEL)
L1752T
Net. Weight: 3.5 kg (7.72 lbs)
Gross Weight: 4.6 kg (10.14 lbs)
L1952T
Net. Weight: 4.4 kg (9.70 lbs)
Gross Weight: 5.6 kg (12.35 lbs)
- 2 -
Page 3
PRECAUTION
1.5 Kohm/10W
To Instrument’s
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
WARNING FOR THE SAFETY-RELATED COMPONENT.
• There are some special components used in LCD
monitor that are important for safety. These parts are
marked on the schematic diagram and the
replacement parts list. It is essential that these critical
parts should be replaced with the manufacturer’s
specified parts to prevent electric shock, fire or other
hazard.
• Do not modify original design without obtaining written
permission from manufacturer or you will void the
original parts and labor guarantee.
TAKE CARE DURING HANDLING THE LCD MODULE
WITH BACKLIGHT UNIT.
• Must mount the module using mounting holes arranged
in four corners.
• Do not press on the panel, edge of the frame strongly
or electric shock as this will result in damage to the
screen.
• Do not scratch or press on the panel with any sharp
objects, such as pencil or pen as this may result in
damage to the panel.
WARNING
BE CAREFUL ELECTRIC SHOCK !
• If you want to replace with the new backlight (CCFL) or
inverter circuit, must disconnect the AC adapter
because high voltage appears at inverter circuit about
650Vrms.
• Handle with care wires or connectors of the inverter
circuit. If the wires are pressed cause short and may
burn or take fire.
Leakage Current Hot Check Circuit
• Protect the module from the ESD as it may damage the
electronic circuit (C-MOS).
• Make certain that treatment person’s body are
grounded through wrist band.
• Do not leave the module in high temperature and in
areas of high humidity for a long time.
• The module not be exposed to the direct sunlight.
• Avoid contact with water as it may a short circuit within
the module.
• If the surface of panel become dirty, please wipe it off
with a softmaterial. (Cleaning with a dirty or rough cloth
may damage the panel.)
CAUTION
Please use only a plastic screwdriver to protect yourself
from shock hazard during service operation.
- 3 -
Page 4
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this
service manual and its supplements and addenda, read
and follow the SAFETY PRECAUTIONS on page 3 of this
publication.
NOTE: If unforeseen circumstances create conflict
between the following servicing precautions and any of the
safety precautions on page 3 of this publication, always
follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC
power source before;
a. Removing or reinstalling any component, circuit
board module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical
plug or other electrical connection.
c. Connecting a test substitute in parallel with an
electrolytic capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect
polarity installation of electrolytic capacitors may
result in an explosion hazard.
d. Discharging the picture tube anode.
2. Test high voltage only by measuring it with an
appropriate high voltage meter or other voltage
measuring device (DVM, FETVOM, etc) equipped with
a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Discharge the picture tube anode only by (a) first
connecting one end of an insulated clip lead to the
degaussing or kine aquadag grounding system shield
at the point where the picture tube socket ground lead
is connected, and then (b) touch the other end of the
insulated clip lead to the picture tube anode button,
using an insulating handle to avoid personal contact
with high voltage.
4. Do not spray chemicals on or near this receiver or any
of its assemblies.
5. Unless specified otherwise in this service manual,
clean electrical contacts only by applying the following
mixture to the contacts with a pipe cleaner, cottontipped stick or comparable non-abrasive applicator;
10% (by volume) Acetone and 90% (by volume)
isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual,
lubrication of contacts in not required.
6. Do not defeat any plug/socket B+ voltage interlocks
with which receivers covered by this service manual
might be equipped.
7. Do not apply AC power to this instrument and/or any of
its electrical assemblies unless all solid-state device
heat sinks are correctly installed.
8. Always connect the test receiver ground lead to the
receiver chassis ground before connecting the test
receiver positive lead.
Always remove the test receiver ground lead last.
9. Use with this receiver only the test fixtures specified in
this service manual.
CAUTION: Do not connect the test fixture ground strap
to any heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be
damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive (ES)Devices. Examples of typical ES devices are integrated
circuits and some field-effect transistors and
semiconductor "chip" components. The following
techniques should be used to help reduce the incidence of
component damage caused by static by static electricity.
1. Immediately before handling any semiconductor
component or semiconductor-equipped assembly, drain
off any electrostatic charge on your body by touching a
known earth ground. Alternatively, obtain and wear a
commercially available discharging wrist strap device,
which should be removed to prevent potential shock
reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with
ES devices, place the assembly on a conductive
surface such as aluminum foil, to prevent electrostatic
charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or
unsolder ES devices.
4. Use only an anti-static type solder removal device.
Some solder removal devices not classified as "antistatic" can generate electrical charges sufficient to
damage ES devices.
5. Do not use freon-propelled chemicals. These can
generate electrical charges sufficient to damage ES
devices.
6. Do not remove a replacement ES device from its
protective package until immediately before you are
ready to install it. (Most replacement ES devices are
packaged with leads electrically shorted together by
conductive foam, aluminum foil or comparable
conductive material).
7. Immediately before removing the protective material
from the leads of a replacement ES device, touch the
protective material to the chassis or circuit assembly
into which the device will be installed.
CAUTION: Be sure no power is applied to the chassis
or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion
such as the brushing together of your clothes fabric or
the lifting of your foot from a carpeted floor can
generate static electricity sufficient to damage an ES
device.)
- 4 -
Page 5
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and
appropriate tip size and shape that will maintain tip
temperature within the range or 500。F to 600。F.
2. Use an appropriate gauge of RMA resin-core solder
composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a
mall wire-bristle (0.5 inch, or 1.25cm) brush with a
metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal
temperature.
(500。F to 600。F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static,
suction-type solder removal device or with solder
braid.
CAUTION: Work quickly to avoid overheating the
circuitboard printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal
temperature (500。F to 600。F)
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of
the component lead and the printed circuit foil, and
hold it there only until the solder flows onto and
around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the
circuit board printed foil.
d. Closely inspect the solder area and remove any
excess or splashed solder with a small wire-bristle
brush.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong)
through which the IC leads are inserted and then bent flat
against the circuit foil. When holes are the slotted type,
the following technique should be used to remove and
replace the IC. When working with boards using the
familiar round hole, use the standard technique as
outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation
by gently prying up on the lead with the soldering iron
tip as the solder melts.
2. Draw away the melted solder with an anti-static
suction-type solder removal device (or with solder
braid) before removing the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad
and solder it.
3. Clean the soldered areas with a small wire-bristle
brush. (It is not necessary to reapply acrylic coating to
the areas).
1. Remove the defective transistor by clipping its leads as
close as possible to the component body.
2. Bend into a "U" shape the end of each of three leads
remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the
corresponding leads extending from the circuit board
and crimp the "U" with long nose pliers to insure metal
to metal contact then solder each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor
leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the
circuit board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close
as possible to diode body.
2. Bend the two remaining leads perpendicular y to the
circuit board.
3. Observing diode polarity, wrap each lead of the new
diode around the corresponding lead on the circuit
board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder
joints of the two "original" leads. If they are not shiny,
reheat them and if necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board
hollow stake.
2. Securely crimp the leads of replacement component
around notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the
replaced component and adjacent components and the
circuit board to prevent excessive component
temperatures.
- 5 -
Page 6
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed
circuit board will weaken the adhesive that bonds the foil
to the circuit board causing the foil to separate from or
"lift-off" the board. The following guidelines and
procedures should be followed whenever this condition is
encountered.
At IC Connections
To repair a defective copper pattern at IC connections use
the following procedure to install a jumper wire on the
copper pattern side of the circuit board. (Use this
technique only on IC connections).
1. Carefully remove the damaged copper pattern with a
sharp knife. (Remove only as much copper as
absolutely necessary).
2. carefully scratch away the solder resist and acrylic
coating (if used) from the end of the remaining copper
pattern.
3. Bend a small "U" in one end of a small gauge jumper
wire and carefully crimp it around the IC pin. Solder the
IC connection.
4. Route the jumper wire along the path of the out-away
copper pattern and let it overlap the previously scraped
end of the good copper pattern. Solder the overlapped
area and clip off any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper
pattern at connections other than IC Pins. This technique
involves the installation of a jumper wire on the
component side of the circuit board.
1. Remove the defective copper pattern with a sharp
knife.
Remove at least 1/4 inch of copper, to ensure that a
hazardous condition will not exist if the jumper wire
opens.
2. Trace along the copper pattern from both sides of the
pattern break and locate the nearest component that is
directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead
of the nearest component on one side of the pattern
break to the lead of the nearest component on the
other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is
dressed so the it does not touch components or sharp
edges.
- 6 -
Page 7
TIMING CHART
VIDEO
SYNC
B
C
E
A
D
MODE
1H(Pixels)+25.17531.469 800640169648640 x 350
2H(Pixels)-28.32131.4689007201810854720 X 400
3H(Pixels)-25.17531.469800640169648640 x 480
4H(Pixels)-31.537.58406401664120640 x 480
5H(Pixels)+40.037.87910568004012888800 x 600
6H(Pixels)+49.546.87510568001680160800 x 600
7H(Pixels)+/-57.28349.72511528323264224832 x 624
8H(Pixels)-65.048.36313441024241361601024 x 768
9H(Pixels)-78.7560.1231312102416961761024 x 768
10H(Pixels)+/-100.068.68114561152321281441152 x 870
11H(Pixels)+/-92.97861.80515041152181342001152 x 900
12H(Pixels)+108.063.98116881280481122481280 x 1024
13H(Pixels)+135.079.97616881280161442481280 x 1024
H / V
V(Lines)-70.09 44935037260
V(Lines)+70.0844940012235
V(Lines)-59.9452548010233
V(Lines)-755004801316
V(Lines)+60.3176286001423
V(Lines)+75.06256001321
V(Lines)+/-74.556676241339
V(Lines)-60.08067683629
V(Lines)-75.0298007681328
V(Lines)+/-75.0629158703339
V(Lines)+/-65.969379002431
V(Lines)+60.02106610241338
V(Lines)+75.035106610241338
Sync
Polarity
Dot
Clock
Frequency
Total
Period
( E )
Video
Active
Time ( A )
Sync
Duration
( D )
Front
Porch
( C )
Blanking
Time
( B )
Resolution
- 7 -
Page 8
DISASSEMBLY-Set
# 1
# 3
Soft pad on the table.
# 2
Monitor on the pad.
# 4-1
# 4-2
Pull up the stand part.
Hold the head & stand base and then
Twist Stand until "Click".
# 5
Separate head & stand
- 8 -
Page 9
# 6
# 7
# 8
Remove the screws.
1. Pull the front cover upward.
2. Then, let the all latches are separated.(#3-1~3-2)
3. Put the front face down.
# 9
Disassemble back cover.
- 9 -
Page 10
* In case of Latch 4.
DISASSEMBLY-Stand
# 1-1
Push the four latches on the bottom to the
outside and Separate Stand Body & Base.
(Reference the #1-2)
# 2# 3
# 1-2
After finished repair, necessarily push 4ea
Latches to inside for restoration.
- 10 -
Page 11
DISASSEMBLY-Stand
* In case of Latch 2.
# 1# 2
Hold the stand body.Confirm two latch of right and left.
# 3
# 5
# 4
Push the latch to the inside.Push the base to the opposite direction.
Confirm the condition of separation.
- 11 -
Page 12
BLOCK DIAGRAM
LVDS
MStarACE
Line Buffer
Module
Vcc
5V
LVDS
Scaler
Tx
OSD
KEY
SSC
SDA
/SCL
EEPROM
(System)
Flash ROM
3.3V
3.3V
3.3V
1.8V
Regulator
ADC
TSUMx6AL
5V
3.3V
Analog (R/G/B)
TMDS Rx
Digital
D-SubDVI-D
MCU
Intel8032
1.8V
EEPROM
(EDID)
LIPS
5V
12V
Filter
5V
12V
12V
Inverter (4 lamps)
- 12 -
Page 13
BLOCK DIAGRAM-POWER
High
Over
Voltage
Protection
13V
P-ch
12V
Inverter
Inverter
Control
5V
LAMP
Trans
IC
Low
Lamp
Current
Feedback
N-ch
Drive Block
POWERINVERTER
5V
12V
Main Board
Module Vcc
Aux
Drive
Dimming (Lamp Current Control)
Inverter On/OFF (3.3V)
DC DC
(Scaler &
converter)
SMPS
Power
Control
Feedback
IC
Start
Line Filter
LN
- 13 -
Page 14
DESCRIPTION OF BLOCK DIAGRAM
1. Video Controller Part.
This part amplifies the level of video signal for the digital conversion and converts from the analog video signal to the
digital video signal using a pixel clock.
The pixel clock for each mode is generated by the PLL.
The range of the pixel clock is from 25MHz to 135MHz.
This part consists of the Scaler, ADC convertor, TMDS receiver and LVDS transmitter.
The Scaler gets the video signal converted analog to digital, interpolates input to 1280 X 1024 resolution signal and
outputs 8-bit R, G, B signal to transmitter.
2. Power Part.
This part consists of the one 3.3V, and one 1.8V regulators to convert power which is provided 5V in Power board.
12V is provided for inverter, 5V is provided for LCD panel.
Also, 5V is converted 3.3V and 1.8V by regulator. Converted power is provided for IC in the main board.
The inverter converts from DC12V to AC 700Vrms and operates back-light lamps of module.
3. MICOM Part.
This part is include video controller part. And this part consists of EEPROM IC which stores control data, Reset IC and
the Micom.
The Micom distinguishes polarity and frequency of the H/V sync are supplied from signal cable.
The controlled data of each modes is stored in EEPROM.
- 14 -
Page 15
LIPS Board Block Diagram
50 ~ 60Hz
LINE
100 ~ 240V
EMI
COMPONENTS
INPUT RECTIFIER
AND FILTER
PWM CONTROL
CIRCUIT
HVDC
SWITCHING
TRANSFORMER
PHOTO-COUPLER
ISOLATION
100KHz
OUTPUT RECTIFIER
AND FILTER
SIGNAL
COLLENT-
ION
12V
5V
GND
PRIMARYSECONDARY
INVERTER CIRCUIT
High V oltage12V
Operation description_LIPS
1. EMI components.
This part contains of EMI components to comply with global marketing EMI standards like FCC,VCCI CISPR, the
circuit included a line-filter, across line capacitor and of course the primary protection fuse.
2. Input rectifier and filter.
This part function is for transfer the input AC voltage to a DC voltage through a bridge rectifier and a bulk capacitor.
3. Energy Transfer.
This part function is for transfer the primary energy to secondary through a power transformer.
4. Output rectifier and filter.
This part function is to make a pulse width modulation control and to provide the driver signal to power switch, to
adjust the duty cycle during different AC input and output loading condition to achieve the dc output stabilized, and
also the over power protection is also monitor by this part.
5. Photo-Coupler isolation.
This part function is to feed back the DC output changing status through a photo transistor to primary controller to
achieve the stabilized DC output voltage.
6. Signal collection.
This part function is to collect the any change from the DC output and feed back to the primary through photo
transistor.
- 15 -
Page 16
ADJUSTMENT
Windows EDID V1.0 User Manual
Operating System: MS Windows 98, 2000, XP
Port Setup: Windows 98 => Don’t need setup
Windows 2000, XP => Need to Port Setup.
This program is available to LCD Monitor only.
1. Port Setup
a) Copy “UserPort.sys” file to
“c:\WINNT\system32\drivers” folder
b) Run Userport.exe
c) Remove all default number
d) Add 300-3FF
2. EDID Read & Write
1) Run WinEDID.exe
2) Edit Week of Manufacture, Year of Manufacture,
Serial Number
a) Input User Info Data
b) Click “Update” button
c) Click “ Write” button
e) Click Start button.
f) Click Exit button.
- 16 -
Page 17
SERVICE OSD
1) Turn off the power switch at the front side of the display.
2) Wait for about 5 seconds and press MENU, POWER switch with 1 second interval.
3) The SVC OSD menu contains additional menus that the User OSD menu as described below.
a) Auto Color : W/B balance and Automatically sets the gain and offset value.
b) NVRAM INIT : EEPROM initialize.(24C08)
c) CLEAR ETI : To initialize using time.
d) AGING : Select Aging mode(on/off).
e) R/G/B-9300K : Allows you to set the R/G/B-9300K value manually.
f) R/G/B-6500K : Allows you to set the R/G/B-6500K value manually.
g) R/G/B-Offset : Allows you to set the R/G/B-Offset value manually.(Analog Only)
h) R/G/B-Gain : Allows you to set the R/G/B-Gain value manually.(Analog Only)
i) MODULE : To select applied module.
Video Signal
Generator
Control Line
A
IBM
Compatible PC
PARALLEL PORT
Not used
RS232C
C
PARALLEL
Power inlet (required)
220
VGS
A
MONITOR
POWER
ST
V-SYNC
B
F
Power Select Switch
(110V/220V)
Power LED
E
ST Switch
V-Sync On/Off Switch
(Switch must be ON.)
5V
15
OFF ON
F
10
5
11
6
1
B
69
5
1
C
OFF
13
25
5V
4.7K
4.7K
74LS06
ON
5V
E
74LS06
4.7K
1
14
Figure 1. Cable Connection
- 17 -
Page 18
TROUBLESHOOTING GUIDE
NO POWER
(POWER INDICATOR OFF)
1. NO POWER
Check J403 Voltage
Pin5, Pin6 (5V)?
YES
Check
U301 Pin2 Voltage
(3.3V) ?
YES
Check Key Control
Connector Routine
Is U201
Pin75 (3.3V)
Voltage ?
YES
1
Check U201 Pin 96
Pulse
NO
NO
NO
NO
Check Power Board,
And Find Out a Short Point
as Opening
Each Power Line
Check 3.3V Line
(Open Check)
No Problem
Check 3.3V Line
Check X-TAL
1
U201-#96
YES
Check U201
Waveforms
- 18 -
Page 19
2. NO RASTER (OSD IS NOT DISPLAYED) – LIPS
NO RASTER
(OSD IS NOT DISPLAYED)
J403
PIN5, PIN6
5V?
YES
J403 PIN9
5V?
YES
J403 PIN10
5V?
YES
CHECK
PULSE AS
CONTACTING SCOPE
PROBE TO CAUTION LABEL.
(CONTACT PROBE TO
CAUTION LABEL.
CAN YOU SEE PULSE
AT YOUR
SCOPE?
NO
NO
NO
NO
CHECK POWER BOARD,
AND FIND OUT A SHORT
POINT AS OPENING EACH
POWER LINE
3809900177NBACK COVER ASSEMBLY, L1752T NON BACK COVER ASSY PC+ABS MODULE-LPL-DUAL
3809900178KBACK COVER ASSEMBLY, L1952T NON BACK COVER MODULE-LPL-DUAL
3043900041ATILT SWIVEL ASSEMBLY, LX52 35509K0241 STAND BASE ASSY
35509K0245ACOVER, L1752S STAND BODY .
35509K0246ACOVER, L1952S STAND BODY .
3520900038AINDICATOR, LED&PRE AMP LX52 PMMA NON LED LENS
49509K0266AMETAL, SHIELD LX52 LAMP-L1752T
49509K0267AMETAL, SHIELD L1952 LAMP
68719STA24CPWB(PCB) ASSEMBLY,SUB, SUB T.T LM57A LX52 KXRDQPT NT CKD CONTROLL-SILVER
68719ST086A
LCD(LIQUID CRYSTAL DISPLAY), LM170E01-TLB1 LG PHILPS TFT COLOR P5,645CH,300NITS,8MS,700/1,LPL NJ/KUMI,PB FREE,EGI,OKI S D-IC,EGI,
LCD(LIQUID CRYSTAL DISPLAY), LM190E03-TLB7 LG PHILPS TFT COLOR P4,645CH,300NITS,TN,8MS,LPL KUMI,PB FREE,EGI,NEC S D-IC,SXGA,LVDS
LCD(LIQUID CRYSTAL DISPLAY), LM190E03-TLBB LG PHILPS TFT COLOR DOT FREE OF LM190E03-TLB7,P4,645CH,300NITS,TN,8MS,LPL KUMI,PB FREE
LCD(LIQUID CRYSTAL DISPLAY), LM190E03-TLB5 LG PHILPS TFT COLOR P4,645CH,300NITS,TN,8MS,LPL KUMI,PB FREE,EGI,OKI S D-IC,SXGA,LVDS
PWB(PCB) ASSEMBLY,SUB, SUB T.T LM56A L1752/L1952BFQ .KXRDQPT CONTROL TOTAL NT CKD-BLACK
Description
090
100
110
120
130
140
150
160
170
180
190
200
0DLLT0089AALED, LITEON LTL-1BEDJ-0C2 TP GREEN/YELLOW 19MCD
68719PT298APWB(PCB) ASSEMBLY,POWER, POWER T.T LM57A L1752S KNRDQPT TOTAL
or 6709900027ASMPS,AC/DC, AIVP 100.0TO240.0 40W 50TO60HZ
33139L7033CMAIN TOTAL ASSEMBLY, L1752T-BFQ.KXRDQPT NT CKD TSUM56AWL BRAND LM57B-SILVER
3313917030AMAIN TOTAL ASSEMBLY, L1752T-BFQ.KXRDQPT NT CKD TSUM56AWL BRAND LM56A-BLACK
33139L9041CMAIN TOTAL ASSEMBLY, L1952T-BFQ.KXRDQPT NT CKD BRAND LM57B TSUM56AWL-SILVER
3313919008A
35509K0247ACOVER, LX52 PIECE COVER VESA
49509S0034BMETAL, SHIELD LX52 REAR SHIELD-DUAL
4940900022BKNOB, MAIN 5KEY LX52 TACK KNOB ADD SOURCE PRINTING
49509K0262AMETAL, SUPPORT L1752 BRACKET
49509K0263AMETAL, SUPPORT L1952S BRACKET
49519K0137AMETAL ASSEMBLY, STAND HINGE ASSY 17 INCH
35509K0242ACOVER, LX52 HINGE R
35509K0243ACOVER, LX52 HINGE L
35509K0244ACOVER, LX52 HINGE COVER BODY
64109UP002APOWER CORD, DTII-3P-11+DTII-3P-04 HONGCHANG UL/CSA 1870MM PLUG SILVER
R2270RJ0332D67733 OHM 1/10 W 5% 1608 R/TP
R2280RJ4701D6774.7K OHM 1/10 W 5% 1608 R/TP
R2300RJ0000D6770 OHM 1/10 W 5% 1608 R/TP
R2310RJ0000D6770 OHM 1/10 W 5% 1608 R/TP
R2340RJ4700D677470 OHM 1/10 W 5% 1608 R/TP
R2350RJ4701D6774.7K OHM 1/10 W 5% 1608 R/TP
R3010RD1001Q6091K OHM 1/4 W(3.4) 5.00% TA52
R3020RJ5600D677560 OHM 1/10 W 5% 1608 R/TP
R3030RJ2202D67722K OHM 1/10 W 5% 1608 R/TP
R3030RH0222D62222 OHM 1 / 10 W 2012 5.00% D
R3040RD1002Q60910K OHM 1/4 W(3.4) 5.00% TA5
R3050RJ4702D67747000 OHM 1/10 W 5% 1608 R/T
R3060RX0220J6680.22 OHM 1 W 5% SF15
R3070RX0681K6686.8 OHM 2 W 5% SF15
R3080RJ0000D6770 OHM 1/10 W 5% 1608 R/TP
R3090RN1502F40915K OHM 1/6 W 1.00% TA52
R3100RH1004D6221M OHM 1 / 10 W 2012 5.00% D
R3110RH1502D422"15K , 1/10W 1% TP"
R3130RJ6202E47262K OHM 1/8 W 1% 2012 R/TP
R3150RH2001D6222K OHM 1 / 10 W 2012 5.00% D
R3160RH2001D6222K OHM 1 / 10 W 2012 5.00% D
R3170RJ3303E472330000 OHM 1/8 W 1% 2012 R/T
R3180RJ1503E472150K OHM 1/8 W 1% 2012 R/TP
R3190RH1303D622130K OHM 1 / 10 W 2012 5.00%
R3200RH1502D422"15K , 1/10W 1% TP"
R3210RH1002D42210K OHM 1/10 W 1% 2012 R/TP
R4010RJ1001G4761K OHM 1/4 W 1% 3216 R/TP
R4020RJ1001G4761K OHM 1/4 W 1% 3216 R/TP
R4030RJ1001G4761K OHM 1/4 W 1% 3216 R/TP
R4040RJ1001G4761K OHM 1/4 W 1% 3216 R/TP
R4060RJ3600E472360 OHM 1/8 W 1% 2012 R/TP
R4070RJ3600E472360 OHM 1/8 W 1% 2012 R/TP
R4080RJ3600E472360 OHM 1/8 W 1% 2012 R/TP
R4090RJ3600E472360 OHM 1/8 W 1% 2012 R/TP
R4150RJ1200D677120 OHM 1/10 W 5% 1608 R/TP
R4160RJ1200D677120 OHM 1/10 W 5% 1608 R/TP
R4170RJ1000D677100 OHM 1/10 W 5% 1608 R/TP
R4180RJ1000D677100 OHM 1/10 W 5% 1608 R/TP
R4190RJ1000D677100 OHM 1/10 W 5% 1608 R/TP
R4200RJ2001D6772K OHM 1/10 W 5% 1608 R/TP
R4220RJ4701D6774.7K OHM 1/10 W 5% 1608 R/TP
R4230RJ4701D6774.7K OHM 1/10 W 5% 1608 R/TP
R4240RJ0000D6770 OHM 1/10 W 5% 1608 R/TP
R4250RJ0122D67712 OHM 1/10 W 5% 1608 R/TP
R4260RJ0122D67712 OHM 1/10 W 5% 1608 R/TP
R4270RJ0122D67712 OHM 1/10 W 5% 1608 R/TP
R4280RJ0122D67712 OHM 1/10 W 5% 1608 R/TP
R4290RJ0122D67712 OHM 1/10 W 5% 1608 R/TP
R4300RJ0122D67712 OHM 1/10 W 5% 1608 R/TP
R4310RJ0222D67722 OHM 1/10 W 5% 1608 R/TP
R4320RJ0222D67722 OHM 1/10 W 5% 1608 R/TP
R4330RJ4700D677470 OHM 1/10 W 5% 1608 R/TP
R4340RJ4701D6774.7K OHM 1/10 W 5% 1608 R/TP
R4350RJ4701D6774.7K OHM 1/10 W 5% 1608 R/TP
R4360RJ0332D67733 OHM 1/10 W 5% 1608 R/TP
R4370RJ0332D67733 OHM 1/10 W 5% 1608 R/TP
R4380RJ4701D6774.7K OHM 1/10 W 5% 1608 R/TP
R4390RJ4701D6774.7K OHM 1/10 W 5% 1608 R/TP
R4400RJ0332D67733 OHM 1/10 W 5% 1608 R/TP
R4410RJ0000D6770 OHM 1/10 W 5% 1608 R/TP
R4420RJ0682D67768 OHM 1/10 W 5% 1608 R/TP
R4430RJ0682D67768 OHM 1/10 W 5% 1608 R/TP
R4440RJ0332D67733 OHM 1/10 W 5% 1608 R/TP
R4450RJ0752D67775 OHM 1/10 W 5% 1608 R/TP
R4460RJ0752D67775 OHM 1/10 W 5% 1608 R/TP
R4480RJ0752D67775 OHM 1/10 W 5% 1608 R/TP
OTHERs
F1010FZZTTH001ETIME LAG HBC 2153.15MXE(LEAD
R201971-0016TIN HDC 0.60H NON NON
R306971-0016TIN HDC 0.60H NON NON
SC1016620K00020AHUAJIE AC UL/CSA 3PPIN BLACK
T10161709MC011AEER3016 430UH LX52 LIPS SMPS
T30161709MC010AEFD-2124 95UH INVERTER TRANS
T30261709MC010AEFD-2124 95UH INVERTER TRANS
TH1016322A00035A10D2-07 SEMITEC 10OHM 15% L1
X2016212AA2004FHC-49U TXC 14.318 MHZ +/- 30
CONTROL BOARD
R10RD7501Q6097.50K 1/4W(3 5% TA52
R20RD7501Q6097.50K 1/4W(3 5% TA52
R30RD1801Q6091.8K OHM 1/4 W(3.4) 5.00% TA
R40RD1201Q6091.20K 1/4W(3 5% TA52
R50RD1201Q6091.20K 1/4W(3 5% TA52
SW1140-058ESKHV10910B LGEC NON 12V 20A
SW2140-058ESKHV10910B LGEC NON 12V 20A
SW3140-058ESKHV10910B LGEC NON 12V 20A
SW4140-058ESKHV10910B LGEC NON 12V 20A
SW5140-058ESKHV10910B LGEC NON 12V 20A
ZD4010DZ560009AGGDZJ5.6B TP GRANDE DO-34 500
ZD4020DZ560009AGGDZJ5.6B TP GRANDE DO-34 500
LED10DLLT0089AALITEON LTL-1BEDJ-0C2 TP GREE
R1010RJ4703G676470K OHM 1/4 W 5% 3216 R/TP
R1020RJ6801E4726800 OHM 1/8 W 1% 2012 R/TP
R1030RH1004D6221M OHM 1 / 10 W 2012 5.00% D
R1040RH1001D6221K OHM 1 / 10 W 2012 5.00% D
R1050RD0912Q60991 OHM 1/4 W (3.4) 5% TA52
R1060RH2201D6222.2K OHM 1 / 10 W 2012 5.00%
R1070RD8203A609820K OHM 1/2 W(7.0) 5.00% TA
R1080RD4702A60947K OHM 1/2 W(7.0) 5.00% TA5
R1090RX0560J6090.56OHM 1 W 5% TA52
R1100RX1003K607100KOHM 2 W 5% TA62
R1110RD0471Q6094.70 1/4W(3 5% TA52
R1120RJ1302E47213K OHM 1/8 W 1% 2012 R/TP
R1150RJ4703G676470K OHM 1/4 W 5% 3216 R/TP
R1160RJ4703G676470K OHM 1/4 W 5% 3216 R/TP
R1170RH2403D622240K OHM 1 / 10 W 2012 5.00%
R1180RH2403D622240K OHM 1 / 10 W 2012 5.00%
R2020RX0242K66524 OHM 2 W 5% SF
R2040RN3002F40930K OHM 1/6 W 1.00% TA52
R2050RN2201F4092.2K OHM 1/6 W 1.00% TA52
R2060RJ1601E4721.6K OHM 1/8 W 1% 2012 R/TP
R2070RH1001D6221K OHM 1 / 10 W 2012 5.00% D
R2080RH6800D622680 OHM 1 / 10 W 2012 5.00%
R2090RH1001D6221K OHM 1 / 10 W 2012 5.00% D
R2110RJ1001G4761K OHM 1/4 W 1% 3216 R/TP
R3010RD1001Q6091K OHM 1/4 W(3.4) 5.00% TA52
R3030RH0222D62222 OHM 1 / 10 W 2012 5.00% D
R3040RD1002Q60910K OHM 1/4 W(3.4) 5.00% TA5
R3090RN1502F40915K OHM 1/6 W 1.00% TA52
R3100RH1004D6221M OHM 1 / 10 W 2012 5.00% D
R3110RH1502D422"15K , 1/10W 1% TP"
R3130RJ6202E47262K OHM 1/8 W 1% 2012 R/TP
R3150RH2001D6222K OHM 1 / 10 W 2012 5.00% D
R3160RH2001D6222K OHM 1 / 10 W 2012 5.00% D
R3170RJ3303E472330000 OHM 1/8 W 1% 2012 R/T
R3180RJ1503E472150K OHM 1/8 W 1% 2012 R/TP
R3190RH1303D622130K OHM 1 / 10 W 2012 5.00%
R3200RH1502D422"15K , 1/10W 1% TP"
R3210RH1002D42210K OHM 1/10 W 1% 2012 R/TP
R4010RJ1001G4761K OHM 1/4 W 1% 3216 R/TP
R4020RJ1001G4761K OHM 1/4 W 1% 3216 R/TP
R4030RJ1001G4761K OHM 1/4 W 1% 3216 R/TP
R4040RJ1001G4761K OHM 1/4 W 1% 3216 R/TP
R4060RJ3600E472360 OHM 1/8 W 1% 2012 R/TP
R4070RJ3600E472360 OHM 1/8 W 1% 2012 R/TP
R4080RJ3600E472360 OHM 1/8 W 1% 2012 R/TP
R4090RJ3600E472360 OHM 1/8 W 1% 2012 R/TP
TH1016322A00035A10D2-07 SEMITEC 10OHM 15% L1
TRANSFORMER
T10161709MC011AEER3016 430UH LX52 LIPS SMPS
T30161709MC010AEFD-2124 95UH INVERTER TRANS
T30261709MC010AEFD-2124 95UH INVERTER TRANS
OTHERs
SC1016620K00020AHUAJIE AC UL/CSA 3PPIN BLACK
F1010FZZTTH001ETIME LAG HBC 2153.15MXE(LEAD
FB1016210TCE003GBRS3550B BO SUNG 3550MM RADI
HS14920900021AEXTRUSION 10*20 16 LX52
HS24920900021AEXTRUSION 10*20 16 LX52