LG LGAJ10N Users manual

Technical Specification (TM01LA-N)

History

	Ver.	Date	Contents	Written	Checked	Approved	Note
				by	by	by

/30

	Contents
1. Product Introduction.....................................................................................................		4
1.1	Block Diagram....................................................................................................	4
1.2	Environmental Specifications..............................................................................	6
1.3	Electrical Specifications......................................................................................	6
1.3.1 Absolute Maximum and ESD Ratings...........................................................		6
1.3.2 Current Consumption...................................................................................		7
1.4	Mechanical Specifications .................................................................................	8
1.4.1 Physical Dimensions and Connection Interface ...........................................		8
1.4.2 Mechanical Drawing.....................................................................................		9
1.4.3 Footprint ......................................................................................................		9
1.5 PCB information............................................................................................		10
1.5.1 PCB Stack up ............................................................................................		10
2. Pin Definitions............................................................................................................		10
2.1 VCOIN..............................................................................................................		13
2.2	ON/OFF Control ...............................................................................................	14
2.2.1 ON/OFF Timing..........................................................................................		14
2.2.2 Deep Sleep ................................................................................................		14
2.2.3 Sequence to Enter Deep Sleep Mode ........................................................		15
2.3 USB..................................................................................................................		16
2.4 UART ...............................................................................................................		16
2.5	UIM Interface....................................................................................................	16
2.6	General Purpose IO .........................................................................................	17
2.7	Secure Digital IO ..............................................................................................	17
2.8	I2C Interface ...................................................................................................	17
2.9 RESET .............................................................................................................		18
2.10 ADC................................................................................................................		19
2.11 LED driver .....................................................................................................		19
2.13 SPI Interface .................................................................................................		20
2.14 HSIC Interface ..............................................................................................		20
2.15 JTAG Interface ..............................................................................................		21
3 RF Specification.......................................................................................................		21
3.1. WCDMA Specification .....................................................................................		22
3.1. LTE Specification.............................................................................................		23
3.3. GSM Specification...........................................................................................		26
3.3. TD-SCDMA Specification.................................................................................		27
	/30

4. GNSS ......................................................................................................................		28
4.1	GNSS Characteristics.......................................................................................	28
4.2	GNSS Antenna Interface ..................................................................................	29
4.3 Active antenna Powering the External LNA ......................................................		29

/30

1. Product Introuction

The TM01LA-N are designed for the automotive industry. They support LTE, WCDMA and GSM air Interface standards. They also have Global Navigation satellite system (GNSS) capabilities including GPS and GLONASS.

The TM01LA\-N are based on the Qualcomm MDM9215 wireless chipsets and support the following bands.

Table 1. Supported Band

	Region			NA	TML1-E	TML1-C
		LTE		B2/B4/B5/B7/B17
	Band
		WCDMA		B2/B4/B5
		GSM		GSM850/PCS1900
	GNSS			O
	Voice			O

1.1 Block Diagram

Figure 1.1. TM01LA-N Block diagram

5/30

1.2 Environmental Specifications

The environmental specification for operating and storage of the TM01LA-N are defined in the the table below.

LGE guarantee the automotive operation by internal reliability verification

Table 2. Environmental Specifications

Parameter	Temperature Range
Operating Temperature	1) -40 to 85
Storage Temperature	2) -40 to +105
Humidity	95% or less

1)At 90 operating, there is some deviation, but a module can meet 3GPP RF HW Spec

2)A module can accept over 105 storage temperature without packing

A module was guaranteed 34.2 MTTF in worst case at least

1.3 Electrical Specifications

This section provides details for some of the key electrical specifications of the TM01LA-N embedded modules.

1.3.1 Absolute Maximum Rating and ESD Ratings

This section defines the Absolute Maximum and Electrostatic Discharge (ESD) Ratings of the TM01LA-N embedded modules.

Warning: If these parameters are exceeded, even momentarily, damage may occur to the device.

Table 3. Absolute Maximum Ratings

Parameter		Min	Max	Units
+3.7V_VPWR	Power Supply Input	-	tbd	V
VIN	Voltage on any digital input or output pin	-	VREG_MDME+0.5	V
Maximum Voltage applied to antenna interface pins
VANT	Primary Antenna		tbd	V
	Diversity Antenna		tbd	V
	GNSS Antenna		tbd	V
ESD Ratings
ESD1	Primary, Diversity and GNSS antenna		tbd	kV
	pads - Contact
	All other signal pads - Contact		tbd	kV

1 The ESD Simulator configured with 330pF, 1000 .

Caution: The TM01LA-N embedded modules are sensitive to Electrostatic Discharge. ESD countermeasures and handling methods must be used when handling the TM01LA-N devices.

6/30

1.3.2 Current Consumption

Table 4. TM01LA-N Current Consumption (TBD)

Mode		Parameter	Typical	Max		Units
		Band 2, Max TX Output Power
WCDMA		Band 4, Max TX Output Power				mA
		Band 5, Max TX Output Power
		Band2, Max TX Output /Full RB
		Band4, Max TX Output /Full RB
LTE		Band5, Max TX Output /Full RB				mA
		Band7, Max TX Output /Full RB
		Band17, Max TX Output /Full RB
GSM		850/900MHz PCL5				mA
		1800/1900MHz PCL0
WCDMA		Idle, Registered				mA
LTE		Idle, Registered				mA
GSM		Idle, Registered				mA
WCDMA		Sleep Mode, Average Current				mA
LTE		Sleep Mode, Average Current				mA
GSM		Sleep Mode, Average Current				mA

1.4 Mechanical Specifications

1.4.1 Physical Dimensions and Connection Interface

The TM01LA-N embedded modules are a Land Grid Array (LGA) form factor device. The device does not have a System or RF connectors. All electrical and mechanical connections are made via the 206 pad TM01LA-N on the underside of the PCB.

Table5. TM01LA-N Embedded Module Dimensions

Parameter	Nominal	Max	Units
Overall Dimension	35 x 35	35.35 x 35.35	mm
Overall Module Height	3.5	3.85	mm
PCB Thickness	1.0	1.1	mm
Flatness Specification		0.1	mm
Weight	tbd		g

7/30

1.4.2 Mechanical Drawing

[Top view]

[Right view]

[Bottom view]

1.4.3 Footprint

8/30

[LGA PAD View]

1.5 PCB information

1.5.1 PCB Stack up

9/30

1.5.2 PCB via structure

2. Pin Definitions

	Pin No.	Name	Direction	Description
	RF Antenna Pads
	12	ANT_MAIN	Input/Output
	15	ANT_DIVERSITY	Input
	GNSS Antenna Pad
	126	ANT_GNSS	Input
	Power Supply Pads
	81,82,91,92	+3.7V_VPWR	Input	Power Supply Input
	114	VREG_MDME	Output	Voltage Reference Output (1.8V)
	84	VDD_AUDIO_3.3V	Input	Audio codec power supply (typ 3.3V)
	135	VCOIN_3.3V	Input	Coin Battery Input
	USB Pads
			10/30