LG LGAJ10N Users manual
Technical Specification (TM01LA-N)
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Contents
1. Product Introduction..................................................................................................... 4
1.1 Block Diagram .................................................................................................... 4
1.2 Environmental Specifications .............................................................................. 6
1.3 Electrical Specifications ...................................................................................... 6
1.3.1 Absolute Maximum and ESD Ratings ........................................................... 6
1.3.2 Current Consumption ................................................................................... 7
1.4 Mechanical Specifications ................................................................................. 8
1.4.1 Physical Dimensions and Connection Interface ........................................... 8
1.4.2 Mechanical Drawing ..................................................................................... 9
1.4.3 Footprint ...................................................................................................... 9
1.5 PCB information ............................................................................................ 10
1.5.1 PCB Stack up ............................................................................................ 10
2. Pin Definitions............................................................................................................ 10
2.1 VCOIN .............................................................................................................. 13
2.2 ON/OFF Control ............................................................................................... 14
2.2.1 ON/OFF Timing .......................................................................................... 14
2.2.2 Deep Sleep ................................................................................................ 14
2.2.3 Sequence to Enter Deep Sleep Mode ........................................................ 15
2.3 USB .................................................................................................................. 16
2.4 UART ............................................................................................................... 16
2.5 UIM Interface .................................................................................................... 16
2.6 General Purpose IO ......................................................................................... 17
2.7 Secure Digital IO .............................................................................................. 17
2.8 I2C Interface ................................................................................................... 17
2.9 RESET ............................................................................................................. 18
2.10 ADC ................................................................................................................ 19
2.11 LED driver ..................................................................................................... 19
2.13 SPI Interface ................................................................................................. 20
2.14 HSIC Interface .............................................................................................. 20
2.15 JTAG Interface .............................................................................................. 21
3 RF Specification ....................................................................................................... 21
3.1. WCDMA Specification ..................................................................................... 22
3.1. LTE Specification ............................................................................................. 23
3.3. GSM Specification ........................................................................................... 26
3.3. TD-SCDMA Specification................................................................................. 27
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4. GNSS ...................................................................................................................... 28
4.1 GNSS Characteristics....................................................................................... 28
4.2 GNSS Antenna Interface .................................................................................. 29
4.3 Active antenna Powering the External LNA ...................................................... 29
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. Product Introuction
1
The TM01LA-N are designed for the automotive industry. They support LTE, WCDMA and
GSM air Interface standards. They also have Global Navigation satellite system (GNSS)
capabilities including GPS and GLONASS.
The TM01LA\-N are based on the Qualcomm MDM9215 wireless chipsets and support the
following bands.
Table 1. Supported Band
Region NA TML1-E TML1-C
LTE
Band
WCDMA
GSM GSM850/PCS1900
GNSS O
Voice O
1.1 Block Diagram
B2/B4/B5/B7/B17
B2/B4/B5
Figure 1.1. TM01LA-N Block diagram
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Parameter
Min Max
Units
Maximum Voltage applied to antenna interface pins
ESD Ratings
1.2 Environmental Specifications
The environmental specification for operating and storage of the TM01LA-N are defined in the
the table below.
LGE guarantee the automotive operation by internal reliability verification
Table 2. Environmental Specifications
Parameter Temperature Range
Operating Temperature
Storage Temperature
Humidity 95% or less
1)
At 90℃operating, there is some deviation, but a module can meet 3GPP RF HW Spec
2)
A module can accept over 105 ℃ storage temperature without packing
1)
-40℃ to 85℃
2)
-40℃ to +105℃
A module was guaranteed 34.2 MTTF in worst case at least
1.3 Electrical Specifications
This section provides details for some of the key electrical specifications of the TM01LA-N
embedded modules.
1.3.1 Absolute Maximum Rating and ESD Ratings
This section defines the Absolute Maximum and Electrostatic Discharge (ESD) Ratings of the
TM01LA-N embedded modules.
Warning: If these parameters are exceeded, even momentarily, damage may occur to the
device.
Table 3. Absolute Maximum Ratings
+3.7V_VPWR Power Supply Input - tbd V
VIN Voltage on any digital input or output pin
- VREG_MDME+0.5 V
VANT Primary Antenna tbd V
Diversity Antenna tbd V
GNSS Antenna tbd V
ESD1
Primary, Diversity and GNSS antenna
pads - Contact
All other signal pads - Contact tbd kV
tbd
kV
1 The ESD Simulator configured with 330pF, 1000Ω.
Caution: The TM01LA-N embedded modules are sensitive to Electrostatic Discharge. ESD
countermeasures and handling methods must be used when handling the TM01LA-N devices.
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Parameter
Nominal
Max
Units
1.3.2 Current Consumption
Table 4. TM01LA-N Current Consumption (TBD)
Mode Parameter Typical Max Units
Band 2, Max TX Output Power
WCDMA
LTE
GSM 850/900MHz PCL5
WCDMA Idle, Registered
LTE Idle, Registered
GSM Idle, Registered
WCDMA Sleep Mode, Average Current
LTE Sleep Mode, Average Current
GSM Sleep Mode, Average Current
Band 4, Max TX Output Power
Band 5, Max TX Output Power
Band2, Max TX Output /Full RB
Band4, Max TX Output /Full RB
Band5, Max TX Output /Full RB
Band7, Max TX Output /Full RB
Band17, Max TX Output /Full RB
1800/1900MHz PCL0
mA
mA
mA
mA
mA
mA
mA
mA
mA
1.4 Mechanical Specifications
1.4.1 Physical Dimensions and Connection Interface
The TM01LA-N embedded modules are a Land Grid Array (LGA) form factor device. The
device does not have a System or RF connectors. All electrical and mechanical connections
are made via the 206 pad TM01LA-N on the underside of the PCB.
Table5. TM01LA-N Embedded Module Dimensions
Overall Dimension 35 x 35 35.35 x 35.35 mm
Overall Module Height 3.5 3.85 mm
PCB Thickness 1.0 1.1 mm
Flatness Specification 0.1 mm
Weight tbd g
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1.4.2 Mechanical Drawing
1.4.3 Footprint
[Top view] [Right view]
[Bottom view]
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1.5 PCB information
1.5.1 PCB Stack up
[LGA PAD View]
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1.5.2 PCB via structure
2. Pin Definitions
Pin No. Name Direction Description
RF Antenna Pads
12 ANT_MAIN Input/Output
15 ANT_DIVERSITY Input
GNSS Antenna Pad
126 ANT_GNSS Input
Power Supply Pads
81,82,91,92 +3.7V_VPWR Input Power Supply Input
114 VREG_MDME Output Voltage Reference Output (1.8V)
84 VDD_AUDIO_3.3V Input Audio codec power supply (typ 3.3V)
135 VCOIN_3.3V Input Coin Battery Input
USB Pads
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