LG LGAJ10N Users manual

Technical Specification (TM01LA-N)

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Contents

1. Product Introduction..................................................................................................... 4

1.1 Block Diagram .................................................................................................... 4

1.2 Environmental Specifications .............................................................................. 6

1.3 Electrical Specifications ...................................................................................... 6

1.3.1 Absolute Maximum and ESD Ratings ........................................................... 6

1.3.2 Current Consumption ................................................................................... 7

1.4 Mechanical Specifications ................................................................................. 8

1.4.1 Physical Dimensions and Connection Interface ........................................... 8

1.4.2 Mechanical Drawing ..................................................................................... 9

1.4.3 Footprint ...................................................................................................... 9

1.5 PCB information ............................................................................................ 10

1.5.1 PCB Stack up ............................................................................................ 10

2. Pin Definitions............................................................................................................ 10

2.1 VCOIN .............................................................................................................. 13

2.2 ON/OFF Control ............................................................................................... 14

2.2.1 ON/OFF Timing .......................................................................................... 14

2.2.2 Deep Sleep ................................................................................................ 14

2.2.3 Sequence to Enter Deep Sleep Mode ........................................................ 15

2.3 USB .................................................................................................................. 16

2.4 UART ............................................................................................................... 16

2.5 UIM Interface .................................................................................................... 16

2.6 General Purpose IO ......................................................................................... 17

2.7 Secure Digital IO .............................................................................................. 17

2.8 I2C Interface ................................................................................................... 17

2.9 RESET ............................................................................................................. 18

2.10 ADC ................................................................................................................ 19

2.11 LED driver ..................................................................................................... 19

2.13 SPI Interface ................................................................................................. 20

2.14 HSIC Interface .............................................................................................. 20

2.15 JTAG Interface .............................................................................................. 21

3 RF Specification ....................................................................................................... 21

3.1. WCDMA Specification ..................................................................................... 22

3.1. LTE Specification ............................................................................................. 23

3.3. GSM Specification ........................................................................................... 26

3.3. TD-SCDMA Specification................................................................................. 27

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4. GNSS ...................................................................................................................... 28

4.1 GNSS Characteristics....................................................................................... 28

4.2 GNSS Antenna Interface .................................................................................. 29

4.3 Active antenna Powering the External LNA ...................................................... 29

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. Product Introuction

1 The TM01LA-N are designed for the automotive industry. They support LTE, WCDMA and GSM air Interface standards. They also have Global Navigation satellite system (GNSS) capabilities including GPS and GLONASS. The TM01LA\-N are based on the Qualcomm MDM9215 wireless chipsets and support the following bands.

Table 1. Supported Band

Region NA TML1-E TML1-C

LTE

Band

WCDMA

GSM GSM850/PCS1900

GNSS O

Voice O

1.1 Block Diagram

B2/B4/B5/B7/B17

B2/B4/B5

Figure 1.1. TM01LA-N Block diagram

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Parameter

Min Max

Units

Maximum Voltage applied to antenna interface pins

ESD Ratings

1.2 Environmental Specifications The environmental specification for operating and storage of the TM01LA-N are defined in the the table below. LGE guarantee the automotive operation by internal reliability verification

Table 2. Environmental Specifications

Parameter Temperature Range

Operating Temperature

Storage Temperature

Humidity 95% or less

1)

At 90℃operating, there is some deviation, but a module can meet 3GPP RF HW Spec

2)

A module can accept over 105 ℃ storage temperature without packing

1)

-40℃ to 85℃

2)

-40℃ to +105℃

A module was guaranteed 34.2 MTTF in worst case at least

1.3 Electrical Specifications This section provides details for some of the key electrical specifications of the TM01LA-N

embedded modules.

1.3.1 Absolute Maximum Rating and ESD Ratings This section defines the Absolute Maximum and Electrostatic Discharge (ESD) Ratings of the

TM01LA-N embedded modules.

Warning: If these parameters are exceeded, even momentarily, damage may occur to the device.

Table 3. Absolute Maximum Ratings

+3.7V_VPWR Power Supply Input - tbd V VIN Voltage on any digital input or output pin

- VREG_MDME+0.5 V

VANT Primary Antenna tbd V

Diversity Antenna tbd V GNSS Antenna tbd V

ESD1

Primary, Diversity and GNSS antenna pads - Contact All other signal pads - Contact tbd kV

tbd

kV

1 The ESD Simulator configured with 330pF, 1000Ω.

Caution: The TM01LA-N embedded modules are sensitive to Electrostatic Discharge. ESD countermeasures and handling methods must be used when handling the TM01LA-N devices.

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Parameter

Nominal

Max

Units

1.3.2 Current Consumption

Table 4. TM01LA-N Current Consumption (TBD)

Mode Parameter Typical Max Units

Band 2, Max TX Output Power

WCDMA

LTE

GSM 850/900MHz PCL5

WCDMA Idle, Registered LTE Idle, Registered GSM Idle, Registered WCDMA Sleep Mode, Average Current LTE Sleep Mode, Average Current GSM Sleep Mode, Average Current

Band 4, Max TX Output Power Band 5, Max TX Output Power Band2, Max TX Output /Full RB Band4, Max TX Output /Full RB Band5, Max TX Output /Full RB Band7, Max TX Output /Full RB Band17, Max TX Output /Full RB

1800/1900MHz PCL0

mA

mA mA

mA mA mA mA mA

1.4 Mechanical Specifications

1.4.1 Physical Dimensions and Connection Interface The TM01LA-N embedded modules are a Land Grid Array (LGA) form factor device. The

device does not have a System or RF connectors. All electrical and mechanical connections are made via the 206 pad TM01LA-N on the underside of the PCB.

Table5. TM01LA-N Embedded Module Dimensions

Overall Dimension 35 x 35 35.35 x 35.35 mm Overall Module Height 3.5 3.85 mm PCB Thickness 1.0 1.1 mm Flatness Specification 0.1 mm Weight tbd g

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1.4.2 Mechanical Drawing

1.4.3 Footprint

[Top view] [Right view]

[Bottom view]

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1.5 PCB information

1.5.1 PCB Stack up

[LGA PAD View]

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1.5.2 PCB via structure

2. Pin Definitions

Pin No. Name Direction Description RF Antenna Pads

12 ANT_MAIN Input/Output 15 ANT_DIVERSITY Input

GNSS Antenna Pad

126 ANT_GNSS Input

Power Supply Pads

81,82,91,92 +3.7V_VPWR Input Power Supply Input 114 VREG_MDME Output Voltage Reference Output (1.8V) 84 VDD_AUDIO_3.3V Input Audio codec power supply (typ 3.3V) 135 VCOIN_3.3V Input Coin Battery Input

USB Pads

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185 USB_VBUS Input USB Power Supply 198 USB_D+ Input/Output Differential data interface positive 183 USB_D- Input/Output Differential data interface negative 199 USB_ID Input USB ID

UART Pads

153 UART_RXD Output Receive Data (UART1) 169 UART_TXD Input Transmit Data (UART1) 154 UART2_RXD Output UART2 Receive Data 170 UART2_TXD Input UART2 Transmit Data

UIM Pads

146 VREG_USIM Output Supply output for an UIM card 177 UIM_DET Input Detection of an external UIM card 162 UIM_RESET Output Reset output to an external UIM card 161 UIM_DATA Input/Output Data connection with an external UIM card 163 UIM_CLK Output Clock output to an external UIM card

GPIO I/F Pads

172 GPIO1 Pull-Down Available-GPIO 128 GPIO2 Pull-Down Available-GPIO 150 GPIO3 Pull-Down Available-GPIO 164 GPIO4 Pull-Down Available-GPIO 139 GPIO5 Pull-Down Available-GPIO 189 GPIO6 Pull-Down Available-GPIO 137 GPIO7 Pull-Down Available-GPIO 138 GPIO8 Pull-Down Available-GPIO 148 GPIO9 Pull-Down Available-GPIO 130 GPIO10 Pull-Down Available-GPIO

Analog Audio I/F Pads

2 AUDIO_INP1 Input Microphone 1 input positive 3 AUDIO_INN1 Input Microphone 1 input negative 17 AUDIO_INP2 Input Microphone 2 input positive 18 AUDIO_INN2 Input Microphone 2 input negative 19 AUDIO_LINE_IN Input Audio LINE_IN input 48 SPK_OUT3 Output Speaker 3 output 64 SPK_OUT1 Output Speaker 1 output 73 SPK_OUT2 Output Speaker 2 output

HSIC I/F Pads

195 HSIC_STB Input/Output HSIC Strobe signal 194 HSIC_DATA Input/Output HSIC data signal 196 HSIC_CAL Input/Output HSIC calibration pad

Reset Pads

147 RESET_N Input External H/W Reset Input 133 RESOUT_N Output MDM Reset Output

ADC I/F Pads

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129 ADC2 Input Analog to Digital Converter Input 204 ADC1 Input Analog to Digital Converter Input

LED I/F Pad

188 LED Output LED Driver control

SPI I/F Pads

171 SPI_CLK Output SPI Serial Clock 186 SPI_MISO Input SPI Serial input 201 SPI_MOSI Output SPI Serial output 202 SPI_CS_N Output SPI Chip Select

ON/OFF Pad

173 ON/OFF Input ON/OFF Control

SDIO I/F Pads

140 SDIO_DATA0 Input/Output SDIO Data bit 0 122 SDIO_DATA1 Input/Output SDIO Data bit 1 141 SDIO_DATA2 Input/Output SDIO Data bit 2 142 SDIO_DATA3 Input/Output SDIO Data bit 3 131 SDIO_CMD Output SDIO Command 132 SDIO_CLK Output SDIO Clock

I2C I/F Pads

117 I2C_SCL Output I2C Clock output 109 I2C_SDA Input/Output I2C Data

JTAG I/F Pads

159 TRST/ Input Debugging 124 TDI Input Debugging 190 TMS Input Debugging 175 TCK Input Debugging 143 RTCK Output Debugging 174 TDO Output Debugging 206 JTAG_PS_HOLD Input Debugging 166 JTAG_RESIN_NN Input Debugging 113 VREG_MDME Output Power Supply JTAG (1.8V)

Reserved

203 ADC5 Reserved (PMIC MPP_05) 74 AUDIO_RST/ Reserved 75 DEBUG_AUDIO_RST/ Reserved 93 DEBUG_SDOUT3 Reserved 94 I2S_DOUT Reserved 99 DEBUG_I2C_SCL Reserved 100 DEBUG_I2C_SDA Reserved 101 DEBUG_SDOUT2 Reserved 102 I2S_CLK Reserved 103 I2S_WS Reserved 110 I2S_DIN Reserved 111 WIFI_PM_EN Reserved 112 WIFI_CLK_REQ Reserved

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120 WIFI_RESET_N Reserved 180 GPIO68 Reserved 181 GPIO65 Reserved 182 GPIO66 Reserved 197 GPIO67 Reserved 158 145 XO_OUT Clock Reserved 155 UART_RTS/ Reserved 156 UART_CTS/ Reserved 160 TCU_PCM_RXD Reserved 165 WAKE_N Reserved 176 TCU_PCM_CLK Reserved 191 TCU_PCM_FRAME Reserved 192 TCU_PCM_TXD Reserved 200 I2S_MCLK Reserved 205 NDR_PULSE Reserved 149 GPIO_49 Reserved

Ground

1,4,5,6,7,8,9,10,11,13, 14,16,20,21,22,23,24, 25,26,27,28,29,30,31, 32,33,34,35,36,37,38,39 ,40,41,42,43,44,45,46,4 7,49,50,51,52,53,54,55, 56,57,58, 59,60,61,62,63, 65,66,67,68,69, 70,71,72,76,77, 78,79,80,83,85, 86,87,88,89,90, 95,96,97,98,104, 105,106,107,108,115, 116,118,119,121,123, 125,127,134,136,144, 151,152,157,167,168, 178,179,184,187,193,20 7,208,209,210,211,212, 213,214,215,216,217,21 8

PBL_STATUS/HSIC_RST_N

GND Ground GND

Reserved

2.1 VCOIN

The TM01LA-N provides an interface for a coin cell to maintain the internal RTC when +3.7V_VPWR is removed from the TM01LA-N device. Whenever +3.7V_VPWR is applied the RTC is powered from the +3.7V_VPWR supply.

Table7. VCOIN Interface Specification

VCOIN Min Typ Max Units DC Power Input Range 2 3 3.2 V Current Draw 1.1 2.0 µA

2.2 ON/OFF Control

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The ON/OFF signal is internally pulled up to an internal 1.8V reference voltage. An open drain transistor should be connected to this pin to generate a low pulse. This pin should not be driven high external to the TM01LA-N embedded module.

2.2.1 ON/OFF Timing (TBD)

The ON/OFF pin is a low pulse toggle control. The first pulse powers the TM01LA-N ON, a second pulse instructs the TM01LA-N to begin the Shutdown process. The diagram below illustrates the recommended application implementation for ON/OFF control.

The diagram below illustrates an alternate application implementation that holds ON/OFF low during operation.

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Table8. Power-ON Sequence Symbol Definitions (TBD)

Symbol Parameter Min Typ Max t ON Turn ON Pulse duration TBD t OFF Turn OFF Pulse duration TBD t pwroff Time to Power OFF - TBD t pwrrmv

Time +3.7V_VPWR must be

TBD

TBD TBD

TBD

maintained after VREG_MDME goes inactive

t HI

Time required for ON/OFF to be

TBD TBD

high prior to OFF pulse.

T pwroff is the time between when a power OFF pulse is complete and when shutdown is completed by the TM01LA-N devices. This duration is network and device dependent, i.e. in a CDMA network a power down registration is initiated by the TM01LA-N device, when the acknowledgement is received from the network power OFF completes. Detection of power down can be accomplished by monitoring for one of the following:

● +WIND: 10 output on the AT Command interface

● USB ports are de-enumerated

The application must wait for a power down to be detected prior to removing power from the TM01LA-N device. If a timeout is required, it is recommended to be in excess of 30s prior to removing power from the TM01LA-N device.

2.2.2 Deep Sleep

The TM01LA-N embedded modules support a low power mode in which the device is registered on the LTE/GSM/WCDMA network and sleeps in between wake intervals where it listens for pages.

The following table lists the parameter that defines the wake interval period for the various devices.

Table9. Period of Wake Intervals

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Device Network Standard Parameter

TM01LA-N

GSM DRX WCDMA DRX

LTE DRX The DRX cycle index values are broadcast by the wireless network on which the TM01LA-N embedded module is registered. While in Deep Sleep mode the functions of the TM01LA-N are limited as defined in the following table.

Table10. Deep Sleep Function Availability

Function Availability Conditions Paging

√

GNSS GNSS is powered down Time measurement

√

USB USB_VBUS is not applied UART Digital IO Digital IO pins maintained last state

Events that cause the TM01LA-N to wake-up from Deep Sleep mode include:

 Incoming call  Expiration of an internal timer in the TM01LA-N  USB_VBUS is applied to the TM01LA-N  WAKE_N is asserted (low)  UART1 DTR is asserted (high) if UART1 DTR has been enabled as a sleep control

(AT+W32K=1,1) and AT Command Service is mapped to UART1

 GNSS location fix request is initiated from an Embedded Application

2.2.3 Sequence to Enter Deep Sleep Mode

The following list defines the sequence needed by the application to allow the TM01LA-N to enter Deep Sleep mode:

1. TM01LA-N has registered on the WWAN network (or callbox), and is not in a call.

2. End GNSS Tracking session.

3. Turn off GNSS Antenna bias.

4. Confirm WAKE_N is not held low (pulled-up in TML1-X).

5. Ensure UARTs are in the inactive state.

6. Remove VBUS from being applied to the AR device.

7. Ensure UARTs are in the inactive state.

8. Remove VBUS from being applied to the AR device.

2.3 USB

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USB

Value

Units

The TM01LA-N has a High Speed USB2.0 compliant, peripheral only interface. The TM01LA-N don’t support OTG.

The TM01LA-N will not be damaged if a valid USB_VBUS is supplied while the main DC power is not supplied.

Table10. USB Characteristics

USB_VBUS Voltage range 2.0 – 5.25 V

Maximum Current draw 1 1 mA Maximum Input Capacitance (Min ESR = 50 mΩ)

10 µF

1

With the TM01LA-N device powered ON.

2.4 UART

The TM01LA-N has two UART interfaces. The primary UART is an 4-wire electrical interface and the secondary UART is a 2-wire electrical interface.

Table11. UART Interface PADs

Pin No. Name Direction Description

153 UART_RXD Output Receive Data (UART1) 169 UART_TXD Input Transmit Data (UART1) 154 UART2_RXD Output Receive Data (UART2) 170 UART2_TXD Input Transmit Data (UART2) 155 UART_RTS/ Output Request To Send(UART1) 156 UART_CTS/ Input Clear To Send(UART1)

2.5 UIM Interface

The UIM interface of the TM01LA-N supports a USIM for LTE, WCDMA and GSM.

Table13. UIM Interface PADs

Pin No. Name Direction Description

146 VREG_USIM Output Supply output for an UIM card 177 UIM_DET Input Detection of an external UIM card 162 UIM_RESET Output Reset output to an external UIM card 161 UIM_DATA Input/Output Data connection with an external UIM card 163 UIM_CLK Output Clock output to an external UIM card

2.6 General Purpose IO

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The TM01LA-N defines 10 GPIOs for customer use.

Table14. GPIO Inferface PADs

Pin No. Name Direction Description

172 GPIO1 Pull-Down Available-GPIO 128 GPIO2 Pull-Down Available-GPIO 150 GPIO3 Pull-Down Available-GPIO 164 GPIO4 Pull-Down Available-GPIO 139 GPIO5 Pull-Down Available-GPIO 189 GPIO6 Pull-Down Available-GPIO 137 GPIO7 Pull-Down Available-GPIO 138 GPIO8 Pull-Down Available-GPIO 148 GPIO9 Pull-Down Available-GPIO 130 GPIO10 Pull-Down Available-GPIO

2.7 Secure Digital IO

The TM01LA-N defines a 1.8V SDIO interface for future use.

Table15. SDIO Inferface PADs

Pin No. Name Direction Description

140 SDIO_DATA0 Input/Output SDIO Data bit 0 122 SDIO_DATA1 Input/Output SDIO Data bit 1 141 SDIO_DATA2 Input/Output SDIO Data bit 2 142 SDIO_DATA3 Input/Output SDIO Data bit 3 131 SDIO_CMD Output SDIO Command 132 SDIO_CLK Output SDIO Clock

2.8 I2C Interface

The TM01LA-N provides an I2C interface. The I2C signals are open drain outputs with 2.2 kΩ pull-up resistors toVREG_MDME (1.8V) internal to the TML1-X.

Table16. I2C Inferface PADs

Pin No. Name Direction Description

117 I2C_SCL Output I2C Clock output 109 I2C_SDA Input/Output I2C Data

2.9 RESET

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The TM01LA-N provides an interface to allow an external application to RESET the module as well as an output to indicate the current RESET state or control an external device.

The RESIN_N signal is pulled-up internal to the TML1-X. An open collector transistor or equivalent should be used to Ground the signal when necessary to RESET the module.

Note: Use of the RESIN_N signal to RESET the TM01LA-N could result in memory corruption if used inappropriately. This signal should only be used if the TM01LA-N has become unresponsive and it is not possible to perform a power cycle.

Table17. Reset Timing

Symbol Parameter Min Typ Max Trdet Duration of RESIN_N signal before firmware

detects it

(debounce timer) Trlen Duration reset asserted tbd Trdel Delay between minimum Reset duration and

Internal Reset generated

tbd

Figure . Illustration of Reset Timing When RESIN_N < Trdel

Figure. Illustration of Reset Timing When RESIN_N Held Low > Trdet+Trdel

2.10 ADC 19/30

The TM01LA-N provides two ADC inputs. The interface information is provided in the tables below.

Table18. ADC Interface Characteristics

ADC Value Units ADCx Full-Scale Voltage Level 0.05 ~ 1.75 V

Resolution 15 bit Sample rate 1.15(tbd) KHz Input Impedance >4 MΩ

2.11 LED driver

The TM01LA-N provides an LED driver. The LED driver is a programmable current sink.

Table19. LED Inferface PAD

Pin No. Name Direction Description

188 LED Output LED Driver control

2.12 Audio

The TM01LA-N supports Analog audio interfaces. The ADC blocks supports Stereo 24-bit Inputs (Differential, Single-ended) and Mono 24-bit (Line-In). The DAC blocks supports Stereo 24-bit output (Stereo) and Line output (Single-ended).

Table20. Audio Inferface PADs

Pin No. Name Direction Description

2 AUDIO_INP1 Input Microphone 1 input positive 3 AUDIO_INN1 Input Microphone 1 input negative 17 AUDIO_INP2 Input Microphone 2 input positive 18 AUDIO_INN2 Input Microphone 2 input negative 19 AUDIO_LINE_IN Input Audio LINE_IN input 48 SPK_OUT3 Output Speaker 3 output 64 SPK_OUT1 Output Speaker 1 output 73 SPK_OUT2 Output Speaker 2 output

2.13 SPI Interface

The TM01LA-N embedded module provides one SPI bus (4-wire interface). SPI bus interface includes:

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 A CLK signal  An O signal  An I signal  A CS (Chip Select) signal

The following features are available on the SPI bus :

 Master-only mode operation  SPI speed is from 128 kbit/s to 26Mbit/s in master mode operation  4-wire interface  4 to 32 bits data length.

Table21. SPI Inferface PADs

Pin No. Name Direction Description

171 SPI_CLK Output SPI Serial Clock 186 SPI_MISO Input SPI Serial input 201 SPI_MOSI Output SPI Serial output 202 SPI_CS_N Output SPI Chip Select

2.14 HSIC Interface

The TM01LA-N embedded module provides one HSIC bus (2-wire interface). HSIC bus interface includes:

 HSIC strobe signal  HSIC data signal  Calibration pad for HSIC port signal

Table22. HSIC Inferface PADs

Pin No. Name Direction Description

195 HSIC_STB Input/Output HSIC Strobe signal 194 HSIC_DATA Input/Output HSIC data signal 196 HSIC_CAL Input/Output HSIC calibration pad

2.15 JTAG Interface

JTAG test points on customer application are recommended for possible failure analysis if necessary in the future.

Table23. JTAG Inferface PADs

Pin No. Name Direction Description

159 TRST/ Input Debugging

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124 TDI Input Debugging 190 TMS Input Debugging 175 TCK Input Debugging 143 RTCK Output Debugging 174 TDO Output Debugging 206 JTAG_PS_HOLD Input Debugging 166 JTAG_RESIN_NN Input Debugging 113 VREG_MDME Output Power Supply JTAG (1.8V)

3. RF Specification

The specifications for the LTE, GSM and WCDMA interfaces are defined. TM01LA-N is designed to be compliant with the standard shown in the table below. Table24. Standards Compliance

Technology Standards

• 3GPP Release 5

• 3GPP Release 6

UMTS (WCDMA)

• 3GPP Release 7

• 3GPP Release 8 LTE • 3GPP Release 8 GSM/GPRS/EDGE • 3GPP Release R99

3.1 WCDMA B1, B2, B4, B5 Specification

3.1.1 WCDMA TX Output Power

The Maximum / Minimum Transmitter Output Power of the TM01LA-N are specified in the following table.

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Table25.

Band Method (UL CH) Specification

WCDMA Band 2 Power Level

WCDMA Band 4 Power Level

WCDMA Band 5 Power Level

Measure Max and Min Transmit Power of Low Channel (CH=9263) in WCDMA B2 Mode

Measure Max and Min Transmit Power of Middle Channel (CH=9400) in WCDMA B2 Mode

Measure Max and Min Transmit Power of High Channel (CH=9537) in WCDMA B2 Mode

Measure Max and Min Transmit Power of Low Channel (CH=1313) in WCDMA B4 Mode

Measure Max and Min Transmit Power of Middle Channel (CH=1413) in WCDMA B4 Mode

Measure Max and Min Transmit Power of High Channel (CH=1513) in WCDMA B4 Mode

Measure Max and Min Transmit Power of Low Channel (CH=4133) in WCDMA B5 Mode

Measure Max and Min Transmit Power of Middle Channel (CH=4183) in WCDMA B5 Mode

Measure Max and Min Transmit Power of High Channel (CH=4232) in WCDMA B5 Mode

Max Power : 20.2~24.2dBm Min Power : ≤ -50dBm

3.1.2 WCDMA RX Sensitivity

The Receiver Sensitivity of the TM01LA-N are specified in the following table.

Table26. Conducted RX (Receive) Sensitivity – WCDMA Bands

Item Method (DL CH) Specification

WCDMA Band 2 BER(Bit Error Rate)

WCDMA Band 4 BER(Bit Error Rate)

WCDMA Band 5 BER(Bit Error Rate)

Measure BER of Low Channel (CH=9663) in WCDMA B2 Mode

Measure BER of Middle Channel (CH=9800) in WCDMA B2 Mode

Measure BER of High Channel (CH=9937) in WCDMA B2 Mode

Measure BER of Low Channel (CH=1538) in WCDMA B4 Mode

Measure BER of Middle Channel (CH=1675) in WCDMA B4 Mode

Measure BER of High Channel (CH=1737) in WCDMA B4 Mode

Measure BER of Low Channel (CH=4358) in WCDMA B5 Mode

Measure BER of Middle Channel (CH=4400) in WCDMA B5 Mode

Measure BER of High Channel (CH=4457) in WCDMA B5 Mode

0~0.1% @<-104.7dBm

0~0.1% @<-106.7dBm

0~0.1% @<-104.7dBm

3.2. LTE B2, B4, B5, B7, B17 Specification

3.2.1 LTE TX Output Power

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The Maximum / Minimum Transmitter Output Power of the TM01LA-N are specified in the following table.

Table27. Conducted TX (Transmit) Max output Power Tolerances – LTE Bands

BAND Method (UL CH) Specification

BAND2 UE Maximum Output Power

BAND4 UE Maximum Output Power

BAND5 UE Maximum Output Power

BAND7 UE Maximum Output Power

BAND17 UE Maximum Output Power

Measure Max and Min Transmit Power of Low Channel (650)

Measure Max and Min Transmit Power of Mid Channel (900)

Measure Max and Min Transmit Power of High Channel (1150)

Measure Max and Min Transmit Power of Low Channel (2000)

Measure Max and Min Transmit Power of Mid Channel (2175)

Measure Max and Min Transmit Power of High Channel (2350)

Measure Max and Min Transmit Power of Low Channel (2450)

Measure Max and Min Transmit Power of Mid Channel (2525)

Measure Max and Min Transmit Power of High Channel (2600)

Measure Max and Min Transmit Power of Low Channel (2800)

Measure Max and Min Transmit Power of Mid Channel (3100)

Measure Max and Min Transmit Power of High Channel (3400)

Measure Max and Min Transmit Power of Low Channel (23735)

Measure Max and Min Transmit Power of Mid Channel (23790)

Measure Max and Min Transmit Power of High Channel (23845)

Max Power : 19.3~25.7dBm Min Power : ≤ -39dBm

3.2.2 LTE RX Sensitivity

The Receiver Sensitivity of the TM01LA-N are specified in the following table.

Table28. Conducted RX (Receive) Sensitivity – LTE Bands

BAND Method (DL CH) Specification

sensitivity : ≤-95 BLER : ≤ 5%

sensitivity : ≤-97 BLER : ≤ 5%

BAND2 Reference sensitivity level(DUAL)

BAND 4 Reference

Measure BLER of Low Channel (650) in Band2

Measure BLER of Mid Channel (900) in Band2

Measure BLER of High Channel (1150) in Band2

Measure BLER of Low Channel (2000) in Band4

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sensitivity level(DUAL)

BAND 5 Reference sensitivity level(DUAL)

BAND 7 Reference sensitivity level(DUAL)

BAND 17 Reference sensitivity level(DUAL)

Measure BLER of Mid Channel (2175) in Band4

Measure BLER of High Channel (2350) in Band4

Measure BLER of Low Channel (2450) in Band5

Measure BLER of Mid Channel (2525) in Band5

Measure BLER of High Channel (2600) in Band5

Measure BLER of Low Channel (2800) in Band7

Measure BLER of Mid Channel (3100) in Band7

Measure BLER of High Channel (3400) in Band7

Measure BLER of Low Channel (5735) in Band12

Measure BLER of Mid Channel (5790) in Band12

Measure BLER of High Channel (5845) in Band12

sensitivity : ≤-97 BLER : ≤ 5%

sensitivity : ≤-95 BLER : ≤ 5%

sensitivity : ≤-94 BLER : ≤ 5%

3.3 GSM 850, 900,1800, 1900 Specification

3.3.1 GSM TX Output Power The Maximum Transmitter Output Power of the TM01LA-N are specified in the following table.

Table29. Conducted TX (Transmit) Max output Power Tolerances – GSM/EDGE Bands

Item Method (DL CH) Specification

GSM850 Power Level

EGSM900 Power Level

DCS1800 Power Level

PCS1900 Power Level

Measure Max Transmit Power of Low Channel (CH=128) in GSM850 Mode Measure Max Transmit Power of Middle Channel (CH=189) in GSM850 Mode Measure Max Transmit Power of High Channel (CH=251) in GSM850 Mode Measure Max Transmit Power of Low Channel (CH=975) in EGSM Mode Measure Max Transmit Power of Middle Channel (CH=38) in EGSM Mode Measure Max Transmit Power of High Channel (CH=124) in EGSM Mode Measure Max Transmit Power of Low Channel (CH=512) in DCS1800 Mode Measure Max Transmit Power of Middle Channel (CH=660) in DCS1800 Mode Measure Max Transmit Power of High Channel (CH=885) in DCS1800 Mode Measure Max Transmit Power of Low Channel (CH=512) in DCS1900 Mode

Measure Max Transmit Power of Middle Channel (CH=660) in DCS1900 Mode

Measure Max Transmit Power of High Channel (CH=810) in DCS1900 Mode

Max Power : 31.0~33.5dBm Max Power : 31.0~33.5dBm Max Power : 31.0~33.5dBm Max Power : 31.0~33.5dBm Max Power : 31.0~33.5dBm Max Power : 31.0~33.5dBm Max Power : 28.0~30.5dBm Max Power : 28.0~30.5dBm Max Power : 28.0~30.5dBm Max Power : 28.0~30.5dBm

Max Power : 28.0~30.5dBm

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3.3.2

GSM RX Sensitivity

The Receiver Sensitivity of the TM01LA-N are specified in the following table.

Table30. Conducted RX (Receive) Sensitivity – GSM/EDGE Bands

Item Method (DL CH) Specification

GSM850 BER(Bit Error Rate)

EGSM900 BER(Bit Error Rate)

DCS1800 BER(Bit Error Rate)

PCS1900 BER(Bit Error Rate)

Measure BER of Low Channel (CH=128) in GSM850 Mode

Measure BER of Middle Channel (CH=189) in GSM850 Mode

Measure BER of High Channel (CH=251) in GSM850 Mode

Measure BER of Low Channel (CH=975) in EGSM Mode

Measure BER of Middle Channel (CH=38) in EGSM Mode

Measure BER of High Channel (CH=124) in EGSM Mode

Measure BER of Low Channel (CH=512) in DCS1800 Mode

Measure BER of Middle Channel (CH=660) in DCS1800 Mode

Measure BER of High Channel (CH=885) in DCS1800 Mode

Measure BER of Low Channel (CH=512) in PCS1900 Mode

Measure BER of Middle Channel (CH=660) in PCS1900 Mode

Measure BER of High Channel (CH=810) in PCS1900 Mode

0~2.439% @<-102dBm

4. GNSS

The TM01LA-N includes optional Global Navigation Satellite System(GNSS) capabilities via the Qualcomm gpsOne Gen8A Engine, capable of operation in assisted and stand-alone GPS modes as well as GPS+GLONASS mode.

Table33. Position location and navigation summary(gpsOne™)

Standard Feature descriptions

gpsOne with global navigation satellite system (GNSS) support

■ Global positioning system (GPS) ¨ □ Next-generation gpsOne™ solution with enhanced GNSS engine and low power tracking ¨ □ Enhanced navigation 3.0, dynamic power optimization, and on-demand positioning

Gen8A

¨ □ Support for Wi-Fi positioning ¨ □ MS/UE-based, MS/UE-assisted, hybrid modes with AFLT (CDMA), NMR (GSM), and

MRL(UMTS, WCDMA, LTE), standalone and network-aware modes

¨ □ gpsOneXTRA Assistance for enhanced standalone GNSS performance ¨ □ Control plane: IS-801, IS-881, and UMTS CP assisted-GNSS protocols

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¨ □ User plane: v1/v2 trusted mode and OMA SUPL 2.0 assisted-GPS protocols ¨ □ Wideband processing of GPS signals helps resolve multipath interference, promoting improved

measurement accuracy

■ Support for GLONASS standalone mode ¨ □ GLONASS capability increases the number of satellites available to the positioning engine,

resulting in an expanded area of coverage over traditional GPS receivers

4.1 GNSS Characteristics

The GNSS implementation supports GPS L1 operation and GLONASS L1 FDMA operation.

Table34. GNSS Characteristics

Parameter Value

Standalone or MS Based Tracking Sensitivity TBD

*Sensitivity

Accuracy in Open Sky (1 Hz tracking) <2m CEP-50 Total number of SV available ~30 SVs Support for Predicted Orbits Yes Predicted Orbit CEP-50 Accuracy 5 m

GNSS Message Protocols NMEA

Cold Start Sensitivity TBD MS Assisted Synchronous A-GNSS Acquisition Sensitivity TBD

Super Hot 1 s

Standalone Time To First Fix (TTFF)

Warm 29 s Cold 32 s

Note: Acquisition/Tracking Sensitivity performance figures assume open sky w/ active patch GNSS antenna and a 2.5 dB Noise Figure.

4.2 GNSS Antenna Interface

Table35. GNSS Antenna Interface Characteristics

Characteristics GNSS

GPS L1 (Wideband) 1575.42 ± 20 MHz

Frequency

Glonass L1 FDMA 1597.5 – 1605.8 MHz RF Impedance 50 Ω VSWR max RX 2:1

4.3 Active antenna Powering the External LNA

The external LNA needs a source of power. Many of the active antennas accept a 3 volt or 5 volt DC voltage that is impressed upon the RF signal line. This voltage is not supplied by the TML1-X, but can be easily supplied by the host design.

4.3.1 External LNA Enable

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The electrical characteristics of the GNSS_LNA_EN signal are:

Table36. GNSS_LNA EN Table

Parameter Min Typ Max Units GNSS_LNA_EN Output high level 1.6 1.9 V

Output low level 0 0.2 V

An example of GPS Antenna Supply circuit is shown in the following image:

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<FCC Warning Statements> FCC Part 15.19 Statements:

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

FCC Part 15.21 statement

Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment.

RF Exposure Statement

The antenna(s) must be installed such that a minimum separation distance of at least 20 cm is maintained between the radiator (antenna) and all persons at all times. This device must not be co-located or operating in conjunction with any other antenna or transmitter.

The highest permitted antenna gains including cable loss for use with this device are: GSM850 / WCDMA850 : -3.25 dBi, GSM1900 / WCDMA1900 : 1.26 dBi, WCDMA1700 : -0.13 dBi, LTE Band 2:

1.26 dBi, LTE Band 5: -3.25 dBi, LTE Band 17: -3.03 dBi, LTE Band 4: -0.13 dBi, LTE Band 7: -0.22 dBi, LTE Band 12: -3.03 dBi..

End Product Labeling

The module is labeled with its own FCC ID. If the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following:

“Contains FCC ID: BEJLGAJ10N

" Contains IC: 2703H-LGAJ10N

OEM Responsibilities to comply with FCC Regulations

The module has been certified for integration into products only by OEM integrators under the following condition:

- The antenna(s) must be installed such that a minimum separation distance of at least 20 cm is maintained between the radiator (antenna) and all persons at all times.

- The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product procedures.

As long as the two condition above is met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.).

IMPORTANT NOTE: In the event that these conditions can ’ t be met (for certain configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can’t be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.

Manual Information To the End User

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product.

3

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l'exposition aux RF

L’antenne (ou les antennes) doit être installée de façon à maintenir à tout instant une distance

minimum de au moins 20 cm entre la source de radiation (l’antenne) et toute personne physique.

Étiquetage du produit final

Le module BT111 est étiqueté avec sa propre identification FCC et son propre numéro de

certification IC. Si l’identification FCC et le numéro de certification IC ne sont pas visibles lorsque

le module est installé à l’intérieur d’un autre dispositif, la partie externe du dispositif dans lequel

le module est installé devra également présenter une étiquette faisant référence au module inclus.

Dans ce cas, le produit final devra être étiqueté sur une zone visible avec les informations

suivantes :

« Contient module émetteur identification FCC ID : BEJLGAJ10N

« Contient module émetteur IC : 2703H-LGAJ10N

RSS-GEN, Sec. 8.3

This radio transmitter (identify the device by certification number, or model number if Category II)

has been approved by Industry Canada to operate with the antenna types listed below with the

maximum permissible gain and required antenna impedance for each antenna type indicated.

Antenna types not included in this list, having a gain greater than the maximum gain indicated for

that type, are strictly prohibited for use with this device.

Le présent émetteur radio (identifier le dispositif par son numéro de certification ou son numéro

de modèle s’il fait partie du matériel de catégorie I) a été approuvé par Industrie Canada pour

fonctionner avec les types d’antenne énumérés ci-dessous et ayant un gain admissible maximal et

l’impédance requise pour chaque type d’antenne. Les types d’antenne non inclus dans cette liste,

ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l’exploitation

de l’émetteur.

LG LGAJ10N Users manual

Specifications and Main Features

Frequently Asked Questions

User Manual