LG LGAJ10 Users manual

Technical Specification (TM01LA-N)

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Contents

1. Product Introduction ...................................................................................................... 5

1.1 Block Diagram ...................................................................................................... 5

1.2 Environmental Specifications ............................................................................... 6

1.3 Electrical Specifications ....................................................................................... 6

1.3.1 Absolute Maximum and ESD Ratings ........................................................... 6

1.3.2 Current Consumption .................................................................................... 7

1.4 Mechanical Specifications .................................................................................. 7

1.4.1 Physical Dimensions and Connection Interface ............................................ 7

1.4.2 Mechanical Drawing ...................................................................................... 7

1.4.3 Footprint ........................................................................................................ 7

1.5 PCB information ............................................................................................... 8

1.5.1 PCB Stack up ................................................................................................ 8

1.5.2 PCB VIA Stack up ......................................................................................... 8

2. Pin Definitions ............................................................................................................... 9

2.1 VCOIN ................................................................................................................ 12

2.2 ON/OFF Control ................................................................................................. 12

2.2.1 ON/OFF Timing ........................................................................................... 12

2.2.2 Deep Sleep .................................................................................................. 13

2.2.3 Sequence to Enter Deep Sleep Mode ......................................................... 15

2.3 USB .................................................................................................................... 15

2.4 UART ................................................................................................................. 15

2.5 UIM Interface ..................................................................................................... 16

2.6 General Purpose IO ........................................................................................... 16

2.7 Secure Digital IO ................................................................................................ 16

2.8 I2C Interface ..................................................................................................... 17

2.9 RESET ............................................................................................................... 17

2.10 ADC .................................................................................................................. 18

2.11 LED driver ....................................................................................................... 19

2.13 SPI Interface .................................................................................................. 19

2.14 HSIC Interface ................................................................................................ 20

2.15 JTAG Interface ............................................................................................... 20

3 RF Specification ......................................................................................................... 21

3.1. WCDMA B1, B2, B4, B5 Specification .............................................................. 21

3.2. LTE B1, B2, B4, B5, B7, B12 Specification………………………………………..22

3.3. GSM 850/900/1800/1900 Specification ............................................................ 24

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4. GNSS ........................................................................................................................ 25

4.1 GNSS Characteristics ........................................................................................ 26

4.2 GNSS Antenna Interface .................................................................................... 26

4.3 Active antenna Powering the External LNA ....................................................... 26

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1. Product Introuction

The TM01LA-N are designed for the automotive industry. They support LTE, WCDMA and GSM air Interface standards. They also have Global Navigation satellite system (GNSS) capabilities including GPS and GLONASS. The TM01LA-N are based on the Qualcomm MDM9215 wireless chipsets and support the following bands.

Table 1. Supported Band

Region NA TML1-E TML1-C Comments

LTE

Band

WCDM

GSM GSM850/PCS1900

GNSS O

Voice O

B2/B4/B5/B7/

B12/B17

B2/B4/B5

1.1 Block Diagram

Figure 1.1. TML1-N Block diagram

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1.2 Environmental Specifications

The environmental specification for operating and storage of the TM01LA-N are defined in the the table below.

Table 2. Environmental Specifications

Parameter Temperature Range

Operating Temperature

Storage Temperature -40℃ to +90℃

Humidity 95% or less

-40℃ to 85℃

1.3 Electrical Specifications

This section provides details for some of the key electrical specifications of the TM01LA-N embedded modules.

1.3.1 Absolute Maximum Rating and ESD Ratings

This section defines the Absolute Maximum and Electrostatic Discharge (ESD) Ratings of the TM01LA-N embedded modules.

Warning: If these parameters are exceeded, even momentarily, damage may occur to the device.

Table 3. Absolute Maximum Ratings

Parameter Min Max Units

+3.7V_VPWR Power Supply Input - tbd V VIN Voltage on any digital input or output pin - VREG_MDME+0.5 V

Maximum Voltage applied to antenna interface pins

VANT Primary Antenna tbd V

Diversity Antenna tbd V GNSS Antenna tbd V

ESD Ratings

ESD1

1 The ESD Simulator configured with 330pF, 1000Ω.

Caution: The TM01LA-N embedded modules are sensitive to Electrostatic Discharge. ESD countermeasures and handling methods must be used when handling the TM01LA-N devices.

Primary, Diversity and GNSS antenna pads - Contact All other signal pads - Contact tbd kV

tbd kV

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1.3.2 Current Consumption

Table 4. TM01LA-N Current Consumption (TBD)

Mode Parameter Typical Max Units

Band 2, Max TX Output Power

Band 4, Max TX Output Power

WCDMA

LTE

GSM 850/900MHz PCL5

WCDMA Idle, Registered mA

LTE Idle, Registered mA

GSM Idle, Registered mA

WCDMA Sleep Mode, Average Current mA

LTE Sleep Mode, Average Current mA

GSM Sleep Mode, Average Current mA

Band 5, Max TX Output Power

Band2, Max TX Output /Full RB

Band4, Max TX Output /Full RB

Band5, Max TX Output /Full RB

Band7, Max TX Output /Full RB

Band12, Max TX Output /Full RB

Band17, Max TX Output /Full RB

1800/1900MHz PCL0

1.4 Mechanical Specifications

1.4.1 Physical Dimensions and Connection Interface

The TM01LA-N embedded modules are a Land Grid Array (LGA) form factor device. The device does not have a System or RF connectors. All electrical and mechanical connections are made via the 206 pad TM01LA-N on the underside of the PCB.

Table5. TM01LA-N Embedded Module Dimensions

Parameter Nominal Max Units

Overall Dimension 35 x 35 35.35 x 35.35 mm Overall Module Height 3.5 3.85 mm PCB Thickness 1.0 1.1 mm Flatness Specification 0.1 mm Weight tbd g

1.4.2 Mechanical Drawing

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1.4.3 Footprint

[TOP View] [Side view]

[TOP View]

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)

(

)

0.75mm(R0.2

0.85mm

0.95mm

[TOP View]

1.5 PCB information

1.5.1 PCB Stack up Layer Meterial DK

PSR 0.025

Copper 0.035

Pre-Preg 0.060

Copper 0.025

Pre-Preg 0.060

Copper 0.025

Pre-Preg 0.060

Copper 0.025

Pre-Preg 0.110

Copper 0.015

3.98

4.15

R0.2

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