LG LGAJ10 Users manual
Technical Specification (TM01LA-N)
History
Ver. |
Date |
Contents |
Written |
Checked |
Approved |
Note |
|
by |
by |
by |
|||||
|
|
|
|
||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
/30
|
Contents |
|
1. Product Introduction ...................................................................................................... |
5 |
|
1.1 |
Block Diagram...................................................................................................... |
5 |
1.2 |
Environmental Specifications............................................................................... |
6 |
1.3 |
Electrical Specifications ....................................................................................... |
6 |
1.3.1 Absolute Maximum and ESD Ratings ........................................................... |
6 |
|
1.3.2 Current Consumption .................................................................................... |
7 |
|
1.4 |
Mechanical Specifications .................................................................................. |
7 |
1.4.1 Physical Dimensions and Connection Interface ............................................ |
7 |
|
1.4.2 Mechanical Drawing ...................................................................................... |
7 |
|
1.4.3 Footprint ........................................................................................................ |
7 |
|
1.5 PCB information ............................................................................................... |
8 |
|
1.5.1 PCB Stack up ................................................................................................ |
8 |
|
1.5.2 PCB VIA Stack up ......................................................................................... |
8 |
|
2. Pin Definitions ............................................................................................................... |
9 |
|
2.1 VCOIN................................................................................................................ |
12 |
|
2.2 |
ON/OFF Control................................................................................................. |
12 |
2.2.1 ON/OFF Timing ........................................................................................... |
12 |
|
2.2.2 Deep Sleep.................................................................................................. |
13 |
|
2.2.3 Sequence to Enter Deep Sleep Mode......................................................... |
15 |
|
2.3 USB.................................................................................................................... |
15 |
|
2.4 UART ................................................................................................................. |
15 |
|
2.5 |
UIM Interface ..................................................................................................... |
16 |
2.6 |
General Purpose IO ........................................................................................... |
16 |
2.7 |
Secure Digital IO................................................................................................ |
16 |
2.8 |
I2C Interface ..................................................................................................... |
17 |
2.9 RESET ............................................................................................................... |
17 |
|
2.10 ADC.................................................................................................................. |
18 |
|
2.11 LED driver ....................................................................................................... |
19 |
|
2.13 SPI Interface .................................................................................................. |
19 |
|
2.14 HSIC Interface ................................................................................................ |
20 |
|
2.15 JTAG Interface ............................................................................................... |
20 |
|
3 RF Specification......................................................................................................... |
21 |
|
3.1. WCDMA B1, B2, B4, B5 Specification .............................................................. |
21 |
|
3.2. LTE B1, B2, B4, B5, B7, B12 Specification………………………………………..22 |
||
3.3. GSM 850/900/1800/1900 Specification ............................................................ |
24 |
|
|
/30 |
|
4. GNSS ........................................................................................................................ |
25 |
|
4.1 |
GNSS Characteristics ........................................................................................ |
26 |
4.2 |
GNSS Antenna Interface.................................................................................... |
26 |
4.3 Active antenna Powering the External LNA ....................................................... |
26 |
|
/30
1. Product Introuction
The TM01LA-N are designed for the automotive industry. They support LTE, WCDMA and GSM air Interface standards. They also have Global Navigation satellite system (GNSS) capabilities including GPS and GLONASS.
The TM01LA-N are based on the Qualcomm MDM9215 wireless chipsets and support the following bands.
Table 1. |
Supported Band |
|
|
|
|
|
|
|
|
|
||||||
|
Region |
|
|
NA |
|
|
TML1-E |
|
|
TML1-C |
|
|
|
|
||
|
Comments |
|
||||||||||||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LTE |
|
B2/B4/B5/B7/ |
|
|
|
|
|
|
|
|
|
||
|
|
|
|
B12/B17 |
|
|
|
|
|
|
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
||
|
Band |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
WCDM |
|
B2/B4/B5 |
|
|
|
|
|
|
|
|
|
|||
|
|
|
A |
|
|
|
|
|
|
|
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
||
|
|
|
GSM |
|
GSM850/PCS1900 |
|
|
|
|
|
|
|
|
|
||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|||
|
GNSS |
|
O |
|
|
|
|
|
|
|
|
|
||||
|
Voice |
|
O |
|
|
|
|
|
|
|
|
|
||||
1.1 Block Diagram
Figure 1.1. TML1-N Block diagram |
5/30
1.2 Environmental Specifications
The environmental specification for operating and storage of the TM01LA-N are defined in the the table below.
Table 2. Environmental Specifications
Parameter |
Temperature Range |
Operating Temperature |
-40 to 85 |
|
|
Storage Temperature |
-40 to +90 |
|
|
Humidity |
95% or less |
|
|
1.3 Electrical Specifications
This section provides details for some of the key electrical specifications of the TM01LA-N embedded modules.
1.3.1 Absolute Maximum Rating and ESD Ratings
This section defines the Absolute Maximum and Electrostatic Discharge (ESD) Ratings of the TM01LA-N embedded modules.
Warning: If these parameters are exceeded, even momentarily, damage may occur to the device.
Table 3. Absolute Maximum Ratings |
|
|
|
||
Parameter |
|
|
Min |
Max |
Units |
+3.7V_VPWR |
Power Supply Input |
|
- |
tbd |
V |
VIN |
Voltage on any digital input or output pin |
|
- |
VREG_MDME+0.5 |
V |
Maximum Voltage applied to antenna interface pins |
|
|
|
||
VANT |
Primary Antenna |
|
|
tbd |
V |
|
Diversity Antenna |
|
|
tbd |
V |
|
GNSS Antenna |
|
|
tbd |
V |
ESD Ratings |
|
|
|
|
|
ESD1 |
Primary, Diversity and GNSS antenna |
|
|
tbd |
kV |
|
pads - Contact |
|
|
|
|
|
All other signal pads - Contact |
|
|
tbd |
kV |
|
|
|
|
|
|
1 The ESD Simulator configured with 330pF, 1000Ω.
Caution: The TM01LA-N embedded modules are sensitive to Electrostatic Discharge. ESD countermeasures and handling methods must be used when handling the TM01LA-N devices.
6/30
1.3.2 Current Consumption
Table 4. TM01LA-N Current Consumption (TBD)
|
Mode |
|
Parameter |
Typical |
Max |
|
Units |
|
|
|
Band 2, Max TX Output Power |
|
|
|
|
|
|
|
|
|
|
|
|
|
WCDMA |
|
Band 4, Max TX Output Power |
|
|
|
mA |
|
|
|
|
|
|
||
|
|
Band 5, Max TX Output Power |
|
|
|
||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Band 5, Max TX Output Power |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Band2, Max TX Output /Full RB |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Band4, Max TX Output /Full RB |
|
|
|
|
|
|
|
|
|
|
|
|
|
LTE |
|
Band5, Max TX Output /Full RB |
|
|
|
mA |
|
|
|
|
|
|
||
|
|
Band7, Max TX Output /Full RB |
|
|
|
||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Band12, Max TX Output /Full RB |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Band17, Max TX Output /Full RB |
|
|
|
|
|
|
|
|
|
|
|
|
|
GSM |
|
850/900MHz PCL5 |
|
|
|
mA |
|
|
|
|
|
|
|
|
|
|
|
1800/1900MHz PCL0 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
WCDMA |
Idle, Registered |
|
|
|
mA |
|
|
|
|
|
|
|
|
|
|
LTE |
|
Idle, Registered |
|
|
|
mA |
|
|
|
|
|
|
|
|
|
GSM |
|
Idle, Registered |
|
|
|
mA |
|
|
|
|
|
|
|
|
|
WCDMA |
Sleep Mode, Average Current |
|
|
|
mA |
|
|
|
|
|
|
|
|
|
|
LTE |
|
Sleep Mode, Average Current |
|
|
|
mA |
|
|
|
|
|
|
|
|
|
GSM |
|
Sleep Mode, Average Current |
|
|
|
mA |
|
|
|
|
|
|
|
|
1.4 Mechanical Specifications
1.4.1 Physical Dimensions and Connection Interface
The TM01LA-N embedded modules are a Land Grid Array (LGA) form factor device. The device does not have a System or RF connectors. All electrical and mechanical connections are made via the 206 pad TM01LA-N on the underside of the PCB.
Table5. TM01LA-N Embedded Module Dimensions |
|
||
Parameter |
Nominal |
Max |
Units |
Overall Dimension |
35 x 35 |
35.35 x 35.35 |
mm |
Overall Module Height |
3.5 |
3.85 |
mm |
PCB Thickness |
1.0 |
1.1 |
mm |
Flatness Specification |
|
0.1 |
mm |
Weight |
tbd |
|
g |
1.4.2 Mechanical Drawing
7/30
[TOP View] |
[Side view] |
[TOP View]
1.4.3 Footprint
8/30
0.75mm(R0.2) |
|
0.85mm(R0.2) |
|
|
|
0.95mm |
|
|
|
[TOP View] |
|
1.5 PCB information |
|
|
|
1.5.1 PCB Stack up |
|
|
|
Layer |
|
Meterial |
DK |
1 |
PSR |
0.025 |
|
Copper |
0.035 |
3.98 |
|
2 |
Pre-Preg |
0.060 |
|
Copper |
0.025 |
3.98 |
|
3 |
Pre-Preg |
0.060 |
|
Copper |
0.025 |
3.98 |
|
4 |
Pre-Preg |
0.060 |
|
Copper |
0.025 |
4.15 |
|
5 |
Pre-Preg |
0.110 |
|
Copper |
0.015 |
|
|
|
|
9/30 |
|
Loading...