LG L2300C Schematic

COLOR MONIT OR
SER VICE MANUAL
Website:http://biz.LGservice.com
E-mail:http://www.LGEservice.com/techsup.html
CAUTION
BEFORE SERVICING THE UNIT, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS NO. : CL-77
( ) **Same model for Service
CONTENTS
SPECIFICATIONS ................................................... 2
PRECAUTIONS ....................................................... 3
TIMING CHART ....................................................... 7
DISASSEMBLY ....................................................... 8
BLOCK DIAGRAM ................................................... 9
DESCRIPTION OF BLOCK DIAGRAM...................10
SPECIFICATIONS
1. LCD CHARACTERISTICS
Type : TFT Color LCD Module Active Display Area : 23.01 inch Pixel Pitch : Size : 559.8 (H) x 333.8 (V) x 45.7 (D) Color Depth : 16.777,216 colors / 8Bit Electrical Interface : LVDS Surface Treatment : Anti-Glare, Hard-coating(3H) Operating Mode : Normally Black Backlight Unit : 6 CCFL
2. OPTICAL CHARACTERISTICS
2-1. Viewing Angle by Contrast Ratio 10
Left : -88(Typ) Right : +88°(Typ) Top :+88° (Typ) Bottom : -88°(Typ)
2-2. Luminance : 500(Typ)
0.258 (H) x 0.258(V)
ADJUSTMENT ...................................................... 12
TROUBLESHOOTING GUIDE .............................. 14
WIRING DIAGRAM ............................................... 18
EXPLODED VIEW...................................................19
REPLACEMENT PARTS LIST ...............................21
SCHEMATIC DIAGRAM......................................... 26
. Max. Resolution
4
Analog : 1600 x 1200 / 60Hz Digital : 1280 x 1024 / 60Hz
5. POWER SUPPLY
5-1. Power 5-2. Power Consumption
POWER ON(NORMAL)
STAND BY SUSPEND DPMS OFF
POWER S/W OFF
: AC 100-240V~, 50/60Hz , 1.2A
-
VIDEO ACTIVE
OFF OFF OFF
-
MODE
H/V SYNC
ON/ON OFF/ON ON/OFF OFF/OFF
POWER CONSUMPTION
less than 90 W
less than 2W less than 2W less than 2W
less than 2W
LED COLOR
GREEN
AMBER
OFF
2-3. Contrast Ratio : 550(Typ)
3. SIGNAL (Refer to the Timing Chart)
3-1. Sync Signal
• Type : Separate Sync, Digitala SOG (Sync On Green) Composite Sync
3-2. Video Input Signal
1) Type : R, G, B Analog
2) Voltage Level : 0~0.71 V
a) Color 0, 0 : 0 Vp-p b) Color 7, 0 : 0.467 Vp-p c) Color 15, 0 : 0.714 Vp-p
3) Input Impedance : 75
3-4. Operating Frequency
Analog
Horizontal : 30 ~ 83kHz Vertical : 56 ~ 85Hz Dot clock:< 160MHz
Digital
Horizontal : 30 ~ 72kHz Vertical : 56 ~ 85Hz Dot clock:< 160MHz
6. ENVIRONMENT
6-1. Operating Temperature : 10°C~35°C (50°F~95°F) 6-2. Relative Humidity : 10%~80% (Non-condensing) 6-3. Lamp Life : 40,000 Hours(Min)
7. DIMENSIONS (with TILT/SWIVEL)
Width : 446 mm (17.56'') Depth : 237.3 mm (9.34'') Height : 445.6 mm (17.54'')
8. WEIGHT (with TILT/SWIVEL)
Net. Weight : 9.42 kg (20.77lbs) Gross Weight : 12.28 kg (27.08lbs)
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PRECAUTION
1.5 Kohm/10W
To Instrument's exposed METALLIC PARTS
Good Earth Ground such as WATER PIPE, CONDUIT etc.
AC Volt-meter
WARNING FOR THE SAFETY-RELATED COMPONENT.
• There are some special components used in LCD monitor that are important for safety. These parts are
marked on the schematic diagram and the replacement parts list. It is essential that these critical
parts should be replaced with the manufacturer’s specified parts to prevent electric shock, fire or other hazard.
• Do not modify original design without obtaining written permission from manufacturer or you will void the original parts and labor guarantee.
TAKE CARE DURING HANDLING THE LCD MODULE WITH BACKLIGHT UNIT.
• Must mount the module using mounting holes arranged in four corners.
• Do not press on the panel, edge of the frame strongly or electric shock as this will result in damage to the screen.
• Do not scratch or press on the panel with any sharp objects, such as pencil or pen as this may result in damage to the panel.
WARNING
BE CAREFUL ELECTRIC SHOCK !
• If you want to replace with the new backlight (CCFL) or inverter circuit, must disconnect the AC adapter because high voltage appears at inverter circuit about 650Vrms.
• Handle with care wires or connectors of the inverter circuit. If the wires are pressed cause short and may burn or take fire.
Leakage Current Hot Check Circuit
• Protect the module from the ESD as it may damage the electronic circuit (C-MOS).
• Make certain that treatment person’s body are grounded through wrist band.
• Do not leave the module in high temperature and in areas of high humidity for a long time.
• The module not be exposed to the direct sunlight.
• Avoid contact with water as it may a short circuit within the module.
• If the surface of panel become dirty, please wipe it off with a softmaterial. (Cleaning with a dirty or rough cloth may damage the panel.)
CAUTION
Please use only a plastic screwdriver to protect yourself from shock hazard during service operation.
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SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this
service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit
board module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical
plug or other electrical connection.
c. Connecting a test substitute in parallel with an
electrolytic capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.
d. Discharging the picture tube anode.
2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".
3. Discharge the picture tube anode only by (a) first connecting one end of an insulated clip lead to the degaussing or kine aquadag grounding system shield at the point where the picture tube socket ground lead is connected, and then (b) touch the other end of the insulated clip lead to the picture tube anode button, using an insulating handle to avoid personal contact with high voltage.
4. Do not spray chemicals on or near this receiver or any of its assemblies.
5. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton­tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required.
6. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.
7. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.
8. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.
9. Use with this receiver only the test fixtures specified in
this service manual.
CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti­static" can generate electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)
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General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip
temperature within the range or 500
2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-bristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal
temperature.
F to 600 F)
(500 b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static,
suction-type solder removal device or with solder
braid.
CAUTION: Work quickly to avoid overheating the
circuitboard printed foil.
6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal
temperature (500
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of
the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.
d. Closely inspect the solder area and remove any
excess or splashed solder with a small wire-bristle brush.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.
2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.
F to 600
F to 600 F.
F)
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and solder it.
3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.
Power Output, Transistor Device Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit board.
3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.
Fuse and Conventional Resistor Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow stake.
2. Securely crimp the leads of replacement component around notch at stake top.
3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.
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Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.
1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.
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TIMING CHART
VIDEO
SYNC
B
D
C
F
E
A
<< Dot Clock (MHz), Horizontal Frequency (kHz), Vertical Frequency (Hz), Horizontal etc... (µs), Vertical etc... (ms) >>
MODE
1 H(Pixels) + 25.175 31.469 800 640 16 96 48 640 x 350
2 H(Pixels) - 28.321 31.468 900 720 18 108 54 720 X 400
3 H(Pixels) - 25.175 31.469 800 640 16 96 48 640 x 480
4 H(Pixels) - 31.5 37.5 840 640 16 64 120 640 x 480
5 H(Pixels) - 36.0 43.269 832 640 56 56 80 640 x 480
6 H(Pixels) + 40.0 37.879 1056 800 40 128 88 800 x 600
7 H(Pixels) + 49.5 46.875 1056 800 16 80 160 800 x 600
8 H(Pixels) + 56.25 53.674 1048 800 32 64 152 800 x 600
9 H(Pixels) +/- 57.283 49.725 1152 832 32 64 224 832 x 624
10 H(Pixels) - 65.0 48.363 1344 1024 24 136 160 1024 x 768
11 H(Pixels) - 78.75 60.123 1312 1024 16 96 176 1024 x 768
12 H(Pixels) + 94.5 68.68 1376 1024 48 96 208 1024 x 768
13 H(Pixels) + 74.5 44.772 1664 1280 64 128 192 1280 x 720
14 H(Pixels) + 84.75 47.72 1776 1360 72 136 208 1360 x 768
15 H(Pixels) + 108.0 63.981 1688 1280 48 112 248 1280 x 1024
16 H(Pixels) + 135.00 79.98 1688 1280 16 144 248 1280 x 1024
17 H(Pixels) + 162.00 75.00 2160 1600 90 30 88 1600 x 1200
section
V(Lines) - 70.8 449 350 37 2 60
V(Lines + 70.8 449 400 12 2 35
V(Lines) - 59.94 525 480 10 2 33
V(Lines) - 75 500 480 1 3 16
V(Lines) - 85.0 509 480 1 3 25
V(Lines) + 60.317 628 600 1 4 23
V(Lines) + 75.0 625 600 1 3 21
V(Lines) + 85.061 631 600 1 3 27
V(Lines) +/- 74.55 667 624 1 3 39
V(Lines) - 60.0 806 768 3 6 29
V(Lines) - 75.029 800 768 1 3 28
V(Lines) + 85.00 808 768 1 3 36
V(Lines) + 59.855 748 720 3 5 20
V(Lines) + 59.799 798 768 3 5 22
V(Lines) + 60.02 1066 1024 1 3 38
V(Lines) + 75.02 1066 1024 1 3 38
V(Lines) + 60 1250 1200 1 3 46
Polarity Frequency
Dot
Clock
Total
Period
( E )
Display
( A )
Front
Porch
( D )
Sync.
( C )
Back
Porch
( B )
Resolution
1~17 : D-SUB, 1~15 : DVI-D
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REAR CABINET REMOVEL.
DISASSEMBLY
1) Remove the four screws from the stand as shown and separate stand.
3) If you pull the cabinet a little by hand as shown, the latch will be detached.
2) Stand the set as shown and pull the cabinet a little by inserting your finger into the cabinet as shown.
4) Lay down the set as shown and detach the back cover.
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BLOCK DIAGRAM
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DESCRIPTION OF BLOCK DIAGRAM
1. Video Controller Part & Display Data Transmitter Part.
This part amplifies the level of video signal for the digital conversion and converts from the analog video signal to the
digital video signal using a pixel clock. The pixel clock for each mode is generated by the PLL. The range of the pixel clock is from 25MHz to 165MHz. This part consists of the Scaler, Flash-ROM IC which stores program data, Reset IC.
The Scaler gets the video signal converted analog to digital, interpolates input to 1920 x 1200 resolution signal and
outputs 8-bit R, G, B signal to transmitter. Especially pre-amp / ADC / Video controller/ Transmitter are merged to one chip 'Gm1601' by Genesis. This part transmit digital signal from the Scaler to the receiver of module.
2. Power Part
This part consists of the two 3.3V and one 2.5V and one 1.8Vregulators to convert power which is provided 18V in
Power Board V is provided for LCD Panel. 24V in Power Board V is provided for Inverter Part. Also, 5V is converted 3.3V and 2.5V and 1.8V by regulator. Converted power is provided for IC in the main board.
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