Page 1
COLOR MONITOR
SERVICE MANUAL
Website:http://biz.LGservice.com
CAUTION
BEFORE SERVICING THE UNIT,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS NO. : LM74B
MODEL: L226WTQ(L226WTQ-BFS.A**MQP,A**QQP,
A**VQP
)
L226WTQ(L226WTQ-WFS.A**OAP,A**QAP,
A**VAP
)
( ) **Same model for Service
Page 2
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CONTENTS
SPECIFICATIONS ................................................... 2
PRECAUTIONS ....................................................... 4
TIMING CHART ....................................................... 8
DISASSEMBLY ........................................................ 9
BLOCK DIAGRAM ................................................. 10
DESCRIPTION OF BLOCK DIAGRAM...................11
ADJUSTMENT ...................................................... 13
TROUBLESHOOTING GUIDE .............................. 15
EXPLODED VIEW...................................................19
REPLACEMENT PARTS LIST ...............................21
SCHEMATIC DIAGRAM......................................... 24
SPECIFICATIONS
1. LCD CHARACTERISTICS
Type : TFT Color LCD Module
Active Display Area : 22 inch diagonal
Pixel Pitch : 0.282 (H) x 0.282 (V)
Size : 493.7(H) x 320.1(V) x 16.5(D)
Color Depth : 16.7M colors
Electrical Interface : LVDS
Surface Treatment : AG(Haze 25%), Hard Coating(3H)
Operating Mode : Normally White
Backlight Unit : 4 CCFL
2. OPTICAL CHARACTERISTICS
2-1. Viewing Angle by Contrast Ratio ≥ 10
Left : +80° min., +85°(Typ) Right : -80° min., -85°(Typ)
Top : +80° min., +85°(Typ) Bottom : -80° min., -85°(Typ)
2-2. Luminance : 180(Typ) (Typ.
30)-sRGB
: 220(min), 300(Typ)-6500K
: 150(min)-9300K
2-3. Contrast Ratio : 500(min), 1000(Typ)
DFC -> 3000 : 1 (Typ)
3. SIGNAL (Refer to the Timing Chart)
3-1. Sync Signal
• Type : Separate Sync, SOG, Digital
3-2. Video Input Signal
1) Type : R, G, B Analog
2) Voltage Level : 0~0.7 V
3) Input Impedance : 75 Ω
3-3. Operating Frequency
Horizontal : 28 ~ 83kHz
Vertical : 56 ~ 75Hz
4. MAX. RESOLUTION
Analog : 1680 x 1050@60Hz
Digital : 1680 x 1050@60Hz
5. POWER SUPPLY
5-1. Power Adaptor(Built-in Power)
Input : AC 100-240V~, 50/60Hz, 1.2A
5-2. Power Consumption
6. ENVIRONMENT
6-1. Operating Temperature : 10°C~35°C (50°F~95°F)
6-2. Relative Humidity : 10%~80% (Non-condensing)
6-3. MTBF : 50,000 HRS with 90%
Confidence level
Lamp Life : 40,000 Hours (Min)
7. DIMENSIONS (with TILT/SWIVEL)
Width : 471 mm (18.54'')
Depth : 234 mm (9.21'')
Height : 402.4 mm (15.84'')
8. WEIGHT (with TILT/SWIVEL)
Net. Weight : 4.6 kg (10.14 lbs)
Gross Weight : 6.0 kg (13.23 lbs)
MODE
POWER ON (NORMAL)
STAND BY
SUSPEND
DPMS OFF
POWER S/W OFF
H/V SYNC
ON/ON
OFF/ON
ON/OFF
OFF/OFF
-
POWER CONSUMPTION
less than 50 W(max)
less than 45 W(typ)
less than 1 W
less than 1 W
less than 1 W
less than 1 W
LED COLOR
BLUE
AMBER
AMBER
AMBER
OFF
VIDEO
ACTIVE
OFF
OFF
OFF
-
Page 3
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Signal Connector Pin Assignment
Pin Signal (DVI-D)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
T. M. D. S. Data2T. M. D. S. Data2+
T. M. D. S. Data2/4 Shield
T. M. D. S. Data4T. M. D. S. Data4+
DDC Clock
DDC Data
Analog Vertical Sync.
T. M. D. S. Data1T. M. D. S. Data1+
T. M. D. S. Data1/3 Shield
T. M. D. S. Data3T. M. D. S. Data3+
+5V Power
Ground
(return for +5V,
H. Sync. and V. Sync.)
Pin Signal (DVI-D)
1
8
9
17
24
16
16
17
18
19
20
21
22
23
24
Hot Plug Detect
T. M. D. S. Data0T. M. D. S. Data0+
T. M. D. S. Data0/5 Shield
T. M. D. S. Data5T. M. D. S. Data5+
T. M. D. S. Clock Shield
T. M. D. S. Clock+
T. M. D. S. Clock-
T. M. D. S. (Transition Minimized Differential Signaling)
• DVI-D Connector (Digital)
Page 4
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WARNING FOR THE SAFETY-RELATED COMPONENT.
• There are some special components used in LCD
monitor that are important for safety. These parts are
marked on the schematic diagram and the
replacement parts list. It is essential that these critical
parts should be replaced with the manufacturer’s
specified parts to prevent electric shock, fire or other
hazard.
• Do not modify original design without obtaining written
permission from manufacturer or you will void the
original parts and labor guarantee.
TAKE CARE DURING HANDLING THE LCD MODULE
WITH BACKLIGHT UNIT.
• Must mount the module using mounting holes arranged
in four corners.
• Do not press on the panel, edge of the frame strongly
or electric shock as this will result in damage to the
screen.
• Do not scratch or press on the panel with any sharp
objects, such as pencil or pen as this may result in
damage to the panel.
• Protect the module from the ESD as it may damage the
electronic circuit (C-MOS).
• Make certain that treatment person’s body are
grounded through wrist band.
• Do not leave the module in high temperature and in
areas of high humidity for a long time.
• The module not be exposed to the direct sunlight.
• Avoid contact with water as it may a short circuit within
the module.
• If the surface of panel become dirty, please wipe it off
with a softmaterial. (Cleaning with a dirty or rough cloth
may damage the panel.)
WARNING
BE CAREFUL ELECTRIC SHOCK !
• If you want to replace with the new backlight (CCFL) or
inverter circuit, must disconnect the AC adapter
because high voltage appears at inverter circuit about
650Vrms.
• Handle with care wires or connectors of the inverter
circuit. If the wires are pressed cause short and may
burn or take fire.
Leakage Current Hot Check Circuit
PRECAUTION
CAUTION
Please use only a plastic screwdriver to protect yourself
from shock hazard during service operation.
1.5 Kohm/10W
To Instrument's
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
Page 5
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SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this
service manual and its supplements and addenda, read
and follow the SAFETY PRECAUTIONS on page 3 of this
publication.
NOTE: If unforeseen circumstances create conflict
between the following servicing precautions and any of the
safety precautions on page 3 of this publication, always
follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC
power source before;
a. Removing or reinstalling any component, circuit
board module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical
plug or other electrical connection.
c. Connecting a test substitute in parallel with an
electrolytic capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect
polarity installation of electrolytic capacitors may
result in an explosion hazard.
d. Discharging the picture tube anode.
2. Test high voltage only by measuring it with an
appropriate high voltage meter or other voltage
measuring device (DVM, FETVOM, etc) equipped with
a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Discharge the picture tube anode only by (a) first
connecting one end of an insulated clip lead to the
degaussing or kine aquadag grounding system shield
at the point where the picture tube socket ground lead
is connected, and then (b) touch the other end of the
insulated clip lead to the picture tube anode button,
using an insulating handle to avoid personal contact
with high voltage.
4. Do not spray chemicals on or near this receiver or any
of its assemblies.
5. Unless specified otherwise in this service manual,
clean electrical contacts only by applying the following
mixture to the contacts with a pipe cleaner, cottontipped stick or comparable non-abrasive applicator;
10% (by volume) Acetone and 90% (by volume)
isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual,
lubrication of contacts in not required.
6. Do not defeat any plug/socket B+ voltage interlocks
with which receivers covered by this service manual
might be equipped.
7. Do not apply AC power to this instrument and/or any of
its electrical assemblies unless all solid-state device
heat sinks are correctly installed.
8. Always connect the test receiver ground lead to the
receiver chassis ground before connecting the test
receiver positive lead.
Always remove the test receiver ground lead last.
9. Use with this receiver only the test fixtures specified in
this service manual.
CAUTION: Do not connect the test fixture ground strap
to any heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be
damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive (ES)
Devices. Examples of typical ES devices are integrated
circuits and some field-effect transistors and
semiconductor "chip" components. The following
techniques should be used to help reduce the incidence of
component damage caused by static by static electricity.
1. Immediately before handling any semiconductor
component or semiconductor-equipped assembly, drain
off any electrostatic charge on your body by touching a
known earth ground. Alternatively, obtain and wear a
commercially available discharging wrist strap device,
which should be removed to prevent potential shock
reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with
ES devices, place the assembly on a conductive
surface such as aluminum foil, to prevent electrostatic
charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or
unsolder ES devices.
4. Use only an anti-static type solder removal device.
Some solder removal devices not classified as "antistatic" can generate electrical charges sufficient to
damage ES devices.
5. Do not use freon-propelled chemicals. These can
generate electrical charges sufficient to damage ES
devices.
6. Do not remove a replacement ES device from its
protective package until immediately before you are
ready to install it. (Most replacement ES devices are
packaged with leads electrically shorted together by
conductive foam, aluminum foil or comparable
conductive material).
7. Immediately before removing the protective material
from the leads of a replacement ES device, touch the
protective material to the chassis or circuit assembly
into which the device will be installed.
CAUTION: Be sure no power is applied to the chassis
or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion
such as the brushing together of your clothes fabric or
the lifting of your foot from a carpeted floor can
generate static electricity sufficient to damage an ES
device.)
Page 6
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General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and
appropriate tip size and shape that will maintain tip
temperature within the range or 500
F to 600 F.
2. Use an appropriate gauge of RMA resin-core solder
composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a
mall wire-bristle (0.5 inch, or 1.25cm) brush with a
metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal
temperature.
(500
F to 600 F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static,
suction-type solder removal device or with solder
braid.
CAUTION: Work quickly to avoid overheating the
circuitboard printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal
temperature (500
F to 600 F)
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of
the component lead and the printed circuit foil, and
hold it there only until the solder flows onto and
around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the
circuit board printed foil.
d. Closely inspect the solder area and remove any
excess or splashed solder with a small wire-bristle
brush.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong)
through which the IC leads are inserted and then bent flat
against the circuit foil. When holes are the slotted type,
the following technique should be used to remove and
replace the IC. When working with boards using the
familiar round hole, use the standard technique as
outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation
by gently prying up on the lead with the soldering iron
tip as the solder melts.
2. Draw away the melted solder with an anti-static
suction-type solder removal device (or with solder
braid) before removing the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad
and solder it.
3. Clean the soldered areas with a small wire-bristle
brush. (It is not necessary to reapply acrylic coating to
the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as
close as possible to the component body.
2. Bend into a "U" shape the end of each of three leads
remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the
corresponding leads extending from the circuit board
and crimp the "U" with long nose pliers to insure metal
to metal contact then solder each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor
leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the
circuit board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close
as possible to diode body.
2. Bend the two remaining leads perpendicular y to the
circuit board.
3. Observing diode polarity, wrap each lead of the new
diode around the corresponding lead on the circuit
board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder
joints of the two "original" leads. If they are not shiny,
reheat them and if necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board
hollow stake.
2. Securely crimp the leads of replacement component
around notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the
replaced component and adjacent components and the
circuit board to prevent excessive component
temperatures.
Page 7
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Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed
circuit board will weaken the adhesive that bonds the foil
to the circuit board causing the foil to separate from or
"lift-off" the board. The following guidelines and
procedures should be followed whenever this condition is
encountered.
At IC Connections
To repair a defective copper pattern at IC connections use
the following procedure to install a jumper wire on the
copper pattern side of the circuit board. (Use this
technique only on IC connections).
1. Carefully remove the damaged copper pattern with a
sharp knife. (Remove only as much copper as
absolutely necessary).
2. carefully scratch away the solder resist and acrylic
coating (if used) from the end of the remaining copper
pattern.
3. Bend a small "U" in one end of a small gauge jumper
wire and carefully crimp it around the IC pin. Solder the
IC connection.
4. Route the jumper wire along the path of the out-away
copper pattern and let it overlap the previously scraped
end of the good copper pattern. Solder the overlapped
area and clip off any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper
pattern at connections other than IC Pins. This technique
involves the installation of a jumper wire on the
component side of the circuit board.
1. Remove the defective copper pattern with a sharp
knife.
Remove at least 1/4 inch of copper, to ensure that a
hazardous condition will not exist if the jumper wire
opens.
2. Trace along the copper pattern from both sides of the
pattern break and locate the nearest component that is
directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead
of the nearest component on one side of the pattern
break to the lead of the nearest component on the
other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is
dressed so the it does not touch components or sharp
edges.
Page 8
TIMING CHART
- 8 -
VIDEO
SYNC
F
E
C
A
B
D
1 H(Pixels) - 28.321 31.468 900 720 18 108 54 720 X 400
V(Lines) + 70.08 449 400 12 2 35
2 H(Pixels) - 25.175 31.469 800 640 16 96 48 640 x 480
V(Lines) - 59.94 525 480 10 2 33
3 H(Pixels) - 31.5 37.5 840 640 16 64 120 640 x 480
V(Lines) - 75 500 480 1 3 16
4 H(Pixels) + 40.0 37.879 1056 800 40 128 88 800 x 600
V(Lines) + 60.317 628 600 1 4 23
5 H(Pixels) + 49.5 46.875 1056 800 16 80 160 800 x 600
V(Lines) + 75.0 625 600 1 3 21
6 H(Pixels) - 65.0 48.363 1344 1024 24 136 160 1024 x 768
V(Lines) - 60.0 806 768 3 6 29
7 H(Pixels) - 78.75 60.123 1312 1024 16 96 176 1024 x 768
V(Lines) - 75.029 800 768 1 3 28
8 H(Pixels) +/- 108.0 67.500 1600 1152 64 128 256 1152 x 864
V(Lines) +/- 75.000 900 864 1 3 32
9 H(Pixels) + 108.0 63.981 1688 1280 48 112 248 1280 x 1024
V(Lines) + 60.02 1066 1024 1 3 38
10 H(Pixels) + 135.0 79.976 1688 1280 16 144 248 1280 x 1024
V(Lines) + 75.035 1066 1024 1 3 38
11 H(Pixels) + 119 64.674 1840 1680 48 32 80 1680x1050
V(Lines) - 59.883 1080 1050 3 6 21
12 H(Pixels) - 146.25 65.290 2240 1680 104 176 280 1680x1050
V(Lines) + 59.954 1089 1050 3 6 30
MODE
H / V
Sync
Polarity
Dot
Clock
Frequency
Total
Period
( E )
Video
Active
Time ( A )
Sync
Duration
( D )
Front
Porch
( C )
Blanking
Time
( B )
Resolution
Page 9
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DISASSEMBLY
Remove the screws.
# 1
Remove the screws.
1.Disassemble PCB.
2. Put the front face down.
Disassemble PCB.
# 2
# 3
# 4
# 5
# 6
Disassemble back cover
1. Pull the front cover upward.
2. Then, let the all latches are separated with jig.
(#3~4)
# 7
Page 10
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BLOCK DIAGRAM
146Mhz
1680X1050@60Hz
LVDS
Panel
Response
Display
L V D S
Time
Processing
Module
Vcc
5V
Interface
Enhancement
Engine
DRAM
MCU
Clock
Generator
OSD
KEY
Flash ROM
Crystal
14.318MHz
3.3V
3.3V
3.3V
1.8V
TSUMO58CWHJ
Analog I(R/G/B)
Dual
Engine
Interface
3.3V
(EDID)
EEPROM
D-Sub
1.8V
DVI(TMDS)
(EDID)
EEPROM
DVI-D
SDA
/SCL
EEPROM
(System)
LIPS
5V
5V Regulator
15V
15V
Inverter(4Lamps)
Filter
Page 11
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DESCRIPTION OF BLOCK DIAGRAM
1. Video Controller Part.
This part amplifies the level of video signal for the digital conversion and converts from the analog video signal to the
digital video signal using a pixel clock.
The pixel clock for each mode is generated by the PLL.
The range of the pixel clock is 146MHz In L226WTQ/WTG.
This part consists of the Scaler, ADC convertor, TMDS receiver and LVDS transmitter.
The Scaler gets the video signal converted analog to digital, interpolates input to 1680X1050(L226WTQ/WTG)
resolution signal and outputs 8-bit R, G, B signal to transmitter.
2. Power Part.
This part consists of the one 3.3V, and one 1.8V regulators to convert power which is provided 5V in Power board.
15V is provided for inverter in L226WTQ/WTG.
Also, 5V is converted 3.3V and 1.8V by regulator. Converted power is provided for IC in the main board.
The inverter converts from DC 15V to AC 700Vrms and operates back-light lamps of module in L226WTQ/WTG.
3. MICOM Part.
This part is include video controller part. And this part consists of EEPROM IC , control data, Reset IC and the Micom.
The Micom distinguishes polarity and frequency of the H/V sync are supplied from signal cable.
The controlled data of each modes is stored in EEPROM.
Page 12
LIPS Board Block Diagram
- 12 -
Operation description_Power
1. EMI components.
This part contains of EMI components to comply with global marketing EMI standards like FCC,VCCI CISPR, the
circuit included a line-filter, across line capacitor and of course the primary protection fuse.
2. Input rectifier and filter.
This part function is for transfer the input AC voltage to a DC voltage through a bridge rectifier and a bulk capacitor.
3. Energy Transfer.
This part function is for transfer the primary energy to secondary through a power transformer.
4. Output rectifier and filter.
This part function is to make a pulse width modulation control and to provide the driver signal to power switch, to
adjust the duty cycle during different AC input and output loading condition to achieve the dc output stabilized, and
also the over power protection is also monitor by this part.
5. Photo-Coupler isolation.
This part function is to feed back the DC output changing status through a photo transistor to primary controller to
achieve the stabilized DC output voltage.
6. Signal collection.
This part function is to collect the any change from the DC output and feed back to the primary through photo
transistor.
50 ~ 60Hz
LINE
100 ~ 240V
EMI
COMPONENTS
INPUT RECTIFIER
AND FILTER
PWM
CONTROL
CIRCUIT
HVDC
ENERGY
TRANSFER
PHOTO-
COUPLER
ISOLATION
67KH z
OUTPUT RECTIFIER
AND FILTER
SIGNAL
COLLENT-
ION
15V
5V
GND
PRIMARY SECONDARY
Page 13
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ADJUSTMENT
Windows EDID V1.0 User Manual
Operating System: MS Windows 98, 2000, XP
Port Setup: Windows 98 => Doesn’t need setup
Windows 2000, XP => Need to Port Setup.
This program is available for LCD Monitor only.
1. Port Setup
a) Copy “UserPort.sys” file to
“c:\WINNT\system32\drivers” folder
b) Run Userport.exe
c) Remove all default number
d) Add 300-3FF
e) Click Start button.
f) Click Exit button.
2. EDID Read & Write
1) Run WinEDID.exe
2) Edit Week of Manufacture, Year of Manufacture,
Serial Number
a) Input User Info Data
b) Click “Update” button
c) Click “ Write” button
Page 14
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2
2
0
IBM
Compatible PC
PARALLEL PORT
Power inlet (required)
Power LED
ST Switch
Power Select Switch
(110V/220V)
Control Line
Not used
RS232C
PARALLEL
V-SYNC
PO
W
ER
ST
VGS
MONITOR
E
E
V-Sync On/Off Switch
(Switch must be ON.)
F
F
A
A
B
B
C
C
15
10
5
5
69
1
1
1
14
13
25
6
5V
5V
5V
4.7K
4.7K
4.7K
74LS06
74LS06
OFF ON
OFF
ON
11
Video Signal
Generator
Figure 1. Cable Connection
SERVICE OSD
1) Turn off the power switch at the right side of the display.
2) Wait for about 5 seconds and press MENU, POWER switch for 1 second interval.
3) The SVC OSD menu contains additional menus that the User OSD menu as described below.
a) CLEAR ETI : To initialize using time.
c) Auto Color : W/B balance and Automatically sets the gain and offset value.
(press key for over 3 sec)
d) AGING : Select Aging mode(on/off).
b) Module : To select applied module.
d) NVRAM INIT : EEPROM initialize.(24C16, press key for over 3 sec)
e) R/G/B-9300K : Allows you to set the R/G/B-9300K value manually.
f) R/G/B-6500K : Allows you to set the R/G/B-6500K value manually.
g) R/G/B-Offset : Allows you to set the R/G/B-Offset value manually.(Analog Only)
h) R/G/B-Gain : Allows you to set the R/G/B-Gain value manually.(Analog Only)
Page 15
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TROUBLESHOOTING GUIDE
1. NO POWER
NO POWER
(POWER INDICATOR OFF)
CHECK U501
NO
NO
CHECK POWER BOARD,
AND FIND OUT A SHORT
POINT AS OPENING
EACH POWER LINE
CHECK U901(3.3V)
U902(1.8V) LINE
NO
CHECK CRYSTAL(X501)
YES
YES
YES
CHECK J905 VOLTAGE
PIN5, PIN6 (5V)?
IS U901 PIN2(3.3V)
U902 PIN2(1.8V)
CHECK X501 PIN127
PULSE
1
2
13
14
Waveforms
1
J905-#5,6
2
U901-#2
3
U902-#2
4
U501-#127
Page 16
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2. NO RASTER (OSD IS NOT DISPLAYED) – LIPS
CHECK U501 INVERTER
ON/OFF PORT
J905 PIN9 3.3V?
NO RASTER
(OSD IS NOT DISPLAYED)
CHECK POWER BOARD
(LIPS)
CHECK J905
VOLTAGE PIN5,6
(5V)?
NO
NO
NO
NO
1. CONFIRM BRIGHTNESS
OSD CONTRL STATUS
2. CHECK MICOM DIM-ADJ
PORT
CHECK J905
PIN10
POWER BOARD (LIPS)
CHECK
PULSE AS
CONTACTING PROBE
TO THE LAMP
WIRE OF THE
LCD MODULE
REPLACE LCD MODULE
YES
1
2
3
4
YES
YES
YES
Waveforms
1
J905-#5,6
2
J905-#9
3
J905-#10 (Brightness 100)
5
LAMP CURRENT
3
J905-#10 (Brightness 0)
Page 17
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3. NO RASTER (OSD IS NOT DISPLAYED) - MAIN
1. CHECK PIN 127,128
SOLDERING CONDITION
2. CHECK X501
3. TROUBLE IN U501
CHECK U501
PIN114(3.3V)
PIN21(1.8V)
NO
NO
NO
CHECK U901(3.3V),
U902(1.8V)
U501
PIN 127,128
14.3MHZ?
CHECK CONNECTION LINE
FROM D-SUB TO U501
TROUBLE IN CABLE
OR LCD MODULE
YES
YES
NO RASTER
(OSD IS NOT DISPLAYED)
CHECK U501
PIN32(H-SYNC) AND
PIN33(V-SYNC).
IS PULSE APPEARED AT
SIGNAL PINS?
YES
1
Waveforms
1
U501-#127
Page 18
- 18 -
4. TROUBLE IN DPM
TROUBLE IN DPM
TROUBLE IN U501
CHECK PC
PC IS GOING
INTO DPM MODE
NO
CHECK H/V SYNC LINE
NO
YES
CHECK R718 AND
R719, SYNC
APPEARED?
CHECK
U501 PIN 32,33
SYNC PULSE
YES
1
H-SYNC
2
V-SYNC
Waveforms
1
2
Page 19
EXPLODED VIEW
- 19 -
200
400
420
500
510
410
900
430
910
920
300
520
310
320
330
Page 20
- 20 -
EXPLODED VIEW PARTS LIST
200 EAJ33945801
LCD,Module-TFT, LM220WE1-TLA1 DRIVER 22.0INCH 1680X1050 300CD COLOR 72% 16/10 800:1 160/160 5ms 4LAMPS LG PHILIPS LCD
EAJ33527501
LCD,Module-TFT, M220Z1-L01 ZBD DRIVER 22.0INCH 1680X1050 300CD COLOR 72% 16/10 700:1 4CCFL, 2CH-LVDS, 5MS, 170/160 CHI MEI OPTOELECTRONICS CORP
or EAJ33527502
LCD,Module-TFT, M220Z1-L01 NON-ZBD DRIVER 22.0INCH 1680X1050 300CD COLOR 72% 16/10 700:1 4CCFL, 2CH-LVDS, 5MS, 170/160 CHI MEI OPTOELECTRONICS CORP
EAJ38178401
LCD,Module-TFT, LM220WE1-TLD1 WSXGA 22.0INCH 1680X1050 300CD COLOR 72% 16/10 1000:1 5ms,TN,P7(MMG),160/160,4CCFL,16.7M(6BIT+Hi-FRC),Non-Glare,Source:Novatek, Gate:OKI
EAJ38030201
LCD,Module-TFT, M220EW01 V0 ZBD WSXGA 22.0INCH 1680X1050 300CD COLOR 72% 16/10 1000:1 5ms,TN,170/160,4CCFL,16.7M(6BIT+A-FRC),Non-Glare,Non-ZBD AU OPTRONICS CORP
or EAJ38030202
LCD,Module-TFT, M220EW01 V0 Non-ZBD WSXGA 22.0INCH 1680X1050 300CD COLOR 72% 16/10 1000:1 5ms,TN,170/160,4CCFL,16.7M(6BIT A-FRC),Non-Glare,Non-ZBD AU OPTRONICS CORP
300 ABJ31701220 Cabinet Assembly, L226WTQ LM62A 23" Black,3000:1+2ms+EPA
ABJ32761401 Cabinet Assembly, L226W LM62A 23" Glare cabient-WHITE
310 MEY33947503 Knob, MOLD ABS MAIN 5 L225W Control Knob(5Key) Black
320 MEY33947602 Knob, MOLD ABS MAIN2 1 L225W Power(On/Off)
330 MFB33947801 Lens, MOLD PMMA BENQ LENS L225W Eagel Eye
400 ACQ31701704 Cover Assembly,Rear, L225W LM62A 23" Backcover LPL DVI,D-SUB-Black
ACQ31701719
Cover Assembly,Rear, L225W LM62A 23" Backcover CMO DVI,D-SUB,mercury-C/SKD-For U.S.A
ACQ31701720
Cover Assembly,Rear, L225W LM62A 23" Backcover LPL DVI,D-SUB,mercury-C/SKD-For U.S.A
ACQ31701701
Cover Assembly,Rear, L225W LM62A 23" Backcover CMO DVI,D-SUB-C/SKD-For Japan,Russia
ACQ31701733 Cover Assembly,Rear, L225W LM62A 23" Backcover LPL DVI,D-SUB,White,EU
410 MGJ33948901 Plate,Metal, PRESS SECC 0.8 SUPPORTER SECC L225W Stand Bracket Metal
420 ADV31702021
Frame Assembly, L226W LM62A 23" Domestic Assy,Rear Shield Assy(DVI-D,D-SUB) for LPL
ADV31702001 Frame Assembly, L225W LM62A 23" Rear shield assy ,DVI,D-SUB-CMO-C/SKD
ADV31702015 Frame Assembly, L226W LM62A 23" Rear Shield Assy(DVI-D,D-SUB) for LPL-C/SKD
430 ADV32121503 Frame Assembly, L226W LM62A 23" Lamp shield assy, domestic assy
ADV32121501 Frame Assembly, L226W LM62A 23" Lamp shield assy-C/SKD
500 EBU37792101 Main Total Assembly, L226WTQ-XFS BRAND LM74B
EBU37792102 Main Total Assembly, L226WTQ-XFS BRAND LM74B-C/SKD
510 EAY37155801
Power Supply Assembly, AIP-0156 FREE 22LS4D, 4Lamp MFT LCD LienChang 19", 20", 22" 4Lamp MFT LIEN CHANG
520 EBR33771802 PCB Assembly,Sub, CONTROL T.T LM62B L225WT ARDGQF L225WT Gumi CONTROL
EBR33771804
PCB Assembly,Sub, CONTROL T.T LM62B L226WT S KXXV(O)XPN L226WT Gumi CONTROL-C/SKD
900 AAN31689301 Base Assembly, STAND L225WT LM62A STAND HINGE BODY ASSY
910 AAN31689201 Base Assembly, STAND L225WT LM62A STAND BODY ASSY
920 AAN31688001 Base Assembly, ASSY L225WT LM62A STAND BASE ASSY
Description
Part No.
No.
* Note: Safety mark
Page 21
LOC. NO. PART NO. DESCRIPTION / SPECIFICATION
A1 SAB30926101 "S/W PackageKR015457 L196WTG/Q, L"
SAB30926103 S/W PackageSAB30926103 L196WTG/Q
SAB30571102 S/W PackageL226WT-SFQ CD ASSY US
SAB30571108 S/W PackageJAPAN; CD ASSY JAPAN;
SAB30571109 S/W PackageRUSSIA(OVERSEAS); CD
A2 6410TEW010A "Power CordCEE,LP-34A&H05VV-FX3C,"
6410TAW001A Power CordPG8BHM3CG0A-062 LP-39
64109UP002A Power CordDTII-3P-11+DTII-3P-04
EAD30470701 Power CordLP-42 LS-60 1.87M NONE
6410TJW005A "Power CordPSE,LP-54 & VTF18OXC70"
A3 3171TZ1099Q S/W Package3171TZ1099Q Forte Man
A4 3840TRL045L CardPRINTING REGISTRATION BRAND
A5 68509F0003A "Cable,AssemblyD-SUB TO D-SUB UL2"
A6 68509J0004A "Cable,AssemblyDVI-D TO DVI-D UL2"
C501 0CK104CF56A "Capacitor,Ceramic,Chip0603B104K1"
C502 0CK473CH56A "Capacitor,Ceramic,ChipC1608X7R1E"
C503 0CK473CH56A "Capacitor,Ceramic,ChipC1608X7R1E"
C504 0CK473CH56A "Capacitor,Ceramic,ChipC1608X7R1E"
C505 0CK473CH56A "Capacitor,Ceramic,ChipC1608X7R1E"
C506 0CC102CK41A "Capacitor,Ceramic,ChipC1608C0G1H"
C507 0CK473CH56A "Capacitor,Ceramic,ChipC1608X7R1E"
C508 0CK473CH56A "Capacitor,Ceramic,ChipC1608X7R1E"
C509 0CC270CK41A "Capacitor,Ceramic,ChipC1608C0G1H"
C510 0CC270CK41A "Capacitor,Ceramic,ChipC1608C0G1H"
C511 0CK103CK51A "Capacitor,Ceramic,Chip0603B103K5"
C512 0CK103CK51A "Capacitor,Ceramic,Chip0603B103K5"
C513 0CK104CF56A "Capacitor,Ceramic,Chip0603B104K1"
C514 0CK224CF56A "Capacitor,Ceramic,Chip0603B224K1"
C515 0CE106CF638 "Capacitor,AL,RadialSHL5.0TP16VB1"
C516 0CK104CF56A "Capacitor,Ceramic,Chip0603B104K1"
C517 0CK104CF56A "Capacitor,Ceramic,Chip0603B104K1"
C518 0CK104CF56A "Capacitor,Ceramic,Chip0603B104K1"
C519 0CK104CF56A "Capacitor,Ceramic,Chip0603B104K1"
C520 0CK104CF56A "Capacitor,Ceramic,Chip0603B104K1"
C521 0CK104CF56A "Capacitor,Ceramic,Chip0603B104K1"
C522 0CK104CF56A "Capacitor,Ceramic,Chip0603B104K1"
C523 0CK104CF56A "Capacitor,Ceramic,Chip0603B104K1"
C524 0CK104CF56A "Capacitor,Ceramic,Chip0603B104K1"
C525 0CK104CF56A "Capacitor,Ceramic,Chip0603B104K1"
C526 0CK104CF56A "Capacitor,Ceramic,Chip0603B104K1"
C527 0CK104CF56A "Capacitor,Ceramic,Chip0603B104K1"
C528 0CK104CF56A "Capacitor,Ceramic,Chip0603B104K1"
C529 0CK104CF56A "Capacitor,Ceramic,Chip0603B104K1"
C530 0CK104CF56A "Capacitor,Ceramic,Chip0603B104K1"
C531 0CK104CF56A "Capacitor,Ceramic,Chip0603B104K1"
C532 0CK104CF56A "Capacitor,Ceramic,Chip0603B104K1"
C533 0CK104CF56A "Capacitor,Ceramic,Chip0603B104K1"
C534 0CK104CF56A "Capacitor,Ceramic,Chip0603B104K1"
C535 0CK104CF56A "Capacitor,Ceramic,Chip0603B104K1"
C536 0CK104CF56A "Capacitor,Ceramic,Chip0603B104K1"
C537 0CK104CF56A "Capacitor,Ceramic,Chip0603B104K1"
C538 0CK104CF56A "Capacitor,Ceramic,Chip0603B104K1"
C539 0CC080CK11A "Capacitor,Ceramic,ChipC1608C0G1H"
C540 0CC080CK11A "Capacitor,Ceramic,ChipC1608C0G1H"
C541 0CC080CK11A "Capacitor,Ceramic,ChipC1608C0G1H"
C701 0CC101CK41A "Capacitor,Ceramic,ChipC1608C0G1H"
C702 0CC101CK41A "Capacitor,Ceramic,ChipC1608C0G1H"
C703 0CC680CK41A "Capacitor,Ceramic,ChipC1608C0G1H"
C704 0CK104CK56A "Capacitor,Ceramic,Chip0603B104K5"
C705 0CC680CK41A "Capacitor,Ceramic,ChipC1608C0G1H"
C706 0CK104CF56A "Capacitor,Ceramic,Chip0603B104K1"
C707 0CK104CF56A "Capacitor,Ceramic,Chip0603B104K1"
C708 0CK104CF56A "Capacitor,Ceramic,Chip0603B104K1"
C709 0CK104CF56A "Capacitor,Ceramic,Chip0603B104K1"
C710 0CK104CF56A "Capacitor,Ceramic,Chip0603B104K1"
C711 0CK104CF56A "Capacitor,Ceramic,Chip0603B104K1"
C712 0CK104CF56A "Capacitor,Ceramic,Chip0603B104K1"
C713 0CK104CF56A "Capacitor,Ceramic,Chip0603B104K1"
C714 0CC680CK41A "Capacitor,Ceramic,ChipC1608C0G1H"
C715 0CC680CK41A "Capacitor,Ceramic,ChipC1608C0G1H"
C716 0CK104CF56A "Capacitor,Ceramic,Chip0603B104K1"
C717 0CK104CF56A "Capacitor,Ceramic,Chip0603B104K1"
C718 0CK104CF56A "Capacitor,Ceramic,Chip0603B104K1"
C719 0CK104CF56A "Capacitor,Ceramic,Chip0603B104K1"
C720 0CK104CF56A "Capacitor,Ceramic,Chip0603B104K1"
C723 0CK104CF56A "Capacitor,Ceramic,Chip0603B104K1"
C724 0CK105CD56A "Capacitor,Ceramic,ChipC1608X7R1A"
C725 0CC101CK41A "Capacitor,Ceramic,ChipC1608C0G1H"
C901 0CK103CK51A "Capacitor,Ceramic,Chip0603B103K5"
C902 0CE107EF610 "Capacitor,AL,RadialKMG16VB100M 1"
C905 0CE107EF610 "Capacitor,AL,RadialKMG16VB100M 1"
C906 0CE107EF610 "Capacitor,AL,RadialKMG16VB100M 1"
C907 0CE107EF610 "Capacitor,AL,RadialKMG16VB100M 1"
C908 0CK104CK56A "Capacitor,Ceramic,Chip0603B104K5"
C909 0CK104CK56A "Capacitor,Ceramic,Chip0603B104K5"
C910 0CK104CK56A "Capacitor,Ceramic,Chip0603B104K5"
C911 0CK102CK56A "Capacitor,Ceramic,Chip0603B102K5"
C912 0CK102CK56A "Capacitor,Ceramic,Chip0603B102K5"
C913 0CK102CK56A "Capacitor,Ceramic,Chip0603B102K5"
C914 0CE227EF610 "Capacitor,AL,RadialKMG16VB220M 2"
C915 0CK103CK51A "Capacitor,Ceramic,Chip0603B103K5"
C915 0CK105CD56A "Capacitor,Ceramic,ChipC1608X7R1A"
LOC. NO. PART NO. DESCRIPTION / SPECIFICATION
- 21 -
REPLACEMENT PARTS LIST
DATE: 2007. 05. 15.
CAPACITORs
ACCESSORY
Page 22
LOC. NO. PART NO. DESCRIPTION / SPECIFICATION
D701 0DS226009AA "Diode,SwitchingKDS226 1.2V 85V 3"
D702 0DS226009AA "Diode,SwitchingKDS226 1.2V 85V 3"
D703 0DS226009AA "Diode,SwitchingKDS226 1.2V 85V 3"
D704 0DS226009AA "Diode,SwitchingKDS226 1.2V 85V 3"
D705 0DS226009AA "Diode,SwitchingKDS226 1.2V 85V 3"
D706 0DS226009AA "Diode,SwitchingKDS226 1.2V 85V 3"
D707 0DS226009AA "Diode,SwitchingKDS226 1.2V 85V 3"
D708 0DS226009AA "Diode,SwitchingKDS226 1.2V 85V 3"
D709 0DS226009AA "Diode,SwitchingKDS226 1.2V 85V 3"
D710 0DS226009AA "Diode,SwitchingKDS226 1.2V 85V 3"
D711 0DS226009AA "Diode,SwitchingKDS226 1.2V 85V 3"
D712 0DSON00138A "Diode,SchottkyMMBD301LT1G 600MV"
D713 0DD184009AA Diode AssemblyKDS184 KDS184 TP K
D714 0DSON00138A "Diode,SchottkyMMBD301LT1G 600MV"
D715 0DD184009AA Diode AssemblyKDS184 KDS184 TP K
ZD1 0DZ560009GB "Diode,ZenerBZT52C5V6S-(F) 5.6V 5"
ZD2 0DZ560009GB "Diode,ZenerBZT52C5V6S-(F) 5.6V 5"
ZD3 0DZ560009GB "Diode,ZenerBZT52C5V6S-(F) 5.6V 5"
ZD4 0DZ560009GB "Diode,ZenerBZT52C5V6S-(F) 5.6V 5"
ZD701 0DZ560009GB "Diode,ZenerBZT52C5V6S-(F) 5.6V 5"
ZD702 0DZ560009GB "Diode,ZenerBZT52C5V6S-(F) 5.6V 5"
ZD703 0DZ560009GB "Diode,ZenerBZT52C5V6S-(F) 5.6V 5"
ZD704 0DZ560009GB "Diode,ZenerBZT52C5V6S-(F) 5.6V 5"
ZD705 0DZ560009GB "Diode,ZenerBZT52C5V6S-(F) 5.6V 5"
ZD708 0DZ560009GB "Diode,ZenerBZT52C5V6S-(F) 5.6V 5"
ZD709 0DZ560009GB "Diode,ZenerBZT52C5V6S-(F) 5.6V 5"
ZD710 0DZ560009GB "Diode,ZenerBZT52C5V6S-(F) 5.6V 5"
IC1 0IPMGA0010A "IC,LDO Voltage RegulatorAZ1117H-"
U501 0IPRP00784C "IC,Video ProcessorsFE253MOH-LF 3"
U502 EAN37791401 IC AssemblyL226WTQ-XFS Msta refr
U503 0IMMRSG036B "IC,EEPROMM24C16-WMN6TP 16KBIT 2K"
U701 0IMMR00014A "IC,EEPROMM24C02-RMN6TP 2KBIT 256"
U702 0IMMR00014A "IC,EEPROMM24C02-RMN6TP 2KBIT 256"
U901 0IPMGA0010A "IC,LDO Voltage RegulatorAZ1117H-"
U902 0IPMG78403A "IC,LDO Voltage RegulatorAZ1086S-"
L901 0LCML00003B "Filter,BeadMLB-201209-0120P-N2 1"
L902 0LCML00003B "Filter,BeadMLB-201209-0120P-N2 1"
L903 0LCML00003B "Filter,BeadMLB-201209-0120P-N2 1"
Q501 0TR390409AE "TR,BipolarKST3904 NPN 6V 60V 40V"
Q701 0TR390609FA "TR,BipolarKST3906-MTF PNP -5V -4"
Q702 0TR390609FA "TR,BipolarKST3906-MTF PNP -5V -4"
Q901 0TR127309AA "TR,BipolarKTA1273 PNP -5V -30V -"
Q902 0TR390409AE "TR,BipolarKST3904 NPN 6V 60V 40V"
Q904 0TR127309AA "TR,BipolarKTA1273 PNP -5V -30V -"
R1 0RJ7501D677 "Resistor,ChipMCR03EZPJ752 7.5KOH"
R2 0RJ7501D677 "Resistor,ChipMCR03EZPJ752 7.5KOH"
R3 0RJ1201D677 "Resistor,ChipMCR03EZPJ122 1.2KOH"
R4 0RJ1801D677 "Resistor,ChipMCR03EZPJ182 1.8KOH"
R5 0RJ1201D677 "Resistor,ChipMCR03EZPJ122 1.2KOH"
R501 0RJ1000D677 "Resistor,ChipMCR03EZPJ101 100OHM"
R502 0RJ0562D677 "Resistor,ChipMCR03EZPJ560 56OHM"
R503 0RJ1000D677 "Resistor,ChipMCR03EZPJ101 100OHM"
R504 0RJ0562D677 "Resistor,ChipMCR03EZPJ560 56OHM"
R505 0RJ4700D677 "Resistor,ChipMCR03EZPJ471 470OHM"
R506 0RJ1000D677 "Resistor,ChipMCR03EZPJ101 100OHM"
R507 0RJ0562D677 "Resistor,ChipMCR03EZPJ560 56OHM"
R508 0RJ4701D677 "Resistor,ChipMCR03EZPJ472 4.7KOH"
R509 0RJ4701D677 "Resistor,ChipMCR03EZPJ472 4.7KOH"
R510 0RJ4701D677 "Resistor,ChipMCR03EZPJ472 4.7KOH"
R511 0RJ4701D677 "Resistor,ChipMCR03EZPJ472 4.7KOH"
R512 0RJ4700D677 "Resistor,ChipMCR03EZPJ471 470OHM"
R513 0RJ4700D677 "Resistor,ChipMCR03EZPJ471 470OHM"
R516 0RJ3900D677 "Resistor,ChipMCR03EZPJ391 390OHM"
R517 0RJ1002D677 "Resistor,ChipMCR03EZPJ103 10KOHM"
R518 0RJ0000D677 "Resistor,ChipMCR03EZPJ000 0OHM 5"
R519 0RJ1502D677 "Resistor,ChipMCR03EZPJ153 15KOHM"
R522 0RJ4701D677 "Resistor,ChipMCR03EZPJ472 4.7KOH"
R523 0RJ1000D677 "Resistor,ChipMCR03EZPJ101 100OHM"
R524 0RJ1002D677 "Resistor,ChipMCR03EZPJ103 10KOHM"
R525 0RJ4701D677 "Resistor,ChipMCR03EZPJ472 4.7KOH"
R526 0RJ0332D677 "Resistor,ChipMCR03EZPJ330 33OHM"
R527 0RJ0332D677 "Resistor,ChipMCR03EZPJ330 33OHM"
R530 0RJ1002D677 "Resistor,ChipMCR03EZPJ103 10KOHM"
R6 0RJ1801D677 "Resistor,ChipMCR03EZPJ182 1.8KOH"
R701 0RJ4701D677 "Resistor,ChipMCR03EZPJ472 4.7KOH"
R702 0RJ4701D677 "Resistor,ChipMCR03EZPJ472 4.7KOH"
R703 0RJ0332D677 "Resistor,ChipMCR03EZPJ330 33OHM"
R704 0RJ0102D677 "Resistor,ChipMCR03EZPJ100 10OHM"
R705 0RJ0102D677 "Resistor,ChipMCR03EZPJ100 10OHM"
R706 0RJ0102D677 "Resistor,ChipMCR03EZPJ100 10OHM"
R707 0RJ0102D677 "Resistor,ChipMCR03EZPJ100 10OHM"
R708 0RJ0102D677 "Resistor,ChipMCR03EZPJ100 10OHM"
R709 0RJ0102D677 "Resistor,ChipMCR03EZPJ100 10OHM"
R710 0RJ0332D677 "Resistor,ChipMCR03EZPJ330 33OHM"
R711 0RJ0000D677 "Resistor,ChipMCR03EZPJ000 0OHM 5"
R712 0RJ0102D677 "Resistor,ChipMCR03EZPJ100 10OHM"
R713 0RJ0102D677 "Resistor,ChipMCR03EZPJ100 10OHM"
R714 0RJ1001D677 "Resistor,ChipMCR03EZPJ102 1KOHM"
R715 0RJ0000D677 "Resistor,ChipMCR03EZPJ000 0OHM 5"
R716 0RJ0332D677 "Resistor,ChipMCR03EZPJ330 33OHM"
R717 0RJ0752D677 "Resistor,ChipMCR03EZPJ750 75OHM"
R718 0RJ0682D677 "Resistor,ChipMCR03EZPJ680 68OHM"
R719 0RJ0682D677 "Resistor,ChipMCR03EZPJ680 68OHM"
R720 0RJ0332D677 "Resistor,ChipMCR03EZPJ330 33OHM"
R721 0RJ0752D677 "Resistor,ChipMCR03EZPJ750 75OHM"
R722 0RJ0752D677 "Resistor,ChipMCR03EZPJ750 75OHM"
R723 0RJ0000D677 "Resistor,ChipMCR03EZPJ000 0OHM 5"
LOC. NO. PART NO. DESCRIPTION / SPECIFICATION
- 22 -
ICs
FILTERs
TRANSISTORs
RESISTORs
DIODEs
Page 23
LOC. NO. PART NO. DESCRIPTION / SPECIFICATION
R724 0RJ4701D677 "Resistor,ChipMCR03EZPJ472 4.7KOH"
R725 0RJ4701D677 "Resistor,ChipMCR03EZPJ472 4.7KOH"
R726 0RJ4701D677 "Resistor,ChipMCR03EZPJ472 4.7KOH"
R727 0RJ4701D677 "Resistor,ChipMCR03EZPJ472 4.7KOH"
R728 0RJ4701D677 "Resistor,ChipMCR03EZPJ472 4.7KOH"
R729 0RJ4701D677 "Resistor,ChipMCR03EZPJ472 4.7KOH"
R730 0RJ2200D677 "Resistor,ChipMCR03EZPJ221 220OHM"
R731 0RJ2200D677 "Resistor,ChipMCR03EZPJ221 220OHM"
R732 0RJ1000D677 "Resistor,ChipMCR03EZPJ101 100OHM"
R733 0RJ1000D677 "Resistor,ChipMCR03EZPJ101 100OHM"
R735 0RJ2001D677 "Resistor,ChipMCR03EZPJ202 2KOHM"
R736 0RJ4701D677 "Resistor,ChipMCR03EZPJ472 4.7KOH"
R737 0RJ4701D677 "Resistor,ChipMCR03EZPJ472 4.7KOH"
R738 0RJ4701D677 "Resistor,ChipMCR03EZPJ472 4.7KOH"
R739 0RJ4701D677 "Resistor,ChipMCR03EZPJ472 4.7KOH"
R903 0RJ1002D677 "Resistor,ChipMCR03EZPJ103 10KOHM"
R904 0RJ1002D677 "Resistor,ChipMCR03EZPJ103 10KOHM"
R904 0RJ2001D677 "Resistor,ChipMCR03EZPJ202 2KOHM"
R905 0RJ3900D677 "Resistor,ChipMCR03EZPJ391 390OHM"
R906 0RH1002D622 "Resistor,ChipMCR10EZHJ103 10KOHM"
R907 0RX0331K668 "Resistor,Metal Oxide FilmRSD02F4"
R909 0RJ0000D677 "Resistor,ChipMCR03EZPJ000 0OHM 5"
R910 0RJ0000D677 "Resistor,ChipMCR03EZPJ000 0OHM 5"
R911 0RJ1002D677 "Resistor,ChipMCR03EZPJ103 10KOHM"
R912 0RJ3900D677 "Resistor,ChipMCR03EZPJ391 390OHM"
C1 6631900109A "Harness,Single(FOOSUNG)DCE153B-2"
C2 6631V12031F "Harness,Single12505HS-0400 12505"
C3 6631T12006E "Harness,Single6P(1.25MM)_220MM 1"
C4 6631T20034P "Harness,Single11P(M203WTB) SMH20"
J1 6602T12005E "Connector,Wafer12505WR-06A00 6P"
J2 6602T12005C "Connector,Wafer12505WR-04A00 4P"
J3 6602T12005C "Connector,Wafer12505WR-04A00 4P"
J901 6630TGA005B "Connector,DSUBQH11121-DN0-D DVI"
J902 6630TGA004F "Connector,DSUBKCN-DS-3-0062 D-SU"
J905 6602T20008K "Connector,WaferSMW200-11P 11P 2."
J906 6630V90219A "Connector,WaferSMW200-28C 28P 2."
J907 6602T12004E "Connector,Wafer12505WS-06A00 6P"
SW1 6600R00004C "Switch,TactJTP1127WEM 1C1P 15VDC"
SW2 6600R00004C "Switch,TactJTP1127WEM 1C1P 15VDC"
SW3 6600R00004C "Switch,TactJTP1127WEM 1C1P 15VDC"
SW4 6600R00004C "Switch,TactJTP1127WEM 1C1P 15VDC"
SW5 6600R00004C "Switch,TactJTP1127WEM 1C1P 15VDC"
SW6 6600R00004C "Switch,TactJTP1127WEM 1C1P 15VDC"
B1 MAY33996601 BoxBOX SW 559 173 403 2 COLOR L2
D1 0DLBE0048AA "LED,ChipBL-HKBB533B-TRB SUPER YE"
D1 0DLGP0128AA "LED,ChipGPTD1210YBC BLUE/YELLOW"
P1 3918TKK038S Packing(1030*820) FOR LG130AL G
P2 MFZ33027201 PackingMOLD EPS L225WA EPS EPS F
X501 6212AA2004F CrystalHC-49/U 14.31818MHZ 30PPM
LOC. NO. PART NO. DESCRIPTION / SPECIFICATION
- 23 -
CONNECTORs
SWITCHs
OTHERs
Page 24
- 24 -
PRINTED CIRCUIT BOARD
MAIN (TOP)
MAIN (BOTTOM)
Page 25
- 25 -
CONTROL
Page 26
SCHEMATIC DIAGRAM
- 26 -
1. SCALER
Page 27
- 27 -
2. POWER & WAFER
Page 28
- 28 -
3. CONTROL
Page 29
May. 2007
P/NO : MFL38456741 Printed in Korea
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