Width: 501.7 mm (19.75 inchs)
Depth: 59.5 mm (2.34 inchs)
Height: 337.4 mm (13.28 inchs)
8. WEIGHT (with TILT/SWIVEL)
Net. Weight: 5.65 kg
(12.56 Ibs)
Page 3
PRECAUTION
WARNING FOR THE SAFETY-RELATED COMPONENT.
• There are some special components used in LCD
monitor that are important for safety. These parts are
marked on the schematic diagram and the
replacement parts list. It is essential that these critical
parts should be replaced with the manufacturer’s
specified parts to prevent electric shock, fire or other
hazard.
• Do not modify original design without obtaining written
permission from manufacturer or you will void the
original parts and labor guarantee.
TAKE CARE DURING HANDLING THE LCD MODULE
WITH BACKLIGHT UNIT.
• Must mount the module using mounting holes arranged
in four corners.
• Do not press on the panel, edge of the frame strongly
or electric shock as this will result in damage to the
screen.
• Do not scratch or press on the panel with any sharp
objects, such as pencil or pen as this may result in
damage to the panel.
• Protect the module from the ESD as it may damage the
electronic circuit (C-MOS).
• Make certain that treatment person’s body are
grounded through wrist band.
• Do not leave the module in high temperature and in
areas of high humidity for a long time.
• The module not be exposed to the direct sunlight.
• Avoid contact with water as it may a short circuit within
the module.
• If the surface of panel become dirty, please wipe it off
with a softmaterial. (Cleaning with a dirty or rough cloth
may damage the panel.)
WARNING
BE CAREFUL ELECTRIC SHOCK !
• If you want to replace with the new backlight (CCFL) or
inverter circuit, must disconnect the AC adapter
because high voltage appears at inverter circuit about
650Vrms.
• Handle with care wires or connectors of the inverter
circuit. If the wires are pressed cause short and may
burn or take fire.
Leakage Current Hot Check Circuit
CAUTION
Please use only a plastic screwdriver to protect yourself
from shock hazard during service operation.
1.5 Kohm/10W
To Instrument’s
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
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Page 4
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this
service manual and its supplements and addenda, read
and follow the SAFETY PRECAUTIONS on page 3 of this
publication.
NOTE: If unforeseen circumstances create conflict
between the following servicing precautions and any of the
safety precautions on page 3 of this publication, always
follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC
power source before;
a. Removing or reinstalling any component, circuit
board module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical
plug or other electrical connection.
c. Connecting a test substitute in parallel with an
electrolytic capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect
polarity installation of electrolytic capacitors may
result in an explosion hazard.
d. Discharging the picture tube anode.
2. Test high voltage only by measuring it with an
appropriate high voltage meter or other voltage
measuring device (DVM, FETVOM, etc) equipped with
a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Discharge the picture tube anode only by (a) first
connecting one end of an insulated clip lead to the
degaussing or kine aquadag grounding system shield
at the point where the picture tube socket ground lead
is connected, and then (b) touch the other end of the
insulated clip lead to the picture tube anode button,
using an insulating handle to avoid personal contact
with high voltage.
4. Do not spray chemicals on or near this receiver or any
of its assemblies.
5. Unless specified otherwise in this service manual,
clean electrical contacts only by applying the following
mixture to the contacts with a pipe cleaner, cottontipped stick or comparable non-abrasive applicator;
10% (by volume) Acetone and 90% (by volume)
isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual,
lubrication of contacts in not required.
6. Do not defeat any plug/socket B+ voltage interlocks
with which receivers covered by this service manual
might be equipped.
7. Do not apply AC power to this instrument and/or any of
its electrical assemblies unless all solid-state device
heat sinks are correctly installed.
8. Always connect the test receiver ground lead to the
receiver chassis ground before connecting the test
receiver positive lead.
Always remove the test receiver ground lead last.
9. Use with this receiver only the test fixtures specified in
this service manual.
CAUTION: Do not connect the test fixture ground strap
to any heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be
damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive (ES)Devices. Examples of typical ES devices are integrated
circuits and some field-effect transistors and
semiconductor "chip" components. The following
techniques should be used to help reduce the incidence of
component damage caused by static by static electricity.
1. Immediately before handling any semiconductor
component or semiconductor-equipped assembly, drain
off any electrostatic charge on your body by touching a
known earth ground. Alternatively, obtain and wear a
commercially available discharging wrist strap device,
which should be removed to prevent potential shock
reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with
ES devices, place the assembly on a conductive
surface such as aluminum foil, to prevent electrostatic
charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or
unsolder ES devices.
4. Use only an anti-static type solder removal device.
Some solder removal devices not classified as "antistatic" can generate electrical charges sufficient to
damage ES devices.
5. Do not use freon-propelled chemicals. These can
generate electrical charges sufficient to damage ES
devices.
6. Do not remove a replacement ES device from its
protective package until immediately before you are
ready to install it. (Most replacement ES devices are
packaged with leads electrically shorted together by
conductive foam, aluminum foil or comparable
conductive material).
7. Immediately before removing the protective material
from the leads of a replacement ES device, touch the
protective material to the chassis or circuit assembly
into which the device will be installed.
CAUTION: Be sure no power is applied to the chassis
or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion
such as the brushing together of your clothes fabric or
the lifting of your foot from a carpeted floor can
generate static electricity sufficient to damage an ES
device.)
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Page 5
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and
appropriate tip size and shape that will maintain tip
temperature within the range or 500。F to 600。F.
2. Use an appropriate gauge of RMA resin-core solder
composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a
mall wire-bristle (0.5 inch, or 1.25cm) brush with a
metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal
temperature.
(500。F to 600。F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static,
suction-type solder removal device or with solder
braid.
CAUTION: Work quickly to avoid overheating the
circuitboard printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal
temperature (500。F to 600。F)
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of
the component lead and the printed circuit foil, and
hold it there only until the solder flows onto and
around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the
circuit board printed foil.
d. Closely inspect the solder area and remove any
excess or splashed solder with a small wire-bristle
brush.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong)
through which the IC leads are inserted and then bent flat
against the circuit foil. When holes are the slotted type,
the following technique should be used to remove and
replace the IC. When working with boards using the
familiar round hole, use the standard technique as
outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation
by gently prying up on the lead with the soldering iron
tip as the solder melts.
2. Draw away the melted solder with an anti-static
suction-type solder removal device (or with solder
braid) before removing the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad
and solder it.
3. Clean the soldered areas with a small wire-bristle
brush. (It is not necessary to reapply acrylic coating to
the areas).
1. Remove the defective transistor by clipping its leads as
close as possible to the component body.
2. Bend into a "U" shape the end of each of three leads
remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the
corresponding leads extending from the circuit board
and crimp the "U" with long nose pliers to insure metal
to metal contact then solder each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor
leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the
circuit board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close
as possible to diode body.
2. Bend the two remaining leads perpendicular y to the
circuit board.
3. Observing diode polarity, wrap each lead of the new
diode around the corresponding lead on the circuit
board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder
joints of the two "original" leads. If they are not shiny,
reheat them and if necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board
hollow stake.
2. Securely crimp the leads of replacement component
around notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the
replaced component and adjacent components and the
circuit board to prevent excessive component
temperatures.
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Page 6
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed
circuit board will weaken the adhesive that bonds the foil
to the circuit board causing the foil to separate from or
"lift-off" the board. The following guidelines and
procedures should be followed whenever this condition is
encountered.
At IC Connections
To repair a defective copper pattern at IC connections use
the following procedure to install a jumper wire on the
copper pattern side of the circuit board. (Use this
technique only on IC connections).
1. Carefully remove the damaged copper pattern with a
sharp knife. (Remove only as much copper as
absolutely necessary).
2. carefully scratch away the solder resist and acrylic
coating (if used) from the end of the remaining copper
pattern.
3. Bend a small "U" in one end of a small gauge jumper
wire and carefully crimp it around the IC pin. Solder the
IC connection.
4. Route the jumper wire along the path of the out-away
copper pattern and let it overlap the previously scraped
end of the good copper pattern. Solder the overlapped
area and clip off any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper
pattern at connections other than IC Pins. This technique
involves the installation of a jumper wire on the
component side of the circuit board.
1. Remove the defective copper pattern with a sharp
knife.
Remove at least 1/4 inch of copper, to ensure that a
hazardous condition will not exist if the jumper wire
opens.
2. Trace along the copper pattern from both sides of the
pattern break and locate the nearest component that is
directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead
of the nearest component on one side of the pattern
break to the lead of the nearest component on the
other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is
dressed so the it does not touch components or sharp
edges.
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Page 7
TIMING CHART
MODE H / V
H(Pixels) -
1
2
3
4
5
6
7
8
9
10
11
12
V(Lines) + 70.08 449 400 12 2 35
H(Pixels) -
V(Lines) - 59.94 525 480 10 2 33
H(Pixels) -
V(Lines) - 7550048013 16
H(Pixels) +
V(Lines) + 60.317 628 600 1 4 23
H(Pixels) +
V(Lines) + 75.0 625 600 1 3 21
H(Pixels) -
V(Lines) - 60.0 806 768 3 6 29
H(Pixels) -
V(Lines) - 75.02980076813 28
H(Pixels) +/-
V(Lines) +/- 75.062 915 870 3 3 39
H(Pixels) +
V(Lines) + 60.02 1066 1024 1 3 38
H(Pixels) +
V(Lines) + 75.0351066102413 38
H(Pixels) +
V(Lines) - 59.883 1080 1050 6 3 30
H(Pixels) -
V(Lines) + 59.954 1089 1050 6 3 39
Sync
Polarity
Dot
Clock
28.321
25.175
31.5
40.0
49.5
65.0
78.5
100.0
108.0
135.0
119
146.25
Total
Frequency
31.468 900 720 18 108 54
31.469 800 640 16 96 48
37.58406401664 120
37.879 1056 800 40 128 88
46.875 1056 800 16 80 160
48.3631344102424136 160
60.023131210241696 176
68.681 1456 1152 32 128 144
63.981 1688 1280 48 112 248
79.9761688128016144 248
64.674 1840 1680 32 48 160
65.290 2240 1680 176 104 560
Period
( E )
Video
Active
Time
( A )
Sync
Duration
( D )
Front
Porch
( C )
Blanking
Time
( B )
Resolution
720 X 400
640 x 480
640 x 480
800 x 600
800 x 600
1024 x 768
1024 x 768
1152 x 870
1280x1024
1280 x 1024
1680x1050
1680x1050
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Page 8
DISASSEMBLY-Set
#1
Put the monitor on a soft flat.
#3
#2
Remove the four screws and disassemble the stand.
#4
Disassemble the rear cover from the bezel with
a thin card. There are 7 clips on the button & top
and 5 clips on the left/right side.
#5
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Disassemble the bezel.
Disassemble the connector.
#6
Disassembly the shielding.
-8-
Page 9
DISASSEMBLY-Stand
#1
Pull the Base 2 ea Latches to inside until losing elasticity.
#3
#2
Synchronously, take one finger to push the base.
#4
Consequently, pull the stand body directly.
#5
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Fix Stand Base & Stand Body.
Separate Stand Body & Stand Base.
-10-
Page 10
#7
#8
Remove the 2 screws.
#9
Main board & power board
Disassemble the LVDS cable.
#10
The panel
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Page 11
BLOCK DIAGRAM
TSUMU18BWL
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Page 12
Power
100~240V
EMI filter
BLOCK DIAGRAM-POWER
Rush
prevention
Rectification
Starting
resistor
Transformer
Diode
rectifier
5V
12V
Inverter
12V
ON/OFF
Push-pull
circuit
VDDA
ON/OFF circuit
5V/12V
output OVP
Feedback
control
circuit
Transformer
conversion
PWM IC
OZ9938GN
Switching
circuit (PWM
control IC &
MOSFER)
OVP protect
circuit
LC resonance
OVP circuit
Feedback
circuit
4 CCFL lamps
Sampling
Lamp open
protection
DIM
DIM circuit
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Page 13
DESCRIPTION OF BLOCK DIAGRAM
1. Video Controller Part.
This part amplifies the level of video signal for the digital conversion and converts from the analog video signal to the
digital video signal using a pixel clock.
The pixel clock for each mode is generated by the PLL.
The range of the pixel clock is from 25MHz to 135MHz.
This part consists of the Scaler, ADC converter, TMDS receiver and LVDS transmitter.
The Scaler gets the video signal converted analog to digital, interpolates input to 1280 X 1024 resolution signal and
outputs 8-bit R, G, B signal to transmitter.
2. Power Part.
This part consists of the one 3.3V, and one 1.8V regulators to convert power which is provided 5V in Power board.
12V is provided for inverter, 5V is provided for LCD panel.
Also, 5V is converted 3.3V and 1.8V by regulator. Converted power is provided for IC in the main board.
The inverter converts from DC 12V to AC 700Vrms and operates back-light lamps of module.
3. MICOM Part.
This part is including video controller part. And this part consists of EEPROM IC which stores control data, Reset IC and
the Micom.
The Micom distinguishes polarity and frequencies of the H/V sync are supplied from signal cable.
The controlled data of each mode is stored in EEPROM.
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Page 14
LIPS Board Block Diagram
Operation description_LIPS
1. EMI components.
This part contains of EMI components to comply with global marketing EMI standards like FCC,VCCI CISPR, the
circuit included a line-filter, across line capacitor and of course the primary protection fuse.
2. Input rectifier and filter.
This part function is for transfer the input AC voltage to a DC voltage through a bridge rectifier and a bulk capacitor.
3. Energy Transfer.
This part function is for transfer the primary energy to secondary through a power transformer.
4. Output rectifier and filter.
This part function is to make a pulse width modulation control and to provide the driver signal to power switch, to
adjust the duty cycle during different AC input and output loading condition to achieve the dc output stabilized, and
also the over power protection is also monitor by this part.
5. Photo-Coupler isolation.
This part function is to feed back the DC output changing status through a photo transistor to primary controller to
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achieve the stabilized DC output voltage.
6. Signal collection.
This part function is to collect the any change from the DC output and feed back to the primary through photo transistor.
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Page 15
ADJUSTMENT
Windows EDID V1.0 User Manual
Operating System: MS Windows 98, 2000, XP
Port Setup: Windows 98 => Doesn’t need setup
Windows 2000, XP => Need to Port Setup.
This program is available for LCD Monitor only.
1. Port Setup
a) Copy “UserPort.sys” file to
“c:\WINNT\system32\drivers” folder
b) Run Userport.exe
c) Remove all default number
d) Add 300-3FF
e) Click Start button.
f) Click Exit button.
2. EDID Read & Write
1) Run WinEDID.exe
2) Edit Week of Manufacture, Year of Manufacture,
Serial Number
a) Input User Info Data
b) Click “Update” button
c) Click “ Write” button
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Page 16
SERVICE MODE
1) Turn off the power switch at the front side of the display.
2) Wait for about 5 seconds and press MENU, POWER switch with 1 second interval.
3) The SVC OSD menu contains additional menus that the User OSD menu as described below.
a) CLEAR ETI: To initialize using time.
b) Auto Color: W/B balance and automatically sets the gain and offset value.
c) AGING: Select Aging mode (on/off).
d) PANEL: used panel type
e) NVRAM INIT: EEPROM initialize.
f) R/G/B-9300K: Allows you to set the R/G/B-9300K value manually.
g) R/G/B-6500K: Allows you to set the R/G/B-6500K value manually.
h) R/G/B-Offset: Allows you to set the R/G/B-Offset value manually. (Analog Only)
i) R/G/B-Gain: Allows you to set the R/G/B-Gain value manually. (Analog Only)
Connect to
the monitor
Connect to
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Figure 1. Cable Connection for Micom uploading
the PC
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Page 17
TROUBLESHOOTING GUIDE
No Power
(Power Indicator Off)
Please reinsert and
make sure the AC of
100-240 is normal
YES
1. NO POWER
NO
Check the Adapter/Inverter
section
Measure U702
PIN2=1.8V U701
PIN2=3.3V
YES
NO
Check CN401 or replace
U702, U701
Check X201 oscillate
waveforms are normal
NO
Replace X201
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Replace U401
YES
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Page 18
2. NO RASTER (OSD IS NOT DISPLAY)-LIPS
No Raster
(OSD Is Not Displayed)
NO
Check U701
PIN 3 =5V?
Check power board and find out a
short point as penning each power
line
YES
Check U701
PIN 2 =3.3V?
NO
1. Check U701
2. Check C408
YES
Check U702
PIN 2=1.8V?
NO
1. CHECK U702
2. CHECK C402
3. TROUBLE IN SCALER IC
YES
NO
Check CN401
PIN3, 4=5V?
1. Check BL ON/OFF pulse as
contacting scope
YES
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LIPS
-18-
Page 19
2. NO RASTER (OSD IS NOT DISPLAY)-MSTAR
No Raster
(OSD Is Not Displayed)
SCALER PIN96
97 OSCILLATES
AS 14.318MHZ?
NO
1. Check C221 C222
2. Check X401
3. TROUBLE IN SCALER IC
YES
SCALER IC
PIN27 H SYNC ?
PIN28 V SYNC?
NO
CHECK CONNECTION
LINE FROM D-SUB TO
SCALER
YES
TROUBLE IN CABLE OR
LCD MODULE
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Page 20
4. TROUBLE IN DPM
TROUBLE IN DPM
SCALER IC
PIN27 H SYNC?
PIN28 V SYNC?
YES
NO
CHECK H/V SYNC LINE
TROUBLE IN CABLE OR
LCD MODULE
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Page 21
C907,C908,IC90
5. POWER
No Power
(Power Indicator Off)
Check AC line volt
100V or 220V
YES
NO
Check AC line
NO
Check the
voltage of C905(+)
Check F901, BD901
YES
Check voltage of
C901 pin7
YES
Check the output of
IC901 pin6
YES
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1) Check IC901,T901
2) Check D906, D907, ZD901, ZD902, ZD903
3) Check IC902, IC903
NO
Check R909, D902,
1
NO
Check D901,L905,Q903,R914
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Page 22
g
6. RASTER
NO Raster
(Lamp Off)
Check C811 (+)
=
Check ON/OFF
nal
si
YES
NO
NO
Check power section
Check Interface section or
main board
YES
NO
CheckIC801 pin
2=5V?
Check Q801 Q802 Q803
ZD801
YES
Check IC801
Pin1/pin15 have the
output of sawtooth
wave at short time
Check Q805/Q806
pin5/pin8 is 12V?
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YES
YES
NO
NO
Check IC801 pin 5/pin6
NO
Replace IC801
Cut all the pin connector of
Q805/Q806, check C811 (+) =12V?
YES
Replace Q805/Q806
NO
Check Q801 Q802
NO
Check PT801/PT802
pin7/pin8= 650V?
Replace backlight
YES
-22-
Unplug backlight connector wire,
check PT801/PT802 pin7/pin8 =
650V?
NO
Replace PT801/PT802
Page 23
WIRING DIAGRAM
095G 825 7D502
089G179E30H 20
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095G8014 6D 46
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Page 24
EXPLODED VIEW
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Page 25
EXPLODED VIEW PARTS LIST
Ref. No. TPV part no. LGE part no. Description
010
020 750GLMC0Z1312N COV30024801 CMO PANEL M220Z1 L03 C1 NB
030 PWPC7C42CQA1 EBU41368102 CMO POWER BOARD(L224WS LIPS)
040 A15G0259102 ADV35565701
D102 093G 64 33 DIO SIG SM BAV99 (PHSE)R
D103 093G 64 33 DIO SIG SM BAV99 (PHSE)R
D104 093G 64 33 DIO SIG SM BAV99 (PHSE)R
D105 093G 64 42 P BAV70 SOT23 BY PAN JIT
ZD106 093G 39GA01 T RLZ5.6B
ZD105 093G 39GA01 T RLZ5.6B
ZD104 093G 39GA01 T RLZ5.6B
ZD103 093G 39GA01 T RLZ5.6B
ZD102 093G 39GA01 T RLZ5.6B
ZD101 093G 39GA01 T RLZ5.6B
IC
U401 056G 562185 IC TSUMU18BWL-LF PQFP-100
U702 056G 56327A IC AP1117E18LA SOT223-3L ANACHIP
U701 056G 585 4A AP1117E33LA
U101 056G1133 84 AF24BC02-S1
U204 056G1133104 IC AF24BC04-SI 4K SOIC-8
U402 056G1133713 IC PM25LV010A-100SCE SOIC-8
TRANSISTOR
Q201 057G 417 12 T KEC 2N3904S-RTK/PS
Q403 057G 417 12 T KEC 2N3904S-RTK/PS
Q202 057G 417 13 T KEC 2N3906S-RTK/PS
Q203 057G 417 13 T KEC 2N3906S-RTK/PS
Q301 057G 417 13 T KEC 2N3906S-RTK/PS
Q302 057G 763 1 A03401 SOT23 BY AOS(A1)
EC 105℃ 100UF M 450V KINGNICHI
CAP L105℃ 1000UF M 16V
CAP L105℃ 470UF M 16V
CAP 105℃ 470UF M 25V
CAP 105℃ 470UF M 25V
CAP 105℃ 470UF M 25V
CAP 105℃ 470UF M 35V
CAP 105℃ 470UF M 35V
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Page 31
C934 065G 2K152 1T GP CERAMIC CAP
C931 065G 2K152 1T GP CERAMIC CAP
C930 065G 2K152 1T GP CERAMIC CAP
C914 065G 2K152 1T GP CERAMIC CAP
C912 065G 2K152 1T GP CERAMIC CAP
C907 067G 5152207HT
C925 067G215S10915T3964 EC CAP 1.0uF 450V 8*11mm
DIODEs
BD901 093G 50460900 BRIDEGE DIODE GBU408 LITEON
D907 093G 60288 DIODE MBRF10100CT 10A/100V ITO-220AB
D906 093G 60526 SCHOTTKY MBRF1060CT ITO-220AB
D806 093G 64 33 DIO SIG SM BAV99 (PHSE)R
D805 093G 64 33 DIO SIG SM BAV99 (PHSE)R
D804 093G 64 33 DIO SIG SM BAV99 (PHSE)R
D803 093G 64 33 DIO SIG SM BAV99 (PHSE)R
D802 093G 64 33 DIO SIG SM BAV99 (PHSE)R
D801 093G 64 33 DIO SIG SM BAV99 (PHSE)R
D807 093G 6432S IN4148W
D808 093G 6432S IN4148W
D809 093G 6432S IN4148W
D810 093G 6432S IN4148W
D811 093G 6432S IN4148W
D904 093G 6432S IN4148W
ZD904 093G 39GA31 T ZENER DIODE RLZ18B SEMTECH
ZD801 093G 39S 24 T RLZ 5.6B LLDS
ZD902 093G 39S 24 T RLZ 5.6B LLDS
ZD903 093G 39S 38 T PTZ 9.1B
ZD901 093G 39S 40 T RLZ 13B LLDS
ZD906 093G 39S 42 T RLZ27B LLDS
D905 093G 5212T52T DIODE 1N4007 DO-41
D901 093G 6026W52T FR107
D902 093G 6038T52T FR103