LG L1972H Service Manual

COLOR MONITOR

SERVICE MANUAL

Website:http://biz.LGservice.com

CAUTION

BEFORE SERVICING THE UNIT, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CHASSIS NO. : LM74B

MODEL: L1972H(L1972H-PFS.A**OAP)

*To apply the MSTAR Chip.

( ) **Same model for Service

Internal Use Only

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Only for training and service purposes

LGE Internal Use Only

CONTENTS

CONTENTS .............................................................................................. 2

PRECAUTION ...........................................................................................3

SPECIFICATION ........................................................................................7

DISASSEMBLY..........................................................................................9

ADJUSTMENT ........................................................................................10

SERVICE OSD .........................................................................................13

TROUBLE SHOOTING ............................................................................14

BLOCK DIAGRAM...................................................................................21

EXPLODED VIEW ...................................................................................24

REPLACEMENT PARTS LIST ............................................................... 26

SVC. SHEET ...............................................................................................

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PRECAUTION

Only for training and service purposes

LGE Internal Use Only

WARNING FOR THE SAFETY-RELATED COMPONENT.

• There are some special components used in LCD

monitor that are important for safety. These parts are

marked on the schematic diagram and the replacement parts list. It is essential that these critical

parts should be replaced with the manufacturer’s specified parts to prevent electric shock, fire or other hazard.

• Do not modify original design without obtaining written permission from manufacturer or you will void the original parts and labor guarantee.

TAKE CARE DURING HANDLING THE LCD MODULE WITH BACKLIGHT UNIT.

• Must mount the module using mounting holes arranged in four corners.

• Do not press on the panel, edge of the frame strongly or electric shock as this will result in damage to the screen.

• Do not scratch or press on the panel with any sharp objects, such as pencil or pen as this may result in damage to the panel.

• Protect the module from the ESD as it may damage the electronic circuit (C-MOS).

• Make certain that treatment person’s body are grounded through wrist band.

• Do not leave the module in high temperature and in areas of high humidity for a long time.

• The module not be exposed to the direct sunlight.

• Avoid contact with water as it may a short circuit within the module.

• If the surface of panel become dirty, please wipe it off with a softmaterial. (Cleaning with a dirty or rough cloth may damage the panel.)

WARNING

BE CAREFUL ELECTRIC SHOCK !

• If you want to replace with the new backlight (CCFL) or inverter circuit, must disconnect the AC adapter because high voltage appears at inverter circuit about 650Vrms.

• Handle with care wires or connectors of the inverter circuit. If the wires are pressed cause short and may burn or take fire.

Leakage Current Hot Check Circuit

CAUTION

Please use only a plastic screwdriver to protect yourself from shock hazard during service operation.

1.5 Kohm/10W

To Instrument's exposed METALLIC PARTS

Good Earth Ground such as WATER PIPE, CONDUIT etc.

AC Volt-meter

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SERVICING PRECAUTIONS

Only for training and service purposes

LGE Internal Use Only

CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit

board module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical

plug or other electrical connection.

c. Connecting a test substitute in parallel with an

electrolytic capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

d. Discharging the picture tube anode.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Discharge the picture tube anode only by (a) first connecting one end of an insulated clip lead to the degaussing or kine aquadag grounding system shield at the point where the picture tube socket ground lead is connected, and then (b) touch the other end of the insulated clip lead to the picture tube anode button, using an insulating handle to avoid personal contact with high voltage.

4. Do not spray chemicals on or near this receiver or any of its assemblies.

5. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cottontipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required.

6. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

7. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

8. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

9. Use with this receiver only the test fixtures specified in

this service manual.

CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "antistatic" can generate electrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)

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Only for training and service purposes

LGE Internal Use Only

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip

temperature within the range or 500

F to 600 F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wire-bristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal

temperature. (500

F to 600 F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static,

suction-type solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuitboard printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal

temperature (500

F to 600 F)

b. First, hold the soldering iron tip and solder the strand

against the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of

the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any

excess or splashed solder with a small wire-bristle brush.

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

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Only for training and service purposes

LGE Internal Use Only

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

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SPECIFICATIONS

Only for training and service purposes

LGE Internal Use Only

1. LCD CHARACTERISTICS

Type : TFT Color LCD Module Active Display Area : 19 inch Pixel Pitch : 0.294 (H) x 0.294 (V) Color Depth : 16.7M colors(6bit + FRC data) Size : 396 (H) x 324 (V) x 16.3(D) Electrical Interface : LVDS Surface Treatment : Hard-coating(3H), Anti-Glare Operating Mode : Normally White Backlight Unit : 4-CCFL

2. OPTICAL CHARACTERISTICS

2-1. Viewing Angle by Contrast Ratio ≥ 10

Left : -70° min., -80°(Typ) Right : +70° min., +80°(Typ) Top :+60° min., +75°(Typ) Bottom : -70° min., -85°(Typ)

2-2. Luminance :

230(min), 300(Typ) (Full White pattern, 0.70V) -6500K

150(min) (Full White pattern, 0.70V) -9300K 75%(min)

2-3. Contrast Ratio : 500(min), 800(Typ), 3000 : 1(DFC)

3. SIGNAL (Refer to the Timing Chart)

3-1. Sync Signal

• Type : Separate Sync, Digital, SOG

3-2. Video Input Signal

1) Type : R, G, B Analog

2) Voltage Level : 0~0.71 V a) Color 0, 0 : 0 Vp-p b) Color 7, 0 : 0.467Vp-p c) Color 15, 0 : 0.714Vp-p

3) Input Impedance : 75Ω

3-3. Operating Frequency

Horizontal(Analog) : 30 ~ 83kHz Horizontal(Digital) : 30 ~ 71kHz Vertical : 56 ~ 75Hz

4. Max. Resolution

D-sub Analog : 1280 x 1024@75Hz Digital : 1280 x 1024@60Hz

5. POWER SUPPLY

5-1. Power : AC 100-240V~, 50/60Hz , 0.8A

5-2. Power Consumption

6. ENVIRONMENT

6-1. Operating Temperature : 10°C~35°C (50°F~95°F)

(Ambient) 6-2. Relative Humidity : 10%~80% (Non-condensing) 6-3. MTBF : 50,000 HRS with 90% Confidence

Lamp Life : 50,000 Hours(Min)

7. DIMENSIONS (with TILT/SWIVEL)

Width : 409 mm (16.93'') Depth : 366 mm (9.13'') Height : 105 mm (16.89'')

8. WEIGHT (with TILT/SWIVEL)

Net. Weight : 5.6 kg (10.14 lbs) Gross Weight : 6.5 kg (11.25 lbs)

MODE

POWER ON (NORMAL)

STAND-BY

SUSPEND

DPMS OFF

POWER S/W OFF

H/V SYNC

ON/ON

OFF/ON

ON/OFF

OFF/OFF

POWER CONSUMPTION

less than 37 W

less than 1 W

LED COLOR

BLUE

AMBER

OFF

VIDEO

ACTIVE

OFF

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TIMING CHART

Only for training and service purposes

LGE Internal Use Only

VIDEO

SYNC

1 H(Pixels) + 25.175 31.469 800 640 16 96 48 640 x 350

V(Lines) - 70.09 449 350 37 2 60

2 H(Pixels) - 28.321 31.468 900 720 18 108 54 720 X 400

V(Lines) + 70.08 449 400 12 2 35

3 H(Pixels) - 25.175 31.469 800 640 16 96 48 640 x 480

V(Lines) - 59.94 525 480 10 2 33

4 H(Pixels) - 31.5 37.5 840 640 16 64 120 640 x 480

V(Lines) - 75 500 480 1 3 16

5 H(Pixels) + 40.0 37.879 1056 800 40 128 88 800 x 600

V(Lines) + 60.317 628 600 1 4 23

6 H(Pixels) + 49.5 46.875 1056 800 16 80 160 800 x 600

V(Lines) + 75.0 625 600 1 3 21

7 H(Pixels) +/- 57.283 49.725 1152 832 32 64 224 832 x 624

V(Lines) +/- 74.55 667 624 1 3 39

8 H(Pixels) - 65.0 48.363 1344 1024 24 136 160 1024 x 768

V(Lines) - 60.0 806 768 3 6 29

9 H(Pixels) - 78.75 60.123 1312 1024 16 96 176 1024 x 768

V(Lines) - 75.029 800 768 1 3 28

10 H(Pixels) +/- 100.0 68.681 1456 1152 32 128 144 1152 x 870

V(Lines) +/- 75.062 915 870 3 3 39

11 H(Pixels) +/- 92.978 61.805 1504 1152 18 134 200 1152 x 900

V(Lines) +/- 65.96 937 900 2 4 31

12 H(Pixels) + 108.0 63.981 1688 1280 48 112 248 1280 x 1024

V(Lines) + 60.02 1066 1024 1 3 38

13 H(Pixels) + 135.0 79.976 1688 1280 16 144 248 1280 x 1024

V(Lines) + 75.035 1066 1024 1 3 38

MODE

H / V

Sync

Polarity

Dot

Clock

Frequency

Total

Period

( E )

Video

Active

Time ( A )

Sync

Duration

( D )

Front

Porch

( C )

Blanking

Time

( B )

Resolution

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Only for training and service purposes

LGE Internal Use Only

DISASSEMBLY

Disassemble Hinge cover Remove the screws.

Remove the screws.

# 1 # 2

# 3

Disassemble back cover.

# 5

1. Pull the front cover upward.

2. Then, let the all latches are separated.

3. Put the front face down.

# 4

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Only for training and service purposes

LGE Internal Use Only

ADJUSTMENT INSTRUCTION

1. Coverage

Apply to 19" monitor made in Monitor Factory(Kumi Korea) or made in accordance with the standard of Kumi Factory process.

2. Appointment

2.1 Adjustment must be done as fixed sequence, and adjustment sequence can be modified after agreement with the responsible R&D engineer considering massproduction condition.

2.2 Power : AC100~240 Voltage (Free)

2.3 Input signal : As Product Standard (Signal ROM :

LB800K Ver1.6)

2.4 Warm-up Time : Over than 30 minutes

2.5 Adjustment equipment : White balance equipment (CA-

110), Display adjust equipment, VG-813(or VG819), Oscilloscope, PC (More than 486 computer ) & White balance adjust program.

3. Adjustment

3.1 Overview Use factory automation equipment and adjust automatic movement. But, do via passivity adjust in error occurrence.

3.2 Adjustment order(refer to the Adjustment standard and adjustment command table)

3.2.1 Board Assembly Line

Connect input signal to 15pin D-sub.

Check the firmware version & model name. And write the firmware code to the serial Flash ROM by ISP. Ready for adjustment : check whether adjustment command works normally or not and the operating state of each mode. Check the display state of gray color when 256 gray scale pattern is embodied. Read by EEPROM Read Command to check whether initial value is correct or not.

3.2.2 Total Assembly Line

Input analog signal. (1280x1024@60Hz) Write HDCP Key to EEPROM(24C16) by using DDC2AB protocol & HDCP Adjusting Jig equipment (Address 0xAC 80, 292 bytes)

If error is occurred, write and check again.

Ready : Heat-run during 30 minutes in the state with

signal. Connect input signal to D-sub. Default value before adjustment : Contrast "70" , Brightness "100(Max)"

3.2.3 Adjustment of Horizontal/Verticality screen position, Clock and Clock Phase at each Mode.

There is no special factory mode adjustment.

Writing initial value of EEPROM in Board Assembly line is adjusting Preset Mode and Reset mode.

(EEPROM is initialized when AC Power is ON first.) If the change of FOS data is needed after M.P, it is possible by writing Mode Data with EEPROM write command or modifying the Mode Data in MICOM itself.

# Caution) Must keep power-on more than 3 seconds after

AC Power-on first time.

3.2.4 Color coordinates adjustment and Luminance adjustment.

3.2.4.1 Color coordinates adjustment Monitor Contrast / Brightness

- Contrast : 70

- Brightness : 100(Max) CA-110 : Set "Channel 9" Signal Generator : At cut-off and drive ‡ 16 step pattern for ADC (Program No.: 31)

- Output Voltage : 700 mVp-p

- Output Mode : Mode 12 ( SXGA 60 Hz)

mode Setting.

3.2.4.2.Adjustment : Board Assembly Line Input 16 step pattern for ADC (Program No.31 (Mode 12,Pattern 11)). (Video level : 700mVp-p) Adjust by commanding AUTO_COLOR_ADJUST Confirm "Success" message in Screen or Check the data of 0xFE,0xFF address of EEPROM(0xA6) is 0xAA after waiting 5 seconds. If there is "FAULT" message or the data of 0xFE,0xFF address of EEPROM(0xA6) is not 0xAA, do adjust again. If all Adjustment is completed, the values of 6500K, User Color and 9300K are saved automatically.

3.2.4.3. Confirm at Total Assembly Line: adjustment Check the data of 0xFE,0xFF address of EEPROM(0xA6) is 0xAA. If the data of 0xFE,0xFF address of EEPROM(0xA6) is not 0xAA, do adjust again by

3.2.4.2.

3.2.4.4. Adjust PRESET 9300K Color coordinates and

Adjust PRESET 6500K Color coordinates .

Set as Aging mode ON, by commanding AGING_ON/OFF command code. Select Module that is being used in present production by commanding MODULE SELECT. Send SYSTEM RESET command to set Module data. Input Full White Pattern (Video level : 700 mVp-p) Set as 9300K by commanding COLOR_MODE_CHANGE Command code. Adjust to meet x = 0.283 °æ 0.004, y=0.298°æ0.004, and confirm. Save 9300K Color by commanding COLOR SAVE Command code. Set as 6500K by commanding COLOR_MODE_CHANGE Command code. At first, Check °‚uv.

If °‚uv is under 0.005, Do not any adjustment. If not. Adjust to meet x=0.313°æ0.007,

y=0.329°æ0.007 Save 6500K Color by commanding COLOR SAVE Command code. Set as sRGB by commanding COLOR_MODE_CHANGE Command code. Adjust to meet Y = 180 °æ 10, and confirm. Save sRGB Color by commanding COLOR SAVE Command code.

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Only for training and service purposes

LGE Internal Use Only

3.2.4.5. Confirm User color coordinates . Confirm Whether User color is saved same as 6500K. After confirming Color coordinates, Must return to 6500K.

3.2.5 Confirm Operation state.

3.2.5.1 Operation mode : Confirm whether each appointed

mode operate correctly or not.

3.2.5.2 Confirmation of Adjustment condition and

operation : Confirm whether it meet Auto/Manual equipement Adjustment standard or not.

Confirm Analog screen state : Confirm screen state at below mode.

Appointment mode : 640*350 @ 70Hz (Mode 1), 800*600@75Hz(Mode 6) 1024*768@60Hz(Mode8), 1280*1024@60Hz(Mode 12) SMPTE pattern(Check 0%,5%,95%,100%) –Mode can be added.

3.2.5.3. Confirm Auto adjustment operation. Input Analog 1 Dot on/off & Rectangle Pattern at Mode 12(1280*1024@60Hz). Confirm adjustment operation by changing Clock,Phase,H/V Position. Check Clock,Phase by pressing AUTO Key. Confirm first set of new lot by periods

3.2.5.4 Other quality Confirm that each items satisfy under standard condition that was written product spec. Confirm Applying Module & MICOM Setting ‡ Confirm with Service OSD

-> Confirm at Service OSD by "Menu + Powerkey" on .(from Power off)

-> Confirm first set of new lot by periods, and confirm periodically when there is Process change or Adjustment setting change.

3.2.5.5. OSD & Adjustment device Confirmation : Confirm operation mentioned as product spec.

Vary Brightness and Contrast and confirm the variation of Luminance and display status. Operate the F-engine function and confirm variation of Luminance. Make sure to do FACTORY RESET after confirmation of OSD function.

3.2.5.6. Confirm the display state by inputting 8 color Bar Pattern & 256 Gray Scale pattern.

3.2.5.7. DPM operation confirmation : Check if Power LED Color and Power Consumption operates as standard.

Measurement Condition : 230V@ 50Hz (Analog) Confirm DPM operation at the state of screen without Video Signal.(refer to Spec at Page 11)

3.2.5.8. DDC EDID Write ( Set as Aging mode ON, by commanding AGING_ON/OFF command code. )

- Digital part EDID data

Confirm whether module selection is correct or not on the self-diagnostics OSD with signal cable disconnected. Connect Digital Signal Cable to DVI-D wafer. Write EDID DATA to EEPROM(24C02) by using DDC2B protocol. Check whether written EDID data is correct or not. (refer to Product spec).

- Analog part EDID data

Connect analog Signal Cable to D-sub wafer. Write EDID DATA to EEPROM(24C02) by using DDC2B protocol.£®NOVATEK dual and odc model£© Write EDID DATA to EEPROM(24C02) by using DDC2AB protocol.£®Mstar dual model£© Check whether written EDID data is correct or not. (refer to Product spec).

--------------------------------------------------------------------------------------

- Analog part EDID data Connect analog Signal Cable to D-sub wafer. Write EDID DATA to EEPROM(24C02) by using DDC2B protocol. Check whether written EDID data is correct or not. (refer to Product spec).

(Mstar ODC model only)

--------------------------------------------------------------------------------------

-> After writing EDID, send Elapsed Time Clear command. (Elapsed time should not be displayed, after EDID writing)

: Confirm periodically (in the first set of new lot,

process change) whether module name and aging time disappeared on the self-diagnostics OSD with signal cable disconnected.

-> If Elapsed Time Clear command isn’t executed, module name, aging time and TCO word appear on the self-diagnostics OSD.(Module name and aging time should not appear after writing EDID)

-> Make sure to do FACTORY RESET at the final process.

3.2.5.9. Shipping condition Contrast : 70

Power Switch : Off

Brightness : "100(Max)" Color Select : Preset ( 6500K )

Language Select : Refer to product spec.

OSD Position : Center Power indicator : ON Flatron F-engine : Normal Mode

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