LG L196WTQ service manual

COLOR MONITOR

SERVICE MANUAL

Website:http://biz.LGservice.com

CAUTION

BEFORE SERVICING THE UNIT, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CHASSIS NO. : LM57D

MODEL: L196WTQ(L196WTQ-SFQ.A**MQP)

L196WTQ(L196WTQ-BFQ.A**MQP)

( ) **Same model for Service

*To apply the MSTAR Chip.

- 2 -

CONTENTS

SPECIFICATIONS ................................................... 2

PRECAUTIONS ....................................................... 4

TIMING CHART ....................................................... 8

DISASSEMBLY ....................................................... 9

BLOCK DIAGRAM ................................................. 11

DESCRIPTION OF BLOCK DIAGRAM...................12

ADJUSTMENT ...................................................... 14

TROUBLESHOOTING GUIDE .............................. 16

EXPLODED VIEW...................................................20

REPLACEMENT PARTS LIST ...............................22

SCHEMATIC DIAGRAM......................................... 25

1. LCD CHARACTERISTICS

Type : TFT Color LCD Module Active Display Area : 19 inch diagonal Pixel Pitch : 0.285 (H) x 0.285 (V) Size : 427.2(H) x 277.4(V) x 15.3(D) Color Depth : 16.7M Electrical Interface : LVDS Surface Treatment : Anti-Glare, Hard Coating(3H) Operating Mode : Transmissive mode,Normally White Backlight Unit : 4 CCFL

2. OPTICAL CHARACTERISTICS

2-1. Viewing Angle by Contrast Ratio ≥ 5

Left : -88°(Typ) Right : +88°(Typ) Top : +85°(Typ) Bottom : -85°(Typ)

2-2. Luminance : 180(Typ) (Typ.

30)

: 210(min), 300(Typ)-6500K : 150(min)-9300K

2-3. Contrast Ratio : 500(min), 850(Typ)

DFC -> 3000 : 1(Typ)

3. SIGNAL (Refer to the Timing Chart)

3-1. Sync Signal

• Type : Separate Sync, SOG, Digital

3-2. Video Input Signal

1) Type : R, G, B Analog

2) Voltage Level : 0~0.7 V

3) Input Impedance : 75 Ω

3-3. Operating Frequency

Horizontal : 30 ~ 83kHz Vertical : 56 ~ 75Hz

4. MAX. RESOLUTION

Analog : 1440 x 900@75Hz Digital : 1440 x 900@60Hz

5. POWER SUPPLY

5-1. Power Adaptor(Built-in Power)

Input : AC 100-240V~, 50/60Hz, 0.8A

5-2. Power Consumption

6. ENVIRONMENT

6-1. Operating Temperature : 10°C~35°C (50°F~95°F) 6-2. Relative Humidity : 10%~80% (Non-condensing) 6-3. MTBF : 50,000 HRS with 90%

Confidence level

Lamp Life : 40,000 Hours (Min)

7. DIMENSIONS (with TILT/SWIVEL)

Width : 439.6 mm (17.31'') Depth : 234 mm (9.21'') Height : 384 mm (15.12'')

8. WEIGHT (with TILT/SWIVEL)

Net. Weight : 4.6 kg (10.14 lbs) Gross Weight : 6.1 kg (13.45 lbs)

SPECIFICATIONS

MODE

POWER ON (NORMAL)

STAND BY

SUSPEND

DPMS OFF

POWER S/W OFF

H/V SYNC

ON/ON

OFF/ON

ON/OFF

OFF/OFF

-

POWER CONSUMPTION

less than 37 W(max)

less than 34 W(typ)

less than 1 W

LED COLOR

BLUE

AMBER

OFF

VIDEO

ACTIVE

OFF

-

- 3 -

Signal Connector Pin Assignment

Pin Signal (DVI-D)

1 2 3 4 5 6 7 8

9 10 11 12 13 14 15

T. M. D. S. Data2T. M. D. S. Data2+ T. M. D. S. Data2/4 Shield T. M. D. S. Data4T. M. D. S. Data4+ DDC Clock DDC Data Analog Vertical Sync. T. M. D. S. Data1T. M. D. S. Data1+ T. M. D. S. Data1/3 Shield T. M. D. S. Data3T. M. D. S. Data3+ +5V Power Ground

(return for +5V,

H. Sync. and V. Sync.)

Pin Signal (DVI-D)

1

8

9

17

24

16

16 17 18 19 20 21 22 23 24

Hot Plug Detect T. M. D. S. Data0T. M. D. S. Data0+ T. M. D. S. Data0/5 Shield T. M. D. S. Data5T. M. D. S. Data5+ T. M. D. S. Clock Shield T. M. D. S. Clock+ T. M. D. S. Clock-

T. M. D. S. (Transition Minimized Differential Signaling)

• DVI-D Connector (Digital)

- 4 -

WARNING FOR THE SAFETY-RELATED COMPONENT.

• There are some special components used in LCD

monitor that are important for safety. These parts are

marked on the schematic diagram and the replacement parts list. It is essential that these critical

parts should be replaced with the manufacturer’s specified parts to prevent electric shock, fire or other hazard.

• Do not modify original design without obtaining written permission from manufacturer or you will void the original parts and labor guarantee.

TAKE CARE DURING HANDLING THE LCD MODULE WITH BACKLIGHT UNIT.

• Must mount the module using mounting holes arranged in four corners.

• Do not press on the panel, edge of the frame strongly or electric shock as this will result in damage to the screen.

• Do not scratch or press on the panel with any sharp objects, such as pencil or pen as this may result in damage to the panel.

• Protect the module from the ESD as it may damage the electronic circuit (C-MOS).

• Make certain that treatment person’s body are grounded through wrist band.

• Do not leave the module in high temperature and in areas of high humidity for a long time.

• The module not be exposed to the direct sunlight.

• Avoid contact with water as it may a short circuit within

the module.

• If the surface of panel become dirty, please wipe it off with a softmaterial. (Cleaning with a dirty or rough cloth may damage the panel.)

WARNING

BE CAREFUL ELECTRIC SHOCK !

• If you want to replace with the new backlight (CCFL) or inverter circuit, must disconnect the AC adapter because high voltage appears at inverter circuit about 650Vrms.

• Handle with care wires or connectors of the inverter circuit. If the wires are pressed cause short and may burn or take fire.

Leakage Current Hot Check Circuit

PRECAUTION

CAUTION

Please use only a plastic screwdriver to protect yourself from shock hazard during service operation.

1.5 Kohm/10W

To Instrument's exposed METALLIC PARTS

Good Earth Ground such as WATER PIPE, CONDUIT etc.

AC Volt-meter

- 5 -

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this

service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit

board module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical

plug or other electrical connection.

c. Connecting a test substitute in parallel with an

electrolytic capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

d. Discharging the picture tube anode.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Discharge the picture tube anode only by (a) first connecting one end of an insulated clip lead to the degaussing or kine aquadag grounding system shield at the point where the picture tube socket ground lead is connected, and then (b) touch the other end of the insulated clip lead to the picture tube anode button, using an insulating handle to avoid personal contact with high voltage.

4. Do not spray chemicals on or near this receiver or any of its assemblies.

5. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cottontipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required.

6. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

7. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

8. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

9. Use with this receiver only the test fixtures specified in

this service manual.

CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "antistatic" can generate electrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)

- 6 -

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip

temperature within the range or 500

F to 600 F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wire-bristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal

temperature. (500

F to 600 F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static,

suction-type solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuitboard printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal

temperature (500

F to 600 F)

b. First, hold the soldering iron tip and solder the strand

against the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of

the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any

excess or splashed solder with a small wire-bristle brush.

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

- 7 -

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

TIMING CHART

- 8 -

VIDEO

SYNC

F

E

C

A

B

D

1 H(Pixels) + 25.175 31.469 800 640 16 96 48 640 x 350

V(Lines) - 70.09 449 350 37 2 60

2 H(Pixels) - 28.321 31.468 900 720 18 108 54 720 X 400

V(Lines) + 70.08 449 400 12 2 35

3 H(Pixels) - 25.175 31.469 800 640 16 96 48 640 x 480

V(Lines) - 59.94 525 480 10 2 33

4 H(Pixels) - 31.5 37.5 840 640 16 64 120 640 x 480

V(Lines) - 75 500 480 1 3 16

5 H(Pixels) + 40.0 37.879 1056 800 40 128 88 800 x 600

V(Lines) + 60.317 628 600 1 4 23

6 H(Pixels) + 49.5 46.875 1056 800 16 80 160 800 x 600

V(Lines) + 75.0 625 600 1 3 21

7 H(Pixels) +/- 57.283 49.725 1152 832 32 64 224 832 x 624

V(Lines) +/- 74.55 667 624 1 3 39

8 H(Pixels) - 65.0 48.363 1344 1024 24 136 160 1024 x 768

V(Lines) - 60.0 806 768 3 6 29

9 H(Pixels) - 78.75 60.123 1312 1024 16 96 176 1024 x 768

V(Lines) - 75.029 800 768 1 3 28

10 H(Pixels) +/- 100.0 68.681 1456 1152 32 128 144 1152 x 870

V(Lines) +/- 75.062 915 870 3 3 39

11 H(Pixels) +/- 92.978 61.805 1504 1152 18 134 200 1152 x 900

V(Lines) +/- 65.96 937 900 2 4 31

12 H(Pixels) + 108.0 63.981 1688 1280 48 112 248 1280 x 1024

V(Lines) + 60.02 1066 1024 1 3 38

13 H(Pixels) + 135.0 79.976 1688 1280 16 144 248 1280 X 1024

V(Lines) + 75.035 1066 1024 1 3 38

14 H(Pixels) + 88.750 55.5 1600 1440 48 32 80 1440 x 900

V(Lines) - 59.90 926 900 3 6 17

15 H(Pixels) - 106.500 55.935 1904 1440 80 152 232 1440x 900

V(Lines) + 59.887 934 900 3 6 25

16 H(Pixels) - 136.750 70.635 1936 1440 96 152 248 1440x 900

V(Lines) + 74.984 942 900 3 6 33

MODE

H / V

Sync

Polarity

Dot

Clock

Frequency

Total

Period

( E )

Video

Active

Time ( A )

Sync

Duration

( D )

Front

Porch

( C )

Blanking

Time

( B )

Resolution

- 9 -

DISASSEMBLY-Set

Remove the screws.

Disassemble back cover.

Remove the screws.

1. Pull the front cover upward.

2. Then, let the all latches are separated.

3. Put the front face down.

# 1

# 4

# 2

# 3

- 10 -

DISASSEMBLY-Stand

Please pull the stand body lightly to separate it from the hinge body.

Pushing Latch inside, Take the stand base from stand body. (#1-1~2)

# 1-1

# 2

# 1-2

- 11 -

BLOCK DIAGRAM

- 12 -

DESCRIPTION OF BLOCK DIAGRAM

1. Video Controller Part.

This part amplifies the level of video signal for the digital conversion and converts from the analog video signal to the digital video signal using a pixel clock. The pixel clock for each mode is generated by the PLL. The range of the pixel clock is 135MHz In L196WTQ/WTG. This part consists of the Scaler, ADC convertor, TMDS receiver and LVDS transmitter. The Scaler gets the video signal converted analog to digital, interpolates input to 1440X900(L196WTQ/WTG) resolution signal and outputs 8-bit R, G, B signal to transmitter.

2. Power Part.

This part consists of the one 3.3V, and one 1.8V regulators to convert power which is provided 5V in Power board.. 12V is provided for inverter in L196WTQ/WTG. Also, 5V is converted 3.3V and 1.8V by regulator. Converted power is provided for IC in the main board. The inverter converts from DC 12V to AC 820Vrms and operates back-light lamps of module in L196WTQ/WTG.

3. MICOM Part.

This part is include video controller part. And this part consists of EEPROM IC , control data, Reset IC and the Micom. The Micom distinguishes polarity and frequency of the H/V sync are supplied from signal cable. The controlled data of each modes is stored in EEPROM.

LIPS Board Block Diagram

- 13 -

Operation description_Power

1. EMI components.

This part contains of EMI components to comply with global marketing EMI standards like FCC,VCCI CISPR, the circuit included a line-filter, across line capacitor and of course the primary protection fuse.

2. Input rectifier and filter.

This part function is for transfer the input AC voltage to a DC voltage through a bridge rectifier and a bulk capacitor.

3. Energy Transfer.

This part function is for transfer the primary energy to secondary through a power transformer.

4. Output rectifier and filter.

This part function is to make a pulse width modulation control and to provide the driver signal to power switch, to adjust the duty cycle during different AC input and output loading condition to achieve the dc output stabilized, and also the over power protection is also monitor by this part.

5. Photo-Coupler isolation.

This part function is to feed back the DC output changing status through a photo transistor to primary controller to achieve the stabilized DC output voltage.

6. Signal collection.

This part function is to collect the any change from the DC output and feed back to the primary through photo transistor.

50 ~ 60Hz

100KHz

OUTPUT RECTIFIER

AND FILTER

SIGNAL

Collection

and

Feedback

LINE

100 ~ 240V

EMI

COMPONENTS

INPUT RECTIFIER

AND FILTER

PWM

CONTROL

CIRCUIT

HVDC

ENERGY

TRANSFER

PHOTO-

COUPLER

ISOLATION

PRIMARY SECONDARY

15V

5V

GND

- 14 -

ADJUSTMENT

Windows EDID V1.0 User Manual

Operating System: MS Windows 98, 2000, XP Port Setup: Windows 98 => Doesn’t need setup

Windows 2000, XP => Need to Port Setup.

This program is available for LCD Monitor only.

1. Port Setup a) Copy “UserPort.sys” file to

“c:\WINNT\system32\drivers” folder

b) Run Userport.exe

c) Remove all default number d) Add 300-3FF

e) Click Start button. f) Click Exit button.

2. EDID Read & Write

1) Run WinEDID.exe

2) Edit Week of Manufacture, Year of Manufacture, Serial Number a) Input User Info Data b) Click “Update” button c) Click “ Write” button

- 15 -

2 2

0

IBM Compatible PC

PARALLEL PORT

Power inlet (required)

Power LED

ST Switch

Power Select Switch (110V/220V)

Control Line

Not used

RS232C

PARALLEL

V-SYNC

POW

ER

ST

VGS

MONITOR

E

V-Sync On/Off Switch (Switch must be ON.)

F

A

B

C

15

10

5

69

1

14

13

25

6

5V

4.7K

74LS06

OFF ON

OFF

ON

11

Video Signal Generator

Figure 1. Cable Connection

SERVICE OSD

1) Turn off the power switch at the right side of the display.

2) Wait for about 5 seconds and press MENU, POWER switch for 1 second interval.

3) The SVC OSD menu contains additional menus that the User OSD menu as described below.

a) CLEAR ETI : To initialize using time. c) Auto Color : W/B balance and Automatically sets the gain and offset value.

(press key for over 3 sec) d) AGING : Select Aging mode(on/off). b) Module : To select applied module. d) NVRAM INIT : EEPROM initialize.(24C16, press key for over 3 sec) e) R/G/B-9300K : Allows you to set the R/G/B-9300K value manually. f) R/G/B-6500K : Allows you to set the R/G/B-6500K value manually. g) R/G/B-Offset : Allows you to set the R/G/B-Offset value manually.(Analog Only) h) R/G/B-Gain : Allows you to set the R/G/B-Gain value manually.(Analog Only)

- 16 -

TROUBLESHOOTING GUIDE

1. NO POWER

NO POWER

(POWER INDICATOR OFF)

CHECK U501

NO

CHECK POWER BOARD, AND FIND OUT A SHORT POINT AS OPENING EACH POWER LINE

CHECK U901(3.3V) U902(1.8V) LINE

NO

CHECK CRYSTAL(X501)

YES

CHECK J905 VOLTAGE

PIN5,6 (5V)?

IS U901 PIN2(3.3V)

U902 PIN2(1.8V)

CHECK X501 PIN127

PULSE

1

2

13

14

Waveforms

1

J905-#5,6

2

U901-#2

3

U902-#2

4

U501-#127

- 17 -

2. NO RASTER (OSD IS NOT DISPLAYED) – LIPS

CHECK U501 INVERTER ON/OFF PORT

J905 PIN9 3.3V?

NO RASTER

(OSD IS NOT DISPLAYED)

CHECK POWER BOARD (LIPS)

CHECK J905

VOLTAGE PIN5,6

(5V)?

NO

1. CONFIRM BRIGHTNESS OSD CONTRL STATUS

2. CHECK MICOM DIM-ADJ PORT

CHECK J905

PIN10

POWER BOARD (LIPS)

CHECK

PULSE AS

CONTACTING PROBE

TO THE LAMP WIRE OF THE LCD MODULE

REPLACE LCD MODULE

YES

1

3

2

4

YES

Waveforms

1

J905-#5,6

2

J905-#9

4

LAMP CURRENT

33

J905-#10 (Brightness 100) J905-#10 (Brightness 0)

- 18 -

3. NO RASTER (OSD IS NOT DISPLAYED) - MAIN

1. CHECK PIN 127,128

SOLDERING CONDITION

2. CHECK X501

3. TROUBLE IN U501

CHECK U501 PIN114(3.3V)

PIN21(1.8V)

NO

CHECK U901(3.3V), U902(1.8V)

U501

PIN 127,128

14.3MHZ?

CHECK CONNECTION LINE FROM D-SUB TO U501

TROUBLE IN CABLE

OR LCD MODULE

YES

NO RASTER

(OSD IS NOT DISPLAYED)

CHECK U501

PIN32(H-SYNC) AND

PIN33(V-SYNC).

IS PULSE APPEARED AT

SIGNAL PINS?

YES

1

Waveforms

1

U501-#30

- 19 -

4. TROUBLE IN DPM

TROUBLE IN DPM

TROUBLE IN U501

CHECK PC PC IS GOING INTO DPM MODE

NO

CHECK H/V SYNC LINE

NO

YES

CHECK R718 AND

R719, SYNC

APPEARED?

CHECK

U501 PIN32,33

SYNC PULSE

YES

1

H-SYNC

2

V-SYNC

Waveforms

1

2

EXPLODED VIEW

- 20 -

400

420

430

500

940

910

900

410

930

960

950

920

300

200

340

510

330

520

320

310

- 21 -

EXPLODED VIEW PARTS LIST

200

300

310

320

330

340

400

410

420

430

500

510

520

900

910

920

930

940

950

960

EAJ33945401

LCD,Module-TFT, M190A1-L02 ZBD DRIVER 19INCH 1440X900 300CD COLOR 72% 16/10 850:1 ZBD 170/160 5ms CHI MEI OPTOELECTRONICS CORP

EAJ33945402

LCD,Module-TFT, M190A1-L02 NON-ZBD DRIVER 19INCH 1440X900 300CD COLOR 72% 16/10 850:1 NON-ZBD 170/160 5ms CHI MEI OPTOELECTRONICS CORP

ABJ33081204 Cabinet Assembly, L196W LM62B 19" Cabinet Assy' , MT11010, Silver, 02-CKD

ABJ33081203 Cabinet Assembly, L196W LM62B 19" Cabinet Assy' , MT11010, BK. 01-CKD-BLACK

MFB35938701 Lens, MOLD PMMA BenQ LENS Lx6W Eagle Eye, PMMA

MEY35940502 Knob, MOLD ABS HF-350 SUB 1 keys Lx6W(19"/20") Power knob , light gray(89483)-SILVER

MEY35940501 Knob, MOLD ABS 380 SUB 1 keys Lx6W Power knob.-BLACK

MEY35940302 Knob, MOLD ABS HF-350 SUB 5keys Lx6W(20"/19") ABS HF 350, light gray(89483)-SILVER

MEY35940301 Knob, MOLD ABS 380 SUB 5keys Lx6W(20"/19") ABS HF 380-BLACK

MDQ35942002 Frame, PRESS SPTE 0.3 L196W METAL LampWire shield. 01-CKD

ACQ32509905 Cover Assembly,Rear, L196WT LM62B 19" Back Cover Assy,BK, CMO, 04-CKD

MJH35943001 Supporter, PRESS EGI 0.8 GUIDE EGI Metal stand bracket

49519S0038R Plate Assembly, ASSY L196WT CMO, DUAL, "P"-CKD

35509K0247A Cover, MOLD ABS AF-320T L1752TX ABS .

EBU36414401 Main Total Assembly, L196WTQ-WQF BRAND LM57D-EEMA

EBU36414402 Main Total Assembly, L196WTQ-WQF BRAND LM57D-ESSP

6709900027A

SMPS,AC/DC, AIVP 100VTO240V 40W 50TO60HZ UL/CSA/VDE/SEV/SEMKO/FIMKO/IMQ/OVE/BSI WORLD WIDE LIEN CHANG

EBR35809101

PCB Assembly,Sub, CONTROL T.T LM62B L196/206WT AXXXXFX L196/206 CONTROL ASSEMBLEY TOTALGUMI-EEMA

EBR35809102

PCB Assembly,Sub, CONTROL T.T LM62B L196/206WT KWZBQFS L196/206 CONTROL ASSEMBLEY TOTAL BRAZIL CKD-ESSP

MCK35941602 Cover, MOLD ABS Lx6W ABS HF-350, Hinge Cover Body. (BK)

MCK35941502 Cover, MOLD ABS Lx6W ABS HF-350, Hinge Left cover. (BK)

MCK35941402 Cover, MOLD ABS Lx6W ABS HF-350, Hinge Right cover. (BK)

ABA31569202 Bracket Assembly, STAND L196W/L206W LM62B Hinge Assy

AAN32510104 Base Assembly, STAND L206W/L196W LM62B Stand Hinge body Assy.(BK), 03-CKD

AAN32533504 Base Assembly, STAND L206W/L196W LM62B stand body Assy, Black, 03-CKD

AAN32510204 Base Assembly, STAND L206W/L196W LM62B Stand base Assy, RAVEN BLACK, 03-CKD

Description

Part No.

Ref. No.

* Note: Safety mark

LOC. NO. PART NO. DESCRIPTION / SPECIFICATION

C501

C502

C503

C504

C505

C506

C507

C508

C509

C510

C511

C512

C513

C514

C515

C516

C517

C518

C519

C520

C521

C522

C523

C524

C525

C526

C527

C528

C529

C530

C531

C532

C533

C534

C535

C536

C537

C538

C701

C702

C703

C704

C705

C706

C707

C708

C709

C710

0CK104CF56A

0CK473CH56A

0CC102CK41A

0CK473CH56A

0CC270CK41A

0CK103CK51A

0CK104CF56A

0CK224CF56A

0CE106CF638

0CK104CF56A

0CC101CK41A

0CC680CK41A

0CK104CK56A

0CC680CK41A

0CK104CF56A

0603B104K160CT 100nF 10% 16V X7R

C1608X7R1E473KT 47nF 10% 25V X7R

C1608C0G1H102JT 1nF 5% 50V C0G -

C1608X7R1E473KT 47nF 10% 25V X7R

C1608C0G1H270JT 27pF 5% 50V C0G

0603B103K500CT 10nF 10% 50V Y5P

0603B104K160CT 100nF 10% 16V X7R

0603B224K160CT 220nF 10% 16V X7R

SHL5.0TP16VB10M 10uF 20% 16V 0A

0603B104K160CT 100nF 10% 16V X7R

C1608C0G1H101JT 100pF 5% 50V C0G

C1608C0G1H680JT 68pF 5% 50V C0G

0603B104K500CT 100nF 10% 50V X7R

C1608C0G1H680JT 68pF 5% 50V C0G

0603B104K160CT 100nF 10% 16V X7R

C711

C712

C713

C714

C715

C716

C717

C718

C719

C720

C723

C724

C725

C901

C902

C903

C904

C905

C906

C907

C908

C909

C910

C911

C912

C913

C914

C1

C2

C3

C4

J1

J2

J3

J901

J902

J905

J906

J907

D701

D702

D703

D704

0CK104CF56A

0CC680CK41A

0CK104CF56A

0CK105CD56A

0CC101CK41A

0CE107EF610

0CK103CK51A

0CC102CK41A

0CK105CD56A

0CE107EF610

0CK104CK56A

0CK102CK56A

0CE227EF610

6631900109A

6631T20023J

6631T12002H

6631V12031G

6602T12005E

6602T12005C

6630TGA005B

6630TGA004F

6602T20008K

6630V90219A

6602T12004E

0DS226009AA

0603B104K160CT 100nF 10% 16V X7R

C1608C0G1H680JT 68pF 5% 50V C0G

0603B104K160CT 100nF 10% 16V X7R

C1608X7R1A105KT 1uF 10% 10V X7R

C1608C0G1H101JT 100pF 5% 50V C0G

KMG16VB100M 100uF 20% 16V 125MA

0603B103K500CT 10nF 10% 50V Y5P

C1608C0G1H102JT 1nF 5% 50V C0G -

C1608X7R1A105KT 1uF 10% 10V X7R

KMG16VB100M 100uF 20% 16V 125MA

0603B104K500CT 100nF 10% 50V X7R

0603B102K500CT 1nF 10% 50V X7R -

KMG16VB220M 220uF 20% 16V 213MA

"Harness,Single",(FOOSUNG)DCE153B-

"Harness,Single",11P(2.0MM) SMH200-11

"Harness,Single",6P(1.25MM) 12505HS-06P

"Harness,Single",12505HS-0400 12505HS-

"Connector,Wafer",12505WR-06A00 6P

"Connector,Wafer",12505WR-04A00 4P

"Connector,DSUB",QH11121-DN0-D DVI 24P

"Connector,DSUB",KCN-DS-3-0062 D-SUB

"Connector,Wafer",SMW200-11P 11P 2.00MM

"Connector,Wafer",SMW200-28C 28P 2.0MM

"Connector,Wafer",12505WS-06A00 6P

KDS226 1.2V 85V 300MA 2A 4NSEC 1

LOC. NO. PART NO. DESCRIPTION / SPECIFICATION

- 22 -

REPLACEMENT PARTS LIST

DATE: 2007. 01. 17.

CAPACITOR

CONNECTORs & WAFERs

DIODEs

LOC. NO. PART NO. DESCRIPTION / SPECIFICATION

D705

D706

D707

D708

D709

D710

D711

D712

D713

D714

D715

ZD1

ZD2

ZD3

ZD4

ZD701

ZD702

ZD703

ZD704

ZD705

ZD708

ZD709

ZD710

L901

L902

L903

U501

U502

U503

U701

U702

U901

U902

R1

R2

R3

R4

R5

R501

R502

R503

R504

R505

R506

R507

0DS226009AA

0DSON00138A

0DD184009AA

0DSON00138A

0DD184009AA

0DZ560009GB

0LCML00003B

0IPRP00784B

EAN36412701

0IMMRSG036B

0IMMR00014A

0IPMGFA003G

0IPMGSG016A

0RJ7501D677

0RJ1201D677

0RJ1801D677

0RJ1201D677

0RJ1000D677

0RJ0562D677

0RJ1000D677

0RJ0562D677

0RJ4700D677

0RJ1000D677

0RJ0562D677

KDS226 1.2V 85V 300MA 2A 4NSEC 1

MMBD301LT1G 600MV 30V - - 1.5pF

KDS184 KDS184 TP KEC - 85V - - -

MMBD301LT1G 600MV 30V - - 1.5pF

KDS184 KDS184 TP KEC - 85V - - -

BZT52C5V6S-(F) 5.6V 5.2TO6V 40OH

MLB-201209-0120P-N2 120OHM 2X1.2

"TSUMO5PWHJ-LF 3VTO3.6V,1.5VTO1.9"

L196WTQ-WQF.AEUQQPX

M24C16-WMN6TP 16KBIT 2KX8BIT 2.5

M24C02-RMN6TP 2KBIT 256X8BIT 1.8

FAN1117AS33X 4.8TO10.3V 3.3V - S

LD1086D2T18TR 3.4TO30V 1.8V - D2

MCR03EZPJ752 7.5KOHM 5% 1/10W 16

MCR03EZPJ122 1.2KOHM 5% 1/10W 16

MCR03EZPJ182 1.8KOHM 5% 1/10W 16

MCR03EZPJ122 1.2KOHM 5% 1/10W 16

MCR03EZPJ101 100OHM 5% 1/10W 160

MCR03EZPJ560 56OHM 5% 1/10W 1608

MCR03EZPJ101 100OHM 5% 1/10W 160

MCR03EZPJ560 56OHM 5% 1/10W 1608

MCR03EZPJ471 470OHM 5% 1/10W 160

MCR03EZPJ101 100OHM 5% 1/10W 160

MCR03EZPJ560 56OHM 5% 1/10W 1608

R508

R509

R510

R511

R512

R513

R516

R517

R518

R519

R522

R523

R524

R525

R526

R527

R530

R6

R701

R702

R703

R704

R705

R706

R707

R708

R709

R710

R711

R712

R713

R714

R715

R716

R717

R718

R719

R720

R721

R722

R723

R724

R725

R726

R727

R728

R729

R730

R731

R732

R733

R735

R736

R737

0RJ4701D677

0RJ4700D677

0RJ3900D677

0RJ1002D677

0RJ0000D677

0RJ1502D677

0RJ4701D677

0RJ1000D677

0RJ1002D677

0RJ4701D677

0RJ0332D677

0RJ1002D677

0RJ1801D677

0RJ4701D677

0RJ0332D677

0RJ0102D677

0RJ0332D677

0RJ0000D677

0RJ0102D677

0RJ1001D677

0RJ0000D677

0RJ0332D677

0RJ0752D677

0RJ0682D677

0RJ0332D677

0RJ0752D677

0RJ0000D677

0RJ4701D677

0RJ4700D677

0RJ0392D677

0RJ1000D677

0RJ2001D677

0RJ4701D677

MCR03EZPJ472 4.7KOHM 5% 1/10W 16

MCR03EZPJ471 470OHM 5% 1/10W 160

MCR03EZPJ391 390OHM 5% 1/10W 160

MCR03EZPJ103 10KOHM 5% 1/10W 160

MCR03EZPJ000 0OHM 5% 1/10W 1608

MCR03EZPJ153 15KOHM 5% 1/10W 160

MCR03EZPJ472 4.7KOHM 5% 1/10W 16

MCR03EZPJ101 100OHM 5% 1/10W 160

MCR03EZPJ103 10KOHM 5% 1/10W 160

MCR03EZPJ472 4.7KOHM 5% 1/10W 16

MCR03EZPJ330 33OHM 5% 1/10W 1608

MCR03EZPJ103 10KOHM 5% 1/10W 160

MCR03EZPJ182 1.8KOHM 5% 1/10W 16

MCR03EZPJ472 4.7KOHM 5% 1/10W 16

MCR03EZPJ330 33OHM 5% 1/10W 1608

MCR03EZPJ100 10OHM 5% 1/10W 1608

MCR03EZPJ330 33OHM 5% 1/10W 1608

MCR03EZPJ000 0OHM 5% 1/10W 1608

MCR03EZPJ100 10OHM 5% 1/10W 1608

MCR03EZPJ102 1KOHM 5% 1/10W 1608

MCR03EZPJ000 0OHM 5% 1/10W 1608

MCR03EZPJ330 33OHM 5% 1/10W 1608

MCR03EZPJ750 75OHM 5% 1/10W 1608

MCR03EZPJ680 68OHM 5% 1/10W 1608

MCR03EZPJ330 33OHM 5% 1/10W 1608

MCR03EZPJ750 75OHM 5% 1/10W 1608

MCR03EZPJ000 0OHM 5% 1/10W 1608

MCR03EZPJ472 4.7KOHM 5% 1/10W 16

MCR03EZPJ471 470OHM 5% 1/10W 160

MCR03EZPJ390 39OHM 5% 1/10W 1608

MCR03EZPJ101 100OHM 5% 1/10W 160

MCR03EZPJ202 2KOHM 5% 1/10W 1608

MCR03EZPJ472 4.7KOHM 5% 1/10W 16

LOC. NO. PART NO. DESCRIPTION / SPECIFICATION

- 23 -

FILTERs

ICs

RESISTORs

LOC. NO. PART NO. DESCRIPTION / SPECIFICATION

R738

R739

R903

R904

R905

R907

R909

R910

Q501

Q701

Q702

SW1

SW2

SW3

SW4

SW5

SW6

B1

D1

P1

P2

Q901

X501

A1

A2

A3

A4

A5

0RJ4701D677

0RJ5600D677

0RJ2202D677

0RJ2702D677

0RX0331K668

0RJ0000D677

0TR390409AE

0TR390609FA

6600R00004C

MAY36541101

0DLBE0048AA

3918TKK038R

MFZ35944901

0TFVI80067A

6212AA2004F

SAB30647601

6410TEW010A

3171TZ1099M

68509J0004A

6850TD9007D

MCR03EZPJ472 4.7KOHM 5% 1/10W 16

MCR03EZPJ561 560OHM 5% 1/10W 160

MCR03EZPJ223 22KOHM 5% 1/10W 160

MCR03EZPJ273 27KOHM 5% 1/10W 160

RSD02F4J3R30 3.3OHM 5% 2W 12.0X4

MCR03EZPJ000 0OHM 5% 1/10W 1608

KST3904 NPN 6V 60V 40V 200MA 50N

KST3906-MTF PNP -5V -40V -40V -0

JTP1127WEM 1C1P 15VDC 0.05A HORI

Box,BOX SW-A 482 173 353 2 COLOR L19

"LED,Chip" BL-HKBB533B-TRB SUPER

Packing,COMPLEX 1070*955 SW -

Packing,"MOLD EPS L196W EPS 19"" Monitor

FET,SI3865BDV(E3) N-CHANNEL MOSFET 8

Crystal,HC-49/U 14.31818MHZ 30PPM(TXC)

S/W Package,"L196WT, L206WT SERIES

Power Cord,"CEE,LP-34A&H05VV-FX3C,LS-

S/W Package,3171tz1099M Forte Manager

"Cable,Assembly",DVI-D TO DVI-D UL20276

"Cable,Assembly",6850TD9007D D-SUB

LOC. NO. PART NO. DESCRIPTION / SPECIFICATION

- 24 -

MISCELLANEOUSs

ACCESSORIEs

SWITCHs

TRANSISTORs

SCHEMATIC DIAGRAM

- 25 -

1. SCALER

- 26 -

2. POWER & WAFER

- 27 -

3. CONTROL

PRINTED CIRCUIT BOARD

- 28 -

MAIN (TOP)

MAIN (BOTTOM)

- 29 -

CONTROL (TOP)

Jan. 2007

P/NO : MFL36713679 Printed in Korea

LG L196WTQ service manual

Specifications and Main Features

Frequently Asked Questions

User Manual