LG L1920P Schematic

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Service Guide Specification

Model Description

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MODEL

SUFFIX

L1920PN

KFUSGM

Printing Specification

BRAND

Product Name

1. Trim Size (Format) : 215mm x 280 mm

2. Printing Colors

• Cover : LG COLORS

• Inside : Black

3. Stock (Paper)

• Cover : Snow White 150 g/

• Inside : Snow White 100 g/

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4. Printing Method :

5. Bindery : Saddle stitch

6. Language : English

7. Number of pages : 28(

Including blank 2pages)

FLATRON L1920P

Part No.

3828TSL085J

Special Instructions3.

(1) Origin Notification

* LGEDI : Printed in Indonesia * LGEWA : Printed in U.K. * LGESP : Printed in Brazil * LGEMX : Printed in Mexico

* LGENT : Printed in China * LGEIL : Printed in India

Changes

7 6

5 4 3 2

REV.

NO.

MM/DD/YY

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CHANGE NO.

CHANGE CONTENTS

Pagination sheet

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Cover

Front Cover inside

English….English

English

….

English

….

English

Blank

English

…..

Rear Cover Inside

Blank

Rear

Cover

COLOR MONIT OR

SER VICE MANUAL

Website:http://biz.LGservice.com

E-mail:http://www.LGEservice.com/techsup.html

CAUTION

BEFORE SERVICING THE UNIT, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CHASSIS NO. : CL-67

MODEL: L1920P (L1920PN-AF**G)

( ) **Same model for Service

*Same looking with new chassis.

Issue Date; 2004.8

*To apply the GM5321 Chip.

- 2 -

CONTENTS

SPECIFICATIONS ................................................... 2

PRECAUTIONS ....................................................... 3

TIMING CHART ....................................................... 7

BLOCK DIAGRAM ................................................... 8

DESCRIPTION OF BLOCK DIAGRAM.....................9

ADJUSTMENT ....................................................... 11

SERVICE OSD ...................................................... 12

TROUBLESHOOTING GUIDE .............................. 13

WIRING DIAGRAM ................................................17

EXPLODED VIEW...................................................18

REPLACEMENT PARTS LIST ...............................20

SCHEMATIC DIAGRAM......................................... 23

1. LCD CHARACTERISTICS

Type : TFT Color LCD Module Size : 19inch(48cm )diagonal Pixel Pitch : 0.294(H) x 0.294(V) Color Depth : 8-bit, 16,777,216 colors Electrical Interface : LVDS Surface Treatment : Anti-Glare, Hard Coating(2H) Operating Mode : Normally Black Backlight Unit : 4-CCFL (Cold Cathode

Fluorescent Lamp)

2. OPTICAL CHARACTERISTICS

2-1. Viewing Angle by Contrast Ratio

≥

Left : -85° min. Right : +85° min. Top : +85° min. Bottom : -85° min.

2-2. Luminance : 210(min), 300(Typ) 2-3. Contrast Ratio : 250(min), 400(Typ)

3. SIGNAL (Refer to the Timing Chart)

3-1. Sync Signal

• Type : Separate, Digital SOG (Sync On Green)

3-2. Video Input Signal

1) Type : R, G, B Analog

2) Voltage Level : 0~0.7 V

a) Color 0, 0 : 0 Vp-p b) Color 7, 0 : 0.35 Vp-p c) Color 15, 0 : 0.7 Vp-p

3) Input Impedance : 75 Ω

3-3. Operating Frequency

Horizontal(Analog) : 30 ~ 83kHz Horizontal(Digital) : 30 ~ 71kHz Vertical : 56 ~ 75Hz

4. MAX. RESOLUTION

D-sub Analog : 1280 x 1024@75Hz DVI Digital : 1280 x 1024@60Hz

5. POWER SUPPLY

5-1. Power Adaptor(Built-in Power)

Input : AC 100-240V~, 50/60Hz , 1.0A

5-2. Power Consumption

6. ENVIRONMENT

6-1. Operating Temperature: 10°C~35°C (50°F~95°F)

(Ambient)

6-2. Relative Humidity : 10%~80%

(Non-condensing)

6-3. MTBF : 50,000 Hours

Lamp Life : 30,000 Hours(Typ)

7. DIMENSIONS (with TILT/SWIVEL)

Width : 440 mm (17.32'') Depth : 261 mm (10.28'') Height : 423 mm (16.65'')

8. WEIGHT (with TILT/SWIVEL)

Net. Weight : 6.5kg (14.33 lbs) Gross Weight : 9.5kg (20.95 lbs)

9. USB

Upstream : 1 port, Downstream : 2 port Speed : Full-12Mbps, Low-1.5Mbps

SPECIFICATIONS

MODE

POWER ON (NORMAL)

STAND-BY

SUSPEND

DPM OFF

H/V SYNC

ON/ON OFF/ON ON/OFF

OFF/OFF

POWER CONSUMPTION

less than 45 W

less than 2 W less than 2 W

less than 2 W

LED COLOR

BLUE AMBER AMBER AMBER

VIDEO

ACTIVE

OFF OFF OFF

- 3 -

WARNING FOR THE SAFETY-RELATED COMPONENT.

• There are some special components used in LCD monitor that are important for safety. These parts are

marked on the schematic diagram and the replacement parts list. It is essential that these critical

parts should be replaced with the manufacturer’s specified parts to prevent electric shock, fire or other hazard.

• Do not modify original design without obtaining written permission from manufacturer or you will void the original parts and labor guarantee.

TAKE CARE DURING HANDLING THE LCD MODULE WITH BACKLIGHT UNIT.

• Must mount the module using mounting holes arranged in four corners.

• Do not press on the panel, edge of the frame strongly or electric shock as this will result in damage to the screen.

• Do not scratch or press on the panel with any sharp objects, such as pencil or pen as this may result in damage to the panel.

• Protect the module from the ESD as it may damage the electronic circuit (C-MOS).

• Make certain that treatment person’s body are grounded through wrist band.

• Do not leave the module in high temperature and in areas of high humidity for a long time.

• The module not be exposed to the direct sunlight.

• Avoid contact with water as it may a short circuit within the module.

• If the surface of panel become dirty, please wipe it off with a softmaterial. (Cleaning with a dirty or rough cloth may damage the panel.)

WARNING

BE CAREFUL ELECTRIC SHOCK !

• If you want to replace with the new backlight (CCFL) or inverter circuit, must disconnect the AC adapter because high voltage appears at inverter circuit about 650Vrms.

• Handle with care wires or connectors of the inverter circuit. If the wires are pressed cause short and may burn or take fire.

Leakage Current Hot Check Circuit

PRECAUTION

CAUTION

Please use only a plastic screwdriver to protect yourself from shock hazard during service operation.

1.5 Kohm/10W

To Instrument's exposed METALLIC PARTS

Good Earth Ground such as WATER PIPE, CONDUIT etc.

AC Volt-meter

- 4 -

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this

service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit

board module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical

plug or other electrical connection.

c. Connecting a test substitute in parallel with an

electrolytic capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

d. Discharging the picture tube anode.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Discharge the picture tube anode only by (a) first connecting one end of an insulated clip lead to the degaussing or kine aquadag grounding system shield at the point where the picture tube socket ground lead is connected, and then (b) touch the other end of the insulated clip lead to the picture tube anode button, using an insulating handle to avoid personal contact with high voltage.

4. Do not spray chemicals on or near this receiver or any of its assemblies.

5. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cottontipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required.

6. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

7. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

8. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

9. Use with this receiver only the test fixtures specified in

this service manual.

CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "antistatic" can generate electrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)

- 5 -

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip

temperature within the range or 500¡£F to 600¡£F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wire-bristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal

temperature.

(500¡£F to 600¡£F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static,

suction-type solder removal device or with solder

braid.

CAUTION: Work quickly to avoid overheating the

circuitboard printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal

temperature (500¡£F to 600¡£F)

b. First, hold the soldering iron tip and solder the strand

against the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of

the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any

excess or splashed solder with a small wire-bristle brush.

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

- 6 -

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

TIMING CHART

- 7 -

VIDEO

SYNC

<< Dot Clock (MHz), Horizontal Frequency (kHz), Vertical Frequency (Hz), Horizontal etc... (µs), Vertical etc... (ms) >>

H + 31.469 800 640 16 96 48

V – 70.8 449 350 37 2 60

H + 37.879 1056 800 40 128 88

V + 60.317 628 600 1 4 23

H – 31.469 800 640 16 96 48

V – 59.94 525 480 10 2 33

H – 37.5 840 640 16 64 120

V – 75 500 480 1 3 16

H – 31.468 900 720 18 108 54

V + 70.09 449 400 12 2 35

H + 46.875 1056 800 16 80 160

V + 75.0 625 600 1 3 21

H+/– 49.725 1152 832 32 64 224

V+/– 74.55 667 624 1 3 39

H – 48.363 1344 1024 24 136 160

V – 60.0 806 768 3 6 29

H – 60.123 1312 1024 16 96 176

V – 75.029 800 768 1 3 28

H+/– 68.681 1456 1152 32 128 144

V+/– 75.062 915 870 3 3 39

H+/– 61.805 1504 1152 18 134 200

V+/– 65.96 937 900 2 4 31

H + 63.981 1688 1280 48 112 248

V + 60.02 1066 1024 1 3 38

H + 79.976 1688 1280 16 144 248

V + 75.035 1066 1024 1 3 38

Mode

H/V

Sort

25.175

28.321

25.175

31.5

40.0

49.5

57.283

65.0

78.75

100.0

92.978

108.0

135.0

640x350

70Hz

800x600

60Hz

640x480

60Hz

640x480

75Hz

720x400

70Hz

800x600

75Hz

832x624

75Hz

1024x768

60Hz

1024x768

75Hz

1152x900

75Hz

1152x900

65Hz

1280x1024

60Hz

1280x1024

75Hz

Sync

Polarity

Frequency

Dot

Clock

Total Period

(E)

Video Active Time

(A)

Sync Duration

(D)

Back Porch

(F)

Front Porch

(C)

Resolution

- 8 -

BLOCK DIAGRAM

GM5321

- 9 -

DESCRIPTION OF BLOCK DIAGRAM

1. Video Controller Part.

This part amplifies the level of video signal for the digital conversion and converts from the analog video signal to the digital video signal using a pixel clock. The pixel clock for each mode is generated by the PLL. The range of the pixel clock is from 25MHz to 135MHz. This part consists of the Scaler, ADC convertor and LVDS transmitter. The Scaler gets the video signal converted analog to digital, interpolates input to 1280 X 1024 resolution signal and outputs 8-bit R, G, B signal to transmitter.

2. Power Part.

This part consists of the one 3.3V, and one 1.8V regulators to convert power which is provided 5V in Power board. 12V is provided for inverter, 5V is provided for LCD panel and 5V for micom. Also, 5V is converted 3.3V and 1.8V by regulator. Converted power is provided for IC in the main board. The inverter converts from DC12V to AC 700Vrms and operates back-light lamps of module.

3. MICOM Part.

This part is include video controller part. And this part consists of EEPROM IC which stores control data, Reset IC and the Micom. The Micom distinguishes polarity and frequency of the H/V sync are supplied from signal cable. The controlled data of each modes is stored in EEPROM.

- 10 -

Operation description_LIPS

LIPS Board Block Diagram

1. EMI components.

This part contains of EMI components to comply with global marketing EMI standards like FCC, VCCI CISPR, the circuit included a line-filter, across line capacitor and of course the primary protection fuse.

2. Input rectifier and filter.

This part function is for transfer the input AC voltage to a DC voltage through a bridge rectifier and a bulk capacitor.

3. Energy Transfer.

This part function is transfer the primary energy to secondary through a power transformer.

4. Output rectifier and filter.

This part function is to make a pulse width modulation control and to provide the driver signal to power switch, to adjust the duty cycle during different AC input and output loading condition to achive the dc output stablize, and also the over power protection is also monitor by this part.

5. Photo-Coupler isolation.

This part function is to feed back the dc output changing status through a photo transistor to primary controller to achieve the stabilized dc output voltage.

6. Signal collection.

This part function is to collect the any change from the dc output and feed back to the primary through photo transistor.

50 ~ 60Hz

LINE

100 ~ 240V

EMI

COMPONENTS

INPUT RECTIFIER

AND FILTER

PWM CONTROL

CIRCUIT

HVDC

ENERGY

TRANSFER

PHOTO-COUPLER

ISOLATION

100KHz

OUTPUT RECTIFIER

AND FILTER

SIGNAL

COLLECT-

PRIMARY SECONDARY

12V

GND

- 11 -

ADJUSTMENT

Windows EDID V1.0 User Manual

Operating System: MS Windows 98, 2000, XP Port Setup: Windows 98 => Don’t need setup

Windows 2000, XP => Need to Port Setup.

This program is available to LCD Monitor only.

1. Port Setup a) Copy “UserPort.sys” file to

“c:\WINNT\system32\drivers” folder

b) Run Userport.exe

c) Remove all default number d) Add 300-3FF

e) Click Start button. f) Click Exit button.

2. EDID Read & Write

1) Run WinEDID.exe

2) Edit Week of Manufacture, Year of Manufacture, Serial Number a) Input User Info Data b) Click “Update” button c) Click “ Write” button

- 12 -

220

IBM Compatible PC

Video Signal Generator

PARALLEL PORT

Power inlet (required)

Power LED

ST Switch

Power Select Switch (110V/220V)

Control Line

Not used

RS232C

PARALLEL

V-SYNC

POWER

VGS

MONITOR

V-Sync On/Off Switch (Switch must be ON.)

4.7K

74LS06

OFF ON

OFF

Figure 1. Cable Connection

SERVICE OSD

1) Turn off the power switch at the front side of the display.

2) Wait for about 5 seconds and press MENU, POWER switch with 1 second interval.

3) The SVC OSD menu contains additional menus that the User OSD menu as described below.

a) Auto Color : W/B balance and Automatically sets the gain and offset value. b) NVRAM INIT : EEPROM initialize.(24C08) c) CLEAR ETI : To initialize using time. d) AGING : Select Aging mode(on/off). e) R/G/B-9300K : Allows you to set the R/G/B-9300K value manually.

f) R/G/B-6500K : Allows you to set the R/G/B-6500K value manually. g) R/G/B-Offset : Allows you to set the R/G/B-Offset value manually.(Analog Only) h) R/G/B-Gain : Allows you to set the R/G/B-Gain value manually.(Analog Only)

i) MODULE : To select applied module.

- 13 -

TROUBLESHOOTING GUIDE

1. NO POWER

NO POWER

(POWER INDICATOR OFF)

CHECK KEY CONTROL

CONNECTOR ROUTINE

CHECK U201

CHECK POWER BOARD, AND FIND OUT A SHORT POINT AS OPENING EACH POWER LINE

CHECK 5VS LINE

(OPEN CHECK)

CHECK 3.3V LINE

YES

CHECK J603 VOLTAGE

PIN5, PIN6 (5V)?

CHECK

U202 PIN 32 Voltage

(5V) ?

IS U201 PIN14(3.3V) VOLTAGE ?

CHECK X-TAL

YES

CHECK U201 PIN 122

PLUSE

NO PROBLEM

Waveforms

J603-#5,6/U202-#32

- 14 -

2. NO RASTER (OSD IS NOT DISPLAYED) – LIPS

NO RASTER

(OSD IS NOT DISPLAYED)

REPLACE CCFL LAMP

IN THE LCD MODULE

CHECK LIPS

CHECK MICOM INV ON/OFF PORT.

1. CONFIRM BRIGHTNESS OSD CONTRL STATE.

2. CHECK MICOM DIM-ADJ PORT

LIPS

YES

J603

PIN5, PIN6

5V?

J603 PIN9

3.3V?

J603 PIN10

5V?

CHECK

PULSE AS

CONTACTING SCOPE

PROBE TO CAUTION LABEL.

(CONTACT PROBE TO

CAUTION LABEL.

CAN YOU SEE PULSE

AT YOUR

SCOPE?

Waveforms

J603-#9

- 15 -

3. NO RASTER (OSD IS NOT DISPLAYED) – GM5321

NO RASTER

(OSD IS NOT DISPLAYED)

TROUBLE IN CABLE

OR LCD MODULE

CHECK U401

1. CHECK PIN169, 170 SOLDERING CONDITION

2. CHECK X201

3. TROUBLE IN U201

CHECK CONNECTION LINE FROM D-SUB TO U201

YES

U201

POWER PIN11, 50

(3.3V)?

U201

PIN169, 170

OSCILLATE AS

14.318MHZ?

U201

PIN181 IS 64KHz H-SYNC?

PIN182 IS 60Hz V-SYNC?

IS PULSE APPEARED

AT SIGNAL PINS?

AT MODE 12?

Waveforms

U201-#11

U201-#170

U201-#181/R629

U201-#182/R630

- 16 -

4. TROUBLE IN DPM

TROUBLE IN DPM

TROUBLE IN PC

CHECK PC PC IS NOT GOING INTO DPM OFF MODE

TROUBLE IN SIGNAL CABLE

YES

CHECK

R629, R630 (SYNC) ?

CHECK

U201 PIN 81

(0V) ?

Waveforms

U201-#181/R629

U201-#182/R630

- 17 -

WIRING DIAGRAM

J702

J201

J706

J705

SC102

Connector Ass’y P/N:

6631T20023A

Connector Ass’y P/N:

6631T20008G

Connector Ass’y P/N:

6631T11012W

Connector Ass’y P/N:

6631T20024C

- 18 -

160

EXPLODED VIEW

130

120

110

140

150

070

090

060

030 040

100

080

020

010

050

170

- 19 -

EXPLODED VIEW PARTS LIST

3091TKL095E CABINET ASSEMBLY, L1920 BRAND L083 ""C"" CKD" 6304FFT002C

LCD(LIQUID CRYSTAL DISPLAY), FLC48SXC8V-11A FUJITSU TFT COLOR 300NITS LVDS MVA TCO-03

3809TKL066F BACK COVER ASSEMBLY, L1920 L066 ""D"" CKD" 3043TKK118D TILT SWIVEL ASSEMBLY, L1920P K691(W) ""C"" CKD" 6871TST465B PWB(PCB) ASSEMBLY,SUB, L1920PM(KFUSRM) CONTROL TOTAL BRAND MX CKD 4951TKS138B METAL ASSEMBLY, FRAME MAIN L1920P,B ""A"" C/SKD" 6631T11012W CONNECTOR ASSEMBLY, 30P H-H 200MM UL20276 LG708G 6871TPT282B

PWB(PCB) ASSEMBLY,POWER, M 19 FUJITSU-DOCKING+450V,NO 78R12,3PIN POWER TOTAL LIEN CHANG

3313TL9059E MAIN TOTAL ASSEMBLY, L1920PN GM5321 MX CKD BRAND CL-67 6871TUT035A PWB(PCB) ASSEMBLY,USB, L15,17,1920PL SUB TOTAL BRAND USB" 4815TKK034B SHIELD ASSEMBLY, REAR REAR L1920P,B ""A"" C/SKD"

3550TKK425B COVER, L1920P BACK CAP ""A"" CKD" 3550TKK426B COVER, L1920P HINGE ""A"" CKD"

6850TD9004J CABLE,D-SUB, UL20276-9C(5.8MM) DT 1500MM,CORE POS400MM GRAY(85964) L1720BM DM"

6866TDV004R CABLE,DVI, UL20276(7.5MM) DT 2000MM GRAY(85964) 20 MODEL DM 6866TDU002D CABLE,D-SUB, UL20276SB10P+2C AWG#30 DT 1870MM GRAY(85964) BRAND DM

4940TKP139B KNOB, POWER L1920P ""A"" CKD"

Description

Part No.Ref. No.

010 020 030 040 050 060 070 080 090 100 110 120 130 140 150 160 170

- 20 -

DATE: 2004. 8. 24.

*S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION

C201 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C202 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C203 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C204 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C205 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C206 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C207 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C208 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C209 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C210 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C211 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C212 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C213 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C214 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C215 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C216 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C217 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C218 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C219 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C220 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C221 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C222 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C223 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C224 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C225 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C226 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C227 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C228 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C229 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C230 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C231 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C232 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C233 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C234 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C235 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C236 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C237 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C238 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C239 0CC080CK11A 8PF 1608 50V 0.5 PF R/TP NP0 C240 0CC080CK11A 8PF 1608 50V 0.5 PF R/TP NP0 C241 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C243 0CC101CK41A 100PF 1608 50V 5% R/TP NP0 C244 0CC101CK41A 100PF 1608 50V 5% R/TP NP0 C245 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C246 0CC221CK41A 220PF 1608 50V 5% R/TP NP0 C247 0CC220CK41A 22PF 1608 50V 5% R/TP NP0 C248 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C249 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C250 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C251 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C252 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C253 0CE107EF628 "100UF KMG,RD 16V 20% FM2.5 T"

DATE: 2004. 8. 24.

*S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION

C403 0CK105CD56A 1UF 1608 10V 10% R/TP X7R C405 0CC102CK41A 1000PF 1608 50V 5% R/TP NP0 C406 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C407 0CE107EF628 "100UF KMG,RD 16V 20% FM2.5 T" C408 0CE107EF628 "100UF KMG,RD 16V 20% FM2.5 T" C409 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C410 0CC102CK41A 1000PF 1608 50V 5% R/TP NP0 C411 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C412 0CC102CK41A 1000PF 1608 50V 5% R/TP NP0 C413 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C414 0CC102CK41A 1000PF 1608 50V 5% R/TP NP0 C415 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C416 0CC102CK41A 1000PF 1608 50V 5% R/TP NP0 C417 0CE107EF628 "100UF KMG,RD 16V 20% FM2.5 T" C418 0CE107EF628 "100UF KMG,RD 16V 20% FM2.5 T" C419 0CE107EF628 "100UF KMG,RD 16V 20% FM2.5 T" C601 0CC101CK41A 100PF 1608 50V 5% R/TP NP0 C602 0CC101CK41A 100PF 1608 50V 5% R/TP NP0 C603 0CC101CK41A 100PF 1608 50V 5% R/TP NP0 C604 0CC101CK41A 100PF 1608 50V 5% R/TP NP0 C605 0CC101CK41A 100PF 1608 50V 5% R/TP NP0 C606 0CC101CK41A 100PF 1608 50V 5% R/TP NP0 C610 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C611 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C612 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C613 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C614 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C615 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C630 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C631 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C632 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C633 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C634 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C635 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C636 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C637 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C638 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C639 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C640 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C641 0CE107EF628 "100UF KMG,RD 16V 20% FM2.5 T" C642 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C643 0CK105CD56A 1UF 1608 10V 10% R/TP X7R C644 0CK105CD56A 1UF 1608 10V 10% R/TP X7R C645 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C646 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C647 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C648 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y

D601 0DS226009AA KDS226 TP KEC SOT-23 80V 30 D602 0DS226009AA KDS226 TP KEC SOT-23 80V 30 D603 0DS226009AA KDS226 TP KEC SOT-23 80V 30 D604 0DS226009AA KDS226 TP KEC SOT-23 80V 30

REPLACEMENT PARTS LIST

CAUTION: BEFORE REPLACING ANY OF THESE COMPONENTS,

READ CAREFULLY THE SAFETY PRECAUTIONS IN THIS MANUAL.

* NOTE : S SAFETY Mark

AL ALTERNATIVE PARTS

MAIN BOARD

CAPACITORS

DIODEs

DATE: 2004. 8. 24.

*S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION

D605 0DS226009AA KDS226 TP KEC SOT-23 80V 30 D606 0DS226009AA KDS226 TP KEC SOT-23 80V 30 D607 0DS226009AA KDS226 TP KEC SOT-23 80V 30 D608 0DS226009AA KDS226 TP KEC SOT-23 80V 30 D609 0DS226009AA KDS226 TP KEC SOT-23 80V 30 D610 0DS226009AA KDS226 TP KEC SOT-23 80V 30 D611 0DS226009AA KDS226 TP KEC SOT-23 80V 30 D612 0DS226009AA KDS226 TP KEC SOT-23 80V 30 D621 0DS301109AA MMBD301LT1 TP MOTOROLA SOT23 D622 0DS301109AA MMBD301LT1 TP MOTOROLA SOT23 D623 0DS301109AA MMBD301LT1 TP MOTOROLA SOT23 U604 0DRCE00018A PACDN004 CAMD R/TP SOT143 5V U605 0DRCE00018A PACDN004 CAMD R/TP SOT143 5V U606 0DRCE00018A PACDN004 CAMD R/TP SOT143 5V U607 0DRCE00018A PACDN004 CAMD R/TP SOT143 5V ZD601 0DZKE00138A KDZ5.6V KEC R/TP USC 0.2W 5. ZD602 0DZKE00138A KDZ5.6V KEC R/TP USC 0.2W 5. ZD603 0DZKE00138A KDZ5.6V KEC R/TP USC 0.2W 5. ZD604 0DZKE00138A KDZ5.6V KEC R/TP USC 0.2W 5. ZD605 0DZKE00138A KDZ5.6V KEC R/TP USC 0.2W 5. ZD606 0DZKE00138A KDZ5.6V KEC R/TP USC 0.2W 5. ZD607 0DZKE00138A KDZ5.6V KEC R/TP USC 0.2W 5. ZD608 0DZKE00138A KDZ5.6V KEC R/TP USC 0.2W 5. ZD609 0DZKE00138A KDZ5.6V KEC R/TP USC 0.2W 5.

U201 0IPRPGN013A "GM5321 GENESIS 208P,PQFP TRA" U202 0IZZTSZ546A L1920PN GM5321 FLASH MEMORY U203 0IKE704200H KIA7042AP TO-92 TP 4.2 VOLT U204 0ISG240860B M24C08W6 SGS-THOMSON 8SOP R/ U401 0IPMGKE011A KIA78D33F KEC DPAK R/TP 3.3V U402 0IPMGSG019A LD1117S18TR STM SOT223 R/TP U601 0IMMRSG036A "M24C02-WMN6T SGS-THOMSON 8P," U602 0IMMRSG036A "M24C02-WMN6T SGS-THOMSON 8P,"

U403 0TFVI80023A VISHAY SI3865DV R/TP TSOP-6 Q201 0TR390409AE FAIRCHILD KST3904(LGEMTF) TP Q202 0TR390409AE FAIRCHILD KST3904(LGEMTF) TP Q601 0TR390409AE FAIRCHILD KST3904(LGEMTF) TP Q602 0TR390409AE FAIRCHILD KST3904(LGEMTF) TP Q603 0TR390609FA KST3906-MTF TP SAMSUNG SOT2 Q604 0TR390609FA KST3906-MTF TP SAMSUNG SOT2

R201 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP R202 0RJ0822D677 82 OHM 1/10 W 5% 1608 R/TP R203 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R204 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R205 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R208 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP R212 0RJ0822D677 82 OHM 1/10 W 5% 1608 R/TP R214 0RJ3301D677 3.3K OHM 1/10 W 5% 1608 R/TP R215 0RJ4702D677 47000 OHM 1/10 W 5% 1608 R/T R216 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP R217 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP R218 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP R220 0RJ0822D677 82 OHM 1/10 W 5% 1608 R/TP R224 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP

DATE: 2004. 8. 24.

*S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION

R226 0RJ0472D677 47 OHM 1/10 W 5% 1608 R/TP R227 0RJ0472D677 47 OHM 1/10 W 5% 1608 R/TP R228 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP R232 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R233 0RJ2700D677 270 OHM 1/10 W 5% 1608 R/TP R236 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP R237 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP R238 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP R240 0RJ3301D677 3.3K OHM 1/10 W 5% 1608 R/TP R253 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP R254 0RJ1001D677 1K OHM 1/10 W 5% 1608 R/TP R256 0RJ1001D677 1K OHM 1/10 W 5% 1608 R/TP R257 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP R258 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP R262 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP R265 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R267 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R268 0RJ0472D677 47 OHM 1/10 W 5% 1608 R/TP R269 0RJ0472D677 47 OHM 1/10 W 5% 1608 R/TP R272 0RJ0222D677 22 OHM 1/10 W 5% 1608 R/TP R273 0RJ0222D677 22 OHM 1/10 W 5% 1608 R/TP R276 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP R277 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP R278 0RJ1001D677 1K OHM 1/10 W 5% 1608 R/TP R279 0RJ1001D677 1K OHM 1/10 W 5% 1608 R/TP R281 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R413 0RJ2202D677 22K OHM 1/10 W 5% 1608 R/TP R414 0RJ5600D677 560 OHM 1/10 W 5% 1608 R/TP R419 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R420 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R421 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R422 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R604 0RJ0752D677 75 OHM 1/10 W 5% 1608 R/TP R605 0RJ0752D677 75 OHM 1/10 W 5% 1608 R/TP R606 0RJ0752D677 75 OHM 1/10 W 5% 1608 R/TP R607 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R616 0RJ0332D677 33 OHM 1/10 W 5% 1608 R/TP R617 0RJ0332D677 33 OHM 1/10 W 5% 1608 R/TP R618 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP R619 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R620 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/TP R625 0RJ0332D677 33 OHM 1/10 W 5% 1608 R/TP R626 0RJ0332D677 33 OHM 1/10 W 5% 1608 R/TP R627 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R628 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R629 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R630 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R631 0RJ1001D677 1K OHM 1/10 W 5% 1608 R/TP R632 0RJ1001D677 1K OHM 1/10 W 5% 1608 R/TP R642 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP R643 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP R650 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP R651 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP R652 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP R654 0RJ0102D677 10 OHM 1/10 W 5% 1608 R/TP R655 0RJ0102D677 10 OHM 1/10 W 5% 1608 R/TP R656 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/TP R657 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/TP R660 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R661 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R662 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R663 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP

- 21 -

ICs

RESISTORs

TRANSISTOR

DATE: 2004. 8. 24.

*S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION

R664 0RJ1801D677 1.8K OHM 1/10 W 5% 1608 R/TP R665 0RJ3301D677 3.3K OHM 1/10 W 5% 1608 R/TP R666 0RJ1001D677 1K OHM 1/10 W 5% 1608 R/TP R667 0RJ1001D677 1K OHM 1/10 W 5% 1608 R/TP

X201 6212AA2004F HC-49U TXC 14.318 MHZ +/- 30

C1 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C2 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R LED1 0DLBE0048AA BRIGHT LED ELECTRONICS BL-HK R1 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R2 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R3 0RJ8200D677 820 OHM 1/10 W 5% 1608 R/TP R4 0RJ8200D677 820 OHM 1/10 W 5% 1608 R/TP R5 0RJ1501D677 1.5K OHM 1/10 W 5% 1608 R/TP R6 0RJ1501D677 1.5K OHM 1/10 W 5% 1608 R/TP R7 0RJ2201D677 2200 OHM 1/10 W 5% 1608 R/TP R8 0RJ2201D677 2200 OHM 1/10 W 5% 1608 R/TP SW1 6600R00004A JTP1138A6EM JEIL 12VDC 50MA SW2 6600R00004A JTP1138A6EM JEIL 12VDC 50MA SW3 6600R00004A JTP1138A6EM JEIL 12VDC 50MA SW4 6600R00004A JTP1138A6EM JEIL 12VDC 50MA SW5 6600R00004A JTP1138A6EM JEIL 12VDC 50MA SW6 6600R00004A JTP1138A6EM JEIL 12VDC 50MA SW7 6600R00004A JTP1138A6EM JEIL 12VDC 50MA SW8 6600R00004A JTP1138A6EM JEIL 12VDC 50MA ZD1 0DZ560009GB BZT52C5V6S DIODES R/TP SOD32 ZD2 0DZ560009GB BZT52C5V6S DIODES R/TP SOD32

C801 0CE1074F638 "100UF SRA,SS 16V M FM5 TP 5" C803 0CE1074F638 "100UF SRA,SS 16V M FM5 TP 5" C805 0CH6330K416 33PF 50V J NP0 2012 R/TP C806 0CE1074F638 "100UF SRA,SS 16V M FM5 TP 5" C807 0CE1054K638 "1 UF SRA,SS 50V M FM5 TP 5" C809 0CH6330K416 33PF 50V J NP0 2012 R/TP C810 0CE1054K638 "1 UF SRA,SS 50V M FM5 TP 5" C812 0CH3103K516 10000PF 50V 10% B(Y5P) 2012 C813 0CK1030K945 0.01UF 50V Z F TR C820 0CH6470K416 47PF 50V 5% NP0 2012 R/TP C821 0CH6470K416 47PF 50V 5% NP0 2012 R/TP C822 0CH6470K416 47PF 50V 5% NP0 2012 R/TP C823 0CH6470K416 47PF 50V 5% NP0 2012 R/TP C831 0CH6470K416 47PF 50V 5% NP0 2012 R/TP C832 0CH6470K416 47PF 50V 5% NP0 2012 R/TP C850 0CH3104K946 100000PF 50V Z F 2012 R/TP C851 0CH3104K946 100000PF 50V Z F 2012 R/TP IC801 0IPH112200C "ISP1122ABD 32P,LQFP R/TP USB" IC802 0ITI204200B TPS2042ADR TEXAS INSTRUMENT L801 125-155P BFS2550R2FG SAMWHA 2.5*5.0MM L802 125-155H BFS3510A0FG SAMWHA 3.5*10MM L804 6210TCE001H HB-1T2012-301JT CERATEC 2012 L805 6210TCE001H HB-1T2012-301JT CERATEC 2012 L807 6210TCE001H HB-1T2012-301JT CERATEC 2012 L808 6210TCE001H HB-1T2012-301JT CERATEC 2012 L809 6210TCE001H HB-1T2012-301JT CERATEC 2012 L810 6210TCE001H HB-1T2012-301JT CERATEC 2012

DATE: 2004. 8. 24.

*S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION

L812 125-155D BFS3514A0FG SAMHWA 3.5*14MM P801 6630SK01104 "UBS21-4K2300 ACON 4P 2.0MM """ P802 6630SK01004 "UAS21-4K2300 ACON 4P 2.0MM """ P803 6630SK01004 "UAS21-4K2300 ACON 4P 2.0MM """ R801 0RH1502D622 15K 1/10W 5 D.R/TP R802 0RH1502D622 15K 1/10W 5 D.R/TP R803 0RH1502D622 15K 1/10W 5 D.R/TP R804 0RD0222Q609 22 1/4W(3 5% TA52 R805 0RD0222Q609 22 1/4W(3 5% TA52 R806 0RD0222Q609 22 1/4W(3 5% TA52 R807 0RH1502D622 15K 1/10W 5 D.R/TP R808 0RH0222D622 22 OHM 1 / 10 W 2012 5.00% D R809 0RH1004D622 1.0M 1/10W 5 D.R/TP R810 0RH1004D622 1.0M 1/10W 5 D.R/TP R811 0RH1003D622 100K 1/10W 5 D.R/TP R812 0RH1003D622 100K 1/10W 5 D.R/TP R813 0RH1004D622 1.0M 1/10W 5 D.R/TP R814 0RH1004D622 1.0M 1/10W 5 D.R/TP R817 0RH0222D622 22 OHM 1 / 10 W 2012 5.00% D R821 0RH1501D622 1.5K OHM 1 / 10 W 2012 5.00% R828 0RH0222D622 22 OHM 1 / 10 W 2012 5.00% D R829 0RH1002D622 10K OHM 1 / 10 W 2012 5.00% R830 0RH1002D622 10K OHM 1 / 10 W 2012 5.00% R835 0RH1003D622 100K 1/10W 5 D.R/TP R836 0RH1004D622 1.0M 1/10W 5 D.R/TP R837 0RH3301D622 3.3K 1/10W 5 D.R/TP R841 0RH1502D622 15K 1/10W 5 D.R/TP R842 0RH1502D622 15K 1/10W 5 D.R/TP R850 0RH1502D622 15K 1/10W 5 D.R/TP R851 0RH1502D622 15K 1/10W 5 D.R/TP X801 6202TTB002B ATS-49/U SUNNY RADIAL 6MHZ 3 ZD801 0DZ510009EE UDZ S 5.1B TP ROHM-K SOD323 ZD802 0DZ510009EE UDZ S 5.1B TP ROHM-K SOD323 ZD803 0DZ510009EE UDZ S 5.1B TP ROHM-K SOD323 ZD804 0DZ510009EE UDZ S 5.1B TP ROHM-K SOD323 ZD805 0DZ510009EE UDZ S 5.1B TP ROHM-K SOD323 ZD806 0DZ510009EE UDZ S 5.1B TP ROHM-K SOD323 ZD807 0DZ510009EE UDZ S 5.1B TP ROHM-K SOD323 ZD811 0DZ560009DA UDZ S 5.6B TP ROHM-K SOD323 ZD812 0DZ560009DA UDZ S 5.6B TP ROHM-K SOD323

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