Service Guide Specification
Service Guide Specification
담 당 관리자
Model Description
1.
MODEL
SUFFIX
2.
L1750S-BNN
L1950S-BNN
ANAUER
Printing Specification
1. Trim Size (Format) : 215mm x 280 mm
2. Printing Colors
• Cover : LG COLORS
• Inside : Black
3. Stock (Paper)
• Cover : Snow White 150 g/㎡
• Inside : Snow White 100 g/㎡
4. Printing Method :
5. Bindery : Saddle stitch
6. Language : English
7. Number of pages : 28 ( Including blank 1pages)
BRAND
Product Name
LG
FLATRON L1750S
FLATRON L1950S
LEE H.J
05.03.04
Part No.
KIM J.O
05.03.04
3828TSL093V
Special Instructions3.
(1) Origin Notification
* LGEDI : Printed in Indonesia * LGEWA : Printed in U.K.
* LGESP : Printed in Brazil * LGEMX : Printed in Mexico
* LGENT : Printed in China * LGEIL : Printed in India
4.
Changes
8
7
6
5
4
3
2
1
REV.
MM/DD/YY
NO.
SIGNATURE
CHANGE NO.
CHANGE CONTENTS
Pagination sheet
Pagination sheet
P/NO.3828TSL093V
Total pages : 28pages
Cover
Front cover
Inside
blank
English….English
English
2
24
English
3
English
25
English
4
English
24
English
….
English25Rear cover
English
…..
Inside
26
Rear
Cover
Website:http://biz.LGservice.com
E-mail:http://www.LGEservice.com/techsup.html
COLOR MONITOR
SERVICE MANUAL
CHASSIS NO. : CL-82
MODEL:
L1750S (L1750S-BNN.AN**EP)
L1950S (L1950S-BNN.AN**EP)
( ) **Same model for Service
CAUTION
BEFORE SERVICING THE UNIT,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
*To apply the MSTAR Chip.
Blank Page1
CONTENTS
SPECIFICATIONS ................................................... 2
PRECAUTIONS ....................................................... 3
TIMING CHART ....................................................... 7
DISASSEMBLY ....................................................... 8
BLOCK DIAGRAM ................................................... 9
DESCRIPTION OF BLOCK DIAGRAM....................10
ADJUSTMENT ...................................................... 12
SPECIFICATIONS
1. LCD CHARACTERISTICS
Type : TFT Color LCD Module
Active Display Area : 17 inch-L1750S
: 19 inch-L1950S
Size :
Pixel Pitch : 0.264 (H) x 0.264 (V)-L1750S
Color Depth : 16.2M colors
Electrical Interface : LVDS
Surface Treatment : Hard-coating(3H), Anti-Glare
Operating Mode :
Backlight Unit : 4-CCFL
2. OPTICAL CHARACTERISTICS
2-1. Viewing Angle by Contrast Ratio ≥ 10
L1750S
Left : -60°min., -70°(Typ) Right : +60°min., +70°(Typ)
Top :+45°min., +60°(Typ) Bottom : -50°min., -60°(Typ)
L1950S
Left : -70°min., -80°(Typ) Right : +70°min., +80°(Typ)
Top :+75°min., +85°(Typ) Bottom : -75°min., -85°(Typ)
358.5(W) x 296.5(H) x 17.0(D)-L1750S
:
404.2(W) x 330(H) x 22.0(D)-L1950S
: 0.294 (H) x 0.294 (V)-L1950S
Normally White, Transmissive mode
SERVICE OSD ...................................................... 13
TROUBLESHOOTING GUIDE .............................. 14
WIRING DIAGRAM ............................................... 18
EXPLODED VIEW...................................................19
REPLACEMENT PARTS LIST ...............................21
SCHEMATIC DIAGRAM......................................... 23
4. Max. Resolution
D-sub Analog : 1280 x 1024@75Hz
5. POWER SUPPLY
5-1. Power : AC 100~240V, 50/60Hz , 1.0A
5-2. Power Consumption
MODE
POWER ON (NORMAL)
STAND-BY
SUSPEND
DPMS OFF
6. ENVIRONMENT
6-1. Operating Temperature : 10°C~35°C
6-2. Relative Humidity : 10%~80%
6-3. MTBF : 50,000 HRS with 90%
Lamp Life : 50,000 Hours(Min)
H/V SYNC
ON/ON
OFF/ON
ON/OFF
OFF/OFF
VIDEO
POWER CONSUMPTION
less than 43 W-L1750S
ACTIVE
less than 45 W-L1950S
OFF
OFF
OFF
less than 1 W
less than 1 W
less than 1 W
Confidence level
LED COLOR
GREEN
AMBER
AMBER
AMBER
2-2. Luminance : 185(min), 250(Typ)
2-3. Contrast Ratio : 300(min), 450(Typ)-L1750S
: 300(min), 500(Typ)-L1950S
3. SIGNAL (Refer to the Timing Chart)
3-1. Sync Signal
• Type : Separate Sync, SOG
3-2. Video Input Signal
1) Type : R, G, B Analog
2) Voltage Level : 0~0.71 V
a) Color 0, 0 : 0 Vp-p
b) Color 7, 0 : 0.467 Vp-p
c) Color 15, 0 : 0.714 Vp-p
3) Input Impedance : 75 Ω
3-3. Operating Frequency
Horizontal : 30 ~ 83kHz
Vertical : 56 ~ 75Hz
7. DIMENSIONS (with TILT/SWIVEL)
L1750S
Width : 368 mm (14.49'')
Depth : 230.5 mm (9.07'')
Height : 389.2 mm (15.32'')
L1950S
Width : 413 mm (16.26'')
Depth : 230.5 mm (9.07'')
Height : 421.4 mm (16.59'')
8. WEIGHT (with TILT/SWIVEL)
L1750S
Net. Weight : 4.9 kg (10.80 lbs)
Gross Weight : 6.5 kg (14.33 lbs)
L1950S
Net. Weight : 5.7 kg (12.57 lbs)
Gross Weight : 7.9 kg (17.42 lbs)
- 2 -
PRECAUTION
1.5 Kohm/10W
To Instrument's
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
WARNING FOR THE SAFETY-RELATED COMPONENT.
• There are some special components used in LCD
monitor that are important for safety. These parts are
marked on the schematic diagram and the
replacement parts list. It is essential that these critical
parts should be replaced with the manufacturer’s
specified parts to prevent electric shock, fire or other
hazard.
• Do not modify original design without obtaining written
permission from manufacturer or you will void the
original parts and labor guarantee.
TAKE CARE DURING HANDLING THE LCD MODULE
WITH BACKLIGHT UNIT.
• Must mount the module using mounting holes arranged
in four corners.
• Do not press on the panel, edge of the frame strongly
or electric shock as this will result in damage to the
screen.
• Do not scratch or press on the panel with any sharp
objects, such as pencil or pen as this may result in
damage to the panel.
WARNING
BE CAREFUL ELECTRIC SHOCK !
• If you want to replace with the new backlight (CCFL) or
inverter circuit, must disconnect the AC adapter
because high voltage appears at inverter circuit about
650Vrms.
• Handle with care wires or connectors of the inverter
circuit. If the wires are pressed cause short and may
burn or take fire.
Leakage Current Hot Check Circuit
• Protect the module from the ESD as it may damage the
electronic circuit (C-MOS).
• Make certain that treatment person’s body are
grounded through wrist band.
• Do not leave the module in high temperature and in
areas of high humidity for a long time.
• The module not be exposed to the direct sunlight.
• Avoid contact with water as it may a short circuit within
the module.
• If the surface of panel become dirty, please wipe it off
with a softmaterial. (Cleaning with a dirty or rough cloth
may damage the panel.)
CAUTION
Please use only a plastic screwdriver to protect yourself
from shock hazard during service operation.
- 3 -
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this
service manual and its supplements and addenda, read
and follow the SAFETY PRECAUTIONS on page 3 of this
publication.
NOTE: If unforeseen circumstances create conflict
between the following servicing precautions and any of the
safety precautions on page 3 of this publication, always
follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC
power source before;
a. Removing or reinstalling any component, circuit
board module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical
plug or other electrical connection.
c. Connecting a test substitute in parallel with an
electrolytic capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect
polarity installation of electrolytic capacitors may
result in an explosion hazard.
d. Discharging the picture tube anode.
2. Test high voltage only by measuring it with an
appropriate high voltage meter or other voltage
measuring device (DVM, FETVOM, etc) equipped with
a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Discharge the picture tube anode only by (a) first
connecting one end of an insulated clip lead to the
degaussing or kine aquadag grounding system shield
at the point where the picture tube socket ground lead
is connected, and then (b) touch the other end of the
insulated clip lead to the picture tube anode button,
using an insulating handle to avoid personal contact
with high voltage.
4. Do not spray chemicals on or near this receiver or any
of its assemblies.
5. Unless specified otherwise in this service manual,
clean electrical contacts only by applying the following
mixture to the contacts with a pipe cleaner, cottontipped stick or comparable non-abrasive applicator;
10% (by volume) Acetone and 90% (by volume)
isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual,
lubrication of contacts in not required.
6. Do not defeat any plug/socket B+ voltage interlocks
with which receivers covered by this service manual
might be equipped.
7. Do not apply AC power to this instrument and/or any of
its electrical assemblies unless all solid-state device
heat sinks are correctly installed.
8. Always connect the test receiver ground lead to the
receiver chassis ground before connecting the test
receiver positive lead.
Always remove the test receiver ground lead last.
9. Use with this receiver only the test fixtures specified in
this service manual.
CAUTION: Do not connect the test fixture ground strap
to any heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be
damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive (ES)
Devices. Examples of typical ES devices are integrated
circuits and some field-effect transistors and
semiconductor "chip" components. The following
techniques should be used to help reduce the incidence of
component damage caused by static by static electricity.
1. Immediately before handling any semiconductor
component or semiconductor-equipped assembly, drain
off any electrostatic charge on your body by touching a
known earth ground. Alternatively, obtain and wear a
commercially available discharging wrist strap device,
which should be removed to prevent potential shock
reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with
ES devices, place the assembly on a conductive
surface such as aluminum foil, to prevent electrostatic
charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or
unsolder ES devices.
4. Use only an anti-static type solder removal device.
Some solder removal devices not classified as "antistatic" can generate electrical charges sufficient to
damage ES devices.
5. Do not use freon-propelled chemicals. These can
generate electrical charges sufficient to damage ES
devices.
6. Do not remove a replacement ES device from its
protective package until immediately before you are
ready to install it. (Most replacement ES devices are
packaged with leads electrically shorted together by
conductive foam, aluminum foil or comparable
conductive material).
7. Immediately before removing the protective material
from the leads of a replacement ES device, touch the
protective material to the chassis or circuit assembly
into which the device will be installed.
CAUTION: Be sure no power is applied to the chassis
or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion
such as the brushing together of your clothes fabric or
the lifting of your foot from a carpeted floor can
generate static electricity sufficient to damage an ES
device.)
- 4 -
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and
appropriate tip size and shape that will maintain tip
temperature within the range or 500。F to 600。F.
2. Use an appropriate gauge of RMA resin-core solder
composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a
mall wire-bristle (0.5 inch, or 1.25cm) brush with a
metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal
temperature.
(500。F to 600。F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static,
suction-type solder removal device or with solder
braid.
CAUTION: Work quickly to avoid overheating the
circuitboard printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal
temperature (500。F to 600。F)
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of
the component lead and the printed circuit foil, and
hold it there only until the solder flows onto and
around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the
circuit board printed foil.
d. Closely inspect the solder area and remove any
excess or splashed solder with a small wire-bristle
brush.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong)
through which the IC leads are inserted and then bent flat
against the circuit foil. When holes are the slotted type,
the following technique should be used to remove and
replace the IC. When working with boards using the
familiar round hole, use the standard technique as
outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation
by gently prying up on the lead with the soldering iron
tip as the solder melts.
2. Draw away the melted solder with an anti-static
suction-type solder removal device (or with solder
braid) before removing the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad
and solder it.
3. Clean the soldered areas with a small wire-bristle
brush. (It is not necessary to reapply acrylic coating to
the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as
close as possible to the component body.
2. Bend into a "U" shape the end of each of three leads
remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the
corresponding leads extending from the circuit board
and crimp the "U" with long nose pliers to insure metal
to metal contact then solder each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor
leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the
circuit board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close
as possible to diode body.
2. Bend the two remaining leads perpendicular y to the
circuit board.
3. Observing diode polarity, wrap each lead of the new
diode around the corresponding lead on the circuit
board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder
joints of the two "original" leads. If they are not shiny,
reheat them and if necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board
hollow stake.
2. Securely crimp the leads of replacement component
around notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the
replaced component and adjacent components and the
circuit board to prevent excessive component
temperatures.
- 5 -
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed
circuit board will weaken the adhesive that bonds the foil
to the circuit board causing the foil to separate from or
"lift-off" the board. The following guidelines and
procedures should be followed whenever this condition is
encountered.
At IC Connections
To repair a defective copper pattern at IC connections use
the following procedure to install a jumper wire on the
copper pattern side of the circuit board. (Use this
technique only on IC connections).
1. Carefully remove the damaged copper pattern with a
sharp knife. (Remove only as much copper as
absolutely necessary).
2. carefully scratch away the solder resist and acrylic
coating (if used) from the end of the remaining copper
pattern.
3. Bend a small "U" in one end of a small gauge jumper
wire and carefully crimp it around the IC pin. Solder the
IC connection.
4. Route the jumper wire along the path of the out-away
copper pattern and let it overlap the previously scraped
end of the good copper pattern. Solder the overlapped
area and clip off any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper
pattern at connections other than IC Pins. This technique
involves the installation of a jumper wire on the
component side of the circuit board.
1. Remove the defective copper pattern with a sharp
knife.
Remove at least 1/4 inch of copper, to ensure that a
hazardous condition will not exist if the jumper wire
opens.
2. Trace along the copper pattern from both sides of the
pattern break and locate the nearest component that is
directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead
of the nearest component on one side of the pattern
break to the lead of the nearest component on the
other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is
dressed so the it does not touch components or sharp
edges.
- 6 -
TIMING CHART
VIDEO
SYNC
B
C
E
A
D
<< Dot Clock (MHz), Horizontal Frequency (kHz), Vertical Frequency (Hz), Horizontal etc... (µs), Vertical etc... (ms) >>
H/V
Mode
1 H + 25.175 31.469 800 640 16 96 48 640 x 350
2 H - 28.321 31.468 900 720 18 108 54 720 X 400
3 H - 25.175 31.469 800 640 16 96 48 640 x 480
4 H - 31.5 37.5 840 640 16 64 120 640 x 480
5 H + 40.0 37.879 1056 800 40 128 88 800 x 600
6 H + 49.5 46.875 1056 800 16 80 160 800 x 600
7 H +/- 57.283 49.725 1152 832 32 64 224 832 x 624
8 H - 65.0 48.363 1344 1024 24 136 160 1024 x 768
9 H - 78.75 60.123 1312 1024 16 96 176 1024 x 768
10 H +/- 100.0 68.681 1456 1152 32 128 144 1152 x 870
11 H +/- 92.978 61.805 1504 1152 18 134 200 1152 x 900
12 H + 108.0 63.981 1688 1280 48 112 248
13 H + 135.0 79.976 1688 1280 16 144 248
Sync
Sort
Polarity
V - 70.09 449 350 37 2 60
V + 70.08 449 400 12 2 35
V - 59.94 525 480 10 2 33
V - 75 500 480 1 3 16
V + 60.317 628 600 1 4 23
V + 75.0 625 600 1 3 21
V +/- 74.55 667 624 1 3 39
V - 60.0 806 768 3 6 29
V - 75.029 800 768 1 3 28
V +/- 75.062 915 870 3 3 39
V +/- 65.96 937 900 2 4 31
V + 60.02 1066 1024 1 3 38
V + 75.035 1066 1024 1 3 38
Dot
Clock
Frequency
Total Period
(E)
Video Active
Time (A)
Front Porch
(D)
Sync Duration
(C)
Back Porch
(F)
Resolution
1280 x 1024
1280 x 1024
- 7 -
DISASSEMBLY
# 1
# 3
Disassembly Hinge Cover.
# 2
Remove the screws.
# 4
# 5
# 7
1. Pull the front cover upward.
2. Then, let the all latches are separated.
3. Put the front face down.
Remove the 6 screws from each up of metal frame.
Disassemble back cover
# 6
Pell off Al-tape from panel.
# 8
Remove Al-tape from control pcb fix.
Remove the 4 screws from each side of metal
frame.
- 8 -
LVDS
(Low V oltage
Differential
BLOCK DIAGRAM
MTV312
Signaling)
MICOM
LCD Module
R,G,B
5V
3.3V
5V
differential
TSU16AL &
TR(KTA1273)
78D33
3.3V Reg.
TSU16AL
1.8V
1.8V
3.3V
including
/TMDS)
/INPUT SWITCHING
(ADC/LVDS/SCALER
3.3V
5V
12V
R,G,B, H/V Sync
D-SUB
LIPS
- 9 -
AC Input
DESCRIPTION OF BLOCK DIAGRAM
1. Video Controller Part.
This part amplifies the level of video signal for the digital conversion and converts from the analog video signal to the
digital video signal using a pixel clock.
The pixel clock for each mode is generated by the PLL.
The range of the pixel clock is from 25MHz to 135MHz.
This part consists of the Scaler, ADC convertor and LVDS transmitter.
The Scaler gets the video signal converted analog to digital, interpolates input to 1280 X 1024 resolution signal and
outputs 8-bit R, G, B signal to transmitter.
2. Power Part.
This part consists of the one 3.3V, and one 1.8V regulators to convert power which is provided 5V in Power board.
12V is provided for inverter, 12V is provided for LCD panel and 5V for micom.
Also, 5V is converted 3.3V and 1.8V by regulator. Converted power is provided for IC in the main board.
The inverter converts from DC12V to AC 700Vrms and operates back-light lamps of module.
3. MICOM Part.
This part is include video controller part. And this part consists of EEPROM IC which stores control data, Reset IC
and the Micom.
The Micom distinguishes polarity and frequency of the H/V sync are supplied from signal cable.
The controlled data of each modes is stored in EEPROM.
- 10 -
LIPS Board Block Diagram
50 ~ 60Hz
100KHz
OUTPUT RECTIFIER
AND FILTER
LINE
EMI
COMPONENTS
INPUT RECTIFIER
AND FILTER
HVDC
ENERGY
TRANSFER
100 ~ 240V
PWM
COMTROL
CIRCUIT
PHOTO COUPLER
ISOLATION
SIGNAL
COLLENT-
ION
PRIMARY SECONDARY
Operation description_LIPS
1. EMI components.
This part contains of EMI components to comply with global marketing EMI standards like FCC, VCCI CISPR, the
circuit included a line-filter, across line capacitor and of course the primary protection fuse.
2. Input rectifier and filter.
This part function is for transfer the input AC voltage to a DC voltage through a bridge rectifier and a bulk capacitor.
12V
5V
GND
3. Energy Transfer.
This part function is transfer the primary energy to secondary through a power transformer.
4. Output rectifier and filter.
This part function is to make a pulse width modulation control and to provide the driver signal to power switch, to
adjust the duty cycle during different AC input and output loading condition to achive the dc output stablize, and also
the over power protection is also monitor by this part.
5. Photo-Coupler isolation.
This part function is to feed back the dc output changing status through a photo transistor to primary controller to
achieve the stabilized dc output voltage.
6. Signal collection.
This part function is to collect the any change from the dc output and feed back to the primary through photo
transistor.
- 11 -
ADJUSTMENT
Windows EDID V1.0 User Manual
Operating System: MS Windows 98, 2000, XP
Port Setup: Windows 98 => Don’t need setup
Windows 2000, XP => Need to Port Setup.
This program is available to LCD Monitor only.
1. Port Setup
a) Copy “UserPort.sys” file to
“c:\WINNT\system32\drivers” folder
b) Run Userport.exe
c) Remove all default number
d) Add 300-3FF
2. EDID Read & Write
1) Run WinEDID.exe
2) Edit Week of Manufacture, Year of Manufacture,
Serial Number
a) Input User Info Data
b) Click “Update” button
c) Click “ Write” button
e) Click Start button.
f) Click Exit button.
- 12 -
220
IBM
Compatible PC
Video Signal
Generator
PARALLEL PORT
Power inlet (required)
Power LED
ST Switch
Power Select Switch
(110V/220V)
Control Line
Not used
RS232C
PARALLEL
V-SYNC
POWER
ST
VGS
MONITOR
E
E
V-Sync On/Off Switch
(Switch must be ON.)
F
F
A
A
B
B
C
C
15
10
5
5
69
1
1
1
14
13
25
6
5V
5V
5V
4.7K
4.7K
4.7K
74LS06
74LS06
OFF ON
OFF
ON
11
SERVICE OSD
1) Turn off the power switch at the front side of the display.
2) Wait for about 5 seconds and press MENU, POWER switch with 1 second interval.
3) The SVC OSD menu contains additional menus that the User OSD menu as described below.
a) Auto Color : W/B balance and Automatically sets the gain and offset value.
b) NVRAM INIT : EEPROM initialize.(24C08)
c) CLEAR ETI : To initialize using time.
d) AGING : Select Aging mode(on/off).
e) R/G/B-9300K : Allows you to set the R/G/B-9300K value manually.
f) R/G/B-6500K : Allows you to set the R/G/B-6500K value manually.
g) R/G/B-Offset : Allows you to set the R/G/B-Offset value manually.(Analog Only)
h) R/G/B-Gain : Allows you to set the R/G/B-Gain value manually.(Analog Only)
i) MODULE : To select applied module.
Figure 1. Cable Connection
- 13 -
TROUBLESHOOTING GUIDE
NO POWER
(POWER INDICATOR OFF)
1. NO POWER
CHECK J705
PIN5, PIN6 (5V)?
U501 PIN 8 VOLTAGE
CHECK KEY CONTROL
CONNECTOR ROUTINE
PIN90 (3.3V)
VOLTAGE ?
1
CHECK U201 PIN 96
VOLTAGE
YES
CHECK
(5V) ?
YES
IS U201
YES
PULSE
NO
NO
NO
NO
CHECK POWER BOARD,
AND FIND OUT A SHORT
POINT AS OPENING
EACH POWER LINE
CHECK 5VS LINE
(OPEN CHECK)
NO PROBLEM
CHECK 3.3V LINE
CHECK X-TAL
1
U201-#96
YES
CHECK U201
Waveforms
- 14 -
2. NO RASTER (OSD IS NOT DISPLAYED) – LIPS
NO RASTER
(OSD IS NOT DISPLAYED)
J705
PIN5, PIN6
5V?
YES
J705 PIN9
2.5V?
YES
J705 PIN10
5V?
YES
CHECK
PULSE AS
CONTACTING SCOPE
PROBE TO CAUTION LABEL.
(CONTACT PROBE TO
CAUTION LABEL.
CAN YOU SEE PULSE
AT YOUR
SCOPE?
NO
NO
NO
NO
CHECK POWER BOARD,
AND FIND OUT A SHORT
POINT AS OPENING
EACH POWER LINE
CHECK MICOM INV
ON/OFF PORT.
1. CONFIRM BRIGHTNESS
OSD CONTRL STATE.
2. CHECK MICOM DIM-ADJ
PORT
LIPS
YES
REPLACE CCFL LAMP
IN THE LCD MODULE
- 15 -
3. NO RASTER (OSD IS NOT DISPLAYED) – MSTAR
NO RASTER
(OSD IS NOT DISPLAYED)
PIN 18, 90
1
2
PIN96, 97
OSCILLATE AS
PIN43 IS 48KHz H-SYNC?
PIN44 IS 60Hz V-SYNC?
IS PULSE APPEARED
AT SIGNAL PINS?
AT MODE 12?
TROUBLE IN CABLE
OR LCD MODULE
U201
3.3V?
YES
U201
12MHZ?
YES
U501
YES
NO
NO
NO
CHECK U801 (17", 19")
CHECK U803 (15")
1. CHECK PIN122, 123
SOLDERING CONDITION
2. CHECK X501
3. TROUBLE IN U201
CHECK CONNECTION LINE
FROM D-SUB TO U501
Waveforms
1 2
U201-#96, 97
U501-#43 H-SYNC
- 16 -
2
U501-#44 V-SYNC
TROUBLE IN DPM
4. TROUBLE IN DPM
3
CHECK
R216, R217
R778, R781
YES
CHECK
U501 PIN 43.44
SYNC PULSE ?
YES
TROUBLE IN U501
NO
NO
CHECK PC
PC IS NOT GOING
INTO DPM OFF MODE
CHECK H/V SYNC LINE
Waveforms
3
R216, R778 H-Sync
3
R217, R781 V-Sync
- 17 -
WIRING DIAGRAM
Connector Ass’y P/N:
or 6631T11020W
6631T11012W
Connector Ass’y P/N:
6631T20034M
or 6631T20023A
- 18 -
Connector Ass’y P/N:
6631T11017X-L1750S
6631T11017Y-L1950S
EXPLODED VIEW
030
100
090
110
010
020
070
050
080
040
060
- 19 -
EXPLODED VIEW PARTS LIST
Ref. No.
010
020
Part No.
3091TKL143Y CABINET ASSEMBLY, L1750S BRAND L122 BLACK ABS TCO99+12MS NT LOCAL
3091TKL144E CABINET ASSEMBLY, L1950S BRAND L123 BLACK ABS350,9930 TCO99
6304FLP110B
or 6304FLP086A
or 6304FLP110A
or 6304FLP160A
or 6304FLP179A
or 6304FLP179B
or 6304FLP180B
or 6304FLP194A
or 6304FLP199A
or 6304FLP200A
or 6304FLP228A
6304FLP210A
or 6304FLP142A
or 6304FLP184A
LCD(LIQUID CRYSTAL DISPLAY), LM170E01-A5N5 LG PHILPS TFT COLOR PART NUMBER CHANGE FOR COST COMPENSATION
LCD(LIQUID CRYSTAL DISPLAY), LM170E01-A5K6 LG PHILPS TFT COLOR LVDS SXGA OKI GATE D-IC
LCD(LIQUID CRYSTAL DISPLAY), LM170E01-A5N5 LG PHILPS TFT COLOR LPL NJ,250NITS,SXGA,LVDS
LCD(LIQUID CRYSTAL DISPLAY), LM170E01-A5KS LG PHILPS TFT COLOR NEC D-IC,250NITS,SXGA,LVDS
LCD(LIQUID CRYSTAL DISPLAY), LM170E01-A6 LG PHILPS TFT COLOR LPL NJ,PB FREE,NEC S D-IC,EGI,250NITS,SXGA,LVDS
LCD(LIQUID CRYSTAL DISPLAY), LM170E01-A6 LG PHILPS TFT COLOR LPL NJ,PB FREE,NEC S D-IC,EGI,250NITS,SXGA,LVDS COST COMPENSATION
LCD(LIQUID CRYSTAL DISPLAY), LM170E01-A6K1 LG PHILPS TFT COLOR LPL NJ,PB FREE,EGI,TI S D-IC,SXGA,LVDS COST COMPENSATION
LCD(LIQUID CRYSTAL DISPLAY), LM170E01-A5K2 LG PHILPS TFT COLOR TI D-IC,250NITS,SXGA,LVDS
LCD(LIQUID CRYSTAL DISPLAY), LM170E01-A6K3 LG PHILPS TFT COLOR 8MS,LPL NJ/KUMI,PB FREE,EGI,SS S D-IC,EGI,250NITS,SXGA,LVDS
LCD(LIQUID CRYSTAL DISPLAY), LM170E01-A6K4 LG PHILPS TFT COLOR 8MS,LPL NJ/KUMI,PB FREE,EGI,TI S D-IC,SXGA,LVDS
LCD(LIQUID CRYSTAL DISPLAY), LM170E01-A5KT LG PHILPS TFT COLOR PB FREE OF A5KS,NEC D-IC,250NITS,SXGA,LVDS
LCD(LIQUID CRYSTAL DISPLAY), LM190E03-B4N9 LG PHILPS TFT COLOR PB FREE OF B4N2,NJ,20T,TN,250NITS,SXGA,LVDS
LCD(LIQUID CRYSTAL DISPLAY), LM190E03-B4K1 LG PHILPS TFT COLOR 20T,TN,250NITS,SXGA,LVDS
LCD(LIQUID CRYSTAL DISPLAY), LM190E03-B4N2 LG PHILPS TFT COLOR B4K1 LPL NJ,20T,TN,250NITS,SXGA,LVDS
Description
030
040
050
060
070
080
090
100
110
3809TKL100A BACK COVER ASSEMBLY, L1750S L100 ABS350 9930(BK)
3809TKL101A BACK COVER ASSEMBLY, L1950S L101 BRAND ABS350 9930(BK)
3043TKK227E TILT SWIVEL ASSEMBLY, L1750S - TILT STAND BODY NT-LOCAL
3043TKK227B TILT SWIVEL ASSEMBLY, L1950S - TILT STAND BODY.
3043TKK228C TILT SWIVEL ASSEMBLY, LX 50S - TILT STAND BASE NT LOCAL-L1750S
3043TKK228A TILT SWIVEL ASSEMBLY, L1750S - TILT STAND BASE-L1950S
6871TST798B PWB(PCB) ASSEMBLY,SUB, L1750 CONTROL TOTAL BRAND NT CKD
6871TST911A PWB(PCB) ASSEMBLY,SUB, L1950 CONTROL TOTAL BRAND KEY
4951TKS199A METAL ASSEMBLY, FRAME MAIN L1750 LPL-A5 KUMI
4951TKS200A METAL ASSEMBLY, FRAME MAIN L1950 LPL-E03 TN/AUO-EN04-V2 KUMI
6871TPT282C
6871TPT282Q
3313TL7100C MAIN TOTAL ASSEMBLY, L1750SN TSU16AL NT CKD - LPL BRAND CL-82
3313TL9079A MAIN TOTAL ASSEMBLY, L1950SN AUO MSTAR BRAND CL-66
4951TKS203A METAL ASSEMBLY, REAR SHIELD LX50 KUMI
3550TKK740A COVER, L1750 BACK DOOR BRAND
3550TKK741A COVER, L1950 BACK DOOR BRAND
PWB(PCB) ASSEMBLY,POWER, M-CHASSIS 1720 DOCKING,2PIN,450V POWER TOTAL LIEN CHANG PB FREE-L1750S
PWB(PCB) ASSEMBLY,POWER, M-CHASSIS 19INCH TN & 1720 DOCKING,2PIN,450V POWER TOTAL LIEN CHANG PB FREE & ANALOG-L1950S
- 20 -
REPLACEMENT PARTS LIST
CAUTION: BEFORE REPLACING ANY OF THESE COMPONENTS,
READ CAREFULLY THE SAFETY PRECAUTIONS IN THIS MANUAL.
* NOTE : S SAFETY Mark
AL ALTERNATIVE PARTS
DATE: 2005. 02. 22.
*S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION
MAIN BOARD
CAPACITORS
C204 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C205 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C206 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C207 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C211 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y
C213 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y
C214 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y
C215 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y
C216 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y
C217 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y
C218 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y
C219 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y
C220 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y
C221 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y
C222 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y
C223 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y
C224 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y
C225 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y
C226 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y
C230 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C231 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C232 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C233 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C240 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C251 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y
C503 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y
C504 0CH8106F611 10UF 16V M 85STD(CYL) R/TP
C506 0CC030CK01A 3PF 1608 50V 0.25 PF R/TP NP
C507 0CC180CK41A 18PF 1608 50V 5% R/TP NP0
C508 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y
C701 0CK105CD56A 1UF 1608 10V 10% R/TP X7R
C707 0CC680CK41A 68PF 1608 50V 5% R/TP NP0
C708 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y
C709 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y
C717 0CC101CK41A 100PF 1608 50V 5% R/TP NP0
C718 0CC101CK41A 100PF 1608 50V 5% R/TP NP0
C727 0CK105CD56A 1UF 1608 10V 10% R/TP X7R
C732 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y
C733 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C734 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C735 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C744 0CC680CK41A 68PF 1608 50V 5% R/TP NP0
C803 0CE107EF610 "100UF KMG,RD 16V 20% FL BULK"
C805 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R-L1750S
C809 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y
C812 0CE107EF610 "100UF KMG,RD 16V 20% FL BULK"
C814 0CE107EF610 "100UF KMG,RD 16V 20% FL BULK"
C817 0CK105CD56A 1UF 1608 10V 10% R/TP X7R-L1950S
C818 0CC102CK41A 1000PF 1608 50V 5% R/TP NP0-L1950S
C819 0CK105CD56A 1UF 1608 10V 10% R/TP X7R
DATE: 2005. 02. 22.
*S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION
DIODEs
D701 0DS226009AA KDS226 TP KEC SOT-23 80V 30
D702 0DS226009AA KDS226 TP KEC SOT-23 80V 30
D706 0DS226009AA KDS226 TP KEC SOT-23 80V 30
ZD701 0DZ560009GB "BZT52C5V6S-(F),LF DIODES R/T"
ZD702 0DZ560009GB "BZT52C5V6S-(F),LF DIODES R/T"
ZD703 0DZ560009GB "BZT52C5V6S-(F),LF DIODES R/T"
ZD704 0DZ560009GB "BZT52C5V6S-(F),LF DIODES R/T"
ZD711 0DZ560009GB "BZT52C5V6S-(F),LF DIODES R/T"
ZD712 0DZ560009GB "BZT52C5V6S-(F),LF DIODES R/T"
ICs
Q502 0IKE704200H KIA7042AP TO-92 TP 4.2 VOLT
U201 0IPRPM3017A "TSU16AL-LF MSTAR 100P,QFP TR"
U501 0IZZTSZ595A L1750SN MSTAR MICOM ASSY - 1-L1750S
U501 0IZZTSZ597A L1950SN MSTAR MICOM ASSY - 1-L1950S
U502 0ICS240813B "CAT24WC08J-TE13 8P,SOIC R/TP"
U801 0IPMGKE011A KIA78D33F KEC DPAK R/TP 3.3V
TRANSISTOR
U802 0TFVI80023A VISHAY SI3865DV R/TP TSOP-6-1950S
Q503 0TR390409AE FAIRCHILD KST3904(LGEMTF) TP
Q504 0TR390409AE FAIRCHILD KST3904(LGEMTF) TP
Q505 0TR390409AE FAIRCHILD KST3904(LGEMTF) TP
Q703 0TR390609FA KST3906-MTF TP SAMSUNG SOT2
Q704 0TR390609FA KST3906-MTF TP SAMSUNG SOT2
Q801 0TR127309AA KTA1273-Y(KTA966A) TP KEC TO-L1750S
Q802 0TR390409AE FAIRCHILD KST3904(LGEMTF) TP-L1750S
Q803 0TR127309AA KTA1273-Y(KTA966A) TP KEC TO
RESISTORs
R201 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TP
R202 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TP
R203 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TP
R207 0RJ3900D677 390 OHM 1/10 W 5% 1608 R/TP
R208 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TP
R209 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TP
R210 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TP
R216 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP
R217 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP
R220 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R240 0RJ1001D677 1K OHM 1/10 W 5% 1608 R/TP
R501 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R503 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R506 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R508 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R520 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R521 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R522 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R523 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R530 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP
- 21 -
DATE: 2005. 02. 22.
*S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION
DATE: 2005. 02. 22.
*S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION
R534 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP
R535 0RJ3301D677 3.3K OHM 1/10 W 5% 1608 R/TP
R537 0RJ3301D677 3.3K OHM 1/10 W 5% 1608 R/TP
R543 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R544 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R545 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/TP
R547 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/TP
R548 0RJ0332D677 33 OHM 1/10 W 5% 1608 R/TP
R549 0RJ0332D677 33 OHM 1/10 W 5% 1608 R/TP
R555 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP
R557 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP
R560 0RJ1501D677 1.5K OHM 1/10 W 5% 1608 R/TP-L1750S
R560 0RJ4702D677 47000 OHM 1/10 W 5% 1608 R/T-L1950S
R701 0RJ0752D677 75 OHM 1/10 W 5% 1608 R/TP
R702 0RJ2001D677 2K OHM 1/10 W 5% 1608 R/TP
R703 0RJ0752D677 75 OHM 1/10 W 5% 1608 R/TP
R704 0RJ2001D677 2K OHM 1/10 W 5% 1608 R/TP
R706 0RJ0752D677 75 OHM 1/10 W 5% 1608 R/TP
R708 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/TP
R709 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/TP
R712 0RJ0102D677 10 OHM 1/10 W 5% 1608 R/TP
R716 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R717 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R720 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP
R722 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP
R723 0RJ0332D677 33 OHM 1/10 W 5% 1608 R/TP
R724 0RJ0332D677 33 OHM 1/10 W 5% 1608 R/TP
R726 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP
R727 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP
R737 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP
R744 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R747 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R751 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/TP
R752 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP
R753 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP
R754 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP
R755 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP
R769 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP
R778 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TP
R781 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TP
R803 0RH0000D622 0 OHM 1 / 10 W 2012 5.00% D
R804 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP-L1750S
R805 0RH2000D622 200 OHM 1 / 10 W 5% D R/TP-L1750S
R806 0RH2000D622 200 OHM 1 / 10 W 5% D R/TP-L1750S
R808 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP
R814 0RJ2202D677 22K OHM 1/10 W 5% 1608 R/TP-L1950S
R815 0RJ5600D677 560 OHM 1/10 W 5% 1608 R/TP-L1950S
R816 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP
R820 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP
R821 0RH0000D622 0 OHM 1 / 10 W 2012 5.00% D
R824 0RJ0272D677 27 OHM 1/10 W 5% 1608 R/TP
R825 0RJ2000D677 200 OHM 1/10 W 5% 1608 R/TP
R1 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R2 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R3 0RJ2001D677 2K OHM 1/10 W 5% 1608 R/TP
R4 0RJ2001D677 2K OHM 1/10 W 5% 1608 R/TP
R5 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
SW1 6600TR1002A SKQGACE010 J-ALPS NON 12V 50
SW2 6600TR1002A SKQGACE010 J-ALPS NON 12V 50
SW3 6600TR1002A SKQGACE010 J-ALPS NON 12V 50
SW4 6600TR1002A SKQGACE010 J-ALPS NON 12V 50
SW5 6600TR1002A SKQGACE010 J-ALPS NON 12V 50
ZD1 0DZ560009GB "BZT52C5V6S-(F),LF DIODES R/T"
ZD2 0DZ560009GB "BZT52C5V6S-(F),LF DIODES R/T"
OTHERs
X501 6212AA2004A HC-49U TXC 12.0MHZ +/- 30 PP
CONTROL BOARD
C1 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C2 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
LED1 0DLLT0208AA LITEON LTST-C155KGJSKT R/TP
- 22 -
1
U201-#96, 97
Waveforms
SCHEMATIC DIAGRAM
1. TSU56AL / TSU16AL
3
3
R216, R778 H-Sync
3
R217, R781 V-Sync
1
- 23 -
2
U501-#43 H-SYNC
Waveforms
2
U501-#44 V-SYNC
2. MICOM
- 24 -
2
3.POWER
- 25 -
3
R216, R778 H-Sync
Waveforms
3
R217, R781 V-Sync
4. CONNECTOR & JACKS
- 26 -
3
Feb. 2005
P/NO : 3828TSL093V Printed in Korea
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