LG L1530SSN Schematic

Page 1
COLOR MONIT OR
SER VICE MANUAL
Website:http://biz.LGservice.com
E-mail:http://www.LGEservice.com/techsup.html
CAUTION
BEFORE SERVICING THE UNIT, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS NO. : CL-66
L1530SBNT (L1530SBNTN.AL**G,AN**EF)
( ) **Same model for Service
*To apply the Genesis ZAN3SL Chip.
MENU
SET/AUTO
LightView
-
+
Page 2
CONTENTS
SPECIFICATIONS ................................................... 2
PRECAUTIONS ....................................................... 3
TIMING CHART ....................................................... 7
DISASSEMBLY .........................................................8
BLOCK DIAGRAM ................................................. 10
DESCRIPTION OF BLOCK DIAGRAM...................11
SPECIFICATIONS
1. LCD CHARACTERISTICS
Type : TFT Color LCD Module Size : 326.5(H) x 253.5(V) x 11.2(D) Pixel Pitch : 0.297mm x 0.297mm Color Depth : 6bits(with FRC)/ 16M colors Active Video Area : 15.0inch Surface Treatment : Anti-Glare, Hard Coating (3H) Backlight Unit : 2CCFL Opraating Mode : Transmissive mode, Normally white Electrical Interface : LVDS
2. OPTICAL CHARACTERISTICS
2-1. Viewing Angle by Contrast Ratio 10
ADJUSTMENT ...................................................... 13
TROUBLESHOOTING GUIDE .............................. 15
WIRING DIAGRAM ................................................19
EXPLODED VIEW...................................................20
REPLACEMENT PARTS LIST ...............................22
SCHEMATIC DIAGRAM......................................... 24
4. POWER SUPPLY
4-1. Power
100-240V~, 50/60Hz 0.6A
4-2. Power Consumption
MODE
POWER ON (NORMAL)
STAND-BY
SUSPEND
DPM OFF
POWER S/W OFF
H/V SYNC
ON/ON OFF/ON ON/OFF
OFF
-
VIDEO
POWER CONSUMPTION
ACTIVE
OFF OFF OFF
-
less than 25 W
less than 1 W
less than 1 W less than 1 W less than 1 W
LED COLOR
GREEN AMBER AMBER AMBER
OFF
Left : 55° min. 65° typ. Right : 55° min. 65° typ. Top : 40° min. 45° typ. Bottom : 50° min. 55° typ.
2-2. Luminance
: 200(min.), 250(typ.) (Full white pattern, 0.73V)
2-3. Contrast Ratio : 300(min.), 400(typ.)
3. SIGNAL (Refer to the Timing Chart)
3-1. Sync Signal
1) Type :
2) Input Voltage Level :
Separate Sync.
Low=0~0.8V, High=2.1~5.5V
3) Sync Polarity : Positive or Negative
3-2. Video Input Signal
1) Type : R, G, B Analog
2) Voltage Level : 0~0.7 V a) Color 0, 0 : 0 Vp-p b) Color 7, 0 : 0.35 Vp-p c) Color 15, 0 : 0.7 Vp-p
3) Input Impedance : 75
3-3. Operating Frequency
Horizontal : 30 ~ 63kHz Vertical : 56 ~ 75Hz
5. ENVIRONMENT
5-1. Operating Temperature : 10°C~35°C (50°F~95°F) 5-2. Operating Humidity : 10%~80% 5-3. MTBF :
50,000 HRS with 90% Confidence level
Lamp Life : 40,000 Hours (Min.)
6. DIMENSIONS (with TILT/SWIVEL)
Width : 368mm (14.01'') Depth : 355mm (5.97'') Height : 105mm (14.16'')
7. WEIGHT (with TILT/SWIVEL)
Net. Weight : 3.6kg (8.82 lbs) Gross Weight : 5.0kg (12.13 lbs)
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Page 3
PRECAUTION
1.5 Kohm/10W
To Instrument's exposed METALLIC PARTS
Good Earth Ground such as WATER PIPE, CONDUIT etc.
AC Volt-meter
WARNING FOR THE SAFETY-RELATED COMPONENT.
• There are some special components used in LCD monitor that are important for safety. These parts are
marked on the schematic diagram and the replacement parts list. It is essential that these critical
parts should be replaced with the manufacturer’s specified parts to prevent electric shock, fire or other hazard.
• Do not modify original design without obtaining written permission from manufacturer or you will void the original parts and labor guarantee.
TAKE CARE DURING HANDLING THE LCD MODULE WITH BACKLIGHT UNIT.
• Must mount the module using mounting holes arranged in four corners.
• Do not press on the panel, edge of the frame strongly or electric shock as this will result in damage to the screen.
• Do not scratch or press on the panel with any sharp objects, such as pencil or pen as this may result in damage to the panel.
WARNING
BE CAREFUL ELECTRIC SHOCK !
• If you want to replace with the new backlight (CCFL) or inverter circuit, must disconnect the AC adapter because high voltage appears at inverter circuit about 650Vrms.
• Handle with care wires or connectors of the inverter circuit. If the wires are pressed cause short and may burn or take fire.
Leakage Current Hot Check Circuit
• Protect the module from the ESD as it may damage the electronic circuit (C-MOS).
• Make certain that treatment person’s body are grounded through wrist band.
• Do not leave the module in high temperature and in areas of high humidity for a long time.
• The module not be exposed to the direct sunlight.
• Avoid contact with water as it may a short circuit within the module.
• If the surface of panel become dirty, please wipe it off with a softmaterial. (Cleaning with a dirty or rough cloth may damage the panel.)
CAUTION
Please use only a plastic screwdriver to protect yourself from shock hazard during service operation.
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Page 4
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this
service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit
board module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical
plug or other electrical connection.
c. Connecting a test substitute in parallel with an
electrolytic capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.
d. Discharging the picture tube anode.
2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".
3. Discharge the picture tube anode only by (a) first connecting one end of an insulated clip lead to the degaussing or kine aquadag grounding system shield at the point where the picture tube socket ground lead is connected, and then (b) touch the other end of the insulated clip lead to the picture tube anode button, using an insulating handle to avoid personal contact with high voltage.
4. Do not spray chemicals on or near this receiver or any of its assemblies.
5. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton­tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required.
6. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.
7. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.
8. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.
9. Use with this receiver only the test fixtures specified in
this service manual.
CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti­static" can generate electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)
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Page 5
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip
temperature within the range or 500。F to 600。F.
2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-bristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal
temperature.
(500。F to 600。F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static,
suction-type solder removal device or with solder
braid.
CAUTION: Work quickly to avoid overheating the
circuitboard printed foil.
6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal
temperature (500。F to 600。F)
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of
the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.
d. Closely inspect the solder area and remove any
excess or splashed solder with a small wire-bristle brush.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.
2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and solder it.
3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.
Power Output, Transistor Device Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit board.
3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.
Fuse and Conventional Resistor Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow stake.
2. Securely crimp the leads of replacement component around notch at stake top.
3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.
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Page 6
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.
1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.
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Page 7
TIMING CHART
VIDEO
SYNC
B
C
E
A
D
MODE
1 H(Pixels) + 25.175 31.468 KHz 800 640 16 96 48 640 x 350
2 H(Pixels) - 28.322 31.468 KHz 900 720 17 108 55 720 x 400
3 H(Pixels) - 25.175 31.469 KHz 800 640 16 96 48 640 x 480
4 H(Pixels) - 30.24 35.00 KHz 864 640 64 64 96 640 x 480
5 H(Pixels) - 31.5 37.861 KHz 832 640 24 40 128 640 x 480
6 H(Pixels) - 31.5 37.50KHz 840 640 16 64 120 640 x 480
7 H(Pixels) + 36.0 35.156 KHz 1024 800 24 72 128 800 x 600
8 H(Pixels) + 40.0 37.879 KHz 1056 800 40 128 88 800 x 600
9 H(Pixels) + 50.0 48.077 KHz 1040 800 56 120 64 800 x 600
10 H(Pixels) + 49.5 46.875 KHz 1056 800 16 80 160 800 x 600
11 H(Pixels) - 57.2832 49.725 KHz 1152 832 32 64 224 832 x 624
12 H(Pixels) - 65 48.363 KHz 1344 1024 24 136 160 1024 x 768
13 H(Pixels) - 75 56.476 KHz 1328 1024 24 136 144 1024 x 768
14 H(Pixels) + 78.75 60.023 KHz 1312 1024 16 96 176 1024 x 768
H / V
V(Lines) - 70.0 Hz 449 350 37 2 60
V(Lines) + 70.0 Hz 449 400 13 2 34 (TEXT)
V(Lines) - 60.0 Hz 525 480 10 2 33
V(Lines) - 66.67 Hz 525 480 3 3 39
V(Lines) - 72.8 Hz 520 480 9 3 28
V(Lines) - 75.0 Hz 500 480 1 3 16
V(Lines) + 56.25 Hz 625 600 1 2 22
V(Lines) + 60.3 Hz 628 600 1 4 23
V(Lines) + 72.188 Hz 666 600 37 6 23
V(Lines) + 75.0 Hz 625 600 1 3 21
V(Lines) - 74.55 Hz 667 624 1 3 39 (MAC)
V(Lines) - 60.0 Hz 806 768 3 6 29
V(Lines) - 70.0 Hz 806 768 3 6 29
V(Lines) + 75.0 Hz 800 768 1 3 28
Sync
Polarity
Dot
Clock
Frequency
Total
Period
( E )
Video
Active
Time ( A )
Front
Porch
( D )
Sync
Duration
( C )
Blanking
Time
( B )
Resolution
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Page 8
DISASSEMBLY
# 1 # 4
1. Put a soft cushion on the floor and lay the stand on its side so that the base is accessible.
# 2 # 5
2. Hold the set while folding the latch and take out the stand base.
# 3 # 6
4. Cover the panel with your hand so that it is not scratched. Then, pull up the cabinet corner side.
5-1. Disassemble the cabinet. 5-2. Hold the control PCB as shown in the figure and gently
pull it out.
3-1. Push the cover upward and remove it. 3-2. Unscrew the four screws.
6. Push up the back cover as shown in the figure and pull out the chassis assembly so that the latch is untied.
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Page 9
# 7 # 9
7. Push the shield cap upward and disassemble it. 9. Pull out the link cable while pushing up the main frame.
# 8
8. Pull out the cable.
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Page 10
BLOCK DIAGRAM
Panel
3.3V VMOD
LVDS
LVDS
Transmitter
Scaling
Switch
OSD
(System)
3.3V
MOD-ON
EEPROM
(System)
+
MCU
5V
3.3 V
1.8 V
Regulator
gmZAN3SL
ADC
3.3 V
Analog(R/G/B)
PLL
1.8 V
D-Sub
To Key Control
LIPS
BRT-CTL
INV-CTL
5V
Inverter
Power +
5V
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Page 11
DESCRIPTION OF BLOCK DIAGRAM
1. Video Controller Part.
This part amplifies the level of video signal for the digital conversion and converts from the analog video signal to the digital video signal using a pixel clock. The pixel clock for each mode is generated by the PLL. The range of the pixel clock is from 25MHz to 80MHz. This part consists of the Scaler, ADC and TMDS receiver . The Scaler gets the video signal converted analog to digital, interpolates input to 1024 X768 resolution signal and outputs 8-bit R, G, B signal to transmitter.
2. Power Part.
This part consists of the one 5V, one 3.3V, and one 1.8V regulators to convert power which is provided 5V in Power board.
3.3V is provided for LCD panel and inverter, 5V is provided for micom. Also, 5V is converted 3.3V and 1.8V by regulator. Converted power is provided for IC in the main board.
3. MICOM Part.
This part consists of EEPROM IC which stores control data, Reset IC and the Micom. The Micom distinguishes polarity and frequency of the H/V sync are supplied from signal cable. The controlled data of each modes is stored in EEPROM.
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Page 12
LIPS Board Block Diagram
50 ~ 60Hz
100KHz
OUTPUT RECTIFIER
AND FILTER
LINE
EMI
COMPONENTS
INPUT RECTIFIER
AND FILTER
HVDC
ENERGY
TRANSFER
100 ~ 240V
PWM CONTROL CIRCUIT
PHOTO
-COUPLER ISOLATION
SIGNAL
COLLENT-
ION
PRIMARY SECONDARY
Operation description_LIPS
1. EMI components.
This part contains of EMI components to comply with global marketing EMI standards like FCC,VCCI CISPR, the circuit included a line-filter, across line capacitor and of course the primary protection fuse.
12V
5V
GND
2. Input rectifier and filter.
This part function is for transfer the input AC voltage to a DC voltage through a bridge rectifier and a bulk capacitor.
3. Energy Transfer.
This part function is for transfer the primary energy to secondary through a power transformer.
4. Output rectifier and filter.
This part function is to make a pulse width modulation control and to provide the driver signal to power switch,to adjust the duty cycle during different AC input and output loading condition to achieve the dcoutput stabilized, and also the over power protection is also monitor by this part.
5. Photo-Coupler isolation.
This part function is to feed back the dc output changing status through a photo transistor to primary controller to achieve the stabilized dc output voltage.
6. Signal collection.
This part function is to collect the any change from the dc output and feed back to the primary through photo transistor.
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Page 13
ADJUSTMENT
Windows EDID V1.0 User Manual
Operating System: MS Windows 98, 2000, XP Port Setup: Windows 98 => Dont need setup
Windows 2000, XP => Need to Port Setup.
This program is available to LCD Monitor only.
1. Port Setup a) Copy UserPort.sys file to
c:\WINNT\system32\drivers folder
b) Run Userport.exe
c) Remove all default number d) Add 300-3FF
2. EDID Read & Write
1) Run WinEDID.exe
2) Edit Week of Manufacture, Year of Manufacture, Serial Number a) Input User Info Data b) Click Update button c) Click Write button
e) Click Start button. f) Click Exit button.
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Page 14
SERVICE OSD
1) Turn off the power switch at the front side of the display.
2) Wait for about 5 seconds and press MENU, POWER switch with 1 second interval.
3) The SVC OSD menu contains additional menus that the User OSD menu as described below.
a) Auto Color : W/B balance and Automatically sets the gain and offset value. b) NVRAM INIT : EEPROM initialize.(24C08) c) CLEAR ETI : To initialize using time. d) AGING : Select Aging mode(on/off). e) R/G/B-9300K : Allows you to set the R/G/B-9300K value manually.
f) R/G/B-6500K : Allows you to set the R/G/B-6500K value manually. g) R/G/B-Offset : Allows you to set the R/G/B-Offset value manually.(Analog Only) h) R/G/B-Gain : Allows you to set the R/G/B-Gain value manually.(Analog Only)
i) PANEL : To select applied module.
Video Signal
Generator
Control Line
A
IBM Compatible PC
PARALLEL PORT
Not used
RS232C
C
PARALLEL
Power inlet (required)
220
VGS
A
MONITOR
POWER
ST
V-SYNC
B
F
Power Select Switch (110V/220V)
Power LED
E
ST Switch
V-Sync On/Off Switch (Switch must be ON.)
5V
15
OFF ON
F
10
5
11
6
1
B
69
5
1
C
OFF
13
25
5V
4.7K
4.7K
74LS06
ON
5V
E
74LS06
4.7K
1
14
Figure 1. Cable Connection
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Page 15
NO POWER
(POWER INDICATOR OFF)
TROUBLESHOOTING GUIDE
1. NO POWER
1
1
CHECK J707 VOLTAGE
PIN5, PIN6 (5V)?
YES
CHECK
U801 PIN 1& U803 PIN
3 VOLTAGE
(5V) ?
YES
CHECK
Q803 PIN 3(3.3V) &
U803 PIN 4 (1.8V)?
YES
CHECK KEY CONTROL
CONNECTOR ROUTINE
NO
NO
NO
CHECK POWER BOARD, AND FIND OUT A SHORT
POINT AS OPENING
EACH POWER LINE
CHECK U801.
CHECK 5VR LINE
(OPEN CHECK)
NO PROBLEM
1
IS U201 PIN88
2
VOLTAGE REPEATED
AS PULSE
SHAPE ?
YES
CHECK IIC LINE
CONNECTION (U501, U502)
Waveforms
1 2
J707-#5, 6 / U801-#1/U803-#3 U201-#88
NO
CHECK U201
VCC, XTAL, RESET
-15 -
Page 16
2. NO RASTER (OSD IS NOT DISPLAYED) – LIPS
NO RASTER
(OSD IS NOT DISPLAYED)
1
PIN5, PIN 6
5V?
J707 PIN2
2.5V?
J707 PIN1
5V?
CHECK
PULSE AS
CONTACTING SCOPE
PROBE TO CAUTION LABEL.
(CONTACT PROBE TO
CAUTION LABEL.
CAN YOU SEE PULSE
AT YOUR
SCOPE?
J707
YES
YES
YES
NO
NO
NO
NO
CHECK LIPS
CHECK MICOM INV ON/OFF
PORT. (U501 PIN9)
1. CONFIRM BRIGHTNESS OSD CONTRL STATE.
2. CHECK MICOM DIM-ADJ PORT(U501 PIN41)
LIPS
3 4
REPLACE CCFL LAMP
IN THE LCD MODULE
Waveforms
1
J707-#5, 6 / U801-#1/U803-#3
YES
3 4
J707-#2 J707-#2
Inverter Off
Micom Port check
J705 Inverter output
-16 -
Inverter On
Micom Port check
J705 Inverter output
J705 Inverter output
Page 17
3. NO RASTER (OSD IS NOT DISPLAYED) – gmZAN3SL
NO RASTER
(OSD IS NOT DISPLAYED)
POWER PINS 3.3V?
2
6
OSCILLATE AS
PIN43 IS 48KHz H-SYNC?
PIN44 IS 60Hz V-SYNC?
IS PULSE APPEARED
AT SIGNAL PINS?
U501 PIN8
U201
YES
U201
PIN88
12MHZ?
YES
U501
YES
5V?
NO
NO
NO
NO
CHECK U803, U801
1. CHECK PIN88
SOLDERING CONDITION
2. CHECK X501
3. TROUBLE IN U201
CHECK CONNECTION LINE
FROM U201 TO U501
CHECK 5VR LINE
2
U201-#88
TROUBLE IN CABLE
OR LCD MODULE
Waveforms
YES
6
U501-#43, 44
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Page 18
4. NO RASTER (OSD IS DISPLAYED) – gmZAN3SL
NO RASTER
(OSD IS DISPLAYED)
U201
POWER PIN99(1.8V)
PIN33(3.3V)?
YES
CHECK
R,G,B INPUT?
U201 PIN 70,74,77
YES
CHECK
H-SYNC INPUT
U201 PIN 95?
YES
CHECK
V-SYNC INPUT
U201 PIN 96?
YES
NO
NO
NO
NO
CHECK U803, U801
1. CHECK PC
2. CHECK SIGNAL CABLE & D-SUB CONNECTOR LINE
CHECK H-SYNC LINE
U501 U201
(D-SUB
PIN95)
CHECK V-SYNC LINE
(D-SUBU501 U201
PIN96)
TROUBLE IN
LCD MODULE
-18 -
Page 19
M
MST9151
Main Board
Power Board
Control Board
Connector Assy P/N:
6631T11012R
WIRING DIAGRAM
Connector Assy P/N:
6631T20024C
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Page 20
130
050
150
140
EXPLODED VIEW
030
120
060
090
040
110
070
070
080
100
020
010
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Page 21
EXPLODED VIEW PARTS LIST
Ref. No.
010
020
030
040 050
060 070
080
090
100 110
120
130
140 150
Part No.
3091TKL097V CABINET ASSEMBLY, L1530 BRAND L088 L088 (PC-ABS) Q-CKD-SILVER-USA 3091TKL097K CABINET ASSEMBLY, L1530 BRAND 3090TKL088 "B"-CKD-SILVER-Brazil,Mexico,Panama 3091TKL153C CABINET ASSEMBLY, L1530 BRAND L088 PC+ABS CKD-BLACK-USA 3091TKL097S CABINET ASSEMBLY, L1530S BRAND 3090TKL088 "C"-CKD-BLACK-Panama 6304FLP146B
or 6304FLP146A
6304FLP113A 3809TKL067G BACK COVER ASSEMBLY, L1530S L072 (PC-ABS) F-CKD-USA 3809TKL067C BACK COVER ASSEMBLY, L1530 3808TKL072 "A"-CKD-Brazil,Mexico,Panama 3043TKK146B TILT SWIVEL ASSEMBLY, L1530 .. "A"-CKD 3043TKK145K TILT SWIVEL ASSEMBLY, L1530 .. "D"-CKD-SILVER
3043TKK145Q TILT SWIVEL ASSEMBLY, L1530S .. (BK-VER)"G"-CKD-BLACK
4951TKS136J METAL ASSEMBLY, FRAME "A"-CKD 4814TKK263A SHIELD, INVERTER CAP(L1530) 4814TKK263B SHIELD, INVERTER CAP_"A"CKD
6871TPT271X
or 6871TPT282E or 6871TPT271N PWB(PCB) ASSEMBLY,POWER, M-CHASSIS 15INCH POWER TOTAL LIEN CHANG C306 68PF
3313TL5101E MAIN TOTAL ASSEMBLY, L1530SN GMZAN3SL MX CKD - E BRAND CL-66-LPL
3313TL5127E MAIN TOTAL ASSEMBLY, L1530SN KNPAEFM BRAND CL-66-LPL TN
3313TL5101F MAIN TOTAL ASSEMBLY, L1530SN GMZAN3SL SP CKD - E BRAND CL-66-LPL 6631T11012R CONNECTOR ASSEMBLY, 20P H-H 140MM UL20276 PANEL LINK CABLE LM567D 6871TST541E PWB(PCB) ASSEMBLY,SUB, L1930BM CONTROL TOTAL BRAND MX CKD-LPL 6871TST804E PWB(PCB) ASSEMBLY,SUB, L1730B LGEMX CONTROL TOTAL BRAND LF-LPL TN
6871TST541H PWB(PCB) ASSEMBLY,SUB, L1530SM CONTROL TOTAL BRAND SP CKD-LPL
3550TKK446F COVER, L1530S BACK DOOR_"E"-CKD-SILVER
3550TKK446H COVER, L1530S BACK DOOR (BK) "C"-CKD-BLACK 3550TKK452D COVER, LXX30 STAND REAR COVER_"B"-CKD-SILVER 3550TKK452E COVER, LXX30S STAND REAR COVER (BK) "C"-CKD-BLACK 6850TD9004G CABLE,D-SUB, UL20276-9C(5.8MM) DT 1800MM BLACK(9930) SONY DM
6410TUW008A POWER CORD, LP31+LS13 LONGWELL UL/CSA 1870MM WALL CD/PB FREE BLACK
or 174-206M POWER CORD, SP305 IS14 I-SHENG UL/CSA 1870MM WALL BLACK
LCD(LIQUID CRYSTAL DISPLAY), LM150X08-A4K8 LG PHILPS TFT COLOR PSWG,LVDS,16MS,SS S D-IC , COST COMPENSATION LCD(LIQUID CRYSTAL DISPLAY), LM150X08-A4K8 LG PHILPS TFT COLOR PSWG,LVDS,16MS,SS S D-IC LCD(LIQUID CRYSTAL DISPLAY), LM150X08-A4K3 LG PHILPS TFT COLOR PSWG,LVDS,16MS,HYNIX/HITACHI
PWB(PCB) ASSEMBLY,POWER, M-CHASSIS 15INCH POWER TOTAL LIEN CHANG C306 68PF 450V PWB(PCB) ASSEMBLY,POWER, M-CHASSIS 15INCH C306 68PF 450V POWER TOTAL LIEN CHANG PB FREE
Description
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Page 22
REPLACEMENT PARTS LIST
CAUTION: BEFORE REPLACING ANY OF THESE COMPONENTS,
READ CAREFULLY THE SAFETY PRECAUTIONS IN THIS MANUAL.
* NOTE : S SAFETY Mark
AL ALTERNATIVE PARTS
DATE: 2005. 3. 21.
*S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION
MAIN BOARD
CAPACITORS
C204 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y
C205 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C206 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C207 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C208 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C210 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C213 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C214 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C215 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C216 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C217 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C218 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C219 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C220 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C221 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C222 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C223 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C224 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C225 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C226 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C227 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C231 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C232 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C233 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C234 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C503 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C504 0CE106CK610 "10UF SHL,SD 50V 20% BULK FL" C506 0CC030CK01A 3PF 1608 50V 0.25 PF R/TP NP C507 0CC180CK41A 18PF 1608 50V 5% R/TP NP0 C508 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C701 0CK105CD56A 1UF 1608 10V 10% R/TP X7R C708 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C709 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C717 0CC101CK41A 100PF 1608 50V 5% R/TP NP0 C718 0CC101CK41A 100PF 1608 50V 5% R/TP NP0 C720 0CC680CK41A 68PF 1608 50V 5% R/TP NP0 C721 0CC680CK41A 68PF 1608 50V 5% R/TP NP0 C727 0CK105CD56A 1UF 1608 10V 10% R/TP X7R C732 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C733 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C734 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C735 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C801 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C819 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C820 0CE107EF628 "100UF KMG,RD 16V 20% FM2.5 T" C821 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C829 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C831 0CE107EF628 "100UF KMG,RD 16V 20% FM2.5 T" C832 0CE107EF628 "100UF KMG,RD 16V 20% FM2.5 T" C833 0CK105CD56A 1UF 1608 10V 10% R/TP X7R C834 0CC102CK41A 1000PF 1608 50V 5% R/TP NP0
DATE: 2005. 3. 21.
*S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION
DIODEs
D701 0DSIH00018A "ENKMC2837-T112,LF ISAHAYA R/" D702 0DSIH00018A "ENKMC2837-T112,LF ISAHAYA R/" D706 0DSIH00018A "ENKMC2837-T112,LF ISAHAYA R/" ZD701 0DZKE00138A KDZ5.6V KEC R/TP USC 0.2W 5. ZD702 0DZKE00138A KDZ5.6V KEC R/TP USC 0.2W 5. ZD703 0DZKE00138A KDZ5.6V KEC R/TP USC 0.2W 5. ZD704 0DZKE00138A KDZ5.6V KEC R/TP USC 0.2W 5. ZD705 0DZKE00138A KDZ5.6V KEC R/TP USC 0.2W 5. ZD711 0DZKE00138A KDZ5.6V KEC R/TP USC 0.2W 5.
ICs
Q502 0IKE704200H KIA7042AP TO-92 TP 4.2 VOLT U201 0IPRPGN016B "GMZAN3SL-BD-LF GENESIS 128P," U501 0IZZTSZ535A L1530SN GMZAN3SL MICOM ASSY-LPL U501 0IZZTSZ701A L1530SN ZAN3SL MICOM ASSY P-LPL TN U502 0ISG240860B "M24C08WMN6T(P),LF SGS-THOMSO" U801 0IPMGKE011A KIA78D33F KEC DPAK R/TP 3.3V U803 0IPMGSG019A "LD1117S18TR,LF STM SOT223 R/"
TRANSISTOR
U802 0TFVI80067A SI3865BDV(E3) VISHAY R/TP TS Q503 0TRIH80001A "RT1C3904-T112,LF ISAHAYA R/T" Q504 0TRIH80001A "RT1C3904-T112,LF ISAHAYA R/T" Q505 0TRIH80001A "RT1C3904-T112,LF ISAHAYA R/T" Q703 0TR390609FA KST3906-MTF TP SAMSUNG SOT2 Q704 0TR390609FA KST3906-MTF TP SAMSUNG SOT2
RESISTORs
R201 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP R202 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP R203 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP R208 0RJ1200D677 120 OHM 1/10 W 5% 1608 R/TP R209 0RJ1200D677 120 OHM 1/10 W 5% 1608 R/TP R210 0RJ1200D677 120 OHM 1/10 W 5% 1608 R/TP R211 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP R213 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R214 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R220 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R221 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R222 0RJ1004D677 1000000 OHM 1/10 W 5% 1608 R R506 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R508 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R514 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R515 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R516 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R518 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R520 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R521 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R522 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R523 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
- 22 -
Page 23
DATE: 2005. 3. 21.
*S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION
DATE: 2005. 3. 21.
*S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION
R534 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R535 0RJ3301D677 3.3K OHM 1/10 W 5% 1608 R/TP R537 0RJ3301D677 3.3K OHM 1/10 W 5% 1608 R/TP R541 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP R542 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP R543 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R544 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R545 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/TP R547 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/TP R548 0RJ0332D677 33 OHM 1/10 W 5% 1608 R/TP R549 0RJ0332D677 33 OHM 1/10 W 5% 1608 R/TP R555 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP R557 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP R560 0RJ4702D677 47000 OHM 1/10 W 5% 1608 R/T R561 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R566 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP R701 0RJ0752D677 75 OHM 1/10 W 5% 1608 R/TP R703 0RJ0752D677 75 OHM 1/10 W 5% 1608 R/TP R706 0RJ0752D677 75 OHM 1/10 W 5% 1608 R/TP R708 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/TP R709 0RJ1001D677 1K OHM 1/10 W 5% 1608 R/TP R716 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R717 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R721 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/TP R722 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP R723 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TP R724 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TP R726 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP R727 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP R728 0RJ1502D677 15K OHM 1/10 W 5% 1608 R/TP R735 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R737 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R744 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R747 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R749 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R770 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R771 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R775 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TP R779 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TP R780 0RJ2001D677 2K OHM 1/10 W 5% 1608 R/TP R781 0RJ2001D677 2K OHM 1/10 W 5% 1608 R/TP R782 0RJ0471D677 4.7 OHM 1/10 W 5% 1608 R/TP R803 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R811 0RJ2202D677 22K OHM 1/10 W 5% 1608 R/TP R812 0RJ5600D677 560 OHM 1/10 W 5% 1608 R/TP R813 0RJ0472D677 47 OHM 1/10 W 5% 1608 R/TP R814 0RJ0472D677 47 OHM 1/10 W 5% 1608 R/TP R815 0RJ0472D677 47 OHM 1/10 W 5% 1608 R/TP R816 0RJ0472D677 47 OHM 1/10 W 5% 1608 R/TP R817 0RJ0472D677 47 OHM 1/10 W 5% 1608 R/TP R818 0RJ0472D677 47 OHM 1/10 W 5% 1608 R/TP R819 0RJ0472D677 47 OHM 1/10 W 5% 1608 R/TP R820 0RJ0472D677 47 OHM 1/10 W 5% 1608 R/TP R821 0RJ0472D677 47 OHM 1/10 W 5% 1608 R/TP R822 0RJ0472D677 47 OHM 1/10 W 5% 1608 R/TP R827 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP
OTHERs
X501 6212AA2004A HC-49U TXC 12.0MHZ +/- 30 PP
CONTROL BOARD
SW2 140-058E SKHV10910B LGEC NON 12V 20A
SW3 140-058E SKHV10910B LGEC NON 12V 20A SW6 140-058E SKHV10910B LGEC NON 12V 20A SW7 140-058E SKHV10910B LGEC NON 12V 20A SW8 140-058E SKHV10910B LGEC NON 12V 20A LED1 0DLLT0340AA LITEON LTL-14CDJNHBP1 BK GRE C1 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C2 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R Q1 0TR390409AE FAIRCHILD KST3904(LGEMTF) TP Q2 0TR390409AE FAIRCHILD KST3904(LGEMTF) TP R1 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R2 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R3 0RJ2001D677 2K OHM 1/10 W 5% 1608 R/TP R4 0RJ2001D677 2K OHM 1/10 W 5% 1608 R/TP R5 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R7 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/TP R8 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/TP
- 23 -
Page 24
2 5
U201-#88
SCHEMATIC DIAGRAM
1. SCALER
# 1
L1515/L1715
ZAN3SL
52
- 24 -
Page 25
6
U501-#43, 44
2. MICOM
# 2
L1515/L1715
MICOM
- 25 -
6
1.5K(17")
Page 26
1
J707-#5,6/U801-#1/U803-#3
3. POWER
390
# 3
L1515/L1715
POWER
1
390
390 390
1
- 26 -
Page 27
Inverter On
Inverter On
Micom Port check
J705 Inverter output
4
J707-#2
4. CONNECTOR & JACKS
3
J707-#2
Inverter Off
Inverter Off
Micom Port check
J705 Inverter output
1
J707-#5,6/U801-#1/U803-#3
1
43
15K
# 4
L1515/L1715
CONNECTOR & JACKS
- 27 -
Page 28
Mar. 2005
P/NO : 3828TSL094X Printed in Korea
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