Page 1
Service Guide Specification
Service Guide Specification
Model Description
1.
MODEL
SUFFIX
2.
L1930SQSNTM
SLEURW
BRAND
Product Name
Printing Specification
1. Trim Size (Format) : 215mm x 280 mm
2. Printing Colors
• Cover : LG COLORS
• Inside : Black
3. Stock (Paper)
• Cover : Snow White 150 g/
• Inside : Snow White 100 g/
4. Printing Method :
5. Bindery : Saddle stitch
6. Language : English
7. Number of pages : 28
LG
FLATRON L1930SQ
Part No.
3828TSL085D
Special Instructions3.
(1) Origin Notification
* LGEDI : Printed in Indonesia * LGEWA : Printed in U.K.
* LGESP : Printed in Brazil * LGEMX : Printed in Mexico
* LGENT : Printed in China * LGEIL : Printed in India
4.
Changes
8
7
6
5
4
3
2
1
REV.
NO.
MM/DD/YY
CHANGE NO.
CHANGE CONTENTS
Page 2
Pagination sheet
Pagination sheet
Cover
Front
Cover
inside
2
English….English
English
3
….
English
4
English
24
English
5
English
25
English
….
English
26
English
…..
Rear
Cover
Inside
27
Rear
Cover
Page 3
COLOR MONIT OR
SER VICE MANUAL
Website:http://biz.LGservice.com
E-mail:http://www.LGEservice.com/techsup.html
CAUTION
BEFORE SERVICING THE UNIT,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS NO. : CL-61
MODEL:
L1930SQ (L1930SQSNTM-AL**R)
( ) **Same model for Service
MENU
LightView SOURCE
SET/AUTO
+
-
Page 4
CONTENTS
SPECIFICATIONS ................................................... 2
PRECAUTIONS ....................................................... 3
SERVICE PRECAUTIONS ...................................... 4
TIMING CHART ....................................................... 7
DISASSEMBLY .........................................................8
WIRING DIAGRAM ............................................... 10
SPECIFICATIONS
1. LCD CHARACTERISTICS
Type : TFT Color
Size : 19 inch
Pixel Pitch : 0.294 (H) x 0.294 (V)
Color Depth : 16.2M colors
Electrical Interface : LVDS
Surface Treatment : Hard-coating(3H), Anti-Glare
Operating Mode :
Normally White,
Backlight Unit : Top/Bottom edge side 4-CCFL
2. OPTICAL CHARACTERISTICS
2-1. Viewing Angle by Contrast Ratio ≥ 10
Left : -60° min., -70°(Typ) Right : +60° min., +70°(Typ)
Top :+65° min., +75°(Typ) Bottom : -55° min., -65°(Typ)
2-2. Luminance : 200(min), 250(Typ)
Transmissive mode
BLOCK DIAGRAM ................................................. 11
ADJUSTMENT ...................................................... 14
TROUBLESHOOTING GUIDE .............................. 16
EXPLODED VIEW...................................................20
REPLACEMENT PARTS LIST ...............................22
SCHEMATIC DIAGRAM......................................... 24
. Max. Resolution
4
Analog : 1280 x 1024 / 75Hz
5. POWER SUPPLY
5-1. Power
5-2. Power Consumption
MODE
POWER ON (NORMAL)
STAND-BY
SUSPEND
DPMS OFF
POWER S/W Off
: AC 100~240V, 50/60Hz , 0.6A
H/V SYNC
ON/ON
OFF/ON
ON/OFF
OFF/OFF
VIDEO
POWER CONSUMPTION
ACTIVE
OFF
OFF
OFF
-
-
less than 43 W
less than 1 W
less than 1 W
less than 1 W
less than 1 W
LED COLOR
GREEN
AMBER
AMBER
AMBER
Off
2-3. Contrast Ratio : 300(min), 500(Typ)
3. SIGNAL (Refer to the Timing Chart)
3-1. Sync Signal
• Type : Separate Sync,
SOG (Sync On Green)
Composite Sync
3-2. Video Input Signal
1) Type : R, G, B Analog
2) Voltage Level : 0~0.7 V
3) Input Impedance : 75 Ω
3-3. Operating Frequency
Horizontal : 30 ~ 83kHz
Vertical : 56 ~ 75Hz
6. ENVIRONMENT
6-1. Operating Temperature: 10°C~35°C (50°F~95°F)
(Ambient)
6-2. Relative Humidity : 10%~80%
(Non-condensing)
6-3. MTBF : 50,000 Hours(Min)
7. DIMENSIONS (with TILT/SWIVEL)
Width : 444.4 mm (17.50'')
Depth : 108.7 mm (4.28'')
Height : 423.8 mm (16.68'')
8. WEIGHT (with TILT/SWIVEL)
Net. Weight : 6.5 kg (14.33 lbs)
Gross Weight : 8.8 kg (19.40 lbs)
- 2 -
Page 5
PRECAUTION
1.5 Kohm/10W
To Instrument's
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
WARNING FOR THE SAFETY-RELATED COMPONENT.
• There are some special components used in LCD
monitor that are important for safety. These parts are
marked on the schematic diagram and the
replacement parts list. It is essential that these critical
parts should be replaced with the manufacturer’s
specified parts to prevent electric shock, fire or other
hazard.
• Do not modify original design without obtaining written
permission from manufacturer or you will void the
original parts and labor guarantee.
TAKE CARE DURING HANDLING THE LCD MODULE
WITH BACKLIGHT UNIT.
• Must mount the module using mounting holes arranged
in four corners.
• Do not press on the panel, edge of the frame strongly
or electric shock as this will result in damage to the
screen.
• Do not scratch or press on the panel with any sharp
objects, such as pencil or pen as this may result in
damage to the panel.
WARNING
BE CAREFUL ELECTRIC SHOCK !
• If you want to replace with the new backlight (CCFL) or
inverter circuit, must disconnect the AC adapter
because high voltage appears at inverter circuit about
650Vrms.
• Handle with care wires or connectors of the inverter
circuit. If the wires are pressed cause short and may
burn or take fire.
Leakage Current Hot Check Circuit
• Protect the module from the ESD as it may damage the
electronic circuit (C-MOS).
• Make certain that treatment person’s body are
grounded through wrist band.
• Do not leave the module in high temperature and in
areas of high humidity for a long time.
• The module not be exposed to the direct sunlight.
• Avoid contact with water as it may a short circuit within
the module.
• If the surface of panel become dirty, please wipe it off
with a softmaterial. (Cleaning with a dirty or rough cloth
may damage the panel.)
CAUTION
Please use only a plastic screwdriver to protect yourself
from shock hazard during service operation.
- 3 -
Page 6
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this
service manual and its supplements and addenda, read
and follow the SAFETY PRECAUTIONS on page 3 of this
publication.
NOTE: If unforeseen circumstances create conflict
between the following servicing precautions and any of the
safety precautions on page 3 of this publication, always
follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC
power source before;
a. Removing or reinstalling any component, circuit
board module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical
plug or other electrical connection.
c. Connecting a test substitute in parallel with an
electrolytic capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect
polarity installation of electrolytic capacitors may
result in an explosion hazard.
d. Discharging the picture tube anode.
2. Test high voltage only by measuring it with an
appropriate high voltage meter or other voltage
measuring device (DVM, FETVOM, etc) equipped with
a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Discharge the picture tube anode only by (a) first
connecting one end of an insulated clip lead to the
degaussing or kine aquadag grounding system shield
at the point where the picture tube socket ground lead
is connected, and then (b) touch the other end of the
insulated clip lead to the picture tube anode button,
using an insulating handle to avoid personal contact
with high voltage.
4. Do not spray chemicals on or near this receiver or any
of its assemblies.
5. Unless specified otherwise in this service manual,
clean electrical contacts only by applying the following
mixture to the contacts with a pipe cleaner, cottontipped stick or comparable non-abrasive applicator;
10% (by volume) Acetone and 90% (by volume)
isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual,
lubrication of contacts in not required.
6. Do not defeat any plug/socket B+ voltage interlocks
with which receivers covered by this service manual
might be equipped.
7. Do not apply AC power to this instrument and/or any of
its electrical assemblies unless all solid-state device
heat sinks are correctly installed.
8. Always connect the test receiver ground lead to the
receiver chassis ground before connecting the test
receiver positive lead.
Always remove the test receiver ground lead last.
9. Use with this receiver only the test fixtures specified in
this service manual.
CAUTION: Do not connect the test fixture ground strap
to any heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be
damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive (ES)
Devices. Examples of typical ES devices are integrated
circuits and some field-effect transistors and
semiconductor "chip" components. The following
techniques should be used to help reduce the incidence of
component damage caused by static by static electricity.
1. Immediately before handling any semiconductor
component or semiconductor-equipped assembly, drain
off any electrostatic charge on your body by touching a
known earth ground. Alternatively, obtain and wear a
commercially available discharging wrist strap device,
which should be removed to prevent potential shock
reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with
ES devices, place the assembly on a conductive
surface such as aluminum foil, to prevent electrostatic
charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or
unsolder ES devices.
4. Use only an anti-static type solder removal device.
Some solder removal devices not classified as "antistatic" can generate electrical charges sufficient to
damage ES devices.
5. Do not use freon-propelled chemicals. These can
generate electrical charges sufficient to damage ES
devices.
6. Do not remove a replacement ES device from its
protective package until immediately before you are
ready to install it. (Most replacement ES devices are
packaged with leads electrically shorted together by
conductive foam, aluminum foil or comparable
conductive material).
7. Immediately before removing the protective material
from the leads of a replacement ES device, touch the
protective material to the chassis or circuit assembly
into which the device will be installed.
CAUTION: Be sure no power is applied to the chassis
or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion
such as the brushing together of your clothes fabric or
the lifting of your foot from a carpeted floor can
generate static electricity sufficient to damage an ES
device.)
- 4 -
Page 7
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and
appropriate tip size and shape that will maintain tip
temperature within the range or 500。F to 600。F.
2. Use an appropriate gauge of RMA resin-core solder
composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a
mall wire-bristle (0.5 inch, or 1.25cm) brush with a
metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal
temperature.
(500。F to 600。F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static,
suction-type solder removal device or with solder
braid.
CAUTION: Work quickly to avoid overheating the
circuitboard printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal
temperature (500。F to 600。F)
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of
the component lead and the printed circuit foil, and
hold it there only until the solder flows onto and
around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the
circuit board printed foil.
d. Closely inspect the solder area and remove any
excess or splashed solder with a small wire-bristle
brush.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong)
through which the IC leads are inserted and then bent flat
against the circuit foil. When holes are the slotted type,
the following technique should be used to remove and
replace the IC. When working with boards using the
familiar round hole, use the standard technique as
outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation
by gently prying up on the lead with the soldering iron
tip as the solder melts.
2. Draw away the melted solder with an anti-static
suction-type solder removal device (or with solder
braid) before removing the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad
and solder it.
3. Clean the soldered areas with a small wire-bristle
brush. (It is not necessary to reapply acrylic coating to
the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as
close as possible to the component body.
2. Bend into a "U" shape the end of each of three leads
remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the
corresponding leads extending from the circuit board
and crimp the "U" with long nose pliers to insure metal
to metal contact then solder each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor
leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the
circuit board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close
as possible to diode body.
2. Bend the two remaining leads perpendicular y to the
circuit board.
3. Observing diode polarity, wrap each lead of the new
diode around the corresponding lead on the circuit
board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder
joints of the two "original" leads. If they are not shiny,
reheat them and if necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board
hollow stake.
2. Securely crimp the leads of replacement component
around notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the
replaced component and adjacent components and the
circuit board to prevent excessive component
temperatures.
- 5 -
Page 8
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed
circuit board will weaken the adhesive that bonds the foil
to the circuit board causing the foil to separate from or
"lift-off" the board. The following guidelines and
procedures should be followed whenever this condition is
encountered.
At IC Connections
To repair a defective copper pattern at IC connections use
the following procedure to install a jumper wire on the
copper pattern side of the circuit board. (Use this
technique only on IC connections).
1. Carefully remove the damaged copper pattern with a
sharp knife. (Remove only as much copper as
absolutely necessary).
2. carefully scratch away the solder resist and acrylic
coating (if used) from the end of the remaining copper
pattern.
3. Bend a small "U" in one end of a small gauge jumper
wire and carefully crimp it around the IC pin. Solder the
IC connection.
4. Route the jumper wire along the path of the out-away
copper pattern and let it overlap the previously scraped
end of the good copper pattern. Solder the overlapped
area and clip off any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper
pattern at connections other than IC Pins. This technique
involves the installation of a jumper wire on the
component side of the circuit board.
1. Remove the defective copper pattern with a sharp
knife.
Remove at least 1/4 inch of copper, to ensure that a
hazardous condition will not exist if the jumper wire
opens.
2. Trace along the copper pattern from both sides of the
pattern break and locate the nearest component that is
directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead
of the nearest component on one side of the pattern
break to the lead of the nearest component on the
other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is
dressed so the it does not touch components or sharp
edges.
- 6 -
Page 9
TIMING CHART
VIDEO
SYNC
B
C
E
A
D
MODE
1
2
3
4
5
6
7
8
9
10
11
12
13
H / V
H(Pixels) +
V(Lines) - 70.09 449 350 37 2 60
H(Pixels) -
V(Lines) + 70.08 449 400 12 2 35
H(Pixels) -
V(Lines) - 59.94 525 480 10 2 33
H(Pixels) -
V(Lines) - 75 500 480 1 3 16
H(Pixels) +
V(Lines) + 60.317 628 600 1 4 23
H(Pixels) +
V(Lines) + 75.0 625 600 1 3 21
H(Pixels) +/-
V(Lines) +/- 74.55 667 624 1 3 39
H(Pixels) -
V(Lines) - 60.0 806 768 3 6 29
H(Pixels) -
V(Lines) - 75.029 800 768 1 3 28
H(Pixels) +/-
V(Lines) +/- 75.062 915 870 3 3 39
H(Pixels) +/-
V(Lines) +/- 65.96 937 900 2 4 31
H(Pixels) +
V(Lines) + 60.02 1066 1024 1 3 38
H(Pixels) +
V(Lines) + 75.035 1066 1024 1 3 38
Sync
Polarity
Dot
Clock
25.175
28.321
25.175
31.5
40.0
49.5
57.283
65.0
78.75
100.0
92.978
108.0
135.0
Frequency
31.469 800 640 16 96 48
31.468 900 720 18 108 54
31.469 800 640 16 96 48
37.5 840 640 16 64 120
37.879 1056 800 40 128 88
46.875 1056 800 16 80 160
49.725 1152 832 32 64 224
48.363 1344 1024 24 136 160
60.123 1312 1024 16 96 176
68.681 1456 1152 32 128 144
61.805 1504 1152 18 134 200
63.981 1688 1280 48 112 248
79.976 1688 1280 16 144 248
Total
Period
( E )
Video
Active
Time ( A )
Sync
Duration
( D )
Front
Porch
( C )
Blanking
Time
( B )
Resolution
640 x 350
720 X 400
640 x 480
640 x 480
800 x 600
800 x 600
832 x 624
1024 x 768
1024 x 768
1152 x 870
1152 x 900
1280 x 1024
1280 x 1024
- 7 -
Page 10
DISASSEMBLY
# 1 # 4
1. Put a soft cushion on the floor and lay the stand on its
side so that the base is accessible.
# 2 # 5
2. Hold the set while folding the latch and take out the stand
base.
# 3 # 6
4. Cover the panel with your hand so that it is not scratched.
Then, pull up the cabinet corner side.
5-1. Disassemble the cabinet.
5-2. Hold the control PCB as shown in the figure and gently
pull it out.
3-1. Push the cover upward and remove it.
3-2. Unscrew the four screws.
6. Push up the back cover as shown in the figure and pull
out the chassis assembly so that the latch is untied.
- 8 -
Page 11
# 7 # 9
7. Push the shield cap upward and disassemble it. 9. Pull out the link cable while pushing up the main frame.
# 8
8. Pull out the cable.
- 9 -
Page 12
M
MST9151
Control Board
J1
J706
J702
J705
Main Board
Power Board
Connector Ass’y :
(Main to Module)
P/N: 6631T11012W
Connector Ass’y :
(Main to LIPS)
P/N: 6631T2000Q
WIRING DIAGRAM
Connector Ass’y :
(Main to Control)
P/N: 6631T20024C
- 10 -
Page 13
BLOCK DIAGRAM
Micom
MTV312
LCD Module
differential
5V
5V 5V
Diode
KDS184
3.3V
Reg.
D-SUB
including
MST9111B
R,G,B, H/V Sync
(ADC/LVDS/SCALER )
V
2.5
2.5V
3.3V
5V
LIPS
12V
3.3V
- 11 -
AC Input
Page 14
DESCRIPTION OF BLOCK DIAGRAM
1. Video Controller Part.
This part amplifies the level of video signal for the digital conversion and converts from the analog video signal
to the digital video signal using a pixel clock.
The pixel clock for each mode is generated by the PLL.
The range of the pixel clock is from 25MHz to 135MHz.
This part consists of the Scaler, ADC, LVDS transmitter.
The Scaler gets the video signal converted analog to digital, interpolates input to 1280 X 1024 resolution signal
and outputs 8-bit R, G, B signal to transmitter.
2. Power Part.
This part consists of the one 3.3V, and one 1.8V regulators to convert power which is provided 5V in Power board.
12V is provided for inverter, 5V is provided for LCD panel and 5V for micom.
Also, 5V is converted 3.3V and 1.8V by regulator. Converted power is provided for IC in the main board.
The inverter converts from DC12V to AC 600Vrms and operates back-light lamps of module.
3. MICOM Part.
This part consists of EEPROM IC which stores control data, Reset IC and the Micom.
The Micom distinguishes polarity and frequency of the H/V sync are supplied from signal cable.
The controlled data of each modes is stored in EEPROM.
- 12 -
Page 15
LIPS Board Block Diagram
50 ~ 60Hz
LINE
100 ~ 240V
EMI
COMPONENTS
PRIMARY SECONDARY
INPUT RECTIFIER
AND FILTER
PWM
CONTROL
CIRCUIT
HVDC
ENERGY
TRANSFER
PHOTO-
COUPLER
ISOLATION
Operation description_LIPS
100KHz
OUTPUT RECTIFIER
AND FILTER
SIGNAL
COLLECTI
ON
12V
5V
GND
1. EMI components.
This part contains of EMI components to comply with global marketing EMI standards like FCC,VCCI CISPR,
the circuit included a line-filter, across line capacitor and of course the primary protection fuse.
2. Input rectifier and filter.
This part function is for transfer the input AC voltage to a DC voltage through a bridge rectifier and a bulk capacitor.
3. Energy Transfer.
This part function is for transfer the primary energy to secondary through a power transformer.
4. Output rectifier and filter.
This part function is to make a pulse width modulation control and to provide the driver signal to power switch,to
adjust the duty cycle during different AC input and output loading condition to achieve the dc output stabilized, and
also the over power protection is also monitor by this part.
5. Photo-Coupler isolation.
This part function is to feed back the dc output changing status through a photo transistor to primary controller to
achieve the stabilized dc output voltage.
6. Signal collection.
This part function is to collect the any change from the dc output and feed back to the primary through photo
transistor
- 13 -
Page 16
ADJUSTMENT
Windows EDID V1.0 User Manual
Operating System: MS Windows 98, 2000, XP
Port Setup: Windows 98 => Don’t need setup
Windows 2000, XP => Need to Port Setup.
This program is available to LCD Monitor only.
1. Port Setup
a) Copy “UserPort.sys” file to
“c:\WINNT\system32\drivers” folder
b) Run Userport.exe
c) Remove all default number
d) Add 300-3FF
2. EDID Read & Write
1) Run WinEDID.exe
2) Edit Week of Manufacture, Year of Manufacture,
Serial Number
a) Input User Info Data
b) Click “Update” button
c) Click “ Write” button
e) Click Start button.
f) Click Exit button.
- 14 -
Page 17
220
IBM
Compatible PC
PARALLEL PORT
Power inlet (required)
Power LED
ST Switch
Power Select Switch
(110V/220V)
Control Line
Not used
RS232C
PARALLEL
V-SYNC
POWER
ST
VGS
MONITOR
E
E
V-Sync On/Off Switch
(Switch must be ON.)
F
F
A
A
B
B
C
C
15
10
5
5
69
1
1
1
14
13
25
6
5V
5V
5V
4.7K
4.7K
4.7K
74LS06
74LS06
OFF ON
OFF
ON
11
Video Signal
Generator
SERVICE OSD
1)Turn off the power switch at the front side of display.
2)Press MENU, POWER Switch.
3)Shows the service OSD menu.
4)The service OSD menu contains additional menus that the User OSD menu as described below.
a) CLEAR ETI : To initialize using time.
b) AUTO COLOR : W/B balance and Automatically sets the gain and offset value.
c) AGING :Select Aging mode(on/off).
d) PANEL : Select using panel.
e) NVRAM INIT : EEPROM initialize(24C08).
f) 9300 : Allows you to set the R/G/B.-9300K value manually.
g) 6500 :Allows you to set the R/G/B.-6500K value manually.
h) OFFSET : Allows you to set the R/G/B.-Offset value manually.(Analog Only)
i) GAIN : Allows you to set the R/G/B.-Gain value manually.(Analog Only)
Figure 1. Cable Connection
- 15 -
Page 18
TROUBLESHOOTING GUIDE
NO POWER
(POWER INDICATOR OFF)
1. NO POWER
1
1
2
CHECK J705 VOLTAGE
PIN5, PIN6 (5V)?
YES
CHECK
U501 PIN 8 Voltage
(5V) ?
YES
CHECK KEY CONTROL
CONNECTOR ROUTINE
YES
IS U201
PIN114 (3.3V)
VOLTAGE ?
YES
CHECK U201 PIN 122
PULSE
YES
NO
NO
NO
NO
CHECK POWER BOARD, AND
FIND OUT A SHORT POINT
AS OPENING
EACH POWER LINE
CHECK 5VS LINE
(OPEN CHECK)
NO PROBLEM
CHECK 3.3V LINE
CHECK X-TAL
CHECK U201
Waveforms
1 2
J705-#5, 6 / U501-#8 U201-#122
- 16 -
Page 19
2. NO RASTER (OSD IS NOT DISPLAYED) – LIPS
NO RASTER
(OSD IS NOT DISPLAYED)
PIN5, PIN6
3
J705 PIN9
MORE THAN 3V?
J705 PIN10
PULSE AS
CONTACTING SCOPE
PROBE TO CAUTION LABEL.
(CONTACT PROBE TO
CAUTION LABEL.
CAN YOU SEE PULSE
AT YOUR
J705
5V?
YES
YES
5V?
YES
CHECK
SCOPE?
YES
NO
NO
NO
NO
CHECK LIPS
CHECK MICOM INV ON/OFF
PORT.
1. CONFIRM BRIGHTNESS
OSD CONTRL STATE.
2. CHECK MICOM DIM-ADJ
PORT
LIPS
REPLACE CCFL LAMP
IN THE LCD MODULE
Waveforms
3 3
J705-#9 J705-#9
- 17 -
Page 20
3. NO RASTER (OSD IS NOT DISPLAYED) – MST9111B
NO RASTER
(OSD IS NOT DISPLAYED)
U201
POWER PIN8, 114
3.3V?
YES
U201
4
5
PIN122, 123
OSCILLATE AS
12MHZ?
YES
U501
PIN43 IS 48KHz H-SYNC?
PIN44 IS 60Hz V-SYNC?
IS PULSE APPEARED
AT SIGNAL PINS?
AT MODE 12?
YES
TROUBLE IN CABLE
OR LCD MODULE
NO
NO
NO
CHECK U801
1. CHECK PIN122, 123
SOLDERING CONDITION
2. CHECK X501
3. TROUBLE IN U201
CHECK CONNECTION LINE
FROM D-SUB TO U501
Waveforms
4 5
U201-#122, 123 U501-#43 H-SYNC
- 18 -
5
U501-#44 V-SYNC
Page 21
TROUBLE IN DPM
4. TROUBLE IN DPM
6
CHECK
R773, R775(SYNC) ?
YES
CHECK
U501 PIN 43.44
SYNC PULSE ?
YES
TROUBLE IN U501
NO
NO
CHECK PC
PC IS NOT GOING
INTO DPM OFF MODE
CHECK H/V SYNC LINE
6
R773 H-Sync
Waveforms
6
R775 V_Sync
- 19 -
Page 22
040
140
100
130
050
120
030
EXPLODED VIEW
010
070
020
070
060
110
090
080
- 20 -
Page 23
EXPLODED VIEW PARTS LIST
Ref. No.
010
020
030
040
050
060
070
080
090
100
110
Part No.
3091TKL125G CABINET ASSEMBLY L1930SQ BRAND L094 SLIVER A-CKD
6304FLP142A
3809TKL078C BACK COVER ASSEMBLY, L1930S .. ""A""-CKD"
3043TKK147N TILT SWIVEL ASSEMBLY, L1730 , ""E""-WA LOCAL"
3043TKK147K TILT SWIVEL ASSEMBLY, 1930S NT LOCAL -FOR CHINA
3043TKK204E TILT SWIVEL ASSEMBLY, L1930 , SLIVER ""145M""-WA LOCAL"
3043TKK145X TILT SWIVEL ASSEMBLY, 1930S SILVER -NT LOCAL
4951TKS145S METAL ASSEMBLY, FRAME TN(""Q""-CKD)"
4814TKK268B SHIELD,INVERTER ""A""-CKD"
6871TPT271Y
6871TPT271P
3313TL9063A MAIN TOTAL ASSEMBLY, L1930SQM BRAND CL-64
6631T11012W CONNECTOR ASSEMBLY, 30P H-H 200MM UL20276 LG708G
6871TST541A PWB(PCB) ASSEMBLY,SUB, L1730BM CONTROL TOTAL BRAND CONTROL
LCD(LIQUID CRYSTAL DISPLAY), LM190E03-B4K1 LG PHILPS TFT COLOR 20T,TN,250NITS,SXGA,LVDS
PWB(PCB) ASSEMBLY, POWER, M-CHASSIS 1719 POWER TOTAL LIEN CHANG SOCKET,2PIN,CY101/2 1000PF 450V
PWB(PCB) ASSEMBLY,POWER, M-CHASSIS 1719 POWER TOTAL LIEN CHANG SOCKET,2PIN,CY101/2 1000PF
Description
120
130
140
3550TKK512D COVER, L1930S BACK DOOR ""B""-CKD"
3550TKK452D COVER, LXX30 STAND REAR COVER_""B""-CKD"
6850TD9007C
CABLE,D-SUB, UL20276-9C(5.8MM) DT L1800MM, CORE POS400MM BLACK(9930) L1730 DM
- 21 -
Page 24
REPLACEMENT PARTS LIST
CAUTION: BEFORE REPLACING ANY OF THESE COMPONENTS,
READ CAREFULLY THE SAFETY PRECAUTIONS IN THIS MANUAL.
* NOTE : S SAFETY Mark
AL ALTERNATIVE PARTS
DATE: 2004. 08. 23.
*S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION
MAIN BOARD
CAPACITORS
C204 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C205 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C206 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C207 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C208 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C209 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C210 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C211 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C214 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C215 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C216 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C217 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C218 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C219 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C220 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C221 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C222 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C223 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C225 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C226 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C227 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C230 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C231 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C232 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C233 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C240 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C251 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C501 0CC101CK41A 100PF 1608 50V 5% R/TP NP0
C502 0CC101CK41A 100PF 1608 50V 5% R/TP NP0
C503 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C504 0CH8106F611 10UF 16V M 85STD(CYL) R/TP
C506 0CC030CK01A 3PF 1608 50V 0.25 PF R/TP NP0
C507 0CC180CK41A 18PF 1608 50V 5% R/TP NP0
C508 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C701 0CK105CD56A 1UF 1608 10V 10% R/TP X7R
C703 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C708 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y5
C709 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y5
C710 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y5
C711 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y5
C717 0CC101CK41A 100PF 1608 50V 5% R/TP NP0
C718 0CC101CK41A 100PF 1608 50V 5% R/TP NP0
C719 0CC680CK41A 68PF 1608 50V 5% R/TP NP0
C720 0CC101CK41A 100PF 1608 50V 5% R/TP NP0
C721 0CC680CK41A 68PF 1608 50V 5% R/TP NP0
C727 0CK105CD56A 1UF 1608 10V 10% R/TP X7R
C732 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y5
C733 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C734 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C735 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C760 0CE107EF610 "100UF KMG,RD 16V 20% FL BULK"
C801 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y5
DATE: 2004. 08. 23.
*S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION
C803 0CE107EF610 "100UF KMG,RD 16V 20% FL BULK"
C804 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C805 0CK105CD56A 1UF 1608 10V 10% R/TP X7R
C806 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y5
C807 0CE107EF610 "100UF KMG,RD 16V 20% FL BULK"
C808 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C809 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y5
C810 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C812 0CE107EF610 "100UF KMG,RD 16V 20% FL BULK"
C814 0CE107EF610 "100UF KMG,RD 16V 20% FL BULK"
C815 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C816 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y5
C817 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C818 0CC102CK41A 1000PF 1608 50V 5% R/TP NP0
DIODEs
D701 0DS226009AA KDS226 TP KEC SOT-23 80V 300
D702 0DS226009AA KDS226 TP KEC SOT-23 80V 300
D706 0DS226009AA KDS226 TP KEC SOT-23 80V 300
D804 0DD184009AA KDS184 TP KEC - 85V - - - 300
D805 0DD184009AA KDS184 TP KEC - 85V - - - 300
ZD701 0DZ560009GB BZT52C5V6S DIODES R/TP SOD323
ZD702 0DZ560009GB BZT52C5V6S DIODES R/TP SOD323
ZD703 0DZ560009GB BZT52C5V6S DIODES R/TP SOD323
ZD704 0DZ560009GB BZT52C5V6S DIODES R/TP SOD323
ZD705 0DZ560009GB BZT52C5V6S DIODES R/TP SOD323
ZD711 0DZ560009GB BZT52C5V6S DIODES R/TP SOD323
ICs
U201 0IPRPM3008B "MST9111B(ANALOG) MSTAR 128P,L"
U501 0IZZTSZ550A MYSON MTV312 L1930SQM -E
U502 0ISG240860B M24C08W6 SGS-THOMSON 8SOP R/T
U801 0IPMGKE011A KIA78D33F KEC DPAK R/TP 3.3V
U802 0TFVI80023A VISHAY SI3865DV R/TP TSOP-6 8
TRANSISTOR
Q502 0IKE704200H KIA7042AP TO-92 TP 4.2 VOLT.
Q503 0TR390409AE FAIRCHILD KST3904(LGEMTF) TP
Q504 0TR390409AE FAIRCHILD KST3904(LGEMTF) TP
Q505 0TR390409AE FAIRCHILD KST3904(LGEMTF) TP
Q703 0TR390609FA KST3906-MTF TP SAMSUNG SOT23
Q704 0TR390609FA KST3906-MTF TP SAMSUNG SOT23
Q706 0TR390409AE FAIRCHILD KST3904(LGEMTF) TP
Q707 0TR390409AE FAIRCHILD KST3904(LGEMTF) TP
RESISTORs
R201 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TP
R202 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TP
R203 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TP
R207 0RJ3900D677 390 OHM 1/10 W 5% 1608 R/TP
- 22 -
Page 25
DATE: 2004. 08. 23.
*S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION
DATE: 2004. 08. 23.
*S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION
R208 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TP
R209 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TP
R210 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TP
R213 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP
R214 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP
R220 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R240 0RJ1001D677 1K OHM 1/10 W 5% 1608 R/TP
R506 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R508 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R512 0RJ0332D677 33 OHM 1/10 W 5% 1608 R/TP
R513 0RJ0332D677 33 OHM 1/10 W 5% 1608 R/TP
R514 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R515 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R516 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R518 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R519 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP
R520 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R521 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R522 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R523 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R524 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP
R525 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP
R526 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP
R527 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP
R528 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP
R529 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP
R531 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP
R532 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP
R534 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP
R535 0RJ3301D677 3.3K OHM 1/10 W 5% 1608 R/TP
R537 0RJ3301D677 3.3K OHM 1/10 W 5% 1608 R/TP
R541 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP
R542 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP
R543 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R544 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R545 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/TP
R546 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP
R547 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/TP
R548 0RJ0332D677 33 OHM 1/10 W 5% 1608 R/TP
R549 0RJ0332D677 33 OHM 1/10 W 5% 1608 R/TP
R555 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP
R556 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/TP
R557 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP
R560 0RJ4702D677 47000 OHM 1/10 W 5% 1608 R/TP
R561 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R563 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP
R564 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP
R565 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP
R566 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP
R701 0RJ0752D677 75 OHM 1/10 W 5% 1608 R/TP
R703 0RJ0752D677 75 OHM 1/10 W 5% 1608 R/TP
R706 0RJ0752D677 75 OHM 1/10 W 5% 1608 R/TP
R708 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/TP
R709 0RJ1001D677 1K OHM 1/10 W 5% 1608 R/TP
R716 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R717 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R720 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP
R722 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP
R723 0RJ0332D677 33 OHM 1/10 W 5% 1608 R/TP
R724 0RJ0332D677 33 OHM 1/10 W 5% 1608 R/TP
R726 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP
R727 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP
R737 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP
R744 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R745 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R747 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R748 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R769 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP
R772 0RJ1001D677 1K OHM 1/10 W 5% 1608 R/TP
R773 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R774 0RJ1001D677 1K OHM 1/10 W 5% 1608 R/TP
R775 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R779 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TP
R780 0RJ2001D677 2K OHM 1/10 W 5% 1608 R/TP
R781 0RJ2001D677 2K OHM 1/10 W 5% 1608 R/TP
R782 0RJ0102D677 10 OHM 1/10 W 5% 1608 R/TP
R783 0RJ0102D677 10 OHM 1/10 W 5% 1608 R/TP
R803 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP
R807 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP
R808 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP
R810 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP
R814 0RJ2202D677 22K OHM 1/10 W 5% 1608 R/TP
R815 0RJ5600D677 560 OHM 1/10 W 5% 1608 R/TP
R821 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP
R822 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP
R824 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP
OTHERs
X501 6212AA2004A HC-49U TXC 12.0MHZ +/- 30 PPM
CONTROL BOARD
C1 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C2 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
LED1 0DLLT0340AA LITEON LTL-14CDJNHBP1 BK GREE
Q1 0TR390409AE FAIRCHILD KST3904(LGEMTF) TP
Q2 0TR390409AE FAIRCHILD KST3904(LGEMTF) TP
R1 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R2 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R3 0RJ2001D677 2K OHM 1/10 W 5% 1608 R/TP
R4 0RJ2001D677 2K OHM 1/10 W 5% 1608 R/TP
R5 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R7 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/TP
R8 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/TP
SW2 140-058E SKHV10910B LGEC NON 12V 20A H
SW3 140-058E SKHV10910B LGEC NON 12V 20A H
SW6 140-058E SKHV10910B LGEC NON 12V 20A H
SW7 140-058E SKHV10910B LGEC NON 12V 20A H
SW8 140-058E SKHV10910B LGEC NON 12V 20A H
- 23 -
Page 26
SCHEMATIC DIAGRAM
- 24 -
1. SCALER
1
1
2
1
U201-#33#30#28_RGB
2
U201-#122
Page 27
- 25 -
2. MICOM
2
3
4
5
3
U501-#17~#22
4
U501-#11, #12
5
Q505-#3
6
U502-#5, #6
6
Page 28
- 26 -
3. POWER
3
Page 29
- 27 -
4. CONNECTOR & JACKS
4
8
7
7
J705-5V:#5, #6 / 12V:#1, #2
8
J703-#5
8
J703-#5
Page 30
Aug 2004
P/NO : 3828TSL085D Printed in Korea
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