LG KC560 Service Manual

Service Manual

Model : KC560

Service Manual

KC560

Date: November, 2008 / Issue 1.0

Internal Use Only

REVISED HISTORY

J

Editor Date Issue Contents of Changes S/W Version

.G.PARK 6/02 0.1

* The information in this manual is subject to change without notice and should not be construed as a commitment by LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes to equipment design as advances in engineering and manufacturing methods warrant.

This manual provides the information necessary to install, program, operate and

maintain the KC560.

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LGE Internal Use Only

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Only for training and service purposes

Table Of Contents

1. INTRODUCTION ...............................................9

1.1 Purpose ......................................................................9

1.2 Regulatory Information .................................................9

2. PERFORMANCE .............................................11

2.1 H/W Feature..............................................................11

2.2 Technical speciﬁ cation ...............................................13

3. TECHNICAL BRIEF .........................................19

3.1 KC560 Functional Block diagram ...............................19

3.2 Baseband Processor (BBP) Introduction ......................20

3.3 Power management IC...............................................29

3.4 Power ON/OFF ..........................................................34

3.5 SIM & uSD interface ..................................................35

3.6 Memory ....................................................................37

3.7 LCD Display ..............................................................38

3.8 Keypad Switching & Scanning ....................................39

3.9 Keypad back-light illumination ....................................40

3.10 LCD back-light illumination ......................................41

3.11 ALC ........................................................................42

3.12 Battery current consumption monitor ........................43

3.13 JTAG & ETM interface connector ..............................43

3.14 Audio ......................................................................44

3.15 charging circuit .......................................................45

3.16 FM radio & BLUETOOTH...........................................46

3.17 18pin Multi Media Interface connector ......................49

3.18 General Description .................................................50

3.19 Receiver part ...........................................................52

3.20 Transmitter part .......................................................52

3.21 RF synthesizer .........................................................53

3.22 DCXO .....................................................................53

3.23 Front End Module control .........................................54

3.24 Power Ampliﬁ er Module ...........................................54

3.25 Mode Selection .......................................................55

3.26 PAM Schematic .......................................................56

4. PCB layout .................................................... 57

4.1 Main & Sub PCB component placement ......................57

5.3 Charging trouble........................................................65

5.4 LCD display trouble ...................................................67

5.5 Camera Trouble .........................................................69

5.6 Receiver & Speaker trouble ........................................71

5.7 Microphone trouble ...................................................73

5.8 Vibrator trouble ..........................................................74

5.9 Keypad back light trouble ...........................................75

5.10 SIM & uSD trouble ...................................................76

5.11 Photo sensor trouble ................................................79

5.12 RGB LED trouble ......................................................80

5.13 Trouble Shooting of Receiver Part .............................81

5.14 Trouble Shooting of Transmitter Part .........................87

6. Multi-Download ........................................... 96

7. BLOCK DIAGRAM ........................................ 100

8. CIRCUIT DIAGRAM ...................................... 101

9. BGA Pin Map .............................................. 109

10. PCB LAYOUT .............................................111

11. RF Calibration .......................................... 121

11.1 Test Equipment Setup ............................................121

11.2 Calibration Step .....................................................121

12. STAND-ALONE TEST ................................. 126

12.1 Test Program Setting .............................................126

12.2 Tx Test ..................................................................128

12.3 Rx Test ..................................................................129

13. ENGINEERING MODE .................................131

14. EXPLODED VIEW & REPLACEMENT

PART LIST ................................................. 133

14.1 EXPLODED VIEW ...................................................133

14.2 Replacement Parts ................................................135

14.3 Accessory .............................................................157

5. TROUBLE SHOOTING ..................................... 61

5.1 Trouble shooting test setup ........................................61

5.2 Power on Trouble .......................................................62

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LGE Internal Use Only

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Only for training and service purposes

ABBREVIATION

G

G G G G G GG

For the purposes of this manual, following abbreviations apply:

APC Automatic Power Control BB Baseband BER Bit Error Ratio CC-CV Constant Current – Constant Voltage CLA Cigar Lighter Adapter DAC Digital to Analog Converter DCS Digital Communication System dBm dB relative to 1 milli-watt DSP Digital Signal Processing EEPROM Electrical Erasable Programmable Read-Only Memory

EGPRS EL Electroluminescence ESD Electrostatic Discharge FPCB Flexible Printed Circuit Board GMSK Gaussian Minimum Shift Keying GPIB General Purpose Interface Bus GPRS General Packet Radio Service GSM Global System for Mobile Communications IPUI International Portable User Identity IF Intermediate Frequency LCD Liquid Crystal Display LDO Low Drop Output LED Light Emitting Diode LGE LG Electronics OPLL Offset Phase Locked Loop PAM Power Amplifier Module PCB Printed Circuit Board PGA Programmable Gain Amplifier PLL Phase Locked Loop PSTN Public Switc hed Te lephone Network RF Radio Frequency RLR Receiving Loudness Rating RMS Root Mean Square RTC Real Time Clock SAW Surface Acoustic Wave SIM Subscriber Identity Module SLR Sending Loudness Rating

lGnGwGyGzG

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LGE Internal Use Only

SRAM Static Random Access Memory STMR Side Tone Masking Rating TA Travel Adapter TDD Time Division Duplex TDMA Time Division Multiple Access UART Universal Asynchronous Receiver/Transmitter VCO Voltage Controlled Oscillator

DCXO Digitally Controlled Crystal Oscillator

WAP Wireless Application Protocol

8PSK 8 Phase Shift Keying

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Only for training and service purposes

1. INTRODUCTION

1.1. Purpose

This manual provides the information necessary to repair, calibration, description and

download the features of the

1.2. Regulatory Information

1.2.1. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges you’re your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. LGE does not warrant that this product is immune from the above case but will prevent unauthorized use of common-carrier telecommunication service of facilities accessed through or connected to it. LGE will not be responsible for any charges that result from such unauthorized use.

KC560.

1.2.2. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.

1.2.3. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.

KC560 or compatibility

1.2.4. Maintenance Limitations

Maintenance limitations on the KC560 must be performed only at the LGE or its authorized agents. The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.

1.2.5. Notice of Radiated Emissions

The KC560 complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.

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LGE Internal Use Only

1. INTRODUCTION

1.2.6. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look

slightly different.

1.2.7. Interference and Attenuation

The KC560 may interfere with sensitive laboratory equipment, medical equipment, etc.

Interference from unsuppressed engines or electric motors may cause problems.

1.2.8. Electrostatic Sensitive Devices

ATTENTION

Boards, which contains Electrostatic Sensitive Device(ESD), are indicated by the sign. Following information is ESD handling: Service personnel shou ld ground themselves by using a wrist strap when exchange system boards. When repairs are made to a system b oard, they should spread the floor with anti-static mat which is also grounded. Use a suitable, grounded soldering iron . Keep sensitive parts in these protective packages until these are used. When returning system boards or parts such as EEPROM to the factory, use the protective package as described.

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Only for training and service purposes

2. PERFORMANCE

2.1 H/W Feature

Item Feature Comment

Form Factor

2. PERFORMANCE

Slide

Battery

Size Standard :

Weight TBD With Battery

Volume ??cc

PCB Staggered 10Layers , 0.8t

Stand by time 250 hrs @ Paging Period 9

Charging time 3 hrs @ Power Off / 900mAh

Talk time Min : 3.0 hrs @ Power Level 7 @ EGSM / 900mAh

RX sensitivity EGSM : -105 dBm

TX output power

GPRS compatibility GPRS Class 10

EDGE compatibility EDGE Class 10

SIM card type Plug-In SIM

GSM/ GPRS

EDGE EGSM : 26 dBm

1) Capacity Standard : Li-Ion, 900mAh

2) Packing Type : Soft Pack

103.8 X 51.4 X 14.9 mm

DCS 1800 : -105 dBm PCS 1900 : -105 dBm

EGSM : 32.7 dBm DCS 1800 : 31dBm PCS 1900 : 30 dBm

DCS 1800 : 25 dBm PCS 1900 : 25 dBm

3V /1.8V

Class4 (EGSM) Class1 (PCS) Class1 (DCS)

E2 (EGSM) E2 (PCS) E2 (DCS)

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LGE Internal Use Only

2. PERFORMANCE

Display 1. Main LCD

2. 262K Color TFT (320 x 240) Backlight : White LED

Built-in Camera

Status Indicator Keypad Alphanumeric Key : 12

ANT Main : Internal Fixed Type System connector 18 Pin Ear Phone Jack 18pin, Stereo PC synchronization Yes Memory NAND Flash : 1Gbit

Speech coding FR, EFR, HR,AMR Data & Fax Built in Data & Fax support Vibrator Built in Vibrator Blue Tooth V2.1 MIDI(for Buzzer

Function) Music Player MP3/ WMA/AAC/AAC+/AAC++ With Graphic EQ Video Player MPEG4, H.263,

3M CMOS Camera (QXGA) One button access None

Function Key: Function Key : 10 Side Key : 4 Total No of Keys :26

SDRAM : 512Mbit

64Poly , MP3 ringtone

4 Key Navigation, OK, F1, F2, CLR,

SND, END

Side Key :

Jog wheel, CAM, Task

Camcorder MPEG4, H.263, Voice Recording Yes

Speaker Phone mode Support Travel Adapter Y es CDROM No Stereo Headset Yes Data Cable No T-Flash(External Memory) No

Yes

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Only for training and service purposes

2.2 Technical specification

Item Description Specification

GSM900

1) PGSM TX: 890 + 0.2 x n MHz RX: 935 + 0.2 x n MHz ( n = 1 ~ 124 )

2) EGSM TX: 890 + 0.2 x (n-1024) MHz

1 Frequency Band

2 Phase Error 3 Frequency Error < 0.1ppm

4 Power Level

5 Output RF Spectrum

( due to modulation)

RX: 935 + 0.2 x (n-1024) MHz ( n = 975 ~ 1023 )

DCS1800

TX: 1710.2 + 0.2 x (n-512) MHz RX: 1805.2 + 0.2 x (n-512) MHz (n = 512 ∼ 885)

PCS1900

TX: 1850 + ( n-511 ) × 0.2 MHz RX: 1930 + ( n-511 ) × 0.2 MHz (n = 512 ∼ 810)

RMS < 5 degrees, Peak < 20 degrees

GSM900 Level Power Toler. Level Power Toler. 5 33 dBm –2dB 13 17 dBm –3dB 6 31 dBm –3dB 14 15 dBm –3dB 7 29 dBm –3dB 15 13 dBm –3dB 8 27 dBm –3dB 16 11 dBm –5dB 9 25 dBm –3dB 17 9 dBm –5dB 10 23 dBm –3dB 18 7 dBm –5dB 11 21 dBm –3dB 19 5 dBm –5dB 12 19 dBm –3dB DCS / PCS Level Power Toler. Level Power Toler. 0 30 dBm –2dB 8 14 dBm –3dB 1 28 dBm –3dB 9 12 dBm –4dB 2 26 dBm –3dB 10 10 dBm –4dB 3 24 dBm –3dB 11 8 dBm –4dB 4 22 dBm –3dB 12 6 dBm –4dB 5 20 dBm –3dB 13 4 dBm –4dB 6 18 dBm –3dB 14 2 dBm –5dB 7 16 dBm –3dB 15 0 dBm –5dB

GSM900 Offset from Carrier (kHz). Max. dBc 100 +0.5 200 -30

2. PERFORMANCE

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LGE Internal Use Only

2. PERFORMANCE

6

7 Spurious Emissions

8 Bit Error Ratio

9 Rx Level Report accuracy

10 SLR

11 Sending Response

Output RF Spectrum (due to switching)

250 -33 400 -60 600 ~ 1,200 -60 1,200 ~ 1,800 -60 1,800 ~ 3,000 -63 3,000 ~ 6,000 -65 6,000 -71 DCS / PCS Offset from Carrier (kHz). Max. dBc 100 +0.5 200 -30 250 -33 400 -60 600 ~ 1,200 -60 1,200 ~ 1,800 -60 1,800 ~ 3,000 -65 3,000 ~ 6,000 -65 6,000 -73 GSM900 Offset from Carrier (kHz) Max. (dBm) 400 -19 600 -21 1,200 -21 1,800 -24 DCS / PCS Offset from Carrier (kHz) Max. (dBm) 400 -22 600 -24 1,200 -24 1,800 -27 Conduction, Emission Status

Conduction, Emission Status GSM900

BER (Class II) < 2.439% @-102dBm

DCS / PCS

BER (Class II) < 2.439% @-102dBm ± 3 dB 8 ± 3 dB Frequency (Hz) Max.(dB) Min.(dB) 100 -12 / 200 0 /

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Only for training and service purposes

300 0 -12 1,000 0 -6 2,000 4 -6 3,000 4 -6 3,400 4 -9 4,000 0 /

12 RLR

13 Receiving Response

14 STMR > 17 dB 15 Echo Loss > 44 dB

16 Idle Noise Sending < -64 dBm0p

17 Idle Noise Receiving < -54 dBm0p

2 ± 3 dB

Frequency (Hz) Max.(dB) Min.(dB) 100 -6 / 200 2 / 300 2 -9 1,000 2 -7 3,400 2 -12 4,000 2

2. PERFORMANCE

<Change> System

18

19

20 Power consumption

21 Talk Time

22 Standby Time

23 Ringer Volume

24 Charge Voltage Fast Charge : < 500 mA

frequency

(13 MHz) tolerance

<Change>32.768KHz tolerance

≤ 2.5ppm

≤ 30ppm

Full power

< 340mA (GSM900) ; < 260mA (DCS / PCS)

Standby

- Normal Mode ≤ 4.0mA(Max. power)

- Using Test mode on DSP Sleep function ≤ 6mA GSM900/Level7 (Battery 900mA):230 Min GSM900/Level12(Battery 900mA):390 Min PCS1800/Level5 (Battery 900mA):340 Min PCS1800/Level10(Battery 900mA):430 Min Under conditions, at least 250 hours: Brand new and full 900mAh battery

Full charge, no receive/send and keep GSM in the mode. Broadcast set off. Signal strength display set at 3 level above. Backlight of phone set off.

At least 55 dB under below conditions:

1. Ringer set as ringer.

2. Test distance set as 1 m

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LGE Internal Use Only

2. PERFORMANCE

Slow Charge: < 120 mA

Antenna Bar Number Power

25 Antenna Display

26 Battery Indicator

27 Low Voltage Warning

28 Forced shut down Voltage

29 Battery Type

7->5 5->4 4->2 2->1 1->0

-93¡ 3dBm

-98¡ 3dBm

-101¡ 3dBm

-104¡ 3dBm

-106¡ 3dBm

Battery Bar Number Voltage

Cut Off 3.20V ~ 3.30V (3.25V)

1->Blinking 3.50V ~ 3.60V (3.55V)

2->1 3.58V ~ 3.68V (3.63V) 3->2 3.68V ~ 3.78V (3.73V)

3 ~ 4.20V

Call, Blinking Voltage 3.52V ~ 3.62V (3.57V)

3.57 ¡ 0.05 V (Call / Warning tone once per one minutes)

3.55 ¡ 0.05 V (Standby /

Warning tone once per three minutes)

3.25 ¡ 0.05 V

Li-Ion Battery, Soft pack, Standard Voltage = 3.7 V Battery full charge voltage = 4.2 V, Capacity: 900mAh

30 Travel Charger

Switching-mode charger Input: 100 ∼ 240 V , 50/60H z Out put: 5.1V, 700mA

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Only for training and service purposes

p(p )

EDGE RF Speciﬁ cation (Option: is not serviced for ”EDGE mode”)

Item Description Specification

1 RMS EVM 9% 2 Peak EVM 30% 3 95th Percentile EVM 15% 4 Origin Offset Suppression 30dB

GSM900/EGSM

Level Power Toler. Level Power Toler.

5 26dBm –3dB 13 17dBm –3dB 6 26dBm –3dB 14 15dBm –3dB 7 26dBm –3dB 15 13dBm –3dB 8 25dBm –3dB 16 11dBm –5dB

9 25dBm –3dB 17 9dBm –5dB 10 23dBm –3dB 18 7dBm –5dB 11 21dBm –3dB 19 5dBm –5dB

5 Power Level

6 Output RF Spectrum

(due to modulation)

12 19dBm –3dB

DCS1800, PCS1900

Level Power Toler. Level Power Toler.

0 25/25dBm –3dB 8 14dBm –3dB

1 25/25dBm –3dB 9 12dBm –4dB

2 25/25dBm –3dB 10 10dBm –4dB

3 24dBm –3dB 11 8dBm –4dB

4 22dBm –3dB 12 6dBm –4dB

5 20dBm –3dB 13 4dBm –4dB

6 18dBm –3dB 14 2dBm –5dB

7 16dBm –3dB 15 0dBm –5dB

GSM900/EGSM

Offset from carrier(kHz) Max. dBc 100 +0.5 200 -30 250 -33 400 -54 600~<1,200 -60 1,200~<1,800 -60 1,800~<3,000 -63 3,000~<6,000 -65 6,000 -71

DCS1800, PCS1900

Offset from carrier(kHz) Max. dBc 100 +0.5 200 -30 250 -33 400 -54

2. PERFORMANCE

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LGE Internal Use Only

2. PERFORMANCE

Output RF Spectrum

7

(due to switching transient)

600~<1,200 -60 1,200~<1,800 -60 1,800~<3,000 -63 3,000~<6,000 -65 6,000 -71

GSM900/EGSM

Offset from carrier(kHz) Max. dBm 400 -23 600 -26 1,200 -27 1,800 -30

DCS1800, PCS1900

Offset from carrier(kHz) Max. dBm 400 -23 600 -26 1,200 -27 1,800 -30

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Only for training and service purposes

3. TECHNICAL BRIEF

III-1 Baseband circuit

3.1. KC560 Functional Block diagram.

The functional component arrangement is mentioned below diagram.

3. TECHNICAL BRIEF

Figure 2 KC560 Functional block diagram

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LGE Internal Use Only

3. TECHNICAL BRIEF

3.2. Baseband Processor (BBP) Introduction

Figure 3 Top level block diagram of the S-GOLD3TM (PMB8877)

3.2.1. General Description

S-GOLD3TM is a GSM/EDGE single chip mixed signal Baseband IC containing all analog and digital functionality of a cellular radio. Additionally S-GOLD3 software MIDI, MP3 sound. It is designed as a single chip solution, integrating the digital and mixed signal portions of the base band in 0.09um, 1.2V technology.

The chip will fully support the FR, EFR, HR and AMR-NB vocoding.

S-GOLD3 application (up to class 12) and EGPRS (up to class 12) without additional external hardware.

TM

support multi-slot operation modes HSCSD (up to class 10), GPRS for high speed data

TM

Provides multimedia extensions such as camera,

3.2.2. Block Description

Processing core

ARM926EJ-S 32 bit processor core for controller functions. The ARM926EJ-S includes an MMU, and the Jazelle Java extension for Java acceleration.

- TEAKLite DSP core

ARM-Memory

- 32k Byte Boot ROM on the AHB

- 96k Byte SRAM on the AHB, flexibly usable as program or data RAM

- 16k Byte Cache for Program (internal)

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Only for training and service purposes

3. TECHNICAL BRIEF

- 8k Byte tightly coupled memory for Program(internal)

- 8k Byte Cache for Data(internal)

- 8k Byte tightly coupled memory for Data(internal)

DSP-Memory

- 104K x 16bit Program ROM

- 8k x 16bit Program RAM

- 60k x 16bit Data ROM

- 37k x 16bit Data RAM

- Incremental Redundancy(IR) Memory of 35904 words of 16bit

Shared Memory Block

1.5K x 32bit Shared RAM(dual ported) between controller system and TEAKLite.

Controller Bus system

The processor cores and their peripherals are connected by powerful buses. Multi-layer AHB for connecting the ARM and the other master capable building blocks with the internal and external memories and with the peripheral buses.

Clock system

The clock system allows widely independent selection of frequencies for the essential parts of the S-GOLD3. Thus power consumption and performance can be optimized for each application.

Functional Hardware block

- CPU and DSP Timers

- MOVE coprocessor performing motion estimation for video encoding algorithms (H.263, MPEG-4)

- Programmable PLL with additional phase shifters for system clock generation

- GSM Timer Module that off-loads the CPU from radio channel timing

- GMSK / 8-PSK Modulator according to GSM-standard 05.04 (5/2000)

- GMSK Modulator: gauss-filter with B*T=0.3

- EDGE Modulator: 8PSK-modulation with linearized GMSK-Pulse-Filter

- Hardware accelerators for equalizer and channel decoding.

- Incremental Redundancy memory for EDGE class 12 support

- A5/1, A5/2, A5/3 Cipher unit

- GEA1, GEA2, GEA3 Cipher Unit to support GPRS data transmission

- Advanced static and dynamic power management features including TDMA-Frame

synchronous low power mode and enhanced CPU modes(idle and sleep modes)

- Pulse Number Modulation output for Automatic Frequency Correction(AFC)

- Serial RF Control interface: support of direct conversion RF

- A Universal Serial Interface(USIF) enabling asynchronous (UART) of synchronous (SPI) serial data transmission

- 3 USIF with auto baud detection, hardware flow control and integrated

- A dedicated Fast IrDA Controller supporting IrDAs SIR,MIR and FIR standards

(up to 4Mbps)

- I2C-bus interface (e.g. connection to S/M power)

- A fast display interface supporting serial and parallel interconnection

- An ITU-R BT.656 compatible Camera interface.

- Programmable clock output for a camera

- An multimedia/Secure Digital Card Interface (MMCI/SD:SDIO capable)

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LGE Internal Use Only

3. TECHNICAL BRIEF

3.2.3. External Devices connected to memory interface

Table 1. Memory interface

Device Name Maker Remark

FLASH K5E1H12ACM-D075 Samsung Synchronous / A synchronous DDR K5E1H12ACM-D075 Samsung Synchronous 133MHz LCD

CAMERA C3AA-M197B

IM240DBNCA

3.2.4. RF Interface (T_OUT)

S-Gold3 uses this interface to control RF IC and Per ipherals. 13 signals are provided switch on/off RF ICs Periodically each TDMA frame.

Table 2. RF Interface Spec.

LGIT 16bit access LGIT

8bit data Interface

T_OUT Resource Interconnection Description

T_OUT0 TXON_PA PAM Power on T_OUT1 FE2 FEM control T_OUT2 PA_BAND TX RF band select T_OUT3 FE1 FEM control T_OUT4 Other operation - T_OUT5 Other operation - T_OUT6 PA MODE PAM Mode select

3.2.5. USIF Interface

KC560 have three USIF Drivers as follow :

- USIF1 : Hardware Flow Control / SW upgrade / Calibration

- USIF2 : MON used Rx, Tx and CTS, RTS use BT Interface

- USIF3 : BT Interface

Table 3. USIF Interface Spec. Resource Name Remark

USIF1

USIF1_TXD UART_TX Transmit Data USIF1_RXD UART_RX Receive Data USIF1_CTS USB_SE0_VM USIF1_RTS USB_DAT_VP

USIF2

USIF2_TXD N.C USIF2_RXD N.C USIF2_CTS UART_BT_CTS

USIF2_RTS UART_BT_RTS.

USIF3

USIF3_TXD UART_BT_TX BT Transmit tx USIF3_RXD UART_BT_RX BT Receive rx

,

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Only for training and service purposes

3. TECHNICAL BRIEF

3.2.6. ADC channel

BBP ADC block is composed of 7 external ADC channel. This block operates charging process and other related process by reading battery voltage and other analog values.

Table 4. S-Gold3 ADC channel usage

ADC channel Resource Interconnection Description

M0 BAT_ID Battery temperature measure M1 RF_TEMP RF block temperature measure M2 REMOTE_ADC Remote Control M3 JACK_TYPE Accessory type detect M4 N.C

M5 2V62_VIO PCB revision M6 N.C M7 N.C M8 VSUPPLY Battery supply voltage measure M9 LOAD Current consumption measure M10 N.C

3.2.7. GPIO map

Over a hundred allowable resources, KC560 is using as fo llows except dedicated to SIM and Memory. KC560 GPIO(General Purpose Input/Output) Map, describing application, I/O state, and enable level, is shown in below table

Table 5 S-Gold3 GPIO pin Map

Port Function Net Name Description KEY MATRIX

KP_IN0 KP_IN1 KP_IN2 KP_IN3 KP_IN4 KP_IN5 KP_IN6 KP_OUT0 KP_OUT1 KP_OUT2 KP_OUT3

USIF1

USIF1_RXD USIF1_TXD USIF1_RTS_N USIF1_CTS_N

USIF2

USIF2 _RXD

KP_ROW0 KP_ROW1 KP_ROW2 KP_ROW3 KP_ROW4 KP_ROW5 KP_ROW6 KP_COL0 KP_COL1 KP_COL2 KP_COL3

RXD UART, RS232 Data TXD UART, RS232 Data USB_DAT_VP USB Data USB_SE0_VM USB Data

Not used

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LGE Internal Use Only

3. TECHNICAL BRIEF

USIF2 _TXD USIF2_RTS_N UART_BT_RTS Bluetooth RTS USIF2_CTS_N

USIF3

USIF3 _RXD USIF3 _TXD

CLK

CLK32K GPIO_22

CAMERA I/F

CIF_D0 CIF_D1 CIF_D2 CIF_D3 CIF_D4 CIF_D5 CIF_D6 CIF_D7 CIF_PCLK CIF_HSYNC CIF_VSYNC CLKOUT CIF_PD CIF_RESET

LCD I/F

DIF_D0 DIF_D1 DIF_D2 DIF_D2 LCD data[2] DIF_D3 DIF_D4 DIF_D5 DIF_D6 DIF_D7 DIF_D8 DIF_CS1 DIF_CS2 DIF_CD DIF_WR DIF_RESET1 DIF_RESET2

I2C

I2C_SCL SCL For FM/BT/Amp/Camera I2C_SDA PM_INT (EINT)

SIM I/F

CC_IO CC_CLK

Not used

UART_BT_CTS Bluetooth CTS

UART_BT_RX Bluetooth RX UART_BT_TX Bluetooth TX

CLK32k For FM Radio, BT CLK32K Not used

CIF_D0 Camera DATA[0] CIF_D1 Camera DATA[1] CIF_D2 Camera DATA[2] CIF_D3 Camera DATA[3] CIF_D4 Camera DATA[4] CIF_D5 Camera DATA[5] CIF_D6 Camera DATA[6] CIF_D7 Camera DATA[7] CIF_PCLK Camera pixel clock CIF_HSYNC Camera H sync CIF_VSYNC Camera V sync CIF_MCLK Camera main clock CIF_PD Camera power down(active high) CIF_RESET Camera reset

DIF_D0 LCD data[0] DIF_D1 LCD data[1]

DIF_D3 LCD data[3] DIF_D4 LCD data[4] DIF_D5 LCD data[5] DIF_D6 LCD data[6] DIF_D7 LCD data[7]

Not used DIF_CS MAIN LCD chip select Not used DIF_CD Command Data switch DIF_WR LCD Write DIF_RESET LCD Reset REMOTE_INT

SDA For FM/BT/Amp/Camera PM_INT

SIM_IO SIM CARD I/O SIM_CLK SIM CARD CLOCK

- 24 -

Only for training and service purposes

3. TECHNICAL BRIEF

CC_RST

I2S2

I2S2_CLK0 GPIO_102 I2S2_RX I2S2_TX I2S2_WA0 GPIO_103

External Memory

MMCI_CMD MMCI_DAT[0] MMCI_CLK

IrDA

IrDA_TX IrDA_RX

I2S1

I2S1_CLK0 I2S1_CLK For Bluetooth EINT_0 I2S1_RX I2S1_TX I2S1_WA0 I2S1_WA0 For Bluetooth

External Memory

MMCI_DAT[1] MMCI_DAT[2] MMCI_DAT[3]

Audio I/F

EPN1 EPP1 EPPA1 EPREF EPPA2 MICN1 MAIN_MIC_N For Mic MICP1 MICN2 MICP2 VMICP VMICN

ADC

M0 M1 M2 M3 M7 M8 M9 M10

SIM_RST SIM CARD RESET

_EO C _EO C

LCD_ID LCD_ID _PPR _PPR BT_INT BT_INT Not used Not used

Key_EN Key_EN

MMC_CMD T-flash MMC_DAT(0) T-flash MMC_CLK T-flash

USB_OEn USB_OEn SLIDE_OPEN SLIDE_OPEN

MMC_DETECT MMC_DETECT I2S1_RX For Bluetooth I2S1_TX For Bluetooth

MMC_DAT(1) T-flash MMC_DAT(2) T-flash MMC_DAT(3) T-flash

RCV_N For Receiver RCV_P For Receiver BBP_SND_L For Speaker Reference BBP_SND_R For Speaker

MAIN_MIC_P For Mic HS_MIC_N For Headset Mic HS_MIC_N For Headset Mic VMIC_P Power for MIC VMIC_N Power for MIC

BAT_ID Battery temperature measure RF_TEMP RF block temperature measure REMOTE_ADC Remote Control JACK_TYPE Accessory type detect H/W VERSION S-Gold H/W version detect VSUPPLY Battery supply voltage measure LOAD Current consumption measure N.C

- 25 -

LGE Internal Use Only

3. TECHNICAL BRIEF

Reference

VREF IREF

JTAG I/F

TDO TDI TMS TCK TRST_n RTCK

ETM I/F

TRIG_IN MON1 MON2 TRACESYNC TRACECLK PIPESTAT[2] PIPESTAT[1] PIPESTAT[0] TRACEPKT[0] TRACEPKT[1] TRACEPKT[2] TRACEPKT[3] TRACEPKT[4] TRACEPKT[5] TRACEPKT[6] TRACEPKT[7]

Memory

MEM_AD[0] MEM _AD[1] MEM _AD[2] MEM _AD[3] MEM _AD[4] MEM _AD[5] MEM _AD[6] MEM _AD[7] MEM _AD[8] MEM _AD[9] MEM _AD[10] MEM _AD[11] MEM _AD[12] MEM _AD[13] MEM _AD[14] MEM _AD[15] MEM _WRN MEM _RDN MEM _BC0_N

VREF

TDO JTAG TDI JTAG TMS JTAG TCK JTAG TRSTn JTAG RTCK JTAG

TRIG_IN ETM (Embedded Trace Macro Cell) 2V62_VIO ETM MON2 ETM TRACESYNC ETM TRACECLK ETM PIPESTAT2 ETM PIPESTAT1 ETM PIPESTAT0 ETM TRACEPKT0 ETM TRACEPKT1 ETM TRACEPKT2 ETM TRACEPKT3 ETM TRACEPKT4 ETM TRACEPKT5 ETM TRACEPKT6 ETM TRACEPKT7 ETM

DATA(0) DATA (1) DATA (2) DATA (3) DATA (4) DATA (5) DATA (6) DATA (7) DATA (8) DATA (9) DATA (10) DATA (11) DATA (12) DATA (13) DATA (14) DATA (15) _WR _RD _BC0

- 26 -

Only for training and service purposes

3. TECHNICAL BRIEF

MEM _BC1_n MEM _A[0] ADD(0) MEM _A[1] MEM _A[2] MEM _A[3] MEM _A[4] ADD (4) MEM _A[5] MEM _A[6] MEM _A[7] MEM _A[8] MEM _A[9] MEM _A[10] MEM _A[11] MEM _A[12] MEM _A[13] MEM _A[14] MEM _A[15] MEM _A[16] MEM _A[17] MEM _A[18] MEM _A[19] MEM _A[20] MEM _A[21] MEM _A[22] MEM _A[23] MEM _A[24] MEM _CS0_N MEM _CS1_N MEM _CS2_N MEM _CS3_N MEM _ADVN MEM _RAS_N MEM _CAS_N MEM _WAITN MEM _SDCLKO MEM _BFCLKO2 MEM _BFCLKO1 MEM _CKE

Memory

FCDP_RBN

TDMA I/F

T_OUT0 T_OUT1 T_OUT2 T_OUT3 T_OUT4 T_OUT5

_BC1

ADD (1) ADD (2) ADD (3)

ADD (5) ADD (6) ADD (7) ADD (8) ADD (9) ADD (10) ADD (11) ADD (12) ADD (13) ADD (14) ADD (15) ADD (16) ADD (17) ADD (18) ADD (19) ADD (20) ADD (21) ADD (22) ADD (23) ADD (24) _NAND_CS _RAM_CS TP103 Not used N.C Not used N.C _RAS _CAS N.C SDCLKO For Burst mode SDCLKI For Burst mode N.C For Burst mode CKE

FCDP

TXON_PA PAM FE2 PA_BAND PAM FE1 DBB_INT MULTIKEY_BL

- 27 -

LGE Internal Use Only

3. TECHNICAL BRIEF

T_OUT6 KP_OUT4 N.C GPIO_51 T_OUT9 CC1CC7IO GPIO_54 BT_LDO_EN

RF I/F

RF_STR0 RF_STR1 RF_DATA RF_CLK

System Port

AFC CLKOUT0 F26M

F32K OSC32K RESET_N TRIG_IN RTC_OUT SPCU_RC_OUT0

DSP

DSPIN0 DSPOUT1 DSPIN1

PA_MODE PAM

FLASH_TORCH_EN DSR JACK_DETECT

RF_EN N.C RF_DA RF_CLK

N.C RPWRON_EN 26MHZ_MCLK 26M Main Clock

F32K to 32k crystal OSC32K to 32k crystal _RESET TRIG_IN RTC_OUT VCXO_EN

CLK32K WDOG N.C

- 28 -

Only for training and service purposes

3. TECHNICAL BRIEF

3.3. Power management IC

3.3.1. General Description

SM-POWER is a highly integrated Power and Battery Management IC for mobile handsets. It has been specially designed for usage with S-Gold3. Although optimized for usage with the Infineon S-GOLD baseband device it is suitable for the S-GOLD lite and the E-GOLD+ baseband devices as well. It also supports the cellular RF devices like SMARTi-DC, SMARTi-DC+, SMARTi-SD and the Bluemoon Single, Infineon’s single chip solution for Bluetooth. If used with S-GOLD3 it provides all power supply functions (except for the RF PA) for a complete advanced GSM Edge smart phone minimizing external device count.

Block Description

Highly efficient step-down converter for main digital baseband supply including Core, DSP and

Memory interface (External Bus Unit). Support of S-GOLD standby power-down concept Low-drop-out (LDO) regulators for Flash and mobile RAM memory devices Voltage independent switching of two SIM cards LDO regulators for baseband I/O supply LDO regulator for analog mixed-signal section of S-GOLD Low-noise LDO regulators for RF devices Supply for Bluemoon Single, Infineon’s single chip solution for Bluetooth Audio amplifier 8 Ohms for Handsfree operation and ringing Charge Control for charging Li-Ion/Polymer batteries under software control Pre-charge current generator with selectable current level RTC regulator with ultra-low quiescent current USB interface support for peripheral and mini-host mode Backlight LEDs driver with current selection and PWM dimming function Two single LED driver outputs for signaling Vibrator driver with adjustable voltage Fully controllable by software via I2C – Bus Temperature and battery voltage sensors Interrupt channels for peripherals System debug mode VQFN 48 package with heat sink and non-protruding leads Compatible with the Infineon E-GOLD+ V2 and V3

SM-POWER is a further step on the successful E-Power product line with enhanced and optimized functionality.

SM-POWER features a baseband supply concept with a DC/DC step-down converter cascaded by two linear regulators

SM-POWER’s DC/DC converter makes up to 40 % reduction of battery current for smart phone

functions (e.g. organizer functions, games, MP3 decoding) possible. SDBB has high efficiency up to 95% and also a power save mode. Memory Interface is directly supported by the SDBB SDBB can also act as main supply voltage for E-GOLD+ or S-GOLDlite baseband devices. For S-GOLD two linear regulators for DSP and Core are cascaded after the SDBB.

- 29 -

LGE Internal Use Only

3. TECHNICAL BRIEF

SM-POWER supports the standby power-down concept of S-GOLD by temporarily switching off the linear regulator for the DSP during mobile standby whenever this subsystem is not used. In this phase the ARM controller and most peripherals including parts of the on-chip SRAM are kept powered-up with power being supplied by the other linear regulator.

SM-POWER includes a fully differential audio amplifier able to drive loads down to a nominal value of 8 Ohm for usage in hands-free phones and for ringing

450 mW maximum output power

adjustable gain

mute switch SM-POWER also integrates a charging function for Li-Ion, Li-Polymer batteries

click and pop -protection SM-POWER also integrates a charging function for Li-Ion, Li-Polymer batteries Precharge current source with two current levels Constant current / constant voltage charging with 3 different termination voltages Programmable charge current limitation for use with different batteries

Freely programmable pulse charging to reduce the thermal power dissipation in the constant voltage

charging phase

op-off charge current sensing SM-POWER completes the USB interface of S-GOLD

Regulated voltage for S-GOLD USB interface including reverse current and overvoltage protection

Switch to supply USB pull-up resistor

ni-host pull down resistor functionality

Charge pump with internal switching capacitor for USB host VBUS supply voltage SM-POWER fully

supports LED and Vibra Motor functionality

no external components needed driver for backlight LEDs adjustable in steps up to 140mA and with soft turn on and off by PWM dimming

wo driver outputs for single LEDs for precharge indication and signaling with i.e. change of color

driver for Vibra Motor with adjustable voltages, soft startup / shutdown and current limitation

SM-POWER offers several control functions

Power-on Reset Generator with logic state machine I2C bus interface

I2C bus configurable mode control logic with ON (push-button or RTC), VCXOEN and LRF3EN (wake-up

by Bluetooth) inputs

Programmable interrupt channels to handle peripherals like SIM, MMC and USB

onitoring of charging functions Under voltage Shut-Down Error flags (volatile or non-volatile) from many power-supply functions and thermal sensor in order to debug

system

Over temperature Shut-Down Over temperature Warning Support of S-GOLD standby power-down concept

Support of S-GOLD Power-Down Pad Tristate Function

- 30 -

Only for training and service purposes

3. TECHNICAL BRIEF

Table 6. LDO Output Table of SM-Power

LDO Net name Output Voltage Output Current Usage

SD1 1V35_Core 1.35V 600mA Core & for LDO

SD2 1V8_SD 1.8V 300mA Memory

VAUX 2V85_VAF 2.85V 100mA Cam Auto Focus

VIO 2V62_VIO 2.62V 100mA Peripherals

VSIM 2V9_SIM 2.9V 70mA SIM card

VMME 2V8_VMME 2.9V 150mA u-SD

VUMTS 2V85_AMP 2.85V 110mA Headset AMP

VUSB VUSB 3.1V 40mA Not used

VLED VLED 2.9V 10mA Not used

VAUDIOa 2V5_VAUDA 2.5V 200mA Stereo headset, Mono earpiece

VAUDIOb 2V5_VAUDB 2.5V 50mA Analog parts of S-Gold

VRF1 2V85_VRF 2.85V 150mA

VRF2 1V5_VRF 1,53V 100mA

VRF3 2V65_VBT 2.7V 150mA Bluetooth

VPLL 1V35_VPLL 1.35V 30mA S-GOLD3 PLL

VRTC 2V11_RTC 2.11V 4mA Real Time Clock

VAFC 2V7_VRF 2.65V 5mA Not used

VVIB 2V8_CAM_A 2.8V 140mA CAMERA

2.85 V supply for SMARTi-PM RF transceiver

1.5 V supply for SMARTi-PM RF transceiver

PMIC

1V8_SD

22u

2V5_VAUDB

C222

2.2u

C235

2.2u

1V35_VPLL

KEY_EN

B10

C9

FLASH_ON

VSS11

E8

E9

C205 1u

TXONPA

VSS12

F3

R202

DNI

2V62_VIO

VBAT

2.2uC206

2.2uC207

A11

B9

A10

VIO

VPLL

VDDPLLIO

U201

PMB6821

VSS13

VSS14

VSS15

VSS16

VSS17

F4

F5

F6

F7

F8

R200

27K

VBAT

4.7KR206

4.7KR207

R208 4.7K

TP200

L1

J4

A1

B4

B11

VSD2

PUMS1

PUMS2

PUMS3

VSS18

VSS19

VSS20

VSS21

VSS22G6VSS23

F9

G3

G4

G5

G7

2V62_VIO

SDA

SPOWER_INT

PWRON

WDOG

ON_OFF2

RESOURCE_CTRL

SCL

4.7KR211

R209 4.7K

SP_INT

L6

L3

K4

L4

L5

K3

J5

J7

K6

K5

WDOG

I2C_INT

I2C_CLK

I2C_DAT

ON_OFF1

ON_OFF2

OUTPORT

POWER_ON

VSS24

VSS25

G8

G9

BL1_PWM

ON_OFF_OUT

RESOURCE_CRTL

VSS26

VSS_VREF

VSS_SD1

VSS_SD2

VSS30

VSS27

VSS28

VSS29

J6

H4

D9

H8

H5

H6

H7

K7

BL2_PWM

J8

C201

2.2u

BL3_PWM

VBAT

TP201

L7

CH_CNTRL

KDR331V

3

D200

VBAT

C204 33 uF

1u

C209

A8

K9

J9

K8

L9

K10

L8

L11

VLED

VDD_REF

SENSE_IN1

SENSE_IN2

CHARGE_UC

CH_SOURCE

VDD_CHARGE

VDDMME

VDDRF13_AFC

VDDSIMVIB

VDDUMTS

SD1_FBLSD2_FB

VSD1

VDDRF2

VUMTS

VDDSD1 SD1_FB

OVP_VC HG

2

OVP_VUSB

1

10uH

1V35_CORE

D201

2V85_CAM

VBAT

C22810u

C230

C239 1u

10u C229

10u

2V8_CAM_A

2V11_RTC2V5_VAUDA

C240 C245

C242

C241

1u

1u 2.2u

1u

L200

RB521S-30

C11

VMME

C10

D10 D11

VRF2

E10

VRF3

E11

F10

VRF1

F11

VVIB

G11

G10

VSIM

H11

VAFC

H10

VRTC

H9 J11

FB201 K11 J10 L10

10u

C232

2V9_SIM

C243

2.2u

2V85_VRF

1V5_VRF

2V9_VMME

1V8_SD

2V65_VBT

C247

C246

C244

C248

2.2u

2.2u2.2u

C200

0.1u

C208

0.1u

A5

A7

VREFEX_M

VDD_MONO

VSS1

D4

C6

C7

A6

VSS_MONO

MONO_OUTP

MONO_OUTN

VSS2

VSS4

VSS3

D5

D6

R212 100K

B8

RREF

VSS6

VSS7

VSS5

E4

D7

D8

RTC_OUT ON_OFF2

NUMKEY_BL

1u

C210

C8

A9

VREF

FLASH_SHINK

VSS10

VSS8

VSS9

E7

E5

E6

VUSB

VBAT

C202

1u

C203 1u

R625

USB_OEn USB_DAT_VP USB_SE0_VM

TXON_PA

VBAT

2V9_VFM

FB200

BT_VCXO_EN

C223

C224

2.2u

1u

C233

0.1uC234

10u

C231

USB_DP

USB_DM

PMRSTn

VCXO_EN

VBAT

U_RCV U_PMIN U_VMIN

PMRSTn

10uHL201

D202

RB521S-30

C237

C236

0.1u

100K

B7

B5

A3

A4

B2

B3

C3

A2

SE0_VM

B1

RCV

C2

VPIN

D3

VMIN

C1

D+

D2

D-

E3

RESET_N

D1

RESET2_N

E2

SLEEP1_N

E1

SLEEP2_N

F2

VAUDIOA

F1

VDDAUDIOA

G2

VDDAUDIOB

G1

VAUDIOB

H2

VAUX

H1

VDDAUX

J1

SU1_GATE

J2

SU1_GND

H3

SU1_FB

J3

SU1_ISENSE

K1

VDDSD2

K2 L2

SD2_FBL

C238 1u

C5

B6

C4

AC-

AC+

VUSB

OE_N

DAT_VP

VDD_USB

SUSPEND

MONO_INP

MONO_INN

Figure 4 PMIC Circuit

- 31 -

LGE Internal Use Only

LG KC560 Service Manual

Specifications and Main Features

Frequently Asked Questions

User Manual