LG KC550 Service Manual

Date: May, 2008 / Issue 1.0
Service Manual
Internal Use Only
Service Manual
KC550
Model : KC550
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
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* The information in this manual is subject to change without notice and should not be construed as a commitment by LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes to equipment design as advances in engineering and manufacturing methods warrant.
* This manual provides the information necessary to install, program, operate and maintain the KC550.
REVISED HISTORY
Editor Date Issue Contents of Changes S/W Version
Y.W.YUN 5/26 0.1
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LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
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1. INTRODUCTION ...............................7
1.1 Purpose .................................................. 7
1.2 Regulatory Information............................ 7
1.3 ABBREVIATION ..................................... 9
2. GENERAL PERFORMANCE ..........11
2.1 H/W Features.........................................11
2.2 Technical specification...........................12
3. TECHNICAL BRIEF ........................19
3.1 KC550 Component Block diagram.........19
3.2 Main Chip Introduction ...........................20
3.3 Baseband Part Introduction ...................22
3.4 Power Management Unit .......................38
3.5 Power ON/OFF ......................................43
3.6 SIM interface..........................................47
3.7 Memory ..................................................48
3.8 LCD Display ...........................................50
3.9 Keypad Switching & Scanning ...............53
3.10 Keypad back-light illumination .............54
3.11 LCD back-light illumination ..................55
3.12 JTAG interface connector ....................57
3.13 Audio....................................................58
3.14 USB charging circuit ............................62
3.15 BLUETOOTH .......................................63
3.16 FM Radio..............................................66
3.17 Micro SD external memory card slot....67
3.18 18pin Multi Media Interface
connector .............................................69
4. RF circuit technical brief ...............71
4.1 General Description ...............................71
4.2 Receiver part..........................................73
4.3 Transmitter part......................................74
4.4 RF synthesizer .......................................75
4.5 DCXO.....................................................76
4.6 Front End Module control.......................76
4.7 Power Amplifier Module .........................77
4.8 Mode Selection ......................................78
5. PCB layout......................................79
5.1 Main PCB component placement ..........79
6. Trouble shooting............................84
6.1 Trouble shooting test setup....................84
6.2 Power on Trouble...................................85
6.3 Charging trouble ....................................88
6.4 LCD display trouble................................90
6.5 Camera Trouble .....................................93
6.6 Receiver & Speaker trouble ...................95
6.7 Microphone trouble ................................97
6.8 Ear-MIc Jack Detection trouble..............98
6.9 Vibrator trouble ......................................99
6.10 Keypad back light trouble...................100
6.11 SIM & uSD trouble .............................103
6.12 RF Troubleshooting ...........................106
6.13 RF Receiver path Troubleshooting ....110
6.14 RF Transmitter path Troubleshooting 113
7. Download & S/W upgrade...............118
7.1 Download program user guide.............118
7.2 Multi-Download Program Setting .........119
8. CIRCUIT DIAGRAM ......................121
9. BGM PIN MAP...............................131
10. PCB LAYOUT..............................137
11. RF Calibration.............................145
11.1 Test Equipment Setup .......................145
11.2 Calibration Step .................................145
12. Stand-alone Test ........................151
12.1 Test Program Setting .........................151
12.2 Tx Test ...............................................153
12.3 Rx Test...............................................154
13. ENGINEERING MODE ................155
14. EXPLODED VIEW &
REPLACEMENT PART LIST ......157
14.1 Exploded View ...................................157
14.2 Replacement Parts ............................159
14.3 Accessory ..........................................182
Table Of Contents
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LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
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1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of the KC550.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges you°Øre your telecommunications
services. System users are responsible for the security of own system.
There are may be risks of toll fraud associated with your telecommunications system. System users
are responsible for programming and configuring the equipment to prevent unauthorized use. LGE
does not warrant that this product is immune from the above case but will prevent unauthorized use of
common-carrier telecommunication service of facilities accessed through or connected to it. LGE will
not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone
service until repair can be done. A telephone company may temporarily disconnect service as long as
repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the KC550 or compatibility with the network,
the telephone company is required to give advanced written notice to the user, allowing the user to take
appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on the KC550 must be performed only at the LGE or its authorized agents.
The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system
and may void any remaining warranty.
1. INTRODUCTION
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
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1. INTRODUCTION
E. Notice of Radiated Emissions
The KC550 complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information
such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
G. Interference and Attenuation
An KC550 may interfere with sensitive laboratory equipment, medical equipment, etc. Interference
from unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contains Electrostatic Sensitive Device(ESD), are indicated by the sign.
Following information is ESD handling: Service personnel should ground themselves by using a wrist
strap when exchange system boards.
When repairs are made to a system board, they should spread the floor with anti-static mat which is
also grounded. Use a suitable, grounded soldering iron. Keep sensitive parts in these protective
packages until these are used. When returning system boards or parts such as EEPROM to the
factory, use the protective package as described.
LGE Internal Use Only
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Only for training and service purposes
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1. INTRODUCTION
1.3 ABBREVIATION
For the purposes of this manual, following abbreviations apply:
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
APC Automatic Power Control
BB Baseband
BER Bit Error Ratio
CC-CV Constant Current - Constant Voltage
CLA Cigar Lighter Adapter
DAC Digital to Analog Converter
DCS Digital Communication System
dBm dB relative to 1 milli-watt
DSP Digital Signal Processing
EEPROM Electrical Erasable Programmable Read-Only Memory
EGPRS Enhanced General Packet Radio Service
EL Electroluminescence
ESD Electrostatic Discharge
FPCB Flexible Printed Circuit Board
GMSK Gaussian Minimum Shift Keying
GPIB General Purpose Interface Bus
GPRS General Packet Radio Service
GSM Global System for Mobile Communications
IPUI International Portable User Identity
IF Intermediate Frequency
LCD Liquid Crystal Display
LDO Low Drop Output
LED Light Emitting Diode
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
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LGE LG Electronics
OPLL Offset Phase Locked Loop
PAM Power Amplifier Module
PCB Printed Circuit Board
PGA Programmable Gain Amplifier
PLL Phase Locked Loop
PSTN Public Switched Telephone Network
RF Radio Frequency
RLR Receiving Loudness Rating
RMS Root Mean Square
RTC Real Time Clock
SAW Surface Acoustic Wave
SIM Subscriber Identity Module
SLR Sending Loudness Rating
SRAM Static Random Access Memory
STMR Side Tone Masking Rating
TA Travel Adapter
TDD Time Division Duplex
TDMA Time Division Multiple Access
UART Universal Asynchronous Receiver/Transmitter
VCO Voltage Controlled Oscillator
VCTCXO Voltage Control Temperature Compensated Crystal Oscillator
WAP Wireless Application Protocol
8PSK 8 Phase Shift Keying
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2. GENERAL PERFORMANCE
2.1 H/W Feature
2. GENERAL PERFORMANCE
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Item Feature Comment
Standard Battery Li-ion, 900mAh
AVG TCVR Current 260mA typ @PL5
Standby Current 2 mA typ @PP9
Talk time 6 hours (GSM TX Level 10)
Standby time Over 450 hours (Paging Period:9, RSSI: -85dBm)
Charging time Under 3 hours
RX Sensitivity EGSM : -105dBm, DCS/PCS : -105dBm
TX output power EGSM : 33dBm (@PL 5)
DCS/PCS: 30dBm (@PL 0)
GPRS compatibility Class 12
SIM card type 3V Small
Display 240 x 320 pixels, 2.4 inch QVGA, 262K color, TFT
Status Indicator Soft icons, 0 ~ 9, #, *, Scroll, Send, End/PWR,
Clear AF/Camera double action, Volume Up,
Volume Down
ANT Built in antenna
EAR Phone Jack 18pin multi port Headset jack (W/O remote controller)
PC Synchronization Yes
Speech coding HR/EFR/FR/AMR
Data and Fax Yes
Vibrator Yes
Buzzer No
Voice Recoding Yes
C-Mic Yes
Receiver Yes
Travel Adapter Yes
Options Bluetooth hands-free kit, Data Kit
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2. GENERAL PERFORMANCE
2.2 Technical specification
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Item Description Specification
1Frequency Band EGSM
TX: 890 + 0.2 x n MHz
RX: 935 + 0.2 x n MHz ( n = 1 ~ 124 )
TX: 890 + 0.2 x (n-1024) MHz
RX: 935 + 0.2 x (n-1024) MHz ( n = 975 ~ 1023 )
DCS1800
TX: 1710 + ( n-511 ) x 0.2 MHz (n = 512 ~ 885)
RX: TX + 95 MHz
PCS1900
TX: 1850.2 + ( n-512 ) x 0.2 MHz (n = 512 ~ 810)
RX: TX + 80MHz
2 Phase Error RMS < 5 degrees ,
Peak < 20 degrees
3 Frequency Error < 0.1ppm
4 Power Level EGSM
Level Power Toler. Level Power Toler.
5 33 dBm 2dB 13 17 dBm 3dB
6 31 dBm 3dB 14 15 dBm 3dB
7 29 dBm 3dB 15 13 dBm 3dB
8 27 dBm 3dB 16 11 dBm 5dB
9 25 dBm 3dB 17 9 dBm 5dB
10 23 dBm 3dB 18 7 dBm 5dB
11 21 dBm 3dB 19 5 dBm 5dB
12 19 dBm 3dB
DCS1800/PCS1900
Level Power Toler. Level Power Toler.
0 30 dBm 2dB 8 14 dBm 3dB
1 28 dBm 3dB 9 12 dBm 4dB
2 26 dBm 3dB 10 10 dBm 4dB
3 24 dBm 3dB 11 8 dBm 4dB
4 22 dBm 3dB 12 6 dBm 4dB
5 20 dBm 3dB 13 4 dBm 4dB
6 18 dBm 3dB 14 2 dBm 5dB
7 16 dBm 3dB 15 0 dBm 5dB
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2. GENERAL PERFORMANCE
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Item Description Specification
5 Output RF Spectrum EGSM
(due to modulation) Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600 ~ 1,200 -60
1,200 ~ 1,800 -60
1,800 ~ 3,000 -63
3,000 ~ 6,000 -65
6,000 -71
DCS1800/PCS1900
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600 ~ 1,200 -60
1,200 ~ 1,800 -60
1,800 ~ 3,000 -65
3,000 ~ 6,000 -65
6,000 -73
6 Output RF Spectrum EGSM
(due to switching transient) Offset from Carrier (kHz) Max. (dBm)
400 -19
600 -21
1,200 -21
1,800 -24
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2. GENERAL PERFORMANCE
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
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Item Description Specification
6 Output RF Spectrum DCS1800/PCS1900
(due to switching transient) Offset from Carrier (kHz). Max. (dBm)
400 -22
600 -24
1,200 -24
1,800 -27
7 Spurious Emissions Conduction, Emission Status
8 Bit Error Ratio EGSM
BER (Class II) < 2.439% @-102dBm
DCS1800/PCS1900
BER (Class II) < 2.439% @-100dBm
9 Rx Level Report accuracy
10 SLR 8 3 dB
11 Sending Response Frequency (Hz) Max.(dB) Min.(dB)
100 -12 -
200 0 -
300 0 -12
1,000 0 -6
2,000 4 -6
3,000 4 -6
3,400 4 -9
4,000 0 -
12 RLR 2 3 dB
13 Receiving Response Frequency (Hz) Max.(dB) Min.(dB)
100 -12 -
200 0 -
300 2 -7
500
*
-5
1,000 0 -5
3,000 2 -5
3,400 2 -10
4,000 2
*
Mean that Adopt a straight line in between 300 Hz
and 1,000 Hz to be Max. level in the range.
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2. GENERAL PERFORMANCE
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Item Description Specification
14 STMR 13 5 dB
15 Stability Margin > 6 dB
16 Distortion dB to ARL (dB) Level Ratio (dB)
-35 17.5
-30 22.5
-20 30.7
-10 33.3
0 33.7
7 31.7
10 25.5
17 Side Tone Distortion Three stage distortion < 10%
18
System frequency
2.5ppm
(26 MHz) tolerance
19 32.768KHz tolerance 30ppm
20 Power consumption Standby
- Normal 2 mA(@PP9)
21 Talk Time EGSM/Lvl 7 (Battery Capacity 900mA):180min
EGSM/Lvl12(Battery Capacity 900mA): 320min
22 Standby Time Under conditions, at least 300 hours:
1. Brand new and full 900mAh battery
2. Full charge, no receive/send and keep GSM in idle mode.
3. Broadcast set off.
4. Signal strength display set at 3 level above.
5. Backlight of phone set off.
23 Ringer Volume At least 65 dB under below conditions:
1. Ringer set as ringer.
2. Test distance set as 50 cm
24 Charge Current Fast Charge : < 450 mA
Slow Charge: < 200 mA
25 Antenna Display Antenna Bar Number Power
7 >-92 dBm ~
7 5 -97dBm ~ -93dBm 5 4 -100dBm ~ -98dBm 4 2 -103dBm ~ -101dBm 2 1 -105dBm ~ -104dBm 1 0< -106 dBm
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2. GENERAL PERFORMANCE
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Item Description Specification
26 Battery Indicator Battery Bar Number Voltage( 0.05V)
3 3.76V~4.2V
2 3.68V~3.75V
1 3.55V~3.65V
0 3.41V~
27 Low Voltage Warning 3.58V 0.05V (Call)
3.51V 0.05V (Standby)
28 Forced shut down Voltage 3.3 0.05 V
29 Battery Type Li-ion Battery or Li-Polymer Battery
Standard Voltage = 3.7 V Battery full charge voltage = 4.2 V Capacity: 900mAh
31 Travel Charger Switching-mode charger
Input: 100 ~ 240 V, 50/60Hz Out put: 5.1, 0.7A
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Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
2. GENERAL PERFORMANCE
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* EDGE RF Specification (Option: is not serviced for “EDGE mode”)
Item Description Specification
1 RMS EVM 9% 2 Peak EVM 30% 395thPercentile EVM 15%
4Origin Offset Suppression 30dB
5 Power Level EGSM
Level Power Toler. Level Power Toler.
5 27dBm 3dB 13 17dBm 3dB
6 27dBm 3dB 14 15dBm 3dB
7 27dBm 3dB 15 13dBm 3dB
8 27dBm 3dB 16 11dBm 5dB
9 25dBm 3dB 17 9dBm 5dB
10 23dBm 3dB 18 7dBm 5dB
11 21dBm 3dB 19 5dBm 5dB
12 19dBm 3dB
DCS1800, PCS1900
Level Power Toler. Level Power Toler.
0 26dBm 3dB 8 14dBm 3dB
1 26dBm 3dB 9 12dBm 4dB
2 26dBm 3dB 10 10dBm 4dB
3 24dBm 3dB 11 8dBm 4dB
4 22dBm 3dB 12 6dBm 4dB
5 20dBm 3dB 13 4dBm 4dB
6 18dBm 3dB 14 2dBm 5dB
7 16dBm 3dB 15 0dBm 5dB
6 Output RF Spectrum EGSM
(due to modulation) Offset from carrier(kHz) Max. dBc
100 +0.5
200 -30
250 -33
400 -54
600 ~ <1,200 -60
1,200 ~ <1,800 -60
1,800 ~ <3,000 -63
3,000 ~ <6,000 -65
6,000 -71
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
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2. GENERAL PERFORMANCE
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Item Description Specification
6 Output RF Spectrum DCS1800, PCS1900
(due to modulation) Offset from carrier(kHz) Max. dBc
100 +0.5
200 -30
250 -33
400 -54
600 ~ <1,200 -60
1,200 ~ <1,800 -60
1,800 ~ <3,000 -63
3,000 ~ <6,000 -65
6,000 -71
7 Output RF Spectrum EGSM
(due to switching transient) Offset from carrier(kHz) Max. dBm
400 -23
600 -26
1,200 -27
1,800 --30
DCS1800, PCS1900
Offset from carrier(kHz) Max. dBm
400 -23
600 -26
1,200 -27
1,800 -30
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
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3.1 KC550 Component Block diagram
KC550 is composed with 5 different PCB part such as main PCB, Key PCB, Key FPCB, LCD FPCB and Flash FPCB/ The functional component arrangement is mentioned below diagram.
3. TECHNICAL BRIEF
Figure 1 KC550 Functional block diagram
Flash LED
PWF4
5M Pxl, AF
2.4î QVGA TFT
2.4î QVGA TFT (240x320)
(240x320)
KEYPAD
Acceleration
Sensor
: Signal , Control Connection : RF Connection : Power Connection : Mechanical Connection
MIPI I/F
LCD 16bit
I/F
DC/DC
Converter
Charge
Pump
BD6095
LCD B/L
Camera LDO
(1.8V, 2.8V)
MMIC/ISP
M180
Audio Codec+AMP
WM8990
16pi, 3.4t
SPK
LP3907
1.2V, 1.8V,
MMIC 16bit I/F
Radio TX
signal
512Mb SDRAM)
Headset
antenna
PMIC
2.6V
A/
D/
18
16
Memory
(1Gb NAND +
BT
BT/FM radio
BLUCORE5-FM
SIM
UART
I2S
BB+RF
PMB8888
D/
4
Micro SD SIM Card
Socket
26MHz
RX IQ
TX IQ
RF Ctrl
Backup Battery
Charging
VUSB
ISL9221
Battery
900mAh
PAM
TQM7M5005
Radio RX
signal
antenna
FEM
LSHS-C085FB
18pin
I/O
Main
RCV
Motor
Stereo
headset
TA
USB cable
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3. TECHNICAL BRIEF
3.2 Main Chip Introduction
3.2.1 General Description
world’s first single-chip solution for feature-rich mobile phones. The EDGE-capable device combines
alldigital and analog functions of the baseband, a quad-band RF transceiver, and the power
management circuitry into a single chip. With an option for memory stacking (“Package on Package”,
JEDEC compliant) the key functions of a mobile phone are now combined into a single device,
providing all the benefits that come from a maximum level of integration. Full software re-use from the
proven Infineon EDGE platform, MP-ELite, enables fast time-to-market using a comprehensive
development kit available to all customers today.
set of multimedia applications such as:
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3. TECHNICAL BRIEF
• Still picture imaging up to 2 MPixel
• MPEG4 video encode/decode
• Video streaming
• MP3 playback
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3. TECHNICAL BRIEF
3.3 Baseband Part Introduction
3.3.1 Block Description
Connectivity
applications:
• USB 2.0 Full Speed (12 Mbps)
• IrDA Controller
Supports Infrared SIR Mode Transceivers
• RS-232 over a 16C550 compliant UART
• MMC/SD Memory Card Interface
- Low Voltage Capable
- SDIO expandable (using external components)
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- 23 -
3. TECHNICAL BRIEF
• Ready to connect to the Infineon’s Bluemoon Family Bluetooth Transceivers
- HCI (H5) optimized USIF (Universal Serial Interface)
- Dedicated PCM-style digital audio interface (I2S)
- Dedicated power supply
• Microcontroller-Like Extension Interface For multimedia companions (for example, complex display/camera modules or graphic accelerators)
• External Memory Interface Supporting:
- SDRAM
- Cellular RAM
- Burst Flash
- SRAM
- NAND flashes (error correction capability in HW)
• User Interface (Keypad) Supporting up to 74 keys with multiple key-press capability
• SIM Card interface (USIM) ISO 7816 compatible
• Analogue Measurement Unit For various general purpose measurements such as battery voltage, battery, VCXO and environmental temperature, battery technology, transmission power, offset, on-chip temperature, etc.
Security
• Secure Boot and Flash Update
• SHA1 HW acceleration
• Secure Debug
• 128-bit customer defined efuse key
• Anti-intrusion logic.
Audio
Besides the telephony voice CODECs supplied by the Firmware running on the TEAKLite® DSP core,
the ARM926 core enables running high-quality audio CODECs such as MPEG-1/2 Layer-3 Decode
(MP3), AAC+ or AAC++. Audio streaming is supported according to the 3GPP PSS Release 4
standard.
The output of audio and voice codecs can be mixed and routed to the integrated Hi-Fi Stereo
voiceband supporting CD-Quality. Alternatively, the audio can also be sinked to a mono loudspeaker
using the integrated hands-free amplifier.
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- 24 -
3. TECHNICAL BRIEF
Video and Imaging
interface and a display module over a microcontroller-like parallel or serial interface. Furthermore,
ARM’s MOVE coprocessor is integrated to accelerate video encoding algorithms (for example, H.263
or MPEG-4). This fulfills basic multimedia requirements and allows connecting commodity cameras
and displays without the need of an additional multimedia IC. The computational power for encoding
and decoding still pictures (JPEG) and video sequences (H.263 or MPEG-4) is provided by the
integrated ARM926 core.
Over-the-air interface JPEG pictures and H.263 or MPEG-4 videos can be sent or received as MMS by
means of (E)GPRS.
Supported "still pictures" multimedia scenarios are:
• View Finding for a Picture Snapshot: Captured frames are transferred from the camera IF to the
display IF at up to15 fps (depending on the camera used) in QCIF resolution (depending on the display used). Downscaling and color conversion is done by the camera and display interface logic. Therefore, view finding for a snapshot is possible without burdening the CPU. However, picture rotation and/or overlay are performed by SW if required.
• Shooting: The captured picture, with up to 1.31 MPixel resolution (SXGA 1280 x 1024), is
transferred within 1/15 sec to external memory.1) Then, JPEG compression is done by SW, while the viewfinder is frozen so that the user can immediately see the snapshot on the display.
• Photo Flash: Under low light conditions usually a photo flash is required. To activate the flash at the
right time, a general purpose timer unit (GTPU) can be used that is triggered by the frame synchronization signal (VSYNC) from the camera interface.
• Processing: JPEG thumbnail generation, picture overlay, picture rotation and other picture
processing tasks are performed by SW.
• Viewing: A JPEG picture is decoded, down-scaled and format converted by SW and then transferred
to the display interface. JPEG thumbnails can also be transferred directly to the display interface after decoding by SW without additional downscaling.
• Storage: JPEG pictures can be stored on an MMC/SD card, a Flash or a PC.
• Sending/Receiving: JPEG thumbnails can be sent/received as MMS (E-GPRS). Full resolution
JPEG pictures can be sent/received as e-mail or downloaded from the internet. Supported "video sequence" multimedia scenarios:
• Record Video Sequences: Captured frames in QCIF resolution are transferred to internal memory
at 15 fps. H.263 or MPEG-4 encoding is performed on-the-fly by SW with the support of the MOVE coprocessor. The audio recording is performed on the DSP (GSM AMR CODEC). Multiplexing of audio and video streams is performed by the ARM.
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3. TECHNICAL BRIEF
• View Finding during Video Encoding: During video recording the user needs to see what is being
recorded. Therefore, the captured frames are not only encoded but also transferred to the display interface. If only every second frame from the camera is used for encoding, viewfinding is possible without burdening the CPU. However, if each frame from the camera has to be encoded, due to low camera frame rate, the YCbCr4:2:2 to YCbCr4:4:4 color conversion and further downscaling is performed by SW. Picture rotation and overlay has to be done in SW in any case.
• Storage: Compressed H.263 or MPEG-4 videos can be stored on an MMC/SD, a Flash or a PC.
• Viewing: De-multiplexing of audio and video streams is performed by the ARM. The H.263 or
MPEG-4 decoding is also done by SW on the ARM and then the frames are transferred to the display interface. Audio decoding (GSM-AMR) is done on the DSP. The audio/video synchronization is done by time stamp feedback from the DSP to the ARM.
• Sending/Receiving: H.263 or MPEG-4 videos can be sent/received as MMS (E-GPRS), as e-mail or
downloaded from the internet.
Higher Multimedia Performance
If higher multimedia performance is required, an external multimedia IC can be connected to S-
interface pins are used in a multiplex mode to connect an external multimedia IC to the S-
multimedia IC, which contains functions (in HW and/or SW) to process still images and video data.
This configuration is intended for higher-end graphics features (for example, high quality video
streaming, video conferencing, hardware-assisted 2D/3D graphics functions, etc.).
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3. TECHNICAL BRIEF
3.3.2 External Devices connected to memory interface
Table 1 Memory interface
3.3.3 RF Interface
RF ICs Periodically each TDMA frame.
Table 2. RF Interface Spec
.
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Device Name Maker Remark
FLASH K5D1G12ACE-D075 SAMSUNG 1G(128Mx8) NAND
SDRAM K5D1G12ACE-D075 SAMSUNG 512M(32Mx16) SDRAM
LCD TX08D13VM0AAA TMD 16bit access 2times transmission
Multimedia IC 215-0638018 AMD Multimedia processing
T_OUT
Resource Interconnection Description
PABS PA_BAND TX RF band select
PAMODE PA_MODE PAM Mode select
FE1 VC1 FEM control
FE2 VC2 FEM control
PAEN PA_EN PAM Power on
VRAMP TX_RAMP APC
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3. TECHNICAL BRIEF
3.3.4 USART Interface
KC550 have a UART Driver as follow :
- USART1 : Hardware Flow Control / SW upgrade / Calibration
Table 3. USIF Interface Spec.
3.3.5 ADC channel
BBP ADC block is composed of 7 external ADC channel. This block operates charging process and
other related process by reading battery voltage and other analog values.
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
USART_0(USART1)
Resource Name Remark
USART0_TXD UART_TX Transmit Data
USART0_RXD UART_RX Receive Data
USART0_CTS ACCEL_INT Interrupt
USART0_RTS MMC_DETECT GPIO
DSPOUT_0 JACK_DETECT Interrupt
ADC channel
Resource Interconnection Description
M0 BATT_ID Battery IC check
M1 RF_TEMP RF block temperature measure
M2 N.C.
M8 VSUPPLY Battery supply voltage measure
M9 N.C.
M10 REMOTE_ADC Remote control key detect
3.3.6 GPIO map
Over a hundred allowable resources, KC550 is using as follows except dedicated to SIM and Memory.
KC550 GPIO(General Purpose Input/Output) Map, describing application, I/O state, and enable level,
is shown in below table.
- 28 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Port Function Net Name Description
#Keypad
KP_IN0 NONE
KP_IN1 KP_IN(1)
KP_IN2 KP_IN(2)
KP_IN3 KP_IN(3)
KP_IN4 KP_IN(4)
KP_IN5 KP_IN(5)
KP_IN6 KP_IN(6)
KP_OUT0 KP_OUT(0)
KP_OUT1 KP_OUT(1)
KP_OUT2 KP_OUT(2)
KP_OUT3 KP_OUT(3)
#USART0
USART0_RXD UART_RX
USART0_TXD UART_TX
USART0_RTS_N MMC_DETECT
USART0_CTS_N ACCEL_INT
DSPOUT0 JACK_DETECT
#USB
USB_DPLUS USB_DP
USB_DMINUS USB_DM
#CIF:Camera Interface
CIF_D0 MM_AD0
CIF_D1 MM_AD1
CIF_D2 MM_AD2
- 29 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
CIF_D3 MM_AD3
CIF_D4 MM_AD4
CIF_D5 MM_AD5
CIF_D6 MM_AD6
CIF_D7 MM_AD7
CIF_PCLK
CIF_HSYNC MM_WAIT
CIF_VSYNC TP
CLKOUT2 GPO_CTRL1
CIF_PD_GPIO HS_SEL N.A
CIF_RESET_GPIO GPO_CTRL2
#Display_Interface
DIF_D0 MM_AD8
DIF_D1 MM_AD9
DIF_D2 MM_AD10
DIF_D3 MM_AD11
DIF_D4 MM_AD12
DIF_D5 MM_AD13
DIF_D6 MM_AD14
DIF_D7 MM_AD15
DIF_CS1 MM_CS0
DIF_CS2 REMOTE_INT
DIF_CD MM_A16
DIF_WR MM_WR
DIF_RD MM_RD
DIF_HD MM_INT
DIF_VD BT_INT
DIF_RESET1_GPIO HOOK_DETECT
#I2C
I2C_SCL I2C_SCL
I2C_SDA I2C_SDA
PM_INT NONE
- 30 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
#Chip Card (USIM1)
CC_IO SIM_IO
CC_CLK SIM_CLK
CC_RST SIM_RST
#MMCI: Multimedia Card IF
MMCI_CMD MMCI_CMD
MMCI_DAT0 MMCI_DAT0
MMCI_CLK MMCI_CLK
#USIF: Universal Serial IF
USIF_TXD_MTSR UART_BT_TX
USIF_RXD_MRST UART_BT_RX
USIF_SCLK BT_VCXO_EN
#I2S1: DAI-PCM
I2S1_CLK0 I2S1_CLK
I2S1_RX I2S1_RX
I2S1_TX I2S1_TX
I2S1_WA0 I2S1_WA0
#MMCI: SD-Extension
MMCI_DAT1 MMCI_DAT1
MMCI_DAT2 MMCI_DAT2
MMCI_DAT3 MMCI_DAT3
#Voiceband: Analog Interface
EP_N SND_L
EP_P SND_R
HS_N EAR_N
EP_CM NA
HS_P EAR_P
MIC1_N MIC_N
MIC1_P MIC_P
MIC2_N HS_MIC_N
MIC2_P HS_MIC_P
VMIC VMIC
#Measurement
M0 BAT_ID
M1 RF_TEMP
M2 JACK_TYPE
M7 GND
M8 VBAT
M9 LOAD
M10 REMOTE_ADC
#Bandgap reference: Analog Interface
VREF2 GND
IREF2 GND
#JTAG
TDO TDO
TDI TDI
TMS TMS
TCK TCK
TRST_n TRST_N
RTCK RTCK
#Debug
TRIG_IN TRIG_IN
MON1 MON1
MON2 MON2
#External Bus Interface (EBU)
#FCDP: Flash Controller DMA Port
FCDP_RBN FCDP
#GSM TDMA Timer: GSM Control
T_OUT1 NONE
T_OUT2 NONE
T_OUT3 UART_BT_RTS
T_OUT4 UART_BT_CTS
T_OUT5 FLIP_OPEN
T_OUT6 PA_MODE_2
- 31 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
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