LG GX500 User Manual
Service Manual Model : GX500
Internal Use Only
Service Manual
GX500
Date: March, 2010 / Issue 1.0
Table Of Contents
1. INTRODUCTION ................................................. 5
1.1 Purpose ............................................................................................... 5
1.2 Regulatory Information ............................................................... 5
1.3 Abbreviations ................................................................................... 7
2. PERFORMANCE ..................................................9
2.1 H/W Features .................................................................................... 9
2.2 Technical Specification ...............................................................10
3. TECHNICAL BRIEF ............................................17
3.1 GX500 Functional Block diagram...........................................17
3.2 Dual Baseband Processor (BBP) Introduction ...................18
3.3 Power management IC ..............................................................38
3.4 Power ON/OFF ...............................................................................46
3.5 Dual SIM & u-SD Interface .........................................................48
3.6 Memory ............................................................................................50
3.7 LCD Display .....................................................................................53
3.8 Keypad Switching & Scanning ................................................54
3.9 LCD back-light illumination ......................................................55
3.10 JTAG & ETM interface connector .........................................56
3.11 Audio ...............................................................................................57
3.12 Charging circuit ..........................................................................59
3.13 WI-FI & BLUETOOTH & FMradio ............................................60
3.14 5pin Micro USB Interface connector ..................................63
3.15 Triaxial, digital acceleration sensor .....................................64
3.16 General Description ..................................................................66
3.17 Receiver part ................................................................................68
3.18 Transmitter part ..........................................................................69
3.19 RF synthesizer ..............................................................................70
3.20 DCXO ...............................................................................................70
3.21 Front End Module control ......................................................71
3.22 Power Amplifier Module .........................................................72
3.23 PAM Schematic ...........................................................................73
4.4 LCD display trouble .....................................................................80
4.5 Camera Trouble .............................................................................82
4.6 Receiver & Speaker trouble ......................................................84
4.7 Microphone trouble ....................................................................86
4.8 Vibrator trouble .............................................................................87
4.9 SIM & uSD trouble ........................................................................89
4.10 Touch trouble...............................................................................92
4.11 LCD LED trouble .........................................................................93
4.12 Trouble shooting of Receiver part .......................................94
4.13 Trouble shooting of Transmitter part .............................. 100
4.14 Trouble shooting of WI-FI/BT/FM part ............................ 109
5. DOWNLOAD & S/W UPGRADE......................112
6. BLOCK DIAGRAM ...........................................120
7. CIRCUIT DIAGRAM ........................................121
8. BGA Pin Map ..................................................129
9. PCB LAYOUT ...................................................139
10. RF CALIBRATION .........................................147
10.1 Test Equipment Setup ........................................................... 147
10.2 Calibration Step ....................................................................... 147
11. STAND ALONE TEST ....................................152
11.1 SIM1 TEST ...................................................................................152
11.2 SIM2 TEST ...................................................................................159
12. ENGINEERING MODE ..................................161
13. EXPLODED VIEW & REPLACEMENT
PART LIST ....................................................163
13.1 EXPLODED VIEW ......................................................................163
13.2 Replacement Parts..................................................................165
13.3 Accessory ...................................................................................189
4. TROUBLE SHOOTING ......................................74
4.1 Trouble shooting test setup .....................................................74
4.2 Power on Trouble ..........................................................................75
4.3 Charging trouble ..........................................................................78
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 3 -
LGE Internal Use Only
LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.
- 4 -
Only for training and service purposes
1. INTRODUCTION
GX500 Operational Description Revision A
I. Introduction
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the features
of the GX500.
1.2 Regulatory Information
1.2.1 Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges you’re your telecommunications services.
System users are responsible for the security of own system. There are may be risks of toll fraud associated
with your telecommunications system. System users are responsible for programming and configuring the
equipment to prevent unauthorized use. LGE does not warrant that this product is immune from the above
case but will prevent unauthorized use of common-carrier telecommunication service of facilities accessed
through or connected to it. LGE will not be responsible for any charges that result from such unauthorized
use.
1.2.2 Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly causing
harm or interruption in service to the telephone network, it should disconnect telephone service until repair
can be done. A telephone company may temporarily disconnect service as long as repair is not done.
1.2.3 Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these changes
could reasonably be expected to affect the use of the GX500 or compatibility with the network, the telephone
company is required to give advanced written notice to the user, allowing the user to take appropriate steps
to maintain telephone service.
1.2.4 Maintenance Limitations
Maintenance limitations on the GX500 must be performed only at the LGE or its authorized agents. The user
may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that
unauthorized alternations or repair may affect the regulatory status of the system and may void any
remaining warranty.
1.2.5 Notice of Radiated Emissions
The GX500 complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information such as
the following to the end user.
1. INTRODUCTION
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 5 -
LGE Internal Use Only
1. INTRODUCTION
GX500 Operational Description Revision A
1.2.6 Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.
1.2.7 Interference and Attenuation
An GX500 may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from
unsuppressed engines or electric motors may cause problems.
1.2.8 Electrostatic Sensitive Devices
ATTENTION
Boards, which contains Electrostatic Sensitive Device(ESD), are indicated by the sign. Following information is
ESD handling: Service personnel should ground themselves by using a wrist strap when exchange system
boards.
When repairs are made to a system board, they should spread the floor with anti-static mat which is also
grounded. Use a suitable, grounded soldering iron. Keep sensitive parts in these protective packages until
these are used. When returning system boards or parts such as EEPROM to the factory, use the protective
package as described.
LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.
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Only for training and service purposes
1. INTRODUCTION
GX500 Operational Description Revision A
1.3 ABBREVIATION
For the purposes of this manual, following abbreviations apply:
APC Automatic Power Control
BB Baseband
BER Bit Error Ratio
CC-CV Constant Current – Constant Voltage
CLA Cigar Lighter Adapter
DAC Digital to Analog Converter
DCS Digital Communication System
dBm dB relative to 1 milli-watt
DSP Digital Signal Processing
EEPROM Electrical Erasable Programmable Read-Only Memory
EGPRS Enhanced General Packet Radio Service
EL Electroluminescence
ESD Electrostatic Discharge
FPCB Flexible Printed Circuit Board
GMSK Gaussian Minimum Shift Keying
GPIB General Purpose Interface Bus
GPRS General Packet Radio Service
GSM Global System for Mobile Communications
IPUI International Portable User Identity
IF Intermediate Frequency
LCD Liquid Crystal Display
LDO Low Drop Output
LED Light Emitting Diode
LGE LG Electronics
OPLL Offset Phase Locked Loop
PAM Power Amplifier Module
PCB Printed Circuit Board
PGA Programmable Gain Amplifier
PLL Phase Locked Loop
PSTN Public Switched Telephone Network
RF Radio Frequency
RLR Receiving Loudness Rating
RMS
Root Mean Square
RTC Real Time Clock
SAW Surface Acoustic Wave
SIM Subscriber Identity Module
SLR Sending Loudness Rating
SRAM Static Random Access Memory
STMR Side Tone Masking Rating
TA Travel Adapter
TDD Time Division Duplex
TDMA Time Division Multiple Access
UART Universal Asynchronous Receiver/Transmitter
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 7 -
LGE Internal Use Only
1. INTRODUCTION
GX500 Operational Description Revision A
VCO Voltage Controlled Oscillator
DCXO Digitally Controled Crystal Oscillator
WAP Wireless Application Protocol
ଝ 8PSK 8 Phase Shift Keying
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Only for training and service purposes
2. PERFORMANCE
GX500 Operational Description Revision A
II. General Performance
2.1 H/W Feature
Item Feature Comment
Standard Battery Lithium-Ion Polymer, 15000mAh
AVG TCVR Current 265mA typ @PL5
Standby Current 3.7 mA typ @PP5
Talk time 7 hours (GSM TX Level 7)
Standby time Over 390 hours (Paging Period:5, RSSI: -85dBm)
Charging time Under 3.5 hours
RX Sensitivity EGSM/GSM850:-105dBm˨ ,DCS/PCS:-105dBm˨
TX output power
EGSM/GSM850 : 33dBm (@PL 5)
DCS/PCS: 30dBm (@PL 0)
GPRS compatibility Class 12
SIM card type 3V Small
Display
Main 240 u 400 pixels, 3” WQVGA, 262K color
Status Indicator
Send Key, Shortcut Key, Volume Up/Down Key,
PWR Key, Camera Key, Lock Key
ANT Built in antenna
EAR Phone Jack 5pin Micro USB
PC Synchronization Yes
Speech coding HR/EFR/FR/AMR
Data and Fax Yes
Vibrator Yes
Buzzer No
Voice Recoding Yes
C-Mic Yes
Receiver Yes
Travel Adapter Yes
Options Bluetooth hands-free kit, Data Kit
2. PERFORMANCE
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
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LGE Internal Use Only
2. PERFORMANCE
GX500 Operational Description Revision A
2.2 Technical specification
Item Description Specification
1
Frequency Band
GSM850
TX: 824 + 0.2 x n MHz
RX: 869 + 0.2 x n MHz ( n = 128 ~ 251 )
EGSM
TX: 890 + 0.2 x (n-1024) MHz
RX: 935 + 0.2 x (n-1024) MHz ( n = 975 ~ 1023 /1 ~ 124)
DCS1800
TX: 1710 + ( n-511 ) u 0.2 MHz (n = 512 a 885)
RX: TX + 95 MHz
PCS1900
TX: 1850.2 + ( n-512 ) u 0.2 MHz (n = 512 a 810)
RX: TX + 80MHz
2
Phase Error
RMS < 5 degrees
Peak < 20 degrees
3
Frequency Error < 0.1ppm
GSM850/EGSM
Level Power Toler. Level Power Toler.
5 33 dBm ±2dB 13 17 dBm ±3dB
6 31 dBm ±3dB 14 15 dBm ±3dB
7 29 dBm ±3dB 15 13 dBm ±3dB
8 27 dBm ±3dB 16 11 dBm ±5dB
9 25 dBm ±3dB 17 9 dBm ±5dB
10 23 dBm ±3dB 18 7 dBm ±5dB
11 21 dBm ±3dB 19 5 dBm ±5dB
12 19 dBm ±3dB
DCS1800/PCS1900
Level Power Toler. Level Power Toler.
0 30 dBm ±2dB 8 14 dBm ±3dB
1 28 dBm ±3dB 9 12 dBm ±4dB
2 26 dBm ±3dB 10 10 dBm ±4dB
3 24 dBm ±3dB 11 8 dBm ±4dB
4 22 dBm ±3dB 12 6 dBm ±4dB
5 20 dBm ±3dB 13 4 dBm ±4dB
6 18 dBm ±3dB 14 2 dBm ±5dB
4
Power Level
7 16 dBm ±3dB 15 0 dBm ±5dB
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Only for training and service purposes
2. PERFORMANCE
GX500 Operational Description Revision A
GSM850/EGSM
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600 ~ 1,200 -60
1,200 ~ 1,800 -60
1,800 ~ 3,000 -63
3,000 ~ 6,000 -65
6,000 -71
DCS1800/PCS1900
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600 ~ 1,200 -60
1,200 ~ 1,800 -60
1,800 ~ 3,000 -65
3,000 ~ 6,000 -65
5
Output RF Spectrum
(due to modulation)
6,000 -73
GSM850/EGSM
Offset from Carrier (kHz) Max. (dBm)
400 -19
600 -21
1,200 -21
1,800 -24
DCS1800/PCS1900
Offset from Carrier (kHz) Max. (dBm)
400 -22
600 -24
1,200 -24
6
Output RF Spectrum
(due to switching transient)
1,800 -27
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
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LGE Internal Use Only
2. PERFORMANCE
GX500 Operational Description Revision A
7 Spurious Emissions
Conduction, Emission Status
Conduction, Emission Status
8
Bit Error Ratio
EGSM/GSM850
BER (Class II) < 2.439% @-102dBm
DCS1800/PCS1900
BER (Class II) < 2.439% @-102dBm
9
Rx Level Report accuracy
r 3 dB
10 SLR
8 r 3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 /
200 0 /
300 0 -12
1,000 0 -6
2,000 4 -6
3,000 4 -6
3,400 4 -9
11
Sending Response
4,000 0 /
12 RLR 2 r 3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 /
200 0 /
300 2 -7
500 * -5
1,000 0 -5
3,000 2 -5
3,400 2 -10
4,000 2
13 Receiving Response
* Mean that Adopt a straight line in between
300 Hz and 1,000 Hz to be Max. level in the
range.
14 STMR
13 r 5 dB
15 Stability Margin > 6 dB
dB to ARL (dB) Level Ratio (dB)
-35 17.5
-30 22.5
-20 30.7
-10 33.3
0 33.7
7 31.7
16
Distortion
10 25.5
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Only for training and service purposes
2. PERFORMANCE
GX500 Operational Description Revision A
17
Side tone Distortion Three stage distortion < 10%
18
<Change> System frequency (26 MHz)
tolerance
d 2.5 ppm
19
<Change>32.768KHz tolerance
d 30ppm
20
Power consumption
Standby
- Normalஆd 3.8 mA(@PP5)
21
Talk Time
EGSM/Lvl 7(Battery Capacity 1500mA):450 min
EGSM/Lvl12(Battery Capacity 1500 mA):630min
22
Standby Time
Under conditions, at least 390 hours:
1. Brand new and full 1500mAh battery
2. Full charge, no receive/send and keep GSM in
idle mode.
3. Broadcast set off.
4. Signal strength display set at 3 level above.
5. Backlight of phone set off.
23
Ringer Volume
At least 65 dB under below conditions:
1. Ringer set as ringer.
2. Test distance set as 50 cm
24
Charge Current Normal charging : 680 mA
Antenna Bar Number
Power
7
>-92 dBm a
5
-97dBm a –93dBm
4
-100dBm a –98dBm
2
-103dBm a –101dBm
1
-105dBm a –104dBm
0 < –106 dBm
25
Antenna Display
Off No Service
Battery Bar Number Voltage (±0.05V)
3 3.69V~4.2V
2 3.53V~3.69V
1 3.43V~3.53V
26 Battery Indicator
0 3.35V~3.43V
3.53VĻ±0.05V (Call)
27 Low Voltage Warning
3.43VĻ±0.05V (Standby)
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
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LGE Internal Use Only
2. PERFORMANCE
GX500 Operational Description Revision A
28 Forced shut down Voltage
3.3 r 0.05 V
29
Battery Type
Li-Polymer Battery
Standard Voltage = 3.7 V
Battery full charge voltage = 4.2 V
Capacity: 1500mAh
30
Travel Charger
Switching-mode charger
Input: 150 a 240 V, 50/60Hz
Out put: 5.1, 0.7A
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Only for training and service purposes
2. PERFORMANCE
GX500 Operational Description Revision A
* EDGE RF Specification (Option: is not serviced for ”EDGE mode”)
Item Description
Specification
1 RMS EVM
≤9%
2 Peak EVM
≤30%
3 95th Percentile EVM
≤15%
4 Origin Offset Suppression
≥30dB
GSM850/EGSM
Level Power Toler. Level Power Toler.
5 27dBm ±3dB 13 17dBm ±3dB
6 27dBm ±3dB 14 15dBm ±3dB
7 27dBm ±3dB 15 13dBm ±3dB
8 27dBm ±3dB 16 11dBm ±5dB
9 25dBm ±3dB 17 9dBm ±5dB
10 23dBm ±3dB 18 7dBm ±5dB
11 21dBm ±3dB 19 5dBm ±5dB
12 19dBm ±3dB
DCS1800, PCS1900
Level Power Toler. Level Power Toler.
0 26/25dBm ±3dB 8 14dBm ±3dB
1 26/25dBm ±3dB 9 12dBm ±4dB
2 26/25dBm ±3dB 10 10dBm ±4dB
3 24dBm ±3dB 11 8dBm ±4dB
4 22dBm ±3dB 12 6dBm ±4dB
5 20dBm ±3dB 13 4dBm ±4dB
6 18dBm ±3dB 14 2dBm ±5dB
5 Power Level
7 16dBm ±3dB 15 0dBm ±5dB
GSM850/EGSM
Offset from carrier(kHz) Max. dBc
100 +0.5
200 -30
250 -33
400 -54
600~<1,200 -60
1,200~<1,800 -60
1,800~<3,000 -63
3,000~<6,000 -65
6
Output RF Spectrum
(due to modulation)
6,000 -71
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
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LGE Internal Use Only
2. PERFORMANCE
GX500 Operational Description Revision A
DCS1800, PCS1900
Offset from carrier(kHz) Max. dBc
100 +0.5
200 -30
250 -33
400 -54
600~<1,200 -60
1,200~<1,800 -60
1,800~<3,000 -63
3,000~<6,000 -65
6,000 -71
GSM850/EGSM
Offset from carrier(kHz) Max. dBm
400 -23
600 -26
1,200 -27
1,800 -30
DCS1800, PCS1900
Offset from carrier(kHz) Max. dBm
400 -23
600 -26
1,200 -27
7
Output RF Spectrum
(due to switching transient)
1,800 -30
6
LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.
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Only for training and service purposes
3. TECHNICAL BRIEF
GX500 Operational Description Revision A
III. Technical brief
III-1 Baseband circuit
3.1 GX500 Functional Block diagram
The functional component arrangement is mentioned below diagram.
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Figure 3-1. GX500 Functional Block diagram
3. TECHNICAL BRIEF
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 17 -
LGE Internal Use Only
3. TECHNICAL BRIEF
GX500 Operational Description Revision A
3.2 Dual Baseband Processor (BBP) Introduction
GX500 is composed of dual Baseband Processor. (S-Gold3 & S-Gold Radio)
3.2.1 S-Gold3 Part
Figure3- 2. Top level block diagram of the S-GOLD3
TM
(PMB8877)
LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.
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Only for training and service purposes
3. TECHNICAL BRIEF
GX500 Operational Description Revision A
3.2.1.1 General Description
S-GOLD3
TM
is a GSM/EDGE single chip mixed signal Baseband IC containing all analog and digital functionality
of a cellular radio. Additionally S-GOLD3
TM
Provides multimedia extensions such as camera, software MIDI,
MP3 sound. It is designed as a single chip solution, integrating the digital and mixed signal portions of the
base band in 0.09um, 1.2V technology.
The chip will fully support the FR, EFR, HR and AMR-NB vocoding.
S-GOLD3TM support multi-slot operation modes HSCSD (up to class 10), GPRS for high speed data application
(up to class 12) and EGPRS (up to class 12) without additional external hardware.
3.2.1.2 Block Description
z Processing core
ARM926EJ-S 32 bit processor core for controller functions. The ARM926EJ-S includes an MMU, and the
Jazelle Java extension for Java acceleration.
- TEAKLite DSP core
z ARM-Memory
- 32k Byte Boot ROM on the AHB
- 96k Byte SRAM on the AHB, flexibly usable as program or data RAM
- 16k Byte Cache for Program (internal)
- 8k Byte tightly coupled memory for Program(internal)
- 8k Byte Cache for Data(internal)
- 8k Byte tightly coupled memory for Data(internal)
z DSP-Memory
- 104K x 16bit Program ROM
- 8k x 16bit Program RAM
- 60k x 16bit Data ROM
- 37k x 16bit Data RAM
- Incremental Redundancy(IR) Memory of 35904 words of 16bit
z Shared Memory Block
1.5K x 32bit Shared RAM(dual ported) between controller system and TEAKLite.
z Controller Bus system
The processor cores and their peripherals are connected by powerful buses.
Multi-layer AHB for connecting the ARM and the other master capable building blocks with the internal
and external memories and with the peripheral buses.
z Clock system
The clock system allows widely independent selection of frequencies for the essential parts of the S-GOLD3.
Thus power consumption and performance can be optimized for each application.
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
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LGE Internal Use Only
3. TECHNICAL BRIEF
GX500 Operational Description Revision A
z Functional Hardware block
- CPU and DSP Timers
- MOVE coprocessor performing motion estimation for video encoding algorithms
(H.263, MPEG-4)
- Programmable PLL with additional phase shifters for system clock generation
- GSM Timer Module that off-loads the CPU from radio channel timing
- GMSK / 8-PSK Modulator according to GSM-standard 05.04 (5/2000)
- GMSK Modulator: gauss-filter with B*T=0.3
- EDGE Modulator: 8PSK-modulation with linearized GMSK-Pulse-Filter
- Hardware accelerators for equalizer and channel decoding.
- Incremental Redundancy memory for EDGE class 12 support
- A5/1, A5/2, A5/3 Cipher unit
- GEA1, GEA2, GEA3 Cipher Unit to support GPRS data transmission
- Advanced static and dynamic power management features including TDMA-Frame
synchronous low power mode and enhanced CPU modes(idle and sleep modes)
- Pulse Number Modulation output for Automatic Frequency Correction(AFC)
- Serial RF Control interface: support of direct conversion RF
- A Universal Serial Interface(USIF) enabling asynchronous (UART) of synchronous (SPI)
serial data transmission
- 3 USIF with autobaud detection, hardware flow control and integrated
- A dedicated Fas IfDA Controller supporting IrDA’s SIR,MIR and FIR standards
(up to 4Mbps)
- I2C-bus interface (e.g. connection to S/M power)
- A fast display interface supporting serial and parallel interconnection
- An ITU-R BT.656 compatible Camera interface.
- Programmable clock output for a camera
- An multimedia/Secure Digital Card Interface (MMCI/SD:SDIO capable)
3.2.1.3 External Devices connected to memory interface
Table 3-1. Memory interface
Device Name Maker Remark
NAND FLASH H8ACS0SJ0MCP-56M Hynix
SDR H8ACS0SJ0MCP-56M Hynix
LCD
DPRAM
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Only for training and service purposes
3. TECHNICAL BRIEF
GX500 Operational Description Revision A
3.2.1.4 RF Interface (T_OUT)
S-Gold3 uses this interface to control RF IC and Peripherals. 13 signals are provided switch on/off RF ICs
Periodically each TDMA frame.
Table 3-2. RF Interface Spec.
T_OUT
Resource Interconnection Description
T_OUT0 TXON_PA PAM Power on
T_OUT1 FE2 FEM Control
T_OUT2 PA_BAND TX RF band select
T_OUT3 FE1 FEM control
T_OUT6 PA_MODE PAM Mode select
3.2.1.5 USIF Interface
GX500 have three USIF Drivers as follow :
- USIF1 : Hardware Flow Control / SW upgrade / Calibration
- USIF2 : Not used Rx, Tx and CTS, RTS use BT Interface
- USIF3 : BT Interface
Table 3-3. USIF Interface Spec.
3.2.1.6 ADC channel
BBP ADC block is composed of 10 external ADC channel. This block operates charging process and other
related process by reading battery voltage and other analog values.
Table 3-4. S-Gold3 ADC channel usage
ADC channel
Resource Interconnection Description
M0 BAT_ID Battery temperature measure
M1 RF_TEMP RF block temperature measure
M8 VSUPPLY Battery supply voltage measure
Resource Name Remark
USIF1
USIF1_TXD SIM1_UART_TX Transmit Data
USIF1_RXD SIM1_UART_RX Receive Data
USIF1_CTS USB_SE0_VM USB
USIF1_RTS USB_DAT_VP USB
USIF2
USIF2_CTS SIM1_BT_CTS BlueTooth
USIF2_RTS SIM1_BT_RTS. BlueTooth
USIF3
USIF3_TXD SIM1_BT_TX BT Transmit tx
USIF3_RXD SIM!_BT_RX BT Receive rx
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Only for training and service purposes
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LGE Internal Use Only
3. TECHNICAL BRIEF
GX500 Operational Description Revision A
3.2.1.7 GPIO map
Over a hundred allowable resources, GX500 is using as follows except dedicated to SIM and Memory. GX500
GPIO(General Purpose Input/Output) Map, describing application, I/O state, and enable level, is shown in
below table
Table 3-5 S-Gold3 GPIO pin Map
Port function Signal Name Reset Value Description
#Keypad G G G
KP_IN0 KEY_ROW0 T/PU G
KP_IN1 KEY_ROW1 T/PU G
KP_IN4 KEY_ROW4 T/PU G
GPIO_03 HSMIC_BIAS_EN T/PU G
CC0CC4IO CHG_DET T/PU "Falling Edge" INT on TA
CC1CC0IO MMC_DET T/PU "Falling Edge" INT
CC1CC4IO ACCEL_INT T/PU For Accel Sensor
KP_OUT0 KEY_COL0 T/PU G
KP_OUT1 KEY_COL1 T/PU G
KP_OUT2 KEY_COL2 T/PU G
KP_OUT3 KEY_COL3 T/PU G
#USIF1: Universal Serial IF
#USB
G G G
USIF1_RXD_MRST SIM1_UART_RX T/PD G
USIF1_TXD_MTSR SIM1_UART_RX T/PD G
USIF1_RTS_N USB_DAT_VP T/PU G
USIF1_CTS_N USB_SE0_VM T/PD G
G G G G
GPIO_15 BT_SEL T/PU G
GPIO_16 USB_SEL T/PD G
USIF2_RTS_N SIM1_BT_RTS T/PD G
USIF2_CTS_N SIM1_BT_CTS T/PD G
G G G G
USIF3_RXD_MRST SIM1_BT_RX T/PD G
USIF3_TXD_MTSR SIM1_BT_TX T/PD G
GPIO_21 SGR_PWR_ON T/PD "High" Enable
G G G G
MMCI2_CMD MMC_CMD T/PD G
MMCI2_DAT[0] MMC_D0 T/PD
MMCI2_CLK MMC_CLK T/PD
G G G G
CIF_D0 CIF_D0 T/PD G
CIF_D1 CIF_D1 T/PD G
CIF_D2 CIF_D2 T/PD G
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3. TECHNICAL BRIEF
GX500 Operational Description Revision A
CIF_D3 CIF_D3 T/PD G
CIF_D4 CIF_D4 T/PD G
CIF_D5 CIF_D5 T/PD G
CIF_D6 CIF_D6 T/PD G
CIF_D7 CIF_D7 T/PD G
CIF_PCLK CIF_PCLK
T/PD G
CIF_HSYNC CIF_HSYNC
T/PD G
CIF_VSYNC CIF_VSYNC
T/PD G
CLKOUT2 CIF_MCLK
T/PD G
CIF_PD CIF_PD
T/PD
CIF_RESET
CIF_RESET
T/PD G
#Display_Interface G G G
DIF_D0
DIF_D0
T/PD G
DIF_D1
DIF_D1
T/PD G
DIF_D2
DIF_D2
T/PD G
DIF_D3
DIF_D3
T/PD G
DIF_D4
DIF_D4
T/PD G
DIF_D5
DIF_D5
T/PD G
DIF_D6
DIF_D6
T/PD G
DIF_D7
DIF_D7
T/PD G
GPIO_109 MIC_BIAS_EN T/PD "High" Enable
DIF_CS1 DIF_CS T/PU G
GPIO_96 TOUCH_EN T/PU G
DIF_CD DIF_CD
T/PU G
DIF_WR DIF_WR
T/PU G
DIF_RD DIF_RD
T/PU G
EINT7
USW_INT
T/PD G
DIF_VD
DIF_VSYNC
T/PD
GPIO_27
DIF_RESET
T/PD G
GPIO_101 LCD_BL_CTRL
T/PD G
#I2C1 G G G
I2C1_SCL SCL T G
I2C1_SDA SDA T G
PM_INT PM_INT # G
#I2C2 G G G
I2C2_SCL CODEC_SCL T G
I2C2_SDA CODEC_SDA T G
#Chip Card (USIM1) G G G
CC_IO SG3_SIM1_IO L G
CC_CLK SG3_SIM1_CLK L G
CC_RST SG3_SIM1_RST L G
G G G G
GPIO_110 USB_OEn T/PD G
EINT3 BT_HOST_WAKEUP
T/PU
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LGE Internal Use Only
3. TECHNICAL BRIEF
GX500 Operational Description Revision A
G G G G
SWIF_TXRX G T/PU Not Used
G G G G
MMCI1_CMD
WLAN_CMD
T/PD G
MMCI1_DAT[0]
WLAN_SDIO[0]
T/PD G
MMCI1_CLK
WLAN_CLK
T/PD G
G G G G
MMCI1_DAT[1]
WLAN_SDIO[1]
T/PD G
MMCI1_DAT[2]
WLAN_SDIO[2]
T/PD G
MMCI1_DAT[3]
WLAN_SDIO[3]
T/PD G
G G G G
I2S1_CLK0
SIM1_I2S1_CLK
T/PD G
GPIO_112
RPWRON
T/PD G
I2S1_RX
SIM1_I2S1_RX
T/PD G
I2S1_TX
SIM1_I2S1_TX
T/PD G
I2S1_WA0
SIM1_I2S1_WA0
T/PD G
G G G G
EINT4 _EOC
T/PD End Of Charge
GPIO_102 LCD_ID
T/PD G
CC0CC1IO _PPR
T/PD USB/TA Charger Insert
GPIO_33
SG3_INT
T/PD
To SGR
CC0CC3IO VIB_PWM
T/PD
T0 timer (PWM)
GPIO_103 NA
T/PD
G G G G
EPN1 EAR_N G G
EPP1 EAR_P G G
EPPA1 BB_SND_L G G
EPREF G G G
EPPA2 BB_SND_R G G
MICN1 SIM1_MIC_N G G
MICP1 SIM1_MIC_P G G
MICN2 SIM1_HSMIC_N G G
MICP2 SIM1_HSMIC_P G G
AUXN1 GND G Connected to GND
AUXP1 GND G Connected to GND
AUXN2 GND G Connected to GND
AUXP2 GND G Connected to GND
AUXGND G G G
VMICP TP 116 G Not Used
VMICN GND G Connected to GND
#I/Q-Signale: Analog
Interface, Baseband
G G G
PAOUT1 PA_LEVEL G G
BB_I I G G
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Only for training and service purposes
3. TECHNICAL BRIEF
GX500 Operational Description Revision A
BB_IX IX G G
BB_Q Q G G
BB_QX QX G G
#Measurement G G G
M_0
BAT_ID
G G
M_1 S1_RF_TEMP
G G
M_2
ʳ
G
M_3 TP 101
G Not Used
M_4
ʳ
G Not Used
M_5 ʳ
G G
M_6
ʳ
G G
M_7 TP 105
G Not Used
M_8
VSUPPLY
G G
M_9 ʳ
G G
M_10
ʳ
G G
G G G G
G VREFN G G
G G G G
#JTAG G G G
TDO S1_TDO T G
TDI S1_TDI PU G
TMS S1_TMS PU G
TCK S1_TCK PD G
TRST_n S1_TRSTn PD G
RTCK S1_RTCK L G
#Debug G G G
TRIG_IN S1_TRIG_IN PD/Latched
MON1 2V62_VIO PD/Latched
MON2 G PD/Latched
config pins (MON1, MON2, TRIG_IN)
according to memory types =>
NAND 8-bit
TRACESYNC TRACESYNC L G
TRACECLK TRACECLK L G
PIPESTAT[2] PIPESTAT2 H G
PIPESTAT[1] PIPESTAT1 H G
PIPESTAT[0] PIPESTAT0 H G
TRACEPKT[0] TRACEPKT0
L G
TRACEPKT[1] TRACEPKT1 L G
TRACEPKT[2] TRACEPKT2 L G
TRACEPKT[3] TRACEPKT3 L G
TRACEPKT[4] TRACEPKT4 L G
TRACEPKT[5] TRACEPKT5 L G
TRACEPKT[6] TRACEPKT6 L G
TRACEPKT[7] TRACEPKT7 L G
Copyright © 2010 LG Electronics. Inc. All right reserved.
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- 25 -
LGE Internal Use Only
3. TECHNICAL BRIEF
GX500 Operational Description Revision A
G G # TP 106
G S1_ADD(31) H G
G _RD_S1 H G
G S1_DATA(0) T/PD G
G S1_DATA(1) T/PD G
G S1_DATA(2) T/PD G
G S1_DATA(3) T/PD G
G S1_DATA(4) T/PD G
G S1_DATA(5) T/PD G
G S1_DATA(6) T/PD G
G S1_DATA(7) T/PD G
G S1_DATA(8) T/PD G
G S1_DATA(9) T/PD G
G S1_DATA(10) T/PD G
G S1_DATA(11) T/PD G
G S1_DATA(12) T/PD G
G S1_DATA(13) T/PD G
G S1_DATA(14) T/PD G
G S1_DATA(15) T/PD G
G _NAND_CS_S1 H G
G _RAM_CS_S1 H G
G _DPRAM_CS_S1 H G
G G H G
G _WR_S1 H G
G S1_ADD(16) L G
G S1_ADD(17) L G
G S1_ADD(18) L G
G S1_ADD(19) L G
G S1_ADD(20) L G
G S1_ADD(21) L G
G S1_ADD(22) L G
G S1_ADD(23) L G
G S1_ADD(24) L G
G S1_ADD(25) L G
G S1_ADD(26) L G
G S1_ADD(27) H G
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Only for training and service purposes
3. TECHNICAL BRIEF
GX500 Operational Description Revision A
G S1_ADD(28) H G
G S1_ADD(29) H G
G S1_ADD(30) H G
G G L G
G S1_SDCLKI T G
G S1_SDCLKO H G
G _BC0_S1 H G
G _BC1_S1 H G
G _BC2_S1 H G
G _BC3_S1 H G
G S1_ADD(0) T/PD G
G S1_ADD(1) T/PD G
G S1_ADD(2) T/PD G
G S1_ADD(3) T/PD G
G S1_ADD(4) T/PD G
G S1_ADD(5) T/PD G
G S1_ADD(6) T/PD G
G S1_ADD(7) T/PD G
G S1_ADD(8) T/PD G
G S1_ADD(9) T/PD G
G S1_ADD(10) T/PD G
G S1_ADD(11) T/PD G
G S1_ADD(12) T/PD G
G S1_ADD(13) T/PD G
G S1_ADD(14) T/PD G
G S1_ADD(15) T/PD G
G _RAS_S1 H G
G _CAS_S1 H G
G S1_CKE L G
G G G G
FCDP_RBn S1_FCDP T/PU G
G G G G
FWP _DPRAM_SEM_S1 T/PU G
G G G G
T_OUT0 TXON_PA
T/PD/Latched
ʳ
GPIO_44 WLAN_WAKEUP
T/PD/Latched
WIFI
T_OUT2 S1_PA_BAND
T/PD/Latched
ʳ
GPIO_46 WLAN_ENABLE
T/PD
WIFI
GPIO_47 ʳ
T/PU
NA
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 27 -
LGE Internal Use Only
3. TECHNICAL BRIEF
GX500 Operational Description Revision A
CC1CC1IO SGR_INT
T/PD
from SGR
T_OUT6 PA_MODE
T/PD
ʳ
GPIO_50 SGR_Resetn
T/PD/Latched
SGR RESET 洢歾穞処 穳旇
HIGH 決檺檂 穮
GPIO_51 UART_SEL
T/PD/Latched
ʳ
GPIO_52 LIN_MOTOR_EN
T/PD/Latched
MOTOR DRIVER IC CONTROL
CC1CC7IO
WLAN_HOST_WAKE
UP
T/PU/Latched
WIFI
GPIO_54 SIM_SWITCH
T/PD
ʳ
GPIO_55 _CHG_EN
T/PD
Charging IC Enable & control
#SPCU G G G
GPIO_117 SIM1_SIM2_SEL
T/PD
ʳ
GPIO_118
BT_ENABLE
T/PD
WIFI
SPCU_RC_OUT0 VCXO_EN
H
ʳ
SPCU_RQ_IN2
RESOURCE_CTRL
T/PD
ʳ
#RF Control Unit G G G
RF_STR0 RF_EN T/PD G
GPIO_57 _DPRAM_BUSY_S1 T/PD/Latched
RF_DATA RF_DA L G
RF_CLK RF_CLK L G
#Other Functional Pins:
Clocks and control
G G G
AFC AFC T G
EINT1 _DPRAM_INT_S1 T/PD 1.8V Power Domain
F26M 26MHZ_MCLK # G
F32K G # Connected to 32KHz
OSC32K G # Connected to 32KHz
RESET_n _RESET # G
GPIO_59 SIM1_DSR T G
RTC_OUT RTC_OUT # TP 110
G G G G
CLK32K CLK32K
T/PD
WIFI
DSPOUT1 WDOG
T/PD
ʳ
GPIO_63 BT_WAKEUP
T/PU
WIFI
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Only for training and service purposes
3. TECHNICAL BRIEF
GX500 Operational Description Revision A
3.2.2 S-Gold Radio Part
Figure 3-3. S-Gold Radio Circuit Diagram of GX500
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 29 -
LGE Internal Use Only
3. TECHNICAL BRIEF
GX500 Operational Description Revision A
3.2.2.1 Block Description
Connectivity
TM offers a variety of connectivity options common in today’s feature phone applications:
• USB 2.0 Full Speed (12 Mbps)
• IrDA Controller
Supports Infrared SIR Mode Transceivers
• RS-232 over a 16C550 compliant UART
• MMC/SD Memory Card Interface
– Low Voltage Capable
– SDIO expandable (using external components)
• Ready to connect to the Infineon’s Bluemoon Family Bluetooth Transceivers
– HCI (H5) optimized USIF (Universal Serial Interface)
– Dedicated PCM-style digital audio interface (I2S)
– Dedicated power supply
• Microcontroller-Like Extension Interface
For multimedia companions (for example, complex display/camera modules or graphic accelerators)
• External Memory Interface
Supporting:
– SDRAM
– Cellular RAM
– Burst Flash
– SRAM
– NAND flashes (error correction capability in HW)
• User Interface (Keypad)
Supporting up to 74 keys with multiple key-press capability
• SIM Card interface (USIM)
ISO 7816 compatible
• Analogue Measurement Unit
For various general purpose measurements such as battery voltage, battery, VCXO and environmental
temperature, battery technology, transmission power, offset, on-chip temperature, etc.
Security
TM has the following security features:
• Secure Boot and Flash Update
• SHA1 HW acceleration
• Secure Debug
• 128-bit customer defined efuse key
• Anti-intrusion logic.
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Only for training and service purposes
3. TECHNICAL BRIEF
GX500 Operational Description Revision A
Audio
Besides the telephony voice CODECs supplied by the Firmware running on the TEAKLite® DSP core, the
ARM926 core enables running high-quality audio CODECs such as MPEG-1/2 Layer-3 Decode (MP3), AAC+ or
AAC++. Audio streaming is supported according to the 3GPP PSS Release 4 standard.
The output of audio and voice codecs can be mixed and routed to the integrated Hi-Fi Stereo voiceband
supporting CD-Quality. Alternatively, the audio can also be sinked to a mono loudspeaker using the
integrated hands-free amplifier.
Video and Imaging
TM allows connecting an external camera module over an ITU-R BT656 compliant interface and a
TM also enables video down-streaming because of its DSP and ARM performances.
Supported "still pictures" multimedia scenarios are:
• View Finding for a Picture Snapshot: Captured frames are transferred from the camera IF to the display
IF at up to15 fps (depending on the camera used) in QCIF resolution (depending on the display used).
Downscaling and color conversion is done by the camera and display interface logic. Therefore, view
finding for a snapshot is possible without burdening the CPU. However, picture rotation and/or overlay are
performed by SW if required.
• Shooting: The captured picture, with up to 1.31 MPixel resolution (SXGA 1280 x 1024), is transferred
within 1/15 sec to external memory.
1) Then, JPEG compression is done by SW, while the viewfinder is
frozen so that the user can immediately see the snapshot on the display.
• Photo Flash: Under low light conditions usually a photo flash is required. To activate the flash at the right
time, a general purpose timer unit (GTPU) can be used that is triggered by the frame synchronization signal
(VSYNC) from the camera interface.
• Processing: JPEG thumbnail generation, picture overlay, picture rotation and other picture processing
tasks are performed by SW.
• Viewing: A JPEG picture is decoded, down-scaled and format converted by SW and then transferred to
the display interface. JPEG thumbnails can also be transferred directly to the display interface after
decoding by SW without additional downscaling.
• Storage: JPEG pictures can be stored on an MMC/SD card, a Flash or a PC.
• Sending/Receiving: JPEG thumbnails can be sent/received as MMS (E-GPRS). Full resolution JPEG
pictures can be sent/received as e-mail or downloaded from the internet.
Supported "video sequence" multimedia scenarios:
• Record Video Sequences: Captured frames in QCIF resolution are transferred to internal memory at 15
fps. H.263 or MPEG-4 encoding is performed on-the-fly by SW with the support of the MOVE coprocessor.
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
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