LG GX200 Service Manual

LG Electr

onics

GX200

Service Manual

1

Table Of Contents

1. INTRODUCTION…………………....3

1.1 Purpose………………………………….3

1.2 Regulatory Information………………...3

2. PERFORMANCE…………………...5

2.1 H/W Features…………………………...5

2.2 S/W Features…………………………...6

3. TECHNICAL BRIEF……………….19

3.1 Digital Main Processor(

3.2 Power Amplifier Module(

3.3 Transceiver Module(

3.4 Bluetooth Module (

3.5 Memory Module (

3.6 FM Radio Module (Si4708)…………..38

3.7 LCD Interface……………………….…40

3.8 SIM& Micro SD Card Interface….…...43

3.9 KEYPAD Interface………..…………...45

3.10 Battery Charging Block Interface…..46

K5D12571CA-D090)

MT6235

SKY77531

AD6548

)…………...28

MT6601

)………….….30

)………..19

)…….27

……...33

4.15 Bluetooth Voice Trouble………….98

4.16 Speaker Trouble…………………101

4.17 Headphone Trouble……………..104

4.18 T-Flash Trouble…………………..109

4.19 USB Download Trouble………....112

4.20 Bluetooth Trouble………………..117

4.21 FM RECEIVER Trouble…………122

4.22 RF TRANSCEIVER +AP Trouble124

5. DOWNLOAD………………...…132

5.1 Download setup…………………...132

5.2 Download Process………………...133

6. BLOCK DIAGRAM…………….141

7. CIRCUIT DIAGRMA……………142

8. BGA IC PIN Check…………….155

3.11 Audio Interface……………….….…...47

3.12 Vibrator Interface….…………………49

3.13 Camera Interface…………………….50

4. TROUBLE SHOOTING…………...52

4.1 Power On Trouble…………………….52

4.2 SIM Card Trouble……………………..58

4.3 Vibrator Trouble……………………….61

4.4 RTC Trouble…………………………...63

4.5 SIM1 SIM 2 LED Trouble…………….65

4.6 Sub Key LED backlight Trouble……..67

4.7 LCD Backlight Trouble……………….70

4.8 LCM Trouble…………………………..73

4.9 Charging Trouble……………………..77

4.10 Master Microphone Trouble……......81

4.11 Receiver Trouble……………...…….84

4.12 Camera Trouble……………………..87

4.13 Key Board Trouble……………….....90

9. PCB LAYOUT…………………..158

10.ENGINEERING MODE……….160

11. CALIBRATION………………..168

11.1 Test Equipment Setup…………..168

11.2 Calibration Steps………………...169

12. STAND ALONE TEST……….208

12.1 Test Configuration……………….208

12.2 META tool Install process………209

12.3 Rx Test……………………………212

12.4 Tx Test…………………………….217

13. EXPLODED VIEW&
REPLACEMENT PART LIST…….219

13.1 Exploded View……………………219

13.2 Replacement Part list.…………....221

4.14 Flash LED Trouble………………….95

2

1. INTRODUCTION

1.1 Purpose

This manual provides information necessary to repair, description and download the

features of this model.

1.2 Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part(for
example ,persons other than your company’s employees, agents, subcontractors, or person
working on your company’s behalf) can result in substantial additional charges for your
telecommunications services.

system users are responsible for the security of own system. There are may be risks of toll
fraud associated with your telecommunications system. System users are responsible for
programming and configuring the equipment to prevent unauthorized use .The manufacturer
dose not warrant that this product is immune from the above case but will prevent
unauthorized use of common-carrier telecommunications service of facilities accessed through
or connected to it.

The manufacturer will not be responsible for any charges that result from such unauthorized
use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and
possibly causing harm or interruption in service to the telephone network, it should disconnect
telephone service until repair can be done. A telephone company may temporarily disconnect
service as long as repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure.
If these changes could reasonably be expected to affect the use of the this phone or
compatibility with the network, the telephone company is required to give advanced written
notice to the user, allowing the user to take appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on this model must be performed only by the manufacturer or its
authorized agent . The user may not make any changes and/or repairs expect as specifically
noted in this manual.

Therefore, note that authorized alternations or repair may affect the regulatory status of the
system and may void any remaining warranty.

E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined
by local regulatory agencies. In accordance with these agencies, you may be required to
provide information such as the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look

-3-

slightly different.

G. Interference and Attenuation

Phone may interfere with sensitive laboratory equipment, medical equipment, etc.

Interference from unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Devices(ESD),are indicated by the
sign .
Following information is ESD handing:
. Service personnel should ground themselves by using a wrist strap when exchange system

boards.
. When repairs are made to a system board , they should spread the floor with anti-static mat
which is also grounded .

. Use a suitable, grounded soldering iron .
. Keep sensitive parts in these protective packages until these are used.
. When returning system boards or parts like EEPROM to the factory, use the protective

packages as described.

-4-

2. PERFORMANCE

2.1 H/W Features

Solution

Type Bar type

Antenna Type Internal (Quad-Band) 850/900/1800/1900-

Main Display 2.0” 176x220 QCIF LGIT

GPRS Class 10

MMS Yes, 1.1

Camera 1.3M FF Abico

Flash Light Yes, / no Torch Definition check ??

Battery 1500mAh Li-ion inner pack Wisepower

Audio player Yes MP3/AAC/WAV

MT6235B

Media Tek

Benchmark (??)

FM Receiver Yes , US/Europe band support

MPEG4/H.263 Yes (support 3GP)

H.264 No(no support)

AAC Yes
AAC+

WMA

FM alarm

Scheduled FM recording

MP4 for incoming call/ power on off
animation and screen saver

Loud Speaker Yes

Audio player--real resuming Yes, for MP3 only

Video recording Yes

Memory Size

Internal NAND

Memory Card Micro SD

Yes

Yes(TBD) LGE will take care of

Yes

Yes

Yes

1G + 256Mb NAND Boot

Yes (Maximum is 80MB for

(87.5~108MHz) --­reserve embedded FM
antenna contact pin on
PCB

Microsoft License if
needed

user memory )

Up to 8GB

Bluetooth Yes, version 2.0 W/O EDR.

USB

WAP Yes, 2.0

Java Yes

SIM Status LED

MPEG4 caller ID Yes TBD

OTA Yes TBD

In flight mode Yes TBD

Yes, USB 2.0 full speed

YES, Green 1pcs, Red 1pcs (TBD) TBD by UI Scenario

-5-

Obigo Q03C

2.2 S/W Features

2-2-1 System Specification

Item Target Specification
Form Factor Bar Type
Size TBD

Weight TBD
Battery 3.7V, 1500mAh Li-Ion
Talk Time

Standby Time

Antenna Embedded type
LCD 2.0” 176x220 QCIF
FM Yes,
Camera 1.3M pixel FF

Back Light White LED
Keypad Backlight Color
Vibrator Yes
Loud Speaker

Microphone Yes
Earphone Jack No
SIM Socket Yes, 1.8/3.0V
Volume Key Side key (up/down)
Basic Accessory

4 hrs 52 min (292 min) @1500mAh @GSM900 PCL 10

400 min @1500mAh @GSM900 PCL 10

428 hrs@1500mAh @ Paging period 9;

500hrs@1500mAh @ Paging period 9

Landscape mode by default setting

Blue TBD, White(confirm)

Yes, 17

Travel Adaptor

Standard Battery (1500mA, Li-Ion)

Stereo Headset with button (FM)
USB Data Cable (Option)

ΦΦΦΦ

1ea, out put : 0.8W over

-6-

2-2-2 General Features

0.03V

0.03V

0.03 V

0.03 V

Speech Codec

Function Target Specification

Basic Display

RSSI (5 Level, 1~5) (7 Level, 0~6) (7 Level, ‘no service, 0, 1, 2, 4, 5, 7’)

Battery Indicator (4 Level, 0~3)

Battery Indicator

Antenna display (7 level settings and the corresponding RSSI)

Icons Indicator

Battery Indicator

4 3
3 -> 2
2 -> 1
1 -> 0

Voltage

3.88

3.72

3.62

3.54

±±±±

±±±±
±±±±
±±±±

Keypad

User Profile
(Audio
Settings)

Others reference to "Phone Personalization Setting"

FR/EFR/HR/AMR

Number of Keys: 24 Key (include 12 alphanumeric/number keys (0-9,#,*), 4 function
keys, 5 way navigation keys, 3 side keys)

Soft Function Keys : 2

International Access (+)(long 0)

User Selectable and Customizable Profiles (7 4 profiles: General, Meeting, Outdoor, Vibrate

only, Headset, Silent, Bluetooth Normal, Outdoor, Silent, Flight mode)

Auto-detect and activated profiles (1 profile: Headset)

Key Tone

Key Tone Volume (7 8 Level – 0 ~ 7, 0 for Mute) (6 Level - 0 ~ 5, 0 for Mute)

Key tone setting (4 sets: Silent, Click, Piano Tone, English/Russia Human voice)

(DTMF, English)

Ring Tone

Ring Tone Volume (7 8 Level – 0 ~ 7, 0 for Mute) (6 Level - 0 ~ 5, 0 for Mute)

Built-in Ring Tone Pattern: 20

Customizable Ring Tone Link: 5

Music player volume level: 7 Levels, 0~6, 0 for Mute

Intelligent Call Alert

Digits To Sound Synthesizing

Alert Type

6 5 Types - Ring, Vibration Only, Vibration and Ring, Ring after vibration, Silent Light Only,

Beep Once

-7-

Personalization

Power On Tone

Built-in Ring Tone Pattern: 3 (include Silent) Built-in Ring Tone Pattern: 4

Power Off Tone

Built-in Ring Tone Pattern: 3 (include Silent)

Message Tone

Built-in Ring Tone Pattern: 8 (include Silent) 7

Warning Tone

Built-in Ring Tone Pattern: 1 (Only On/Off operation)

Power on/off tones

Error Tone

Built-in Ring Tone Pattern: 1 (Only On/Off operation)

Camp On Tone

Built-in Ring Tone Pattern: 1 (Only On/Off operation)

Connect Tone

Built-in Ring Tone Pattern: 1 (Only On/Off operation)

Status LED

Built-in Lighting Pattern: 2 (None, Pattern 1)

Charger-in Status LED

Built-in Lighting Pattern: 2 (None, Pattern 1)

Information
Management

Tools and
Utilities

Answer Mode

Any Key Answer, Send Key only

Auto (Only available for headset mode while headset plugged in) TBD

Calendar - Month view only Personal

To do list - 6 fields (Date, Start time, End time, Note, Alarm, Repeat)

Alarm

5 sets of Alarm

4 major fields for each set - On/Off, Time, Repeat type, Audio option

World Clock

Cities list: China(52),IND(54),CIS(68) cities

Daylight saving time support: activated by user selection

Home city set

Calculator

Addition, Subtraction, Multiplication, Division

Unit Converter

Weight, Length, Currency Converter

Memo

To do

Health

BMI, Menstrual

Greeting Text Phone
Shortcuts

-8-

Setting

Security Phone Lock

Input Method

Flight Mode

Time and Date Setting

Wallpaper

Sceen Saver

Power On Animation

Power Off Animation

LCD Backlight

PLMN/Service Indicator (Display of PLMN Name/Service Provider Name from SIM)

Date Time Display

Own Number Display

Restore Factory Default Setting

SIM/Key Lock

Engine

T9

Support Language

Depends on customer and market requirement.
Total supported languages will be limited to memory condition.

Predictive word input

Game

Anti-theft
Mobile Tracker
(ATMT)

5 Java Games, provided by LGE. TBD

Settings:
BGM, Sound Effect, Vibration

Provide this feature by following LG spec. (GSM_VVLT 0 5_LMT_20071117_1.ppt)

-9-

2-2-3 GSM/GPRS Features

Supplementary

Function Target Specification

GPRS GPRS Multi slot Class 10

Data Service BS 24 - 26 (2400-9600 bit/s), asynchronous, non-transparent, UDI.

CSD rate up to 9.6K bit/s

Call History

Call Cost

GPRS Counter

Call Management

Call Related
Services

Last Dialed Number: 40

Last Received Number: 40

Last Missed Number: 40

Scratch Pad Memory (Save an input number in call): 1

Last Call Time

Total Dialed Call Time

Total Received Call Time

Last Call Cost

Total Cost

Max Cost

Price Per Unit

Last Sent (unit in Byte)

Last Received (unit in Byte)

All Sent (unit in Byte)

All Received (unit in Byte)

Call Swap

Call Retrieve

Automatic Redial

Speed Dialing

Last Number Redial

Support 50-digits Dialing Number from Idle, Phonebook in handset, and Call Log

(This feature will not be realized in LG33 project.)

1. Idle dial screen: OK

2. Phonebook (Phone): OK

3. Phonebook (SIM): Have limitation, depend on SIM card.

4. Call Log: OK

5. SMS: support 20-digit

6. MMS: support 50-digit

Call Hold

Call Waiting

Calling Line Identity Presentation

Calling Line Identity Restriction

Connected Identification Restriction

Call Divert All voice Calls

Call Divert if unreachable

Call Divert if no answer

Call Divert if busy
Call Divert all data calls
Cancel all divert

-10-

Quick Search (Notice: Quick search function only works in Phonebook, SMS and

Phone Book

Call Barring All Outgoing Calls

Call Barring All Outgoing International Calls
Call Barring All outgoing International except home
Call Barring All incoming Calls

Call Barring All incoming Calls when roaming

Multi-party Call (up to 7 calls, 5 in conference, 1 on held, 1 waiting)

Line switching (Line1, Line2)
Call reminder (Off, Single, Periodic)

Closed User Group

MMS. In other application, this phone supports regular search.)
Alpha Store and Recall

Access Phone Book in call

Copy & Move

Fixed Dial Number

Service Dial Number

Speed Dial Number

SOS Number

Entry: 1000 names (12 fields – Name, Mobile, Home, Company name, Email
address, Office number, Fax number, Birthday, Associate Picture, Associate
Video, Associate Sound, Caller group) ---- calculate the memory usage (60KB)

Message

Caller Group-5 caller group- Friends, Family, VIP, Business, Others (6 fields –
Name, Ring, Picture, LED pattern, Video, Member list)

Own Numbers: User can change the own numbers of handset. (Sets of own
numbers depends on SIM)

vCard: (Edit, Send and Receive. 7 fields – Name, Mobile, Home, Company
Name, Email Address, Office Number, Fax Number)

Note: This phone doesn’t support phone number search.

SMS

Standard SMS

SMS Reply Path

SMS Delivery Report
Valid period (1 hour/12 hours/1 day/1 week/Maximum)
Message Type (Text, Fax, Page, Email) Message Indication Type refer to GSM

03.40
Basic text-only SMS as described in 3GPP TS 23.040 R5

Notice: This phone doesn’t support video ring tone via SMS

SMS Character Sets Support

GSM7

UCS-2

EMS

EMS Standard as described in 3GPP TS 23.040 R5 excluding WVG

EMS Text Format

Text Style: Normal, Bold, Italic, Underlined, Strikethrough

-11-

Text Alignment: Left, Right, Center

Text Size: Normal, Large, Small

EMS Image Support

1-bit small image 16x16 pixels black and white

1-bit large image 32x32 pixels black and white

1-bit variable image in single SMS packet

Extended black and white 1-bit image up to 255x255 pixels

Extended 6-bit image up to 255x255

Pre-defined animation

User-defined small animation 8x8 pixel 4-frame black and white

User-defined large animation 16x16 pixel 4-frame black and white

Pre-defined sound

User-defined i-Melody up to 128 bytes

LZSS compression algorithm

Re-use extended object

Object Distribution

User Prompt Indicator

Hyperlink format element

Extended Object Distribution

Notice: This mobile doesn’t support Nokia smart message format (including
WBMP), only support *.ems format"  subject to Nokia smart message license

EMS Character Sets Support

GSM7

UCS-2

EMS Miscellaneous

SMS Concatenation ( 8 Segments for MT/MO)

SMS Compression

MMS

MMS Standard as described in 3GPP TS 23.140 V4.8.0

Extract media from Message

Insert Media into message

OTA provisioning partially support (Network Profile setting

Auto download mode

Manual download mode

Operator can pre-configure the delivery mode

MMS notification with icon or Pop-up message display)

MMS Message Format

MMS SMIL (A subset of SMIL descried in the MMS Conformance Document 1.2)

- maximal size for each MMS is limited by300KB

MMS Character Sets Support

US-ASCII

-12-

imum

Unicode

ISO-8859-1

UTF-16

UTF-8

MMS Images Support

WBMP Wireless bitmap

GIF87

GIF89a

JPEG

MMS Sound Formats Support

WAV

AMR

MIDI

MP3

i-Melody

MMS Miscellaneous

Multipart binary MIME

Storage

Separated Inbox folder for SMS and MMS

Separated Outbox folder for SMS and MMS

Total 300 SMS in the storage of phone plus SIM including Inbox and Outbox
( Phone could supports 260sets SMS including Inbox and Outbox. The max
SMS stored in SIM are 40sets. It means the actual SMS quantities in Inbox and
Outbox are among 260 to 300. )[p1]

Total 100 MMS in the phone storage including Inbox, draft and Outbox
Notice: Total MMS count need depends on user memory space.

Common Operation

Write Message

Read Message

Edit Message
(For MMS, Edit only conformance messages, unknown media not supported,
unknown SMIL not supported)

Reply Message

Send Message

Delete Message

Forward Message

Use Sender's Number

Message Templates

Extract media from Message (MMS/EMS)

Store Media (MMS/EMS)

Delete Media (MMS/EMS)

Cell Broadcast Read Cell Broadcast

-13-

Network

SIM

Cell Broadcast Mode: Receive On/Off

Cell Broadcast Message Language

Channel Setting

Automatic Network Selection

Manual Network Selection

Network Service Status

Preferred Network (User definition)

GPRS connection mode selection: Always, When Needed

Common Operation

SIM Application Toolkit (Release 98 Class 2 certified)

Prepaid SIM operation,

Security

PIN

Personalization (Service provider lock, Network lock)

DTMF Signaling DTMF

DTMF Enable & Disable

2-2-4 Multimedia Features

Function Target Specification

Camera

Image size:
128X160, 160X128, 320X240, 640X480,

Continuous Shot
9 shot, 5 shot, 3 shot, OFF

Zoom: 1x ~ 4x

Image Quality:
High, Normal, Low

White Balance:
Auto, Daylight, Tungsten, Fluorescent, Cloud, Incandescence

Shot: Three Shot Sounds

EV: -4 ~+4

Screen Mode:
Auto, Night

Banding: 60Hz/50Hz

Effect settings: (Total 14 13 types)
Normal, Grayscale, Sepia, Sepia Green, Sepia Blue,
Color Invert, Gray Invert, Blackboard, Whiteboard,

Copper Carving, Blue Carving, Embossment, Contrast, Sketch

-14-

No. of the Stick Frames: 3
Frame 1, Frame 2, None
Stick Frame Only can be used while image size is

128WX160H 240WX320H

Storage Selection:
Phone, Memory card
(Only available when external memory card supported)

Delay timer:
Off/ 5/ 10/ 15 Sec

Image Viewer

Thumbnail supported

Browse Style:
List, Matrix

View

Forward:
To Wallpaper, Phonebook, Picture ID, Screen Saver, Power On Display, Power

Off Display, MMS, Bluetooth

Rename

Delete

Delete All

Sort:
By Name, Type, Time, Size, None

Storage Selection:
Get list from Phone, Memory card
(Only available when external memory card supported)

Image Format Support

JPEG Baseline

GIF87a

Music Player

GIF89a

WBMP

BMP

Play

Pause

Resume

Stop

Next

Previous

Fast forward

Rewind

Storage Selection:
Get list from Phone, Memory card
(Only available when external memory card supported)

Auto-Generate Playlist

Skin: 2 skins

-15-

Repeat Mode:
Off, One Song, All Songs

Shuffle Play

Background Play

Equalizer Setting: 8 sets
Normal, Bass, Dance, Classical, Treble, Party, Pop, Rock

Volume Control:

7 level (0 ~ 6, 0 for Mute) 21 level (0~20, 0 for Mute)

Playlist Edit:
Add, Remove, Remove All

Sound Format Support

MP3

AMR

MIDI

WAV

AAC

Play

Pause

Video Player

Stop

Fast forward

Rewind

Speed Control:
X1, X2, X4, X8, X1/2

Forward:
To Phonebook, Screen Saver, Power On Animation, Power Off Animation, MMS,
Bluetooth

Rename

Delete

Delete All

Sort:
By Name, Type, Time, Size, None

Storage Selection:
Get list from Phone, Memory card

Volume Control:

7 level (0 ~ 6, 0 for Mute) 21 level (0~20, 0 for Mute)

Video Recorder

White Balance:
Auto, Daylight, Tungsten, Fluorescent, Cloud, Incandescence

EV: -4 ~+4

Night Mode:
On/Off

-16-

tar, Violin, Saxophone, Steel Drums, Flute, Harmonica, Trumpet, Music

melody file, so the

Banding: 60Hz/50Hz

Video Quality:
Fine, High, Normal, Low

File Size Limit:
No Limit, 95KB, 195KB, 295KB,

Record Time Limit:
No Limit, 15 sec, 30 sec, 60 sec

Record Audio:
On/Off

Encode Format:
MPEG4, H.263

Effect settings: (Total 14 13 types)
Normal, Grayscale, Sepia, Sepia Green, Sepia Blue,
Color Invert, Gray Invert, Blackboard, Whiteboard,
Copper Carving, Blue Carving, Embossment, Contrast, Sketch

Storage Selection:
Phone, Memory card
(Only available when external memory card supported)

Sound Recorder

Melody Compose

Record

Pause

Resume Recording

Stop

Storage Selection:
Phone, Memory card
(Only available when external memory card supported)

Encode Format:
WAV, AMR

Record

Pause

Resume Recording

Stop

Edit

Play

Save

Instrument Selection: 10 types
Piano, Gui
Box, Xylophone

Play Speed:
Fast, Normal, Slow

[Notice] Melody composer only support one instrument in one i
last chosen instrument will be used to play this imelody file

-17-

FM Radio

Frequencies: 87.5 ~ 108.0
Skin: 2 skins
User definable Preset Channel List

Channel Auto Search

Background Play

Record

Record Format:
AMR, WAV

Record Storage:
Phone, Memory Card
(Only available when external memory card supported)

Preset Channel List generated by auto search

JAVA

MIDP 2.0

CLDC 1.1

Memory Limit 1MB 2MB

Support JSR 139,118,120,135,185

QQ, MSN, Yahoo, Google (Java Application)

Support Text viewer (txt only)

2-2-5 Connectivity Features

Function Target Specification

WAP

WAP 2.0 Spec.

WAP Push OTA/Message

WAP Provisioning Service

CSD/GPRS data connection

Bookmark
Wireless Telephony Application (WTA) support:

Only Public WTA support, supported functions listing below ­ * Make a telephone call
* Send a string of DTMF tones over an established voice connection
* Add an entry to the telephone book of the device

USB

Support OTA push and push message

OTA Provisioning & OTA download

Supports WML, WCSS, XHTML mp

Version 2.0 (w/o EDR) Bluetooth

Profile: GAP,SDAP,DUN,SPP,HSP,HFP,OPP,FTP,A2DP, AVRCP,BPP

Mass Storage Device 2.0

Virtual COM

-18-

3. TECHNICAL BRIEF

3.1 Digital Main Processor

Figure.3-1-1 MT6235 FUNCTIONAL BLOCK DIAGRAM

-19-

3.1.1 System Overview

MT6235 is a highly-integrated and extremely powerful single-chip solution for

GSM/GPRS/EDGE mobile phones.

Based on the 32-bit ARM926EJ-STM RISC processor, MT6235’s superb processing power,
along with high bandwidth architecture and dedicated hardware support, provides an
unprecedented platform for high performance GPRS/EDGE Class 12 MODEM application.
Overall, MT6235 presents a revolutionary platform for mobile
devices.
.

Platform

MT6235 is capable of running the ARM926EJ-STM RISC processor at up to 208 MHz, thus
providing fast data processing capabilities. In addition to the high clock frequency, separate
CODE and DATA caches are also included to further improve the overall system efficiency.

For large amounts of data transfer, high performance DMA (Direct Memory Access) with
hardware flow control is implemented, which greatly enhances the data movement speed while
reducing MCU processing load.

Targeted as a high performance platform for mobile applications, hardware flash content
protection is also provided to prevent unauthorized porting of the software load to protect the
manufacturer’s development investment.

Memory

To provide the greatest capacity for expansion and maximum bandwidth for data intensive
applications such as multimedia features, MT6235 supports up to 4 external state-of-the-art
devices through its 8/16-bit host interface.High performance devices such as Mobile SDRAM and
Cellular RAM are supported for maximum bandwidth.Traditional devices such as burst/page
mode flash, page mode SRAM, and Pseudo SRAM are also supported. For greatest compatibility,
the memory interface can also be used to connect to legacy devices such as Color/Parallel LCD,
and multi-media companion chips are all supported through this interface. To minimize power
consumption and ensure low noise, this interface is designed for flexible
I/O voltage and allows lowering of the supply voltage down to 1.8V. The driving strength is
configurable for signal integrity adjustment.

Multi-media

The MT6235 multi-media subsystem provides a connection to a CMOS image sensor and
supports a resolution up to 2.0 Mpixels. With its high performance application platform, MT6235
allows efficient processing of image and video data.

In addition to image and video features, MT6235 utilizes high resolution DAC, digital audio, and
audio synthesis technology to provide superior audio features for all future multi-media needs.

Connectivity and Storage

To take advantage of its incredible multimedia strengths, MT6235 incorporates myriads of
advanced connectivity and storage options for data storage and communication. MT6235
supports UART, Fast IrDA, USB 2.0, SDIO,Bluetooth, Touch Screen Controller, WIFI Interface,
and MMC/SD/MS/MS Pro storage systems. These interfaces provide MT6235 users with the
highest degree of flexibility in implementing solutions suitable for the targeted application.

To achieve a complete user interface, MT6235 also brings together all the necessary
peripheral blocks for a multi-media GSM/GPRS/EDGE phone. The peripheral blocks include the
Keypad Scanner with the capability to detect multiple key presses, SIM Controller, Alerter, Real
Time Clock, PWM, Serial LCD Controller, and General Purpose Programmable I/Os.

Furthermore, to provide much better configurability and bandwidth for multi-media products, an
additional 18-bit parallel interface is incorporated. This interface enables connection to LCD
panels as well as NAND flash devices for additional multi-media data storage.

-20-

Audio

Using a highly integrated mixed-signal Audio Front-End, the MT6235 architecture allows for
easy audio interfacing with direct connection to the audio transducers. The audio interface
integrates D/A and A/D Converters for Voice band, as well as high resolution Stereo D/A
Converters for Audio band. In addition, MT6235 also provides Stereo Input and Analog MUX.

MT6235 supports AMR codec to adaptively optimize speech and audio quality. Moreover,
HE-AAC codec is implemented to deliver CD-quality audio at low bit rates.

On the whole, MT6235’s audio features provide a rich solution for multi-media applications.

Radio

MT6235 integrates a mixed-signal baseband front-end in order to provide a well-organized
radio interface with flexibility for efficient customization. The front-end contains gain and offset
calibration mechanisms, and filters with programmable coefficients for comprehensive
compatibility control on RF modules. This approach allows the usage of a high resolution D/A
Converter for controlling VCXO or crystal, reducing the need for an expensive TCVCXO. MT6235
achieves great MODEM performance by utilizing a 14-bit high resolution A/D
Converter in the RF downlink path. Furthermore, to reduce the need for extra external
current-driving component, the driving strength of some BPI outputs is designed to be
configurable.

Debug Function

The JTAG interface enables in-circuit debugging of the software program with the
ARM926EJ-S core. With this standardized debugging interface, MT6235 provides
developers with a wide set of options in choosing ARM development kits from different third party
vendors.

Power Management

The MT6235 offers various low-power features to help reduce system power consumption.
These features include a Pause Mode of 32 KHz clocking in Standby State, Power Down Mode
for individual peripherals, and Processor Sleep Mode. MT6235 is also fabricated in an advanced
low leakage CMOS process, hence providing an overall ultra low leakage solution.

Package

The MT6235 device is offered in a 13mm×13mm, 362-ball,

0.5 mm pitch, TFBGA package.

3.1.2 Platform Features

General

Integrated voice-band, audio-band and base-band analog front ends
TFBGA 13mm×13mm, 362-ball, 0.5 mm pitch package

MCU Subsystem

ARM926EJ-S 32-bit RISC processor
High performance multi-layer AMBA bus
Java hardware acceleration for fast Java-based games and applets
Operating frequency: 26/52/104/208 MHz
Dedicated DMA bus
14 DMA channels
512K bits on-chip SRAM
384K bits Instruction-TCM
640K bits Data-TCM

-21-

128K bits Instruction-Cache
128K bits Data-Cache
On-chip boot ROM for Factory Flash Programming
Watchdog timer for system crash recovery
3 sets of General Purpose Timer
Circuit Switch Data coprocessor
Division coprocessor
PPP Framer coprocessor

External Memory Interface

Supports up to 4 external memory devices
Supports 8-bit or 16-bit memory components with maximum size of up to 128M Bytes each
Supports Mobile SDRAM and Cellular RAM
Supports Flash and SRAM/PSRAM with page mode or burst mode
Industry standard Parallel LCD interface
Supports multi-media companion chips with 8/16 bits data width
Flexible I/O voltage of 1.8V ~ 2.8V for memory interface
Configurable driving strength for memory interface

User Interfaces

8-row × 8-column keypad controller with hardware scanner
Supports multiple key presses for gaming
SIM/USIM controller with hardware T=0/T=1 protocol control
Real Time Clock (RTC) operating with a separate power supply
General Purpose I/Os (GPIOs)
4 sets of Pulse Width Modulation (PWM) output
Alerter output with Enhanced PWM or PDM
8 external interrupt lines

Security

Supports security key and 126 bit chip unique ID

Connectivity

3 UARTs with hardware flow control and speeds up to 921600 bps

IrDA modulator/demodulator with hardware framer. Supports SIR/MIR/FIR operating speeds.

USB 2.0 capability
Multi Media Card, Secure Digital Memory Card, Memory Stick, Memory Stick Pro host

controller with flexible I/O voltage power

Supports SDIO interface for SDIO peripherals as well as WIFI connectivity
DAI/PCM and I2S interface for Audio application

Power Management

Power Down Mode for analog and digital circuits
Processor Sleep Mode
Pause Mode of 32 KHz clocking in Standby State
4-channel Auxiliary 10-bit A/D Converter for charger and battery monitoring and photo sensing

Test and Debug

Built-in digital and analog loop back modes for both Audio and Baseband Front-End
DAI port complying with GSM Rec.11.10
JTAG port for debugging embedded MCU

3.1.3 MODEM Features

Radio Interface and Baseband Front End

GMSK modulator with analog I and Q channel outputs

-22-

10-bit D/A Converter for uplink baseband I and Q signals
14-bit high resolution A/D Converter for downlink baseband I and Q signals

Calibration mechanism of offset and gain mismatch for baseband A/D Converter and D/A

Converter

10-bit D/A Converter for Automatic Power Control
13-bit high resolution D/A Converter for Automatic Frequency Control
Programmable Radio RX filter
2 channels Baseband Serial Interface (BSI) with 3-wire control
Bi-directional BSI interface. RF chip register read access with 3-wire or 4-wire interface.
10-Pin Baseband Parallel Interface (BPI) with programmable driving strength
Multi-band support

Voice and Modem CODEC

Dial tone generation
Voice memo
Noise reduction
Echo suppression
Advanced sidetone Oscillation Reduction
Digital sidetone generator with programmable gain
Two programmable acoustic compensation filters
GSM/GPRS quad vocoders for adaptive multirate (AMR), enhanced full rate (EFR), full rate

(FR) and half rate (HR)

GSM channel coding, equalization and A5/1, A5/2 and A5/3 ciphering
GPRS GEA1, GEA2 and GEA3 ciphering
Programmable GSM/GPRS/EDGE modem
Packet Switched Data with CS1/CS2/CS3/CS4 coding schemes
GSM Circuit Switch Data
GPRS/EDGE Class 12

Voice Interface and Voice Front End

Two microphone inputs sharing one low noise amplifier with programmable gain and automatic

gain control (AGC) mechanisms

Voice power amplifier with programmable gain
2nd order Sigma-Delta A/D Converter for voice uplink path
D/A Converter for voice downlink path
Supports half-duplex hands-free operation
Compliant with GSM 03.50

3.1.4 Multi-Media Features

LCD/NAND Flash Interface

Dedicated Parallel Interface supports 3 external devices with 8-/16-bit NAND flash interface,

8-/9-/16-/18-bit Parallel interface, and Serial interface for LCM

Built-in NAND Flash Controller with 1-bit ECC for mass storage

LCD Controller

Supports simultaneous connection to up to 3 parallel LCD and 2 serial LCD modules
Supports LCM format: RGB332, RGB444, RGB565, RGB666, RGB888
Supports LCD module with maximum resolution up to 800x600 at 24bpp
Per pixel alpha channel
True color engine
Supports hardware display rotation

Capable of combining display memories with up to 6 blending layers

-23-

Image Signal Processor

8 bit YUV format image input
Capable of processing image of size up to 2.0 M pixels
IEEE Std 1180-1990 IDCT standards compliance

Supports progressive image processing to minimize storage space requirement
Supports reload-able DMA for VLD stream

Image Data Processing

Supports Digital Zoom
Supports RGB888/565, YUV444 image processing
High throughput hardware scaler. Capable of tailoring an image to an arbitrary size.
Horizontal scaling in averaging method
Vertical scaling in bilinear method
YUV and RGB color space conversion
Boundary padding

2D Accelerator

Supports 32-bpp ARGB8888, 24-bpp RGB888, 16-bpp RGB565, and 8-bpp index color modes
Supports SVG Tiny
Rectangle gradient fill
BitBlt: multi-BitBlt with 7 rotation, 16 binary ROP
Alpha blending with 7 rotation
Line drawing: normal line, dotted line, anti-aliasing
Circle drawing
Bezier curve drawing
Triangle flat fill
Font caching: normal font, italic font
Command queue with max depth of 2047

Audio CODEC

Supports HE-AAC codec decode
Supports AAC codec decode
Wavetable synthesis with up to 64 tones
Advanced wavetable synthesizer capable of generating simulated stereo
Wavetable including GM full set of 128 instruments and 47 sets of percussions
PCM Playback and Record
Digital Audio Playback

Audio Interface and Audio Front End

Supports I2S interface
High resolution D/A Converters for Stereo Audio
Stereo analog input for stereo audio source
Analog multiplexer for stereo audio
Stereo to mono conversion

3.1.5 General Description

Figure 3-1-2 depicts the block diagram of MT6235. Based on a dual-processor architecture,

MT6235 integrates both an ARM926EJ-S core and a digital signal processor core. ARM926EJ-S
is the main processor responsible for running high-level GSM/GPRS protocol software as well as
multi-media applications. The digital signal processor manages the
low-level MODEM as well as advanced audio functions. Except for a few mixed-signal circuitries,
the other building blocks in MT6235 are connected to either the microcontroller or the digital

-24-

signal processor.

MT6235consists of the following subsystems:

Microcontroller Unit (MCU) Subsystem: includes an ARM926EJ-S RISC processor and its

accompanying memory management and interrupt handling logics;

Digital Signal Processor (DSP) Subsystem: includes a DSP and its accompanying memory,

memory controller, and interrupt controller;

MCU/DSP Interface: the junction at which the MCU and the DSP exchange hardware and

software information;

Microcontroller Peripherals: includes all user interface modules and RF control interface

modules;

Microcontroller Coprocessors: runs computing-intensive processes in place of the

Microcontroller;

DSP Peripherals: hardware accelerators for GSM/GPRS/EDGE channel codec;
Multi-media Subsystem: integrates several advanced accelerators to support multi-media

applications;

Voice Front End: the data path for converting analog speech to and from digital speech;
Audio Front End: the data path for converting stereo audio from an audio source;
Baseband Front End: the data path for converting a digital signal to and from an analog signal

from the RF modules;

Timing Generator: generates the control signals related to the TDMA frame timing; and,
Power, Reset and Clock Subsystem: manages the power, reset, and clock distribution inside

MT6235.

-25-

Figure.3-1-2 MT6235 BLOCK DIAGRAM

-26-

3.2 Power Amplifier Module (SKY77531)

Figure.3-2-1 SKY77531 FUNCTIONAL BLOCK DIAGRAM

The SKY77531 is a transmit and receive front-end module (FEM) with Integrated Power Amplifier
Control (iPAC.) for quad-band cellular handsets comprising GSM850/900 and DCS1800/PCS1900
operation. Designed in a low profile, compact form factor, the SKY77531 offers a complete Transmit
VCO-to-Antenna and Antenna-to-Receive SAW filter solution. The FEM also supports Class 12 General
Packet Radio Service (GPRS) multi-slot operation.

The module consists of a GSM850/900 PA block and a DCS1800/PCS1900 PA block,

impedancematching circuitry for 50 Ω input and output impedances, Tx harmonics filtering, high linearity
and a low insertion loss PHEMT RF switch, and a Power Amplifier Control (PAC) block with internal

current sense resistor. A custom BiCMOS integrated circuit provides the internal PAC function and
decoder circuitry to control the RF switches. The two Heterojunction Bipolar Transistor (HBT) PA blocks
are fabricated onto a single Gallium Arsenide (GaAs) die. One PA block supports the GSM850/900 bands
and the other PA block supports the DCS1800/PCS1900 bands. Both PA blocks share common power
supply pads to distribute current. The output of each PA block and the outputs to the four receive pads are
connected to the antenna pad through a PHEMT RF switch. The GaAs die, PHEMT die, Silicon (Si) die
and passive components are mounted on a multi-layer laminate substrate. The assembly is encapsulated
with plastic overmold.

Band selection and control of transmit and receive are performed using four external control pads. Refer
to the block diagram in Figure 1 below. The band select pads, BS1 and BS2, select GSM850, GSM900,
DCS, and PCS modes of operation. Transmit enable Tx_EN controls receive or transmit
mode of the RF switch (Tx = logic 1). Proper timing between transmit enable Tx_EN and Analog
Power Control VRAMP allows for high isolation between the antenna and Tx–VCO while the VCO is

being tuned prior to the transmit burst.

The SKY77531 is compatible with logic levels from 1.2 V to VCC for BS1, BS2, and Tx_EN pads,
depending on the level applied to the VLOGIC pad. This feature provides additional flexibility for the
designer in the selection of FEM interface control logic.

-27-

3.3 Transceiver Module (AD6548)

Figure.3-3-1 AD6548 FUNCTIONAL BLOCK DIAGRAM

3.3.1 General Descriptions

The AD6548/9 provides a highly integrated direct conversion radio solution that combines, on a single
chip, all radio and power management functions necessary to build the most compact GSM radio solution
possible. The only external components required for a complete radio design are the Rx SAWs, PA,
Switchplexer and a few passives enabling an extremely small
cost effective GSM Radio solution.

The AD6548/9 uses the industry proven direct conversion receiver architecture of the OthelloTM family.
For Quad band applications the front end features four fully integrated programmable gain differential
LNAs. The RF is then downconverted by quadrature mixers and then fed to the baseband
programmable-gain amplifiers and active filters for channel selection. The Receiver output pins can be
directly connected to the baseband analog processor. The Receive path features automatic calibration
and tracking to remove DC offsets.

The transmitter features a translation-loop architecture for directly modulating baseband signals onto
the integrated TX VCO. The translation-loop modulator and TX VCO are extremely low noise removing the
need for external SAW filters prior to the PA.

The AD6548/9 uses a single integrated LO VCO for both the receive and the transmit circuits. The
synthesizer lock times are optimized for GPRS applications up to and including class 12.
To dramatically reduce the BOM both TX Translational loop and main PLL Loop Filters are fully integrated
into the device.

AD6548 incorporates a complete reference crystal calibration system. This allows the external VCTCXO
to be replaced with a low cost crystal. No other external components are required. The AD6549 uses the
traditional VCTCXO reference source.

The AD6548/9 also contains on-chip low dropout voltage regulators (LDOs) to deliver regulated supply
voltages to the functions on chip, with a battery input voltage of between 2.9V and 5.5V. Comprehensive
power down options are included to minimize power consumption in normal use.

-28-

A standard 3 wire serial interface is used to program the IC. The interface features low-voltage digital
interface buffers compatible with logic levels from 1.6V to 3.0V.
The AD6548/9 is packaged in a 5mm × 5mm , 32-lead LFCSP package.

3.3.2 Features
Fully Integrated GSM Transceiver including

Direct Conversion Receiver

Translation Loop Direct VCO Modulator

High performance multi band PLL system

Power Management

Small footprint

APPLICATIONS

Dual, Triple and Quad Band Radios

- GSM850, E-GSM 900, DCS1800 and PCS1900

- GPRS to Class 12- EDGE RX

ORDERING GUIDE Model Temperature

Range

AD6548BCPZ -20°C to +85°C LFCSP-32

AD6549BCPZ -20°C to +85°C LFCSP-32

4 Differential LNAs
Integrated Active RX Channel Select Filters
Programmable Gain Baseband Amplifiers

Integrated TX VCO and tank
External TX filters eliminated
Integrated Loop filter components

Fast Fractional-N Synthesizer
Integrated Local Oscillator VCO
Fully Integrated Loop filters
Crystal Reference Oscillator & Tuning System (AD6548)

Integrated LDOs allow direct battery supply connection

32-Lead 5 X 5 mm Chipscale Package

Package

3.3.3 Pin Descriptions

-29-

3.4 Bluetooth Module (MT6601)

The internal connection of the major physical blocks and their associated external interfaces

are shown in Figure 3-4-1.

The transceiver section of MT6601 incorporates the complete receive and transmit paths,

including PLL, VCO, LNA, PA, modulator, demodulator.

The baseband signal processor incorporates hardware engines performing frequency hopping,
error correcting, whitening, encrypting, data packet assembling and de-assembly to offload the
embedded ARM7.

Figure.3-4-1 MT6601 FUNCTIONAL BLOCK DIAGRAM

3.4.1 General description

Bluetooth is a low-cost wireless technology used to provide “ad hoc” networking between
versatile portable devices such as cell phones, PDAs, digital cameras, headsets, and more.

MT6601 is a highly integrated Bluetooth platform IC. It includes powerful baseband processing
capabilities with rich features and a high performance transceiver, all in a compact single
package.

-30-

3.4.2 Features

Radio features

Fully compliant with Bluetooth specification 1.2.

Low out-of-band spurious emissions supports simultaneous operation with GPS, GSM/GPRS
worldwide radio systems.

Direct conversion architecture with no external channel filter or VCO resonator components.

Fully integrated RF front-end matching circuits eliminates external balance and T/R switch.

Transmitter features

Meets class 2 and class 3 transmitting requirement.

Support Class 1 operation with external PA.

Receiver features

-85dBm sensitivity with excellent interference rejection performance.

Hardware AGC dynamically adjusts receiver performance in changing environments.

Baseband features

eSCO support.

3 simultaneous SCO channels.

Scatternet support.

Sniff mode, hold mode, and part mode support.

AFH and PTA collaborative support for WLAN/BT coexistence.

Lower power mode and deep sleep mode enables ultra low power consumption

Platform features

On-chip voltage regulation simplifies voltage input requirements.

Low power consumption in active and standby mode.

Wide ranges of crystal and external reference clock support.

PCM interface and built-in transcoders for A-law, _-law and linear voice.

Built-in hardware modem engine for access code correlation, header error correction, forward
error correction,CRC, whitening, and encryption.

High speed UART support.

Built-in RAM and ROM with patch system.

Software features

Supports standard HCI interface.

3.4.3 Applications

MT6601 is designed to provide direct interface with existing handset chip as shown in Figure
3-4-2.

The PCM interface provides master or slave mode operation with programmable data frequency
to connect to the voice channel with the GSM baseband. The UART interface supports hardware
flow control as well as high-speed baud rate. The PTA interface accommodates different
arbitration scheme enabling efficient channel utilization in co-existence environment.
The external reference clock interface supports wide ranges of frequencies that the mobile
phones use.

-31-

Figure.3-4-2 Mobile phone application.

-32-

3.5 Memory Module (K5D12571CA-D090)

Figure.3-5-1 K5D12571CA-D090 FUNCTIONAL BLOCK DIAGRAM

-33-

3.5.1 FEATURES

<Common>

‧ Operating Temperature : -25°C ~ 85°C
‧ Package : 107-ball FBGA Type - 10.5x13x1.4mmt,

0.80mm pitch

<NAND Flash>

‧ Voltage Supply : 2.5V ~ 2.9V
‧ Organization

- Memory Cell Array : (64M + 2M) x 8bits

- Data Register : (512 + 16) x 8bits

‧ Automatic Program and Erase

- Page Program : (512 + 16) x 8bits

- Block Erase : (16K + 512)Bytes

‧ Page Read Operation

- Page Size : (512 + 16)Bytes

- Random Access : 15μs(Max.)

- Serial Page Access : 42ns(Min.)

‧ Fast Write Cycle Time

- Program time : 200μs(Typ.)

- Block Erase Time : 2ms(Typ.)

‧ Command/Address/Data Multiplexed I/O Port
‧ Hardware Data Protection

- Program/Erase Lockout During Power Transitions

‧ Reliable CMOS Floating-Gate Technology

- Endurance : 100K Program/Erase Cycles (with 1bit/512Byte ECC)

- Data Retention : 10 Years

‧ Command Register Operation
‧ Unique ID for Copyright Protection

<Mobile SDRAM>

• VDD/VDDQ = 1.8V/1.8V

• LVCMOS compatible with multiplexed address.

• Four banks operation.

• MRS cycle with address key programs.

- CAS latency (1, 2 & 3).

- Burst length (1, 2, 4, 8 & Full page).

- Burst type (Sequential & Interleave).

• EMRS cycle with address key programs.

• All inputs are sampled at the positive going edge of the system
clock.

• Burst read single-bit write operation.

• Special Function Support.

- PASR (Partial Array Self Refresh).

- Internal TCSR (Temperature Compensated Self Refresh)

- DS (Driver Strength)

• DQM for masking.

• Auto refresh.
64ms refresh period (8K cycle).

Address configuration

-34-

Organization Bank

Row

Column

16M x 16

BA0,BA1 A0 - A12 A0 - A8

3.5.2 GENERAL DESCRIPTION

The K5D12571CA is a Multi Chip Package Memory which combines 512Mbit NAND Flash
Memory and 256Mbit Mobile Synchronous Dynamic RAM.

Offered in 64Mx8bits, the NAND Flash is 512Mbit with spare 16Mbit capacity. The device is
offered in 2.7V Vcc. Its NAND cell provides the most cost-effective solutIon for the solid state
mass storage market. A program operation can be performed in typical 200μs on the 528-bytes

and an erase operation can be performed in typical 2ms on a 16K-bytes block. Data in the page
can be read out at 42ns cycle time per byte. The I/O pins serve as the ports for address and data
input/output as well as command input. The on-chip write control automates all program
and erase functions including pulse repetition, where required, and internal verification and
margining of data. Even the write-intensive systems can take advantage of the device′s

extended reliability of 100K program/erase cycles by providing ECC(Error Correcting Code) with
real time mapping-out algorithm. The device is an optimum solution for large nonvolatile storage
applications such as solid state file storage and other portable applications requiring
non-volatility.

The 256Mb Mobile SDRAM is 268,435,456 bits synchronous high data rate Dynamic RAM
organized as 4 x 4,194,304 words by 16 bits, fabricated with SAMSUNG’s high performance
CMOS technology. Synchronous design allows precise cycle control with the use of system clock
and I/O transactions are possible on every clock cycle. Range of operating frequencies,
programmable burst lengths and programmable latencies allow the same device to be useful for
a variety of high bandwidth and high performance memory system applications.

The K5D12571CA is suitable for use in data memory of mobile communication system to
reduce not only mount area but also power consumption. This device is available in 107-ball
FBGA Type.

-35-

Figure.3-5-2 K5D12571CA-D090 PIN CONFIGURATION

-36-

Figure.3-5-3 K5D12571CA-D090 PIN Description

-37-

3.6 FM Radio Module (Si4708)

The Si4708/09 extends Silicon Laboratories Si4700 FM tuner family, and further increases the
ease and attractiveness of adding FM radio reception to mobile devices through small size and
board area, minimum component count, flexible programmability, and superior, proven
performance. Si4708/09 software is backwards compatible to existing Si4700/01/02/03 FM
Tuner designs and leverages Silicon Laboratories' highly successful and patented
Si4700/01/02/03 FM tuner. The Si4708/09 benefits from proven digital integration and 100%
CMOS process technology, resulting in a completely integrated solution. It is the industry's
smallest footprint FM tuner IC requiring only 6.25 mm2 board space and one external bypass
capacitor.

The device offers significant programmability, catering to the subjective nature of FM listeners’
audio preferences and variable FM broadcast environments worldwide.

The Si4709 incorporates a digital processor for the European Radio Data System (RDS) and
the US Radio Broadcast Data System (RBDS) including all required symbol decoding, block
synchronization, error detection, and error correction functions.

RDS/RDBS* enables data such as station identification and song name to be displayed to the
user. The Si4709 offers a detailed RDS view and a standard view, allowing adopters to
selectively choose granularity of software is backwards compatible to the proven Si4701/03,
adopted by leading cell-phone and MP3 manufacturers world-wide.

The Si4708/09 is based on the superior, proven performance of Silicon Laboratories' Aero
architecture offering unmatched interference rejection and leading sensitivity. The device uses
the same programming interface as the Si4700/01/02/03 and supports multiple bus modes.
Power management is simplified with an integrated regulator allowing direct connection to a 2.7
to 5.5 V battery for VD and 2.7 to 5.5 V battery for VA.

The Si4708/09 device’s high level of integration and complete FM system production testing
increases quality to manufacturers, improves device yields, and simplifies device manufacturing
and final testing.

Figure. 3-6-1 Si4708 FM Receiver Block Diagram

-38-

-39-

3.7 LCD Interface

Figure.3-7-1 LCD Interface

The IM200CBNUA model is a Color TFT LCD supplied by LG Innotek.

This main LCD has a 2.00 inch diagonally measured active display area with 176(RGB)X220
resolution Each pixel is divided into Red, Green and Blue sub-pixels and dots which are arranged
in vertical stripes.

Main LCD color is determined with 262,000colors signal for each pixel.

The IM200CBNUA has been designed to apply the interface method that enables low power,
high speed, and high contrast.

The IM200CBNUA is intended to support applications where thin thickness, wide viewing angle
and low power consumption are critical factors and graphic displays are important.

-40-

Figure. 3-7-2 IM200CBNUA Block Diagram

-41-

Figure. 3-7-3 IM200CBNUA PIN DESCRIPTION

-42-

3.8 SIM Card &SD Card Interface

Figure.3-8-1 SIM CARD Interface

-43-

Figure.3-8-2 SD CARD Interface

The MT6235 contains a dedicated smart card interface to allow the MCU access to the SIM
card. It can operate via 4terminals, using VSIM, SIMI/O, SIMRST, SIMCLK

The VSIM is used to control the external voltage supply to the SIM card. SIMRST is used as
the SIM card reset signal. SIMI/O and SIMCLK are used for data exchange purpose.

The SIM interface acts as a half duplex asynchronous communication port and its data format
is composed of ten consecutive bits: a start bit in state Low, eight information bits, and a tenth bit
used for parity checking.

The SD Card control signal and data signal is controlled by MT6235.

-44-

3.9 KEYPAD Interface

Figure.3-9-1. KEYPAD Interface

The keypad can be divided into two parts: one is the keypad interface including 4 columns and
6 rows; the other is the key detection block which provides key pressed, key released and
de-bounce mechanisms. Each time the key is pressed or released, i.e. something different in the
4 x 6 matrix, the key detection block senses the change and recognizes if a key has been
pressed or released. Whenever the key status changes and is stable, a KEYPAD IRQ is issued.
The MCU can then read the key(s) pressed directly in KP_HI_KEY, KP_MID_KEY and
KP_LOW_KEY registers. To ensure that the key pressed information is not missed, the status
register in keypad is not read-cleared by APB read command. The status register can only be
changed by the key-pressed detection FSM.

-45-

3.10 Battery Charging Block Interface

Figure.3-10-1 Charging IC Interface

The BQ24350DSGR is controlled by MT6235.

-46-

3.11 Audio Interface

Figure.3-11-1 Main Speaker Interface

Figure.3-11-2 Main Microphone & Receiver Interface

YDA145 (D-4H) is a digital audio power amplifier IC with maximum output of 2.1W
(RL=4Ώ)×1ch.

YDA145 has a “Pure Pulse Direct Speaker Drive Circuit” which directly drives speakers while
reducing distortion of pulse output signal and reducing noise on the signal, and realizes the
highest standard low distortion rate characteristics and low noise characteristics among digital
amplifier ICs for mobile use.

In addition, circuit design with fewer external parts can be made depend on the condition of use
because corresponds to filter less.

The YDA145 features Yamaha original non-clip output control function which detects output
signal clip due to the over level input signal and suppress the output signal clip automatically.
Also the non-clip output control function can adapt the output clip caused by power supply
voltage down with battery. This is the difference from the traditional AGC (Auto Gain Control) or
ALC (Auto Level Control) circuit.
YDA145 has the power-down function which can minimizes the power consumption in the
standby state.

As for protection function, overcurrent protection function for speaker output terminal,
overtemperatue protection function for inside of the device, and low supply voltage malfunction
preventing function are prepared.

-47-

< 9-ball WLCSP Bottom View >

-48-

3.12 Vibrator Interface

Figure.3-12-1 Vibrator Interface

This handset has Vibrator operation. Control signal is controlled by MT6235

-49-

3.13 Camera Interface

Figure.3-13-1Camera Interface

-50-

3.13.1 Pin Description

-51-

4. Trouble Shooting

BB SUb-systems

4.1 Power On Trouble

4.1.1 Test Point

- Power-On key detection(PWRON signal)

- Outputs of CPU U401, LDOs U202

- Os Battery Voltage(Need to over 3.35V)

- Oscillate frequency of X401 and X201

Voltage PART
VDD 2.8V TP1(R511.2)
VMEM 1.8V TP2(R501.1)
AVDD 2.8V TP3(C531.1)
VCORE 1.2V TP4(C524.1)
VRF 2.8V TP5(B202.1)
VRTC 1.2V TP6(C507.1)

signal PART

32.768KHz 32.768KHz Clock signal TP7(X401.4)
26MHz 26MHz Clock signal TP8(X201.1)

26MHz out 26MHzClock signal TP9(C232.1)

TP7 32.768KHz

-52-

TP8 26MHz

TP9 26MHz Out

-53-

AVDD

VDD

VMEM

TP10

VCORE

32.768KHz

VRTC

VRF 26MHz Out 26MHz

TP11

-54-

4.1.2 Circuit Diagram

TP10, 2.8V

32.768KH

-55-

TP11

26MHz

TP5

-56-

4.1.3 Checking Flow

Start

Check Battery Voltage

> 3.35V ?

YES

Check key board

connector is well?

YES

Check the Voltage of

U401,U202 Output of

TP1~TP6 ?

YES

NO

NO

NO

Charge or Change

Battery

1. Re-work J801

2. Charge key board

3. Try again

Re-work or change
CPU (U401), U202

Check X401 output is

32.768KHz and X201, output
is 26MHz ?

YES

Check TP11 (SYSRST_B) and
TP10 (BBWAKEUP) signal is

YES

The Phone will

POWER ON

NO

NO

Re-work or change
X401, X201 and
around Component

Re-work or change
CPU (U401)

-57-

4.2 SIM Card Trouble

4.2.1 Test Point

TP2 VSIM2

TP1 VSIM1

Voltage PART
VSIM1 1.8V or 3.0V TP1(J802.5)
VSIM2 1.8V or 3.0V TP2(J804.5)

-58-

4.2.2 Circuit Diagram

TP1 VSIM1

TP2 VSIM2

-59-

4.2.3 Checking Flow

Start

Measure the SIM Card

supports 1.8V or 3.0V

YES

Check SIM socket J802,is work

well

YES

Check SIM socket J804,is work

well

YES

NO

NO

NO

Change the SIM
Card. Our phone
supports only 1.8V or
3V SIM Card

Re-work or change
Change J802 SIM and
around component

Re-work or change
Change J804 SIM socket
around component

Check voltage

of

TP1,

TP2 ?

YES

SIM card will operate

properly

NO

Re-soldering
or change CPU
(U401)

-60-

4.3 Vibrator Trouble

4.3.1 Test Point

4.3.2 Circuit Diagram

TP1 =

TP2 VIBRATOR < 0.2V

VIB=3.2

TP1 = 2.6V~2.8V

TP2 VIBRATOR < 0.2V

-61-

4.3.3 Checking Flow

Start

Enter the Engineer Mode and set Vibrator ON

YES

Check vibrator

work properly ?

YES

Measure TP1 of 2.6V~2.8V ?

YES

Measure TP2

Of > 0.2V ?

YES

NO

NO

NO

Reposition or change
vibrator

Re-soldering or
change the
component

Re-work or change
CPU (U401)

Vibrator will operate

properly

-62-

4.4 RTC Trouble

32.768KHz

4.4.1 Test Point

32.768KHz

32.768KHz

4.4.2 Circuit Diagram

-63-

4.4.3 Checking Flow

Start

Is the frequency about

32.768kHz?

YES

Check soldering status of

C401,C402 ?

YES

Check soldering status of

CPU(U401) ?

NO

NO

NO

Re-soldering X401
and try again

Re-soldering or
change C401 ,C402

and try again

Re-soldering or
change CPU(U401)
and try again

YES

RTC will work

properly

-64-

4.5 SIM1 SIM 2 LED Trouble

TP1

TP3

TP4

4.5.1 Test Point

Voltage PART
SIM1 LED1308.1 1.75V~2.0V TP1(LED1308.1)
SIM2 LED1307.1 1.75V~2.0V TP2(LED1307.1)

SIM1 R1403.1 2.8V TP3(R1402.2)

SIM2 R1404.1 2.8V TP4(R1405.2)

4.5.2 Circuit Diagram

TP2

TP1

TP2

TP3

TP2

-65-

4.5.3 Checking Flow

Start

Enter the Engineer Mode and

set Starus LED ON

YES

Check Voltage of

TP1 (SIM1) TP2(SIM2)

stauts ?

YES

Check Voltage of

TP1,TP2 stauts ?

YES

Check Voltage of

TP3,TP4 stauts ?

NO

NO

NO

Re-work or change
SIM1 (LED1308)
SIM2 (LED1307)
And

Try again

Re-work or change
U1401 and around
Component

Try again

Re-work or change
CPU (401)

Try again

YES

SIM LED will

operate properly

-66-

4.6 Sub Key LED backlight Trouble

4.6.1 Test Point

TP1

TP2

TP3

Voltage PART
KD101.2 2.6~2.9 V TP1(KD101.2)
KD102.2 2.6~2.9V TP2(KD102.2)

TP4

KP_LEDIN >0.2V TP3(RJ1401.2)

KEY_LED >0.2V TP4(R1401.1)

-67-

4.6.2 Circuit Diagram

TP2

TP3

TP1

TP4

-68-

4.6.3 Checking Flow

Start

Enter the Engineer Mode and

set Key LED ON

Check Sub Key Board

work properly ?

YES

Check Voltage of

TP1,TP2 stauts ?

YES

Check Voltage of

TP3 stauts ?

YES

NO

NO

NO

Change the Sub Key
Board and

Try again

Re-work or change
KD101 or KD102

and Try again

Re-work or change
J1401

Try again

Check Voltage of

TP4 stauts ?

YES

LED work properly?

YES

Sub Key Board LED

backlight will operate

properly

NO

NO

Re-work or change
R1401 and around
component

Re-work or change
CPU(U401)

Try again

Try again

-69-

4.7 LCD Backlight Trouble

4.7.1 Test Point

TP2

TP3

TP4

TP1

TP5

Voltage PART
LCM_BL_EN/SET 2.8V TP1(R907.6)
LCM_LED+ 3.5V~4.5V TP2(U901.2)

LCM_LED1
LCM_LED1
LCM_LED1

0.7V~1.0V TP3(U901.1)
TP4(U901.10)
TP5(U901.9))

-70-

4.7.2 Circuit Diagram

5

P5

TP

TP3,TP4,T

TP1

TP3,TP4,TP

-71-

4.7.3 Checking Flow

Start

Check Sub Key Board

work properly ?

YES

Check LCM Panel

work properly ?

YES

Check KJ301 soldering

work properly ?

YES

Check Voltage of

TP1 stauts ?

NO

NO

NO

NO

Change the Sub Key
Board and

Try again

Change LCM Panel
Board and

Try again

Re-soldering KJ301
and Change KJ301
and Try again

Re-work or change
KJ401 and change
LCD to MB FPC
Cable and Try again

YES

Check Voltage of
TP2~TP6 stauts ?

YES

LCM backlight will

operate properly

-72-

NO

Re-work or change
KU202 and

Try again

4.8 LCM Trouble

4.8.1 Test Point

Check this component of B902 soldering work
properly

Check this component of
J901 soldering work properly

Check this component of
V904,V903,V902,V901 soldering
work properly

Check this component of
C904,R903,R902 soldering work
properly

-73-

4.8.2 Circuit Diagram

Check this component of C904,R903,R902

Check this component of B902 soldering

work properly

soldering work properly

Check this component of
V904,V903,V902,V901
soldering work properly

Check this component of J901
soldering work properly

-74-

-75-

4.8.3 Checking Flow

Start

LCM Backlight is OK?

YES

Check LCM Panel

work properly ?

YES

Check J901 soldering

work properly ?

YES

Check Component of

V901 ~ V904 soldering

work properly ?

NO

NO

NO

NO

Change the Sub Key
Board and

Try again

Change LCM Panel
Board and

Try again

Re-soldering J901
and Change J901 and

Try again

Re-soldering or
change Component
of V901~ V904

Try again

YES

Check Component of

R902, R903, C904, B902

soldering

work properly ?

YES

Check Component of
CPU (401) soldering

work properly ?

YES

LCM will operate

properly

Re-soldering or

NO

NO

change Component
of R902, R903,
C904,B902 and

again

Re-soldering or
change Component
of CPU (401)and

Try again

Try

-76-

4.9

4.9.1 Test Point

Charging

TP2

TP1

Trouble

TP3

TP4

-77-

TP5

TP6

Voltage PART

J1101.1 4.6V~5.7V TP1(J1101.1)
F1101.1 4.6V~5.7V TP2(F1101.1)

C805.2 4.5V~5.6V TP3(C805.2)
R801.2 2.4V~4.2V ( very close to battery

TP4(R801.2)

voltage )

J801.1 2.4V~4.2V ( battery voltage ) TP5(J801.1)

J801.2 0.4V~1.5V TP6(J801.2)

-78-

4.9.2 Circuit Diagram

TP3

TP4

TP2

TP1

TP6

TP5

-79-

4.9.3 Checking Flow

Start

Measure voltage

of TP5 status ?

YES

Check battery connector

and USB connector

are well?

YES

Check voltage of

TP2 status ?

YES

Measure voltage

of TP3, TP4 status ?

NO

NO

NO

NO

The battery may have problem,
Change new battery pack a

Try again

Change battery
connector J801and
J1101 USB connector

Re-soldering and
Change F1101 and

Try again

Re-soldering and
Change U801 and

Try again

nd

YES

Measure voltage

of TP5,TP6 status ?

YES

Charging will operate

properly ?

NO

Re-soldering and
Change CPU(U401)
and

Try again

-80-

4.10 Master Microphone Trouble

signal

4.10.1 Test Point

TP1

TP2

Voltage PART
MICBIASP 2.0V~2.2V TP1( R701.1)
L707.2 1.8V~2.0V TP2(L707.2)

4.10.2 Circuit Diagram

TP2

Master Mic

TP1

-81-

Master Mic
signal

-82-

4.10.3 Checking Flow

Start

Enter the Engineer Mode and

set Master Microphone on

Check Voltage of

TP1, TP2 Status ?

YES

Check Component status

around Mic ?

YES

Check status of MIC ?

YES

NO

NO

NO

Re-soldering and
Change and L707,
R701 and

Re-solder or Replace
Component

Re-solder or replace
Microphone around
and try again

Try again

Re-soldering and check

CPU(U401) status ?

YES

Microphone work

properly

NO

Change MB PCBA

-83-

4.11 Receiver Trouble

4.11.1 Test Point

TP3

TP4

TP2

TP1

Voltage PART
REC701.1 1.3V~1.5V TP1(REC701.1)

REC701.2 1.3V~1.5V TP2(REC701.2)

L710.2 1.3V~1.5V TP2(L710.2)

L711.2 1.3V~1.5V TP2(L711.2)

-84-

4.11.2 Circuit Diagram

Receiver Signal

TP3

TP1

TP2

TP4

Receiver Signal

-85-

4.11.3 Checking Flow

Start

Enter the Engineer Mode and

set Receiver on

Check Voltage of
TP1,TP2 Status ?

YES

Check Voltage of
TP3,TP4 Status ?

YES

Check status of Receiver ?

NO

NO

NO

Change Receiver and

Try again

Re-solder or replace
L710, L711 and
around Component

Re-solder or replace
CPU (U401) of try again

YES

Receiver work

properly

-86-

4.12 Camera Trouble

4.12.1 Test Point

TP3

TP4

TP2

TP1

Voltage PART
VCAM_D 2.8V TP1(B1003.2)
CM_DVDD_2.8V 2.8V TP2(B1003.1)

VCAM_A 2.8V TP3(B1002.2)
CM_AVDD_2.8V 2.8V TP4(B1002.1)

-87-

4.12.2 Circuit Diagram

TP4

TP2

TP1

TP3

-88-

4.12.3 Checking Flow

Start

Enter the Engineer Mode and

set Camera on

Check status of Camera ?

YES

Check Voltage of

TP1, TP3 Status ?

YES

Check status of Camera ?

YES

Check Voltage of

TP2, TP4 Status ?

NO

NO

NO

NO

Change new
Camera module
and try again

Re-solder or replace
B1002, B1003
and try again

Re-solder or replace
J1002 and try again

Re-solder or replace
CPU (401) and
around Component

YES

Check Cmaera signal

is well ?

YES

Camera work

properly

-89-

NO

Re-solder or replace
CPU (401) and
around Component

4.13 Key Board Trouble

Of J1401 soldering work properly

Check this component of SW1, SW2, SW3

4.13.1 Test Point

Check this component of

Check this component of
V1404,V1405,V1406 soldering work
properly

soldering work properly

-90-

Key Board

Check this component of KJ101
soldering work properly

Check this around component of soldering work properly of
Key function “7” ”8” “9” “ *” “0“ “ #” function

-91-

4.13.2 Circuit Diagram

KP_COL3

KP_COL2

KP_COL1

KP_COL0

KP_ROW0

KP_ROW1

KP_ROW2

KP_ROW3

KP_ROW4

KP_ROW5

[UP] [SOFT_L]

S102

1 2

[SEND]

S106

1 2

S110

1 2

S114

1 2

S118

1 2

[DOWN]

S103

1 2

[OK]

S107

1 2

S111

1 2

3

S115

1 2

2 5

S119

1 2

1

12

HSP1302

ESD_PAD_1

Key Board PAD Circuit

Check this around component of soldering work

S108

1 2

1 2

6

4 7

12

HSP1303

ESD_PAD_1

L1410
100nH

12

C1412

33.0pF

1 2

L1411
100nH

12

C1413

33.0pF

1 2

L1412
100nH

12

C1414

33.0pF

S112

1 2

S116

1 2

S120

1 2

S112_2

1 2

L1407

9

100nH

S116_2

1 2

L1408

8

100nH

S120_2

1 2

L1409
100nH

12

12

12

C1409

33.0pF

C1410

33.0pF

C1411

33.0pF

12

1 2

1 2

[SOFT_R]

1 2

HSP1304

ESD_PAD_1

S101

S105

S109

1 2

12

1 2

12

1 2

12

C1406

33.0pF

C1407

33.0pF

C1408

33.0pF

ESD_PAD_1

HSP1307

12

ESD_PAD_1

HSP1306

12

ESD_PAD_1

HSP1305

12

L1404
100nH

L1405
100nH

L1406
100nH

S113

1 2

S117

1 2

S121

1 2

KEY PAD

1 2

L1401

#

100nH

1 2

L1402

0

100nH

1 2

L1403

*

100nH

12

12

12

C1403

33.0pF

C1404

33.0pF

C1405

33.0pF

KP_COL0
KP_COL1
KP_PWRKEY
KP_COL3

KP_PWRKEY

HSP1301

ESD_PAD_1

VBAT

S122

ON/OFF

12

POWER KEY

12

KP_COL0

12

12

HSP1315

HSP1316

ESD_PAD_1

ESD_PAD_1

B to B connector

KJ101

24

24

20

20

19

19

18

18

17

17

16

16

15

15

14

14

13

13

12

12

11

11

23

23

DF40C-20DP-0.4V(51)

Main Board Key pad Circuit

21

10
22

Check this component of KJ101
soldering work properly

S112_2

KP_COL1

12

12

12

12

12

HSP1311

HSP1317

HSP1318

ESD_PAD_1

ESD_PAD_1

HSP1312

ESD_PAD_1

ESD_PAD_1

12

HSP1313

ESD_PAD_1

S116_2
S120_2

12

12

12

HSP1308

HSP1309

HSP1314

ESD_PAD_1

ESD_PAD_1

HSP1310

ESD_PAD_1

ESD_PAD_1

21
1

1

2

2

3

3

4

4

5

5

6

6

7

7

8

8

9

9

10
22

Keypad_LED

KP_ROW5
KP_ROW4
KP_ROW3
KP_ROW2
KP_ROW1KP_COL2
KP_ROW0

-92-

KP_LEDIN

KP_ROW5
KP_ROW4
KP_ROW3
KP_ROW2
KP_ROW1
KP_ROW0

KEY PAD Connector

J1401
DF40C-20DS-0.4V(51)

1
2
3
4
5
6
7 14
8
9

10

20
19
18
17
16
15

13
12
11

VBAT

Check this component of J1401
soldering work properly

KP_COL0
KP_COL1
KP_PWRKEY
KP_COL3
KP_COL2

KP_COL2
KP_COL1
KP_COL0

KP_ROW0

SIDE UP

SW1 LS12K2H-T

1 2
3 4

5

SIDE DOWN

SW2 LS12K2H-T

1 2
3 4

5

SIM Switch

SW3 LS12K2H-T

1 2
3 4

5

KROW2
KROW3
KROW4
KROW5

KROW0
KROW1

KCOL2
KCOL3

PWRKEY

KCOL1
KCOL0

KEY_LED

MLVS0402M07-330

2 1

V1425

R1401

0.00Ohm

1 2

V1424

MLVS0402M07-330

2 1

ESD_PAD_1

1
3
5
7 8

1
3
5
7 8

1
3
5
7 8

12

HSP1319

V1404
ICVE21054E250R101FR

V1406
ICVE21054E250R101FR

V1405
ICVE21054E250R101FR

MLVS0402M07-330

2 1

V1415

9

10

KP_ROW2

2

KP_ROW3

4

KP_ROW4

6

KP_ROW5

9

10

KP_ROW0

2

KP_ROW1

4

KP_COL2

6

KP_COL3

9

10

KP_PWRKEY

2

KP_COL1

4

KP_COL0

6

KP_LEDIN

12

HSP1320

ESD_PAD_1

MLVS0402M07-330

2 1

V1416

12

HSP1321

ESD_PAD_1

12

HSP1322

ESD_PAD_1

2 1

MLVS0402M07-330

V1417

12

HSP1323

ESD_PAD_1

12

HSP1324

ESD_PAD_1

2 1

MLVS0402M07-330

V1418

Check this component of SW1,SW2,SW3
soldering work properly

Check this component of
V1404,V1405,V1406 soldering
work properly

C1402

1.00nF

12

V1414
MLVS0402M07-330

2 1

-93-

4.13.3 Checking Flow

Start

Enter the Engineer Mode and

set Key pad function on

Check status of Key board

Key pad function ?

YES

Check status of

V1404,V1405,V1406 , J1401

soldering work properly ?

YES

Check status of Key board

Key pad function ?

YES

Check status of

SW1,SW2,SW3 Key pad

function ?

NO

NO

Change new
Sub Key Board
and try again

Re-solder or replace
V1404,V1405,V1406
, J1401 and try again

Re-solder or replace

NO

NO

CPU(U401)
and Key around
Component and try
again

Re-solder or replace
SW1,SW2, SW3 and
around Component and
try again

YES

Check status of Key board

Key pad function ?

YES

Keyfunction work

properly

-94-

NO

Change new Metal of
MB PCBA

4.14 Flash LED Trouble

6.5V~ 5.0V without LED

4.14.1 Test Point

TP2

TP3

TP1

TP4

Voltage PART
C1005.1 3.6V~4.2V TP1(C1005.1)
J1001.1

TP2(J1001.1)

2.4V~ 3.3V with LED

FLASH_LED_EN/SET 2.8V TP3(R1005.2)
T101 2.4V~ 3.3V TP4(T101)

-95-

4.14.2 Circuit Diagram

VBAT

1 2

12

C1004

1.00uF

R1005 n.m

R1005 0.00Ohm

FLASH_LED_EN/SET

FLASH_LED_MODE

1 2

R1006 0.00Ohm

1 2

R1006 n.m

R1004

0.00Ohm

C1005

10.0uF

R1007
100Kohm

TP1

1

+

2

C1006 1.00uF

1 2

U1001

1

VIN

EN/SET

MODE

GND
PAD

C1+

10

7

6

8

11

12

12

R1008
100Kohm

100K =100mA Torch

AAT3176IDH-T1

9

C1-

VOUT

FL

RSETF

RSETM

R1009
100Kohm

C1007

2.20uF

2

3

4

5

1 2

12

12

R1010

51.0Kohm

TP2

J1001
66578-A4-132601

1

1

2

2

V1001
MLVS0402M07-330

2 1

51K =200mA Flash LED

TP3

TP4

T101

1

2 +

PAD_2x2.2

21

LED1
EHP-C04/NT01H-P01/TR

T102

1

1 -

PAD_2x2.2

-96-

4.14.3 Checking Flow

Start

Enter the Engineer Mode and

set Flash LED function on

Check voltage of

TP4 status?

YES

Check voltage of

TP1 ~ TP3 status?

YES

Check status of Flash LED

work properly ?

NO

NO

NO

Change new
Flash LED Module
and try again

Re-solder or replace
U1001 and around
and try again

Re-solder or replace
CPU (U401) and and
try again

YES

Flash LED work

properly

-97-

4.15 Bluetooth Voice Trouble

4.15.1 Test Point

TP1

Voltage PART
VCCBT 2.8V TP1(B303.2)

-98-

4.15.2 Circuit Diagram
CPU BT PCM Circuit

BT PCM interface of (U401)

BT Device PCM Circuit

-99-

4.15.3 Checking Flow

Start

Make a Call and change audio patch

to link BT earphone

Check BT function

is work well ?

YES

Check voltage of

TP1 status?

YES

Check component U301

soldering stauts ?

YES

NO

NO

NO

Re-solder or replace
U301 and around
circuit try again

Re-solder
CPU(U401) and and
try again

Re-solder U301 and
and try again

BT function work

properly

-100-