LG GW520 Service Manual

Service Manual Model : GW520

Internal Use Only

Service Manual

GW520

Date: July, 2009 / Issue 1.1

Table Of Contents

1. INTRODUCTION ...............................................5

1.1 Purpose ......................................................................5

1.2 Regulatory Information .................................................5

1.3. ABBREVIATION ...........................................................7

2. PERFORMANCE ...............................................9

2.1 Supporting Standard ....................................................9

2.2 Main Parts : Solution ..................................................10

2.3 H/W features .............................................................10

2.4 HW Spec. ................................................................12

3. BB CIRCUIT TECHNICAL BRIEF ..................... 17

3.1 Functional Block Diagram ..........................................17

3.2 Baseband Processor Introduction ...............................18

3.3 Power management IC...............................................31

3.4. Power ON/OFF .........................................................39

3.5 SIM Interface .............................................................40

3.6 MICRO SD connector .................................................41

3.7 Memory ....................................................................42

3.8 LCD Display ..............................................................43

3.9 Keypad switching & scanning .....................................44

3.10 keypad back-light illumination ..................................45

3.11 LCD back-light illumination ......................................47

3.12 Battery voltage monitor ............................................48

3.13 Audio ......................................................................49

3.14 Bluetooth/FM (RBCA-B561A)....................................51

3.15 5PIN Interface connector ..........................................53

5.4 USB Trouble ..............................................................75

5.5 SIM Detect Trouble ....................................................78

5.6 Qwerty Key Sense Trouble ..........................................81

5.7 Slide Key sense Trouble .............................................83

5.8 Keypad backlight Trouble ...........................................84

5.9 Micro SD Trouble .......................................................86

5.10 Audio Trouble ..........................................................88

5.11 Microphone Trouble .................................................92

5.12 Camera Trouble .......................................................94

5.13 Main LCD Trouble ....................................................96

5.14 Bluetooth Trouble .....................................................98

5.15 RF Component ......................................................101

5.16 GSM PATH ............................................................103

5.17 Trouble Shooting of GSM Part .................................103

5.18 Trouble Shooting of WCDMA Part ............................112

6. Download & S/W upgrade .........................118

7. BLOCK DIAGRAM ........................................ 148

8. CIRCUIT DIAGRAM ...................................... 149

9. BGA Pin Map ..............................................157

10. PCB LAYOUT .............................................161

11. RF Calibration .......................................... 167

11.1. Test Equipment Setup ...........................................167

11.2. Calibration Step ....................................................167

4. RF Circuit Technical Brief ............................ 54

4.1 General Description ...................................................54

4.2 GSM Part ..................................................................58

4.3 WCDMA Part .............................................................62

4.4 GSM Power Ampliﬁ er Module .....................................65

4.5 WCDMA Band1/8 Power Ampliﬁ er Module ..................66

4.6 WCDMA Band1/8 Low Noise Ampliﬁ er ........................67

4.7 WCDMA Band1 Duplexer ...........................................68

4.8 WCDMA Band8 Duplexer ...........................................68

5. Trouble shooting ..........................................69

5.1 Trouble shooting test setup ........................................69

5.2. Power on trouble ......................................................70

5.3 Charging Trouble .......................................................73

12. EXPLODED VIEW & REPLACEMENT

PART LIST ................................................173

12.1 EXPLODED VIEW ...................................................173

12.2 Replacement Parts ................................................175

12.3 Accessory ............................................................. 201

- 3 -

LGE Internal Use Only

- 4 -

Only for training and service purposes

1. INTRODUCTION

1.1.Purpose

This manual provides the information necessary to repair, calibration, description and download the

features of the GW520.

1.2.Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,

persons other than your company’s employees, agents, subcontractors, or person working on your

company’s behalf) can result in substantial additional charges for your telecommunications services.

System users are responsible for the security of own system.

There might be risks of toll fraud associated with your telecommunications system. System users are

responsible for programming and configuring the equipment to prevent unauthorized use. LGE does

not warrant that this product is immune from the above case but will prevent unauthorized use of

common carrier telecommunication service of facilities accessed through or connected to it. LGE will

not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly

causing harm or interruption in service to the telephone network, it should disconnect telephone

service until repair can be done. A telephone company may temporarily disconnect service as long as

repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these

changes could reasonably be expected to affect the use of the GW520 or compatibility with the net

work, the telephone company is required to give advanced written notice to the user, allowing the user

to take appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on the GW520 must be performed only by the LGE or its authorized agent.

The user may not make any changes and/or repairs expect as specifically noted in this manual.

Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system

and may void any remaining warranty.

- 5 -

LGE Internal Use Only

1. INTRODUCTION

GW520 service manual

E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local

regulatory agencies. In accordance with these agencies, you may be required to provide information

such as the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly

different.

G. Interference and Attenuation

GW520 may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from

unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign. Following

information is ESD handling:

• Service personnel should ground themselves by using a wrist strap when exchange system boards.

• When repairs are made to a system board, they should spread the floor with anti-static mat which is

also grounded.

• Use a suitable, grounded soldering iron.

• Keep sensitive parts in these protective packages until these are used.

• When returning system boards or parts like EEPROM to the factory, use the protective package as

described.

- 6 -

Only for training and service purposes

1. INTRODUCTION

GW520 service manual

◆

1.3. ABBREVIATION

1. INTRODUCTION

For the purposes of this manual, following abbreviations apply:

APC Automatic Power Control BB Baseband BER Bit Error Ratio CC-CV Constant Current – Constant Voltage CLA Cigar Lighter Adapter DAC Digital to Analog Converter DCS Digital Communication System dBm dB relative to 1 milli-watt DSP Digital Signal Processing EEPROM Electrical Erasable Programmable Read-Only Memory EGPRS Enhanced General Packet Radio Service EL Electroluminescence ESD Electrostatic Discharge FPCB Flexible Printed Circuit Board GMSK Gaussian Minimum Shift Keying GPIB General Purpose Interface Bus GPRS General Packet Radio Service GSM Global System for Mobile Communications IPUI International Portable User Identity IF Intermediate Frequency LCD Liquid Crystal Display LDO Low Drop Output LED Light Emitting Diode LGE LG Electronics OPLL Offset Phase Locked Loop PAM Power Amplifier Module PCB Printed Circuit Board PGA Programmable Gain Amplifier PLL Phase Locked Loop

- 7 -

LGE Internal Use Only

1. INTRODUCTION

GW520 service manual

◆

PSTN Public Switched Telephone Network RF Radio Frequency RLR Receiving Loudness Rating RMS Root Mean Square RTC Real Time Clock SAW Surface Acoustic Wave SIM Subscriber Identity Module SLR Sending Loudness Rating SRAM Static Random Access Memory STMR Side Tone Masking Rating TA Travel Adapter TDD Time Division Duplex TDMA Time Division Multiple Access UART Universal Asynchronous Receiver/Transmitter VCO Voltage Controlled Oscillator VCTCXO

WAP Wireless Application Protocol

◆ 8PSK 8 Phase Shift Keying

Voltage Control Temperature Compensated Crystal

Oscillator

- 8 -

Only for training and service purposes

2. PERFORMANCE

GW520 service manual

2.1 Supporting Standard

Item Feature Comment

Supporting Standard WCDMA 900 / WCDMA 2100

2. PERFORMANCE

GSM850/EGSM/DCS/PCS with seamless handover Phase 2+(include AMR) SIM Toolkit : Class 1, 2, 3, A-E

Frequency Range GSM850 TX : 824 - 849MHz

GSM850 RX : 869 - 894MHz EGSM TX : 880 - 915 MHz EGSM RX : 925 - 960 MHz DCS TX : 1710 - 1785 MHz DCS RX : 1805 - 1880 MHz PCS TX : 1850 - 1910 MHz PCS RX : 1930 - 1990 MHz WCDMA900 TX : 880 - 915 MHz WCDMA900 RX : 925 - 960 MHz WCDMA2100 TX : 1920 - 1980 MHz WCDMA2100 RX : 2110 - 2170 MHz

Application Standard WAP 2.0, JAVA 2.0

2.2 Main Parts : Solution

Item Part name Comment

Baseband Chip PMB8878 (Infineon)

PMIC PMB6821 (Infineon)

RF chip PMB6952 (Infineon)

- 9 -

LGE Internal Use Only

2. PERFORMANCE

2.3 H/W features

Item Feature Comment

Form Factor Color LCD – Slide

1)Capacity : Li-Polymer, 950mAh

time

Talk time

Charging

time

Rx sensitivity GSM850 : < -105dBm

TX output

Battery

2) Packaging Type : Standard

Item Feature Comment

Size 104.5 x 54 x 16.75 mm

Weight 130 g With Battery

GSM > 250 hours @paging period 5 Stand-by

WCDMA > 250hours @DRX=7

GSM >160mins @ Tx level 5

WCDMA >160mins @Tx=12dBm

3 hours @power OFF/950mAh

EGSM900 : < -105 dBm

DCS1800 : < -105 dBm

PCS1900 : < -105 dBm

WCDMA 900/2100 : < -106.7 dBm

GSM/

GSM850 : 32.5 dBm

Class4(GSM850)

power

GPRS

EDGE GSM850 : 27dBm

EGSM900 : 32.5 dBm

DCS1800 : 29.5 dBm

PCS1900 : 29.5 dBm

EGSM900 : 27 dBm

DCS1800 : 26 dBm

PCS1900 : 26 dBm

Class4 (EGSM900)

Class1(DCS)

Class1(PCS)

E2(GSM850)

E2 (EGSM900)

E2 (DCS)

E2 (PCS)

GPRS compatibility GPRS Class 12

EDGE compatibility EDGE Class 12

Display Main LCD

(2.8”, 240 x 400 Pixels)/TFT

- 10 -

Only for training and service purposes

2. PERFORMANCE

GW520 service manual

Built-in Camera 5 Mega pixel

3 Mega pixel

ANT Main & Sub : Internal Fixed Type

System connector 5 Pin uUSB

Ear Phone Jack 5pin uUSB Type

PC synchronization Yes

Speech coding FR, EFR, HR, AMR

Vibrator Built in Vibrator

Blue Tooth V2.1 with A2DP

Voice Recording Yes

Speaker Phone mode

Yes

Support

Travel Adapter Yes

CDROM No

Stereo Headset Yes

Data Cable No TBD

T-Flash Yes Not Equipped

- 11 -

LGE Internal Use Only

2. PERFORMANCE

GW520 service manual

2.4 HW Spec.

GSM Transmitter/Receiver spec.

Item Specification

GSM 850 TX : 824 - 849 MHz RX : 869 - 894 MHz

EGSM TX : 880 - 915 MHz RX : 925 - 960 MHz

Frequency

DCS TX : 1710 - 1785 MHz RX : 1805 - 1880 MHz

PCS TX : 1850 - 1910 MHz RX : 1930 - 1990 MHz

Phase Error

Frequency Error

EMC(Radiated Spurious Emission

Disturbance)

Transmitter Output power and

Burst Timing

Burst Timing <3.69us

Spectrum due to modulation out

to less than 1800kHz offset

Spectrum due to modulation out

to larger than 1800kHz offset to

the edge of the transmit band

Spectrum due to switching

transient

Rms : 5°

Peak : 20 °

GSM : 0.1 ppm

DCS/PCS : 0.1 ppm

GSM/DCS : < -28dBm

GSM : 5dBm – 33dBm ± 3dB

DCS/PCS : 0dBm – 30dBm ± 3dB

200kHz : -36dBm

600kHz : -51dBm/-56dBm

GSM : 1800-3000kHz :< -63dBc(-46dBm)

3000kHz-6000kHz : <-65dBc(-46dBm)

6000kHz < : < -71dBc(-46dBm)

DCS : 1800-3000kHz :< -65dBc(-51dBm)

6000kHz < : < -73dBc(-51dBm)

400kHz : -19dBm/-22dBm(5/0), -23dBm

600kHz : -21dBm/-24dBm(5/0), -26dBm

Reference Sensitivity – TCH/FS Class II(RBER) : -105dBm(2.439%)

Usable receiver input level range 0.012(-15 - -40dBm)

Intermodulation rejection –

Speech channels

AM Suppression

- GSM : -31dBm - DCS : 29dBm

Timing Advance ± 0.5T

± 800kHz, ± 1600kHz : -98dBm/-96dBm (2.439%)

-98dBm/-96dBm (2.439%)

- 12 -

Only for training and service purposes

GW520 service manual

WCDMA Transmitter spec.

Item Specification

Transmit Frequency WCDMA900 : 880 MHz ~915 MHz

WCDMA2100 : 1920 ~1980 MHz

Maximum Output Power +24 dBm / 3.84 MHz, +1 / -3 dB

Frequency Error within ±0.1 PPM

Open Loop Power Control Normal Conditions : within ±9 dB,

Extreme Conditions : within ±12 dB

Minimum Transmit Power < -50 dBm /3.84 MHz

Occupied Bandwidth < 5 MHz at 3.84 Mcps (99% of power)

2. PERFORMANCE

Adjacent Channel Leakage

Power Ratio (ACLR)

Spurious Emissions

|f-fc| > 12.5 MHz

Transmit Intermodulation < -31 dBc @ 5 MHz & < -41 dBc @ 10 MHz

Error Vector Magnitude < 17.5 %, when Pout ≥ -20 dBm

Peak Code Domain Error

> 33 dB @ ±5 MHz,

> 43 dB @ ±10 MHz

< -36 dBm / 1 kHz RW @ 9 kHz ≤ f < 150 kHz

< -36 dBm / 10 kHz RW @ 150 KHz ≤ f < 30 MHz

< -36 dBm / 100 kHz RW @ 30 MHz ≤ f < 1 GHz

< -30 dBm / 1 MHz RW @ 1 GHz ≤ f < 12.75 GHz

< -41 dBm / 300 kHz RW @ 1893.5 MHz < f < 1919.6 MHz

< -67 dBm / 100 kHz RW @ 925 MHz ≤ f ≤ 935 MHz

< -79 dBm / 100 kHz RW @ 935 MHz < f ≤ 960 GHz

< -71 dBm / 100 kHz RW @ 1805 MHz ≤ f ≤ 1880 MHz

when Interference CW Signal Level = -40 dBc

< -15 dB at Pout t -20 dBm

- 13 -

LGE Internal Use Only

2. PERFORMANCE

GW520 service manual

A

WCDMA Receiver spec.

Item Specification

Receive Frequency WCDMA900 : 925 MHz ~ 960 MHz

WCDMA2100 : 2110 ~2170 MHz

Reference Sensitivity Level BER < 0.001 when Îor = -106.7 dBm / 3.84 MHz

Maximum Input Level BER < 0.001 when Îor = -25 dBm / 3.84 MHz

djacent Channel Selectivity

(ACS)

Blocking Characteristic BER < 0.001 when Îor = -103.7 dBm / 3.84 MHz

Spurious Response BER < 0.001 when Îor = -103.7 dBm /

Intermodulation BER < 0.001 when Îor= -103.7 dBm / 3.84 MHz

Spurious Emissions < -57 dBm / 100 kHz BW @ 9 kHz ≤ f < 1 GHz

Inner Loop Power Control In

Uplink

ACS > 33 dB where BER < 0.001

when Îor = -92.7 dBm / 3.84 MHz &

Ioac = –52 dBm / 3.84 MHz @ ±5 MHz

& Iblocking = -56 dBm / 3.84 MHz @ Fuw(offset) = ±10 MHz

or Iblocking = -44 dBm / 3.84 MHz @ Fuw(offset) = ±15 MHz

3.84 MHz & Iblocking = -44 dBm

& Iouw1 = -46 dBm @ Fuw1(offset) = ±10 MHz

& Iouw2 = -46 dBm / 3.84 MHz @ Fuw2(offset) = ±20 MHz

< -47 dBm / 1 MHz BW @ 1 GHz ≤ f ≤ 12.75 GHz

Adjust output(TPC command)

cmd 1dB 2dB 3dB

+1 +0.5/1.5 +1/3 +1.5/4

0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5

-1 -0.5/-1.5 -1/-3 -1.5/-4

group(10equal command group)

+1 +8/+12 +16/+24

- 14 -

Only for training and service purposes

GW520 service manual

HSDPA Tx Frequency spec.

Transmit Frequency

Maximum Output

Maximum Output Power

Power

HS-DPCCH

880 MHz ~ 915 MHz

880 MHz ~ 915 MHz 1920MHz ~ 1980 MHz

1920MHz ~ 1980 MHz

Sub-Test

Sub-Test 1=1/15, 2=12/15 21~25dBm / 3.84 MHz

1=1/15, 2=12/15 21~25dBm / 3.84 MHz 3=13/15 4=15/8 20~25dBm / 3.84 MHz

3=13/15 4=15/8 20~25dBm / 3.84 MHz 5=15/7 6=15/0 19~25dBm / 3.84 MHz

5=15/7 6=15/0 19~25dBm / 3.84 MHz

Sub-

test in

table

C.10.1.

4

5

Power

step

SpecificationItem

Power

Power step slot boundary

step size,

P [dB]

2. PERFORMANCE

Transmitter

power step

tolerance

[dB]

+/- 2.36Start of Ack/Nack1

+/- 0.61Start of CQI2

+/- 0.60Middle of CQI3

+/- 2.35End of CQI4

Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0

Frequency offset from

Spectrum Emission

Spectrum Emission Mask

Mask

Adjacent Channel

Adjacent Channel Leakage

Leakage Power Ratio (ACLR)

Power Ratio (ACLR)

HSDPA Tx Frequency spec.

HSDPA Rx Frequency spec.

Receive Frequency

Maximum Input Level

Maximum Input Level (BLER or R), 16QAM Only

(BLER or R), 16QAM Only

Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0

> 33 dB @ ±5 MHz

> 33 dB @ ±5 MHz > 43 dB @ ±10 MHz

> 43 dB @ ±10 MHz

3GPP Not CompleteError Vector Magnitude

925 MHz ~ 960 MHz

925 MHz ~ 960 MHz 2110 MHz ~2170 MHz

2110 MHz ~2170 MHz

Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0

BLER < 10% or R >= 700kbps

carrier △f

Minimum requirement

SpecificationItem

Measurement

Bandwidth

30 kHz-35-15×(△f-2.5)dBc2.5 ~ 3.5 MHz

1 MHz-35-1×(△f-3.5)dBc3.5 ~ 7.5 MHz

1 MHz-35-10×(△f-7.5)dBc7.5 ~ 8.5 MHz

1 MHz-49dBc8.5 ~ 12.5 MHz

- 15 -

LGE Internal Use Only

2. PERFORMANCE

페이지삭제후아래 삽입

Bluetooth spec.

Item Specification

Output Power(TRM/CA/01/C) Class2 : -6 dBm < Pav < 4 dBm

Power Density(TRM/CA/02/C) Power density < 100mW(20dBm) per 100kHz EIRP

Power Control(TRM/CA/03/C) Step size of the power control : 2dB <step size<8dB

TX Output Spectrum-Frequency Range(TRM/CA/04/C)

TX Ouptut Spectrum-20 dB Bandwidth(TRM/CA/05/C)

TX Output Spectrum-Adjacent Channel power(TRM/CA/06/C)

Modulation Characteristics(TRM/CA/07/C)

Initial Carrier Frequency Tolerance(TRM/CA/08/C) Ftx – 75kHz ≤ f0 ≤ ftx + 75kHz

Carrier Frequency Drift(TRM/CA/09/C)

Sensitivity-Single Slot PaCKET(RCV/CA/01/C)

Sensitivity-Multi Slot Packet(RCV/CA/02/C)

2.4000 GHz ~ 2.4835 GHz

│ f (H) - f (L) │≤ 1.0MHz

PTX(f) ≤ -20dBm for │M – N │ = 2 PTX(f) ≤ -40dBm for │M – N │≥3

140KHz ≤ delta f1 max ≤ 175KHz △ f2 max ≥ 115KHz (△ f2 avg /△ f1 avg) ≥ 0.8

DH 1 ≤±25 kHz DH 2 ≤±40 kHz DH 3 ≤±40 kHz Max. Drift Rate (DH 1/DH3/DH5) ( / 50 us) ≤ 20 kHz

BER ≤ 0.1% (min # of samples, 1600000 returned payload bits)

C/I Performance(RCV/CA/03/C) BER ≤ 0.1%

BER ≤ 0.1% (min # of samples, 1600000 returned

Blocking Performance(RCV/CA/04/C)

Intermodulation Performance(RCV/CA/05/C) BER ≤ 0.1%

Maximum Input Level(RCV/CA/06/C)

payload bits) # of freq. recorded in step v ≤ 24 # of freq. recorded in step v1 ≤ 5

BER ≤ 0.1% (min # of samples, 1600000 returned payload bits)

- 16 -

Only for training and service purposes

3. BB Circuit Technical brief

GW520 service manual

3.1 Functional Block Diagram

CAMERA (3M)

BT

FM Audio

RF

அ

FM Radio

Filter

3. BB Circuit Technical brief

Micro

SD

LCD(WqVGA)

FEM

PAM

26M

Battery

MOTOR

USIM

PMB

6821

(PMIC)

Main key

LED

26M

32K

RX ADC

TX DAC

VIB_DRV_N

USIM I/F

I2C

32K

UART1

I2S

XMM6080

(HSDPA)

I2C

MMC I/F

LCD

NAND DATA

SDRAM_ DATA

EBU_ ADDR

Mic In

Audio Out

UART0

I2C

USB

I2C

8bit

D(0:7)

D(0:15)

A(0:24)

I2C

Screen

Touch

NAND

Flash 2Gbit

SDRAM

1Gbit

MIC

Audio AMP

KEY

Encoder

3-Axis

Sensor

FM Audio

QWERTY

KEY

Receiver

SPEAKER

MUIC

UART

USB2.0

FULL

[Figure 3.1] Functional Block Diagram

- 17 -

LGE Internal Use Only

3. BB Circuit Technical brief

GW520 service manual

3.2 Baseband Processor Introduction

[Figure 3.2] Top level block diagram of S-GOLD®3H(PMB8878)

- 18 -

Only for training and service purposes

3. BB Circuit Technical brief

GW520 service manual

3.2.1 General description

S-GOLD®3H is a HSDPA/WCDMA/EDGE/GPRS/GSM system in package solution consisting of a

mixed signal baseband IC combined with a 3G coprocessor IC, providing all analog and digital

functionality for a dual mode mobile phone in a single chip. Both ICs building up the S-GOLD®3H SiP are manufactured in infineon Technologies` 1.35V 90nm

CMOS technology to meet the ever increasing demands of the market for feature rich and high

performance terminals at low costs.

The chip will support the FR, EFR, HR and AMR-NB vocoding. S-GOLD®3H support multi-slot operation modes HSCSD (up to class 10), GPRS for high speed data

application (up to class 12), EGPRS (up to class 12) and DTM(class11) without additional external

hardware.

3.2.2. Block Description

z Processing core

- ARM926EJ-S 32 bit processor core for controller functions. The ARM926EJ-S includes an MMU,

and the Jazelle Java extension for Java acceleration and a MOVE co-processor to accelerate

Motion Estimation algorithms with based video encoding schemes..

- TEAKLite DSP core

z ARM9-Memory

- 32k Byte Boot ROM on the AHB

- 128k Byte SRAM on the AHB, flexibly usable as program or data RAM

- 32k Byte Instruction Cache

- 32k Byte Data Cache

- 8k Byte Instruction Tightly coupled Memory (I-TCM)

- 8k Byte Data tightly coupled memory (D-TCM)

z TEAKLite®-Memory

- 120k x 16bit Program ROM

- 8k x 16bit Program RAM

- 72k x 16bit Data ROM

- 48k x 16bit Data XRAM

- 5k x 16bit Data YRAM

- Incremental Redundancy(IR) Memory of 35904 words of 16bit

- 19 -

LGE Internal Use Only

3. BB Circuit Technical brief

GW520 service manual

z Shared Memory Block

1.5K x 32bit Shared RAM(dual ported) between controller system and TEAKLite®.

z Controller Bus system

The processor cores and their peripherals are connected by powerful buses.

- Multi-layer AHB for connecting the ARM and the other master capable building blocks with the

internal and external memories and with the peripheral buses.

- An FPI-Bus for connecting GSM peripherals, called hereafter FPI3 bus.

- A controller FPI bus for connecting the low performance controller peripherals such as keypad

etc. called hereafter fPI2 bus.

- FPI2 and FPI3 are connected asynchronously to the AHB buses. 1 DMA controller with

8channels offloads the controller from data transfers.

- 2 AHB Lite buses for connecting multi-media and high performance peripherals, called

AHB_PER1 and AHB_PER2 hereafter. These peripheral buses are connected to the multi-layer

AHB ‘backbone’ by asynchronous, burst capable AHB2AHB bridges which are shared between

accessing masters.

- The DMA controller is enabled to access AHB_PER1 by use of its first master interface and

AHB_PER2 by its second master interface.

z TEAKLite® Bus System

- 1 TEAKLite® data bus for connecting the TEAKLite® data memory and the TEAKLite® peripherals.

Also the data bus is connected into the controller system via shared RAMs to the FPI3 bus.

- 1 TEAKLite® program bus for connecting the TEAKLite® program memory to the TEAKLite®.

z Clock system

The clock system allows widely independent selection of frequencies for the essential parts of the S-

GOLD®3H. Thus power consumption and performance can be optimized for each application.

z Functional Hardware block

- CPU and DSP Timers

- MOVE coprocessor performing motion estimation for video encoding algorithms

(H.263, MPEG-4)

- Programmable PLL with four additional phase shifters for system clock generation

- GSM Timer Module that off-loads the CPU from radio channel timing

- GMSK / 8-PSK Modulator according to GSM-standard 05.04 (5/2000)

· GMSK Modulator: gauss-filter with B*T=0.3

· EDGE Modulator: 8PSK-modulation with linearized GMSK-Pulse-Filter

- 20 -

Only for training and service purposes

3. BB Circuit Technical brief

GW520 service manual

- Hardware accelerators for equalizer and channel decoding.

- Incremental Redundancy memory for EDGE class 12 support

- A5/1, A5/2, A5/3 Cipher unit

- GEA1, GEA2, GEA3 Cipher Unit to support GPRS data transmission

- f8 and f9 Cipher unit

- Advanced static and dynamic power management features including TDMA-Frame

synchronous low-power mode and enhanced CPU modes(idle and sleep modes)

- 2D engine for support of image processing and 2D graphics applications. The 2D engine is tightly

coupled to the display interface. The resulting building block consisting of 2D engine and Display

interface is called Display Content Controller (DCC)

- Security crypto box supporting

· AES, DES, 3 DES

· Hash function

· RSA acceleration

· Secret Root Key (e-fuse) and Key Management

· True Random Number Generator

- Sample Rate Converter (SRC) for audio up-sampling

- Comprehensive static and dynamic Power Management

· Various frequency options during operation mode

· 32 kHz clock in standby mode

· Sleep control in standby mode

· RAMs and ROMs in power save mode during standby mode

· Additional leakage current reduction in standby mode possible by switching off for the

TEAKLitre® subsystem.

- Extensive debug support for the controller and the DSP system

· OCDS level 2+ (run control, non-intrusive program flow trace and limited data flow

trace) for ARM

· OCDS level 1+ (run control, limited program flow trace) for the TEAKLite®

· Multi-core debug support

· 4 Monitor pins for important internal signals and most pad signals

· Cerberus debugging unit

- 2 General Purpose Timers with 3 32-bit timers

- Serial number

- A real time clock with alarm functions

- 2 capture/compare units with 16 channels. One channel active during sleep mode.

- 21 -

LGE Internal Use Only

3. BB Circuit Technical brief

GW520 service manual

z 3G Coprocessor Subsystem

- ARM7 TRMI-S

· 240 kByte Instruction RAM

· 64 kByte Data RAM

· 8 kByte Boot ROM

- 20kByte Communication RAM

- HW accelerators for

· Transmit Path

· Inner and Outer Receiver for Release5 incl. HSDPA

3.2.3 RF Interface(T_OUT)

S-Gold® 3H uses this interface to control RF IC and Peripherals.

[Table 3.2.3-1] RF Interface Spec.

T_OUT Resource Interconnection Description

T_OUT0 TXON_PA PAM Power on

T_OUT1 -

T_OUT2 ANT_SEL1

T_OUT3

T_OUT4 FEM control

T_OUT5 FEM control

T_OUT6 PA_MODE PAM Mode select

T_OUT7 ANT_SEL2

T_OUT8 ANT_SEL3

T_OUT9

T_OUT10

- 22 -

Only for training and service purposes

GW520 service manual

3.2.4 ADC channel

3. BB Circuit Technical brief

ADC block is composed of 11 external ADC channel. This block operates charging process and other

related process by reading battery voltage and other analog values.

[Table 3.2.4-1] S-Gold3 ADC channel usage

ADC channel Resource Interconnection Description

M0 BAT_ID Battery temperature measure

M1 RF_TEMP RF block temperature measure

M2 N.C

M3 N.C

M4 LCD_ID

M5 N.C

M6 N.C

M7 H/W VERSION H/W version detect

M8 VBAT Battery supply voltage measure

M9 N.C

M10 N.C

- 23 -

LGE Internal Use Only

3. BB Circuit Technical brief

GW520 service manual

3.2.5 GPIO map

Over a hundred allowable resources, GW520 is using as follows except dedicated to SIM and Memory.

GW520 GPIO(General Purpose Input/Output) Map, describing application, I/O state, and enable level,

is shown in below table

[Table 3.2.5-1] S-Gold®3H GPIO pin Map

Port Function Net Name Description

KEY MATRIX

KP_IN0

KP_IN1

KP_IN2

KP_IN3

KP_IN4

KP_IN5

KP_IN6

KP_OUT0

KP_OUT1

KP_OUT2

KP_OUT3

USIF1

USIF1_RXD_MRST

USIF1_TXD_MTSR

USIF1_RTS_N

USIF1_CTS_N

USIF2

USIF2 _RXD_MRST

USIF2 _TXD_MTSR

USIF2_RTS_N

USIF2_CTS_N

USIF3

USIF3_RXD_MRST(EINT6)

USIF3 _TXD_MTSR

USIF3_SCLK

CLK

CLK32K

CLK26M

NA

KEY_12C_SCL

KEY_12C_SDA

KEY_INT

TP(NA)

ACCEL_INT

NA

VGA_PWDN

12C3_SCL

I2C3_SCL

12C3_SDA

I2C3_SDA

LIN_INVERTER

UART_RX UART Data

UART_TX UART Data

USB_ DAT_VP USB Data

USB_SE0_VM USB Data

TP(NA)

RPWRON_DBB

UART_BT_RTS Bluetooth RTS

UART_BT_CTS Bluetooth CTS

UART_BT_RX Bluetooth UART Data

UART_BT_TX Bluetooth UART Data

LIN_MOTOR_EN

CLK32k For FM Radio, BT CLK32K

TO THE FLIPFLOP(CLK26M)

- 24 -

Only for training and service purposes

GW520 service manual

CAMERA I/F

CIF_D0 CIF_D1 CIF_D2 CIF_D3 CIF_D4 CIF_D5 CIF_D6 CIF_D7 CIF_PCLK CIF_HSYNC CIF_VSYNC CLKOUT2 CIF_PD CIF_RESET

LCD I/F

DIF_D0 DIF_D1 DIF_D2 DIF_D3 DIF_D4 DIF_D5 DIF_D6 DIF_D7 DIF_D8 DIF_CS1 DIF_CS2 DIF_CD DIF_WR DIF_RD DIF_HD DIF_VD DIF_RESET1 DIF_RESET2

I2C

I2C1_SCL I2C1_SDA PM_INT

3. BB Circuit Technical brief

CIF_D0 CAMERA_DATA

CIF_D1 CAMERA_DATA

CIF_D2 CAMERA_DATA

CIF_D3 CAMERA_DATA

CIF_D4 CAMERA_DATA

CIF_D5 CAMERA_DATA

CIF_D6 CAMERA_DATA

CIF_D7 CAMERA_DATA

CIF_PCLK CAMERA_PCLK

CIF_HSYNC CAMERA_HSYNC

CIF_VSYNC CAMERA_VSYNC

CIF_MCLK CAMERA_MCLK (26M CLK)

M_CAM_PD

CAM_RESET

LCD_DATA(0) LCD_DATA

LCD_DATA(1) LCD_DATA

LCD_DATA(2) LCD_DATA

LCD_DATA(3) LCD_DATA

LCD_DATA(4) LCD_DATA

LCD_DATA(5) LCD_DATA

LCD_DATA(6) LCD_DATA

LCD_DATA(7) LCD_DATA

SHIFT_LED

LCD_CSn LCD SELECT

N.A

LCD_CD LCD ADDRESS

LCD_WRn LCD WRITE

LCD_RDn LCD READ

CAM_LDO_EN

LCD_VSYNC

LCD_RESET LCD_RESET

A_RESET 3G reset

I2C1_SCL For PMIC & AUDIO AMP

I2C1_SDA For PMIC & AUDIO AMP

PM_INT For PMIC

- 25 -

LGE Internal Use Only

3. BB Circuit Technical brief

GW520 service manual

I2C2_SCL I2C2_SDA

SIM I/F

CC_IO CC_CLK CC_RST

I2S2

I2S2_CLK0 (GPIO_31) I2S2_CLK1 (GPIO_102) I2S2_RX (GPIO_32) I2S2_TX (GPIO_33) I2S2_WA0 (GPIO_34) I2S2_WA1 (GPIO_103)

External Memory

MMCI1_CMD MMCI1_DAT[0] MMCI1_CLK MMC1_DAT[1] MMC1_DAT[2] MMC1_DAT[3] MMCI2_CMD (GPIO_22) MMCI2_DAT[0] (GPIO_107) MMCI2_CLK (GPIO_108)

I2C2_SCL FOR CAMERA,TOUCH, 3-AXIS ACCEL……

I2C2_SDA FOR CAMERA,TOUCH, 3-AXIS ACCEL……

SIM_IO SIM CARD DATA

SIM_CLK SIM CARD CLOCK

SIM_RST SIM CARD RESET

BT_RESET_N Bluetooth reset

DBB_BT_INT DBB_WAKEUP

LIN_PWM_MAG MOTER OPERATION

BT_INT BT_WAKEUP

TORCH_INT TOUCH INTERRUPT

QWERTY_KEY_EN QWERTY_KEY_ENABLE

MMC_CMD

MMC_D0

MMC_CLK

MMC_D1

MMC_D2

MMC_D3

MUIC_INT

LCD_BL_CTRL

FN_LED

IrDA

IrDA_TX (GPIO_110)

IrDA_RX (GPIO_111)

I2S1

I2S1_CLK0 I2S1_CLK1 I2S1_RX

I2S1_TX I2S1_WA0

Audio I/F

EPN1 EPP1 EPPA1 EPREF

USB_OEn For USB

SLIDE_DETECT Slide on/off detect

BT_PCM_CLK For Bluetooth

N.A

BT_PCM_RX For Bluetooth

BT_PCM_TX For Bluetooth

BT_PCM_SYNC For Bluetooth

REC_N For Receiver

REC_P For Receiver

EAR_SPK_P For SPK &Headset

N.A Reference

- 26 -

Only for training and service purposes

3. BB Circuit Technical brief

GW520 service manual

EPPA2 MICN1 MICP1 MICN2 MICP2 VMICP VMICN

ADC

M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 M10

Reference

VREFP IREF

JTAG I/F

JTAG0_TDO JTAG0_TDI JTAG0_TMS JTAG0_TCK JTAG0_TRST_n JTAG0_RTCK JTAG1_TDO JTAG1_TDI JTAG1_TMS JTAG1_RTCK JTAG1_TRST_n

ETM I/F

TRIG_IN MON1 MON2

EAR_SPK_N For SPK & Headset

MIC_N For Main Mic

MIC_P For Main Mic

HS_MIC_N For Headset Mic

HS_MIC_P For Headset Mic

VMIC_P Power for MIC

VMIC_GND Ground for MIC

BAT_ID Battery temperature measure

RF_TEMP RF block temperature measure

N.A

LCD ID LCD BANDER DETECT

N.A

VBAT

TP(N.A)

N.A

VREFN

GND

TDO

TDI

TMS

TCK

TRST_n

RTCK

A_TDO

A_TDI

A_TMS

A_RTCK

A_TRSTn

TRIG_IN , 2V62_VIO

2V62_VIO ETM

GND ETM

- 27 -

LGE Internal Use Only

3. BB Circuit Technical brief

GW520 service manual

TRACESYNC TRACECLK PIPESTAT[2] PIPESTAT[1] PIPESTAT[0] TRACEPKT[0] TRACEPKT[1] TRACEPKT[2] TRACEPKT[3] TRACEPKT[4] TRACEPKT[5] TRACEPKT[6] TRACEPKT[7]

Memory

MEM_AD[0] MEM _AD[1] MEM _AD[2] MEM _AD[3] MEM _AD[4] MEM _AD[5] MEM _AD[6] MEM _AD[7] MEM _AD[8] MEM _AD[9] MEM _AD[10] MEM _AD[11] MEM _AD[12] MEM _AD[13] MEM _AD[14] MEM _AD[15] MEM _WR_n MEM _RD_n MEM _BC0_n MEM _BC1_n MEM _BC2_n MEM _BC3_n MEM _A[0] MEM _A[1]

TRACESYNC

TRACECLK

PIPESTAT2

PIPESTAT1

PIPESTAT0

TRACEPKT0

TRACEPKT1

TRACEPKT2

TRACEPKT3

TRACEPKT4

TRACEPKT5

TRACEPKT6

TRACEPKT7

NAND_IO(0)

NAND_IO(1)

NAND_IO(2)

NAND_IO(3)

NAND_IO(4)

NAND_IO(5)

NAND_IO(6)

NAND_IO(7)

NAND_IO(8)

NAND_IO(9)

NAND_IO(10)

NAND_IO(11)

NAND_IO(12)

NAND_IO(13)

NAND_IO(14)

NAND_IO(15)

_WR

_RD

_BC0

_BC1

LDQS

UDQS

SD-DATA(0) SDRAM DATA

SD_DATA(1)

- 28 -

Only for training and service purposes

3. BB Circuit Technical brief

GW520 service manual

MEM _A[2] MEM _A[3] MEM _A[4] MEM _A[5] MEM _A[6] MEM _A[7] MEM _A[8] MEM _A[9] MEM _A[10] MEM _A[11] MEM _A[12] MEM _A[13] MEM _A[14] MEM _A[15] MEM _A[16] MEM _A[17] MEM _A[18] MEM _A[19] MEM _A[20] MEM _A[21] MEM _A[22] MEM _A[23] MEM _A[24] MEM _A[25] MEM _A[26] MEM_CSA0_N MEM_CSA1_N MEM_CSA2_N MEM_CSA3_N MEM _CS0_n MEM _CS1_n MEM _CS2_n MEM _CS3_n MEM _ADV_n MEM _RAS_n MEM _CAS_n MEM _WAIT_n MEM _SDCLK0

SD_DATA(2)

SD_DATA(3)

SD_DATA(4)

SD_DATA(5)

SD_DATA(6)

SD_DATA(7)

SD_DATA(8)

SD_DATA(9)

SD_DATA(10)

SD_DATA(11)

SD_DATA(12)

SD_DATA(13)

SD_DATA(14)

SD_DATA(15)

SD_ADD(0) SDRAM ADDRESS

SD_ADD(1)

SD_ADD(2)

SD_ADD(3)

SD_ADD(4)

SD_ADD(5)

SD_ADD(6)

SD_ADD(7)

SD_ADD(8)

SD_ADD(9)

SD_ADD(10)

SD_ADD(11)

SD_ADD(12)

SD_ADD(13)

BA0

_NAND_CS

_RAM_CS

TP(N.A)

_CS3

BA1

_RAS

_CAS

_WAIT

SDCLKO For Burst mode

- 29 -

LGE Internal Use Only

3. BB Circuit Technical brief

GW520 service manual

MEM _BFCLK01 MEM _BFCLK02 MEM _CKE

Memory

FCDP_RBn FWP (GPIO_60)

TDMA I/F

T_OUT0 T_OUT1 T_OUT2 T_OUT3 (GPIO_46) T_OUT4 (GPIO_47) T_OUT5 (GPIO_48) T_OUT6 T_OUT7 T_OUT8 T_OUT9 (I2C2_SDA) T_OUT10 T_IN0 (I2C2_SCL) T_IN1 (GPIO_55)

RF I/F

RF_STR0 RF_STR1 RF_DATA RF_CLK GPIO[7] GPIO[10] GPIO[15] GPIO[16] GPIO[17] GPIO[18]

System Port

AFC CLKOUT0 F26M F32K OSC32K RESET_N

BFCLKO For Burst mode

SDCLKI For Burst mode

CKE

FCDP

_WP

TXON_PA PAM

N.A

ANT_SEL1

SLIDE_KEY_LED

_CHG_EOC Charging terminate signal

MMC_DETECT SD card detect

PA_MODE PAM

ANT_SEL2

ANT_SEL3

TOUCH_SDA

DSR

TOUCH_SCL

CHG_EN Charging enable signal

2G_EN

_PPR Charger detect

2G_DATA

2G_CLK

3G_LD

3G_MASTER_ON

3G_PA_MODE1

ANT_SEL4

ANT_SEL5

ANT_SEL6

TO THE FLIPFLOP(AFC)

TO THE PLIPFLOP(26Mhz)

26MHZ 26M Main Clock

TO THE CRYSTAL(32.768khz)

_RESET

to 32k crystal

- 30 -

Only for training and service purposes

3. BB Circuit Technical brief

GW520 service manual

RSTOUT_N RTC_OUT SPCU_RQ_IN1 SPCU_RC_OUT0

DSP

DSPIN0 DSPOUT1 DSPIN1

N.A

RTC_OUT

BT_VCXO_EN

PM_VCXO_EN

CLK32K

WDOG

LIN_PWM_FREQ

3.3 Power management IC

3.3.1 General Description

SM-POWER is a highly integrated Power and Battery Management IC for mobile handsets. It has

been specially designed for usage with S-Gold3. Although optimized for usage with the Infineon

SGOLD

baseband device it is suitable for the S-GOLD lite and the E-GOLD+ baseband devices as well.

It also supports the cellular RF devices like SMARTi-DC, SMARTi-DC+, SMARTi-SD and the

Bluemoon Single, Infineon’s single chip solution for Bluetooth. If used with S-GOLD3 it provides all

power supply functions (except for the RF PA) for a complete advanced GSM Edge smart phone

minimizing external device count.

Block Description

• Highly efficient step-down converter for main digital baseband supply including Core, DSP and

memory interface (External Bus Unit).

• Support of S-GOLD standby power-down concept

• Low-drop-out (LDO) regulators for Flash and mobile RAM memory devices

• Voltage independent switching of two SIM cards

• LDO regulators for baseband I/O supply

• LDO regulator for analog mixed-signal section of S-GOLD

• Low-noise LDO regulators for RF devices

• Supply for Bluemoon Single, Infineon’s single chip solution for Bluetooth

• Audio amplifier 8 Ohms for handsfree operation and ringing

- 31 -

LGE Internal Use Only

LG GW520 Service Manual

Specifications and Main Features

Frequently Asked Questions

User Manual