LG GT350f Service Manual

Internal Use Only

Service Manual

GT350f

Date: January, 2011 / Issue 1.0

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LGE Internal Use Only Copyright © 2011 LG Electronics. Inc. All right reserved.

Only for training and service purposes

Table Of Contents

1. INTRODUCTION ..................................................................3

1.1 Purpose ............................................................................................... 3

1.2 Regulatory Information ............................................................... 3

1.3 Abbreviations ................................................................................... 5

2. PERFORMANCE ...................................................................7

2.1 H/W Features .................................................................................... 7

2.2 Technical Specification ................................................................. 8

3. TECHNICAL BRIEF .............................................................15

3.1 GT350f Functional Block diagram .........................................15

3.2 Baseband Processor (BBP) Introduction..............................16

3.3 Power management IC ..............................................................28

3.4. Power ON/OFF ..............................................................................34

3.5. SIM & uSD interface ....................................................................35

3.6. Memory ...........................................................................................37

3.7. LCD Display ....................................................................................38

3.8. Keypad Switching & Scanning ...............................................39

3.9. Keypad back-light illumination .............................................40

3.10. LCD back-light illumination ..................................................42

3.11. Audio ..............................................................................................43

4.5 Camera Trouble .............................................................................71

4.6 Receiver & Speaker trouble ......................................................73

4.7 Microphone trouble ....................................................................75

4.8 Vibrator trouble .............................................................................77

4.9 Keypad back light trouble .........................................................79

4.10 SIM & uSD trouble ......................................................................81

4.11 Touch trouble...............................................................................85

4.12 Trouble shooting of Receiver part .......................................87

4.13 Trouble shooting of Transmitter part. ................................93

5. DOWNLOAD ................................................................... 102

6. BLOCK DIAGRAM ........................................................... 115

7. CIRCUIT DIAGRAM ........................................................ 116

8. BGA PIN MAP ................................................................

9. PCB LAYOUT ................................................................... 128

10.ENGINEERING MODE ................................................... 134

10.1. Test Equipment Setup ..........................................................134

10.2. Calibration Step ...................................................................... 134

125

3.13. charging circuit ..........................................................................46

3.14 FM radio & BLUETOOTH ..........................................................47

3.15. 5pin u-USB Interface connector..........................................51

3.16. General Description .................................................................54

3.17. Receiver part ...............................................................................56

3.18. Transmitter part .........................................................................57

3.19. RF synthesizer .............................................................................58

3.20. Front End Module control .....................................................59

3.21. Power Amplifier Module ........................................................60

3.22. PAM Schematic ..........................................................................61

4. TROUBLE SHOOTING .......................................................62

4.1 Trouble shooting test setup .....................................................62

4.2 Power on Trouble ..........................................................................63

4.3 Charging trouble ..........................................................................66

4.4 LCD display trouble .....................................................................69

11. STAND ALONE TEST .................................................... 139

11.1 Test Program Setting ............................................................. 139

11.2 Tx Test ........................................................................................... 142

11.4 Rx Test .......................................................................................... 144

12. EXPLODED VIEW & REPLACEMENT PART LIST

12.1 EXPLODED VIEW ...................................................................... 146

12.2 Replacement Parts.................................................................. 147

12.3 Accessory ................................................................................... 170

......... 146

1. INTRODUCTION

I. Introduction

1.1 Purpose

This manual provides the information necessary to repair, calibration, description and download the features
of the GT350.

1.2 Regulatory Information

1.2.1 Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges you’re your telecommunications services.
System users are responsible for the security of own system. There are may be risks of toll fraud associated
with your telecommunications system. System users are responsible for programming and configuring the
equipment to prevent unauthorized use. LGE does not warrant that this product is immune from the above
case but will prevent unauthorized use of common-carrier telecommunication service of facilities accessed
through or connected to it. LGE will not be responsible for any charges that result from such unauthorized
use.

1.2.2 Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly causing
harm or interruption in service to the telephone network, it should disconnect telephone service until repair
can be done. A telephone company may temporarily disconnect service as long as repair is not done.

1.2.3 Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the GT350 or compatibility with the network, the
telephone company is required to give advanced written notice to the user, allowing the user to take
appropriate steps to maintain telephone service.

1.2.4 Maintenance Limitations

Maintenance limitations on the GT350 must be performed only at the LGE or its authorized agents. The user
may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that
unauthorized alternations or repair may affect the regulatory status of the system and may void any
remaining warranty.

1.2.5. Notice of Radiated Emissions

The GT350 complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information such as
the following to the end user.

1. INTRODUCTION

GT350f.

GT350f

GT350f

GT350f

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1. INTRODUCTION

1.2.6 Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.

1.2.7 Interference and Attenuation

An GS290 may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from
unsuppressed engines or electric motors may cause problems.

1.2.8 Electrostatic Sensitive Devices

ATTENTION

Boards, which contains Electrostatic Sensitive Device(ESD), are indicated by the sign. Following information is
ESD handling: Service personnel should ground themselves by using a wrist strap when exchange system
boards.

When repairs are made to a system board, they should spread the floor with anti-static mat which is also
grounded. Use a suitable, grounded soldering iron. Keep sensitive parts in these protective packages until
these are used. When returning system boards or parts such as EEPROM to the factory, use the protective
package as described.

GT350f

1.3 ABBREVIATION

For the purposes of this manual, following abbreviations apply:

୛ APC Automatic Power Control

୛ BB Baseband

୛ BER Bit Error Ratio

୛ CC- Constant Current – Constant Voltage

୛ CLA Cigar Lighter Adapter

୛ DAC Digital to Analog Converter

୛ DCS Digital Communication System

୛ dBm dB relative to 1 milli-watt

୛ DSP Digital Signal Processing

୛ EEPROM Electrical Erasable Programmable Read-Only Memory

୛ EGPRS Enhanced General Packet Radio Service

୛ EL Electroluminescence

୛ ESD Electrostatic Discharge

୛ FPCB Flexible Printed Circuit Board

୛ GMSK Gaussian Minimum Shift Keying

୛ GPIB General Purpose Interface Bus

୛ GPRS General Packet Radio Service

୛ GSM Global System for Mobile Communications

୛ IPUI International Portable User Identity

୛ IF Intermediate Frequency

୛ LCD Liquid Crystal Display

୛ LDO Low Drop Output

୛ LED Light Emitting Diode

୛ LGE LG Electronics

୛ OPLL Offset Phase Locked Loop

୛ PAM Power Amplifier Module

୛ PCB Printed Circuit Board

୛ PGA Programmable Gain Amplifier

1. INTRODUCTION

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୛ PLL Phase Locked Loop

୛ PSTN Public Switched Telephone Network

୛ RF Radio Frequency

୛ RLR Receiving Loudness Rating

୛ RMS Root Mean Square

୛ RTC Real Time Clock

୛ SAW Surface Acoustic Wave

୛ SIM Subscriber Identity Module

୛ SLR Sending Loudness Rating

୛ SRAM Static Random Access Memory

୛ STMR Side Tone Masking Rating

୛ TA Travel Adapter

୛ TDD Time Division Duplex

୛ TDMA Time Division Multiple Access

୛ UART Universal Asynchronous Receiver/Transmitter

୛ VCO Voltage Controlled Oscillator

୛ DCXO Digitally Controled Crystal Oscillator

୛ WAP Wireless Application Protocol

୛ 8PSK 8 Phase Shift Keying

1. INTRODUCTION

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2. PERFORMANCE

II. General Performance

2.1 H/W Feature

Item Feature Comment

Standard Battery Li-ion polymer, 950mAh

AVG TCVR Current 250mA typ @PL5

Standby Current 2.0 mA typ @PP9

Talk time 4 hours (GSM TX Level 7)

Standby time Over 450 hours (Paging Period:9, RSSI: -85dBm)

Charging time Under 3 hours

RX Sensitivity EGSM/GSM850:-105dBm˨ ,DCS/PCS:-105dBm˨

TX output power

EGSM/GSM850 : 33dBm (@PL 5)
DCS/PCS: 30dBm (@PL 0)

GPRS compatibility Class 10

SIM card type 3V (Plug in type)

Display

Main 240 u 400 pixels, 3” WQVGA, 262K TFT

Status Indicator

Send Key, End key, Shortcut Key, Volume
Up/Down Key, PWR Key, Camera Key

ANT Built in antenna

EAR Phone Jack 3.5Pi Headset jack

PC Synchronization Yes

Speech coding HR/EFR/FR/AMR

Data and Fax Yes

Vibrator Yes

Buzzer No

Voice Recoding Yes

C-Mic Yes

Receiver Yes

Travel Adapter Yes

Options Bluetooth hands-free kit, Data Kit

2. PERFORMANCE

3V (Plug in type)

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2. PERFORMANCE

2.2 Technical specification

Item Description Specification

1 Frequency Band

GSM850

TX: 824 + 0.2 x n MHz
RX: 869 + 0.2 x n MHz ( n = 1 ~ 124 )

EGSM

TX: 890 + 0.2 x (n-1024) MHz
RX: 935 + 0.2 x (n-1024) MHz ( n = 975 ~ 1023 )

DCS1800

TX: 1710 + ( n-511 ) u 0.2 MHz (n = 512 a 885)

RX: TX + 95 MHz

PCS1900

TX: 1850.2 + ( n-512 ) u 0.2 MHz (n = 512 a 810)
RX: TX + 80MHz

2

Phase Error

RMS < 5 degrees
Peak < 20 degrees

3

Frequency Error < 0.1ppm

GSM850/EGSM

Level Power Toler. Level Power Toler.

5 33 dBm ±2dB 13 17 dBm ±3dB

6 31 dBm ±3dB 14 15 dBm ±3dB

7 29 dBm ±3dB 15 13 dBm ±3dB

8 27 dBm ±3dB 16 11 dBm ±5dB

9 25 dBm ±3dB 17 9 dBm ±5dB

10 23 dBm ±3dB 18 7 dBm ±5dB

11 21 dBm ±3dB 19 5 dBm ±5dB

12 19 dBm ±3dB

DCS1800/PCS1900

Level Power Toler. Level Power Toler.

0 30 dBm ±2dB 8 14 dBm ±3dB

1 28 dBm ±3dB 9 12 dBm ±4dB

2 26 dBm ±3dB 10 10 dBm ±4dB

3 24 dBm ±3dB 11 8 dBm ±4dB

4 22 dBm ±3dB 12 6 dBm ±4dB

5 20 dBm ±3dB 13 4 dBm ±4dB

6 18 dBm ±3dB 14 2 dBm ±5dB

4

Power Level

7 16 dBm ±3dB 15 0 dBm ±5dB

2. PERFORMANCE

GSM850/EGSM

Offset from Carrier (kHz). Max. dBc

100 +0.5

200 -30

250 -33

400 -60

600 ~ 1,200 -60

1,200 ~ 1,800 -60

1,800 ~ 3,000 -63

3,000 ~ 6,000 -65

6,000 -71

DCS1800/PCS1900

Offset from Carrier (kHz). Max. dBc

100 +0.5

200 -30

250 -33

400 -60

600 ~ 1,200 -60

1,200 ~ 1,800 -60

1,800 ~ 3,000 -65

3,000 ~ 6,000 -65

5

Output RF Spectrum
(due to modulation)

6,000 -73

GSM850/EGSM

Offset from Carrier (kHz) Max. (dBm)

400 -19

600 -21

1,200 -21

1,800 -24

DCS1800/PCS1900

Offset from Carrier (kHz) Max. (dBm)

400 -22

600 -24

1,200 -24

6

Output RF Spectrum
(due to switching transient)

1,800 -27

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2. PERFORMANCE

7 Spurious Emissions

Conduction, Emission Status
Conduction, Emission Status

8

Bit Error Ratio

GSM850 / EGSM

BER (Class II) < 2.439% @-102dBm

DCS1800/PCS1900

BER (Class II) < 2.439% @-100dBm

9

Rx Level Report accuracy

r 3 dB

10 SLR

8 r 3 dB

Frequency (Hz) Max.(dB) Min.(dB)

100 -12 /
200 0 /
300 0 -12
1,000 0 -6
2,000 4 -6
3,000 4 -6
3,400 4 -9

11

Sending Response

4,000 0 /

12 RLR 2 r 3 dB

Frequency (Hz) Max.(dB) Min.(dB)

100 -12 /
200 0 /
300 2 -7
500 * -5
1,000 0 -5
3,000 2 -5
3,400 2 -10
4,000 2

13 Receiving Response

* Mean that Adopt a straight line in between 300
Hz and 1,000 Hz to be Max. level in the range.

14 STMR

13 r 5 dB

15 Stability Margin > 6 dB

dB to ARL (dB) Level Ratio (dB)

-35 17.5

-30 22.5

-20 30.7

-10 33.3

0 33.7

7 31.7

16

Distortion

10 25.5

17

Side tone Distortion Three stage distortion < 10%

18

<Change> System frequency (26 MHz)
tolerance

d 2.5 ppm

19

<Change>32.768KHz tolerance

d 30ppm

20

Power consumption

Standby

- Normalஆd 2 mA(@PP9)

21

Talk Time

EGSM/Lvl 7 (Battery Capacity 800mA):180 min
EGSM/Lvl12(Battery Capacity 800 mA):320min

22

Standby Time

Under conditions, at least 300 hours:

1. Brand new and full 950mAh battery

2. Full charge, no receive/send and keep GSM in
idle mode.

3. Broadcast set off.

4. Signal strength display set at 3 level above.

5. Backlight of phone set off.

23

Ringer Volume

At least 65 dB under below conditions:

1. Ringer set as ringer.

2. Test distance set as 50 cm

24

Charge Current

Fast Charge : < 650 mA
Slow Charge: < 120 mA

Antenna Bar Number

Power

7

>-92 dBm a

5

-97dBm a –93dBm

4

-100dBm a –98dBm

2

-103dBm a –101dBm

1

-105dBm a –104dBm

0 < –106 dBm

25

Antenna Display

Off No Service

Battery Bar Number Voltage (±0.05V)

3 3.76V~4.2V

2 3.68V~3.75V

1 3.62V~3.67V

26 Battery Indicator

0 3.36V~3.61V

3.61VĻ±0.05V (Call)

27 Low Voltage Warning

3.61VĻ±0.05V (Standby)

28 Forced shut down Voltage

3.35 r 0.05 V

2. PERFORMANCE

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2. PERFORMANCE

29

Battery Type

Li-ion Polymer Battery
Standard Voltage = 3.7 V
Battery full charge voltage = 4.2 V
Capacity: 950mAh

30

Travel Charger

Switching-mode charger
Input: 150 a 240 V, 50/60Hz
Out put: 5.1, 0.7A

* EDGE RF Specification (Option: is not serviced for ”EDGE mode”)

Item Description Specification

1 RMS EVM ≤9%
2 Peak EVM ≤30%

3 95th Percentile EVM ≤15%
4 Origin Offset Suppression ≥30dB

GSM900/EGSM

Level Power Toler. Level Power Toler.

5 27dBm ±3dB 13 17dBm ±3dB
6 27dBm ±3dB 14 15dBm ±3dB
7 27dBm ±3dB 15 13dBm ±3dB
8 27dBm ±3dB 16 11dBm ±5dB

9 25dBm ±3dB 17 9dBm ±5dB
10 23dBm ±3dB 18 7dBm ±5dB
11 21dBm ±3dB 19 5dBm ±5dB
12 19dBm ±3dB

DCS1800, PCS1900

Level Power Toler. Level Power Toler.

0 26/25dBm ±3dB 8 14dBm ±3dB

1 26/25dBm ±3dB 9 12dBm ±4dB

2 26/25dBm ±3dB 10 10dBm ±4dB

3 24dBm ±3dB 11 8dBm ±4dB

4 22dBm ±3dB 12 6dBm ±4dB

5 20dBm ±3dB 13 4dBm ±4dB

6 18dBm ±3dB 14 2dBm ±5dB

5 Power Level

7 16dBm ±3dB 15 0dBm ±5dB

GSM900/EGSM

Offset from carrier(kHz) Max. dBc
100 +0.5
200 -30
250 -33
400 -54
600~<1,200 -60
1,200~<1,800 -60
1,800~<3,000 -63
3,000~<6,000 -65
6,000 -71

DCS1800, PCS1900

Offset from carrier(kHz) Max. dBc
100 +0.5
200 -30
250 -33
400 -54
600~<1,200 -60
1,200~<1,800 -60
1,800~<3,000 -63
3,000~<6,000 -65

6

Output RF Spectrum
(due to modulation)

6,000 -71

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2. PERFORMANCE

Only for training and service purposes

2. PERFORMANCE

GSM900/EGSM

Offset from carrier(kHz) Max. dBm
400 -23
600 -26
1,200 -27
1,800 -30

DCS1800, PCS1900

Offset from carrier(kHz) Max. dBm
400 -23
600 -26
1,200 -27

7

Output RF Spectrum
(due to switching transient)

1,800 -30

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3. TECHNICAL BRIEF

III. Technical brief

III-1 Baseband circuit

3.1 GT350 Functional Block diagram

The functional component arrangement is mentioned below diagram.

LGE Internal Use Only

GT350 BLOCK DIAGRAM

PMB6821(PM IC)

BB IC(PMB8877)

(2G NAND +

1G DDR SDRAM)

Charging IC

Ր-SD

TRANSCEIVER

PMB6272

LMSP4DNA

BT/FM IC

(BCM20780)

Haptic Driver

LCD, 3.0”

262K TFT WQVGA

KEY PAD

KEY Back Light

Charge Pump

SD1 (1.35V)

SD2(1.8V)

SU1(5.6..25V)

VAUX (2.9V)

VIO(2.62V)

VSIM(2.9V)

VMME (2.9V)

VUMTS(2.85V)

VUSB(3.1V) VVIB(2.8V)

VAUDIOa(2.5V)

VAUDIOb(2.5V)

VRF1(2.85V)

VRF2(1.53V)

VRF3(2.70V)

VPLL(1.35V)

VRTC(2.0V)

VAFC (2.65V)

VBAT

DCS/PCS

GSM850/900

FEM

PAM(SKY77344)

2M CAM

FE1 FE2

PA_MODE

PA_BAND

TXON_PA

PA_LEVEL

I/I_/Q/Q_

RF_EN

RF_CLK

RF_DA

26M_MCLK

26M_Crystal

ANT

BPF

BT ANT

FM ANT

UART

/

/

I2S

/

BT_CLK

ADD(0:29)

/

DATA(0:15)

/

32kHz

Headset Reciever(L/R)

MAIN MIC

FM RADIO

FM RADIO

AUIDO AMP

EPN11

EPP11

EPPA11

EPPA21

INM­INM+

INL
INR

MAIN SPEAKER

OUT-

OUT+

MIC1(P/N)

MIC2(P/N)

VMICP/N

I2C

/

INL/R

tply

iwhzz

wylThtw

Match

Match

Match

Match

Controller

Battery

CHG_EN

T_IN1

I2C1

/

(LED CTRL : 6 ea)

I2C2

/

SET/EN

VBAT

Power_KEY

COL

ROW

GPIO

2V11_RTC

2V11_RTC

B/UP BAT.

I2C2

/

I2C2

I2C1

CIF

MMC I/F

/

MMCI1

VIB_EN

GPIO

PA_MODE

PA_BAND

TXON_PA

PA_LEVEL

USIF2

I2S1

ymGpu{lymhjl

Memory

FM_ANT

T|ziGj

MUIC_DP/DM

VBUS_VCHG

DIF

/

DIF

Touch Sensor IC

SIM Socket

SIM I/F

SIM I/F

I2C1

/

I2C1

KEY_EN

GPIO

MUIC

MUIC_ID

I2C1

UART

HEADSET MIC

KEY Encoder

KEY_I2C

/

Vibrator

VIB_PWM

GPIO

I2C1

USB

/

CIF

I2C2

GPIO

Ear-jack

RF Transceiver(PMB6272)

Touch Window

Figure 1 GT350 Functional block diagram

ADC

ADC

Dig

PGA

FEM

Control

Bias DAC

DAC

÷4

÷2

÷4

÷2

Bias

RX1/RX1X

850MHz

RX2/RX2X

900MHz

RX3/RX3X

1800MHz

RX4/RX4X

1900MHz

TX1

850/900MHz

TX2

1800/1900MHz

VBIAS

FE1

FE2

VCO_R

cordic

I/Q

=>

R/Φ

Sigma-Delta

MASH Modulator

d/dt

2

2

2

PGA

1dB

Ramp

Integrated

3.8GHz VCO

26 MHz

.125dB

PGA

6dB

2

Q

I

OLG

asjust

VCO

control

fast

CP

fast

PFD

multi modulus divider

on chip

loop filter

VCO-LDO

Timing

&

Measure

ment

NI_NF

MOD

3-wire

bus

Sequencing

GT350f

3. TECHNICAL BRIEF

GT350f

GT350f

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3. TECHNICAL BRIEF

3.2 Baseband Processor (BBP) Introduction

Figure 2 Top level block diagram of the S-GOLD3

TM

(PMB8877)

3. TECHNICAL BRIEF

3.2.1 General Description

S-GOLD3TM is a GSM/EDGE single chip mixed signal Baseband IC containing all analog and digital
functionality of a cellular radio. Additionally S-GOLD3TM Provides multimedia extensions such as camera,
software MIDI, MP3 sound. It is designed as a single chip solution, integrating the digital and mixed signal
portions of the base band in 0.09um, 1.2V technology.

The chip will fully support the FR, EFR, HR and AMR-NB vocoding.

S-GOLD3

TM

support multi-slot operation modes HSCSD (up to class 10), GPRS for high speed data application

(up to class 12) and EGPRS (up to class 12) without additional external hardware.

3.2.2 Block Description

z Processing core

ARM926EJ-S 32 bit processor core for controller functions. The ARM926EJ-S includes an MMU, and the
Jazelle Java extension for Java acceleration.

- TEAKLite DSP core

z ARM-Memory

- 32k Byte Boot ROM on the AHB

- 96k Byte SRAM on the AHB, flexibly usable as program or data RAM

- 16k Byte Cache for Program (internal)

- 8k Byte tightly coupled memory for Program(internal)

- 8k Byte Cache for Data(internal)

- 8k Byte tightly coupled memory for Data(internal)

z DSP-Memory

- 104K x 16bit Program ROM

- 8k x 16bit Program RAM

- 60k x 16bit Data ROM

- 37k x 16bit Data RAM

- Incremental Redundancy(IR) Memory of 35904 words of 16bit

z Shared Memory Block

1.5K x 32bit Shared RAM(dual ported) between controller system and TEAKLite.

z Controller Bus system

The processor cores and their peripherals are connected by powerful buses.
Multi-layer AHB for connecting the ARM and the other master capable building blocks with the internal
and external memories and with the peripheral buses.

z Clock system

The clock system allows widely independent selection of frequencies for the essential parts of the
S-GOLD3. Thus power consumption and performance can be optimized for each application.

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3. TECHNICAL BRIEF

z Functional Hardware block

- CPU and DSP Timers

- MOVE coprocessor performing motion estimation for video encoding algorithms
(H.263, MPEG-4)

- Programmable PLL with additional phase shifters for system clock generation

- GSM Timer Module that off-loads the CPU from radio channel timing

- GMSK / 8-PSK Modulator according to GSM-standard 05.04 (5/2000)

- GMSK Modulator: gauss-filter with B*T=0.3

- EDGE Modulator: 8PSK-modulation with linearized GMSK-Pulse-Filter

- Hardware accelerators for equalizer and channel decoding.

- Incremental Redundancy memory for EDGE class 12 support

- A5/1, A5/2, A5/3 Cipher unit

- GEA1, GEA2, GEA3 Cipher Unit to support GPRS data transmission

- Advanced static and dynamic power management features including TDMA-Frame

synchronous low power mode and enhanced CPU modes(idle and sleep modes)

- Pulse Number Modulation output for Automatic Frequency Correction(AFC)

- Serial RF Control interface: support of direct conversion RF

- A Universal Serial Interface(USIF) enabling asynchronous (UART) of synchronous (SPI)
serial data transmission

- 3 USIF with autobaud detection, hardware flow control and integrated

- A dedicated Fas IfDA Controller supporting IrDA’s SIR,MIR and FIR standards

(up to 4Mbps)

- I2C-bus interface (e.g. connection to S/M power)

- A fast display interface supporting serial and parallel interconnection

- An ITU-R BT.656 compatible Camera interface.

- Programmable clock output for a camera

- An multimedia/Secure Digital Card Interface (MMCI/SD:SDIO capable)

3.2.3 External Devices connected to memory interface

Table 1. Memory interface

Device Name Maker Remark

FLASH K522H1HACB-B060 SAMSUNG Synchronous / A synchronous
DDR K522H1HACB-B060 SAMSUNG Synchronous 166MHz
LCD IM300IBN4A LGIT 8bit access 2 times transmission
Melody IC Not Used S/W Infineon Software CODEC

3.2.4 RF Interface (T_OUT)

S-Gold3 uses this interface to control RF IC and Peripherals. 13 signals are provided switch on/off RF ICs
Periodically each TDMA frame.

Table 2. RF Interface Spec.

T_OUT
Resource Interconnection Description

T_OUT0 TXON_PA PAM Power on
T_OUT1
T_OUT2 PA_BAND TX RF band select
T_OUT3
T_OUT4 BT_WAKEUP BT wake up
T_OUT5 VIB_PWM Motor control
T_OUT6 PA MODE PAM Mode select

3.2.5 USIF Interface

GT350 have three USIF Drivers as follow :

- USIF1 : Hardware Flow Control / SW upgrade / Calibration

- USIF2 : Not used Rx, CTS & RTS use BT Interface

- USIF3 : WLAN Data

Table 3. USIF Interface Spec.

Resource Name Remark
USIF1

USIF1_TXD TXD Transmit Data
USIF1_RXD RXD Receive Data
USIF1_CTS USB_DM USB
USIF1_RTS USB_DP USB

USIF2
USIF2_TXD VIB_EN Motor control

USIF2_RXD Other function ­USIF2_CTS BT_CTS BT
USIF2_RTS BT_RTS. BT

USIF3
USIF3_TXD WLAN_D[1] WLAN Data

USIF3_RXD WLAN_D[2] WLAN Data

3. TECHNICAL BRIEF

GT350f

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3. TECHNICAL BRIEF

3.2.6 ADC channel

BBP ADC block is composed of 10 external ADC channel. This block operates charging process and other
related process by reading battery voltage and other analog values.

Table 4. S-Gold3 ADC channel usage

ADC channel
Resource Interconnection Description

M0 BAT_ID Battery temperature measure
M1 RF_TEMP RF block temperature measure
M2 N.C
M3 N.C
M4 N.C
M5 N.C
M6 N.C
M7 N.C
M8 VSUPPLY Battery supply voltage measure
M9 N.C
M10 N.C

3.2.7 GPIO map

Over a hundred allowable resources, GT350 is using as follows except dedicated to SIM and Memory.
GPIO(General Purpose Input/Output) Map, describing application is shown in below table

Table 5 S-Gold3 GPIO pin Map

Port function Net name Description

#Keypad

G G

KP_IN0

G

G

KP_IN1

G

G

KP_IN2

IF_MODE0

LCD Interface mode 0

KP_IN3

G

G

KP_IN4

G G

KP_IN5

G

KP_IN6

KEY_INT Key coder IC interrupt

KP_OUT0

JACK_DETECT

Ear-mic jack detect

KP_OUT1

G

G

KP_OUT2

KEY_I2C_SCL

Key coder IC’s I2C clock

KP_OUT3

KEY_I2C_SDA

Key coder IC’s I2C data

#USIF1: Universal
Serial IF
#USB

G G

USIF1_RXD_MRST

UART_RX

UART, RS232 Data

USIF1_TXD_MTSR

UART_TX

UART, RS232 Data

USIF1_RTS_N

USB_DAT_VP

USB Data

USIF1_CTS_N

USB_SE0_VM

USB Data

#USIF2: Universal
Serial IF

G G

USIF2_RXD_MRST

G

G

USIF2_TXD_MTSR

VIB_EN

Moter enable

USIF2_RTS_N

UART_BT_RTS

Bluetooth RTS

USIF2_CTS_N

UART_BT_CTS

Bluetooth CTS

#USIF3: Universal
Serial IF

G G

USIF3_RXD_MRST

G

USIF3_TXD_MTSR

G

USIF3_SCLK

G

#MMCI2: Intrachip

G G

MMCI2_CMD

G

MMCI2_DAT[0]

G

MMCI2_CLK

G

#CIF: Camera Interface G G

CIF_D0

CIF_D0

Camera DATA[0]

CIF_D1

CIF_D1

Camera DATA[1]

CIF_D2

CIF_D2

Camera DATA[2]

GT350f

3. TECHNICAL BRIEF

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CIF_D3

CIF_D3

Camera DATA[3]

CIF_D4

CIF_D4

Camera DATA[4]

CIF_D5

CIF_D5

Camera DATA[5]

CIF_D6

CIF_D6

Camera DATA[6]

CIF_D7

CIF_D7

Camera DATA[7]

CIF_PCLK

CIF_PCLK

Camera pixel clock

CIF_HSYNC

CIF_HSYNC

Camera H sync

CIF_VSYNC

CIF_VSYNC

Camera V sync

CLKOUT2

CIF_MCLK

Camera main clock

CIF_PD

CIF_PD

Camera power down(active high)

CIF_RESET

CIF_RESET

Camera reset

#Display_Interface

G G

DIF_D0

DIF_D0

LCD data[0]

DIF_D1

DIF_D1

LCD data[1]

DIF_D2

DIF_D2

LCD data[2]

DIF_D3

DIF_D3

LCD data[3]

DIF_D4

DIF_D4

LCD data[4]

DIF_D5

DIF_D5

LCD data[5]

DIF_D6

DIF_D6

LCD data[6]

DIF_D7

DIF_D7

LCD data[7]

DIF_D8

CAM_LDO_EN

Camera LDO enabe

DIF_CS1

DIF_CS

MAIN LCD chip select

DIF_CS2

LCD_ID

LCD ID

DIF_CD

DIF_CD

LCD Command Data switch

DIF_WR

DIF_WR

LCD Write enable

DIF_RD

DIF_RD

LCD read enable

DIF_HD

HOOK_DETECT

Ear-mic hook detect

DIF_VD

DIF_VSYNC

LCD V sync

DIF_RESET1

DIF_RESET LCD reset

DIF_RESET2

TOUCH_INT Touch interrupt

#I2C1

G G

I2C1_SCL

I2C1_SCL

For PMIC/Touch/MUIC

I2C1_SDA

I2C1_SDA

For PMIC/Touch/MUIC

PM_INT

PM_INT

PMIC interrupt

#I2C2

G G

I2C2_SCL

I2C2_SCL

For Amp/Camera

I2C2_SDA

I2C2_SDA

For Amp/Camera

#Chip Card (USIM1)

G G

CC_IO

SIM_IO

SIM CARD I/O

CC_CLK

SIM_CLK

SIM CARD CLOCK

CC_RST

SIM_RST

SIM CARD RESET

#FIrDA:
Fast IrDA

G G

IrDA_TX

_USB_OE

USB out enable

IrDA_RX

BT_INT BT interrupt

#SWIF: 1 wire IF G G

3. TECHNICAL BRIEF

SWIF_TXRX

G G

#MMCI1:
Card Connector

G G

MMCI1_CMD

MMC_CMD T-flash command

MMCI1_DAT[0]

MMC_D[0] T-flash data[0]

MMCI1_CLK

MMC_CLK T-flash clock

#MMCI1:
SD-Extension

G G

MMCI1_DAT[1]

MMC_D[1] T-flash data[1]

MMCI1_DAT[2]

MMC_D[2] T-flash data[2]

MMCI1_DAT[3]

MMC_D[3] T-flash data[3]

#I2S1

G G

I2S1_CLK0

I2S1_CLK For Bluetooth

I2S1_CLK1

_MMC_DET T-flash detect

I2S1_RX

I2S1_RX For Bluetooth

I2S1_TX

I2S1_TX For Bluetooth

I2S1_WA0

I2S1_WA0 For Bluetooth

#I2S2

G G

I2S2_CLK0

_CHG_EOC End of charge from charging IC

I2S2_CLK1

UART_BT_RX For Bluetooth

I2S2_RX

_PPR Power good output from charging IC

I2S2_TX

KEY_EN For PMIC

I2S2_WA0

SLIDE_OPEN Slide open/close detect

I2S2_WA1

UART_BT_TX For Bluetooth

#Voiceband: Analog
Interface

G G

EPN1

RCV_N

For Receiver

EPP1

RCV_P

For Receiver

EPPA1

BB_SND_L For Speaker

EPREF

G G

EPPA2

BB_SND_R For Speaker

MICN1

MAIN_MIC_N

For Main Mic

MICP1

MAIN_MIC_P

For Main Mic

MICN2

HS_MIC_N

For Headset Mic

MICP2

HS_MIC_P

For Headset Mic

AUXN1

G G

AUXP1

G G

AUXN2

G

G

AUXP2

G G

AUXGND

G G

VMICP

VMIC_P

Power for MIC

VMICN

VMIC_N

Power for MIC

#I/Q-Signale: Analog
Interface, Baseband

G G

PAOUT1

PA_LEVEL G

BB_I

I G

BB_IX

IX G

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3. TECHNICAL BRIEF

BB_Q

Q G

BB_QX

QX G

#Measurement

G G

M_0

BAT_ID

Battery temperature measure

M_1

RF_TEMP

RF block temperature measure

M_2

PCB_VER G

M_3

G

G

M_4

G

G

M_5

G

G

M_6

G

G

M_7

G

G

M_8

VBAT Battery supply voltage measure

M_9

G

G

M_10

G G

#Bandgap reference:
Analog Interface

G G

VREFP

VREFN G

IREF

pull-down G

#JTAG

G G

TDO

TDO

JTAG

TDI

TDI

JTAG

TMS

TMS

JTAG

TCK

TCK

JTAG

TRST_n

_TRST

JTAG

RTCK

RTCK

JTAG

#Debug

G G

TRIG_IN

TRIG_IN

ETM (Embedded Trace Macro Cell)

MON1

pull-up

ETM

MON2

pull-down

ETM

TRACESYNC

TRACESYNC

ETM

TRACECLK

TRACECLK

ETM

PIPESTAT[2]

PIPESTAT2

ETM

PIPESTAT[1]

PIPESTAT1

ETM

PIPESTAT[0]

PIPESTAT0

ETM

TRACEPKT[0]

TRACEPKT0

ETM

TRACEPKT[1]

TRACEPKT1

ETM

TRACEPKT[2]

TRACEPKT2

ETM

TRACEPKT[3]

TRACEPKT3

ETM

TRACEPKT[4]

TRACEPKT4

ETM

TRACEPKT[5]

TRACEPKT5

ETM

TRACEPKT[6]

TRACEPKT6

ETM

TRACEPKT[7]

TRACEPKT7

ETM

#External Bus Interface
(EBU)

G G

3. TECHNICAL BRIEF

MEM_WAIT_n

G G

MEM_ADV_n

DDR_BA1 G

MEM_RDN

_RD G

MEM_AD[0]

NAND_AD[0] G

MEM_AD[1]

NAND_AD[1] G

MEM_AD[2]

NAND_AD[2] G

MEM_AD[3]

NAND_AD[3] G

MEM_AD[4]

NAND_AD[4] G

MEM_AD[5]

NAND_AD[5] G

MEM_AD[6]

NAND_AD[6] G

MEM_AD[7]

NAND_AD[7] G

MEM_AD[8]

NAND_AD[8] G

MEM_AD[9]

NAND_AD[9] G

MEM_AD[10]

NAND_AD[10] G

MEM_AD[11]

NAND_AD[11] G

MEM_AD[12]

NAND_AD[12] G

MEM_AD[13]

NAND_AD[13] G

MEM_AD[14]

NAND_AD[14] G

MEM_AD[15]

NAND_AD[15] G

MEM_CS0_n

_NAND_CS G

MEM_CS1_n

_DDR_CS G

MEM_CS2_n

G G

MEM_CS3_n

G G

MEM_WRN

_WR G

MEM_A[16]

DDR_A[0]

G

MEM_A[17]

DDR_A[1]

G

MEM_A[18]

DDR_A[2]

G

MEM_A[19]

DDR_A[3]

G

MEM_A[20]

DDR_A[4]

G

MEM_A[21]

DDR_A[5]

G

MEM_A[22]

DDR_A[6]

G

MEM_A[23]

DDR_A[7]

G

MEM_A[24]

DDR_A[8]

G

MEM_A[25]

DDR_A[9]

G

MEM_A[26]

DDR_A[10]

G

MEM_CSA0_n

DDR_A[11]

G

MEM_CSA1_n

DDR_A[12]

G

MEM_CSA2_n

DDR_A[13]

G

MEM_CSA3_n

DDR_BA0 G

MEM_BFCLKO1

G G

MEM_BFCLKO2

DDR_CLK_N G

MEM_SDCLKO

DDR_CLK G

MEM_BC0_n

DDR_LDQM G

MEM_BC1_n

DDR_UDQM G

MEM_BC2_n

DDR_LDQS G

MEM_BC3_n

DDR_UDQS G

MEM_A[0]

DDR_DQ[0]

G

MEM_A[1]

DDR_DQ[1]

G

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3. TECHNICAL BRIEF

MEM_A[2]

DDR_DQ[2]

G

MEM_A[3]

DDR_DQ[3]

G

MEM_A[4]

DDR_DQ[4]

G

MEM_A[5]

DDR_DQ[5]

G

MEM_A[6]

DDR_DQ[6]

G

MEM_A[7]

DDR_DQ[7]

G

MEM_A[8]

DDR_DQ[8]

G

MEM_A[9]

DDR_DQ[9]

G

MEM_A[10]

DDR_DQ[10]

G

MEM_A[11]

DDR_DQ[11]

G

MEM_A[12]

DDR_DQ[12]

G

MEM_A[13]

DDR_DQ[13]

G

MEM_A[14]

DDR_DQ[14]

G

MEM_A[15]

DDR_DQ[15]

G

MEM_RAS_n

_DDR_RAS G

MEM_CAS_n

_DDR_CAS G

MEM_CKE

DDR_CKE G

#FCDP:
Flash Controller DMA
Port

G G

FCDP_RBn

FCDP G

#Flash Write
Protection

G G

FWP

_WP G

#GSM TDMA Timer:
GSM Control

G G

T_OUT0

TXON_PA For PAM

T_OUT1
T_OUT2

PA_BAND For PAM

T_OUT3
T_OUT4

BT_WAKEUP BT wakeup

T_OUT5

VIB_PWM Linear Motor pwm

T_OUT6

PA_MODE For PAM

T_OUT7

SLIDE_KEY_BL Slide pcb key backlight

T_OUT8

RPWRON Remote power on

T_OUT9

LCD_BACKLIGHT_EN LCD backlight control

T_OUT10

_MUIC_INT MUIC interrupt

T_IN0
T_IN1

_CHG_EN Charger enable

#SPCU

G G

SPCU_RQ_IN0

G G

SPCU_RQ_IN1

_BT_RESET BT reset

3. TECHNICAL BRIEF

SPCU_RC_OUT0

VCXO_EN G

SPCU_RQ_IN2

RESOURCE_CTRL G

#RF Control Unit

G G

RF_STR0

RF_EN

RF_STR1

G

RF_DATA

RF_DA

RF_CLK

RF_CLK G

#Other Functional
Pins: Clocks and
control

G G

AFC

G G

CLKOUT0

G G

F26M

26MHZ_MCLK 26MHz Clock

F32K

F32K G

OSC32K

OSC32K G

RESET_n

_RESET G

RSTOUT_n

G G

RTC_OUT

RTC_OUT G

#Extra I/Os & Interrupt
Inputs

G G

DSPIN0

CLK32K G

DSPOUT1

WDOG G

DSPIN1

G G

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3. TECHNICAL BRIEF

3.3 Power management IC

3.3.1 General Description

SM-POWER is a highly integrated Power and Battery Management IC for mobile handsets. It has been
specially designed for usage with S-Gold3. Although optimized for usage with the Infineon S-GOLD
baseband device it is suitable for the S-GOLDlite and the E-GOLD+ baseband devices as well. It also supports
the cellular RF devices like SMARTi-DC, SMARTi-DC+, SMARTi-SD and the Bluemoon Single, Infineon’s single
chip solution for Bluetooth. If used with S-GOLD3 it provides all power supply functions (except for the RF PA)
for a complete advanced GSM Edge smart phone minimizing external device count.

Block Description

• Highly efficient step-down converter for main digital baseband supply including Core, DSP and
memory interface (External Bus Unit).

• Support of S-GOLD standby power-down concept

• Low-drop-out (LDO) regulators for Flash and mobile RAM memory devices

• Voltage independent switching of two SIM cards

• LDO regulators for baseband I/O supply

• LDO regulator for analog mixed-signal section of S-GOLD

• Low-noise LDO regulators for RF devices

• Supply for Bluemoon Single, Infineon’s single chip solution for Bluetooth

• Audio amplifier 8 Ohms for handsfree operation and ringing

• Charge Control for charging Li-Ion/Polymer batteries under software control

• Pre-charge current generator with selectable current level

• RTC regulator with ultra-low quiescent current

• USB interface support for peripheral and mini-host mode

• Backlight LEDs driver with current selection and PWM dimming function

• Two single LED driver outputs for signaling

• Vibrator driver with adjustable voltage

• Fully controlable by software via I2C – Bus

• Temperature and battery voltage sensors

• Interrupt channels for peripherals

• System debug mode

• VQFN 48 package with heat sink and non-protruding leads

• Compatible with the Infineon E-GOLD+ V2 and V3

SM-POWER is a further step on the successful E-Power product line with enhanced and optimized
functionality.

SM-POWER features a baseband supply concept with a DC/DC step-down converter cascaded by two linear
regulators

–SM-POWER’s DC/DC converter makes up to 40 % reduction of battery current for smart phone functions

(e.g. organizer functions, games, MP3 decoding) possible.
– SDBB has high efficiency up to 95% and also a power save mode.
– Memory Interface is directly supported by the SDBB
– SDBB can also act as main supply voltage for E-GOLD+ or S-GOLDlite baseband devices.
– For S-GOLD two linear regulators for DSP and Core are cascaded after the SDBB.

3. TECHNICAL BRIEF

SM-POWER supports the standby power-down concept of S-GOLD by temporarily switching off the linear
regulator for the DSP during mobile standby whenever this subsystem is not used. In this phase the ARM
controller and most peripherals including parts of the on-chip SRAM are kept powered-up with power being
supplied by the other linear regulator.

SM-POWER includes a fully differential audio amplifier able to drive loads down to a nominal value of 8 Ohm
for usage in hands-free phones and for ringing

– 450 mW maximum output power

– adjustable gain

– mute switch SM-POWER also integrates a charging function for Li-Ion, Li-Polymer batteries

– click and pop -protection SM-POWER also integrates a charging function for Li-Ion, Li-Polymer batteries
– Precharge current source with two current levels
– Constant current / constant voltage charging with 3 different termination voltages
– Programable charge current limitation for use with different batteries
– Freely programable pulse charging to reduce the thermal power dissipation in the constant voltage charging
phase
– Top-off charge current sensing SM-POWER completes the USB interface of S-GOLD
– Regulated voltage for S-GOLD USB interface including reverse current and overvoltage protection
– Switch to supply USB pull-up resistor
– Mini-host pull down resistor functionality
– Charge pump with internal switching capacitor for USB host VBUS supply voltage SM-POWER fully supports LED
and Vibra Motor functionality
– no external components needed
– driver for backlight LEDs adjustable in steps up to 140mA and with soft turn on and off by PWM dimming
– two driver outputs for single LEDs for precharge indication and signaling with i.e. change of colour

–driver for Vibra Motor with adjustable voltages, soft startup / shutdown and current limitation
SM-POWER offers several control functions
– Power-on Reset Generator with logic state machine
– I2C bus interface

– I2C bus configurable mode control logic with ON (push-button or RTC), VCXOEN and LRF3EN (wake-up by
Bluetooth) inputs
– Programable interrupt channels to handle peripherals like SIM, MMC and USB
– Monitoring of charging functions
– Undervoltage Shut-Down
– Errorflags (volatile or non-volatile) from many power-supply functions and thermal sensor in order to debug
system
– Overtemperature Shut-Down
– Overtemperature Warning
– Support of S-GOLD standby power-down concept
– Support of S-GOLD Power-Down Pad Tristate Function

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3. TECHNICAL BRIEF

Table 6. LDO Output Table of SM-Power

LDO Net name Output Voltage Output Current Usage

SD1 1V35_VCORE 1.35V 600mA Core & for LDO
SD2 1V8_VSD 1.8V 300mA Memory
VAUX 2V9_VAUX 2.9V 100mA Linear motor driver
VIO 2V62_VIO 2.62V 100mA Peripherals
VSIM 2V9_VSIM 2.9V 70mA SIM card
VMME 2V9_VMME 2.9V 150mA u-SD
VUMTS 2V85_VCAMIO 2.85V 110mA Camera IO
VUSB 3V1_VUSB 3.1V 40mA VUSB
VLED - 2.9V 10mA Not used
VAUDIOa 2V5_VAUDA 2.5V 200mA Analog parts of S-Gold

VAUDIOb 2V5_VAUDB 2.5V 50mA

Analog parts of S-Gold
Headset MIC

VRF1 2V85_VRF 2.85V 150mA

2.85 V supply for SMARTi-PM
RF transceiver

VRF2 1V53_VRF 1.53V 100mA

1.5 V supply for SMARTi-PM

RF transceiver
VRF3 2V7_VBT 2.7V 150mA BT/FM Radio
VPLL 1V35_VPLL 1.35V 30mA S-GOLD3 PLL
VRTC 2V0_VRTC 2.11V 4mA Real Time Clock
VAFC 2V65_VTOUCH 2.65V 5mA Touch
VVIB 2V8_VCAM_A 2.8V 140mA Camera analog