LG GB210 Service Manual

Service Manual Model : GB210

Internal Use Only

Service Manual

GB210

Date: January, 2009 / Issue 1.0

Table Of Contents

1. INTRODUCTION ............................................... 5

1.1 Purpose ......................................................................5

1.2 Regulatory Information ................................................. 5

1.3 Abbreviations .............................................................. 7

2. PERFORMANCE ............................................... 9

2.1 H/W Features ..............................................................9

2.2 Technical Specifi cation (GB210)..................................11

3. TECHNICAL BRIEF ......................................... 15

3.1 SKY77518 TX–RX iPAC™ FEM for Dual-Band

GSM/GPRS (SKY77518, U500) ..................................15

3.2 Transceiver (AD6548, U501) ...................................... 17

3.3 26 MHz Clock (Crystal, X500) ..................................... 19

3.4 BT Module with integrated FM tuner(BC5-FM, U200) ... 20

3.5 Baseband Processor (AD6726, U103) ......................... 21

3.6 Display and Interface ................................................. 27

3.7 Camera Interface(AIT716 , U400) ...............................29

3.8 Keypad Switches and Scanning .................................. 32

3.9 Microphone ............................................................... 33

3.10 Main Speaker .......................................................... 34

3.11 Headset Interface .................................................... 35

3.12 Key Back-light Illumination .......................................36

3.13 LCD Back-light Illumination ...................................... 37

3.14 VIBRATOR ............................................................... 38

3.15 Battery Charging .....................................................39

4.15 Microphone Trouble .................................................78

4.16 RTC Trouble ............................................................ 80

4.17 Micro SD Trouble ..................................................... 82

5. Download ..................................................... 84

5.1 Download.................................................................. 84

6. BLOCK DIAGRAM .......................................... 90

7. CIRCUIT DIAGRAM ........................................ 91

8. BGA Pin Map ................................................ 97

9. PCB LAYOUT ............................................... 101

10. STAND ALONE TEST.................................. 103

10.1 Introduction ........................................................... 103

10.2 Setting Method ...................................................... 103

10.3 Means of Test ........................................................ 104

11. AUTO CALIBRATION .................................. 106

11.1 Overview ............................................................... 106

11.2 Equipment List ...................................................... 106

11.3 Test Jig Operation .................................................. 107

11.4 Procedure .............................................................108

11.5 AGC ...................................................................... 110

11.6 APC ...................................................................... 110

11.7 ADC ...................................................................... 110

4. TROUBLE SHOOTING ..................................... 40

4.1 RF Component .......................................................... 40

4.2 RX Trouble ................................................................41

4.3 TX Trouble .................................................................46

4.4 Bluetooth + FM Radio ................................................ 52

4.5 Power On Trouble ......................................................55

4.6 Charging Trouble ....................................................... 57

4.7 Vibrator Trouble .........................................................60

4.8 LCD Trouble .............................................................. 62

4.9 Camera Trouble ......................................................... 65

4.10 Speaker Trouble ......................................................68

4.11 SIM Card Interface Trouble .......................................70

4.12 Earphone Trouble ..................................................... 72

4.13 KEY backlight Trouble ..............................................74

4.14 Receiver Trouble ...................................................... 76

Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT

PART LIST ................................................. 111

12.1 EXPLODED VIEW ................................................... 111

12.2 Replacement Parts ................................................ 113

12.3 Accessory .............................................................129

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LGE Internal Use Only

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Only for training and service purposes

1. INTRODUCTION

1. INTRODUCTION

1.1 Purpose

This manual provides the information necessary to repair, calibration, description and download the features of
this model.

1.2 Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons
other than your company’s employees, agents, subcontractors, or person working on your company’s behalf)
can result in substantial additional charges for your telecommunications services. System users are responsible
for the security of own system. There are may be risks of toll fraud associated with your telecommunications
system. System users are responsible for programming and configuring the equipment to prevent unauthorized
use. The manufacturer does not warrant that this product is immune from the above case but will prevent
unauthorized use of common-carrier telecommunication service of facilities accessed through or connected to
it.

The manufacturer will not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly causing
harm or interruption in service to the telephone network, it should disconnect telephone service until repair can
be done. A telephone company may temporarily disconnect service as long as repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these changes
could reasonably be expected to affect the use of the this phone or compatibility with the network, the
telephone company is required to give advanced written notice to the user, allowing the user to take
appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on this model must be performed only by the manufacturer or its authorized agent.
The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note
that unauthorized alternations or repair may affect the regulatory status of the system and may void any
remaining warranty.

Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

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LGE Internal Use Only

1. INTRODUCTION

E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory
agencies. In accordance with these agencies, you may be required to provide information such as the following to
the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.

G. Interference and Attenuation

Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from unsuppressed
engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated

by the sign. Following information is ESD handling:

• Service personnel should ground themselves by using a wrist strap when exchange system

boards.

• When repairs are made to a system board, they should spread the floor with anti-static mat

which is also grounded.

• Use a suitable, grounded soldering iron.

• Keep sensitive parts in these protective packages until these are used.

• When returning system boards or parts like EEPROM to the factory, use the protective

package as described.

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Only for training and service purposes

1.3 Abbreviations

For the purposes of this manual, following abbreviations apply:

Automatic Power ControlAPC
BasebandBB
Bit Error RatioBER
Constant Current – Constant VoltageCC-CV
Digital to Analog ConverterDAC
Digital Communication SystemDCS
dB relative to 1 milli wattdBm

1. INTRODUCTION

Digital Signal ProcessingDSP
Electrical Erasable Programmable Read-Only MemoryEEPROM
Electrostatic DischargeESD
Flexible Printed Circuit BoardFPCB
Gaussian Minimum Shift KeyingGMSK
General Purpose Interface BusGPIB
Global System for Mobile CommunicationsGSM

International Portable User IdentityIPUI

Intermediate FrequencyIF

Liquid Crystal DisplayLCD

Low Drop OutputLDO

Light Emitting DiodeLED

Offset Phase Locked LoopOPLL

Copyright © 2009 LG Electronics. Inc. All right reserved.
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LGE Internal Use Only

1. INTRODUCTION

Power Amplifier ModulePAM

Printed Circuit BoardPCB

Programmable Gain AmplifierPGA

Phase Locked LoopPLL

Public Switched Telephone NetworkPSTN

Radio FrequencyRF

Receiving Loudness RatingRLR

Root Mean SquareRMS

Real Time ClockRTC

Surface Acoustic WaveSAW

Subscriber Identity ModuleSIM

Sending Loudness RatingSLR

Static Random Access MemorySRAM

Pseudo SRAMPSRAM
Side Tone Masking RatingSTMR

Travel AdapterTA

Time Division DuplexTDD

Time Division Multiple AccessTDMA

Universal Asynchronous Receiver/TransmitterUART

Voltage Controlled OscillatorVCO
Voltage Control Temperature Compensated Crystal OscillatorVCTCXO

WAP

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Wireless Application Protocol

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Only for training and service purposes

2. PERFORMANCE

2.1 H/W Features

Item Feature Comment

Standard Battery Li-ion, 3.7V 1100mAh

Talk time Up to 240min : GSM Tx Level 7

Stand by time Up to 350 hours (Paging Period: 5, RSSI: -85 dBm)

Charging time Approx. 3 hours

RX Sensitivity -102dBm

2. PERFORMANCE

TX output power

GPRS compatibility Class 10

SIM card type 3V

Display MAIN : TFT 128 × 160 pixel 262K Color

Status Indicator

ANT Internal

EAR Phone Jack Yes (Stereo)

PC Synchronization Yes

Speech coding

Data Yes

Vibrator Yes

GSM900 : 32.5dBm(Level 5),
DCS : 29.5dBm(Level 0)

Hard icons. Key Pad
0 ~ 9, #, *, Up/Down/Left/Right/Ok Navigation Key
Menu Key, Clear Key, Confirm Key, Send Key , PWR Key,

EFR/FR/HR

Loud Speaker Yes

Voice Recoding Yes

Microphone Yes

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2. PERFORMANCE

Item Feature Comment

Speaker/Receiver Receiver 11X 07, Speaker : 16*16

Travel Adapter Yes

MIDI 32poly SW MIDI

Camera 1.3M

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Only for training and service purposes

2.2 Technical Specifi cation (GB210)

▶ GSM850
TX: 824 + 0.2 x (n-127) MHz
RX: 869 + 0.2 x (n-127) MHz ( n = 128 ~ 251 )
▶ GSM900

(EGSM)
TX: 890 + (n-1024) × 0.2 MHz
RX: 935 + (n-1024) × 0.2 MHz (n=975~1024)

Frequency Band1

Phase Error2

Power Level4

(PGSM)

TX: 890 + (n-1024) × 0.2 MHz

RX: 935 + (n-1024) × 0.2 MHz (n=1~124)

▶ DCS1800

TX: 1710 + (n-512) × 0.2 MHz
RX: 1805 + (n-512) × 0.2 MHz (n=512~885)

▶ PCS1900

TX: 1810 + (n-512) × 0.2 MHz
RX: 1905 + (n-512) × 0.2 MHz (n=512~885)

RMS < 5 degrees
Peak < 20 degrees

< 0.1ppmFrequency Error3

GSM850/EGSM900

25 dBm9

DCS1800/PCS1900

2. PERFORMANCE

SpecificationDescriptionItem

Toler.PowerLevelToler.PowerLevel

±3dB17 dBm13±2dB33 dBm5
±3dB15 dBm14±3dB31 dBm6
±3dB13 dBm15±3dB29 dBm7
±5dB11 dBm16±3dB27 dBm8
±5dB9 dBm17±3dB
±5dB7 dBm18±3dB23 dBm10
±5dB5 dBm19±3dB21 dBm11

±3dB19 dBm12

Toler.PowerLevelToler.PowerLevel

±3dB14 dBm8±2dB30 dBm0
±4dB12 dBm9±3dB28 dBm1
±4dB10 dBm10±3dB26 dBm2
±4dB8 dBm11±3dB24 dBm3
±4dB6 dBm12±3dB22 dBm4
±4dB4 dBm13±3dB20 dBm5
±5dB2 dBm14±3dB18 dBm6
±5dB0 dBm15±3dB16 dBm7

EDGE

5

Not support

Max. Power

EDGE

6

Modulation Accuracy

Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

Not support

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LGE Internal Use Only

2. PERFORMANCE

Output RF Spectrum

7

(Due to Modulation)

Output RF Spectrum

8

(Due to Switching)

Spurious Emissions9

SpecificationDescriptionItem

GSM850/EGSM900

Max. [dBc]Offset from Carrier (kHz).

0.5100

-30200

-33250

-60400

-60600 ~ 1,200

-601,200 ~ 1,800

-631,800 ~ 3,000

-653,000 ~ 6,000

-716,000

DCS1800/PCS1900

Max. [dBc]Offset from Carrier (kHz).

0.5100

-30200

-33250

-60400

-60600 ~ 1,200

-601,200 ~ 1,800

-651,800 ~ 3,000

-653,000 ~ 6,000

-736,000

GSM850/EGSM900

Max. [dBm]Offset from Carrier (kHz)

-19400

-21600

-211,200

-241,800

DCS1800/PCS1900

Max. [dBm]Offset from Carrier (kHz)

-22400

-24600

-241,200

-271,800

Conduction, Emission Status

Radiation, Emission Status

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Only for training and service purposes

Bit Error Ratio10

Sending Response13

RLR(Normal volume)

14

Receiving
Response

15

(Type 3.2)

Power consumption20

2. PERFORMANCE

SpecificationDescriptionItem

GSM850/EGSM900
BER (Class II) < 2.439% @-102dBm
DCS1800/PCS1900
BER (Class II) < 2.439% @-102dBm
2 ± 3 dBRx Level Report accuracy11
8 ± 3 dBSLR12

Min.(dB)Max.(dB)Frequency (Hz)

--12100

-0200

-120300

-601,000

-642,000

-643,000

-943,400

-04,000

-4± 3 dB

Min.(dB)Max.(dB)Frequency (Hz)

/-6100
/2200

-92300

-721,000

-1223,400

-24,000
> 17 dBSTMR16
> 40 dBEcho Loss17
< -64 dBm0pIdle Noise Sending18
< -36 dBm0pIdle Noise Receiving19
Max. power
< 300mA @GSM850, PL=5
< 230mA @PCS, PL=0
Standby
< 5.5mA @PP2
< 3.3mA @PP5
< 2.7mA @PP9
Bluetooth

< 5.0mA @ Bluetooth on (Standby)
< 300mA @ Bluetooth connected (Call)

Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

FM radio

< 40mA @ FM Radio Operation (AVG)

Backup Battery (Without Main Battery)
Normal Power Off : < 5uA
Emergency Power Off : < 15uA

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LGE Internal Use Only

2. PERFORMANCE

Talk Time21

Standby Time22

Ringer Volume(TBD)23

Charge Current24

Antenna Display26

Battery Indicator27

SpecificationDescriptionItem

4 hr., Min.@GSM850/ESGSM900, PL=5

6 hr., Min.@GSM850/EGSM900, PL=12

4.5 hr., Min.@DCS/PCS, PL=0

7 hr., Min.@DCS/PCS, PL=10

400 hr., Min.@PP9

350 hr., Min.@PP5

- Full charge, no receive/send and keep GSM in idle mode.
Broadcast set off. Signal strength display set at 3 levelabove.
Backlight of phone set off.

At least 55 dB under below conditions:

1. Ringer set as ringer.

2. Test distance set as 1 m.

Fast Charge : < 550 mA

Slow Charge: < 110 mA

Under 3 hr.Charging Time25

PowerAntenna Bar Number

-92 dBm ~5

-100 dBm ~ –93 dBm4

skip3

-103 dBm ~ –101 dBm2

-105 dBm ~ –104 dBm1

~ –105 dBm0

VoltageBattery Bar Number

3.42V ± 0.05V1 → 0

3.55V ± 0.05 V2 → 1

3.7V ± 0.05 V3 → 2

4.2V3

Low Voltage Warning(TBD) 28

Battery Type30

Travel Charger31

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3.42 ± 0.05 V (Call)

3.42 ± 0.05 V (Standby)

3.33 ± 0.05VForced shut down Voltage29

Main Battery : Li-ion, 1100mAh, Inner Pack

Back-up Battery : Lithium, 1mAh

Input: 100 ~ 240 V, 50/60Hz

Output: 5.1V, 700mA

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Only for training and service purposes

3. TECHNICAL BRIEF

3. TECHNICAL BRIEF

3.1 SKY77518 TX–RX iPAC™ FEM for Dual-Band GSM/GPRS
(SKY77518, U500)

The SKY77518 is a transmit and receive front-end module (FEM) with Integrated PowerAmplifier Control
(iPAC™) for dual-band cellular handsets comprising GSM900 and DCS1800 operation. Designed in a low
profile, compact form factor, the SKY77518 offers a complete Transmit VCO-to-Antenna and Antenna-to­Receive SAW filter solution. The FEM also supports Class 12 General Packet Radio Service (GPRS) multi-slot
operation. The module consists of a GSM900 PA block and a DCS1800 PA block, impedance-matching
circuitry for 50 Ω input and output impedances, TX harmonics filtering, high linearity and low insertion loss
PHEMT RF switches, diplexer and a Power Amplifier Control (PAC) block with internal current sense resistor. A
custom BiCMOS integrated circuit provides the internal PAC function and decoder circuitry to control the RF
switches. The two Heterojunction Bipolar Transistor (HBT) PA blocks are fabricated onto a single Gallium
Arsenide (GaAs) die. One PA block supports the GSM900 band and the other PA block supports the DCS1800
band. Both PA blocks share common power supply pads to distribute current. The output of each PA block
and the outputs to the two receive pads are connected to the antenna pad through PHEMT RF switches and a
diplexer. The GaAs die, PHEMT die, Silicon (Si) die and passive components are mounted on a multi-layer
laminate substrate. The assembly is encapsulated with plastic overmold. Band selection and control of
transmit and receive modes are performed using two external control pads. Refer to the functional block
diagram in Figure 1 below. The band select pad (BS) selects between GSM and DCS modes of operation. The
transmit enable (TX_EN) pad controls receive or transmit mode of the respective RF switch (TX = logic 1).
Proper timing between transmit enable (TX_EN) and Analog Power Control (VRAMP) allows for high isolation
between the antenna and TX-VCO while the VCO is being tuned prior to the transmit burst. The SKY77518 is
compatible with logic levels from 1.2 V to VCC for BS and TX_EN pads, depending on the level applied to the
VLOGIC pad. This feature provides additional flexibility for the designer in the selection of FEM interface
control logic.

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LGE Internal Use Only

3. TECHNICAL BRIEF

Table 5 Pad description

Table 3 Mode Control logic

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Only for training and service purposes

3. TECHNICAL BRIEF

3.2 Transceiver (AD6548, U501)

The AD6548 provides a highly integrated direct conversion radio solution that combines, on a single chip,
all radio and power management functions necessary to build the most com-pact GSM radio solution
possible. The only external components required for a complete radio design are the Rx SAWs, PA,
Switchplexer and a few passives enabling an extremely small cost effective GSM Radio solution. The
AD6548 uses the industry proven direct conversion receiver architecture of the OthelloTM family. For Quad
band applications the front end features four fully integrated programmable gain differential LNAs. The RF
is then down converted by quad-rature mixers and then fed to the baseband programmable-gain
amplifiers and active filters for channel selection. The Receiver output pins can be directly connected to the
baseband analog processor. The Receive path features automatic calibration and tracking to remove DC
offsets. The transmitter features a translation-loop architecture for directly modulating baseband signals
onto the integrated TX VCO. The translation-loop modulator and TX VCO are extremely low noise removing
the need for external SAW filters prior to the PA. The AD6548 uses a single integrated LO VCO for both the
receive and the transmit circuits. The synthesizer lock times are optimized for GPRS applications up to and
including class 12.
AD6548 incorporates a complete reference crystal calibration system. This allows the external VCTCXO to
be replaced with a low cost crystal. No other external components are required. The AD6548 uses the
traditional VCTCXO reference source. The AD6548 also contains on-chip low dropout voltage regulators
(LDOs) to deliver regulated supply voltages to the functions on chip, with a battery input voltage of
between 2.9V and 5.5V. Comprehensive power down options are included to minimize power
consumption in normal use. A standard 3 wire serial interface is used to program the IC. The interface
features low-voltage digital interface buffers compatible with logic levels from 1.6V to 2.9V.

Antenna Switch Module

PA Module

GSM1800/1900

GSM850/900

TXOP_HI

TXOP_LO

VCC_FE

RX850

RX850B

RX900

RX900B

RX1800

RX1800B

RX1900

RX1900B

SDATA

SCLK

SEN

LNA Gain
Reduction

TX_LO2
TX_LO1

Generator

Generator

Serial

Interface

VCC_TXVCO

/2

RX LO

TX LO

Band

Control

TX Loop

Filter

TX_LO1

TX circuits

Reg 3

supply

LDO

PFD

DC Offset
Correction

DC Offset
Correction

Frac-N Synth

LO VCO

Supply

LDO

Reg 2

AD6548

General
Supply

LDO

Reg 1

/4

TX_LO2

Xtal Osc
+ Tuning

Supply

Ref

I

IB

VCC_BBI

VCC_BBQ

Q

QB

VAFC

REFINB

REFIN

REF_OP

VCC_REF

TXIB

TXI

RXI

RXIB

TXQ

TXQB

RXQ

RXQB

AFC

CLK

REF_OP

VDD

Figure 3.3 AD6548 Block Diagram

Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

VCC_

VBAT VLDO3 VLDO2 VLDO1

TXVCO

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3. TECHNICAL BRIEF

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3. TECHNICAL BRIEF

3.3 26 MHz Clock (Crystal, X500)

The 26 MHz clock (X401) consists of a XO (Crystal Oscillator) which oscillates at a frequency of 26 MHz. The
AD6548 requires only an external low cost crystal as the frequency reference. The circuitry to oscillate the
crystal and tune its frequency is fully integrated. The Oscillator is a balanced implementation requiring the
crystal to be connected across 2 pins. There is a programmable capacitor array included for coarse tuning of
fixed offsets (e.g. crystal manufacturing tolerance), and an integrated varactor for dynamic control. The
oscillator is designed for use with a 26MHz crystal. Dedicated control software ensures excellent frequency
stability under all circumstances.

X500

3

4

12

26MHz

DSX321G-26M

Figure 3.4 CRYSTAL CIRCUIT DIAGRAM

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LGE Internal Use Only

3. TECHNICAL BRIEF

3.4 BT Module with integrated FM tuner(BC5-FM, U200)

The BlueCore5-FM BGA is a single-chip radio and baseband IC for Bluetooth 2.4GHz systems
including enhanced data rates (EDR) to 3Mbits/s. It includes an integrated FM receiver with
stereo audio output stage and an RDS demodulator.
With the on-chip CSR Bluetooth software stack, it provides a fully compliant Bluetooth system
to v2.1 + EDR of the specification for data and voice communications.

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Only for training and service purposes

3.5 Baseband Processor (AD6726 , U103)

• AD6726 is an ADI designed processor

•AD6726 consists of

1. Control Processor Subsystem including:

32-bit MCU ARM7TDMI® Control Processor
78 MHz operation at 1.8V
2Mb of on-chip System SRAM Memory

2.DSP Subsystem including:

16-bit Fixed Point DSP Processor
91 MIPS[1] at 1.8V
Data and Program SRAM
Program Instruction Cache
Full Rate, Enhanced Full Rate and Half Rate
Speech Encoding/Decoding
Capable of Supporting AMR & PDC Speech Algorithms

3. TECHNICAL BRIEF

3.Peripheral Functions

Parallel and Serial Display Interface
USB 2.0 Full Speed device Interface
Keypad Interface
Support for Burst and Page Mode Flash

1.8V and 3.0V, 64 kbps SIM Interface
Universal System Connector Interface
Data Services Interface
SD/Multimedia Card Interface

4. Other

Supports 13 MHz and 26 MHz Input Clocks

1.8V Typical Core Operating Voltages
361-Ball Package (13x13mm) , 0.65mm Ball pitch

5. The AD6726 baseband transmit section supports the following
mobile station GMSK modulation power classes:

GSM 900/850 power classes 4 and 5,

DCS 1800 power classes 1 and 2, and
PCS 1900 power classes 1 and 2

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3. TECHNICAL BRIEF

Figure 3.5 SYSTEM INTERCONECTION OF AD6726 EXTERNAL INTERFACE

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Only for training and service purposes

3.5.1 Interconnection with external devices

A. RTC block interface

Countered by external X-TAL

32.768kHz oscillator supplies on-chip Real Time Clock circuitry

B. LCD module interface

The LCD module is controlled via mobile media processor AIT716
If AIT716 is in the state of by-pass mode, the LCD control signals from AD6726
are by-passed through AIT716.
In operating mode, the AIT716 controls the LCD module through nLCD_CS, nLCD_RS,
nLCD_WR, L_DATA08~L_DATA15.

Signals Description

3. TECHNICAL BRIEF

nLCD_CS

LCD_ID

LCD_RESET

nLCD_WR

nLCD_RS

2V8_MM

MAIN LCD driver chip enable. MAIN LCD driver IC has own CS pin

Identify LCD module maker

This pin resets LCD module. This signal comes from AD6726 directly.

Enable writing to LCD Driver.

This pin determines whether the data to LCD module are LCD command
or data.

2.8V is supplied to LCD driver IC.

Table 3.5.B LCD CONTRON SIGNALS DISCRIPTION

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LGE Internal Use Only

3. TECHNICAL BRIEF

The backlight of LCD module is controlled by AD6726 via AAT2845.
The control signals related to Backlight LED are given as follows.

Signals Description

MLED

LCD_DIM_CTRL

MLED[1:2]

Table 3.5.B2 DESCRIPTION OF LCD BACKLIGHT LED CONTROL

C. RF interface

The AD6726 control RF parts through PA_BAND, ANT_SW, CLKON , PA_EN, S_EN, S_DATA, S_CLK

Current source for backlight LED

Control LCD backlight level in 16 steps

This pins are returned-paths for backlight LED current
source (MLED)

DescriptionSignal

PA_BAND (GPIO 0)

PAM Band Select

Antenna switch Band SelectANT_SW (GPO 9)

PA_EN (GPO 16)

Table 3.5.C RF CONTROL SIGNALS DESCRIPTION

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PAM Enable/Disable

PLL Enable/DisableS_EN (GPO 19)

Serial Data to PLLS_DATA (GPO 20)

Clock to PLLS_CLK (GPO 21)

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Only for training and service purposes

3. TECHNICAL BRIEF

K

D. SIM interface

The AD6726 provides SIM Interface Module. The AD6726 checks status periodically during
established call mode whether SIM card is inserted or not, but it doesn't check during deep
Sleep mode. In order to communicate with SIM card, 3 signals SIM_DATA, SIM_CLK,
SIM_RST(GPIO_23) are required. The descriptions about the signals are given by bellow Table 3-5 in detail.

Signals Description

SIM_DATA

SIM_CLK

SIM_RST

(GPIO_23)

This pin receives and sends data to SIM card.
This model can support 3.0 volt and 1.8 volt interface SIM card.

Clock 3.25MHz frequency.

Reset SIM block

Table 3.5.D SIM CONTROL SIGNALS DESCRIPTION

SIM_CONNECTOR

2V85_VSIM

R303

15K

SIM_DATA

C306

DNI

2V85_VSIM

J300

4

C5

5

C6

6

C7

10

GND4

9

C1
C2

C3
GND1
GND2GND3

1
2
3
7
8

C304

C307

220n

DNI

SIM_RST
SIM_CL

C308

1000p

Figure 3.5.D2 SIM Interface of AD6726

Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 25 -

LGE Internal Use Only

3. TECHNICAL BRIEF

E. LDO Block

There are 9 LDOs in the AD6726.

- 1V8_VCORE : supplies Digital baseband Processor core and AD6726 digital core(1.8V, 80mA)

- 2V8_VMEM : supplies external memory and the interface to the external memory on the digital
baseband processor (2.8V, 150mA)

- 2V8_VEXT : supplies Radio digital interface and high voltage interface (2.8V, 200mA)

- 2V85_VSIM : supplies the SIM interface circuitry on the digital processor and SIM card

(2.85V,1.8V, 20mA)

- 1V8_VRTC : supplies the Real-Time Clock module (1.8 V, 20 μA)

- 2V5_VMIC : supplies the microphone interface circuitry (2.5 V, 2 mA)

- 2V75_VVCXO: supplies the voltage controlled crystal oscillator ( 2.75 V, 10 mA)

- VUSB : supplies USB interface circuitry( 3.2V, 20mA)

- 1V8_VGP : supplies VDD_IO1 & VDD_IO4 of MMP(1.8V, 40mA)

LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.

- 26 -

Only for training and service purposes

3. TECHNICAL BRIEF

3.6 Display and Interface

UnitSpec.Properties

mm28.032mm(W) x 35.04mm(H)Active Screen Size

colors262K TFTColor Depth

Pixels128 X 160Resolution

Controlled by nLCD_CS, LCD_RESET, nLCD_RS, nLCD_WR, L_DATA08~L_DATA15

• nLCD_CS : MAIN LCD driver chip enable. MAIN LCD driver IC has own CS pin

• LCD_RESET : This pin resets LCD module. This signal comes from AD6726 directly.

• nLCD_RS: This pin determines whether the data to LCD module are display data or control data.

• nLCD_WR : Write control Signal

• L_DATA08~L_DATA15 : Parallel data lines.

•LCD_ID : reserved

1

nLCD_RS

nLCD_WR nLCD_WR_OUT

VSYNCOUT VSYNCOUT_

nLCD_CS nLCD_CS_OUT

INOUT_A1

2

INOUT_A2

3

INOUT_A3

4

INOUT_A4

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

G110G2

5

9

8

7

6

nLCD_RS_OUT

FL301 ICVE10184E150R101FR

ICVE10184E150R101FRFL300

L_DATA15
L_DATA14
L_DATA13
L_DATA12

1

INOUT_A1

2

INOUT_A2

3

INOUT_A3

4

INOUT_A4

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

G15G2

10

9

8

7

6

DATAOUT15
DATAOUT14
DATAOUT13
DATAOUT12

ICVE10184E150R101FRFL302

L_DATA10
L_DATA09
L_DATA08

1

INOUT_A1

2

INOUT_A2

3

INOUT_A3

4

INOUT_A4

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

G110G2

5

9

8

7

6

DATAOUT11L_DATA11
DATAOUT10
DATAOUT09
DATAOUT08

Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 27 -

LGE Internal Use Only

3. TECHNICAL BRIEF

MLED
MLED1
MLED2

VSYNCOUT_

nLCD_RD_OUT

nLCD_WR_OUT

nLCD_RS_OUT

LCD_RESET_OUT

nLCD_CS_OUT

DATAOUT15
DATAOUT14
DATAOUT13
DATAOUT12
DATAOUT11
DATAOUT10
DATAOUT09
DATAOUT08

LCD_ID

IM2

IM1

R331

20K

2V8_MM

CN305

35

34

33

32

31

30

29

28

27

26

25

24

23

22

21

20

19

18

17

16

15

14

13

12

11

10

9

8

7

6

5

4

3

2

1

C349

1u

Figure 3.6 LCD INTERFACE CIRCUIT

LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.

- 28 -

Only for training and service purposes

3.7 Camera Interface(AIT716 , U400)

This model has a built-in 1.3M SXGA (1280 x 1024) camera module. And the camera produces
JPG pictures. Camera module is controlled by AIT716. Interface is done by I2C and
YCbCr format. I2C is a control signal and YCbCr is real data interface signal.

3. TECHNICAL BRIEF

Figure 3.7.1 AIT716 BLOCK DIAGRAM

Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 29 -

LGE Internal Use Only

3. TECHNICAL BRIEF

Figure 3.7.2 SENSOR CHIP BLOCK DIAGRAM

LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.

- 30 -

Only for training and service purposes

2V8_MM

3. TECHNICAL BRIEF

_MAIN_CS

_MULTI_RST

MULTIMEDIA IC

C407
33p

ADD01

_RD

_WR

DATA00
DATA01
DATA02
DATA03
DATA04
DATA05
DATA06
DATA07

R406 0

2V8_MM

R402
100K

LCD_BYPASS

_MULTI_INT

13M_AIT

26MHz_BT

nCAM_RST

DATA400

BYPASS
ADD400

MULT_INT

_WAIT

DNIR407

C1
C2
B3
B1
B5
D1
D2
C3
D3
D4
E1
E2
E3
F1
F2
F3
B6
G1

A6

F9

F10

F8

E10

G8

PHCS_
PHRD_
PHWE_
PRST_
PHD0
PHD1
PHD2
PHD3
PHD4
PHD5
PHD6
PHD7
PHD8
PHLCD_BY
PHLCD_A0
PHLCD2_CS_
PHINT
PHWAIT_

PMCLK

PI2S_SCK
PI2S_WS
PI2S_SDO
PI2S_MCLK
NC1

1V8_VGP

1V2_VMM

C400

1u

E5

G6

VDD_CORE0

VDD_CORE1E6VDD_CORE2

Ball Name is changed(E6,F4)

PVSYNC

PHSYNC

G2

G3

F4

VDD_CORE3

PD2

PD3

H1

G4

C401

PD4C5PD5

H2

1u

E4

F5

VDD_IO0

H3

3V3_VUSB

VDD_IO1J8VDD_IO2

PD6

G5

D7

VDD_IO3A1VDD_IO4E7VDD_IO5

PD9

PD7

PD8

J1

J3

H4

C402

C403

1u

39p

D5

F6

H5

GND_IO1

GND_IO2B2GND_IO3F7GND_IO4D6GND_IO5

GND_IO0

EUSY0344901

U400

AIT716

PSCK

PSDAJ2PSEN

PDCLK

PPXL_CLK

J4

K2

K1

C404

1u

PLCD0K3PLCD1

PLCD2

J9

H6

G7

AVD D

PLCD3

J10

1V2_VMM

H7

AVS S

PLCD4J6PLCD5

K4

C405

1u

B4

A5

VSS_PLL

VDD_PLL

PLCD6

PLCD7

J5

K6

PLCD8

K5

C4

K7

1

R400

C6

A8

VDD_CLK

GND_CLK

PLCD_A0K8PLCD_RD_

PLCD_WE_

J7

K10

C406

1u

A4

PTEST_EN

PSCAN_EN

PGPIO0
PGPIO1
PGPIO2
PGPIO3
PGPIO4
PGPIO5
PGPIO6
PGPIO7
PGPIO8

PGPIO9
PGPIO10
PGPIO11
PGPIO12
PGPIO13
PGPIO14
PGPIO15

PVIN_P

PVIN_N

PVREF_P
PVREF_N

NC2

PUSBDN

PUSBDP

PLCD1_CS_

PLCD2_CS_

K9

E9
E8
D10
D9
D8
C8
C9
C10
C7
B8

R403 DNI

B9
B10
B7
A10
A7
A9

G10
H10

Single-end strero MIC Input(AIT)

H8
H9
G9

A3
A2

DNIR404

C415 0.1uF

0.1uFC416

R405 12K

TF_CLK
TF_CMD
TF_DATA0
TF_DATA1
TF_DATA2
TF_DATA3
TF_DET
TF_EN
VSYNCOUT

AIT_UART_RX
AIT_UART_TX

FM_L
FM_R

MM_MICP

MM_L
MM_R

MM_USBDM
MM_USBDP

C417

10u

1V8_CAMIO

C_VS_OUT

C_HS_OUT

C_CD00_OUT

Figure 3.7.3 AIT716 CIRCUIT

Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

C_CD01_OUT

C_CD02_OUT

C_CD03_OUT

C_CD04_OUT

R417 4.7K

C_CD05_OUT

C_CD06_OUT

C_CD07_OUT

CAM_PWR_EN

4.7KR416

- 31 -

C_SDA

C_MCLK

C_SCK

L_DATA08

L_DATA09

C_PCLK_OUT

nLCD_RS

nLCD_CS

L_DATA10

L_DATA11

nLCD_WR

L_DATA12

L_DATA13

L_DATA14

L_DATA15

LGE Internal Use Only