LG GB130kf750 Service Manual

1

GB130

GB130 GB130

GB130

Service Manual

Service ManualService Manual

Service Manual

LG Electronics

2

Table Of Contents

1. INTRODUCTION……………….…..3

1.1 Purpose……………………………..…….3

1.2 Regulatory Information……………..……3

2. PERFORMANCE………………..….5

2.1 H/W Features………………………..……5

2.2 S/W Features………………………….….6

3. TECHNICAL BRIEF…………..….12

3.1 Digital Main Processor(

PMB7890

)….……..12

3.2 Memory chip (

S71GL064NA0BFW0Z0

)….……19

3.3 Power Amplifier Module (

SKY77518

) ……20

3.4 RF SAW (B9308)……….………………21

3.5 Audio Amplifier (TPA6202A1)……..….22

3.6 Charger IC (MP26021)……………...….23

3.7 FM Radio (Si4708)………………..…....25

3.8 LCD Interface…………………………..27

3.9 SIM Card Interface……………..….…...30

3.10 KEYPAD Interface…………….…..….31

3.11 Key LED Interface………….…..…….32

3.12 Vibrator Interface…………….…….…33

4. TROUBLE SHOOTING…….……34

4.1 Power On Trouble……………………...34

4.2 SIM Card Trouble…………………..….37

4.3 Vibrator Trouble…………………….….39

4.4 Keypad Trouble………………………...41

4.5 RTC Trouble……………………………45

4.6 Key Backlight Trouble…………………47

4.7 LCM Backlight Trouble………….…….51

4.8 LCM Trouble…………………………...53

4.9 Microphone Trouble……………………55

4.10 Receiver Trouble……………………....57

4.11 Speaker Trouble……………………….60

4.12 Headphone Trouble……………………63

4.13 Charging Trouble……………………....67

4.14 FM Radio Trouble……………………..69

4.15 RF Trouble……………………………..73

5. DOWNLOAD………………………90

5.1 Download setup………………………....90

5.2 Download Process………………………91

6. BLOCK DIAGRAM……………...102

7. CIRCUIT DIAGRMA…………….103

8. BGA IN PIN Check……………….112

9. PCB LAYOUT…………………….114

10.ENGINEERING MODE…………116

11.CALIBRATION…………………..118

11.1 Test equipment setup………….…..….118

11.2 APT Technologies………………..…...118

12. Stand alone test………………..…133

12.1 Test Program Setting……………….....133

12.2 TX Test …………………………..…..135

12.3 RX Test…………………………….....136

13. EXPLODED VIEW&
REPLACEMENT PART LIST…..…137

13.1 Exploded View…………………….….137

13.2 Replacement Part…………………..…139

3

1. INTRODUCTION

1.1 Purpose

This manual provides information necessary to repair, description and download the features of this

model.

1.2 Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part(for example ,

persons other than your company’s employees, agents, subcontractors, or person working on your

company’s behalf) can result in substantial additional charges for your telecommunications services.

system users are responsible for the security of own system. There are may be risks of toll fraud

associated with your telecommunications system. System users are responsible for programming and

configuring the equipment to prevent unauthorized use .The manufacturer dose not warrant that this

product is immune from the above case but will prevent unauthorized use of common-carrier

telecommunications service of facilities accessed through or connected to it.

The manufacturer will not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly

causing harm or interruption in service to the telephone network, it should disconnect telephone

service until repair can be done. A telephone company may temporarily disconnect service as long as

repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these

changes could reasonably be expected to affect the use of the this phone or compatibility with the

network, the telephone company is required to give advanced written notice to the user, allowing the

user to take appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on this model must be performed only by the manufacturer or its authorized

agent . The user may not make any changes and/or repairs expect as specifically noted in this manual.

Therefore, note that authorized alternations or repair may affect the regulatory status of the system and

may void any remaining warranty.

4

E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local

regulatory agencies. In accordance with these agencies, you may be required to provide information

such as the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly

different.

G. Interference and Attenuation

Phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from

unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Devices(ESD),are indicated by the sign .

Following information is ESD handing:

. Service personnel should ground themselves by using a wrist strap when exchange system boards.

. When repairs are made to a system board , they should spread the floor with anti-static mat which is

also grounded .

. Use a suitable, grounded soldering iron .

. Keep sensitive parts in these protective packages until these are used.

. When returning system boards or parts like EEPROM to the factory, use the protective packages as

described.

5

2. PERFORMANCE

2.1 H/W Features

Solution

EGOLD Voice v2 (ULC2+) Infineon

Type Slide type

Antenna Type Internal (dual-Band)

Main Display 2.0” 128x160 TFT/65k

Frequency

900 MHz/class 4 (2W)

1800 MHz/class 1 (1W)

Dual Band (900/1800)

Dual Band (900/1800)

Physical

The physical dimension is [Length x

Width x Thickness mm]

The overall volume is [# cc]

The weight is [# g]

Target:103x47x15.5mm

TBD

TBD

Vibrator Shall support in built vibration alert

Battery 950mAh Li-ion inner pack 950mAh: 55x34x50mm

FM Receiver Yes(Option)

(87.5~108MHz)

Loud Speaker Yes

Memory Size TBD

Will be fixed at Pre kick

off

Standby Time

Shall support minimum test hours as

[hrs] based on battery capacity of

[mAh]

(Reference measurement conditions

refer to TW-09)

 440 hrs &  2.1mA @

950mAh (P.P.:5)

Talk Time

Shall support minimum test minutes

as [min] based on battery capacity of

[mAh]

(Reference measurement conditions

refer to TW-09)

6hrs30min@950mAh

(PCL: 10)

(Talk time = 95%

Capacity / Talk current)

RTC

The real time clock shall be able to

sustain for at least [#hrs] after

removing the battery. TBD

LMT (Lost Mobile Tracker) TBD

LMT for: AMA

M-DOG: China

6

2.2 S/W Features

Feature Detail Item Description

OS OSE Operating System Y

Speech Code FR,EFR,HR,AMR-NB Y

AMR code GSM Full Rate

3GPP Adaptive Multi Rate

(AMR-NB)

Y

FM Radio Y

MP3 Ring Tone MP3 decode Y

Integrated hands free

speaker

Speaker phone mode Y

Key Tone

Volume

6 Level (Include Mute) Y

Ring Tone

Volume

6 Level (Include Mute) Y

Ring Tone MP3 ring tone/10 Midi Y

Call Alert type Ring, Vibrate, Ring & Vibrate, Ring after

vibrate, Silent

Y

Earpiece

Volume

6 Level (Include Mute) Y

Audio

Mute Y

GSM dual band

MS 900-1800

Configuration is during software compile

time.

Y Frequency

Bands

PCS dual band

MS 850-1900

N/A N

Infrared (IrDA) N

Bluetooth N

USB N

USB Mass

storage

N

Connectivity

RS232(UART) Only for Phone tool & download &

PC Sync

Y

RSSI 6 level (0~5 level) Y

Battery level 4 level (0~3 level) Y

RTC Date & Time Display Y

Display

PLMN/Service

Indicator

Y

7

Quick Access

Mode In Idle

Profile/ SMS + Voice Mail Y

Dimming Clock N

Dual Clock N

Home shortcut Display Shortcut icon in Idle Y

Last Dial

Number

Max : 20 records Y

Last Received

Number

Max : 20 records Y

Last Missed

Number

Max : 20 records Y

Scratch Pad

Memory

N

Call History

Call Duration Last Call time, Total Call Time Y

Call Waiting Y

Call Swap Y

Call Retrieve Y

Auto Answer Not supported in Headset Mode Y

Auto Redial Y

Calling Line Y

Full Call Divert Y

Speed Dialing Y

Last Number

Redial

Y

Multi Party Call Y

Call

Management

ECT Explicit Call Transfer (4 + Send) N

Automatic Network

Selection

Y

Manual

Network

Y

Preferred

Network

Y

Network

Network

Service Status

Y

DTMF

Signaling

Y DTMF

DTMF Enable

& Disable

Y

8

Read Cell

Broadcast

Y

On/Off setting Receive On/Off Y

Alert setting Y

Language

setting

Y

Cell Broadcast

Topics Setting Y

Entry 500 Y

Field Name, Mobile, Home, Office Y

Copy ME <-> SIM Y

Move ME <-> SIM Y

FDN Y

SDN Y

Email Entry N

Picture ID N

Video Caller ID N

vCard N

Business Card TB

D

Contacts(Pho

ne Book)

Delete Delete, Delete All(SIM or Phone),

Multi Delete

Y

CFU Call Forwarding Unconditional Y

CFB Call Forwarding on Mobile

Subscriber Busy

Y

CFNRy Call Forwarding on No Reply Y

CFNRc Call Forwarding on Mobile

Subscriber Not Reachable

Y

BAOC Barring of All Outgoing Calls Y

BOIC Barring of Outgoing International

Calls

Y

BOICexHC Barring of Outgoing International

Calls except those directed to the

Home PLMN Country

Y

BAIC Barring of All Incoming Calls Y

Supplementary

Services

BICRoam Barring of Incoming Calls when

Roaming Outside the/Home PLMN

Country

Y

9

Conference

Call

Up to 5 Y

Plug in Type 3V & 1.8 V Y

SIM Lock Service Provider / Network Lock Y

SIM

SIM Toolkit Class 3 Y

Read Message Y

Write and Edit

Message

Y

Send and Receive

Message

Y

Reply to

Message

Y

Forward

Message

Y

Extract Number from

Message

Y

Message

Status

Y

Message

Unread

Y

Settable Message

Center Number,

Reply Path and

Validity

Y

Visible and Audible

Message

Receive

Y

(No for

Audible)

Voice Mail Y

Settable Voice Mail

Center Number

Y

Message

Protocol

Normal, Fax, National Paging, X400,

ERMES, Voice

Y

Message Overflow

Indicator

Y

Message

Center Number

Y

Short

Message

Nokia Smart

Message

N

10

Development & Test

Facility

Y

Field Test

Facility

Y

Display

Software

Version

Y

IMEI Y

Restore

Factory Setting

Y

Miscellaneous

Function

Battery

Charging Mode

Y

Language Selectable Auto Language

TBD

Text Input

Predictive word

input

T9 Y

Calendar MAX: 20 records (18 chars) Y

To Do N

Scheduler

Memo MAX: 10 records (80 chars) Y

Setting Local

Time

Y

Display Two Number

of

Cities Time

Dual Clock N

Daylight saving N

World Time

NITZ Y

Unit converter Length, Weight, Volume, Surface,

Velocity, Temperature,

User-defined

Y

Stop Watch Y

Calculator + - * / Y

Phone Book

Sync

Only For service Center

TBD

PC Sync

Message Sync

TBD

Game 1 game ( SUDOKU? TBD ) Y

Emergency Call Y

Handset Lock Y

Security Code When Delete All Y

Security

SIM Lock Y

11

Keypad Lock Y

12/24 Hour Y

Calendar Y

Time Zone Y

Daylight saving

Y

Alarm Manager Y

Dimming Clock N

Power-off

Alarm

Y

Real Time

Clock

On Alarm Event Y

Mobile Tracking

software

For India, Asia

TBD

Others

M-DOG For China

TBD

Accessory microSD

Adapter

N

Mono earmic

(without hook

switch)

Y

12

3. TECHNICAL BRIEF

3.1 Digital Main Processor

Figure.3-1 PMB7890 FUNCTIONAL BLOCK DIAGRAM

13

3.1.1 Overview of X-GOLDTM102

The X-GOLDTM102 is a GSM baseband modem including RF transceiver covering the low

bands GSM850 / GSM900 and high bands GSM1800 / GSM1900 bands. X-GOLDTM102 is Dual

Band, therefore, it supports by default a low / high pair of bands at the same time:

1. GSM850 / GSM1800

2. GSM850 / GSM1900

3. GSM900 / GSM1800

4. GSM900 / GSM1900.

The X-GOLDTM102 is optimized for voice-centric Mobile Phone applications.

The X-GOLDTM102 is designed as a single chip solution that integrates the digital, mixed-signal,

RF functionality and a direct-to-battery Power Management Unit.

The transceiver consists of:

• Constant gain direct conversion receiver with an analog I/Q baseband interface

• Fully integrated Sigma/Delta-synthesizer capability

• Fully integrated two-band RF oscillator

• Two-band digital GMSK modulator with digital TX interface

• Digitally controlled crystal oscillator generating system clocks.

The X-GOLDTM102 supports a direct to battery connection, hence eliminating the need for an

external Power Management Unit. The X-GOLDTM102 has different power down modes and an

integrated power up sequencer.

The X-GOLDTM102 is powered by the C166®S-V2 MCU and TEAKLite® DSP cores. The

operating temperature range from -30°C to 85°C. It is manufactured using the 0.13 μm CMOS
process.

3.1.2 Features

Baseband

• High performance fixed-point TEAKlite DSP

• C166S-V2 high performance microcontroller with a 16KB Instruction Cache and a Data cache

Buffer.

• There are several Interfaces:

– I2S interface for DAI connections (for Tape Approval) and external Audio component connection.

– High Speed SSC Interface for connection of companion chips (like Serial SD Cards)

– High Speed SSC Interface dedicated to Display control

– USIM Interface with support of Protocol T=1

– Keypad Interface (6x4 or 5x5 keys)

– EBU for external RAM/NOR FLASH/Busrt Flash/NAND Flash/Parallel Display connection

– Asynchronous serial interface.

– Asynchronous serial interface for WLAN/BT/GPS control (incl. IrDA support capability) .

– JTAG Interface, OCDS, Multi-Core Debug and Real Time Trace facilities.

– Black & white and color displays are supported

14

– PWM source to drive vibrator
– Keypad and display backlight supported.

– HASH Unit support for hashing.

Receiver

• Constant gain, direct conversion receiver with fully integrated blocking filter

• Two integrated LNAs

• No need of interstage and IF filter

• Highly linear RF quadrature demodulator

• Programmable DC output level

• Very low power budget.

• GPRS (up to Class 10 type1)

Transmitter

• Digital Sigma-Delta modulator for GMSK modulation, typical -163.5 dBc/Hz @ 20 MHz

• Single ended outputs to PA, Pout = +3.5 dBm

• Very low power budget.

RF-Synthesizer

• ΣΔSynthesizer for multi-slot operation

• Fast lock-in times (< 150 μs)

• Integrated loop filter

• RF Oscillator

• Fully integrated RF VCO.

Crystal Oscillator

• Fully digital controlled crystal oscillator core with a highly linear tuning characteristic.

Mixed Signal and Power Management Unit

• DC/DC boost for voltages up to 15 V for driving White or Blue LEDs

• 8-Ohm loud speaker driver (250/350 mW)

• 16-Ohm earpiece driver

• 32-Ohm headset driver

• Measurement interfaces (PA temperature, battery voltage, battery temperature, and ambient

temperature)

• Accessory Detection

• PCB ID detection

• Differential microphone input

• System start up circuitry

• Charger circuitry for NiCd, NiMh and LiIon cells with integrated Control Current/Voltage Charging.

• Integrated regulators for direct connection to battery.

Package

X-GOLDTM102 utilizes an PG-VF2BGA-189-1 lead-free (green) package. The high degree of

integration in X-GOLDTM102 in conjunction with a sophisticated designed ball-out allows building

a complete mobile phone with all its peripherals on a 4-layer PCB.

15

3.1.3 System Platform Application

X-GOLDTM102 was developed for very low cost Dual Band GSM/GPRS system solutions.

Here are some potential System Platform configurations that can be built with X-GOLDTM102

Solution:

3.1.4 GSM System Description

The X-GOLDTM102 is suited for mobile stations operating in the GSM850/900/1800/1900 bands.

In the receiver path the antenna input signal is converted to the baseband, filtered, and then

amplified to target level by the RF transceiver chip set. Two A-to-D converters generate two 6.5

Mbit/s data streams. The decimation and narrowband channel filtering is done by a digital

baseband filter in each path. The DSP performs:

1. The GMSK equalization of the received baseband signal (SAIC support available)

2. Viterbi channel decoding supported by an hardware accelerator.

The recovered digital speech data is fed into the speech decoder. The X-GOLDTM102 supports

fullrate, halfrate, enhanced fullrate and adaptive multirate speech CODEC algorithms.

The generated voice signal passes through a digital voiceband filter. The resulting 4 Mbit/s data

stream is D-to-A converted by a multi-bit-oversampling converter, postfiltered, and then amplified

by a programmable gain stage.

The output buffer can drive a handset ear-piece or an external audio amplifier, an additional output

driver for external loud speaker is implemented.

In the transmit direction the differential microphone signal is fed into a programmable gain amplifier.

The prefiltered and A-to-D converted voice signal forms a 2 Mbit/s data stream. The oversampled

voice signal passes a digital decimation filter.

The X-GOLDTM102 performs speech and channel encoding (including voice activity detection

(VAD) and discontinuous transmission (DTX)) and digital GMSK modulation.

In the RF transceiver part, the baseband signal modulates the RF carrier at the desired frequency

in the 850 MHz, 900 MHz, 1.8 GHz, and 1.9 GHz bands using an I/Q modulator. The

X-GOLDTM102 supports dual band applications.

Finally, an RF power module amplifies the RF transmit signal at the required power level. Using

software, the X-GOLDTM102 controls the gain of the power amplifier by predefined ramping curves

(16 words, 11 bits).

16

For baseband operation, the X-GOLDTM102 supports:

• High Speed Circuit Switched Data (HSCSD) class 4

• Packet-oriented data (GPRS) class 4 with a coding scheme from 1 to 4. It provides fixed, dynamic,

and extended dynamic modes.

If the X-GOLDTM102 is only used as a modem, then it supports:

• High Speed Circuit Switched Data (HSCSD) class 10

• Packet-oriented data (GPRS) class 10 with coding schemes from 1 to 4. It provides fixed,

dynamic, and extended dynamic modes.

The X-GOLDTM102 can support Class B operation. The mobile phone can be attached to both

GPRS and GSM services (one service at a time). During a GPRS connection Class B enables

either:

• Making or receiving a voice call

• Sending or receiving an SMS.

During voice calls or SMS, GPRS services are suspended and then resumed automatically after

the call or SMS session has ended.

3.1.5 Bus Concept

The X-GOLDTM102 has two cores (a microcontroller and a DSP), each with its own bus.

There is an Shared memory interconnection between the TEAKlite bus and the C166S-V2 X-Bus.

C166S-V2 Buses

The C166S-V2 is connected to four buses:

1. IMB (Internal Program) bus

2. DPMI (Data-Program) Bus

3. X-Bus

4. PD-Bus.

TEAKLite Bus

The TEAKlite is connected to the TEAKlite bus.

Bus Interconnections

The interconnection between the X-Bus and the TEAKlite Bus uses:

• Multicore Synchronization

• Shared Memory.

3.1.6 Clock Concept

The X-GOLDTM102 has a flexible clock control.

3.1.7 Interrupt Concept

The C166 MCU carries out the X-GOLDTM102 interrupt system.

3.1.8 Debug Concept

The X-GOLDTM102 includes a multi-core debug. The C166 and TEAKlite cores can be debugged

in parallel with:

• A single JTAG port (that is, on a single host)

• Mutual breakpoint control.

17

C166 Debug Concept

The debugging of the C166 uses the OCDS and the Cerberus.

The X-GOLDTM102 also inlcudes a Real Time Trace module for software debugging.

TEAKLite Debug Concept

TEAKlite debugging uses the OCEM and the SEIB.

3.1.9 Power Management

The X-GOLDTM102 provides the power management unit (PMU) for the complete mobile phone

application. The integrated PMU is directly connected to the battery and provides a set of linear

voltage regulators (LDO’s). These LDO’s generate all required supply voltages and currents

needed in a low feature mobile phone.

The charger unit controls the charging of NiCd, NiMh, LiPolymer and LiON batteries. Only a few

external parts are required to support charging from a DC wall adaptor. In addition, the charger

generates the power-on reset after battery insertion or charger connection. The supported battery

voltage range is 3.1 to 5.1 V for NiCd/NiMH and 3.1 to 4.6 V for LiPolymer and LiON batteries. The

upper voltage limit is programmable.The charger supports constant current precharging,

full-charging (pulsed charging) and software controlled constant current charging. The charging

functions are protected by hardware timer. Charger idle voltages up to 20 V can be handled. An

integrated overvoltage protection protects batteries and system against overvoltage.

White/blue backlight generation is supported with a special driver for very a low external parts

count. Power consumption during operation phases is minimized due to flexible clock switching

In the Standby Mode most parts of the device are switched off, only a small part is running at

32kHz and the

controller RAM is switched to a power saving mode. The TEAKLite ROM can be switched off

during Standby via SW.

This Units (associated to the Measurement Unit) provides also support for a accessory

detection .

3.1.10 On-Chip Security Concept

Secure boot is based on a public/private key approach. Flash images that are not signed with the

private key during phone manufacture cannot be loaded. Verification of the Flash code is done with

the public key. The public key as well as hash and verify algorithms are stored in the ROM, which

ensures a hardware secured boot procedure.

The following security features are supported:

• Prevention of illegal Flash programming

• Flash programming makes use of the X-GOLDTM102 ID for personalization checks with IMEI and

SIM-lock protection

The security features use the following mechanism:

• Boot ROM flow:

– Controls the boot transition to external flash

– Controls the flash update

18

• Flash tied to the individual chip via an ID using e-fuses, that is, each X-GOLDTM102 chip has its

own fused ID.

• Harware support of SHA1 algorithm to reduce the booting time.

Further details on the X-GOLDTM102 security concept are not publicly documented.

GSM Cipher Unit

This unit on the TEAKlite bus calculates the GSM/EDGE encryption keystream and the

GSM/EDGE decryption

keystream. It implements the following algorithms: A5/1, A5/2, and A5/3.

3.1.11 Asynchronous Operation Mode Concept

The X-GOLDTM102 can operate in either:

• The traditional synchronous mode with the 26 MHz system clock synchronized on the base

station

• A special asynchronous mode (XO concept).

In the asynchronous mode the 26 MHz clock input is not synchronized with the base station; the

residual frequency offset is compensated in the digital signal processing domain. This processing

includes frequency and timing compensation of the baseband and voiceband signals.

19

3.2 Memory chip (S71GL064NA0BFW0Z0)

Figure.3-2 S71GL064NA0BFW020 FUNCTIONAL BLOCK DIAGRAM

Features

_ Power supply voltage of 2.7 to 3.1V
_ 100 ns access time (S71GL128N)

_ 105 ns access time (S71GL512N)

_ 25 ns page read times

_ Packages:

– 12.0 x 9.0 mm x 1.2 mm FBGA (TLD084) (S71GL512N)

– 11.6 x 8.0 mm x 1.2 mm FBGA (TLA084) (S71GL128N)

_ Operating Temperature

– -25°C to +85°C (Wireless)

General Description

The S71GL Series is a product line of stacked Multi-chip Product (MCP) packages and consists of

_ One Flash memory die

_ One pSRAM

20

3.3 Power Amplifier Module ( SKY77518 )

Figure.3-3 SKY77518 FUNCTIONAL BLOCK DIAGRAM

The SKY77518 is a transmit and receive front-end module (FEM) with Integrated Power

Amplifier Control (iPAC™) for dual-band cellular handsets comprising GSM900 and DCS1800

operation. Designed in a low profile, compact form factor, the SKY77518 offers a complete

Transmit VCO-to- Antenna and Antenna-to-Receive SAW filter solution. The FEM also supports

Class 12 General Packet Radio Service (GPRS) multi-slot operation.

The module consists of a GSM900 PA block and a DCS1800 PA block, impedance-matching

circuitry for 50 Ω input and output impedances, TX harmonics filtering, high linearity and low

insertion loss PHEMT RF switches, diplexer and a Power Amplifier Control (PAC) block with

internal current sense resistor. A custom BiCMOS integrated circuit provides the internal PAC

function and decoder circuitry to control the RF switches. The two Heterojunction Bipolar Transistor

(HBT) PA blocks are fabricated onto a single Gallium Arsenide (GaAs) die. One PA block supports

the GSM900 band and the other PA block supports the DCS1800 band. Both PA blocks share

common power supply pads to distribute current. The output of each PA block and the outputs to

the two receive pads are connected to the antenna pad through PHEMT RF switches and a

diplexer. The GaAs die, PHEMT die, Silicon (Si) die and passive components are mounted on a

multi-layer laminate substrate. The assembly is encapsulated with plastic overmold.

Band selection and control of transmit and receive modes are performed using two external

control pads. Refer to the functional block diagram in Figure.3-2-1 below. The band select pad (BS)

selects between GSM and DCS modes of operation. The transmit enable (TX_EN) pad controls

receive or transmit mode of the respective RF switch (TX = logic 1). Proper timing between transmit

enable (TX_EN) and Analog Power Control (VRAMP) allows for high isolation between the antenna

and TXVCO while the VCO is being tuned prior to the transmit burst.

The SKY77518 is compatible with logic levels from 1.2 V to VCC for BS and TX_EN pads,

depending on the level applied to the VLOGIC pad. This feature provides additional flexibility for

the designer in the selection of FEM interface control logic.

21

3.4 RF SAW (B9308)

Application

Low-loss 2in1 RF filter for mobile telephone GSM 900 and GSM 1800 systems, receive path (Rx)

Usable passband:

Filter 1 (GSM 1800): 75 MHz

Filter 2 (GSM 900): 35 MHz

Unbalanced to balanced operation for both filters

Very low insertion attenuation

Low amplitute ripple

Impedance transformation from 50 W to 150 W for both filters

Suitable for GPRS class 1 to 12

Features

Package size 2.0 x1.6 x 0.68 mm3

Package code QCS10H

RoHS compatible

Approx. weight 0.008 g

Package for Surface Mount Technology (SMT)

Ni, gold-plated terminals

Electrostatic Sensitive Device (ESD)

Pin configuration

1 Input [Filter 1]

4 Input [Filter 2]

6,7 Output, balanced [Filter 2]

8,9 Output, balanced [Filter 1]

2,3,5,10 Case-ground

22

3.5 Audio Amplifier (TPA6202A1)

Figure.3-5 TPA6202A1 FUNCTIONAL BLOCK DIAGRAM

FEATURES

· 1.25 W Into 8W From a 5-V Supply at THD = 1% (Typical)

· Shutdown Pin has 1.8V Compatible Threshold

· Low Supply Current: 1.7mA Typical

· Shutdown Current < 10µA

· Only Five External Components

– Improved PSRR (90 dB) and Wide Supply Voltage (2.5V to 5.5V) for Direct Battery Operation

· Avaliable in a 2 mm x 2 mm MicroStar Junior™ BGA Package (ZQV)

APPLICATIONS

· Designed for Wireless Handsets, PDAs, and other mobile devices

· Compatible with Low Power (1.8V Logic) I/O Threshold control signals

DESCRIPTION

The TPA6202A1 is a 1.25-W mono fully differential amplifier designed to drive a speaker with at

least 8-Ώ impedance while consuming less than 37 mm2 (ZQV package option) total printed-circuit

board (PCB) area in most applications. This device operates from 2.5 V to 5.5 V, drawing only 1.7

mA of quiescent supply current. The TPA6202A1 is available in the space-saving 2 mm x 2 mm

MicroStar Junior™ BGA package.

A fast start-up time of 4ms with minimal pop makes the TPA6202A1 ideal for wireless handsets.

23

3.6 Charger IC (MP26021)

Figure.3-6 MP26021 FUNCTIONAL BLOCK DIAGRAM

DESCRIPTION

The MP26021 is a linear, high-performance single cell Li-Ion battery charger. By integrating high

voltage input protection into the charger IC, the MP26021 can tolerate an input surge up to 28V.

The device features constant current (CC) and constant voltage (CV) charging modes with

programmable charge currents (85mA to 1A), programmable battery full threshold, thermal

protection, battery temperature monitoring, reverse current blocking and trickle charge. The device

also provides AC adapter power good and charge status indications to the system.

MP26021 is available in a 10-pin 3mm x 3mm QFN package.

FEATURES

‧ Input Surge Up to 28V

‧ Adapter or USB Input

‧ Programmable Charge Current: 85mA to 1A

‧ Proprietary Constant Voltage Auto Recharge

‧ Proprietary Over-Voltage Protection

‧ 0.75% VBATT Accuracy

‧ <1µA Battery Reverse Current

‧ 90µA Standby Current from VIN

24

‧ Battery Temperature Monitoring

‧ Over Current Protection

‧ AC Adapter Power Good Indicator

‧ Charge Status Indicator

‧ Programmable Soft-Start

‧ Programmable Charge Termination Current Threshold

‧ Tiny 10-Pin QFN (3mm x 3mm) Package

APPLICATIONS

‧ Cell Phones

‧ MP3 Players

‧ Smart Phones

‧ PDAs

‧ Digital Cameras

25

3.7 FM Radio (Si4708)

Figure.3-7 Si4708 FUNCTIONAL BLOCK DIAGRAM

The Si4708/09 extends Silicon Laboratories Si4700 FM tuner family, and further increases the

ease and attractiveness of adding FM radio reception to mobile devices through small size and

board area, minimum component count, flexible programmability, and superior, proven

performance. Si4708/09 software is backwards compatible to existing Si4700/01/02/03 FM

Tuner designs and leverages Silicon Laboratories' highly successful and patented Si4700/01/02/03

FM tuner. The Si4708/09 benefits from proven digital integration and 100% CMOS process

technology, resulting in a completely integrated solution. It is the industry's smallest footprint FM

tuner IC requiring only 6.25 mm2 board space and one external bypass

capacitor.

The device offers significant programmability, catering to the subjective nature of FM listeners’

audio preferences and variable FM broadcast environments worldwide.

The Si4709 incorporates a digital processor for the European Radio Data System (RDS) and the

US Radio Broadcast Data System (RBDS) including all required symbol decoding, block

synchronization, error detection, and error correction functions.

RDS/RDBS* enables data such as station identification and song name to be displayed to the

user. The Si4709 offers a detailed RDS view and a standard view, allowing adopters to selectively

choose granularity of software is backwards compatible to the proven Si4701/03, adopted by

leading cell-phone and MP3 manufacturers world-wide.

The Si4708/09 is based on the superior, proven performance of Silicon Laboratories' Aero

architecture offering unmatched interference rejection and leading sensitivity. The device uses the

26

same programming interface as the Si4700/01/02/03 and supports multiple bus modes. Power

management is simplified with an integrated regulator allowing direct connection to a 2.7 to 5.5 V

battery for VD and 2.7 to 5.5 V battery for VA.

The Si4708/09 device’s high level of integration and complete FM system production testing

increases quality to manufacturers, improves device yields, and simplifies device manufacturing

and final testing.

27

3.8 LCD Interface

Figure.3-8-1 LCD Interface

The IM200BBN2A model is a Color TFT LCD supplied by LG Innotek.

This main Module has a 2.0 inch diagonally measured active display area with 128(RGB)X160

resolution. Each pixel is divided into Red, Green and Blue sub-pixels and dots which are arranged

in vertical stripes.

Main LCD color is determined with 262,144 colors signal for each pixel.

The IM200BBN2A has been designed to apply the interface method that enables low power,

high speed, and high contrast.

The IM200BBN2A is intended to support applications where thin thickness, wide viewing angle

and low power are critical factors and graphic displays are important.

28

29

Pin Description

30

3.9 SIM Card Interface

Figure.3-9 SIM CARD Interface

Signals Description

SIM_RST This signal makes SIM card to HW default status.

SIM_ CLK This signal is transferred to SIM card .

SIM_I/O This signal is interface datum.