LG FLATRON W1943SB, W1943SB-PFI AxxAP Service Manual

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COLOR MONITOR

SERVICE MANUAL

CHASSIS NO. :

MODEL:

CAUTION

BEFORE SERVICING THE UNIT, READ THE

(W1943SB-

xx * means sales region and module type

(AxxIAP: INL 5ms, AxxVAP: AUO 5ms)

SAFETY PRECAUTIONS

PFI Axx*AP)

W1943SB

IN THIS MANUAL.

*To apply the MSTAR Chip.

1

SPECIFICATIONS ................................................... 2

PRECAUTIONS ....................................................... 4

TIMING CHART ....................................................... 8

DISASSEMBLY

........................................................10

BLOCK DIAGRAM...................................................12

DISCRIPTION OF BLOCK DIAGRAM ...................12

ADJUSTMENT ...................................................... 14

SERVICE OSD ............................................... .........16

TROUBLESHOOTING GUIDE .............................. 17

WIRING DIAGRAM ............................................... 24

EXPLODED VIEW ................................................... 25

REPLACEMENT PARTS LIST ............................... 26

SCHEMATIC DIAGRAM ......................................... 27

SPECIFICATIONS

CONTENTS

1. LCD CHARACTERISTICS

Type Active Display Area : 18.5 inch Pixel Pitch Color Depth

Surface Treatment :

Operating Mode

Backlight Unit

2. OPTICAL CHARACTERISTICS

2-1. Viewing Angle by Contrast Ratio (a) For

InnoLux MT185GW01-V0 panel:

Left /Right=75/85;up/down=70/80;CR≥10

(b) For AUO

M185XW01-V0 panel:

Left /Right170°(min 150) ;up/down160°(min140) CR≥10

2-2. Luminance (a) For

INL MT185GW01-V0 panel:

220cd/㎡(Min),(6500k); 170cd/㎡(Min)(9300k);

(b)

For AUO

M185XW01-V0 panel:

220cd/㎡(Min),(6500k); 170cd/㎡(Min)(9300k);

2-3. Contrast Ratio (a) For

(b) For AUO

InnoLux MT185GW01-V0: 1000:1(Typ),

M185XW01-V0 panel: 1000:1(Typ),

(c) DFC on:30000:1

3. SIGNAL (Refer to the Timing Chart)

3-1. Sync Signal Type : Separate TTL,SOG,

3-2. Video Input Signal

1) Type

2) Voltage Level

3) Input Impedance : 75ohm

3-3. Operating Frequency:

Horizontal Vertical

4. Max. Resolution

D-sub Analog:

5. POWER SUPPLY

5-1. Power: 90 ~ 264 Vac / 50 ~ 60 Hz

5-2. Power Consumption

: TFT Color LCD Module

: 0.3mm(H) X0.3mm(V) : 16.7M

Anti-glare , Hardness (3H)

:

Normally White

: Top/Bottom 2-CCFL

: Analog : 700mV+/-5%(P-P)

: 30-61KHZ : 56-75HZ

1360X768@60HZ

2

Status

H-

syncV-sync

Video Power LED

Power On on on active ≤ 24W Red

off on blanked < 1W Red Blinking

Power Saving

on off blanked < 1W Red Blinking

off off blanked < 1W Red Blinking

Power Off -- -- -- < 0.5W Off

6. ENVIRONMENT

6-1. Operating Temperature

: 0°C to 40°C 6-2. Relative Humidity : 20% to 80% 6-3. MTBF

Lamp Life

:

50,000 H with 90% confidence

:

40,000(min,)/50000(typ)Hours

7. DIMENSIONS (with TILT/SWIVEL)

Width: 446.7mm Depth: 183.0mm(W Base),159.3mm(W/O Base) Height:: 374.3mm(W Base),357.3mm(W/O Base)

8. WEIGHT (with TILT/SWIVEL)

Net. Weight :

3.29+/-0.5Kg（AUO）;3.31+/-0.5Kg(INL)

Gross Weight: 4.64+/-0.5Kg(AUO);4.66+/-0.5Kg(INL)

3

PRECAUTION

WARNING FOR THE SAFETY-RELATED COMPONENT.

• There are some special components used in LCD monitor that are important for safety. These parts are

marked on the schematic diagram and the Exploded View. It is essential that these

critical parts should be replaced with the manufacturer’s specified parts to prevent electric shock, fire or other hazard.

• Do not modify original design without obtaining written permission from manufacturer or you will void the original parts and labor guarantee.

TAKE CARE DURING HANDLING THE LCD MODULE WITH BACKLIGHT UNIT.

• Must mount the module using mounting holes arranged in four corners.

• Do not press on the panel, edge of the frame strongly or electric shock as this will result in damage to the screen.

• Protect the module from the ESD as it may damage the electronic circuit (C-MOS).

• Make certain that treatment person’s body is grounded through wrist band.

• Do not leave the module in high temperature and in areas of high humidity for a long time.

• The module not be exposed to the direct sunlight.

• Avoid contact with water as it may a short circuit within the module.

• If the surface of panel become dirty, please wipe it off with a soft material. (Cleaning with a dirty or rough cloth may damage the panel.)

CAUTION

Please use only a plastic screwdriver to protect yourself from shock hazard during service operation.

WARNING

BE CAREFUL ELECTRIC SHOCK !

• If you want to replace with the new backlight (CCFL) or inverter circuit, must disconnect the AC adapter because high voltage appears at inverter circuit about 650Vrms.

• Handle with care wires or connectors of the inverter circuit. If the wires are pressed cause short and may burn or take fire.

• Be careful while tilting and rotating the monitor to avoid pinching hand(s)

Leakage Current Hot Check Circuit

AC Volt-meter

Good Earth Ground

To Instrument's exposed METALLIC PARTS

1.5 Kohm/10W

such as WATER PIPE, CONDUIT etc.

4

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this

service manual and its supplements and addenda, read

and follow the SAFETY PRECAUTIONS on page 3 of this

publication.

NOTE:

between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

If unforeseen circumstances create conflict

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit

board module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical

plug or other electrical connection.

c. Connecting a test substitute in parallel with an

electrolytic capacitor in the receiver.

CAUTION: A wrong part substitution or incorrect

polarity installation of electrolytic capacitors may result in an explosion hazard.

d. Discharging the picture tube anode.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Discharge the picture tube anode only by (a) first connecting one end of an insulated clip lead to the degaussing or kine aquadag grounding system shield at the point where the picture tube socket ground lead is connected, and then (b) touch the other end of the insulated clip lead to the picture tube anode button, using an insulating handle to avoid personal contact with high voltage.

4. Do not spray chemicals on or near this receiver or any of its assemblies.

5. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cottontipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength)

CAUTION: This is a flammable mixture.

Unless specified otherwise in this service manual, lubrication of contacts in not required.

6. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

7. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

8. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

9. Use with this receiver only the test fixtures specified in this service manual.

CAUTION: Do not connect the test fixture ground strap

to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The fol l o wi n g techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "antistatic" can generate electrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.

CAUTION: Be sure no power is applied to the chassis

or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)

5

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500。F to 600。F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wire-bristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal

temperature.

(500。F to 600。F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static,

suction-type solder removal device or with solder

braid.

CAUTION: Work quickly to avoid overheating the

circuitboard printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal

temperature (500。F to 600。F)

b. First, hold the soldering iron tip and solder the strand

against the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of

the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil.

CAUTION: Work quickly to avoid overheating the

circuit board printed foil.

d. Closely inspect the solder area and remove any

excess or splashed solder with a small wire-bristle brush.

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard te c h n i q u e a s outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one

operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an antista tic suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor Removal/Replacement

1.

Clip each fuse or resistor lead at top of the circuit

board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

3. Solder the connections.

CAUTION: Maintain original spacing between

the replaced component and adjacent components and the ci r cuit board to prevent excessive component temperatures.

6

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use t h i s technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper a s absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the outaway copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique i nvo l v es th e ins t alla t i on o f a jump e r wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections.

CAUTION: Be sure the insulated jumper wire

is dressed so the it does not touch components or sharp edges.

7

TIMING CHART

VIDEO

mode section polarity

SYNC

A

E

D B

C

M

DOT

CLOCK

[MHz]

Frequency

[kHz]/[Hz]

Total

Period(E)

Display

(A)

Front

Porch

(D)

Sync

.

(C)

Back

Porch

(B)

Resol-

ution

H(Pixels) - 31.468 900 720 18 108 54

1

V(Lines) +

H(Pixels) - 31.469 800 640 16 96 48

2

V(Lines) -

H(Pixels) - 37.5 840 640 16 64 120

3

V(Lines) -

H(Pixels) + 37.879 1056 800 40 128 88

4

V(Lines) +

H(Pixels) + 46.875 1056 800 16 80 160

5

V(Lines) +

H(Pixels) +/- 49.725 1152 832 32 64 224

6

V(Lines) +/-

H(Pixels) - 48.363 1344 1024 24 136 160

7

V(Lines) -

H(Pixels) - 60.123 1312 1024 16 96 176

8

V(Lines) -

28.321

70.08 449 400 12 2 35

25.175

59.94 525 480 10 2 33

31.5 75 500 480 1 3 16

40.0

60.317 628 600 1 4 23

49.5

75.0 625 600 1 3 21

57.283

74.55 667 624 1 3 39

65.0

60.0 806 768 3 6 29

78.75

75.029 800 768 1 3 28

720 X

400

640 x

480

640 x

480

800 x

600

800 x

600

832 x

624

1024 x

768

1024 x

768

H(Pixels) + 47.712 1792 1360 64 122 256

9

V(Lines) +

85.5

 79

8

768 3

 

1360 x768

DISASSEMBLY

9

10

LG FLATRON W1943SB, W1943SB-PFI AxxAP Service Manual

Specifications and Main Features

Frequently Asked Questions

User Manual