LG FLATRON M3201C, FLATRON M3701C, FLATRON M4201C Service Manual

COLOR MONITOR

SERVICE MANUAL

Website:http://biz.LGservice.com

CAUTION

BEFORE SERVICING THE UNIT, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CHASSIS NO. : LW61A

MODEL: M3201C (M3201C-BAFE.A**LLC)

M3701C (M3701C-BAFE.A**LLC) M4201C (M4201C-BAFE.A**LLC)

( ) **Same model for Service

Internal Use Only

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LGE Internal Use Only

1. LCD CHARACTERISTICS

Type : TFT Color LCD Module Active Display Area :

31.51 inches(800.4mm) diagonal-M3201C

37.02 inches(800.4mm) diagonal-M3701C

42.02 inches(1067.308mm) diagonal-M4201C

Pixel Pitch :

170.25 (H) x 510.75 (V) x RGB-M3201C

0.2mm (H) x 0.6mm (V) x RGB-M3701C

0.227mm (H) x 0.681mm (V) x RGB-M4201C

Color Depth : 8bits, 16,777,216 colors Electrical Interface : LVDS Size : 760(H) x 450(D) x 48(D)-M3201C Size :

877(H) x 516.8(D) x 55.5(D)-M3701C

Size :

1006(H) x 610(D) x 59(D)-M4201C

Surface Treatment : Anti-Glare, Hard Coating(3H) Operating Mode : Normally Black Backlight Unit : 18EEFL (20lamps)-M3201C Backlight Unit :

20EEFL (20lamps)-M3701C,M4201C

2. OPTICAL CHARACTERISTICS

2-1. Viewing Angle by Contrast Ratio ≥ 10 Left : -85° min., -89°(Typ) Right : +85° min., +89°(Typ) Top : +85° min., +89°(Typ) Bottom : -85° min., -89°(Typ)

2-2. Luminance : 400(min), 500(Typ)-9300K

2-3. Contrast Ratio : 600(min), 800(Typ)

at PSM : Standard, CSM : Normal

3. SIGNAL (Refer to the Timing Chart)

3-1. PC & Video Input

1)Input Form : RGB, HDMI/DVI, Component, Video, S-Video

2)Resolution(max) : Analog -1600 x 1200@60Hz

Digital -1280 x 1024@60Hz

3-2. Sync Input

Horizontal : 30 ~ 83kHz(Digital: ~72kHz) Vertical : 56 ~ 85Hz Input Form : Separate, SOG, Composite, Digital

4. SPECIAL FUNCTION

4-1. Audio

1)Output Rating : 10W + 10W(Rated Output

10%)

2)Freq. Character : 100Hz~10KHz Range(-3dB)

3)T. H. D : Within 10%

4)Input Sensitivity : 0.700Vrms

4-2. Speaker

1)TYPE : Detachable

2)Impedance : 8

3)Input : Max : 15W, Normal : 10W

4-2. AV

1)Video Level : Input : 0.7

0.15Vp-p

2)Sync Level : Input : 0.286

0.075Vp-p

3)Color Burst : Input : 0.214

0.072Vp-p

4)Audio Level : NTSC Input : 0.40

0.1Vrms

PAL Input : 0.5

0.1Vrms

PC Input : 0.7

0.1Vrms

5)Video Cross Talk : 43dB

5. POWER SUPPLY

5-1. Power Adaptor

Input : AC 100~240V, 50/60Hz , 2.8A

5-2. Power Consumption

6. ENVIRONMENT

6-1. Operating Temperature: 10°C~35°C 6-2. Operating Humidity : 10%~80% 6-3. MTBF : 50,000 HRS with 90%

Confidence level

Lamp Life : 50,000 Hours(Min.)

CONTENTS

SPECIFICATIONS

SPECIFICATIONS ................................................... 2

PRECAUTIONS ....................................................... 4

TIMING CHART ....................................................... 8

BLOCK DIAGRAM ................................................. 10

DESCRIPTION OF BLOCK DIAGRAM...................11

ADJUSTMENT ...................................................... 12

SERVICE OSD ...................................................... 14

TROUBLESHOOTING GUIDE .............................. 17

WIRING DIAGRAM ............................................... 24

EXPLODED VIEW...................................................25

REPLACEMENT PARTS LIST ...............................31

SCHEMATIC DIAGRAM......................................... 42

MODE

POWER ON (NORMAL)

STAND-BY

SUSPEND

DPMS OFF

POWER SW OFF

H/V SYNC

ON/ON

OFF/ON

ON/OFF

OFF/OFF

POWER CONSUMPTION

less than 145W-M3201C

less than 180W-M3701C

less than 240W-M4201C

less than 1 W

less than 4 W

less than 1 W

less than 4 W

less than 1 W

less than 4 W

less than 1 W

LED COLOR

RGB

HDMI

RGB

HDMI

RGB

HDMI

VIDEO

ACTIVE

OFF

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LGE Internal Use Only

7. DIMENSIONS (with Speaker/Stand) M3201C

Width : 964 mm (31.61'') Depth : 180 mm (3.93'') Height : 540 mm (19.41'')

M3701C

Width : 1129 mm (31.61'') Depth : 227.7 mm (3.93'') Height : 619 mm (19.41'')

M4201C

Width : 1259 mm (31.61'') Depth : 294.5 mm (3.93'') Height : 702 mm (19.41'')

8. WEIGHT (with Speaker/Stand) M3201C

Net. Weight : 21.1 kg (35.28 lbs) Gross Weight : 26 kg (46.08 lbs)

M3701C

Net. Weight : 30.5 kg (35.28 lbs) Gross Weight : 36.4 kg (46.08 lbs)

M4201C

Net. Weight : 44 kg (35.28 lbs) Gross Weight : 46.5 kg (46.08 lbs)

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LGE Internal Use Only

WARNING FOR THE SAFETY-RELATED COMPONENT.

• There are some special components used in LCD

monitor that are important for safety. These parts are

marked on the schematic diagram and the replacement parts list. It is essential that these critical

parts should be replaced with the manufacturer’s specified parts to prevent electric shock, fire or other hazard.

• Do not modify original design without obtaining written

permission from manufacturer or you will void the original parts and labor guarantee.

TAKE CARE DURING HANDLING THE LCD MODULE WITH BACKLIGHT UNIT.

• Must mount the module using mounting holes arranged

in four corners.

• Do not press on the panel, edge of the frame strongly

or electric shock as this will result in damage to the screen.

• Do not scratch or press on the panel with any sharp

objects, such as pencil or pen as this may result in damage to the panel.

• Protect the module from the ESD as it may damage the

electronic circuit (C-MOS).

• Make certain that treatment person’s body are

grounded through wrist band.

• Do not leave the module in high temperature and in

areas of high humidity for a long time.

• The module not be exposed to the direct sunlight.

• Avoid contact with water as it may a short circuit within

the module.

• If the surface of panel become dirty, please wipe it off

with a softmaterial. (Cleaning with a dirty or rough cloth may damage the panel.)

WARNING

BE CAREFUL ELECTRIC SHOCK !

• If you want to replace with the new backlight (CCFL) or inverter circuit, must disconnect the AC adapter because high voltage appears at inverter circuit about 650Vrms.

• Handle with care wires or connectors of the inverter circuit. If the wires are pressed cause short and may burn or take fire.

Leakage Current Hot Check Circuit

PRECAUTION

CAUTION

Please use only a plastic screwdriver to protect yourself from shock hazard during service operation.

1.5 Kohm/10W

To Instrument's exposed METALLIC PARTS

Good Earth Ground such as WATER PIPE, CONDUIT etc.

AC Volt-meter

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LGE Internal Use Only

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this

service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit

board module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical

plug or other electrical connection.

c. Connecting a test substitute in parallel with an

electrolytic capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

d. Discharging the picture tube anode.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Discharge the picture tube anode only by (a) first connecting one end of an insulated clip lead to the degaussing or kine aquadag grounding system shield at the point where the picture tube socket ground lead is connected, and then (b) touch the other end of the insulated clip lead to the picture tube anode button, using an insulating handle to avoid personal contact with high voltage.

4. Do not spray chemicals on or near this receiver or any of its assemblies.

5. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cottontipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required.

6. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

7. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

8. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

9. Use with this receiver only the test fixtures specified in

this service manual.

CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "antistatic" can generate electrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)

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LGE Internal Use Only

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip

temperature within the range or 500

F to 600 F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wire-bristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal

temperature. (500

F to 600 F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static,

suction-type solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuitboard printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal

temperature (500

F to 600 F)

b. First, hold the soldering iron tip and solder the strand

against the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of

the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any

excess or splashed solder with a small wire-bristle brush.

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

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LGE Internal Use Only

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

TIMING CHART

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LGE Internal Use Only

VIDEO

SYNC

<< Dot Clock (MHz), Horizontal Frequency (kHz), Vertical Frequency (Hz), Horizontal etc... (µs), Vertical etc... (ms) >>

1) PC Mode

1~17 : D-SUB, DVI-D: 1~15

1 H(Pixels) + 25.175 31.469 800 640 16 96 48 640 x 350

V(Lines) - 70.8 449 350 37 2 60

2 H(Pixels) - 28.321 31.468 900 720 18 108 54 720 X 400

V(Lines) + 70.8 449 400 12 2 35

3 H(Pixels) - 25.175 31.469 800 640 16 96 48 640 x 480

V(Lines) - 59.94 525 480 10 2 33

4 H(Pixels) - 31.5 37.5 840 640 16 64 120 640 x 480

V(Lines) - 75 500 480 1 3 16

5 H(Pixels) - 36.0 43.269 832 640 56 56 80 640 x 480

V(Lines) - 85.0 509 480 1 3 25

6 H(Pixels) + 40.0 37.879 1056 800 40 128 88 800 x 600

V(Lines) + 60.317 628 600 1 4 23

7 H(Pixels) + 49.5 46.875 1056 800 16 80 160 800 x 600

V(Lines) + 75.0 625 600 1 3 21

8 H(Pixels) + 56.25 53.674 1048 800 32 64 152 800 x 600

V(Lines) + 85.061 631 600 1 3 27

9 H(Pixels) +/- 57.283 49.725 1152 832 32 64 224 832 x 624

V(Lines) +/- 74.55 667 624 1 3 39

10 H(Pixels) - 65.0 48.363 1344 1024 24 136 160 1024 x 768

V(Lines) - 60.0 806 768 3 6 29

11 H(Pixels) - 78.75 60.123 1312 1024 16 96 176 1024 x 768

V(Lines) - 75.029 800 768 1 3 28

12 H(Pixels) + 94.5 68.68 1376 1024 48 96 208 1024 x 768

V(Lines) + 85.00 808 768 1 3 36

13 H(Pixels) + 74.5 44.772 1664 1280 64 128 192 1280 x 720

V(Lines) + 59.855 748 720 3 5 20

14 H(Pixels) + 84.75 47.72 1776 1360 72 136 208 1360 x 768

V(Lines) + 59.799 798 768 3 5 22

15 H(Pixels) + 108.0 63.981 1688 1280 48 112 248 1280 x 1024

V(Lines) + 60.02 1066 1024 1 3 38

16 H(Pixels) + 135.00 79.98 1688 1280 16 144 248 1280 x 1024

V(Lines) + 75.02 1066 1024 1 3 38

17 H(Pixels) + 162.00 75.00 2160 1600 90 30 88 1600 x 1200

V(Lines) + 60 1250 1200 1 3 46

MODE

H / V

Sync

Polarity

Dot

Clock

Frequency

Total

Period

( E )

Video

Active

Time ( A )

Front

Porch

( C )

Sync

Duration

( D )

Back

Porch

( F )

Resolution

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LGE Internal Use Only

2) DTV Mode

Component Input(Y/Pb/Pr)

Resolution H-freq(kHz) V-freq(Hz)

1. 720*480 15.63 59.94 SDTV, DVD 480i

2. 720*483 31.47 59.94 EDTV 480p

3. 720*576 15.625 50.00 SDTV, DVD 625 Line

4. 720*576 31.25 50.00 HDTV 576p

5. 1280*720 45.00 60.00 HDTV 720p

6. 1280*720 37.5 50 HDTV 720p

7. 1280*720 44.96 59.94 HDTV 720p

8. 1920*1080 31.25 50.00 HDTV 1080i 50Hz (Australia)

9. 1920*1080 33.75 60.00 HDTV 1080i 60Hz (ATSC)

10. 1920*1080 33.72 59.94 HDTV 1080i 59.94Hz

RGB-DTV, HDMI/DVI-DTV Input

Resolution H-freq(kHz) V-freq(Hz)

1. 480/60P 31.5 60 EDTV 480p

2. 720/60P 45 60 HDTV 720p

3. 1080/60i 33.75 60 HDTV 1080i 60Hz (ATSC)

4. 576/50P 31.25 50.00 HDTV 576p

5. 720/50P 37.5 50 HDTV 720p

6. 1080/50i 28.1 50 HDTV 1080i 50Hz (Australia)

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LGE Internal Use Only

AT49BV160

(Flash Memory)

IC309

HY5DU281622ETP

(DDR SDRAM)

IC310

HY5DU281622ETP

(DDR SDRAM)

IC311

KEY1 / KEY2

PREAMP IR

WIRE CONTROL

RXD / TXD

24bit

PC R/G/B

PC R/G/B OUT

PC H/V SYNC

PC H/V SYNC OUT

(D526, D527)

HDMI

(JK501)

WIRE

CONTROL

(JK500)

RS-232C

IN / OUT

(P502)

PC RGB

IN / OUT

(P503)

PC Audio

(IC510)

(IC511)

(IC512)

500KHz

(X501)

19.6608MHz

(X801)

(IC509)

SYNC_DE

C_OUT

V / Y_OUT

Y/C

I2S

Delayed I2S

18.432MHz

(X800)

OUT1A

OUT1B

OUT2A

OUT2B

AV Audio OUT

PC Audio IN

Component Audio IN

AV Audio IN

CVBS

CVBS OUT

Component 1, 2 IN

Component 1, 2 Y Pb Pr

Component 1, 2

Audio IN

(JK503)

CVBS

IN / OUT

(JK514)

CVBS

IN / OUT

(JK513)

S-Video

(JK506)

(JK512) (JK511) (JK510)

27MHz

(X500)

ICL3232C

(RS232C)

IC503

74HC14D

(Schmitt Trigger

Inverter)

IC507

CM2021

(ESD

Protector)

AD8009

(OP AMP)

LA7217M

(Video Sync

Seperator)

LC FILTER

TAS5122

(D-CLASS AMP)

IC802

NTP2000

(Digital Audio Processor)

IC805

NJU26901

(Audio Delay)

IC803

MSP4440K

(Audio Processor)

IC804

CXA2040AQ

(Video Switch)

IC513

ANX9021

(HDMI

RX’er)

IC508

32" / 37" / 42"

LCD Panel

FLI8662

(Cortez Advanced)

IC101

KEY CONTROL B’D

(6871TST481G)

RXC /RX0

RX1 /RX2

RXC /RX0

RX1 /RX2

BLOCK DIAGRAM

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LGE Internal Use Only

DESCRIPTION OF BLOCK DIAGRAM

1. AV INPUT SELECTION CIRCUIT

1) AV(Video) INPUT SELECT : This section is composed of Video switching IC (CXA2040AQ_IC513) and peripheral devices. Video switching IC(CXA2040AQ_U201) selects CVBS video or S-video and the signal is sent to Scaler IC(IC101).

2) AV Sync Detection : This section is composed of Sync Separator IC(LA7217M_IC509) and peripheral devices. Av input selection block sends selected signal to Sync detection block then sync detection block identifies if AV signal is present or not. And this block sends this information to Scaler(Micom).

2. Component INPUT

Component input signal was connected from input jack to scaler directly.

3. RGB INPUT OUTPUT CIRCUIT

1) D-SUB RGB INPUT OUTPUT : This section is composed of RGB Input Output Jack(P503), Schmitt trigger inverter IC(IC507), OP-AMPs(IC510, IC511, IC512) and peripheral devices. RGB input signal path was connected from input jack to Scaler directly. But scaler receives RGB Sync signal via schmitt trigger inverter IC. RGB output signal was made by OP-Amp ICs. And this sends output signal to RGB output jack.

4. HDMI INPUT CIRCUIT

This section is composed of TMDS receiver IC(ANX9021_IC508), ESD protection diode(CM2021_D526, D527) and peripheral devices. TMDS receiver IC receives TMDS signal via ESD protection diode. And it convert HDMI signal to digital RGB signal. And it sends to scaler.

5. RS-232C INPUT OUTPUT CIRCUIT

This section is composed of RS-232C IC(ICL3232C_IC503), and peripheral devices. Computer and scaler(micom) was connected by RS232C IC.

6. VIDEO SIGNAL PROCESSOR (FORMAT CONVERTER)

This section is composed of FLI8662(IC101) and peripheral devices. FLI8662(SCALER_IC101) has in built MICOM in IC.

(1) This IC includes A/D Converter, Pre-Amp, PLL

Circuit. (2) This IC includes video decoder and De-interlacer. (3) This IC includes LVDS Transmitter.

LVDS Transmitter is encoding the output Signal. Also, FLI8662 have Format Converter (Scaling) function. This IC converts Various size of Digital signal to LCD Module's resolution (WXGA).

7. AUDIO DECODER

This section is composed of MSP4440K(IC804), NTP2000(IC805) and peripheral devices. MSP4440K is processing audio signal(AV, Component, PC Audio and IIS). Digital audio processor IC receives IIS signal from MSP4440K, and converts IIS to PWM signal. This IC's output signal is sent to Audio Amplifier IC(TAS5122_IC802).

8. AUDIO AMPLIFIER

This section is composed of TAS5122(IC802) and peripheral devices. Audio Amplifier's function is amplification of sound signal received from Audio Decoder. Input Audio signal is amplified according to the DC Volume control curve.

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LGE Internal Use Only

ADJUSTMENT

All adjustment are thoroughly checked and corrected when the monitor leaves the factory, but sometimes several minor adjustment may be required. Adjustment should be following procedure and after warming up for a minimum of 30 minutes.

• Alignment appliances and tools.

- IBM compatible PC

- Programmable Signal Generator. (eg. VG-819 made by Astrodesign Co.)

- Oscilloscope.

- White Balance Meter. (CA-110)

1. DDC Data Write Procedure-Analog

1) Use this procedure only when there is some problem on Analog EDID data.

2) Run alignment program for M3201C on the IBM compatible PC.

3) Select EEPROM → Analog EDID write command and Enter.

4) This will write the Analog EDID data to EEPROM.

2. DDC Data Write Procedure-Digital

1) Use this procedure only when there is some problem on Digital EDID data.

2) Run alignment program for M3201C on the IBM compatible PC.

3) Select EEPROM → Digital EDID write command and Enter.

4) This will write the Digital EDID data to EEPROM.

RS-232C

EXT.

2 2

IBM Compatible PC

Parallel Port

Power inlet (required)

Power LED

ST Switch

Power Select Switch (110V/220V)

Control Line

Not used

RS232C

PARALLEL

-S

V-Sync On/Off Switch (Switch must be ON.)

4.7K

74LS06

OFF ON

OFF

Figure 1. Cable Connection

- 13 -

LGE Internal Use Only

Windows EDID V1.0 User Manual

Operating System: MS Windows 98, 2000, XP Port Setup: Windows 98 => Don’t need setup

Windows 2000, XP => Need to Port Setup.

This program is available to LCD Monitor only.

1. Port Setup a) Copy “UserPort.sys” file to

“c:\WINNT\system32\drivers” folder

b) Run Userport.exe

c) Remove all default number d) Add 300-3FF

e) Click Start button. f) Click Exit button.

2. EDID Read & Write

1) Run WinEDID.exe

2) Edit Week of Manufacture, Year of Manufacture, Serial Number a) Input User Info Data b) Click “Update” button c) Click “ Write” button

- 14 -

LGE Internal Use Only

SERVICE OSD

LW61A

Cortez Version 3.00

Panel Used 106 Hr.

Tool Option 1 11

Tool Option 2

Area Option 0

OPTION 1

OPTION 2

OPTION 3

OPTION 4

System Control 1

System Control 2

System Control 3

BlkLine Detector

Power-off History

Fan Control

Tool Option 1

MODULE L32LPL

MODULE OPTION SW

Tool Option 2

Tuner Num.

No Tuner

EYE

INDEX

RGB ONLY 0

Full 1

HDMI Type 1-HDMI

System Control 1

System Control 1 32

SplitZoom key

Save Split Zoom 0

2 Hour Off Opt. 0

OSD Rotate 0

Favorite Key 0

Exit Key 1

Navigation key 0

The OSD is displayed when 'ADJ Key is pressed on ADJUST

REMOCON in Service Menu.

Description of operation

- LW61A : Model chassis

- Cortez Version : Software Version

- Panel Used : Use time the Panel

- Area Option

- OPTION 1

- OPTION 2 Not Use

- OPTION 3

- OPTION 4

- System Control 3 : Debug Print Set up

- Power-off History : History Memory of Abnormal

- Fan Control : Nothing

The OSD is displayed when 'OK' Key is pressed on Tool Option 1 in Service Menu.

Tool Option 1

- MODULE : Inch, make factory Module change

- Cortez Version : Fix SW (Not change)

The OSD is displayed when 'OK' Key is pressed on Tool Option 2 in Service Menu.

Tool Option 2

- Tuner Num. : Fix No Tuner (Not Adjust)

- EYE : Fix Intelligent Eye Not Action (Not Adjust)

- INDEX : Nothing

- RGB ONLY : Select the RGB Only Model

- Full : Set the ARC Full

- HDMI Type : Fix HDMI : 1-HDMI (Not Adjust)

The OSD is displayed when 'OK' Key is pressed on System

Control 1 in Service Menu.

System Control 1

- SpritZoom / Save sprilt Zoom : Nothing

- 2 Hour Off opt. :

If no key input is made for 2 hours, Sets the Power off

- OSD Rotate : Nothing

- Favorite Key / Exit Key / Navigation Key : Remot conntroller Key

(Not adjust)

- 15 -

LGE Internal Use Only

System Control 2

System 4-SYS

OverScan 5%

RS-232 Host PC

Baud Rate 9600bps

RS-232 Select New

AGC-L 253 140

Audio Delay 0

BlkLine Detector

BlkLine Min. 10

BlkLine Max 70

BlkLine Gap. 20

Full Time 8

Original Time 2

Panel Control

AV / P C AV

ISM Auto

Gamma 0

Pwr. Save 75%

Bright 63%

Pnl.Lock Lock

OrbitPixel 2

Orbit Step 2

OrbitTime 120 Sec.

Inv.Time 30 Min

GUC 0

AMSE 0

Module Download 0

Reset Panel Used Time

The OSD is displayed when 'OK' Key is pressed on BlkLine

Detector in Service Menu.

BlkLine Detector

- BlkLine Min : Sets the BlkLine Min

- BlkLine Max : Sets the BlkLine Max

- Full Time : Sets the Full time

- Original Time : Sets the Original time

The OSD is displayed when 'OK' Key is pressed on System

Control 2 in Service Menu.

System Control 2

- System : Sets the Color system mode

- OverScan : Sets the Video Signal OverScan

- RS-232 Host : Nothing

- Baud Rate : Sets the RS-232 communication speed

- RS-232 Select : Select the RS-232 communication

- AGC-L : Nothing

- Audio Delay : Sets the Audio Delay(ms)

The OSD is displayed when 'OK' Key is pressed on Panel Control in Service Menu.

Panel Control

- AV / PC : Nothing

- ISM : Nothing

- Gamma : Nothing

- Pwr.Save : Nothing

- Bright : Nothing

- Pnl.Lock : Nothing

- OrbitPixel : Sets the Pixel

- Orbit Step : Sets the Step

- Orbit Time : Sets the Time

- Inv.Time : Sets the inversion time

- GUC : Nothing

- AMSE : Nothing

- Module Download : Nothing

- Reset Panel Used Time : Reset the Panel Use Time

+ 32 hidden pages

LG FLATRON M3201C, FLATRON M3701C, FLATRON M4201C Service Manual

Specifications and Main Features

Frequently Asked Questions

User Manual