LG Flatron M3200C, Flatron M4200C-SAC, Flatron M4200C-BAC, Flatron M4200C-BAPC, Flatron M4200C-BATC Service Manual

...

COLOR MONIT OR

SER VICE MANUAL

Website:http://biz.LGservice.com

E-mail:http://www.LGEservice.com/techsup.html

CAUTION

BEFORE SERVICING THE UNIT, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CHASSIS NO. : CL-70

MODEL: M3200C (M3200C-SAFC.AL**LF)

M3200C (M3200C-BAFC.AL**LF) M3200C (M3200C-BAC.AL**LF)

( ) **Same model for Service

1. LCD CHARACTERISTICS

Type : TFT Color LCD Module Active Display Area : 31.51 inches(800.4mm) diagonal Pixel Pitch : 170.25 (H) x 510.75 (V) x RGB Color Depth : 8bits, 16,777,216 colors Electrical Interface : LVDS Size : 760(H) x 450(D) x 48(D) Surface Treatment : Anti-Glare, Hard Coating(3H) Operating Mode : Normally Black Backlight Unit : 20EEFL (20lamps)

2. OPTICAL CHARACTERISTICS

2-1. Viewing Angle by Contrast Ratio ≥ 10 Left : -85° min., -88°(Typ) Right : +85° min., +88°(Typ) Top : +85° min., +88°(Typ) Bottom : -85° min., -88°(Typ)

2-2. Luminance : 400(min), 500(Typ) 2-3. Contrast Ratio : 400(min), 600(Typ)

3. SIGNAL (Refer to the Timing Chart)

3-1. PC & Video Input

1)Signal Input : S-video,RCA, Component

2)Input Form : D-SUB Analog, DVI, V1(CVBS) V2(SVHS), DVD(YCbCr), HDTV(YPbPr), TV-NTSC(Opion)

3)Resolution(max) : Analog -1600 x 1200@60Hz

Digital -1280 x 1024@60Hz

3-2. Sync Input

Horizontal : 30 ~ 83kHz(Digital: 30~72kHz) Vertical : 56 ~ 85Hz Input Form : Separate, TTL,

Positive/Negative Digital

4. SPECIAL FUNCTION

4-1. Audio

1)Output Rating : 10W + 10W(Rated Output ± 10%)

2)Freq. Character : 100Hz~10KHz Range(-3dB)

3)T. H. D : Within 10%

4)Input Sensitivity : 0.700Vrms

4-2. Speaker

1)TYPE : Detachable

2)Impedance : 8Ϊ

3)Input : Max : 15W, Normal : 10W

4-2. AV

1)Video Level : Input : 0.7 ± 0.15Vp-p

2)Sync Level : Input : 0.286 ± 0.075Vp-p

3)Color Burst : Input : 0.214 ± 0.072Vp-p

4)Audio Level : NTSC Input : 0.40 ± 0.1Vrms PAL Input : 0.5 ± 0.1Vrms PC Input : 0.7 ± 0.1Vrms

5)Video Cross Talk : 43dB

5. POWER SUPPLY

5-1. Power Adaptor

Input : AC 100~240V, 50/60Hz , 2.8A

5-2. Power Consumption

6. ENVIRONMENT

6-1. Operating Temperature: 10°C~35°C 6-2. Operating Humidity : 10%~80% 6-3. MTBF : 50,000 HRS with 90%

Confidence level

Lamp Life : 50,000 Hours(Min.)

7. DIMENSIONS (with Speaker/Stand)

Width : 803 mm (31.61'') Depth : 99.9 mm (3.93'') Height : 493 mm (19.41'')

8. WEIGHT (with Speaker/Stand)

Net. Weight : 16 kg (35.28 lbs) Gross Weight : 20.9 kg (46.08 lbs)

CONTENTS

SPECIFICATIONS

- 2 -

SPECIFICATIONS ................................................... 2

PRECAUTIONS ....................................................... 3

TIMING CHART ....................................................... 7

BLOCK DIAGRAM ................................................... 9

DESCRIPTION OF BLOCK DIAGRAM...................10

ADJUSTMENT ....................................................... 11

SERVICE OSD ...................................................... 13

TROUBLESHOOTING GUIDE .............................. 14

WIRING DIAGRAM ............................................... 20

EXPLODED VIEW...................................................21

REPLACEMENT PARTS LIST ...............................23

SCHEMATIC DIAGRAM......................................... 34

MODE

POWER ON (NORMAL)

STAND-BY

SUSPEND

DPM OFF

POWER OFF

H/V SYNC

ON/ON OFF/ON ON/OFF

OFF/OFF

POWER CONSUMPTION

less than 160 W

less than 4 W less than 4 W

less than 4 W less than 2 W

LED COLOR

GREEN AMBER AMBER AMBER

OFF

VIDEO ACTIVE

OFF OFF OFF

- 3 -

WARNING FOR THE SAFETY-RELATED COMPONENT.

• There are some special components used in LCD monitor that are important for safety. These parts are

marked on the schematic diagram and the replacement parts list. It is essential that these critical

parts should be replaced with the manufacturer’s specified parts to prevent electric shock, fire or other hazard.

• Do not modify original design without obtaining written permission from manufacturer or you will void the original parts and labor guarantee.

TAKE CARE DURING HANDLING THE LCD MODULE WITH BACKLIGHT UNIT.

• Must mount the module using mounting holes arranged in four corners.

• Do not press on the panel, edge of the frame strongly or electric shock as this will result in damage to the screen.

• Do not scratch or press on the panel with any sharp objects, such as pencil or pen as this may result in damage to the panel.

• Protect the module from the ESD as it may damage the electronic circuit (C-MOS).

• Make certain that treatment person’s body are grounded through wrist band.

• Do not leave the module in high temperature and in areas of high humidity for a long time.

• The module not be exposed to the direct sunlight.

• Avoid contact with water as it may a short circuit within the module.

• If the surface of panel become dirty, please wipe it off with a softmaterial. (Cleaning with a dirty or rough cloth may damage the panel.)

WARNING

BE CAREFUL ELECTRIC SHOCK !

• If you want to replace with the new backlight (CCFL) or inverter circuit, must disconnect the AC adapter because high voltage appears at inverter circuit about 650Vrms.

• Handle with care wires or connectors of the inverter circuit. If the wires are pressed cause short and may burn or take fire.

Leakage Current Hot Check Circuit

PRECAUTION

CAUTION

Please use only a plastic screwdriver to protect yourself from shock hazard during service operation.

1.5 Kohm/10W

To Instrument's exposed METALLIC PARTS

Good Earth Ground such as WATER PIPE, CONDUIT etc.

AC Volt-meter

- 4 -

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this

service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit

board module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical

plug or other electrical connection.

c. Connecting a test substitute in parallel with an

electrolytic capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

d. Discharging the picture tube anode.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Discharge the picture tube anode only by (a) first connecting one end of an insulated clip lead to the degaussing or kine aquadag grounding system shield at the point where the picture tube socket ground lead is connected, and then (b) touch the other end of the insulated clip lead to the picture tube anode button, using an insulating handle to avoid personal contact with high voltage.

4. Do not spray chemicals on or near this receiver or any of its assemblies.

5. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cottontipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required.

6. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

7. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

8. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

9. Use with this receiver only the test fixtures specified in

this service manual.

CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "antistatic" can generate electrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)

- 5 -

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip

temperature within the range or 500。F to 600。F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wire-bristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal

temperature.

(500。F to 600。F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static,

suction-type solder removal device or with solder

braid.

CAUTION: Work quickly to avoid overheating the

circuitboard printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal

temperature (500。F to 600。F)

b. First, hold the soldering iron tip and solder the strand

against the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of

the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any

excess or splashed solder with a small wire-bristle brush.

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

- 6 -

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

TIMING CHART

- 7 -

VIDEO

SYNC

<< Dot Clock (MHz), Horizontal Frequency (kHz), Vertical Frequency (Hz), Horizontal etc... (µs), Vertical etc... (ms) >>

1) PC Mode

※1~17 : D-SUB, DVI-D: 1~15

MODE

H / V

Sync

Polarity

Frequency

Total

Period

( E )

Video

Active

Time ( A )

Front

Porch

( C )

Sync

Duration

( D )

Back

Porch

( F )

Resolution

Dot

Clock

1 H(Pixels) + 25.175 31.469 800 640 16 96 48 640 x 350

V(Lines) - 70.8 449 350 37 2 60

2 H(Pixels) - 28.321 31.468 900 720 18 108 54 720 X 400

V(Lines) + 70.8 449 400 12 2 35

3 H(Pixels) - 25.175 31.469 800 640 16 96 48 640 x 480

V(Lines) - 59.94 525 480 10 2 33

4 H(Pixels) - 31.5 37.5 840 640 16 64 120 640 x 480

V(Lines) - 75 500 480 1 3 16

5 H(Pixels) - 36.0 43.269 832 640 56 56 80 640 x 480

V(Lines) - 85.0 509 480 1 3 25

6 H(Pixels) + 40.0 37.879 1056 800 40 128 88 800 x 600

V(Lines) + 60.317 628 600 1 4 23

7 H(Pixels) + 49.5 46.875 1056 800 16 80 160 800 x 600

V(Lines) + 75.0 625 600 1 3 21

8 H(Pixels) + 56.25 53.674 1048 800 32 64 152 800 x 600

V(Lines) + 85.061 631 600 1 3 27

9 H(Pixels) +/- 57.283 49.725 1152 832 32 64 224 832 x 624

V(Lines) +/- 74.55 667 624 1 3 39

10 H(Pixels) - 65.0 48.363 1344 1024 24 136 160 1024 x 768

V(Lines) - 60.0 806 768 3 6 29

11 H(Pixels) - 78.75 60.123 1312 1024 16 96 176 1024 x 768

V(Lines) - 75.029 800 768 1 3 28

12 H(Pixels) + 94.5 68.68 1376 1024 48 96 208 1024 x 768

V(Lines) + 85.00 808 768 1 3 36

13 H(Pixels) + 74.5 44.772 1664 1280 64 128 192 1280 x 720

V(Lines) + 59.855 748 720 3 5 20

14 H(Pixels) + 84.75 47.72 1776 1360 72 136 208 1360 x 768

V(Lines) + 59.799 798 768 3 5 22

15 H(Pixels) + 108.0 63.981 1688 1280 48 112 248 1280 x 1024

V(Lines) + 60.02 1066 1024 1 3 38

16 H(Pixels) + 135.00 79.98 1688 1280 16 144 248 1280 x 1024

V(Lines) + 75.02 1066 1024 1 3 38

17 H(Pixels) + 162.00 75.00 2160 1600 90 30 88 1600 x 1200

V(Lines) + 60 1250 1200 1 3 46

- 8 -

2) Component Video Mode(Y/Pb/Pr)

MODE

H / V

Sync

Polarity

Frequency

Total

Period

( E )

Video

Active

Time ( A )

Front

Porch

( C )

Sync

Duration

( D )

Back

Porch

( F )

Resolution

Dot

Clock

1 H(Pixels) - 25.175 31.469 800 640 16 96 48 SDTV

V(Lines) - 59.94 525 480 10 2 33 480

2 H(Pixels) - 27.027 31.5 858 720 16 62 60 HDTV

V(Lines) - 60 525 480 10 2 33 720P (HDCP)

3 H(Pixels) - 74.176 44.955 1650 1280 70 40 260 HDTV

V(Lines) - 59.94 750 720 5 5 60 720P (HDCP)

4 H(Pixels) - 74.250 33.750 2200 1920 44 44 192 HDTV

V(Lines) - 60.053 562 540 2 5 15 1080I (HDCP)

5 H(Pixels) - 74.176 33.716 2200 1920 44 44 192 HDTV

V(Lines) - 59.994 562 540 2 5 15 1080I (HDCP)

- 9 -

DVI

RGB1

RGB2

RGB Out

Sound

Component1 In

Component2 In

Component1(2)

Sound

CVBS In

CVBS Out

S-VIDEO

LCD Module

Inverter Assy

Power Assy

RS232 In/Out

Video Signal P rocessor

(U402)

ADC

TMDS

LVD S

128Mb DDR

FRC Memory

(U401)

8Mb

Flash

Memory

(U403)

(480

i ~ 1080i)

(480i/576i)

Comp1

Comp2

S/W

(U201)

(CXA2040AQ)

Y/C

ADC

(U303)

(MST9883C)

4:2:2 (16bit)

Video Decoder

(U801)

(UPD64012)

SDRAM

(U802)

(K4S161622)

De-interlace

(U901)

(MDIN150L)

(K4S643232)

SDRAM (U902)

(M29W800DT)

Audio

Decoder

(U501)

(MSP3420G)

Amp

(U502)

(TPA3004)

(gm1501H-CF-LF)

(HY5DU283222AQ)

Signal Selector

(U121)

RGB

(SOG)

RGB

(SOG)

Low

Distortion

Amp

RGB

(SOG)

TMDS

LVD S

12P Wafer 30P Wafer

Regulator

Power FET Block

4:2:2 (16

bit)

HD-YPbP

CVBS OUT

Y OUT

C OUT

CVBS OUT

CVBS IN

4:2:2

(16bit)

YCbCr

Control Assy

15P W afer

10P W afer 9P Wafer

1.5V/1.8V/2.5V/3.3V/5V/

12V/18V

24V

12P W afer

FAN Assy (42 ”)

Temp

Sensor

(LM35DT)

(U523)

Speaker Assy

4P Wafer

5P Wafer

Logo LED Assy

Left Right

RightLeft

PC Audio

Component

Audio

CVBS

Audio

DTV Audio (Comp1)

DVD Audio (Comp2)

PC Audio

CVBS Audio

SCL

SDA

H/V

SCL

SDA

H/V

SCL

SDA

H/V

SCL

SDA

H/V

SCL

SDA

SCL2/SDA2

SCL/SDA

H/V/CLK

4:2:2

(16bit)

SCL2/SDA2

SCL/SDA

SCL2/SDA2

SCL/SDA

5V/8V

18V

1.8V

2.5V

3.3V

2.5V

3.3V

1.5V/3.3V

3.3V

2.5V/3.3V

3.3V

(BA7657F)

3.3V

(AD8009)

BLOCK DIAGRAM(uPD64011+gm1501H)

- 10 -

DESCRIPTION OF BLOCK DIAGRAM

1. INPUT SELECTION CIRCUIT

1) D-SUB RGB INPUT SELECT : This section is composed of Signal selector IC(BA7657F_U121) and peripheral devices. The BA7657F(U121) IC select RGB1 signal or RGB2 signal and the signal is sent to gm1501H (U402).

2) VIDEO INPUT SELECT : This section is composed of Video switching IC (CXA2040AQ_U201) and peripheral devices. Video switching IC(CXA2040AQ_U201) select CVBS video or S-video and the signal is sent to Video decoder (UPD64012)

3) DVI signal input is directly fed to SCALER, DTV(Component1) signal input is given to Scaler IC(U402) via MST9883C(U303) DVD(Component2) signal input is given to Scaler IC via Video Decoder IC(UPD64012_U801).

2. DDC COTROLLER

This section is composed gm1501H(U402),EEPROM IC (U404, U115, U120) and peripheral devices. gm1501H(U402) is controlling peripheral devices through IIC Line. Major functions of this block are :

(1) Controlling of u-COM and Flash memory through

DDC-SCLA, DDC-SDAA of D-sub connector.

(2) Storage of EDID DATA in the EEPROM(U115,

U120).

3. ANALOG DIGITAL CONVERTER

This section is composed of MST9883C(U303) and peripheral devices. gm1501H(U402) is controlling MST9883C through IIC Line. This IC is converting DTV(YPbPr) signal in to 16 bit Interlace signal and the signal is sent to De-interlace IC(MDIN150L_U901) This output signal have CONTRAST, BRIHTNESS, SHARPNESS, COLOR, TINT information.

3. VIDEO DECODER

This section is composed of UPD64012(U801) and peripheral devices. gm1501H(U402) is controlling UPD64012 through IIC Line. This IC is controlling CVBS input signal ,S-VIDEO(Y/C) input signal and DVD(YCbCr) input signal and converting input signals in to 16 bit interlace signal and the signal is sent to De-interlace IC(U901). This output signal have CONTRAST, BRIHTNESS, SHARPNESS, COLOR, TINT information.

4. DE-INTERLACER

This section is composed of MDIN150L(U901) and peripheral devices. gm1501H(U402) is controlling MDIN150L through IIC Line.

This IC is converting 16bit interlace input signal in to 16bit De-interlace signal and the signal is sent to Video Signal Processor IC(gm1501H_U402).Ä

5. AUDIO DECODER

This section is composed of MSP3420G(U501) and peripheral devices. gm1501H(U402) is controlling MSP3420G through IIC Line. This IC is processing audio signal output of A/V Jack, PC Audio Jack. This IC's output signal is sent to Audio Amplifier IC(TPA3004_U502).

6. AUDIO AMPLIFIER

This section is composed of TPA3004(U502) OR TPA3001(U507) and peripheral devices. Audio Amplifier's function is amplification of sound signal received from Audio Decoder. Input Audio signal is amplified according to the DC Volume control curve.

VIDEO SIGNAL PROCESSOR (FORMAT CONVERTER)

This section is composed of gm1501H(U402) and peripheral devices. gm1501H(SCALER_U402) have in built u-COM in IC. (1) This IC include A/D Converter, Pre-Amp, PLL

Circuit.

(2) This IC include TMDS Receiver and LVDS

Transmitter. TMDS Receiver is decoding input DVI Signal and LVDS Transmitter is encoding the output Signal . also, gm1501H have Format Converter (Scaling) function. This IC convert Various sized Digital signal to LCD Module's resolution (WXGA).

8. DC/DC COVERTER

DC/DC Converters change Power output voltage (DC 5V, 12V, 24V) to 1.5V, 2.5V, 3.3V, 5V, 8V, 9V. (To be used by different IC on the main board.)

9. TEMPERATURE SENSING AND FAN CONTROL

This section is composed of LM35DT(U523), KIA358F(U524) and peripheral devices. The temperature at surface of LM35DT(U523) is sensed and converted to HEX code by KIA358(U524). gm1501H(U402) receives sensing HEX values from KIA358F(U524)and control FAN(42INCH ONLY).

10. POWER SUPPLY BLOCK

Power supply receives AC voltage (100-240 V, 50/60 Hz,) and converts to System voltage that are 5V, 12V, 18V and 24V DC voltage. These voltages supports main board, inverter board and module;s T-con board. This Circuit contains PFC(Power Factor Correction) circuit. The Minimum Power efficiency is about 75%.

- 11 -

ADJUSTMENT

All adjustment are thoroughly checked and corrected when the monitor leaves the factory, but sometimes several minor adjustment may be required. Adjustment should be following procedure and after warming up for a minimum of 30 minutes.

• Alignment appliances and tools.

- IBM compatible PC

- Programmable Signal Generator. (eg. VG-819 made by Astrodesign Co.)

- Oscilloscope.

- White Balance Meter. (CA-110)

1. DDC Data Write Procedure-Analog

1) Use this procedure only when there is some

problem on Analog EDID data.

2) Run alignment program for M3200C on the IBM

compatible PC.

3) Select EEPROM → Analog EDID write command

and Enter.

4) This will write the Analog EDID data to EEPROM.

2. DDC Data Write Procedure-Digital

1) Use this procedure only when there is some problem on Digital EDID data.

2) Run alignment program for M3200C on the IBM compatible PC.

3) Select EEPROM → Digital EDID write command and Enter.

4) This will write the Digital EDID data to EEPROM.

RS-232C

EXT.

220

IBM Compatible PC

Parallel Port

Power inlet (required)

Power LED

ST Switch

Power Select Switch (110V/220V)

Control Line

Not used

RS232C

PARALLEL

V-SYNC

POWER

VGS

MONITOR

V-Sync On/Off Switch (Switch must be ON.)

4.7K

74LS06

OFF ON

OFF

Figure 1. Cable Connection

- 12 -

Windows EDID V1.0 User Manual

Operating System: MS Windows 98, 2000, XP Port Setup: Windows 98 => Don’t need setup

Windows 2000, XP => Need to Port Setup.

This program is available to LCD Monitor only.

1. Port Setup a) Copy “UserPort.sys” file to

“c:\WINNT\system32\drivers” folder

b) Run Userport.exe

c) Remove all default number d) Add 300-3FF

e) Click Start button. f) Click Exit button.

2. EDID Read & Write

1) Run WinEDID.exe

2) Edit Week of Manufacture, Year of Manufacture, Serial Number a) Input User Info Data b) Click “Update” button c) Click “ Write” button

- 13 -

SERVICE OSD

SEREVICE MENU

Model : Elapsed Time 17H

V1.0M3200C

NVram Inatial OFF RS232 Speed 115.2K WB Adjust 0 Aging Mode OFF

Model Select M3200C TV <-> AV AV

Contry Option USA

SEREVICE MENU

Model :

Resolution Auto

Elapsed Time 17H

AI OFF Hotel Mode SET SVC Display SET Video H Position 50 Video V Position 50

Normal

RS232 Select

LG Hotel Mode Set Up

Channel Change YES

Channel Menu Display YES

Input Mode Change YES

100

Volume Limit Fixed V olume YES OSD Display YES

Remocon Operation YES Local Key Operation YES On Monitor Operation

Volume On

Channel On

YES

Auto Off Operation YES

■ Engaging the `in-start' key of the remote control lets you into the Service Menu

■ Description of operation

- Elapsed time : Time used for back light

- Nvram Initial : EEPROM reset

- RS232 Speed : Baud Speed

- WB Adjust : Adjusts the white balance

- Aging Mode : Sets the aging mode

- Model Select : Sets the model name

- TV <-> AV : Sets the TV or AV only Model

- Country Option : Chooses a country

■ Caution

- To use the functions of the existing Special Menu, use Power Off/On.

■ Description of operation

- Resolution : Adjusts the picture resolution

- AI : Function built in panel

- Hotel Mode : Function for a Hotel system manager

- SVC Display : Adjusts the service screen quality

- Video H Position : Adjusts Video H position

- Video V Position : Adjusts Video V position

- RS232 Select : Adjusts RS232 comunication type.

■ The OSD is displayed when Audio Key is pressed on Nvram

Initial in Service Menu.

■ Purpose

- Function :

The setting can be adjusted when the unit is being used in a hotel.

■ Description of operation

- Channel Change :

Enables (Yes)/Disables (No) channel change in the TV source mode.

- Input Source Change : Enables (Yes)/Disables (No) input source change.

- Volume Limit : Sets the maximum volume within the range of 0 ~ 100 when

volume control is allowed.

- Fixed Volume : Sets Yes (Fixed)/No (Variable) about whether the sound volume will be fixed to the current value or not.

- OSD Display : Sets whether the OSD will be displayed (Yes) or not (No).

- Remote Control Operation : Activates (Yes)/Deactivates (No) remote

control operation.

- Local Key Operation : Activates (Yes)/Deactivates (No) local key operation.

- On Monitor Operation : Sets Yes (Operation)/No (No operation) about

whether the channel and the volume level that will be displayed when the power is turned on.

- Channel : Sets Yes (Operation)/No (No operation) about whether the preset channel will be selected or the one memorized last will be selected when the power is turned on. On (Activated) or Off (Deactivated) can be selected.

- Channel Menu Display: Enables (Yes)/Disables (No) entry into the Channel menu on the main OSD.

- Auto Off Operation : Sets whether the automatic turn-off function will be activated or not with On (Activated) or Off (Deactivated) option, which turns off the TV if no key input is made for 2 hours, using Auto Off operation and On Time on the Time menu.

- 14 -

TROUBLESHOOTING GUIDE

1. NO POWER

NO POWER

(POWER INDICATOR OFF)

CHECK POWER BOARD

CHECK J601 VOLTAGE

(18V, 12V, 5V)?

CHECK POWER BOARD

CHECK

J603 VOLTAGE

(12V, 24V) ?

1. KEY PART IC CHECK (U401, U402,U403)

2. CHECK KEY CONTROL BOARD

YES

CHECK X401

CHECK

X401

(14.318MHz) ?

CHECK MICOM(U402)

SUB POWER PORT

CHECK J601

(SUB POWER) ?

+ 30 hidden pages

LG Flatron M3200C, Flatron M4200C-SAC, Flatron M4200C-BAC, Flatron M4200C-BAPC, Flatron M4200C-BATC Service Manual

Specifications and Main Features

Frequently Asked Questions

User Manual