LG Flatron M228WD Service Manual

COLOR MONITOR

SERVICE MANUAL

Website:http://biz.LGservice.com

CAUTION

BEFORE SERVICING THE UNIT, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CHASSIS NO. : LD73D

MODEL: M228WD (M228WD-BZH.A**OLF)

*( ) **Same model for Service

Internal Use Only

- 2 -

LGE Internal Use Only

CONTENTS

CONTENTS .............................................................................................. 2

PRECAUTION ...........................................................................................3

SPECIFICATION ........................................................................................7

DISASSEMBLY........................................................................................12

ADJUSTMENT ........................................................................................14

TROUBLE SHOOTING ............................................................................19

BLOCK DIAGRAM...................................................................................26

EXPLODED VIEW ...................................................................................27

REPLACEMENT PARTS LIST ............................................................... 29

SVC. SHEET ...............................................................................................

- 3 -

LGE Internal Use Only

WARNING FOR THE SAFETY-RELATED COMPONENT.

• There are some special components used in LCD

monitor that are important for safety. These parts are

marked on the schematic diagram and the replacement parts list. It is essential that these critical

parts should be replaced with the manufacturer’s specified parts to prevent electric shock, fire or other hazard.

• Do not modify original design without obtaining written permission from manufacturer or you will void the original parts and labor guarantee.

TAKE CARE DURING HANDLING THE LCD MODULE WITH BACKLIGHT UNIT.

• Must mount the module using mounting holes arranged in four corners.

• Do not press on the panel, edge of the frame strongly or electric shock as this will result in damage to the screen.

• Do not scratch or press on the panel with any sharp objects, such as pencil or pen as this may result in damage to the panel.

• Protect the module from the ESD as it may damage the electronic circuit (C-MOS).

• Make certain that treatment person’s body are grounded through wrist band.

• Do not leave the module in high temperature and in areas of high humidity for a long time.

• The module not be exposed to the direct sunlight.

• Avoid contact with water as it may a short circuit within the module.

• If the surface of panel become dirty, please wipe it off with a softmaterial. (Cleaning with a dirty or rough cloth may damage the panel.)

WARNING

BE CAREFUL ELECTRIC SHOCK !

• If you want to replace with the new backlight (CCFL) or inverter circuit, must disconnect the AC adapter because high voltage appears at inverter circuit about 650Vrms.

• Handle with care wires or connectors of the inverter circuit. If the wires are pressed cause short and may burn or take fire.

Leakage Current Hot Check Circuit

PRECAUTION

CAUTION

Please use only a plastic screwdriver to protect yourself from shock hazard during service operation.

1.5 Kohm/10W

To Instrument's exposed METALLIC PARTS

Good Earth Ground such as WATER PIPE, CONDUIT etc.

AC Volt-meter

- 4 -

LGE Internal Use Only

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this

service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit

board module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical

plug or other electrical connection.

c. Connecting a test substitute in parallel with an

electrolytic capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

d. Discharging the picture tube anode.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Discharge the picture tube anode only by (a) first connecting one end of an insulated clip lead to the degaussing or kine aquadag grounding system shield at the point where the picture tube socket ground lead is connected, and then (b) touch the other end of the insulated clip lead to the picture tube anode button, using an insulating handle to avoid personal contact with high voltage.

4. Do not spray chemicals on or near this receiver or any of its assemblies.

5. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cottontipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required.

6. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

7. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

8. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

9. Use with this receiver only the test fixtures specified in

this service manual.

CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "antistatic" can generate electrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)

- 5 -

LGE Internal Use Only

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip

temperature within the range or 500

F to 600 F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wire-bristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal

temperature. (500

F to 600 F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static,

suction-type solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuitboard printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal

temperature (500

F to 600 F)

b. First, hold the soldering iron tip and solder the strand

against the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of

the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any

excess or splashed solder with a small wire-bristle brush.

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

- 6 -

LGE Internal Use Only

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

- 7 -

LGE Internal Use Only

1. Application range

This specification is applied to 22" Wide Monitor TV used LD73D chassis.

2. Requirement for Test

Each part is tested as below without special appointment.

(1) Power Voltage : Standard input voltage (100~240V@,

50/60Hz)

*Standard Voltage of each products is marked by models.

(2) Specification and performance of each parts are followed

each drawing and specification by part number in accordance with BOM.

(3) The receiver must be operated for about 20 minutes prior

to the adjustment.

3. Test method

3.1 Performance : LGE test method followed

3.2 Demanded other specification Safety : CE, IEC Specification EMC : CE, IEC

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

4-1. General Specification (TV)

4. Electrical Specification

No Item Specification Remark

1 Video input applicable system PAL-D/K, B/G, I, SECAM

2 Receivable Broadcasting System PAL/SECAM BG EU(PAL Market)

PAL/SECAM DK

PAL I/II

SECAM L/L’

DVB-T

3 RF Input Channel VHF : E2 ~ E12 PAL

UHF : E21 ~ E69

CATV : S1 ~ S20

HYPER : S21~ S47

4 Input Voltage 100 ~ 240V/50Hz, 60Hz

5 Market EU

6 Picture Size 22 inch

7 Tuning System FVS 100 program PAL, 200 PR.(Option)

8 Operating Environment Temp : 10

°C ~ 35°C

Humidity : 20% ~ 80%

9 Storage Environment Temp : -10

°C ~ 60°C Non condensing

Humidity : 5% ~ 90% Non condensing

10 Display LCD Module LPL

- 8 -

LGE Internal Use Only

No. Item Specification Remark

1 Supported Sync. Type Separate Sync., Digital

2 Operating Frequency Analog Horizontal 30 ~ 83kHz

Vertical 56 ~ 75 Hz

Digital Horizontal 30 ~ 83kHz

Vertical 56 ~ 75 Hz

3 Resolution Analog Max. 1680 x 1050 @ 60Hz

Recommend 1680 x 1050 @ 60Hz

Digital Max. 1680 x 1050 @ 60Hz

Recommend 1680 x 1050 @ 60Hz

4 Inrush Current Cold Start : 50 A Hot : 120 A

5 Operating Condition Sync (H/V) Video LED Wattage

Power S/W On

On mode

On/On Active Blue 70W Max.

On/On Active Blue 60W Typ.

Sleep mode

Off/On

Off Amber 1W

On/Off

Power S/W Off Off mode - Off Off 1W

6 MTBF 50,000 HRS with 90% Confidence level Lamp Life : 50,000 Hours(min)

7 Using Altitude 5,000 m (for Reliability) 3,000m(for FOS)

4-2. General Specification (PC)

No. Item Specification Unit Remark

1. Type TFT Color LCD Module

2. Active Display area 473.76 (H) x 296.1 (V) mm

3. Outline dimension 493.7 (H) x 320.1 (V) x16.5 (D) mm Typ

4. Pixel pitch 0.282mm (H) x 0.282mm (V) x RGB mm

5. Color arrangement RGB vertical stripe

6. Color Depth 16.7M color

7. Electrical Interface LVDS

8. Surface Treatment Hard coating(3H) & Anti-glare(Haze 25)

9. Operating Mode Normally White

10. Back light Unit 4 CCFL (4 lamps)

11. R/T R.T : 1.3ms + R.T : 3.7ms Typ.

4-3. General Specification (LCD Module)

- 9 -

LGE Internal Use Only

4-4. Optical characteristic specifications

No. Item Specification Remark

Min Typ Max

1 Viewing Angle R/L 70/70 80/80

<CR>10> U/D 60/70 75/85

2 Luminance

RGB 250 300

PSM:Dynamic, CSM: 6500K

Luminance Full White(100 IRE)

(cd/m

) AV/TV/HDMI

190 250

PSM:Dynamic, CSM:Cool

Component Full White(100 IRE)

Variation 75% Min / Max

RGB/AV/

At DFC Mode

3 Contrast Ratio CR TV/HDMI/ 500 800

Typ. 3000 :1, Min. 2400:1

Component

4 CIE Color Coordinates WHITE Wx 0.313

Wy 0.329 In RGB input

RED Rx 0.635

Ry 0.342 PSM : Dynamic

GREEN Gx 0.292 CSM : 6500K

Gy 0.611 White

BLUE Bx 0.147 (100 IRE)

By 0.070

WHITE Wx 0.285

In AV/Component/TV HDMI input

Wy 0.293

PSM:Dynamic, CSM:Cool, White (85IRE)

Typ.

+0.015

Typ.

+0.015

Typ.

-0.015

Typ.

-0.015

5. Component Video Input (Y, PB, PR)

Specification

Proposed

Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz)

1. 720*480 15.73 59.94 13.500 480i

2. 720*480 15.75 60.00 13.514 480i

3. 720*576 15.625 50.00 13.500 576i

4. 720*480 31.47 59.94 27.000 480p

5. 720*480 31.50 60.00 27.027 480p

6. 720*576 31.25 50.00 27.000 576p

7. 1280*720 44.96 59.94 74.176 720p

8. 1280*720 45.00 60.00 74.250 720p

9. 1280*720 37.50 50.00 74.250 720p

10. 1920*1080 33.72 59.94 74.176 1080i

11. 1920*1080 33.75 60.00 74.250 1080i

12. 1920*1080 28.125 50.00 74.250 1080i

13. 1920*1080 67.50 60.00 74.250 1080p

- 10 -

LGE Internal Use Only

6. RGB PC

* RGB-PC EDID DATA

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz)

1. 720*400 31.468 70.08 28.321

2. 640*480 31.469 59.94 25.175

3. 640*480 37.5 75 31.5

4. 800*600 37.879 60.317 40.0

5. 800*600 46.875 75.0 49.5

6. 1024*768 48.363 60.0 65.0

7. 1024*768 60.123 75.029 78.75

8. 1152*864 67.500 75.000 108.0

9. 1280*1024 63.981 60.02 108.0

10. 1280*1024 79.976 75.035 135.0

11. 1680*1050 64.674 59.883 119.0

12. 1680*1050 65.290 59.954 146.25

0x00 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0A 0x0B 0x0C 0x0D 0x0E 0x0F

0x00 00 FF FF FF FF FF FF 00 1E 6D 70 56

0x01 01 03 08 2F 1E 78 EA AE C5 A2 57 4A 9C 25

0x02 12 50 54 A7 6B 80 95 0F 95 00 81 80 81 40 71 4F

0x03 01 01 01 01 01 01 7C 2E 90 A0 60 1A 1E 40 30 20

0x04 36 00 D9 28 11 00 00 1A 21 39 90 30 62 1A 27 40

0x05 68 B0 36 00 D9 28 11 00 00 1C 00 00 00 FD 00 38

0x06 4B 1E 53 0F 00 0A 20 20 20 20 20 20 00 00 00 FC

0x07 00 4D 32 32 38 57 44 2D 42 5A 0A 20 20 20 00

Serial No

Month/Year

C/S

- HDMI DTV TABLE

7. HDMI

No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Remark Proposed

1. 720 x 480 31.47 59.94 27.00 SDTV 480p 60Hz(4:3)

2. 720 x 480 31.50 60 27.027 SDTV 480p 60Hz(4:3)

3. 640 x 480 31.50 59.94 25.175 SDTV 480p 60Hz(4:3)

4. 640 x 480 31.50 60 25.20 SDTV 480p 60Hz(4:3)

5. 720 x 480 31.47 59.94 27.00 SDTV 480p 60Hz(16:9)

6. 720 x 480 31.47 60 27.027 SDTV 480p 60Hz(16:9)

7. 720 x 576 31.25 50.00 27.000 SDTV 576p 50Hz

8. 1280 x 720 45.00 50.00 74.176 HDTV 720p 50Hz HDCP

9. 1280 x 720 44.96 59.94 74.176 HDTV 720p 60Hz HDCP

10. 1280 x 720 44.96 60 74.250 HDTV 720p 60Hz HDCP

11. 1920 x 1080 28.13 50.00 74.250 HDTV 1080i 50Hz HDCP

12. 1920 x 1080 33.72 59.94 74.176 HDTV 1080i 60Hz HDCP

13. 1920 x 1080 33.75 60 74.250 HDTV 1080i 60Hz HDCP

14. 1920 x 1080 27 24 74.250 HDTV 1080P 24Hz HDCP

15. 1920 x 1080 56.25 50.00 148.500 HDTV 1080P 50Hz HDCP

16. 1920 x 1080 67.43 59.94 148.352 HDTV 1080P 60Hz HDCP

17. 1920 x 1080 67.50 60 148.500 HDTV 1080P 60Hz HDCP

- 11 -

LGE Internal Use Only

- HDMI PC TABLE

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz)

1. 720*400 31.468 70.08 28.321

2. 640*480 31.469 59.94 25.175

3. 640*480 37.5 75 31.5

4. 800*600 37.879 60.317 40.0

5. 800*600 46.875 75.0 49.5

6. 1024*768 48.363 60.0 65.0

7. 1024*768 60.123 75.029 78.75

8. 1152*864 67.500 75.000 108.0

9. 1280*1024 63.981 60.02 108.0

10. 1280*1024 79.976 75.035 135.0

11. 1680*1050 64.674 59.883 119.0

12. 1680*1050 65.290 59.954 146.25

0x00 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0A 0x0B 0x0C 0x0D 0x0E 0x0F

0x00 00 FF FF FF FF FF FF 00 1E 6D 71 56

0x01 01 03 80 2F 1E 78 0A AE C5 A2 57 4A 9C 25

0x02 12 50 54 A7 6B 80 71 4F 81 80 81 40 01 01 01 01

0x03 01 01 01 01 01 01 7C 2E 90 A0 60 1A 1E 40 30 20

0x04 36 00 D9 0A 11 00 00 1A 21 39 90 30 62 1A 27 40

0x05 68 B0 36 00 D9 0A 11 00 00 1C 00 00 00 FD 00 38

0x06 4B 1E 53 0F 00 0A 20 20 20 20 20 20 00 00 00 FC

0x07 00 4D 32 32 38 57 44 2D 42 5A 0A 20 20 20 01

0x00 02 03 21 F1 4E 81 02 03 15 12 13 04 14 05 20 21

0x01 22 1F 10 23 09 07 07 83 01 00 00 65 03 0C 00 10

0x02 00 01 1D 00 80 51 D0 1C 20 40 80 35 00 BC 88 21

0x03 00 00 1E 8C 0A D0 8A 20 E0 2D 10 10 3E 96 00 13

0x04 8E 21 00 00 18 02 3A 80 18 71 38 2D 40 58 2C 45

0x05 00 06 44 21 00 00 1E 01 1D 80 18 71 1C 16 20 58

0x06 2C 25 00 C4 8E 21 00 00 9E 4E 1F 00 80 51 00 1E

0x07 30 40 80 37 00 BC 88 21 00 00 18 00 00 00 00

Serial No

Month/Year

C/S

* HDMI EDID DATA

DISASSEMBLY

- 12 -

LGE Internal Use Only

1. Push down slightly to disassembly it.

2. After push the cable management like above fig.(Downward),

Disassembly the Cable management with pulling it upward.

3. Disassembly Cable Holder.

Disassembly Stand base.

Remove base body Like a picture.

Push 2 letches Like a picture.

Push the button.

Hold the stand base.

# 1

# 4

# 2

# 5

# 3

# 6

- 13 -

LGE Internal Use Only

# 7

# 9

# 8

# 10

Pull base body to separate from set during pressing 2 letches.

Remove the screws.

# 11

Pull the connector.

Disassembly back cover.

1. Remove the screws.

2. Disassembly Hinge Cover.

- 14 -

LGE Internal Use Only

ADJUSTMENT

1. Application Range

This document is applied to 22" LCD Monitor TV which is manufactured in TV(or Monitor) Factory or is produced on the basis of this data.

2. Specification.

1) Because this is not a hot chassis, it is not necessary to use an isolation transformer. However, the use of isolation transformer will help to protect test instruments

2) Adjustment must be done in the correct sequence.

3) The adjustment must be performed at 25±5°C temperature and 65±10% relative humidity if there is no specified designation.

4) The input voltage of the receiver must be kept between 100-220V~, 50/60Hz.

5) Before adjustment, execute Heat-Run for 30 minutes at RF no signal.

3. Channel Memory

3.1. Setting up the LGIDS

1) Press ADJ key in Adjust remote control.

2) Select “Channel Recover” by using

D /E (CH+/-) key, and

press

G (VOL+).

3) When Channel Recover is completed, set will be turned off and LED light go to stand-by mode.

4. EDID

* Caution

* Use the proper signal cable for EDID Download

- Analog EDID : Pin3 exists

- Digital EDID : Pin3 exists

-> Caution : - Never connect HDMI & D-sub Cable at the

same time. Use the proper cables below for EDID Writing.

4.1. EDID Data

4.2. Data

(1) ANALOG (128 bytes)

(2) HDMI 1 (256 bytes)

=> Detail EDID Options are below (a, b, c, d, e-1, e-2)

(a) Product ID (b) Serial No: Controlled on production line. (c) Month, Year: Controlled on production line:

ex) Monthly : ‘08’ -> ‘08’

Year : ‘2007’ -> ‘11’ (d) Model Name(Hex): (e-1, e-2, f) Checksum

5. Substrate ADC Calibration

5.1. ADC Calibration Mode

(1) Adjustment of RF / AV

Model : 202 / Pattern : 65

(2) Adjustment of Component

Model : 215 / Pattern : 65

D-sub to D-sub

DVI-D to HDMI or HDMI or HDMI

For HDMI EDID

For Analog EDID

No Item Content 16bit Data

1 Manufacturer ID GSM 1E6D 2 Product ID 22128(Analog) 5670

22129(HDMI) 5671 3 Year 2007 11 4 Version Analog : 1 01

Digital : 1

5 Revision Analog : 3

Digital : 3 03

6 Model Name M228WD-BZ

0x00 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0A 0x0B 0x0C 0x0D 0x0E 0x0F

0x00 00 FF FF FF FF FF FF 00 1E 6D

0x01 01 03 08 2F 1E 78 EA AE C5 A2 57 4A 9C 25

0x02 12 50 54 A7 6B 80 95 0F 95 00 81 80 81 40 71 4F

0x03 01 01 01 01 01 01 7C 2E 90 A0 60 1A 1E 40 30 20

0x04 36 00 D9 28 11 00 00 1A 21 39 90 30 62 1A 27 40

0x05 68 B0 36 00 D9 28 11 00 00 1C 00 00 00 FD 00 38

0x06 4B 1E 53 0F 00 0A 20 20 20 20 20 20 00 00 00 FC

0x07 00 4D 32 32 38 57 44 20 42 5A 0A 20 20 20 00

-1

0x00 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0A 0x0B 0x0C 0x0D 0x0E 0x0F

0x00 00 FF FF FF FF FF FF 00 1E 6D

0x01 01 03 80 2F 1E 78 0A AE C5 A2 57 4A 9C 25

0x02 12 50 54 A7 6B 80 71 4F 81 80 81 40 01 01 01 01

0x03 01 01 01 01 01 01 7C 2E 90 A0 60 1A 1E 40 30 20

0x04 36 00 D9 0A 11 00 00 1A 21 39 90 30 62 1A 27 40

0x05 68 B0 36 00 D9 0A 11 00 00 1C 00 00 00 FD 00 38

0x06 4B 1E 53 0F 00 0A 20 20 20 20 20 20 00 00 00 FC

0x07 00 4D 32 32 38 57 44 2D 42 5A 0A 20 20 20 01

0x00 02 03 21 F1 4E 81 02 03 15 12 13 04 14 05 20 21

0x01 22 1F 10 23 09 07 07 83 01 00 00 65 03 0C 00 10

0x02 00 01 1D 00 80 51 D0 1C 20 40 80 35 00 BC 88 21

0x03 00 00 1E 8C 0A D0 8A 20 E0 2D 10 10 3E 96 00 13

0x04 8E 21 00 00 18 02 3A 80 18 71 38 2D 40 58 2C 45

0x05 00 06 44 21 00 00 1E 01 1D 80 18 71 1C 16 20 58

0x06 2C 25 00 C4 8E 21 00 00 9E 4E 1F 00 80 51 00 1E

0x07 30 40 80 37 00 BC 88 21 00 00 18 00 00 00 00

- 15 -

LGE Internal Use Only

(3) Adjustment of RGB

Model : 3 / Pattern : 65

6. ADC Calibration (The case where does not become Substrate ADC Calibration)

6.1. Adjustment of RF/AV

* Required Equipments

- Remote controller for adjustment

- MSPG-925FS Pattern Generator (Which has Video Signal : 7 Color Bar Pattern shown in Fig. 1)

=> Model: 202 / Pattern: 65

(1) Method of Auto RF/AV Color Balance.(PAL_BGDHI)

1) Input the Video Signal : 7 Color Bar signal into AV1 or

AV2.

2) Set the PSM to Dynamic mode in the Picture menu.

[Fig.1]

3) Press IN-START key on R/C for adjustment.

4) Press the

G (Vol.+) key to operate the set, then it

becomes automatically.

5) Auto-RGB OK means the adjustment is completed.

6.2. Adjustment of Component

* Required Equipments

- Remote controller for adjustment

- MSPG-925FS Pattern Generator (Which has 720p/50Hz YPbPr output Pattern shown in Fig.2)

=> Model : 215 / Pattern : 65

(1) Method of Auto Component Color Balance

1) Input the Component 720p/50Hz 7 Color Bar(MSPG-

925FS model : 215, pattern : 65) signal into Component.

2) Set the PSM to Dynamic mode in the Picture menu

[Fig.2]

3) Press the IN-START key on R/C for adjustment.

4) Press the

G (Vol.+) key to operate the set , then it

becomes automatically.

5) Auto-RGB OK means the adjustment is completed.

6.3 Adjustment of RGB

* Required Equipments

- Remote controller for adjustment

- MSPG-925F Pattern Generator (Which has XGA [1024*768] 60Hz 8 Color Bar 100%

pattern shown in Fig.3)

(1) Method of Auto RGB Color Balance

1) Input the PC 1024x768@60Hz 7 Color Bar (MSPG-925F

model : 60, pattern : 65) signal into RGB (Using D-sub to D-sub cable)

2) Set the PSM to Dynamic mode in Picture menu.

3) Press the IN-START key on R/C for adjustment

[Fig.3]

4) Press the G (Vol.+) key operate To set , then it becomes

automatically.

5) Auto-RGB OK means adjustment is completed.

* Before adjusting White-balance, the AV ADC should be

done.

- 16 -

LGE Internal Use Only

7. White Balance

* Test Equipment

Color Analyzer (CA-210/CH.9)

-> When you adjust LCD color temperature, on Color analyzer (CA-210), you should use Channel 9 which is Matrix compensated (White, Red, Green, Blue revised) by CS-1000 and adjust in accordance with White balance adjustment coordinate which is specified on the next.

* Color temperature standards according to CSM and Module

Cool : 9,300k Medium : 8,000k Warm : 6,500k

* White balance adjustment coordinate and color temperature

- PC (for communication through RS-232C)

-> UART Baud rate : 115200 bps

- Luminance Y AV : upper 100 cd/m

(Typ : 250 cd/m2)

-> Applying to Cool, Medium, Warm mode

* Connecting picture of the measuring instrument (On

Automatic control ) Inside PATTERN is used when W/B is controlled. Connect to auto controller or push control R/C IN-START

-> Enter the mode of White-Balance, the pattern will come out.

* Auto adjustment Map (RS-232C)

* Auto-control interface and directions

1) Adjust in the place where the influx of light like floodlight around is blocked. (illumination is less than 10ux).

2) Adhere closely the Color Analyzer ( CA-210 ) to the module less than 10cm distance, keep it with the surface of the Module and Color Analyzer’s Prove vertically.(80~100°).

3) Aging time

- After aging start, keep the power on (no suspension of

power supply) and heat-run over 15 minutes.

- Using ‘no signal’ or ‘full white pattern’ or the others,

check the back light on.

7.1. Auto white Balance (Set:RS-232, Host:PC, Baud Rate:115200bps, Download:Cortez)

- Inside pattern is used when balance is controlled. Connect as below figure and click the start button on W/B execution program. W/B is automatically processing Cool -> Medium -> Warm in order.

When W/B is completed, you can see ‘OK’ on PC monitor.

7.2. Manual white Balance

- One of R Gain / G Gain / B Gain should be kept on 80, and others are controlled lowering from 80

1) Press ‘power on’ of the control R/C, set heat run to white by

pressing

G , and heat run over 15 minutes. (Set : RS-233

Host : PC, Baud Rate : 115200bps, Download : Cortez)

2) Zero Calibrate CA-210, and when controlling, stick the

sensor to the center of LCD module surface.

3) Double click In-start key on Controlling R/C and get in

‘white balance’.

Cool CS-1000 CA-210(CH 9)

x 0.285 0.285±0.002 y 0.293 0.293±0.002

∆uv 0.000 0.000

Medium CS-1000 CA-210(CH 9)

x 0.295 0.295±0.002 y 0.305 0.305±0.002

∆uv 0.000 0.000

Warm CS-1000 CA-210(CH 9)

x 0.313 0.313±0.002 y 0.329 0.329±0.002

∆uv 0.004 0.004

<Fig. 2> Connecting picture (On Automatic Control)

Type LD73B

Baud Rate Data bit Stop bit Parity

115200 8 1 None

Index Cmd 1 Cmd 2 Data Min Value Max Value

R-Gain_Normal j a 00(00) 128(80)

G-Gain_Normal j b 00(00) 128(80)

B-Gain_Normal j c 00(00) 128(80)

R-Gain_Warm j d 00(00) 128(80)

G-Gain_Warm j e 00(00) 128(80)

B-Gain_Warm j f 00(00) 128(80)

R-Gain_Cool j g 00(00) 128(80)

G-Gain_Cool j h 00(00) 128(80)

B-Gain_Cool j i 00(00) 128(80)

R-Offset_Normal l j 00(00) 128(80)

G-Offset_Normal l k 00(00) 128(80)

B-Offset_Normal l l 00(00) 128(80)

R-Offset_Warm l m 00(00) 128(80)

G-Offset_Warm l n 00(00) 128(80)

B-Offset_Warm l o 00(00) 128(80)

R-Offset_Cool l p 00(00) 128(80)

G-Offset_Cool l q 00(00) 128(80)

B-Offset_Cool l r 00(00) 128(80)

Internal Pattern signal w b 00 Starting W/B ADJ

Internal Pattern signal w b 10 Using internal Pattern

Internal Pattern signal w b ff Ending W/B ADJ

- 17 -

LGE Internal Use Only

4) Set test-pattern on and display inside pattern. Control is carried out on three color temperature, COOL, MEDIUM, WARM. (Control is carried out three times.)

5) When the R/G/B GAIN is 80 on OSD, it is the FULL DYNAMIC Range of the Module. In order to control white balance without the saturation of FULL DYNAMIC Range and DATA, one of R Gain / G Gain / B Gain should be kept on 80, and other two is controlled lowering from 80.

* Color Temperature : Cool, Medium, Warm

1) When R GAIN is set to 80

- Control G GAIN and B GAIN by lowering from 80.

2) When B GAIN is set to 80

- Control R GAIN and G GAIN by lowering from 80.

3) When G GAIN is set to 80

- Control R GAIN and B GAIN by lowering from 80. One of R Gain / G Gain / B Gain should be kept on 80, and adjust other two lower than 80. (When R/G/B GAIN are all 80, it is the FULL DYNAMIC Range of Module)

8. Set information(Serial No & Model name)

(1) Setting up like bottom figure (After setting white balance,

this is set) (Press ADJ Key in the Adjust remocon.)

- Select “System Control 2” by using

D /E (CH+/-) key, and

press

A (ENTER).

Using Adjust remocon, RS-232 Host & Baud Rate &

Download value change (RS-232 Host : PC, Baud Rate:115200bps, Download:Cortez)

(2) Bar-code scanning

1) Push the menu button in DTV mode. Select the STATION -> Diagnostics -> To set

2) Check the Serial Number.

System Control 2

System 4-SYS Spread En On RS-232 Host PC Baud rate 115200bps Download Cortez AGC-L 0 140 Audio Delay 0 DVI EQ 2 EQ Gain OFF 10% Dimming OFF

LD73D Cortez 2.00 Sti 5100 4.17 UTT 0

-----------------------------------------Tool Option 1 196 Tool Option 2 65 Area Option 3 0 OPTION 1 14

2 1

OPTION 2 OPTION 3 OPTION 4 192 System Control 1

System Control 2

System Control 3 BlkLine Detector Power-off History Panel Control Fan Control Channel Recover

- 18 -

LGE Internal Use Only

Windows EDID V1.0 User Manual

Operating System: MS Windows 98, 2000, XP Port Setup: Windows 98 => Don’t need setup

Windows 2000, XP => Need to Port Setup.

This program is available to LCD Monitor only.

1. Port Setup a) Copy “UserPort.sys” file to

“c:\WINNT\system32\drivers” folder

b) Run Userport.exe

c) Remove all default number d) Add 300-3FF

e) Click Start button. f) Click Exit button.

2. EDID Read & Write

1) Run WinEDID.exe

2) Edit Week of Manufacture, Year of Manufacture, Serial Number a) Input User Info Data b) Click “Update” button c) Click “ Write” button

- 19 -

LGE Internal Use Only

TROUBLESHOOTING

1. Power Board

1-1. The full flowchart for the voltage output

Start check

Manufacture’s model

passage

1. Check the Power Off status.

Does the whole screen appear?

Is it

identical to when the

power is off?

Yes

2. Check the Interface signal status.

Is the Interface

signal operating?

Yes

3. Check the St-by 5V signal circuit.

Does the

low pressure output

appear?

Does the

St-by 5V signal

appear?

Yes

4. Check the 5V Monitor signal circuit.

Does the

5V Monitor signal

appear?

7. Check the VSC Vs-ON signal

Does the

high tension output

appear?

Does the

VSC signal Vs-ON

appear?

Does the

high tension

output voltage

occur?

When

removing the Y B/D

Module input connector,

does output voltage

drop?

When the

Y, Z B/D Module

input connector, does Power

Board high tension

output voltage drop?

No No No

9. Check the Power Board Output high

tension circuit

Yes

10. Check the Z B/D

Module output circuit

Yes

When

removing the Z B/D

Module input connector,

does output voltage

drop?

11. Check the Y B/D Module output circuit

Yes

8. Check the Vs, Va

voltage output circuit.

Does the

Vs, Va voltage output

appear?

Yes

5. Check the VSC RL-ON signal.

Does the

VSC signal RL-ON

appear?

6. Check the VSC low pressure output

Does the

VSC low pressure

output appear?

+ 44 hidden pages

LG Flatron M228WD Service Manual

Specifications and Main Features

Frequently Asked Questions

User Manual