LG B1200 Schematics

5. TEST POINT DATA

- 35 -

5. TEST POINT DATA

Component Side (1-1)

9

10

6

4

1

2

3

5

7

8

11

12

13

16

15

14

5. TEST POINT DATA

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Location Component Side (1-1)

1 J103 Battery connector : For damage or cold soldering cause power on failure

2 Q101 P-channel MOSFET with schottky diode : For damage or cold soldering cause

charger function failure

3 U202 Nausica_CS : analog baseband chipset (ABB)

4 U201 Hercrom20 : digital baseband chipset (DBB)

5 U301 16Mbit flash ROM : For damage or cold soldering cause power on failure

6 U101 3V, 200mA LDO regulator : For damage or cold soldering cause accessory power

failure.

7 Q301 Isolated dual transistors : For damage or cold soldering Q301A cause vibration

motor Failure, Q301B cause keypad back-light failure

8 Q302 Isolated dual transistors : For damage or cold soldering Q302A cause pre-charger

indication failure, Q302B cause the LCD back-light failure

9 J301 Vibration motor : For damage or bad connection cause vibrator failure.

10 J104 System connector : For damage or cold soldering cause headset failure, trace/debug

/SW download failure

11 J102 SIM connector : For damage or bad connection cause SIM card failure.

12 U302 Audio amplifier : For damage cause speaker function failure.

13 Y201 32.768kHz crystal : For damage cause RTC function failure.

14 R104 8P4R resistor network : For damage or cold soldering cause trace/debug

R105 /SW download failure
R109

15 D313 Switching diode array : For damage or cold soldering cause the surge noise by

Vibrator

16 D102 Switching diode array : For damage or cold soldering cause the flash fast program

function failure