Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check(See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explosion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging
wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
5.2.1. 3D Supported mode (Only for models that support 3D)
Video, which is input as below media contents is switched into the 3D screen automatically.
The method for 3D digital broadcast may differ depending on the signal environment.
If video is not switched automatically into 3D, manually convert the settings to view 3D images.
For models supporting Miracast / Intel® WiDi, you can set the 3D mode
InputSignalHorizontal Frequency
HDMI480p31.469 / 31.559.94/ 60Top & Bottom, Side by Side(Half),
62.938 / 63Frame Packing, Line Alternative
720p44.96 / 4559.94 / 60Top & Bottom, Side by Side(Half),
89.91 / 90Frame Packing, Line Alternative
1080i33.72 / 33.7559.94 / 60Top & Bottom, Side by Side(Half),
67.432 / 67.5Frame Packing, Line Alternative
1080p26.97 / 2723.97 / 24Top & Bottom, Side by Side(Half),
28.12525
33.716/33.7529.976 / 30
43.94 / 5423.97 / 24Frame Packing, Line Alternative
56.2525
67.432 / 67.529.976 / 30
67.432 / 67.559.94 / 60Top & Bottom, Side by Side(Half)
DTVFrame
Compatible
--Side by Side(Half), Top & Bottom
(kHz)
Vertical Frequency (Hz)Playable 3D video format
Side by Side(Full)
Side by Side(Full)
Side by Side(Full)
Side by Side(Full)
5.2.2. 3D Supported mode manually(Only for models that support 3D)
Video, which is input as below media contents is switched into the 3D screen automatically.
Signal
Input
DTVHD / SD--2D to 3D, Side by Side(Half), Top & Bottom
This spec. sheet applies to LA48V Chassis applied LED TV all
models manufactured in TV factory
2. Specification.
(1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument
(2) Adjustment must be done in the correct order.
(3) The adjustment must be performed in the circumstance of
25 ±5ºC of temperature and 65±10% of relative humidity if
there is no specific designation
(4) The input voltage of the receiver must keep 100~240V,
50/60Hz
(5) The receiver must be operated for about 5 minutes prior to
the adjustment when module is in the circumstance of over
15ºC
▪ In case of keeping module is in the circumstance of 0°C, it
should be placed in the circumstance of above 15°C for 2
hours
▪ In case of keeping module is in the circumstance of below
-20°C, it should be placed in the circumstance of above 15°C
for 3 hours
* Caution) When still image is displayed for a period of 20
minutes or longer (especially where W/B scale is
strong. Digital pattern 13ch and/or Cross hatch
pattern 09ch), there can some afterimage in the
black level area.
3. Adjustment items
3.1. PCB assembly adjustment items
1) MAC Address, ESN Key and Wide-vine Key D/L
2) LAN Test( Ping-Test )
3) Main S/W program download : Using USB Memory stick
4) Input Tool - Option
5) Download EDID
6) ADC Calibration – RGB & Component
7) Check SW Version
4. PCB assembly adjustment method
4.1. ADC Calibration : component using internal pattern
- An ADC calibration is needed to fine the optimum black level
and gain in Analog-to-Digital device
Recommend that don’t connect HDMI and RGB(D-SUB) cable
when downloading the EDID.
If not possible, recommend that connect the MSPG equipment.
There are two methods of downloading the edid data
It is a VESA regulation. A PC or a MNT will display an optimal
resolution through information
Sharing without any necessity of user input. It is a realization
of “Plug and Play”
4.5.1. 1st Method
EDID data’s are automatically downloaded when adjusting the
Tool Options.
Automatically downloaded when pushing the enter key in the
EDID D/L menu.
It takes about 2seconds
4.5.2. 2st Method
=> Caution : Must be checked that the tool option is right or
not. If tool option is wrong, HDMI edid data could
not be downloaded well.
1) Press the ADJ key
2) Move to the 13. EDID D/L and Press the right direction
key(►)
3) Press the right direction key(►) at Start.
4) After about a few seconds, appear “Waiting..” => “OK”, then
complete.
ⓐ Product ID
ⓑ Serial No: Controlled on production line.
ⓒ Month, Year: Controlled on production line:
ex) Monthly : ‘01’ -> ‘01’
Year : ‘2014’ -> ‘18
ⓓ Model Name(Hex): LGTV
ⓔ Checksum(LG TV): Changeable by total EDID data.
ⓕ Vendor Specific(HDMI)
2) Adj. Computer (During auto adj., RS-232C protocol is
needed)
3) Adjust Remocon
4) Video Signal Generator MSPG-925F 720p/216-Gray
(Model: 217, Pattern: 78)
5.2.2.3. Adjustment
1) Set TV in Adj. mode using POWER ON
2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface.
3) Press ADJ key -> EZ adjust using adj. R/C > 6. White-
Balance then press the cursor to the right (KEY►). When
KEY(►) is pressed 216 Gray internal pattern will be
displayed.
4) One of R Gain / G Gain / B Gain should be fixed at 192, and
the rest will be lowered to meet the desired value.
5) Adj. is performed in COOL, MEDIUM, WARM 3 modes of
color temperature.
▪ If internal pattern is not available, use RF input. In EZ Adj.
menu 6.White Balance, you can select one of 2 Test-pattern:
ON, OFF. Default is inner(ON). By selecting OFF, you can
adjust using RF signal in 216 Gray pattern.
** R-fix adjustment
Adjust modes (Cool), Fix the R gain to 210 (default data) and
change the others (G/B Gain ).
- Adjust the R gain more than 210 ( If G gain or B gain is less
than 0 , R gain can adjust more than 210 ) and change the
others ( G/B Gain ). Adjust two modes(Medium / Warm), Fix
the one of R/G/B gain to 192 (default data) and decrease the
others.
1) Purpose : Especially G-gain fix adjust leads to the
luminance enhancement. Adjust the color
temperature to reduce the deviation of the
module color temperature.
2) Principle : To adjust the white balance without the
saturation, Adjust the G gain more than 172 ( If R
gain or G gain is more than 255 , G gain can
adjust less than 172 ) and change the others (R/B
Gain).
3) Adjustment mode : mode – Cool
5.2.3.2. Medium / Warm Mode
1) Purpose : Adjust the color temperature to reduce the
deviation of the module color temperature.
2) Principle : To adjust the white balance without the
saturation, Fix the one of R/G/B gain to 192
(default data) and decrease the others.
3) Adjustment mode : Two modes – Medium / Warm
▪ Luminance: 204 Gray
▪ Standard color coordinate and temperature using CS-1000
(over 26 inch)
Mode
Cool0.2710.27013,000K0.0000
Medium0.2860.2899,300K0.0000
Warm0.3130.3296,500K0.0000
* Change reason : When vivid mode, more detail than other
▪ Standard color coordinate and temperature using
CA-210(CH-14) – by aging time
(1) Normal line in Korea (From January to February) : LGD
( UB98xxx, UB95/93xxx, UB85xxx, UB83xxx, UC97 Series
models)
10-2286 295 301314328354
23-5284 290 299309326349
36-9282 287 297306324346
410-19279 283 294302321342
520-35276 278 291297318337
636-49274 275 289294316334
750-79273 272 288291315331
880-119272 271 287290314330
9Over 120271 270 286289313329
Coordinate
XY
Aging time
(Min)
Temp△uv
company set.
CoolMediumWarm
XYXYXY
271270286289313329
▪ Standard color coordinate and temperature using
CA-210(CH-14) – by aging time
(2) Normal line in Korea (From March to December) : : LGD
(UB98xxx, UB95/93xxx, UB85xxx, UB83xxx, UC97 Series
models)
* Normal line in Mexico : LGD (UB98xxx, UB95/93xxx, UB85xxx,
UB83xxx ,UC97 Series models)
Aging time
(Min)
10-2282 289 297308324348
23-5281 287 296306323346
36-9279 284 294303321343
410-19277 280 292299319339
520-35275 277 290296317336
636-49274 274 289293316333
750-79273 272 288291315331
880-119272 271 287290314330
9Over 120271 270 286289313329
CoolMediumWarm
XYXYXY
271270286289313329
(3) O/S Module(AUO, INX, Sharp, CSOT, BOE)
CoolMediumWarm
XYXYXY
spec271270286289313329
target278280293299320339
-. To check the Coordinates of White Balance, you have to
measure at the below conditions.
Picture Mode : select Vivid and change
Dynamic Contrast : Off ,
Dynamic Colour : Off,
Clear White : Off
-> Picture Mode change : Vidid -> Vivid(User)
(If you miss the upper condition, the coordinates of W/B can be
lower than the spec.)
1) Press ‘TILT” key of the Adj. R/C and check moving patterns.
The black bar patterns moves from top left to bottom right. If
local dimming function does not work, a whole screen
shows full white.
5.8. Motion Remote controller Inspection
1) Equipment : Motion remote controller for test, IR-KEYCODE remote controller for test Check battery before test.
(Recommend : Change battery for every Lot.)
2) Process
- If you select the ‘start key(wheel)’ on the controller, you can
pairing with the TV SET.
- You can check the cursor on the TV Screen, when select the
‘Wheel Key’ on the controller
- You must remove the pairing with the TV Set by select ‘Back
(2) Enter ADC Calibration by pushing “►” key at “9. ADC
Calibration”
(3) Select [Reset] button by pressing Enter key
(4) Change “OTP” to “Internal” by pushing “►” key
(5) Select [Start] button by pressing Enter key, then it will
operate ADC adjustment.
5.16.3. Check point
1) Test voltage
(A) 3 Poles
- GND: 1.5KVac/min at 100mA
- SIGNAL: 3KVac/min at 100mA
2) TEST time: 1 second
3) TEST POINT
(B) 3 Poles
- GND Test = POWER CORD GND and SIGNAL CABLE
GND.
- Hi-pot Test = POWER CORD GND and LIVE & NEUTRAL.
4) LEAKAGE CURRENT: At 0.5mArms
5.16. GND and Hi-Pot test
5.16.1. GND & HI-POT auto-check preparation
1) Check the POWER CABLE and SIGNAL CABE insertion
condition
5.16.2. GND & HI-POT auto-check
1) Pallet moves in the station. (POWER CORD / AV CORD is
tightly inserted)
2) Connect the AV JACK Tester.
3) Controller (GWS103-4) on.
4) GND Test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, execute next process (Hi-pot test).
(Remove A/V CORD from A/V JACK BOX)
5) HI-POT test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, GOOD Lamp on and move to next
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BSD-14Y-UD-001-HD
2013-12-17
H13 D CHIP
LG1154A
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
11/05/31
SMD TOP for EMI
SMD_GASKET_8.5T
GASKET_8.0X6.0X8.5H
M200
MDS62110209
SMD_GASKET_12.5T
GASKET_8.0X6.0X12.5H
M200-*1
MDS62110217
+1.5V_DDR
L230
BLM18PG121SN1D
22uF
C303
C302
0.1uF
C306
0.1uF
C308
0.1uF
C305
VDDC15_M1
+1.5V_Bypass Cap
VDDC15_M0
R200
OPT
OPT
OPT
0.1uF
C309
0.1uF
C311
0.1uF
C312
OPT
OPT
0.1uF
C313
OPT
0.1uF
C314
C350
0.1uF
C352
0.1uF
0.1uF
C353
0.1uF
C354
0.1uF
C355
0.1uF
C356
0.1uF
C357
0.1uF
C358
0.1uF
C359
0.1uF
C360
0.1uF
C361
0.1uF
C362
0.1uF
C363
0.1uF
C365
0.1uF
C366
0.1uF
C367
0.1uF
C369
0.1uF
C370
0.1uF
C371
0.1uF
C372
0.1uF
R201
VREF_M0_0
1K 1%
1K 1%
C296
OPT
0.1uF
VDDC15_M0
R202
R203
1K 1%
VREF_M0_1
1K 1%
OPT
C344
0.1uF
+1.5V_DDR
L228
BLM18PG121SN1D
22uFC299
C307
0.1uF
VDDC15_M1
R300
R301
VREF_M1_0
1K 1%
1K 1%
C304
OPT
0.1uF
VDDC15_M1VDDC15_M0
VREF_M1_1
R302
1K 1%
OPT
0.1uF
R303
1K 1%
C310
BSD-14Y-UD-003-HD
2013-12-17
MAIN POWER
Place JACK Side
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
AV1_CVBS_IN
5.5V
D404
SC_CVBS_IN
TU_CVBS
SCART_FB_DIRECT
SC_FB
SC_ID
NON_EU
R422-*1
SC_CVBS_IN_SOY
COMP1_Pb
COMP1_Y
COMP1_Pr
SC_L_IN
SC_R_IN
SCART_Lout
SCART_Rout
HP_LOUT_MAIN
HP_ROUT_MAIN
R423100
R435
R422
75
0
SCART_FB_DIRECT
SC_B
SC_G
SC_R
5.5V
COMP1/AV1/DVI_L_IN
COMP1/AV1/DVI_R_IN
10pF
C472
D406
D403
D401
5.5V
5.5V
Near Place Scart AMP
EU
4.7uF 10V
C6006
EU
10K
4.7uF 10V
R6005
C6001
+12V
EU
R403
100K
EU
R404
100K
R430
22K
OPT
R445
22K
OPT
C405
150pF
50V
C408
150pF
50V
EU
10K
C473
50V
OPT
EU
10K
R60 06
EU
R408
100K
2.2uF
10V
R409
100K
R6450
C400
0.01uF
OPT
C401
0.01uF
OPT
L408
C402
150pF
50V
OPT
EU
10pF
50V
EU
EU
C403
EU
100
R6451
L409
OPT
C430
1uH
1uH
EU
EU
2.7K
10pF
C474
50V
OPT
10pF
C431
50V
SCART_AMP_R_FB
EU
C406
2.2uF
10V
100
+3.3V_NORMAL
R4641K1/16W
R465
390
1/16W
C410
R410
150pF
75
1%
3216
C462
R411
150pF
75
EU
EU
1%
3216
NON_EU
R436
R436-*1
0
75
75
1%
1%
EU
R414
R412
10pF
10pF
C470
50V
50V
SCART_AMP_L_FB
SCART_Lout_SOC
SCART_Rout_SOC
CLK_54M_VTT
1%
C404
0.01uF
50V
1%
DAC_START_PULLDOWN
R466821/16W
1%
75
EU
EU
1%
R416
75
75
75
1%
1%
1%
R417
R415
R413
AUDA_OUTL
AUDA_OUTR
FOR EMI
R400
R405
R427
R424
R425
1%
R41827K
1%
R41927K
1%
R42027K
1%
R42127K
SC_FB
Clock for H13A
MAIN Clock(24Mhz)
12pFD13_STPO_SOP
C426
12pF
C427
Place SOC Side
R434
C424 0.047uF
100
EU
R433
R432
EU
EU
EU
C425 0.047uF
100
SC_CVBS_IN_SOY
C423 0.047uF
100
C417 0.047uF
33
C418 0.047uF
33
C428 1000pF
C419 0.047uF
33
C420 0.047uF
33
C421 0.047uF
33
C429 1000pF
C422 0.047uF
33
R431
EU
EU
EU
EU
EU
AUDIO IN
EU
EU
EU
SCART_FB_BUFFER
C4324.7uF
R43710K 1%
C4334.7uF
R43810K 1%
C4344.7uF
R43910K 1%
C4354.7uF
R44010K 1%
R401
470
1/16W
5%
R4061K
SCART_FB_BUFFER
EU
EU
EU
+3.3V_NORMAL
R446
4.7K
SCART_FB_BUFFER
C
B
E
1/16W
1%
X-TAL_1
GND_1
1
2
4
3
GND_2
X-TAL_2
AV1_CVBS_IN_SOC
SC_CVBS_IN_SOC
TU_CVBS_SOC
SC_FB_SOC
SC_ID_SOC
COMP1_PB_IN_SOC
COMP1_Y_IN_SOC
COMP1_Y_IN_SOC_SOY
COMP1_PR_IN_SOC
COMP2_PB_IN_SOC
COMP2_Y_IN_SOC
COMP2_Y_IN_SOC_SOY
COMP2_PR_IN_SOC
SC_FB_BUF
MMBT3904(NXP)
Q400
SCART_FB_BUFFER
R441
X400
24MHz
SOC_RESET
AUAD_L_CH3_IN
AUAD_R_CH3_IN
AUAD_L_CH2_IN
AUAD_R_CH2_IN
Tuner IF Filter
1M
COMP1_Y_IN_SOC_SOY
COMP2_Y_IN_SOC_SOY
HP_LOUT_AMP
XIN_SUB
XOUT_SUB
XIN_SUB
XOUT_SUB
XTAL_SEL[0]
XTAL_SEL[1]
C415
OPM[0]
0.1uF
OPM[1]
H13A_SCL
H13A_SDA
AV1_CVBS_IN_SOC
SC_CVBS_IN_SOC
TU_CVBS_SOC
DTV/MNT_V_OUT_SOC
OPT
Placed as close as possible to SOC
REFT
REFB
R44768
R44868
R44968
SC_ID_SOC
SC_FB_SOC
COMP1_PB_IN_SOC
COMP1_Y_IN_SOC
COMP1_PR_IN_SOC
COMP2_PB_IN_SOC
COMP2_Y_IN_SOC
COMP2_PR_IN_SOC
+3.3V_NORMAL
POWER_SAVE
HP_OUT
L400
To ADC
VOUT
VSAG
NON_TU_W_BR/TW
NON_TU_W_BR/TW
NON_TU_W_BR/TW
HP_OUT
C407
0.22uF
10V
DTV/MNT_V_OUT
ADC_I_INN
ADC_I_INP
BLM18PG121SN1D
Place at JACK SIDE
P17
6
5
4
TU_W_BR/TW
R443-*1
220
0.01uF
0.01uF
BLM18PG121SN1D
HP_ROUT_AMP
V+
GND
VIN
C437
C438
P18
J17
N18
D18
M18
M17
E3
K3
K2
A8
B8
U13
V14
V15
V13
U15
U14
U7
V6
V7
U10
V12
T5
T6
U8
V8
V9
U9
V10
U11
V11
U12
L406
OPT
HP_OUT
L401
R453330
C443 0.047uF
68
R450
C439
100pF
50V
C440 0.047uF
C441 0.047uF
C442 0.047uF
IC400
NJM2561BF1
1
EU
2
3
R443
51
C436
22pF
R444
51
Placed as close as possible to IC100
HP_LOUT
OP MODE Setting
& Select XTAL Input
OP MODE[0:1] : SW[2:1]
00 => Normal Operaiton Mode
/T32 Debug Mode
01 => Internal Test Purpose
10 => Internal Test Purpose
11 => Internal Test Purpose
XTAL SEL[1:0] : SW[4:3]
00 => Xtal Input
01 => CLK 24M from H13D
10 => XTAL Bypass from H13D
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BSD-14Y-UD-004-HD
2013-12-17
MAIN AUDIO/VIDEO
IC100
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
DDR3 1.5V bypass Cap - Place these caps near Memory
WE
J1
NC_1
J9
T2
NC_2
RESET
L1
NC_3
L9
NC_4
F3
DQSL
G3
DQSL
A9
C7
VSS_1
DQSU
B3
B7
VSS_2
DQSU
E1
VSS_3
G8
E7
VSS_4
DML
J2
D3
VSS_5
DMU
J8
VSS_6
M1
E3
VSS_7
DQL0
M9
F7
VSS_8
DQL1
P1
F2
VSS_9
DQL2
P9
F8
VSS_10
DQL3
T1
H3
VSS_11
DQL4
T9
H8
VSS_12
DQL5
G2
DQL6
H7
DQL7
B1
VSSQ_1
B9
D7
VSSQ_2
DQU0
D1
C3
VSSQ_3
DQU1
D8
C8
VSSQ_4
DQU2
E2
C2
VSSQ_5
DQU3
E8
A7
VSSQ_6
DQU4
F9
A2
VSSQ_7
DQU5
G1
B8
VSSQ_8
DQU6
G9
A3
VSSQ_9
DQU7
C522
0.47uF
6.3V
Close to REFOUT pin
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BSD-14Y-UD-005-HD
2013-12-17
MAIN DDR
PCM_RESET
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BSD-14Y-UD-007-HD
2013-12-17
PCMCIA
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