LG 86UM8070PUA Schematic

CONFIDENTIAL

LED TV

SERVICE MANUAL

CHASSIS : UA92F

MODEL : 86UM8070PUA

MODEL : 86UM8070AUB

CAUTION

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

P/NO : MFL71404408 (1903-REV00)

Any reproduction, duplication, distribution (including by way of email, facsimile or other electronic means), publication, modification, copying or transmission of this Service Manual is STRICTLY PROHIBITED unless you have obtained the prior written consent of the LG Electronics entity from which you received this Service Manual. The material covered by this prohibition includes, without limitation, any text, graphics or logos in this Service Manual.

CONTENTS

CONTENTS .............................................................................................. 2

SAFETY PRECAUTIONS ........................................................................ 3

SERVICING PRECAUTIONS ................................................................... 4

SPECIFICATION ....................................................................................... 6

SOFTWARE UPDATE ........................................................................... 10

BLOCK DIAGRAM ................................................................................. 12

EXPLODED VIEW .................................................................................. 20

ASSEMBLY / DISASSEMBLY GUIDE .................................................... 21

TROUBLE SHOOTING GUIDE ................................................ APPENDIX

- 2 -

SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.

It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1 M When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

Ω and 5.2 MΩ.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check. Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to

0.5 mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit

- 3 -

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conict between the

following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before;

a. Removing or reinstalling any component, circuit board mod-

ule or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its assemblies.

4. Unless specied otherwise in this service manual, clean

electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength)

CAUTION: This is a ammable mixture. Unless specied otherwise in this service manual, lubrication of

contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

8. Use with this receiver only the test xtures specied in this

service manual.

CAUTION: Do not connect the test xture ground strap to any

heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES

devices are integrated circuits and some eld-effect transistors

and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder

removal devices not classied as “anti-static” can generate electrical charges sufcient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate

electrical charges sufcient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your

foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 °F to 600 °F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.

(500 °F to 600 °F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature

(500 °F to 600 °F)

b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there only until the solder ows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

- 4 -

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

- 5 -

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

.

1. Application range

This specification is applied to the LED TV used UA92F chassis.

2. Test condition

Each part is tested as below without special appointment. (1) Temperature: 25 °C ± 5 °C, CST: 40 °C ± 2 °C (2) Relative Humidity: 65 % ± 10 % (3) Power Voltage

: Standard input voltage (AC 100-240 V~, 50/60 Hz) * Standard Voltage of each products is marked by models.

(4) Specification and performance of each parts are followed

each drawing and specification by part number in accordance with BOM.

(5) The receiver must be operated for about 5 minutes prior to

the adjustment.

3. Test method

(1) Performance: LGE TV test method followed (2) Demanded other specification

- Safety : CE, IEC specification

- EMC : CE, IEC

4. General Specification

No Item Specication Remark

1 Market North America

2 Broadcasting system ATSC / NTSC-M, 64 & 256 QAM

3 Available Channel VHF : 02~13

UHF : 14~69

DTV : 02-69

CATV : 01~135

CADTV : 01~135

4 Receiving system Digital : ATSC, 64 & 256 QAM

Analog : NTSC-M

5 Video Input NTSC-M Rear (1EA)

6 HDMI Input UHD HDMI 1 PC / DTV format Side, Support 6Gbps

HDMI 2 PC / DTV format Side, Support 6Gbps, Support ARC

HDMI 3 PC / DTV format Rear, Support 6Gbps

HDMI 4 PC / DTV format Rear, Support 6Gbps

7 Audio Input AV Audio / DVI Audio AV and DVI use same jack ;

8 SPDIF out(1EA) Optical Audio out Rear (1EA),

9 HeadPhone HeadPhone out

10 USB Input EMF, DivX HD, For SVC (download) JPEG, MP3, DivX HD

- 6 -

5. External Input Support Format

5.1. HDMI Input (PC/DTV)

No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remarks

PC

1 640*350 31.46 70.09 25.17 EGA

2 720*400 31.46 70.08 28.32 DOS

3 640*480 31.46 59.94 25.17 VESA(VGA)

4 800*600 37.87 60.31 40 VESA(SVGA)

5 1024*768 48.36 60 65 VESA(XGA)

6 1360*768 47.71 60.01 84.75 VESA(WXGA)

7 1152*864 54.34 60.05 80 VESA

8 1280*1024 63.98 60.02 109 SXGA Support to HDMI-PC

9 1920*1080 67.5 60 158.4 WUXGA(Reduced

Blanking)

10 1920*1080 135 120 297

11 3840*2160 54 24 297 UDTV 2160P

12 3840*2160 56.25 25 297 UDTV 2160P

13 3840*2160 67.5 30 297 UDTV 2160P

14 3840*2160 112.5 50 594 UDTV 2160P

15 3840*2160 135 60 594 UDTV 2160P

16 3840*2160 225 100 1188 UDTV 2160P

17 3840*2160 270 120 1188 UDTV 2160P

18 4096*2160 53.95 23.97 296.7 UDTV 2160P

19 4096*2160 54 24 297 UDTV 2160P

20 4096*2160 56.25 25 297 UDTV 2160P

21 4096*2160 67.5 30 297 UDTV 2160P

22 4096*2160 112.5 50 594 UDTV 2160P

23 4096*2160 135 60 594 UDTV 2160P

24 4096*2160 225 100 1188 UDTV 2160P

25 4096*2160 270 120 1188 UDTV 2160P

26 2560*1440 88.78 60 241.5 3K

27 2560*1440 183 120 497.7 3K

28 7680*4320 107.89 23.98 1188 8K 8K Model Only

29 7680*4320 108 24 1188 8K 8K Model Only

30 7680*4320 110 25 1188 8K 8K Model Only

31 7680*4320 131.87 29.97 1188 8K 8K Model Only

32 7680*4320 132 30 1188 8K 8K Model Only

33 7680*4320 220 50 2376 8K 8K Model Only

34 7680*4320 263.74 59.94 2376 8K 8K Model Only

35 7680*4320 264 60 2376 8K 8K Model Only

- 7 -

No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remarks

DTV

1 640*480 31.46 59.94 25.12 SDTV 480P

2 640*480 31.5 60 25.12 SDTV 480P

3 720*480 15.73 59.94 13.5 SDTV, DVD

480I(525I)

4 720*480 15.75 60 13.51 SDTV, DVD

480I(525I)

5 720*576 15.62 50 13.5 SDTV, DVD

576I(625I) 50Hz

6 720*480 31.47 59.94 27 SDTV 480P

7 720*480 31.5 60 27.02 SDTV 480P

8 720*576 31.25 50 27 SDTV 576P

9 1280*720 44.96 59.94 74.17 HDTV 720P

10 1280*720 45 60 74.25 HDTV 720P

11 1280*720 37.5 50 74.25 HDTV 720P

12 1920*1080 28.12 50 74.25 HDTV 1080I

13 1920*1080 33.72 59.94 74.17 HDTV 1080I

14 1920*1080 33.75 60 74.25 HDTV 1080I

15 1920*1080 26.97 23.97 63.29 HDTV 1080P

16 1920*1080 27 24 63.36 HDTV 1080P

17 1920*1080 33.71 29.97 79.12 HDTV 1080P

18 1920*1080 33.75 30 79.2 HDTV 1080P

19 1920*1080 56.25 50 148.5 HDTV 1080P

20 1920*1080 67.43 59.94 148.35 HDTV 1080P

21 1920*1080 67.5 60 148.5 HDTV 1080P

22 1920*1080 112.5 100 297 HDTV 1080P

23 1920*1080 134.86 119.88 296.7 HDTV 1080P

24 1920*1080 135 120 297 HDTV 1080P

25 3840*2160 53.95 23.98 296.7 UDTV 2160P

26 3840*2160 54 24 297 UDTV 2160P

27 3840*2160 56.25 25 297 UDTV 2160P

28 3840*2160 61.43 29.97 296.7 UDTV 2160P

29 3840*2160 67.5 30 297 UDTV 2160P

30 3840*2160 112.5 50 594 UDTV 2160P When HDMI1,2,3,4

31 3840*2160 134.86 59.94 593.4 UDTV 2160P

32 3840*2160 135 60 594 UDTV 2160P

33 3840*2160 225 100 1188 UDTV 2160P

34 3840*2160 270 120 1188 UDTV 2160P

35 4096*2160 53.95 23.98 296.7 UDTV 2160P

36 4096*2160 54 24 297 UDTV 2160P

37 4096*2160 56.25 25 297 UDTV 2160P

38 4096*2160 61.43 29.97 296.7 UDTV 2160P

39 4096*2160 67.5 30 297 UDTV 2160P

Spec. out but display

UHD DEEP COLOUR

ON

- 8 -

No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remarks

DTV

40 4096*2160 112.5 50 594 UDTV 2160P When HDMI1,2,3,4

41 4096*2160 134.86 59.94 593.4 UDTV 2160P

42 4096*2160 135 60 594 UDTV 2160P

43 4096*2160 225 100 1188 UDTV 2160P

44 4096*2160 270 120 1188 UDTV 2160P

45 2560*1440 88.78 60 241.5 3K non-standard

46 2560*1440 183 120 497.7 3K non-standard

47 7680*4320 107.89 23.98 1188 8K 8K Model Only

48 7680*4320 108 24 1188 8K 8K Model Only

49 7680*4320 110 25 1188 8K 8K Model Only

50 7680*4320 131.87 29.97 1188 8K 8K Model Only

51 7680*4320 132 30 1188 8K 8K Model Only

52 7680*4320 220 50 2376 8K 8K Model Only

53 7680*4320 263.74 59.94 2376 8K 8K Model Only

54 7680*4320 264 60 2376 8K 8K Model Only

UHD DEEP COLOUR

ON

- 9 -

SOFTWARE UPDATE

1. USB

(1) Insert the USB memory Stick to the USB port (2) Automatically detect the SW Version and show the below message

(3) Click [YES]: initiate the download and install of the update.

(4) Click [Check Now]: move to “About This TV” page for update (5) TV is updating

(6) After finished the update, below Pop-up appear

(7) Click [Yes] : TV will be DC OFF -> ON (8) After TV turned on, Check the updated SW Version and Tool Option

- 10 -

2. NSU

(This Function is needed to connect to the internet)

(Case 1) Allow Automatic Updates Toggle Item

(1) Menu -> All Settings -> General -> About This TV

(2) Silent Update_Pop-up When the download and install of the update is complete, the TV issues a Toast notification letting the user know that the update is complete and a reboot is required.

(3) If you want to see the update progress, go to [Menu -> All

Settings -> General -> About This TV]

(Case 2) NOT Allow Automatic Updates Toggle Item

(1) Menu -> All Settings -> General -> About This TV

(2) TV will automatically check for updates when every TV

boots When an updated is detected, the TV will issue an Alert letting the user know that an update is available.

(4) If you want to cancel update, click (1.1) CANCEL UPDATE

(5) [NO] : Keep updating [Yes] : Cancel updating

(3) [Yes] : Initiate the download and install of the update

[No] : Close the pop-up. The Alert will come back again when TV checks again.

(4) The following pop up window appears.

(5) [CHECK NOW] : Go to the About this TV setting page [CLOSE] : Close the pop-up

- 11 -

1. Main IC

MAIN Audio AMP

(NTP7519)

Main IC

IF+, IF-

OPTIC

LAN

HDMI1 HDMI 2.0

EEPROM(NVRAM)

(256Kb)

PHY3_RX0N

Air/

Cable

TUNER

(Air/Cable)

USB1 (2.0)

eMMC

(4GB)

Sub Micom

(RENESAS

R5F100GEAFB)

P_TS(Korea / Japan / China)

X_TAL

24MHz

X_TAL

32.768KHz

I2S Out

I2C 0

I2C 4

R

E

A

R

YPbPr

SPDIF OUT

ETHERNET

I2C 1

SUB

ASSY

IR / KEY

WIFI/BT Combo

USB_WIFI

CVBS

HDMI3 HDMI 2.0

USB2 (2.0)

RS232C/HP

HDMI2(ARC) HDMI 2.0

AV

OCP

USB2_0

USB2_2

PHY2_RX0N

PHY1_RX0N

SIF

HDMI4 HDMI 2.0

PHY0_RX0N

PMIC

CVBS/COMP

M0

M1

DDR3 2640

512MB

DDR3 2640

512MB

DDR3 2640

512MB

DDR3 / 2640

512MB

I2C 5

USB3 (2.0)

OCP

USB2_1

Depend on Region

Side

Rear

Depend on Region

Side

Rear

I_P, I_N, Q_P, Q_N

KR

US

EPI/

Vx1

Output

BLOCK DIAGRAM

- 12 -

2. I2C

SCL0

SDA0

100Ω

3.3KΩ

Main IC

+3.3V_NORMAL

3.3KΩ

33Ω

IC102

NVRAM

+3.3V_NORMAL

IC5300

NTP7519

SCL2

SDA2

TUNER

SCL4

SDA4

33pF

SCL5

SDA5

1.8KΩ

SCL1

SDA1

IC3000

MICOM

33Ω

3.3KΩ

+3.3V_NORMAL

3.3KΩ

+3.3V_NORMAL

IC8000

SW50212

33Ω

IC8100

RT5094

33Ω

47pF

+3.3V_TU

2.7KΩ

33Ω

IC7001

LNB

+3.3V_NORMAL

SCL3

SDA3

TUNER(JAPAN)

33Ω

Depend on Region

- 13 -

3. Power

LDO DCDC

+D13V

+5V_NORMAL

IC1600 / 8A

TPS568330

IC1400 / 3A

TPS563208

IC1100

TPS259271

IC1700 / 3.5A

TPS563240

NTP7519

+3.3V_NORMAL

+3.5V_ST

+1.8V_IO

IC2100 / 3A

TPS563208

+0.9V_CPU

IC2000 / 12A

TPS56C215RNNR

+0.9V_CORE

USB1 (2.0)

USB2 (2.0)

PANEL

MICOM

IR_KEY

ETHERNET

WIFI

+3.5V_WOL

WIFI_EN

+0.9V_CPU

+0.9V_CORE

Main

IC1800 / 3A

TPS563208

SWITCH

+0.9V_DDR & C4TX

NVRAM

H/P AMP

1.1/1.2V_DEMOD

TUNER

NTP7519

MAX3232CDR

USB1 (2.0)

IC1502 / 1A

LR1801G-ADJ

DDR3

1.2V_DDR

2.5V_VPP

CI_CAM

IC6900 / 2A

TJ4320GDP-ADJ

IC6800 / 2A

TJ4320GDP-ADJ

2.5V_DEMOD

IC2200 / 3A

TPS563208

Main

IC2300 / 2A

TJ4320GDP-ADJ

Main

Source

IC1501 / 3.5A

TLV62585

- 14 -

4. Tuner

SCL5

SDA5

DMD_TADC_INP

DMD_TADC_INN

AAD_ADC_SIF

Tuner

B2[+3.3V_DEMOD]11

[IF_P] 8

[IF_N] 7

+1.2V_TU

[SCL_RF] 1

[SDA_RF] 2

[SIF] 6

[CVBS] 4

[RESET_DEMOD] 10

FILTER

33 Ω

IF_P_TU

IF_N_TU

TU_CVBS

IF_AGC

TADC_I_INP

TADC_I_INN

/TU_RESET1

GPIO26

CVBS_IN1

IFAGC

+3.3V_TU

1.2KΩ

Main IC

B1[+3.3V_RF]3

TU_SIF

[FE_DEMOD1_1_TS_CLK] 15

[FE_DEMOD1_TS_SYNC] 16

[FE_DEMOD1_TS_VAL] 17

FE_DEMOD1_TS_DATA[0] 18

FE_DEMOD1_TS_DATA[1] 19

FE_DEMOD1_TS_DATA[2] 20

FE_DEMOD1_TS_DATA[3] 21

FE_DEMOD1_TS_DATA[4] 22

FE_DEMOD1_TS_DATA[5] 23

FE_DEMOD1_TS_DATA[6] 24

FE_DEMOD1_TS_DATA[7] 25

FE_DEMOD1_TS_CLK

FE_DEMOD1_TS_SYNC

FE_DEMOD1_TS_VAL

FE_DEMOD1_TS_DATA [0-7]

TP_DVB_CLK

TP_DVB_SOP

TP_DVB_VAL

TP_DVB_DATA0

TP_DVB_DATA1

TP_DVB_DATA2

TP_DVB_DATA3

TP_DVB_DATA4

TP_DVB_DATA5

TP_DVB_DATA6

TP_DVB_DATA7

_D

OD

_1_

_

D

_

D

_

V

A

_

OD

_

A

_

D

_

A

_

OD

_

A

_

D

_

A

_

OD

_

A

_

OD

_

A

_

D

_

A

_

OD

_

A

Y

N

C VAA

A

CL

_

O

P

TP

_

D

A

1

_

D

A

TP

_DAT

3

A

_

D

A

_

D

A

_

D

A

US

D

_

I

_

AA

A

C

_

KR

V

D

U

C

V

B

S /

E

SE

V

S

N

1

[IF_AGC] 5

COMON

- 15 -

5. Video/Audio In

Main IC

CVBS_IN2

Tuner

Jack Side

SoC Side

JK3401

AV_CVBS_IN / AV_L_IN / AV_R_IN

AV1_CVBS_IN_SOC

TU_SIF_TU, IF_P/N_TU

AAD_ADC_SIF, DMD_TADC_INP, DMD_TADC_INN

TU_SIF, TADC_I_INN/INP

Y1_IN

COMP1_Y_IN_SOC

- 16 -

HDMI4 (SIDE)

HDMI 2.0

HDMI2 (SIDE) with ARC

HDMI 2.0

CEC_REMOTE

RENESAS

MICOM(IC3000)

Main IC

HDMI_ARC

X-Tal(X3000)

32.768kHz

HDMI1 (SIDE)

HDMI2.0

DDC_SCL_1

DDC_SDA_1

TMDS Link 8bits

DDC_SCL_2

DDC_SDA_2

TMDS Link 8bits

DDC_SCL_4

DDC_SDA_4

* TMDS Link 8bits = TMDS DATA 6bits(DATA0,1,2)+ TMDS CLK 2bits

TMDS Link 8bits

HDMI_CEC_MICOM

Q3001

DDC_SCL_1

DDC_SDA_1

JK3104

JK3102

JK3101

1

000

0

HDMI3

(SIDE)

HDMI2.0

JK3103

DDC_SCL_3

DDC_SDA_3

TMDS Link 8bits

DDC_SCL_2

DDC_SDA_2

PHY0_ARC_OUT

DDC_SCL_3

DDC_SDA_3

DDC_SCL_4

DDC_SDA_4

6. HDMI

- 17 -

USB1(SIDE)

USB2.0_1_DM0

USB2.0_1_DP0

USB2(SIDE)

IC1600

SYVL86A

5V / 6A

+5V_USB_1

+5V_USB_2

/USB_OCD2

USB_CTL

2

USB_CTL2

/USB_OCD2

WIFI_DM

WIFI_DP

USB2_2_DM0

USB2_2_DP0

RENESAS MICOM(IC3000)

UART0_TXD/GPIO105

UART0_RXD/GPIO106

SOC_TX

SOC_RX

IC7200

MAX3232CDR

USB2.0

WIFI Combo

BT_RESET

BT_WAKEUP_DEVICE

BT_WAKEUP_HOST

OCP

IC4700

BD2242G

OCP

IC4501

BD2242G

+5V_NORMAL

JK4400

JK4200

USB2.0

Main IC

USB2.0_2_DM1

USB2.0_2_DP1

OCP

IC4700

BD2242G

+5V_NORMAL

USB3(Rear)

+5V_USB_3

USB_CTL2

/USB_OCD2

JK4600

USB2.0_3_DM0

USB2.0_3_DP0

USB2.0

7. USB / WIFI / M-REMOTE / UART

- 18 -

Main

Main IC

P7601 (51p)

P7602 (41p)

TX 8lane

Lock_In

TX 8lane

8. Vx1 41/51Pin Interface

- 19 -

EXPLODED VIEW (SET)

400

LV1

570

530

HP1

HS1

120

500

540

LV2

950

820

521

HW1

AR2

700

901

902

A10

200T

200A

200

710

411

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

- 20 -

Only for training and service purposes.

ASSEMBLY / DISASSEMBLY GUIDE

[Disassembly Guide]

(1) Lay the TV Set on a flat Pad and Remove the Stand Screw 6ea. (L:3ea / R:3ea) -> Remove the Stand Assy

: M4*30 6EA Disassemble screw

(2) Remove 1ea Screw of the Power Cord Bracket. -> Remove the Power Cord Bracket

:M3*5.5 1EA Disassemble screw Separate the Power Cord Bracket Remove the Power Cord Bracket Assy

- 21 -

(3) Remove the B/C Screw 20ea. -> Remove the B/C

(4)

(5)

(6)

(4) (4)

(4)

(4) (4) (4)

(5)

(6)

(5)

(Since there are Latches(8ea) on the upper side of B/C, you should disassemble from the bottom.)

:M3*5.5 1EA Disassemble screw

:M4*10 15EA Disassemble screw

(4) M3*5.5 4ea Disassemble screw (5) Detach the tape 3ea (6) Separate connector 1ea -> Remove the Bottom Cover Bracket

:M8*10 4EA Disassemble screw

:Latch 8ea

- 22 -

(7) Separate connector 10ea

(8)

(7)

(7) (7)

(7)

b

aa

b

aa

(8) M3*5.5 8ea Disassemble screw -> Remove the Main and Power PCB Assy

(9) Remove the Speaker 2ea

- 23 -

(10) M4*12 4EA Disassemble screw -> Remove the 2Pole Stand Guide Supporter(2ea) (11) Detach the Insulation Sheet 1ea

- 24 -

[Assembly Guide]

a

b

(2)

(1)

b

a

b b b

a

(1) Attach the Insulation Sheet 1ea (2) Place the 2Pole Stand Guide Supporter and M4*12 4EA Assemble screw

(3) Assemble the Speaker 2ea. ( )

- 25 -

(4) M3*5.5 8ea Assemble screw

(4)

(5)

(5) (5)

(5)

(7)

(8)

(6)

(7) (7)

(7)

(7) (7) (7)

(8)

(6)

(8)

(5) Attach Connector 10ea

(6) Attach Connector 2ea (7) M3*5.5 7ea Assemble screw (8) Attach the tape (5ea) and Gasket (1ea)

- 26 -

(9) Since there are Latches(8ea) on the upper side of B/C, Assemble the Latches after cover the B/C. (10) Assemble the B/C Screw 20ea.

:M3*5.5 1EA Disassemble screw

:M4*10 15EA Disassemble screw

(11) Attach the Power Cord Bracket and Assemble the screw 1ea.

:M8*10 4EA Disassemble screw

:Latch 8ea

- 27 -

:M3*5.5 1EA Disassemble screwAssemble the Power Cord BracketAttach the Power Cord Connector

(12) Assemble the Stand Assy. (Assemble screw 6ea)

: M4*30 6EA Disassemble screw

- 28 -

DISASSEMBLY GUIDE (MODULE)

(Step 1) Disassemble tthe Main, PSU, SPK, Wifi, IR & Stand Bracket A,B

(Step 2) Disassemble the S-PCB Cover Shield (left/right).

* Rear Sliver screw (left : 6-point / right : 6-point)

(Step 3) Reverse the LCM and disassemble the Source PCB from Holder

(Step 4) Disassemble the Case Top Screw (side) and Case Top

*top 10ea / side L 6ea / side R 6ea / down 10ea

- 29 -

(Step 5) Disassemble the Panel.

* Use a tape to x the FFC

(Step 6) 6 Disassemble the guide panel.

* 6-piece Guide Panel (Top 2ea / Side 2ea / Down 2ea)

(Step 7) Disassemble the Optical Sheet/Diffuser Plate (DS, Prism on Prism, DP)

(Step 8) Disassemble the DPS, LED Array Fixer(pin), and the Reflector

*Rotate the DPS to remove (23ea)

* Push the LED Fixer (6ea)

- 30 -