Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check(See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explosion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging
wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
This spec. sheet applies to EA41C Chassis applied OLED TV
all models manufactured in TV factory
2. Specification
(1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
(2) Adjustment must be done in the correct order.
(3) The adjustment must be performed in the circumstance of
25 ±5 ºC of temperature and 65±10% of relative humidity if
there is no specific designation
(4) The input voltage of the receiver must keep 100~240V,
50/60Hz
(5) The receiver must be operated for about 5 minutes prior to
the adjustment when module is in the circumstance of over
15
ºC
In case of keeping module is in the circumstance of 0°C, it
should be placed in the circumstance of above 15°C for 2
hours
In case of keeping module is in the circumstance of below
-20°C, it should be placed in the circumstance of above
15°C for 3 hours.
※ Caution
When still image is displayed for a period of 20 minutes or
longer (especially where W/B scale is strong.
Digital pattern 13ch and/or Cross hatch pattern 09ch), there
can some afterimage in the black level area
4. MAIN PCBA Adjustments
4.1. ADC Calibration
- An ADC calibration is not necessary because MAIN SoC
(LGExxxx) is already calibrated from IC Maker
4.2. MAC Address, ESN, Widevine, HDCP2.0,
DTCP Key download
- Above adjustment items can be also performed in Final
Assembly if needed. Adjustment items in both PCBA and
final assembly tages can be checked by using the INSTART
Menu -> 1.ADJUST CHECK
3.2. Final assembly adjustment
(1) White Balance adjustment
(2) RS-232C functionality check
(3) Factory Option setting per destination
(4) Shipment mode setting (In-Stop)
(5) GND and HI-POT test
3.3. Appendix
(1) Tool option menu, USB Download (S/W Update, Option and
Service only)
(2) Manual adjustment for ADC calibration and White balance.
(3) Shipment conditions, Channel pre-set
4.2.5. Download
1) US, Canada, Japan, France models (14Y LCD TV + MAC +
Widevine + ESN + HDCP2.0 + DTCP key)
(1) Objective: To reduce each Panel’s W/B deviation
(2) How-it-works: When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic Range. In order to
prevent saturation of Full Dynamic range and data, one of
R/G/B is fixed at 192, and the other two is lowered to find
the desired value.
(3) Adj. condition: normal temperature
- Surrounding Temperature: 25±5 °C
- Warm-up time: About 5 Min
- Surrounding Humidity: 20% ~ 80%
- Before White balance adjustment, Keep power on status,
don’t power off
5.1.1.2. Adj. condition and cautionary items
(1) Lighting condition in surrounding area surrounding lighting
should be lower 10 lux. Try to isolate adj. area into dark
surrounding.
(2) Probe location: Color Analyzer (CA-210) probe should be
within 10cm and perpendicular of the module surface
(80°~ 100°)
(3) Aging time
- After Aging Start, Keep the Power ON status during 5
Minutes.
- In case of LCD, Back-light on should be checked using no
- Purpose : Especially B-gain fix adjust leads to the
luminance enhancement. Adjust the color temperature to
reduce the deviation of the module color temperature.
- Principle : To adjust the white balance without the
saturation, Adjust the B gain more than 192 ( If R gain or G
gain is more than 255 , G gain can adjust less than 192 )
and change the others ( R/G Gain ).
- Adjustment mode : mode – Cool
(2) Medium / Warm Mode
- Purpose : Adjust the color temperature to reduce the
deviation of the module color temperature
- Principle : To adjust the white balance without the
saturation, Fix the B gain to 192 (default data) and
decrease the others
- Adjustment mode : mode – Medium
(3) Warm
- Purpose : Adjust the color temperature to reduce the
deviation of the module color temperature.
- Principle : To adjust the white balance without the
saturation, Fix the W gain to 192 (default data) and
decrease the others.
- Adjustment mode : mode – Warm
(4) THX(Warm)
- Purpose : Adjust the color temperature to reduce the
deviation of the module color temperature.
- Principle : To adjust the white balance without the
saturation, Fix the W gain to 192 (default data) and
decrease the others.
- Adjustment mode : mode – Warm
- Auto White balance 4 point
- Adjust 100 IRE White Balance
- Adjust Gamam 2.2 each IRE (60, 40, 20). Using max
luminance
- Complete 4 point gamma, W/B.
5.1.6. Reference (White Balance Adj. coordinate and
color temperature)
(1) Luminance: 204 Gray, 80IRE
(2) Standard color coordinate and temperature using CS-1000
(over 26 inch)
5.1.7. Reference (White Balance Adj. coordinate and
color temperature)
▪ Luminance: 204 Gray
▪ Standard color coordinate and temperature using CS-1000
(over 26 inch)
Mode
Cool0.2770.27811,000K-0.0030
Medium0.2860.2899300K0.0000
Warm0.3130.3296500K+0.0030
▪ Standard color coordinate and temperature using
CA-210(CH-17)
Mode
Cool0.277±0.0020.278±0.00211000K-0.0030
Medium0.286±0.0020.289±0.0029300K0.0000
Warm0.313±0.0020.329±0.0026500K+0.0030
Coordinate
XY
Coordinate
XY
Temp△uv
Temp△uv
5.2. Tool Option setting & Inspection per
countries
5.2.1. Overview
(1) Tool option selection is only done for models in Non-USA
North America due to rating
(2) Applied model: EA41C Chassis applied to CANADA and
MEXICO
5.2.2. Country Group selection
(1) Press ADJ key on the Adj. R/C, and then select Country
Group Menu
(2) Depending on destination, select US, then on the lower
Country option, select US, CA, MX.
Selection is done using +, - KEY
Picture is H 1/3, V 1/3
fixed Center Window size
Outer Black Picture do not need change Contrast / Brightness
Center Level can change Contrast / Bright
Window pattern of Center 0~255 level
(1) Turn on TV
(2) After 25~30 seconds, Press “EYE” button on the
Adjustment remote controller.
(3) Block the Intelligent Sensor module on the front C/A about
6 seconds.
When the “Sensor Data” is lower than 20, you can see the
“OK” message
→ If it doesn’t show “OK” message, the Sensor Module is
defected one. You have to replace that with a good one.
(4) After check the “OK” message come out, take ou t your
hand from the Sensor module.
→ Check “Sensor Data” value change from “0” to “300” or not.
If it doesn’t change the value, the sensor is also defected
one. You have to replace it.
10. USB S/W Download
(optional, Service only)
(1) Put the USB Stick to the USB socket
(2) Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is lower
than that of TV set, it didn’t work. Otherwise USB data is
automatically detected.
(3) Show the message “Copying files from memory”
(4) Updating is staring
9. GND and HI-POT Test
9.1. GND & HI-POT auto-check preparation
(1) Check the POWER CABLE and SIGNAL CABE insertion
condition
9.2. GND & HI-POT auto-check
(1) Pallet moves in the station. (POWER CORD / AV CORD is
tightly inserted)
(2) Connect the AV JACK Tester.
(3) Controller (GWS103-4) on.
(4) GND Test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, execute next process (Hi-pot test).
(Remove A/V CORD from A/V JACK BOX)
(5) HI-POT test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, GOOD Lamp on and move to next process
automatically.
9.3. Checkpoint
(1) Test voltage
- GND: 1.5KV/min at 100mA
- SIGNAL: 3KV/min at 100mA
(2) TEST time: 1 second
(3) TEST POINT
- GND Test = POWER CORD GND and SIGNAL CABLE GND.
- Hi-pot Test = POWER CORD GND and LIVE & NEUTRAL.
(4) LEAKAGE CURRENT: At 0.5mArms
(5) Updating Completed, The TV will restart automatically
(6) If your TV is turned on, check your updated version and
Tool option.
* If downloading version is more high than your TV have, TV
can lost all channel data. In this case, you have to channel
recover. If all channel data is cleared, you didn’t have a DTV/
ATV test on production line.
* After downloading, TOOL OPTION setting is needed again.
(1) Push "IN-START" key in service remote controller.
(2) Select "Tool Option 1" and Push “OK” button.
(3) Punch in the number. (Each model has their number.)
CH14/ OLED : CH17)
(2) Adj. Computer (During auto adj., RS-232C protocol is
needed)
(3) Adjust Remocon
(4) Video Signal Generator MSPG-925F 720p/216-Gray
(Model: 217, Pattern: 78)
11.2.3. Adjustment
(1) Set TV in Adj. mode using POWER ON
(2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface.
(3) Press ADJ key -> EZ adjust using adj. R/C -> 6. White-
Balance then press the cursor to the right (KEY►). When
KEY(►) is pressed 216 Gray internal pattern will be
displayed.
(4) One of R Gain / G Gain / B Gain should be fixed at 192,
and the rest will be lowered to meet the desired value.
(5) Adj. is performed in COOL, MEDIUM, WARM 3 modes of
color temperature.
▪ If internal pattern is not available, use RF input. In EZ Adj.
menu 6.White Balance, you can select one of 2 Test-pattern:
ON, OFF. Default is inner(ON). By selecting OFF, you can
adjust using RF signal in 216 Gray pattern.
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BSD-14Y-UD-001-HD
2013-12-17
H13 D CHIP
LG1154A
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
11/05/31
SMD TOP for EMI
SMD_GASKET_8.5T
GASKET_8.0X6.0X8.5H
M200
MDS62110209
SMD_GASKET_12.5T
GASKET_8.0X6.0X12.5H
M200-*1
MDS62110217
+1.5V_DDR
L230
BLM18PG121SN1D
22uF
C303
C302
0.1uF
C306
0.1uF
C308
0.1uF
C305
VDDC15_M1
+1.5V_Bypass Cap
VDDC15_M0
R200
OPT
OPT
OPT
0.1uF
C309
0.1uF
C311
0.1uF
C312
OPT
OPT
0.1uF
C313
OPT
0.1uF
C314
C350
0.1uF
C352
0.1uF
0.1uF
C353
0.1uF
C354
0.1uF
C355
0.1uF
C356
0.1uF
C357
0.1uF
C358
0.1uF
C359
0.1uF
C360
0.1uF
C361
0.1uF
C362
0.1uF
C363
0.1uF
C365
0.1uF
C366
0.1uF
C367
0.1uF
C369
0.1uF
C370
0.1uF
C371
0.1uF
C372
0.1uF
R201
VREF_M0_0
1K 1%
1K 1%
C296
OPT
0.1uF
VDDC15_M0
R202
R203
1K 1%
VREF_M0_1
1K 1%
OPT
C344
0.1uF
+1.5V_DDR
L228
BLM18PG121SN1D
22uFC299
C307
0.1uF
VDDC15_M1
R300
R301
VREF_M1_0
1K 1%
1K 1%
C304
OPT
0.1uF
VDDC15_M1VDDC15_M0
VREF_M1_1
R302
1K 1%
OPT
0.1uF
R303
1K 1%
C310
BSD-14Y-UD-003-HD
2013-12-17
MAIN POWER
Place JACK Side
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
AV1_CVBS_IN
5.5V
D404
SC_CVBS_IN
TU_CVBS
SCART_FB_DIRECT
SC_FB
SC_ID
NON_EU
R422-*1
SC_CVBS_IN_SOY
COMP1_Pb
COMP1_Y
COMP1_Pr
SC_L_IN
SC_R_IN
SCART_Lout
SCART_Rout
HP_LOUT_MAIN
HP_ROUT_MAIN
R423100
R435
R422
75
0
SCART_FB_DIRECT
SC_B
SC_G
SC_R
C472
D406
D403
D401
5.5V
5.5V
5.5V
Near Place Scart AMP
EU
4.7uF 10V
C6006
EU
10K
4.7uF 10V
R6005
C6001
COMP1/AV1/DVI_L_IN
COMP1/AV1/DVI_R_IN
+12V
EU
R403
100K
EU
R404
100K
R430
22K
OPT
R445
22K
OPT
C405
150pF
50V
C408
150pF
50V
EU
10K
10pF
C473
50V
OPT
EU
10K
R60 06
EU
R408
100K
2.2uF
R409
100K
R6450
C400
0.01uF
OPT
C401
0.01uF
OPT
10V
C402
150pF
50V
OPT
EU
10pF
EU
EU
C403
EU
100
L408
L409
50V
OPT
C430
R6451
1uH
1uH
EU
EU
2.7K
10pF
C474
50V
OPT
10pF
C431
50V
SCART_AMP_R_FB
EU
C406
2.2uF
10V
100
+3.3V_NORMAL
R4641K1/16W
R465
390
1/16W
C410
R410
150pF
75
1%
3216
C462
R411
150pF
75
EU
EU
1%
3216
NON_EU
R436
R436-*1
0
75
75
1%
1%
EU
R414
R412
10pF
10pF
C470
50V
50V
SCART_AMP_L_FB
SCART_Lout_SOC
SCART_Rout_SOC
CLK_54M_VTT
1%
C404
0.01uF
50V
1%
DAC_START_PULLDOWN
R466821/16W
1%
75
EU
EU
1%
R416
75
75
75
1%
1%
1%
R417
R415
R413
AUDA_OUTL
AUDA_OUTR
FOR EMI
R400
R405
R427
R424
R425
1%
R41827K
1%
R41927K
1%
R42027K
1%
R42127K
SC_FB
Clock for H13A
MAIN Clock(24Mhz)
12pFD13_STPO_SOP
C426
12pF
C427
Place SOC Side
R434
C424 0.047uF
100
EU
EU
R432
EU
R433
EU
C425 0.047uF
100
SC_CVBS_IN_SOY
C423 0.047uF
100
C417 0.047uF
33
C418 0.047uF
33
C428 1000pF
C419 0.047uF
33
C420 0.047uF
33
C421 0.047uF
33
C429 1000pF
C422 0.047uF
33
R431
EU
EU
EU
EU
EU
AUDIO IN
EU
EU
EU
SCART_FB_BUFFER
C4324.7uF
R43710K 1%
C4334.7uF
R43810K 1%
C4344.7uF
R43910K 1%
C4354.7uF
R44010K 1%
R401
470
1/16W
5%
R4061K
SCART_FB_BUFFER
EU
EU
EU
+3.3V_NORMAL
R446
4.7K
SCART_FB_BUFFER
C
B
E
1/16W
1%
X-TAL_1
GND_1
1
2
4
3
GND_2
X-TAL_2
AV1_CVBS_IN_SOC
SC_CVBS_IN_SOC
TU_CVBS_SOC
SC_FB_SOC
SC_ID_SOC
COMP1_PB_IN_SOC
COMP1_Y_IN_SOC
COMP1_Y_IN_SOC_SOY
COMP1_PR_IN_SOC
COMP2_PB_IN_SOC
COMP2_Y_IN_SOC
COMP2_Y_IN_SOC_SOY
COMP2_PR_IN_SOC
SC_FB_BUF
MMBT3904(NXP)
Q400
SCART_FB_BUFFER
R441
X400
24MHz
SOC_RESET
AUAD_L_CH3_IN
AUAD_R_CH3_IN
AUAD_L_CH2_IN
AUAD_R_CH2_IN
Tuner IF Filter
1M
COMP1_Y_IN_SOC_SOY
COMP2_Y_IN_SOC_SOY
HP_LOUT_AMP
XIN_SUB
XOUT_SUB
XIN_SUB
XOUT_SUB
XTAL_SEL[0]
XTAL_SEL[1]
C415
OPM[0]
0.1uF
OPM[1]
H13A_SCL
H13A_SDA
AV1_CVBS_IN_SOC
SC_CVBS_IN_SOC
TU_CVBS_SOC
DTV/MNT_V_OUT_SOC
OPT
Placed as close as possible to SOC
REFT
REFB
R44768
R44868
R44968
SC_ID_SOC
SC_FB_SOC
COMP1_PB_IN_SOC
COMP1_Y_IN_SOC
COMP1_PR_IN_SOC
COMP2_PB_IN_SOC
COMP2_Y_IN_SOC
COMP2_PR_IN_SOC
+3.3V_NORMAL
POWER_SAVE
HP_OUT
L400
To ADC
VOUT
VSAG
NON_TU_W_BR/TW
NON_TU_W_BR/TW
NON_TU_W_BR/TW
HP_OUT
C407
0.22uF
10V
DTV/MNT_V_OUT
ADC_I_INN
ADC_I_INP
BLM18PG121SN1D
Place at JACK SIDE
P17
6
5
4
TU_W_BR/TW
R443-*1
220
0.01uF
0.01uF
BLM18PG121SN1D
HP_ROUT_AMP
V+
GND
VIN
C437
C438
P18
J17
N18
D18
M18
M17
E3
K3
K2
A8
B8
U13
V14
V15
V13
U15
U14
U7
V6
V7
U10
V12
T5
T6
U8
V8
V9
U9
V10
U11
V11
U12
L406
OPT
HP_OUT
L401
R453330
C443 0.047uF
68
R450
C439
100pF
50V
C440 0.047uF
C441 0.047uF
C442 0.047uF
IC400
NJM2561BF1
1
EU
2
3
R443
51
C436
22pF
R444
51
Placed as close as possible to IC100
HP_LOUT
OP MODE Setting
& Select XTAL Input
OP MODE[0:1] : SW[2:1]
00 => Normal Operaiton Mode
/T32 Debug Mode
01 => Internal Test Purpose
10 => Internal Test Purpose
11 => Internal Test Purpose
XTAL SEL[1:0] : SW[4:3]
00 => Xtal Input
01 => CLK 24M from H13D
10 => XTAL Bypass from H13D
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BSD-14Y-UD-004-HD
2013-12-17
MAIN AUDIO/VIDEO
IC100
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BSD-14Y-UD-005-HD
2013-12-17
MAIN DDR
PCM_RESET
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BSD-14Y-UD-007-HD
2013-12-17
PCMCIA
Power_DET
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
OLED_AC_DET
PD_OLED_AC
R2398
39K
1%
PD_OLED_AC
R2399
PD_UHD_24V
R2327-*2
9.1K
1%
PD_UHD_24V
R2328-*2
1.6K
1%
RESET_IC_DIODES
IC2307-*1
APX803D29
RESET
VDD
VDD
PD_20_24V
OPT
R2337
100K
RESET_IC_ROHM
IC2307
BD48K28G
3
1
GND
OPT
R2336
100K
PD_20_24V_ROHM
IC2308
BD48K28G
3
1
GND
+3.5V_ST
C2365
0.1uF
16V
C2362
0.1uF
16V
R2316
0
24V-->3.48V
20V-->3.51V
12V-->3.58V
ST_3.5V-->3.5V
RESET
POWER_DET
POWER_DET_1
R2338
10K
PWR_DET_MERGE
VOUT
2
R2315
0
PWR_DET_MERGE
VOUT
2
PWR_DET_SEPARATE
+12V
22K
1%
1%
PD_20V
R2328-*1
1.3K
1%
PD_+12V
R2325
2.7K
1%
PD_+12V
R2326
1.2K
1%
PD_20V
R2327-*1
5.6K
+24V
+3.5V_ST
PD_24V
R2327
8.2K
1%
PD_24V
R2328
1.5K
1%
PD_+3.5V
R2330
0
5%
C2355
0.1uF
16V
C2356
0.1uF
16V
3
2
1
GND
PD_20_24V_DIODES
IC2308-*1
APX803D29
3
2
1
GND
not to RESET
at 8kV ESD
PWR_DET_SEPARATE
VCC
VCC
eMMC POWER
+3.3V_NORMAL
+12V
L2300
BLM18PG121SN1D
C2301
10uF
16V
1.0V_DCDC_TI
C2312-*1
3300pF
50V
3.3V_EMMC
L2302
BLM18PG121SN1D
C2359
0.1uF
C2305
C2300
0.1uF
22uF
16V
10V
+1.0V_VDD
R2304
R2302
R2
1%
11K
R2306
10K
33K
1%
POWER_ON/OFF2_3
R1
C2308
100pF
50V
DCDC_ROHM
IC2300
BD9D320EFJ
EN
C2310
1uF
10V
1
FB
2
VREG
3
SS
4
C2312
2200pF
50V
1.0V_DCDC_ROHM
3A
9
THERMAL
8
7
6
5
Vout=0.765*(1+R1/R2)
[EP]FIN
VIN
BOOT
SW
GND
+3.5V_ST
LG1154A
0.1uF
C2314
R2333
16V
22
LD2300
NR5040T2R2N
L2307
2.2uH
R2341
10K
C2340
22uF
10V
+3.3V_NORMAL
1.5K
R2342
+1.0V_VDD
R2346
C
Q2303
2SC3052
C2348
22uF
10V
+2.5V
POWER_ON/OFF2_2
+3.3V_NORMAL
C2327
0.1uF
11K
B
E
16V
R2312
10K
+5V_NORMAL
C2337
1uF
C2341
0.1uF
IC2302
AP2132MP-2.5TRG1
1
PG
2
EN
THERMAL
3
VIN
4
2A
VCTRL
EAN61387601
[EP]
8
GND
9
7
ADJ
6
VOUT
5
NC
T2 : Max 1.7A
else : Max 0.7A
+2.5V_Normal
1.2K
R2
R2321
R1
3.9 K
R23 22
C2342
10uF
10V
5V
OPT
ZD2302
Vout=0.6*(1+R1/R2)
+12V
L2301
BLM18PG121SN1D
C2302
C2360
10uF
0.1uF
16V
1.0V_DCDC_TI
C2315-*1
3300pF
50V
UB98/UC9_H13_DDR_Voltage
R2305-*1
4.99K
1%
Main +1.5V
POWER_ON/OFF2_3
UB95/95/UC97_H13_DDR_Voltage
R2305
R2303
R1
18K
1%
C2303
100pF
50V
R2
R2313
10K
4.3K
1%
R2307
22K
1%
Vout=0.765*(1+R1/R2)=1.516V
C2313
1uF
10V
BD9D320EFJ
EN
1
FB
2
VREG
3
SS
4
C2315
2200pF
50V
1.0V_DCDC_ROHM
DCDC_ROHM
IC2303
THERMAL
3A
+1.5V_DDR
DCDC_TI
IC2303-*1
TPS54327DDAR
[EP]GND
VIN
EN
8
1
VBST
VFB
9
7
C2321
22uF
10V
VREG5
OPT
2
3
SS
4
ZD2303
2.5V
THERMAL
SW
6
GND
5
[EP]FIN
VIN
8
9
7
6
5
BOOT
SW
GND
16V
0.1uF
C2318
NR5040T2R2N
L2308
2.2uH
C2320
22uF
10V
+1.2V_CORE
R2368
100
1/16W
OPT
2.5V
ZD2300
EN
VFB
VREG5
SS
DCDC_TI
IC2300-*1
TPS54327DDAR
1
2
3
4
THERMAL
R2359
10K
1%
R2358
5%
1%
0.1uF
C2372
4.7
OPT
91K
1/1 6W
R23 61
27K
1/1 6W
RF
R23 60
PGOOD
EN
16V
VBST
NC_1
SW_1
SW_2
SW_3
SW_4
30V
D2301
C2370
1000pF
50V
[EP]GND
VIN
8
VBST
9
7
SW
6
GND
5
POWER_ON/OFF2_4
+1.2V_VDD
OPT
2.5V
ZD2304
C2361
22uF
C2353
22uF
C2369
0.1uF
16V
C2366
22uF
R2356 1K
R2355
2K
1/16W
5%
L2321
1uH
R2357
3.3
1/10W
C2371
470pF
50V
[EP]
1
THERMAL
2
29
3
IC2309
4
TPS53513RVER
5
6
7
8
8A
9
10
PGND_111PGND_212PGND_313PGND_414PGND_5
R2362
39K
1/16W
5%
TRIP26NC_327GND128GND2
24VO25
R1
R2
FB
23
GND
22
MODE
21
VREG
20
VDD
19
NC_2
18
VIN_3
17
VIN_2
16
VIN_1
15
R2363
R2364
C2373
2200pF
50V
5.1K
4.87K
1%
1/16W
1%
1/16W
1%
1%
1/16W
20K
R2365
C2374
1uF
10V
L2322
C2375
10uF
16V
+12V
C2376
10uF
16V
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
MAX A
L2305
BLM18PG121SN1D
Placed on SMD-TOP
C2304
C2325
10uF
10uF
16V
16V
+12V
C2326
0.1uF
16V
OPT
+3.3V_NORMAL
C2332
0.0068uF
50V
R2311
10K
L2309
PGND
VIN
AGND
FB
IC2301
BD86106EFJ
1
2
3
4
6A
9
THERMAL
[EP]
SW_2
8
SW_1
7
EN
6
R2308
6.8K
COMP
5
C2328
0.1uF
16V
Vout=0.8*(1+R1/R2)
2uH
POWER_ON/OFF2_1
C2319
10uF
10V
C2323
100uF
6.3V
C2345
47pF
50V
OPT
R2319
R2320
30K
R2323
10K
1%
1.5K
1/16W
1%
1%
R1
R2
+3.3V_NORMAL
5V
ZD2301
OPT
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BSD-14Y-UD-024_02-HD
2013.12.17
HDMI
+5.0V normal & USB for UB model
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
+24V
120-ohm
C2309
10uF
35V
OPT
L2310
C2311
10uF
35V
25V
C2338
OPT
2200pF
C2343
50V
100pF
22SS23FB24
14
NFAULT2
USB_CTL3
USB_CTL2
50V
LX_3
21
LX_2
20
LX_1
19
18
17
16
15
R2350
BST
SW_IN2
SW_IN1
NFAULT1
Vout=0.6*(1+R1/R2)=5.1V
/USB_OCD2
R2349
10K
R2347 16K 1 %
R2348150 K 1%
R2344 16K 1%
COMP
RLIM
RSET1
RSET2
AGND
[EP]
25
26
27
VIN_1
VIN_2
VIN_3
C2329
0.1uF
50V
PGND_1
PGND_2
PGND_3
5%
1/16W
C2335
0.0068uF
0
50V
1uF
C2324
28
1
THERMAL
2
29
3
4
SN1302001(TPS65286RHDR)
5
6
V7V
7
R2343
IC2304
6A
9EN10
8
MODE/SYNC
10K
R2345
POWER_ON/OFF1
12
SW_EN213SW_EN1
SW_OUT211SW_OUT1
+5V_USB_2
+5V_USB_3
C2344
0.047uF
25V
0
C2347
82pF
50V
L2311
4.7uH
5%
R2
C2346
0.047uF
25V
100K
R2351
1/16W
/USB_OCD3
1%
R1
1%
R2354
1/16W
1/16W
1/16W
6.8K
R2352
51K
R2353
5%
100K
C2349
1uF
10V
C2351
22uF
10V
C2350
C2358
10uF
22uF
10V
+5V_NORMAL
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
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