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SAFETY PRECAUTIONS

SAFETY-RELATED COMPONENT WARNING!

There are special components used in this color monitor which are important for safety. These parts are marked on the schematic diagram and the replacement parts list. It is essential that these critical parts should be replaced with the manufacturer's specified parts to prevent X-radiation, shock, fire, or other hazards. Do not modify the original design without obtaining written permission from manufacturer or you will void the original parts and

labor guarantee.

CAUTION: No modification of any circuit should be attempted.

Service work should be performed only after you are thoroughly familiar with all of the following safety checks and servicing guidelines.

SAFETY CHECK

Care should be taken while servicing this color monitor because of the high voltage used in the deflection circuits. These voltages are exposed in such areas as the associated flyback and yoke circuits.

FIRE & SHOCK HAZARD

An isolation transformer must be inserted between the color monitor and AC power line before servicing the chassis.

•In servicing, attention must be paid to the original lead dress specially in the high voltage circuit. If a short circuit is found, replace all parts which have been overheated as a result of the short circuit.

•All the protective devices must be reinstalled per the original design.

•Soldering must be inspected for the cold solder joints, frayed leads, damaged insulation, solder splashes, or the sharp points. Be sure to remove all foreign materials.

IMPLOSION PROTECTION

All used display tubes are equipped with an integral implosion protection system, but care should be taken to avoid damage and scratching during installation. Use only same type display tubes.

X-RADIATION

The only potential source of X-radiation is the picture tube. However, when the high voltage circuitry is operating properly there is no possibility of an X-radiation problem. The basic precaution which must be exercised is keep the high voltage at the factory recommended level; the normal high voltage is about 25.8kV. The following steps describe how to measure the high voltage and how to prevent X- radiation.

Note : It is important to use an accurate high voltage meter calibrated periodically.

•To measure the high voltage, use a high impedance high voltage meter, connect (–) to chassis and (+) to the CDT anode cap.

•Set the brightness control to maximum point at full white pattern.

•Measure the high voltage. The high voltage meter should be indicated at the factory recommended level.

•If the meter indication exceeds the maximum level, immediate service is required to prevent the possibility of premature component failure.

•To prevent X-radiation possibility, it is essential to use the specified picture tube.

CAUTION:

Please use only a plastic screwdriver to protect yourself from shock hazard during service operation.

Leakage Current Hot Check Circuit

AC Volt-meter

Good Earth Ground such as WATER PIPE,

To Instrument's CONDUIT etc. exposed

METALLIC PARTS

1.5 Kohm/10W

- 3 -

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication.

NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1.Always unplug the receiver AC power cord from the AC power source before;

a.Removing or reinstalling any component, circuit board module or any other receiver assembly.

b.Disconnecting or reconnecting any receiver electrical plug or other electrical connection.

c.Connecting a test substitute in parallel with an electrolytic capacitor in the receiver.

CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

d.Discharging the picture tube anode.

2.Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe.

Do not test high voltage by "drawing an arc".

3.Discharge the picture tube anode only by (a) first connecting one end of an insulated clip lead to the degaussing or kine aquadag grounding system shield at the point where the picture tube socket ground lead is connected, and then (b) touch the other end of the insulated clip lead to the picture tube anode button, using an insulating handle to avoid personal contact with high voltage.

4.Do not spray chemicals on or near this receiver or any of its assemblies.

5.Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cottontipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength)

CAUTION: This is a flammable mixture.

Unless specified otherwise in this service manual, lubrication of contacts in not required.

6.Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

7.Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

8.Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead.

Always remove the test receiver ground lead last.

9.Use with this receiver only the test fixtures specified in this service manual.

CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1.Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.

2.After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3.Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4.Use only an anti-static type solder removal device. Some solder removal devices not classified as "antistatic" can generate electrical charges sufficient to damage ES devices.

5.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6.Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7.Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.

CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8.Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)

- 4 -

General Soldering Guidelines

1.Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 F to 600 F.

2.Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3.Keep the soldering iron tip clean and well tinned.

4.Thoroughly clean the surfaces to be soldered. Use a mall wire-bristle (0.5 inch, or 1.25cm) brush with a metal handle.

Do not use freon-propelled spray-on cleaners.

5.Use the following unsoldering technique

a.Allow the soldering iron tip to reach normal temperature.

(500 F to 600 F)

b.Heat the component lead until the solder melts.

c.Quickly draw the melted solder with an anti-static, suction-type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuitboard printed foil.

6.Use the following soldering technique.

a.Allow the soldering iron tip to reach a normal temperature (500 F to 600 F)

b.First, hold the soldering iron tip and solder the strand against the component lead until the solder melts.

c.Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil.

CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d.Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush.

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1.Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2.Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1.Carefully insert the replacement IC in the circuit board.

2.Carefully bend each IC lead against the circuit foil pad and solder it.

3.Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor

Removal/Replacement

1.Remove the defective transistor by clipping its leads as close as possible to the component body.

2.Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3.Bend into a "U" shape the replacement transistor leads.

4.Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device

Removal/Replacement

1.Heat and remove all solder from around the transistor leads.

2.Remove the heat sink mounting screw (if so equipped).

3.Carefully remove the transistor from the heat sink of the circuit board.

4.Insert new transistor in the circuit board.

5.Solder each transistor lead, and clip off excess lead.

6.Replace heat sink.

Diode Removal/Replacement

1.Remove defective diode by clipping its leads as close as possible to diode body.

2.Bend the two remaining leads perpendicular y to the circuit board.

3.Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4.Securely crimp each connection and solder it.

5.Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor

Removal/Replacement

1.Clip each fuse or resistor lead at top of the circuit board hollow stake.

2.Securely crimp the leads of replacement component around notch at stake top.

3.Solder the connections.

CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

- 5 -

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1.Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2.carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3.Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4.Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1.Remove the defective copper pattern with a sharp knife.

Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2.Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3.Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side.

Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

- 6 -

TIMING CHART

VIDEO

C B

SYNC

D E F

A

<< Dot Clock (MHz), Horizontal Frequency (kHz), Vertical Frequency (Hz), Horizontal etc... (µs), Vertical etc... (ms) >>

	Mode	H/V	Sync	Frequency	Total Period	Video Active	Blanking Time	Sync Duration	Back Porch	Front Porch	Resolution
		Sort	Polarity		(A)	Time (B)	(C)	(E)	(F)	(D)
	1	H	–	37.50	26.67	20.32	6.35	2.03	3.81	0.51	640x480
		V	–	74.99	13.335	12.802	0.533	0.080	0.427	0.026	75Hz
	2	H	+	46.88	21.33	16.16	5.17	1.62	3.23	0.32	800x600
		V	+	75.01	13.331	12.798	0.533	0.064	0.448	0.021	75Hz
	3	H	+	53.68	18.63	14.22	4.41	1.14	2.70	0.57	800x600
		V	+	85.07	11.755	11.178	0.577	0.056	0.503	0.018	85Hz
	4	H	+	68.677	14.561	10.836	3.725	1.016	2.201	0.508	1024x768
		V	+	85.00	11.764	11.182	0.582	0.044	0.524	0.014	85Hz

* No Support Composite Mode.

- 7 -

DISASSEMBLY

1.Carefully place the monitor on a soft cushion and stand it upright with the cabinet facing downward.

2.Remove the two screws from the back cover.

4.Separate the back cover from the latch at the bottom of the cabinet using the jig as shown in the figure.

(Insert the jig into the latch and lift slightly.)

3.Separate the back cover from the latch on top of the cabinet using a screwdriver as shown in

the figure.

(Insert the screwdriver and gently press the latch.)

5. Lift up the back cover to separate from cabinet assembly.

- 8 -

ADJUSTMENT

1. Preparation for Service Adjustment

GENERAL INFORMATION

All adjustment are thoroughly checked and corrected when the monitor leaves the factory, but sometimes several adjustments may be required.

Adjustment should be following procedure and after warming up for a minimum of 30 minutes.

•Alignment appliances and tools.

-IBM compatible PC.

-Programmable Signal Generator.

(eg. VG-819 made by Astrodesign Co.)

-EPROM or EEPROM with saved each mode data.

-Alignment Adaptor and Software.

-Digital Voltmeter.

-White Balance Meter.

-Luminance Meter.

-High-voltage Meter.

AUTOMATIC AND MANUAL DEGAUSSING

The degaussing coil is mounted around the CDT so that automatic degaussing when turn on the monitor. But a monitor is moved or faced in a different direction, become poor color purity cause of CDT magnetized, then press DEGAUSSING on the OSD menu.

ADJUSTMENT PROCEDURE & METHOD

-Install the cable for adjustment such as Figure 1and run the alignment program on the DOS for IBM compatible PC.

-Set external Brightness and Contrast volume to max position.

1.Adjustment for B+ Voltage.

1)Display cross hatch pattern at Mode 4.

2)Check D961 cathode voltage within 50V ± 1V .

2.Adjustment for High-Voltage.

1)Display cross hatch pattern at Mode 4.

2)Enter the SVC SUB menu as the following instruction.

3)Adjust H/Voltage to 25.8kV±0.1 kV by adjust 1-P value.

2. Adjustment by Service Hot key

How to enter SVC HOT KEY

1.Press Menu and OSD window will appear.

2.While OSD window is displayed, is seen on the left bottom of OSD window.

3.Press + power switch simultaneously and the screen will immediately refresh.

4.Press Menu and make sure that is changed to 1 2.

5.Follow the menu on the left of OSD window to find 12 and OSD will change as shown in the figure.

6.Select Degauss in the above figure and then press Select and to enter the screen of the SUB menu. (Back Raster for Pattern)

FOS SPEC

1.Size

H : 310 4mm

V : 230 4mm

Scanning frequency : All Mode (Mode 1~4) Display image : Cross hatch pattern

2.Centering

Scanning frequency : All Mode (Mode 1~4)

Display image : Crosshatch pattern

Horizontal : 10 Row

Vertical : 8 Row

			U
		L			R
			D
H : L-R
	4mm, V : U-D			4mm

3.Tilt

Scanning frequency : All Mode (Mode 1~4) Display image : Crosshatch pattern Horizontal : 10 Row

Vertical : 8 Row

		E	F
Tilt :	E-F	2.0mm

- 9 -

4.Distortion

Scanning frequency : All Mode (Mode 1~4) Display image : Crosshatch pattern Horizontal : 10 Row

Vertical : 8 Row

	B
E		G
F		H

CD

A-B	2.0mm,	C-D	2.0mm
E-F	2.0mm,	G-H	2.0mm

5.Displa Size drift

4mm : 25 Standard, 1035

0.5mm : 180V ~ 264V

6.Linearity

						Y1
						Y2
						Y3
						Y4
	X1		X2	X3	X4
Formula (Max - Min) / Max x 100(%)
Criteria : H - 10%			Max. (Upper 40kHz)
14%			Max. (Less 40kHz)

V - 8% Max.

7.Regulation Luminance 2mm

Dynamic(lode) 2mm

Scanning frequency : All Mode (Mode 1~4)

8.Trapezoid

			U-D	< 4mm
U							U
							D
D

9. Pin Balance

L1 R12.0mm

L1	R1
R1	L1

10. Parallelogram

4mm

11.Adjustment of white balance (Adjustment of chromaticity diagram)

*(Adjustment of white balance must be made after entering Hot Key Mode and DEGAUSS.)

CONDITIONS
Signal:	69 kHz / 85 Hz
Display image:	Back raster (Color 0,0)
Contrast:	Maximum
Brightness:	Maximum

Color temperature: 9300K

11-1. Adjustment of cut off (Adjustment of back raster)

11-1(a). Before adjustment, press Menu and Degauss to remove.

=> Enter hot key mode.

Adjust Brightness and Contrast to Max in OSD window.

(1)Adjust cut off (back raster) first. Enter DEGAUSS in the Menu and modify the following data.

Modify RCUT to Min , Modify GCUT To Min ,

Adjust to BCUT Data = 127 (7F (h)) , Adjust to SBRT Data = 205 ( CD (h)).

(2)Turn FBT screen volume on "CRT COLOR ANALYZER CA-100" equipment to adjust

Brightness to 0.4

0.05FL.

(3)Adjust RCUT, GCUT, and SBRT to set chromaticity diagram at :

x:0.283 0.005

y:0.298 0.005

Y: 0.40 0.05FL

*If color values would not be matched desirable values, repeat sequence 1 and 2 after readjusting “GREEN CUTOFF” control a little different.

- 10 -

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3.Adjustment Using Service software Program (Adjustment Program)

1.Adjustment for Factory Mode (Preset Mode).

1)Display cross hatch pattern at Mode All.

2)Run alignment program for 710BM/773NM on the IBM compatible PC.

3)EEPROM → ALL CLEAR → Y(Yes) command.

<Caution> Do not run this procedure unless the EEPROM is changed. All data in EEPROM (mode data and color data) will be erased.

4)COMMAND → PRESET START → Y(Yes) command.

5)DIST. ADJ. → FOS. ADJ command.

6)Adjust H-POSITION as arrow keys to center of the screen.

7)Adjust H-SIZE as arrow keys to 310 ± 2mm.

8)Adjust V-POSITION as arrow keys to center of the screen.

9)Adjust V-SIZE as arrow keys to 230 ± 2mm.

10)Adjust TRAPEZOID as arrow keys to be the best condition.

11)Adjust SIDE PINCUSHON as arrow keys to be the best condition.

12)Adjust TILT as arrow keys to be the best condition.

13)Display cross hatch pattern at Mode 4.

14)DIST. ADJ. → BALANCE DATA command.

15)Adjust balance of Pin-Balance as arrow keys to be the best condition.

16)Adjust parallelogram as arrow keys to be the best condition.

17)Save of the Mode.

18)Save of the System.

19)Display from Mode 4 and repeat above from number 6) to 16).

20)COMMAND → PRESET EXIT → Y (Yes) command.

2.Adjustment for White Balance and Luminance.

1)Set the White Balance Meter.

2)Press the DEGAUSSING on the OSD menu for demagnetization of the CDT.

3)Display color 0,0 pattern at Mode 4.

4)COMMAND → PRESET START → Y(Yes) command.

5)Set Bightness and Contrast to max position.

6)COLOR ADJ. → LUMINANCE command of the alignment program.

7)COLOR ADJ. → BIAS ADJ. command of the alignment program.

8)Check whether blue color or not at R-BIAS and G- BIAS to min position, Sub-Brightness to 205 (CD(h))position, B-Bias to 127(7F(h))position. If it's not blue color, the monitor must repair.

9)Adjust Screen control on the FBT to 0.4 ± 0.05FL of the raster luminance.

10)Adjust R-BIAS and G-BIAS command to x=0.283 ± 0.006 and y=0.298 ± 0.006 on the White Balance Meter with PC arrow keys.

11)Display color 15,0 Full White(70x70mm) at mode 4.

12)DRIVE ADJ command.

13)Set B-DRIVE to 90(5A(h)) at DRIVE of the alignment program.

14)Adjust R-DRIVE and G-DRIVE command to white balance x=0.283 ± 0.003 and y=0.298 ± 0.003 on the White Balance Meter with PC arrow keys.

15)Adjust SUB-CONTRAST command to 50±1FL of the raster luminance.

15)Display color 15,0 full white patten at Mode 4.

16)COLOR ADJ. → LUMINANCE → ABL command.

17)Adjust ABL to 32 ± 1FL of the luminance.

18)Exit from the program.

- 12 -

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