LG 70LB720T Schematic

Internal Use Only
LED TV
SERVICE MANUAL
CHASSIS : LT42B
MODEL : 70LB720T 70LB720T-DA
CAUTION
BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
Printed in KoreaP/NO : MFL68007722 (1403-REV00)
CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ................................................................................. 3
SPECIFICATION ....................................................................................... 6
ADJUSTMENT INSTRUCTION .............................................................. 17
EXPLODED VIEW .................................................................................. 25
SCHEMATIC CIRCUIT DIAGRAM ..............................................................
Only for training and service purposes
- 2 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.
It will also protect the receiver and it's components from being damaged by accidental shorts of th e cir cuitry that may be inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1 MΩ and 5.2 MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check. Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exp ose d metallic par t. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.
Leakage Current Hot Check circuit
Only for training and service purposes
- 3 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power source before;
a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explo­sion hazard.
2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture. Unless specied otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.
7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged eas­ily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component dam­age caused by static by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alter­natively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent poten­tial shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or expo­sure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classied as “anti-static” can generate electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electri­cally shorted together by conductive foam, aluminum foil or comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replace­ment ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity suf­cient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire­bristle (0.5 inch, or 1.25 cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there only until the solder ows onto and around both the compo­nent lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent at against the cir­cuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.
2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and solder it.
3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.
Power Output, Transistor Device Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as pos­sible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit board.
3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.
3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connec­tions).
1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.
1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly con­nected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.
Fuse and Conventional Resistor Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow stake.
2. Securely crimp the leads of replacement component around notch at stake top.
Only for training and service purposes
- 5 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement
.
1. Application range
This spec sheet is applied all of the 32”,39’’,42”,47”,55”,60”, 70” LED TV with LT42B chassis
2. Test condition
Each part is tested as below without special notice.
1) Temperature : 25 ºC ± 5 ºC, CST : 40 ºC±5 ºC
2) Relative Humidity: 65 % ± 10 %
3) Power Voltage Standard input voltage (100~240V@ 50/60Hz) * Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
ea ch drawing and s pe cificatio n b y p art number in accordance with BOM.
5) The receiver must be operated for about 20 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety : CE, IEC specification
- EMC: CE, IEC
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
4. General Specification
No Item Specication Remark
1. Display Screen Device 32” wide Color Display Module Resolution: 1366*768
32” wide Color Display Module Resolution: 1920*1080
39” wide Color Display Module Resolution: 1920*1080
42” wide Color Display Module Resolution: 1920*1080
47” wide Color Display Module Resolution: 1920*1080
50” wide Color Display Module Resolution: 1920*1080
55” wide Color Display Module Resolution: 1920*1080
60” wide Color Display Module Resolution: 1920*1080
70” wide Color Display Module Resolution: 1920*1080
2. Aspect Ratio 16:9 All
3. LCD Module 32" TFT WUXGA LCD
32" TFT WXGA LCD
39" TFT WXGA LCD
42" TFT WUXGA LCD
47” TFT WUXGA LCD
50” TFT WUXGA LCD
55” TFT WUXGA LCD
60” TFT WUXGA LCD
70” TFT WUXGA LCD
4. Operating Environment TFT 1) Temp. : 0 ~ 40 deg
5. Storage Environment TFT 1) Temp. : -20 ~ 60 deg
6. Input Voltage AC100 ~ 240V, 50/60Hz
7. Power Consumption(Max) = LCD(Module) + Backlight(LED)
FHD T240Hz Slim Direct
FHD M120Hz Direct
FHD M120Hz Direct M
FHD T240Hz Edge LED
2) Humidity : 0 ~ 85%
2) Humidity : 10 ~ 90%
60”’ 72.16 W
39” 45.74 W T390HVJ01.2 [39LB650T-DF]
42’’ TBD W LC420DUH-FGP2 [42LB6500-DF / 42LB650T-DF]
47’’ TBD W LC470DUH-FGP2 [47LB6500-DF / 47LB650T-DF]
50’’ 64.1 W LC500DUH-FGP2 [50LB6500-DF / 50LB650T-DF]
55’’ 62.5 W LC550DUH-FGP2 [55LB6500-DF / 55LB650T-DF]
60’’ TBD W LC600DUF-FGP2 [60LB6500-DF / 60LB650T-DF]
70” 189.5 W HC700DUF-VHHD2[70LB720T-DA]
60” 71.16 W LC600DUF-FGP1[60LB720T-DA]
55” 68.2 W LC550DUH-PGF1 [55LB700T-DF/6700-DA]
47” 41.29 W LC470DUH-PGF1 [47LB700T-DF/6700-DA]
42” 38.4 W LC420DUH-PGF1 [42LB700T-DF/6700-DA]
49”’ 50.24 W FPR : LC490EUH-LGF1 [49LB870T-DA]
LGE SPEC
LC600DUF-FGP1 [60LB720T-DA]
Only for training and service purposes
- 7 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
8. LCD Module Size Maker Inch (H) × (V) × (D)
LGD 42” 959.5 x 559.5 x 25.0 LC420DUH-FGP2
944.4 x 542.7 x 25.0 LC420DUH-PGF1
47” 1071 x.621.6x26.3 LC470DUH-FGP2
1056.1 x 605.5 x 25.0 LC470DUH-PGF1
49” 1086.3 X 622.0 X 9.9 LC490EUH-LGF1 [49LB870T-DA]
50” 1126.11 x 652.5 x 26.3 LC500DUH-FGP2
55” 1241.19 x 717.94 x 26 LC550DUH-FGP2
1226.0 x 701.1 x 25.0 LC550DUH-PGF1
60” 1350.89x 780.54 x 28 LC600DUF-FGP1 [60LB720T-DA]
1346.8 x 774.4 x 29.9 LC600DUF-FGP2
HeeSung 70” 1574.06 x 912.19 x30 HC700DUF-VHHD2[70LB720T-DA]
Pixel Pitch Maker Inch (H) × (V) × (D)
AUO 39’’ 444.75 x 444.75 T390HVJ01.2 [39LB650T-DF]
LGD 42’’ 541.5 x 541.5 LC420DUH-FGP2
47” 559.3 x 559.3 LC470DUH-FGP2
49” 570.75 x 570.75 LC490EUH-LGF1 [49LB870T-DA]
50” 630 x 630 LC500DUH-FGP2
55” 686.1 x 686.1 LC550DUH-FGP2
60” 483.3 x 483.3 LC600DUF-FGP1 [60LB720T-DA]
TBD LC600DUF-FGP2
HeeSung 70” 802 x 802 HC700DUF-VHHD2
[42LB6500-DF / 42LB650T-DF]
[42LB700T-DF/6700-DA]
[47LB6500-DF / 47LB650T-DF]
[47LB700T-DF/6700-DA]
[50LB6500-DF / 50LB650T-DF]
[55LB6500-DF / 55LB650T-DF]
[55LB700T-DF/6700-DA]
[60LB6500-DF / 60LB650T-DF]
[42LB6500-DF / 42LB650T-DF] LC420DUH-PGF1 [42LB700T-DF/6700-DA]
[47LB6500-DF / 47LB650T-DF] LC470DUH-PGF1 [47LB700T-DF/6700-DA]
[50LB6500-DF / 50LB650T-DF]
[55LB6500-DF / 55LB650T-DF] LC550DUH-PGF1 [55LB700T-DF/6700-DA]
[60LB6500-DF / 60LB650T-DF]
[70LB720T-DA]
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
9. Back Light Maker Inch TYPE Module Name
LGD 42” Edge
47”
49” FPR : LC490EUH-LGF1 [49LB870T-DA]
50”
55”
55 Direct M LC550DUH-PGF1
47” LC470DUH-PGF1
42” LC420DUH-PGF1
60” LC600DUF-FPG1 [ 60LB720T-DA]
70” HC700DUF-VHHD2[70LB720T-DA]
39’’ Direct L T390HVJ01.2 [39LB650T-DF]
42’’ LC420DUH-FGP2
47 LC470DUH-FGP2
50 LC500DUH-FGP2
55 LC550DUH-FGP2
60’’ LC600DUF-FGP2
Display Colors 1.06 B (10-bit) Except FHD 60Hz models
16.7 M (8-bit) FHD/HD 60Hz models
Coating 3H(Hard coating), Anti-glare
[55LB700T-DF/6700-DA]
[47LB700T-DF/6700-DA]
[42LB700T-DF/6700-DA]
[42LB6500-DF / 42LB650T-DF]
[47LB6500-DF / 47LB650T-DF]
[50LB6500-DF / 50LB650T-DF]
[55LB6500-DF / 55LB650T-DF]
[60LB6500-DF / 60LB650T-DF]
AUO_T390HVJ01.2 [39LB6500]
Only for training and service purposes
- 9 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
5. External Input Support Format
5.1. Component input(Y, CB/PB, CR/PR)
No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed
1. 720*480 15.73 60 13.5135 SDTV ,DVD 480I
2. 720*480 15.73 59.94 13.5 SDTV ,DVD 480I
3. 720*480 31.50 60 27.027 SDTV 480P
4. 720*480 31.47 59.94 27.00 SDTV 480P
5. 720*576 15.625 50* 13.5 SDTV 576I
6. 720*576 31.25 50* 13.5 SDTV 576P
7. 1280*720 37.5 50* 74.25 HDTV 720P
8. 1280*720 45.00 60.00 74.25 HDTV 720P
9. 1280*720 44.96 59.94 74.176 HDTV 720P
10. 1929*1080 28.125 50* 74.25 HDTV 1080I
11. 1920*1080 33.75 60.00 74.25 HDTV 1080I
12. 1920*1080 33.72 59.94 74.176 HDTV 1080I
13. 1920*1080 56.25 50* 148.5 HDTV 1080P
14. 1920*1080 67.50 60 148.50 HDTV 1080P
15. 1920*1080 67.432 59.94 148.352 HDTV 1080P
16. 1920*1080 27.00 24.00 74.25 HDTV 1080P
17. 1920*1080 26.97 23.976 74.176 HDTV 1080P
18. 1920*1080 33.75 30.00 74.25 HDTV 1080P
19. 1920*1080 33.71 29.97 74.176 HDTV 1080P
Only for training and service purposes
- 10 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
5.2. HDMI : EDID DATA : Refer to adjust specification
5.2.1. DTV mode
No Resolution H-freq(kHz) V-freq.(Hz)
1 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I) Spec. out but display
2 15.75 60.00 13.514 SDTV, DVD 480I(525I)
3 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz
4 720*480 31.47 59.94 27 SDTV 480P
5 31.5 60.00 27.027 SDTV 480P
6 720*576 31.25 50.00 27 SDTV 576P
7 1280*720 44.96 59.94 74.176 HDTV 720P
8 45 60.00 74.25 HDTV 720P
9 37.5 50.00 74.25 HDTV 720P
10 1920*1080 28.125 50.00 74.25 HDTV 1080I
11 33.72 59.94 74.176 HDTV 1080I
12 33.75 60.00 74.25 HDTV 1080I
13 26.97 23.976 63.296 HDTV 1080P
14 27.00 24.000 63.36 HDTV 1080P
15 33.71 29.97 79.120 HDTV 1080P
16 33.75 30.00 79.20 HDTV 1080P
17 56.25 50.00 148.5 HDTV 1080P
18 67.432 59.94 148.350 HDTV 1080P
19 67.5 60.00 148.5 HDTV 1080P
Pixel
clock(MHz)
Proposed Remark
5.2.2. PC mode
No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed Remarks
1 640*350 31.468 70.09 25.17 EGA
2 720*400 31.469 70.09 28.32 DOS
3 640*480 31.469 59.94 25.17 VESA(VGA)
4 800*600 37.879 60.31 40 VESA(SVGA)
5 1024*768 48.363 60.00 65 VESA(XGA)
6 1152*864 54.348 60.053 80.002 VESA(VGA)
7 1360*768 47.712 60.015 84.75 VESA(WXGA)
8 1280*1024 63.981 60.020 109.00 SXGA
9 1920*1080 67.5 60 158.40 WUXGA (Reduced Blanking) Only FHD Model
Only FHD Model (Support to HDMI-PC)
Only for training and service purposes
- 11 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
5.3. 3D mode
5.3.1. RF Input (3D supported mode manually)
No Resolution Proposed 3D input proposed mode
1 HD 1080I
720P
2 SD 576P
576I
5.3.2. RF Input (3D supported mode automatically)
No Signal 3D input proposed mode
1 Frame Compatible Side by Side(Half), Top & Bottom
5.3.3. HDMI Input 1.3(3D supported mode manually)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark
1 1280*720 45.00 60.00 74.25 HDTV 720P 2D to 3D
2 1280*720 37.500 50 74.25 HDTV 720P 2D to 3D
3 1920*1080 33.75 60.00 74.25 HDTV 1080I 2D to 3D
4 1920*1080 28.125 50.00 74.25 HDTV 1080I 2D to 3D
5 1920*1080 27.00 24.00 74.25 HDTV 1080P 2D to 3D
6 1920*1080 28.12 25 74.25 HDTV 1080P 2D to 3D
7 1920*1080 33.75 30.00 74.25 HDTV 1080P 2D to 3D
8 1920*1080 56.25 50 148.5 HDTV 1080P 2D to 3D
9 1920*1080 67.50 60.00 148.5 HDTV 1080P 2D to 3D
2D to 3D Side by Side(Half) Top & Bottom
2D to 3D
Side by Side(half), Top & Bottom, Single Frame Sequential
Side by Side(half), Top & Bottom, Single Frame Sequential
Side by Side(half), Top & Bottom
Side by Side(half), Top & Bottom
Side by Side(half), Top & Bottom, Checkerboard
Side by Side(half), Top & Bottom, Checkerboard
Side by Side(half), Top & Bottom, Checkerboard
Side by Side(half), Top & Bottom, Checkerboard, Single Frame Sequential, Row Interleaving, Column Interleaving
Side by Side(half), Top & Bottom, Checkerboard, Single Frame Sequential, Row Interleaving, Column Interleaving
Only for training and service purposes
- 12 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
5.3.4. HDMI Input 1.4b (3D supported mode automatically)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) 3D input proposed
mode
1 640*480 31.469 / 31.5 59.94/ 60 25.175/25.2 Top-and-Bottom
Side-by-side(half)
2 62.938 / 63 59.94/ 60 50.35/50.4 Frame packing
Line alternative
3 31.469 / 31.5 59.94/ 60 50.35/50.4 Side-by-side(Full) (SDTV 480P)
4 720*480 31.25 50 27 Top-and-Bottom
Side-by-side(half)
5 62.5 50 54 Frame packing
Line alternative
6 31.25 50 54 Side-by-side(Full) (SDTV 480P)
7 720*576
(576p)
8 62.5 50 54 Frame packing
9 31.25 50 54 Side-by-side(Full) (SDTV 576P)
10 720 (1440)*576
(576i)
11 31.25 50 54 Frame packing
12 15.625 50 54 Side-by-side(Full) (SDTV 576I)
13 1280*720 37.5 50 74.25 Top-and-Bottom
14 75 50 148.5 Frame packing
15 37.5 50 148.5 Side-by-side(Full) (HDTV 720P)
16 44.96 / 45 59.94 / 60 74.18/74.25 Top-and-Bottom
17 89.91 / 90 59.94 / 60 148.35/148.5 Frame packing
18 44.96 / 45 59.94 / 60 148.35/148.5 Side-by-side(Full) (HDTV 720P)
31.25 50 27 Top-and-Bottom Side-by-side(half)
Line alternative
15.625 50 27 Top-and-Bottom Side-by-side(half)
Field alternative
Side-by-side(half)
Line alternative
Side-by-side(half)
Line alternative
Secondary(SDTV 480P) Secondary(SDTV 480P)
Secondary(SDTV 480P) (SDTV 480P)
Secondary(SDTV 480P) Secondary(SDTV 480P)
Secondary(SDTV 480P) (SDTV 480P)
Secondary(SDTV 576P) Secondary(SDTV 576P)
Secondary(SDTV 576P) (SDTV 576P)
Secondary(SDTV 576I) Secondary(SDTV 576I)
Secondary(SDTV 576I) (SDTV 576I)
Primary(HDTV 720P) Primary(HDTV 720P)
Primary(HDTV 720P) (HDTV 720P)
Primary(HDTV 720P) Primary(HDTV 720P)
Primary(HDTV 720P) (HDTV 720P)
Proposed
Only for training and service purposes
- 13 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) 3D input proposed
mode
19 1920*1080 33.72 / 33.75 59.94 / 60 74.18/74.25 Top-and-Bottom
Side-by-side(half)
20 67.432 / 67.5 59.94 / 60 148.35/148.5 Frame packing
Field alternative
21 33.72 / 33.75 59.94 / 60 148.35/148.5 Side-by-side(Full) (HDTV 1080I)
22 28.125 50.00 74.25 Top-and-Bottom
Side-by-side(half)
23 56.25 50.00 148.5 Frame packing
Field alternative
24 28.125 50.00 148.5 Side-by-side(Full) (HDTV 1080I)
25 26.97 / 27 23.97 / 24 74.18/74.25 Top-and-Bottom
Side-by-side(half)
26 43.94 / 54 23.97 / 24 148.35/148.5 Frame packing
Line alternative
27 26.97 / 27 23.97 / 24 148.35/148.5 Side-by-side(Full) (HDTV 1080P)
28 28.12 25 74.25 Top-and-Bottom
Side-by-side(half)
29 56.25 25 148.5 Frame packing
Line alternative
30 28.125 25 148.5 Side-by-side(Full) (HDTV 1080P)
31 33.716 / 33.75 29.976 / 30.00 74.18/74.25 Top-and-Bottom
Side-by-side(half)
32 67.432 / 67.5 29.976 / 30.00 148.35/148.5 Frame packing
Line alternative
33 33.716 / 33.75 29.976 / 30.00 148.35/148.5 Side-by-side(Full) (HDTV 1080P)
34 56.25 50 148.5 Top-and-Bottom
Side-by-side(half)
35 67.43 / 67.5 59.94 / 60 148.35/148.50 Top-and-Bottom
Side-by-side(half)
Secondary(HDTV 1080I) Primary(HDTV 1080I)
Primary(HDTV 1080I) (HDTV 1080I)
Secondary(HDTV 1080I) Primary(HDTV 1080I)
Primary(HDTV 1080I) (HDTV 1080I)
Primary(HDTV 1080P) Primary(HDTV 1080P)
Primary(HDTV 1080P) (HDTV 1080P)
Secondary(HDTV 1080P) Secondary(HDTV 1080P)
Secondary(HDTV 1080P) (HDTV 1080P)
Primary(HDTV 1080P) Secondary(HDTV 1080P)
Primary(HDTV 1080P) (HDTV 1080P)
Primary(HDTV 1080P) Secondary(HDTV 1080P)
Primary(HDTV 1080P) Secondary(HDTV 1080P)
Proposed
5.3.5. HDMI-PC 3D Input (3D supported mode manually)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) 3D input proposed mode Proposed
1 1024*768 48.36 60 65 2D to 3D,
Side by Side(half) Top & Bottom
2 1360*768 47.71 60 85.5 2D to 3D,
Side by Side(half) Top & Bottom
3 1920*1080 67.500 60 148.50 2D to 3D,
Side by Side(half) Top & Bottom, Checker Board, Single Frame Sequential Row Interleaving, Column Interleaving
4 Others - - - 2D to 3D 640*350
- 14 -
Only for training and service purposes
HDTV 768P
HDTV 768P
HDTV 1080P
720*400 640*480 800*600 1152*864
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
5.3.6. Component 3D Input (3D supported mode manually)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) 3D input proposed mode Proposed
1 1280*720 37.5 50 74.25 2D to 3D,
Side by Side(half), Top & Bottom
2 1280*720 45.00 60.00 74.25 2D to 3D,
Side by Side(half), Top & Bottom
3 1280*720 44.96 59.94 74.176 2D to 3D,
Side by Side(half) Top & Bottom
4 1920*1080 33.75 60.00 74.25 2D to 3D,
Side by Side(half) Top & Bottom
5 1920*1080 33.72 59.94 74.176 2D to 3D,
Side by Side(half) Top & Bottom
6 1920*1080 28.12 50 74.25 2D to 3D,
Side by Side(half) Top & Bottom
7 1920*1080 67.500 60 148.50 2D to 3D,
Side by Side(half) Top & Bottom
8 1920*1080 67.432 59.94 148.352 2D to 3D,
Side by Side(half) Top & Bottom
9 1920*1080 27.000 24.000 74.25 2D to 3D,
Side by Side(half) Top & Bottom
10 1920*1080 28.12 25 74.25 2D to 3D,
Side by Side(half) Top & Bottom
11 1920*1080 56.25 50 74.25 2D to 3D,
Side by Side(half) Top & Bottom
12 1920*1080 26.97 23.976 74.176 2D to 3D,
Side by Side(half) Top & Bottom
13 1920*1080 33.75 30.000 74.25 2D to 3D,
Side by Side(half) Top & Bottom
14 1920*1080 33.71 29.97 74.176 2D to 3D,
Side by Side(half) Top & Bottom
HDTV 720P
HDTV 720P
HDTV 720P
HDTV 1080I
HDTV 1080I
HDTV 1080I
HDTV 1080P
HDTV 1080P
HDTV 1080P
HDTV 1080P
HDTV 1080P
HDTV 1080P
HDTV 1080P
HDTV 1080P
Only for training and service purposes
- 15 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
5.3.7. USB Input (3D) (3D supported mode manually)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) 3D input proposed mode Proposed
1 1920*1080 33.75 30 74.25 2D to 3D
Side by Side(Half)*, Top & Bottom*, Checkerboard* Row Interleaving, Column Interleaving (Photo : side by Side(half), Top & Bottom)
HDTV 1080P
5.2.8. DLNA Input (3D)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) 3D input proposed mode Proposed
1 1920*1080 33.75 30 74.25 2D to 3D
Side by Side(Half)*, Top & Bottom*, Checkerboard* Row Interleaving, Column Interleaving (Photo : side by Side(half), Top & Bottom)
HDTV 1080P
Only for training and service purposes
- 16 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied all of the LT42B LED TV models, which produced in manufacture department or similar LG TV factory
2. Notice
(1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation transformer will help protect test instrument.
(2) Adjustment must be done in the correct order. But it is
flexible when its factory local problem occurs.
(3) The adjustment must be performed in the circumstance of
25 ±5ºC of temperature and 65±10% of relative humidity if there is no specific designation.
(4) The input voltage of the receiver must keep 100~220V,
50/60Hz.
(5) Before adjustment, execute Heat-Run for 5 minutes.
▪ After Receive 100% Full white pattern (06CH) then process
Heat-run
(or “8. Test pattern” condition of Ez-Adjust status)
▪ How to make set white pattern
1) Press Power ON button of Service Remocon
2) Pr ess ADJ button of Service remocon. Select “8. Test pattern” and, after select “White” using navigation button, and then you can see 100% Full White pattern.
* In this status you can maintain Heat-Run useless any pattern
generator
* Notice : if you mai nt ain one pictu re ov er 20 minutes
(Especially sharp distinction black with white pattern
-13Ch, or Cross hatch pattern – 09Ch) then it can appear image stick near black level.
4. PCB Assembly Adjustment
4.1. MAC Address, ESN Key and Widevine Key download
4.1.1. Equipment & Condition
1) Play file: keydownload.exe
4.1.2. Communication Port connection
1) Key Write: Com 1,2,3,4 and 115200 (Baudrate)
2) Barcode: Com 1,2,3,4 and 9600 (Baudrate)
4.1.3. Download process
1) Select the download items.
2) Mode check: Online Only
3) Check the test process
- DETECT -> MAC_WRITE -> ESN_WRITE -> WIDEVINE_ WRITE
4) Play : START
5) Check of result: Ready, Test, OK or NG
4.1.4. Communication Port connection
1) Connect: PCBA Jig -> RS-232C Port == PC -> RS-232C
Port
3. Adjustment items
3.1. PCB Assembly Adjustment
▪ MAC Address / ESN / Widevine / HDCP1.4 / HDCP 2.0
Download
▪ EDID (The Extended Display Identification Data)/DDC
(Display Data Channel) download * If it is necessary, it can adjustment at Manufacture Line You can see set adjustment status at “1. ADJUST CHECK”
of the “In-start menu”
3.2. Set Assembly Adjustment
▪ Color Temperature (White Balance) Adjustment ▪ Using RS-232C ▪ PING Test ▪ Selection Factory output option
Only for training and service purposes
4.1.5. Download
1) 14Y LCD TV+MAC+Widevine+ESN Key+ HDCP1.4 and HDCP2.0
4.1.6. Inspection
- In INSTART menu, check these keys.
- 17 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
4.2. LAN PORT INSPECTION(PING TEST)
4.2.1. Equipment setting
1) Play the LAN Port Test PROGRAM.
2) Input IP set up for an inspection to Test Program.
*IP Number : 12.12.2.2.
4.2.2. LAN PORT inspection (PING TEST)
1) Play the LAN Port Test Program.
2) connect each other LAN Port Jack.
3) Play Test (F9) button and confirm OK Message.
4) remove LAN CABLE
4.3. ADC Adjust => No need at Assembly line because of OPT type
* OTP mode Automatic ADC Calibration. (Internal ADC Calibration) On the manufacture line, OTP is used for ADC Calibration automatically.
* External mode Manual ADC Calibration. When OTP mode is failed, ADC calibration should be “OK” by using External mode.
- If you want re-adjust for ADC.
■ Enter Service Mode by pushing “ADJ” key,
■ Enter Internal ADC mode by pushing “►” key at “9. ADC
Calibration”
Adjustment protocol
Order Command Set response
(1) Inter the Adjustment mode aa 00 00 a 00 OK00x
(2) Change the Source xb 00 40 b 00 OK40x (Adjust 480i Comp1 )
(3) Start Adjustment ad 00 10
(4) Return the Response OKx ( Success condition )
(5) Read Adjustment data ( main)
ad 00 20 ( main ) ad 00 30
(6) Conrm Adjustment ad 00 99 NG 03 00x (Failed condition)
(7) End of Adjustment ad 00 90 d 00 OK90x
(Adjust 1080p Comp1)
NGx ( Failed condition )
(main : component1 480i) 000000000000000000000000007c007b­006dx (main : component1 1080p) 000000070000000000000000007c0083 0077x
NG 03 01x (Failed condition) NG 03 02x (Failed condition) OK 03 03x (Success condition)
Only for training and service purposes
- 18 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
5. Factory Adjustment
5.1. EDID (The Extended Display Identification Data)/DDC (Display Data Channel) Download
● Summary
▪ It is established in VESA, for communication between PC
and Monitor without order from user for building user condition. It helps to make easily use realize “Plug and Play” function. For EDID data write, we use DDC2B protocol.
● Auto Download (No need Writing EDID data in Assembly line)
▪ After Set Tool Option, then TV turn off and on finish auto
download
* EDID data for 3DTV (LB65/67/72/87 Serise) (Model name =
LG TV ) .
*Rev. 15xxx to confirm that, Rev. up subject to change
- HDMI EDID table
- HDMI-1 EDID table (0XE8, 0xCC)
* EDID data for Non-3DTV (FHD) (Model name = LG TV ) *Rev. 24xxx to confirm that, Rev. up subject to change
- HDMI EDID table
- HDMI-1 EDID table (0x42, 0X1B)
A. If the LVDS supports 8bit (not support Deep color) , CEA
Block 0x23 :80, 0x24 : 1E) (1) HDMI 1 Check sum : 0x42, 0X1B (CEA Block 0x21 :10) (2) HDMI 2 Check sum : 0x42, 0X0B (CEA Block 0x21 :20) (3) HDMI 3 Check sum : 0x42, 0XFB (CEA Block 0x21 :30)
A. If support 8bit (not support Deep color) (1) HDMI 1 Check sum : 0xE8, 0XCC (CEA Block 0x21 :10) (2) HDMI 2 Check sum : 0x E8, 0XBC (CEA Block 0x21 :20) (3) HDMI 3 Check sum : 0x E8, 0XAC (CEA Block 0x21 :30)
B. If support 10bit (support Deep color) (1) HDMI 1 Check sum : 0xE8, 0X85 (CEA Block 0x21 :10) (2) HDMI 2 Check sum : 0x E8, 0X75 (CEA Block 0x21 :20) (3) HDMI 3 Check sum : 0x E8, 0X65 (CEA Block 0x21 :30)
B. If the LVDS supports 10bit (support Deep color) , CEA Block
0x23 :B8, 0x24 : 2D) (1) HDMI 1 Check sum : 0x42, 0XD4 (CEA Block 0x21 :10) (2) HDMI 2 Check sum : 0x42, 0XC4 (CEA Block 0x21 :20) (3) HDMI 3 Check sum : 0x42, 0XB4 (CEA Block 0x21 :30
* EDID data for Non-3DTV (HD) (Model name = LG TV) *Rev. 24xxx to confirm that, Rev. up subject to change
- HDMI EDID table
- HDMI-1 EDID table (0X76, 0XE2)
Only for training and service purposes
- 19 -
(1) HDMI 1 Check sum : 0X76, 0XE2 (CEA Block 0x21 :10) (2) HDMI 2 Check sum : 0X76, 0XD2 (CEA Block 0x21 :20) (3) HDMI 3 Check sum : 0X76, 0XC2 (CEA Block 0x21 :30)
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
5.2. Adjustment White balance
● W/B Equipment condition
CA210 : CH 14, Test signal : Inner pattern (80IRE) – LED
Module
CH18 , Test signal : Inner pattern (80IRE) – ALEF
Module
● Above 5 minutes H/run in the inner pattern. (“power on” key of
adjust remote control)
The spec of color temperature and coordinate.
X=0.271
Cool (C50) 13,000k K
All
Medium (0) 9,300k K
Warm (W50) 6,500k K
Normal line(LGD Module (LB5xxx, LB6xxx, LB7xxx, LB8xxx))
- Except Winter Season ( Jan. , Feb. ) and Global table
Cool Medium Warm
H/R Time(Min)
1 0-2 282 289 297 308 324 348
2 3-5 281 287 296 306 323 346
3 6-9 279 284 294 303 321 343
4 10-19 277 280 292 299 319 339
5 20-35 275 277 290 296 317 336
6 36-49 274 274 289 293 316 333
7 50-79 273 272 288 291 315 331
8 80-119 272 271 287 290 314 330
9 Over 120 271 270 286 289 313 329
x y x x y x
271 270 286 289 313 329
AUO, INX, Sharp, CSOT, BOE Model (in case, Cool spec =
13000K)
cool med warm
x y x y x y
spec 271 270 286 289 313 329
target 278 280 293 299 320 339
(±0.002) Y=0.270 (±0.002)
X=0.286 (±0.002) Y=0.289 (±0.002)
X=0.313 (±0.002) Y=0.329 (±0.002)
<Test signal>
- Inner pattern for W/B adjust
- External white
pattern (80IRE, 204gray)
Connecting picture of the measuring instrument (On Automatic
control)
Inside PATTERN is used when W/B is controlled. Connect to auto controller or push Adjustment R/C POWER-ON -> Enter the mode of White-Balance, the pattern will come out
● Auto-control interface and directions
(1) Adjust in the place where the influx of light like floodlight
around is blocked. (Illumination is less than 10ux).
(2) Adhere closely the Color Analyzer ( CA210 ) to the module
less than 10cm distance, keep it with the surface of the Module and Color Analyzer’s Prove vertically.(80~100°).
(3) Aging time
- After aging start, keep the power on (no suspension of power supply) and heat-run over 5 minutes.
- Using ‘no signal’ or ‘full white pattern’ or the others, check the back light on.
● Auto adjustment Map(RS-232C)
RS-232C COMMAND [ CMD ID DATA ] Wb 00 00 White Balance Start Wb 00 ff White Balance End
RS-232C COMMAND
[CMD ID DATA]
Cool Mid Warm 00 Cool Mid Warm
R Gain Jg ja jd 00 172 192 192 192
G Gain Jh jb je 00 172 192 192 192
B Gain Ji jc jf 192 192 172 192
R Gain 64 64 64 128
G Gain 64 64 64 128
B Gain 64 64 64 128
MIN CENTER
(DEFAULT)
MAX
Only for training and service purposes
- 20 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
● Manual W/B process using adjusts Remote control.(TBD)
- Co lor analyzer(CA100+, CA210) should be used in the calibrated ch by CS-1000
- Operate the zero-calibration of the CA100+ or CA-210, then stick sensor to the module when adjusting.
- After enter Service Mode by pushing “ADJ” key,
- Enter White Balance by pushing “►” key at “8. White
Balance”
● For manual adjustment, it is also possible by the following
sequence
(1) Set TV in Adj. mode using “P-ONLY” key on remote controller
and then operate heat run longer than 15 minutes.
(I f not executed this step, the condition for W/B may be
different.) (2) Push “Exit” key. (3) Enter White Balance mode by pushing the ADJ key and select
“8. White Balance”. When KEY (►) is pressed, 206 Gray
internal pattern will be displayed.
(4) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface
(5) Select each items (Red/Green/Blue Gain) using ▲/▼(CH +/-)
key on R/C..
(6) Adjust R/ G/ B Gain using ◄/►(VOL +/-) key on R/C.
(7) Adjust three modes all (Cool / Medium / Warm) -Fix the one of
R/G/B gain and change the others
(8) When adjustment is completed, exit adjustment mode using
EXIT key on R/C.
CASE Cool
- First adjust the coordinate far away from the target value(x, y). (1) x, y > target (i) Decrease the R, G. (2) x, y < target (i) First decrease the B gain, (ii) Decrease the one of the others. (3) x > target , y < target (i) First decrease B, so make y a little more than the target. (ii) Adjust x value by decreasing the R (4) x < target , y > target (i) First decrease B, so make x a little more than the target. (ii) Adjust x value by decreasing the G
● RS-232C Command (Commonly apply)
RS-232C COMMAND
CMD DATA ID
wb 00 00 White Balance adjustment start
Wb 00 10
wb 00 1f End of gain adjust
wb 00 20
wb 00 2f End of offset adjust
wb 00 ff End of White Balance adjust
Start of adjust gain (Inner white pattern)
Start of offset adjust(Inner white pattern)
(Inner pattern disappeared)
Explanation
▪ “wb 00 00”: Start Auto-adjustment of white balance. ▪ “wb 00 10”: Start Gain Adjustment (Inner pattern) ▪ “jb 00 c0” : ▪ … ▪ “wb 00 1f”: End of Adjustment
* If it needs, offset adjustment (wb 00 20-start, wb 00 2f-end)
▪ “wb 00 ff”: End of white balance adjustment (inner pattern
disappear)
Notice) Adjustment Mapping information
RS-232C COMMAND
[CMD ID DATA]
Cool Mid Warm 00 Cool Mid Warm
R Gain Jg ja jd 00 172 192 192 192
G Gain Jh jb je 00 172 192 192 192
B Gain Ji jc jf 192 192 172 192
R Gain 64 64 64 128
G Gain 64 64 64 128
B Gain 64 64 64 128
MIN CENTER
(DEFAULT)
MAX
5.3. Magic Motion remote controller Check (Only LB67/LB69/LB772/LB87)
5.3.1 Test equipment
- RF-remote controller for check, IR-KEY-CODE remote controller.
- Check AA battery before test. A recommendation is that a tester change battery every lots.
5.3.2. Test
(1) Make pairing with TV set by pressing “Mute (START) key”
on RCU.
(2) Check a cursor on screen by pressing ‘ENTER” or “OK”
key of RCU
(3) Stop paring with TV set by pressing “VOL+ (STOP) key.
After You finish all adjustments, Press “In-start” button and
compare Tool option and Area option value with its BOM, if it is correctly same then unplug the AC cable.
If it is not same, then correct it same with BOM and unplug AC
cable. For correct it to the model’s module from factory JIG model.
Push The “I N STOP KEY” after completing the functi on
inspection.
Only for training and service purposes
- 21 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
5.4. 3D pattern test
5.4.1. Test equipment
(1) Pattern Generator MSHG-600 or MSPG-6100 (HDMI 1.4
support)
(2) Pattern: HDMI mode (model No. 872, pattern No. 83)
5.5. HDMI ARC Function Inspection
5.5.1. Test equipment
- Optic Receiver Speaker
- MSHG-600 (SW: 1220 ↑)
- HDMI Cable (for 1.4 version)
5.4.2. Test method
(1) Input 3D test signal as Fig.1.
(2) Press ‘OK” key as a 3D input OSD is shown. (3) Check pattern as Fig2 without 3D glasses. (3D mode
without 3D glasses)
<OK in 3D mode without 3D glasses>
Fig.2
5.5.2. Test method
(1) Insert the HDMI Cable to the HDMI ARC port from the
master equipment (HDMI1)
(2) Check the sound from the TV Set
(3) Check the Sound from the Speaker or using AV & Optic
TEST program (It’s connected to MSHG-600)
<NG in 3D mode without 3D glasses>
Only for training and service purposes
Fig.3
* Remark: Inspect in Power Only Mode and check SW version
in a master equipment
5.6. Selection of Country option
Selection of country option is allowed only North American model (Not allowed Korean model). It is selection of Country about Rating and Time Zone.
▪ Models: All models which use LJ22E Chassis (See the first
page.)
▪ Press “In-Start” button of Service Remocon, then enter the
“Option” Menu with “PIP CH-“ Button
▪ Select one of these three (USA, CANADA, MEXICO) defends
on its market using “Vol. +/-“button.
- 22 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
5.7. MHL Test
Green Eye-Check
Sensor Data : 492 BackLight : 100
OK
Step 1) Turn on TV Step 2) Select HDMI4 mode using input Menu. Step 3) Set MHL Zig(M1S0D3617) using MHL input, output
and power code.
Step 4) Connect HDMI cable between MHL Zig and HDMI4
port.
Step 5) Check LED light of Zig and Module of Set
5.9. Intelligent Sensor Inspection
Step 1) Turn on the TV set. Step 2) Press “ EY E” button o n t he Adjust me nt remote
controller.
Step 3) Block the Intelligent Sensor module on the front C/A
about 6 seconds. When the “Sensor Data” is lower than 20, you can see the “OK” message
=> If it doesn’t show “OK” message, the Sensor Module is
defected one. You have to replace that with a good one.
Step 4) After check the “OK” message come out, take out your
hand from the Sensor module
=> Check “Sensor Data” value change from “0” to “300” or
not. If it doesn’t change the value, the sensor is also defected one. You have to replace it.
Caution : Don’t push The INSTOP KEY after completing the
function inspection
Result) If, The LED light is green and The Module shows normal stream -> OK Else -> NG
Caution : Don’t push The INSTOP KEY after completing the
function inspection.
5.8. Local Dimming Function Check
Step 1) Turn on TV Step 2) Press “TILT” key on the Adj. R/C Step 3) At the Local Dimming mode, module Edge Backlight
moving left to right. Back light of IOP module moving Step 4) confirm the Local Dimming mode. Step 5) Press “exit” key.
Only for training and service purposes
6. GND and HI-POT Testing
6.1. GND & HI-POT auto-check preparation Check the connection between set and power cord
(1) Check the POWER CABLE and SIGNAL CABE insertion
condition
6.2. GND & HI-POT auto-check
(1) Pallet moves in the station. (POWER CORD / AV CORD is
tightly inserted) (2) Connect the AV JACK Tester (3) Controller (GWS103-4) on. (4) GND Test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, execute next process (Hi-pot test). (Remove A/V CORD from A/V JACK BOX) (5) HI-POT test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, GOOD Lamp on and move to next process
automatically
6.3. Check Point
(1) Test voltage 3 Poles : GND: 1.5KV/min at 100mA / SIGNAL: 3KV/min at
100mA (2) TEST time: 1 second (3) TEST POINT 3 Poles : GND Test = POWER CORD GND and SIGNAL
CABLE GND. Hi-pot Test = POWER CORD GND and LIVE & NEUTRAL. (4) LEAKAGE CURRENT: At 0.5mArms
- 23 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
7. Default Service option
7.1. ADC-Set
▪ R-Gain adjustment Value (default 128) ▪ G-Gain adjustment Value (default 128) ▪ B-Gain adjustment Value (default 128) ▪ R-Offset adjustment Value (default 128) ▪ G-Offset adjustment Value (default 128) ▪ B-Offset adjustment Value (default 128)
7.2. White balance. Value
CENTER (DEFAULT)
C50 0 W50
R Gain 192 192 192
G Gain 192 192 192
B Gain 192 192 192
R Cut 64 64 64
G Cut 64 64 64
B Cut 64 64 64
8. USB DOWNLOAD (*.epk file download)
(1) Put the USB Stick to the USB socket (2) Press Menu key, and move General *before 10.2 Step. Set USB Expert Mode : Enabled IN START > System 3 > USB Expert Mode
(3) Press “number key 7” Press 7 times
(4) Select download file (epk file) (5) After download is finished, remove the USB stick. ( it will be
auto-reboot )
(6) Press “IN-START” key of ADJ remote control, check the
S/W version.
Only for training and service purposes
- 24 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
400
EXPLODED VIEW
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essenti al that these special safet y parts shoul d be replac ed with the same compo nents as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
710
700
410
560
900
LV1
200
521
540
800
530
500
200T
121
120
AT1
AG1
A10
Set + Stand
A22
Only for training and service purposes
- 25 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
System Configuration
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
Clock for M14-A0
MAIN Clock(24Mhz)
LOADCAP_ATSC_PCB
10pF
C101
C102 LOADCAP_ATSC_PCB
System Clock for Analog block(24Mhz)
PLL SET[1:0] : internal pull up "00" : CPU(1200Mhz),M0 / M1 DDR(792,792 Mhz) "01" : CPU(1056Mhz),M0 / M1 DDR(672,672 Mhz) "10" : CPU(1056Mhz),M0 / M1 DDR(792,792 Mhz) "11" : CPU( 960Mhz),M0 / M1 DDR(792,792 Mhz)
OP MODE[1:0] "00" : Normal Mode "01/10/11" : Internal Test mode
+3.3V_NORMAL
R101 3.3K
R102 3.3K
Extenal test only
+3.3V_NORMAL
+3.3V_TUNER
R148
3.3K
R146
3.3K
KR_PIP_NOT
KR_PIP_NOT
1.5K
1.5K
KR_PIP
R146-*1
KR_PIP
R148-*1
10pF
Extenal test only
OPT
OPT
R149
2
3
OPT
R103 3.3K
R104 3.3K
OPT
3.3K
X-TAL_1
GND_1
1
4
X-TAL_2
OPM1
OPM0
24MHz
GND_2
X101
R118
PLLSET1
PLLSET0
+3.3V_TUNER
R150
3.3K
R155
1.2K
KR_PIP_NOT
KR_PIP_NOT
3.3K
KR_PIP
KR_PIP
R155-*1
1M
R180 560
LOADCAP_DVB_PCB
C101-*1
6.8pF 50V
+3.3V_NORMAL
INSTANT boot MODE "1 : Instant boot "0 : normal
3.3K
R121
(internal pull down)
OPT
INSTANT_MODE0
+3.3V_NORMAL
R158
R157
R156
3.3K
R156-*1
3.3K
1.2K
XTAL_IN
XTAL_OUT
LOADCAP_DVB_PCB
C102-*1
6.8pF 50V
INSTANT_BOOT
I2C PULL UP
R159
3.3K
3.3K
R160
3.3K
R161
+3.3V_NORMAL
3.3K
R127
OPT
3.3K
R128
BOOT_MODE0
I2C
I2C_1 : AMP I2C_2 : T-CON,L/DIMING I2C_3 : MICOM I2C_4 : S/Demod,T2/Demod, LNB I2C_5 : NVRAM I2C_6 : TUNER_MOPLL(T/C,ATV)
R162
3.3K
3.3K
IC103
AT24C256C-SSHL-T
A0
1
A1
2
A2
3
GND
4
NVRAM_ATMEL
BOOT MODE "0 : EMMC "1 : TEST MODE
BOOT_MODE
I2C_SDA1 I2C_SCL1 I2C_SDA_MICOM_SOC I2C_SCL_MICOM_SOC I2C_SDA2 I2C_SCL2
I2C_SDA4 I2C_SCL4
I2C_SDA5 I2C_SCL5
I2C_SDA6 I2C_SCL6
NVRAM
VCC
8
WP
7
SCL
6
SDA
5
+3.3V_NORMAL
C107
0.1uF 16V
Write Protection
- Low : Normal Operation
- High : Write Protection
R143 33
R144 33
IC103-*1
M24256-BRMN6TP
E0
VCC
1
8
WC
E1
7
2
SCL
E2
6
3
SDA
VSS
5
4
NVRAM_ST
I2C_SCL5
I2C_SDA5
I2C_SCL_MICOM_SOC I2C_SDA_MICOM_SOC
LOCAL DIMMING I2C CONTROL
+3.3V_NORMAL
OPT
OPT
R105
3.3K
R106
3.3K
LED_SCL LED_SDA
SOC_RESET
FORCED_JTAG_0
P102
12507WS-04L
1
2
3
4
5
+3.3V_NORMAL
R163 10K
OPT
C104
0.1uF 16V
L/DIM0_VS
L/DIM0_SCLK
L/DIM0_MOSI
IRB_SPI_MOSI/TDO1 IRB_SPI_MISO/TDI1
M_REMOTE_RX M_REMOTE_TX
1/16W
33
AR100
I2C_SCL4 I2C_SDA4
I2C_SCL6 I2C_SDA6
PWM_DIM2
PWM_DIM
EMMC_CLK EMMC_CMD EMMC_RST
EMMC_DATA[0-7]
OPT
XTAL_IN
XTAL_OUT
BOOT_MODE
PLLSET0 PLLSET1
TCK0 TDI0
TRST_N1 IRB_SPI_SS/TMS1 IRB_SPI_CK/TCK1
I2C_SCL1 I2C_SDA1
I2C_SCL2 I2C_SDA2
I2C_SCL5 I2C_SDA5
33
R107
33
R108
OPM0 OPM1
R178 33
OPT
R182 10K
R183 10K R184 10K
R185 10K
SOC_RX
SOC_TX
EMMC_DATA[7] EMMC_DATA[6] EMMC_DATA[5] EMMC_DATA[4] EMMC_DATA[3] EMMC_DATA[2] EMMC_DATA[1] EMMC_DATA[0]
12505WS-10A00
JTAG_CPU
B23 A23
R169
AG21
33
AJ18
AB8 AC8
AD8 AE8
AR101
AG30 AG28 AG29 AH29 AJ27 AH27 AG26 AH26
AJ12 AJ13 AH12 AG12
AH23 AG22
AH11 AG11
AG10
AH22 AJ22 AH10 AJ10 AG23 AH24
Y7 Y6 W7 W6 W5
AH7 AJ7
AG8 AH8
AH9 AG9
AJ9
AC6 AC7 AD7 AB7
G32 G33 G31 D31 F33 F32 E32 F31 D33 D32 E31
33
R179 10K
1/16W 5%
Jtag-0 I/F
+3.3V_NORMAL
P103
1
2
3
4
5
6
7
8
9
10
11
IC101
LG1311
XIN_MAIN XO_MAIN
PORES_N
BOOT_MODE
PLLSET0 PLLSET1
OPM0 OPM1
L_VSOUT_LD/TRST0_N DIM0_SCLK/TMS0 DIM1_SCLK/TCK0 DIM1_MOSI/TDI0 DIM0_MOSI/TDO0
SPI_CS0 SPI_SCLK0 SPI_DO0 SPI_DI0/TRST1_N SPI_CS1/TMS1 SPI_SCLK1/TCK1 SPI_DO1/TDO1 SPI_DI1/TDI1
EXT_INTR0 EXT_INTR1 EXT_INTR2 EXT_INTR3
UART0_RXD UART0_TXD UART1_RXD UART1_TXD
UART1_RTS_N UART1_CTS_N
SCL0 SDA0 SCL1 SDA1 SCL2 SDA2 SCL3 SDA3 SCL4 SDA4 SCL5 SDA5
PWM0 PWM1 PWM2 PWM_IN
EMMC_CLK EMMC_CMD EMMC_RESETN EMMC_DATA7 EMMC_DATA6 EMMC_DATA5 EMMC_DATA4 EMMC_DATA3 EMMC_DATA2 EMMC_DATA1 EMMC_DATA0
USB2_0_DP0 USB2_0_DM0
USB2_0_TXRTUNE
USB2_1_DP0 USB2_1_DM0
USB2_1_TXRTUNE
USB3_DP0
USB3_DM0 USB3_TXP0 USB3_TXM0 USB3_RXP0 USB3_RXM0
USB3_RESREF0
USB3_DP1
USB3_DM1 USB3_TXP1 USB3_TXM1 USB3_RXP1 USB3_RXM1
USB3_RESREF1
HUB_PORT_OVER0 HUB_VBUS_CTRL0
EB_CS3 EB_CS2 EB_CS1 EB_CS0
EB_WE_N EB_OE_N
EB_WAIT EB_BE_N1 EB_BE_N0
CAM_CD1_N CAM_CD2_N CAM_CE1_N CAM_CE2_N
CAM_IREQ_N
CAM_RESET
CAM_INPACK_N
CAM_VCCEN_N
CAM_WAIT_N
CAM_REG_N
EB_ADDR0 EB_ADDR1 EB_ADDR2 EB_ADDR3 EB_ADDR4 EB_ADDR5 EB_ADDR6 EB_ADDR7 EB_ADDR8 EB_ADDR9
EB_ADDR10 EB_ADDR11 EB_ADDR12 EB_ADDR13 EB_ADDR14 EB_ADDR15
EB_DATA0 EB_DATA1 EB_DATA2 EB_DATA3 EB_DATA4 EB_DATA5 EB_DATA6 EB_DATA7
L/DIM0_VS
TDI0
L/DIM0_MOSI
L/DIM0_SCLK
TCK0
SOC_RESET
FORCED_JTAG_0
AN9 AM9 AN8
H32 J31 H33
N31 N32 P33 P32 M32 M33 P31
K33 K32 L32 L31 K31 J32 M31
W28 W29
H28 J30 J28 J29
G30 F30 H29 G29 G28
P28 P27 U28 R29 V27 T28 T29 R28 U27 N29
K30 E30 M30 N28 M28 M29 L29 K29 K28 L28 D30
EB_ADDR[10]
F29
EB_ADDR[11]
C32
EB_ADDR[12]
C33
EB_ADDR[13]
C31
EB_ADDR[14]
B33
B32 A32 B31 A31 A30 B30 C30 C29
(TRST0_N)
(TDO0)
(TMS0)
R1712001%
R1722001%
R1732001%
R1742001%
/USB_OCD1
/USB_OCD2 /USB_OCD3
EB_BE_N1 EB_BE_N0
CAM_CD1_N CAM_CD2_N
CAM_IREQ_N CAM_INPACK_N CAM_WAIT_N
EB_ADDR[0] EB_ADDR[1] EB_ADDR[2] EB_ADDR[3] EB_ADDR[4] EB_ADDR[5] EB_ADDR[6] EB_ADDR[7] EB_ADDR[8] EB_ADDR[9]
EB_DATA[0] EB_DATA[1] EB_DATA[2] EB_DATA[3] EB_DATA[4] EB_DATA[5] EB_DATA[6] EB_DATA[7]
12505WS-10A00
WIFI_DP WIFI_DM
USB_DP3 USB_DM3
USB_DP1 USB_DM1
USB_DP2 USB_DM2
USB_CTL1
USB_CTL2 USB_CTL3 EB_WE_N
EB_OE_N
/PCM_CE1 /PCM_CE2
PCM_RESET PCM_5V_CTL CAM_REG_N
Jtag-1 I/F
+3.3V_NORMAL
P104
OPT
1
2
3
4
5
6
7
8
9
10
11
EB_ADDR[0-14]
TP102
EB_DATA[0-7]
TP103
PAGE 1
TP104 TP105
TP106 TP107
TP108 TP109
TP110 TP111 TP112 TP113 TP114 TP115 TP116 TP117
EB_ADDR[0-14]
EB_DATA[0-7]
EB_WE_N EB_OE_N
EB_BE_N1 EB_BE_N0
CAM_CD1_N CAM_CD2_N
/PCM_CE1 /PCM_CE2 CAM_IREQ_N PCM_RESET CAM_INPACK_N PCM_5V_CTL CAM_WAIT_N CAM_REG_N
TRST_N1
IRB_SPI_MISO/TDI1
IRB_SPI_MOSI/TDO1
IRB_SPI_SS/TMS1
IRB_SPI_CK/TCK1
SOC_RESET
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
M14-Peripheral
MID_LG1311
M14 Symbol A
2013.04.04 1
31
PAGE 2
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
FE_DEMOD1_TS_DATA[0-7]
TPI_ERR
AMP_RESET_N
TP226 TP227
FE_DEMOD3_TS_SYNC
FE_DEMOD3_TS_DATA
TPI_DATA[0-7]
Near AMP
C200
1000pF
50V
R231
4.7K
TP228
FE_DEMOD1_TS_CLK
FE_DEMOD1_TS_SYNC
FE_DEMOD1_TS_VAL
FE_DEMOD1_TS_ERROR
FE_DEMOD3_TS_CLK FE_DEMOD3_TS_VAL
SC_DET
R226
100
1/16W
5%
LED_SDA
INSTANT_BOOT
LED_SCL
CAM_SLIDE_DET
CAM_TRIGGER_DET
/RST_HUB
IC101
LG1311
AH30
TP_DVB_CLK
AH32
TP_DVB_SOP
AH31
TP_DVB_VAL
AH33
TP_DVB_ERR
FE_DEMOD1_TS_DATA[7] FE_DEMOD1_TS_DATA[6] FE_DEMOD1_TS_DATA[5] FE_DEMOD1_TS_DATA[4] FE_DEMOD1_TS_DATA[3] FE_DEMOD1_TS_DATA[2] FE_DEMOD1_TS_DATA[1] FE_DEMOD1_TS_DATA[0]
FE_DEMOD2_TS_CLK
FE_DEMOD2_TS_SYNC
FE_DEMOD2_TS_VAL
FE_DEMOD2_TS_ERROR
FE_DEMOD2_TS_DATA
TPI_CLK TPI_SOP TPI_VAL
SC_DET
/RST_PHY
2D/3D_CTL
/TU_RESET1 /TU_RESET2
BT_RESET
HP_DET
OPT
OPC_EN
DEBUG
BIT0
/RST_HUB
COMP1_DET
IR_B_RESET
BIT1 BIT2 BIT3 BIT4 BIT5 BIT6 BIT7
TPI_ERR
TPI_DATA[0] TPI_DATA[1] TPI_DATA[2] TPI_DATA[3] TPI_DATA[4] TPI_DATA[5] TPI_DATA[6] TPI_DATA[7]
MODEL_OPT_11
TP225
RF_SWITCH_CTL
R224
33
CAM_SLIDE_DET
CAM_TRIGGER_DET
MODEL_OPT_12
AV1_CVBS_DET
MODEL_OPT_8 MODEL_OPT_9
MODEL_OPT_10 EPI_LOCK8/6
AM33
TP_DVB_DATA7
AL32
TP_DVB_DATA6
AL33
TP_DVB_DATA5
AK32
TP_DVB_DATA4
AK33
TP_DVB_DATA3
AK31
TP_DVB_DATA2
AJ30
TP_DVB_DATA1
AJ31
TP_DVB_DATA0
AL31
STPI0_CLK
AN32
STPI0_SOP
AM32
STPI0_VAL
AN31
STPI0_ERR
AM31
STPI0_DATA
AH28
STPI1_CLK
AJ28
STPI1_SOP
AK30
STPI1_VAL
AJ29
STPI1_ERR
AG27
STPI1_DATA
A28
TPI_CLK
B28
TPI_SOP
B29
TPI_VAL
C28
TPI_ERR
A27
TPI_DATA0
B27
TPI_DATA1
C27
TPI_DATA2
B26
TPI_DATA3
C26
TPI_DATA4
B25
TPI_DATA5
A25
TPI_DATA6
C25
TPI_DATA7
AG13
GPIO31
AJ19
GPIO30
AG14
GPIO29
AG15
GPIO28
AJ15
GPIO27
AH19
GPIO26
AH18
GPIO25
AG19
GPIO24
AH5
GPIO23
AJ5
GPIO22
AJ6
GPIO21
AH6
GPIO20
AG6
AG24 AH16
AJ21 AH21
AG16 AJ24 AH17 AG17 AH13 AH15 AG18 AH14 AJ16 AH20
GPIO19
AG5
GPIO18
AF7
GPIO17
AG7
GPIO16 GPIO15 GPIO14
V29
GPIO13 GPIO12 GPIO11
V28
GPIO10 GPIO9 GPIO8 GPIO7 GPIO6 GPIO5 GPIO4 GPIO3 GPIO2 GPIO1 GPIO0
R225
OPT
33
TPIO_CLK TPIO_SOP TPIO_VAL
TPIO_ERR TPIO_DATA0 TPIO_DATA1 TPIO_DATA2 TPIO_DATA3 TPIO_DATA4 TPIO_DATA5 TPIO_DATA6 TPIO_DATA7
EPI_SOE EPI_MCLK EPI_GCLK
EPI_EO
EPI_VST
TX_0N TX_0P TX_1N TX_1P TX_2N TX_2P TX_3N TX_3P TX_4N TX_4P TX_5N TX_5P TX_6N TX_6P TX_7N TX_7P TX_8N TX_8P TX_9N
TX_9P TX_10N TX_10P TX_11N TX_11P TX_12N TX_12P TX_13N TX_13P TX_14N TX_14P TX_15N TX_15P TX_16N TX_16P TX_17N TX_17P TX_18N TX_18P TX_19N TX_19P TX_20N TX_20P TX_21N TX_21P TX_22N TX_22P TX_23N TX_23P
TX_LOCKN
D28 E29 E28 F28 D27 E27 F27 E26 F26 E25 D25 F25
AA5 AB5 AA7 AA6 AB6
AK8 AL8 AK7 AL7 AM6 AN6 AK6 AL6 AK5 AL5 AN4 AN3 AM2 AM1 AM4 AM3 AL4 AL3 AK2 AK1 AK4 AK3 AJ4 AJ3 AH2 AH1 AH4 AH3 AG4 AG3 AF2 AF1 AF4 AF3 AE4 AE3 AD2 AD1 AD4 AD3 AC4 AC3 AB2 AB1 AB4 AB3 AA4 AA3
AM8
TPO_CLK TPO_SOP TPO_VAL TPO_ERR
TPO_DATA[0] TPO_DATA[1] TPO_DATA[2] TPO_DATA[3] TPO_DATA[4] TPO_DATA[5] TPO_DATA[6] TPO_DATA[7]
EPI_SOE MCLK_SOC GCLK_SOC EO_SOC GST_SOC
TXB4N/TX0N TXB4P/TX0P TXB3N/TX1NFE_DEMOD3_TS_ERROR TXB3P/TX1P TXBCLKN/TX2N TXBCLKP/TX2P TXB2N/TX3N TXB2P/TX3P TXB1N/TX4N TXB1P/TX4P TXB0N/TX5N TXB0P/TX5P
TXD4N/TX12N TXD4P/TX12P TXD3N/TX13N TXD3P/TX13P TXDCLKN/TX14N TXDCLKP/TX14P TXD2N/TX15N TXD2P/TX15P TXD1N/TX16N TXD1P/TX16P TXD0N/TX17N TXD0P/TX17P
TPO_DATA[0-7]
TXA4N/TX6N TXA4P/TX6P TXA3N/TX7N TXA3P/TX7P TXACLKN/TX8N TXACLKP/TX8P TXA2N/TX9N TXA2P/TX9P TXA1N/TX10N TXA1P/TX10P TXA0N/TX11N TXA0P/TX11P
TXC4N/TX18N TXC4P/TX18P TXC3N/TX19N TXC3P/TX19P TXCCLKN/TX20N TXCCLKP/TX20P TXC2N/TX21N TXC2P/TX21P TXC1N/TX22N TXC1P/TX22P TXC0N/TX23N TXC0P/TX23P
TPO_ERR
EPI_SOE
+3.3V_NORMAL
BIT0_1
R201 10K
BIT0_0
R202 10K
BIT [0/1]
0 / 0 0 / 1 1 / 0 1 / 1
TAIWAN/COLOM
CHINA/HONGKONG
ASIA/AFRICA
EU/CIS
BIT1_1
R203 10K
BIT1_0
R204 10K
ATSC
N/AMERICA
KOREA
S/AMERCIA
Model Option
BIT3_1
BIT2_1
R205 10K
R207 10K
BIT0 BIT1
BIT3_0
BIT2_0
R206 10K
R208 10K
JP
JAPAN
BIT4_1
R209 10K
BIT4_0
R210 10K
BIT5_1
R211 10K
BIT5_0
R212 10K
BIT2 BIT3 BIT4 BIT5
BACK-END OPTIONAREA OPTION
BIT[2/3/4/5]DVB 0 / 0 / 0 / 0 0 / 0 / 0 / 1 0 / 0 / 1 / 0 0 / 0 / 1 / 1 0 / 1 / 0 / 0 0 / 1 / 0 / 1 0 / 1 / 1 / 0 0 / 1 / 1 / 1 1 / 0 / 0 / 0 1 / 0 / 0 / 1 1 / 0 / 1 / 0 1 / 0 / 1 / 1 1 / 1 / 0 / 0 1 / 1 / 0 / 1 1 / 1 / 1 / 0 1 / 1 / 1 / 1
BIT6_1
R213 10K
BIT [6/7]
BIT7_1
R215 10K
0 / 0 0 / 1 1 / 0 1 / 1
EU/CIS
T/C
T2/C/S2/ATV_EXT
T2/C
T2/C/S2/ATV_SOC
BIT6 BIT7
BIT6_0
BIT7_0
R214 10K
R216 10K
TYPE
EPI FHD, 120Hz, V14 (8 lane) EPI FHD, 120Hz, v14_32inch (6 lane) EPI FHD, 120Hz, V13 (6 lane) EPI FHD, 120Hz, V12 (6 lane)
EPI FHD, 60Hz, V14_32 inch (6lane)
LVDS FHD, 120Hz LVDS FHD, 60Hz
LVDS HD, 60Hz
LVDS FHD, 60Hz, CP BOX LVDS HD, 60Hz SMALL SMART
Vby1 FHD, 120Hz LVDS FHD, 120Hz OLED
FRC
FHD
PANEL TYPE
OLED
AJJA
T/C T2/C/ATV_EXT T2/C/ATV_SOC
T2/C/S2
DDR3_DDP
R219 10K
R217 10K
DDR3_1.5GB
DDR3_2GB
R220 10K
R218 10K
DDR3_NON_DDP
TAIWAN/COL
T/C
T2/C PIP
T2/C
DDR_3G
R221 10K
R222 10K
NON_DDR_3G
MODEL_OPT_8
MODEL_OPT_9
MODEL_OPT_10
MODEL_OPT_11
MODEL_OPT_12
BRAZILKOREA
ISDB PIP
ISDB
ATV_SOC ATV_EXT
OPT
R227 10K
NORTH AMERICA
ATSC PIP
ATV_SOC ATV_EXT
OPT
R229 10K
CHINA/HONG
Default Default
ATSC PIP
MODEL_OPT_8 MODEL_OPT_9 MODEL_OPT_10
OPT
OPT
R230 10K
R228 10K
DDR3
DDR3
FOR UD
LOW
NON_DDP
NON_DDR3 3G
HIGH
DDP
1.5GB
2GB
DDR3 3G
JAPAN
MODEL_OPT_11
MODEL_OPT_12
FE_DEMOD2_TS_CLK
FE_DEMOD2_TS_SYNC
FE_DEMOD2_TS_VAL
FE_DEMOD2_TS_ERROR
FE_DEMOD2_TS_DATA
FE_DEMOD3_TS_CLK
FE_DEMOD3_TS_SYNC
FE_DEMOD3_TS_VAL
FE_DEMOD3_TS_ERROR
FE_DEMOD3_TS_DATA
TPI_DATA[0-7]
TPI_CLK TPI_SOP TPI_VAL
TPO_DATA[0-7]
TPO_CLK TPO_SOP TPO_VAL
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
M14-Display In/Out
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
TP202 TP203 TP204 TP205 TP206
TP207 TP208 TP209 TP210 TP211
TP212
TP213 TP214 TP215
TP221
TP218 TP219 TP220
DEBUG
+3.3V_NORMAL
SW201
JTP-1127WEM
12
3
4
For ISP
R223
3.3K
MID_LG1311
M14 Symbol B
2013.04.04 2
31
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