LG 60LB561T Schematic

Printed in KoreaP/NO : MFL68024115 (1404-REV00)

CHASSIS : LT43B

MODEL : 60LB561T 60LB561T-DC

CAUTION

BEFORE SERVICING THE CHASSIS,

READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

LED TV

SERVICE MANUAL

North/Latin America http://aic.lgservice.com

Europe/Africa http://eic.lgservice.com

Asia/Oceania http://biz.lgservice.com

Internal Use Only

- 2 -

Only for training and service purposes

CONTENTS

CONTENTS .............................................................................................. 2

PRODUCT SAFETY ................................................................................. 3

SPECIFICATION ....................................................................................... 4

ADJUSTMENT INSTRUCTION .............................................................. 11

BLOCK DIAGRAM .................................................................................. 18

EXPLODED VIEW .................................................................................. 19

SCHEMATIC CIRCUIT DIAGRAM ..............................................................

- 3 -

Only for training and service purposes

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the

Schematic Diagram and Exploded View.

It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent

Shock, Fire, or other Hazards.

Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the

servicing of a receiver whose chassis is not isolated from the AC

power line. Use a transformer of adequate power rating as this

protects the technician from accidents resulting in personal injury

from electrical shocks.

It will also protect the receiver and it's components from being

damaged by accidental shorts of th e cir cuitry that may be

inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown,

replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor,

over 1 W), keep the resistor 10 mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed

metallic parts of the cabinet, such as antennas, terminals, etc., to

be sure the set is safe to operate without damage of electrical

shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an

electrical jumper across the two AC plug prongs. Place the AC

switch in the on position, connect one lead of ohm-meter to the AC

plug prongs tied together and touch other ohm-meter lead in turn to

each exposed metallic parts such as antenna terminals, phone

jacks, etc.

If the exposed metallic part has a return path to the chassis, the

measured resistance should be between 1 MΩ and 5.2 MΩ.

When the exposed metal has no return path to the chassis the

reading must be infinite.

An other abnormality exists that must be corrected before the

receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check.

Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor

between a known good earth ground (Water Pipe, Conduit, etc.)

and the exposed metallic parts.

Measure the AC voltage across the resistor using AC voltmeter

with 1000 ohms/volt or more sensitivity.

Reverse plug the AC cord into the AC outlet and repeat AC voltage

measurements for each exp ose d metallic par t. Any voltage

measured must not exceed 0.75 volt RMS which is corresponds to

0.5 mA.

In case any measurement is out of the limits specified, there is

possibility of shock hazard and the set must be checked and

repaired before it is returned to the customer.

Leakage Current Hot Check circuit

IMPORTANT SAFETY NOTICE

SAFETY PRECAUTIONS

- 4 -

Only for training and service purposes

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service

manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication.

NOTE: If unforeseen circumstances create conict between the

following servicing precautions and any of the safety precautions

on page 3 of this publication, always follow the safety precautions.

Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power

source before;

a. Removing or reinstalling any component, circuit board mod-

ule or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver.

CAUTION: A wrong part substitution or incorrect polarity

installation of electrolytic capacitors may result in an explo-

sion hazard.

2. Test high voltage only by measuring it with an appropriate

high voltage meter or other voltage measuring device (DVM,

FETVOM, etc) equipped with a suitable high voltage probe.

Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its

assemblies.

4. Unless specied otherwise in this service manual, clean

electrical contacts only by applying the following mixture to the

contacts with a pipe cleaner, cotton-tipped stick or comparable

non-abrasive applicator; 10 % (by volume) Acetone and 90 %

(by volume) isopropyl alcohol (90 % - 99 % strength)

CAUTION: This is a ammable mixture.

Unless specied otherwise in this service manual, lubrication of

contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which

receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its

electrical assemblies unless all solid-state device heat sinks are

correctly installed.

7. Always connect the test receiver ground lead to the receiver

chassis ground before connecting the test receiver positive

lead.

Always remove the test receiver ground lead last.

8. Use with this receiver only the test xtures specied in this

service manual.

CAUTION: Do not connect the test xture ground strap to any

heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged eas-

ily by static electricity. Such components commonly are called

Electrostatically Sensitive (ES) Devices. Examples of typical ES

devices are integrated circuits and some eld-effect transistors

and semiconductor “chip” components. The following techniques

should be used to help reduce the incidence of component dam-

age caused by static by static electricity.

1. Immediately before handling any semiconductor component or

semiconductor-equipped assembly, drain off any electrostatic

charge on your body by touching a known earth ground. Alter-

natively, obtain and wear a commercially available discharging

wrist strap device, which should be removed to prevent poten-

tial shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES

devices, place the assembly on a conductive surface such as

aluminum foil, to prevent electrostatic charge buildup or expo-

sure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES

devices.

4. Use only an anti-static type solder removal device. Some solder

removal devices not classied as “anti-static” can generate

electrical charges sufcient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate

electrical charges sufcient to damage ES devices.

6. Do not remove a replacement ES device from its protective

package until immediately before you are ready to install it.

(Most replacement ES devices are packaged with leads electri-

cally shorted together by conductive foam, aluminum foil or

comparable conductive material).

7. Immediately before removing the protective material from the

leads of a replacement ES device, touch the protective material

to the chassis or circuit assembly into which the device will be

installed.

CAUTION: Be sure no power is applied to the chassis or circuit,

and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replace-

ment ES devices. (Otherwise harmless motion such as the

brushing together of your clothes fabric or the lifting of your

foot from a carpeted oor can generate static electricity suf-

cient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate

tip size and shape that will maintain tip temperature within the

range or 500 °F to 600 °F.

2. Use an appropriate gauge of RMA resin-core solder composed

of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wire-

bristle (0.5 inch, or 1.25 cm) brush with a metal handle.

Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.

(500 °F to 600 °F)

b. Heat the component lead until the solder melts.

c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

6. Use the following soldering technique.

a. Allow the soldering iron tip to reach a normal temperature

(500 °F to 600 °F)

b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there

only until the solder ows onto and around both the compo-

nent lead and the foil.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

- 5 -

Only for training and service purposes

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through

which the IC leads are inserted and then bent at against the cir-

cuit foil. When holes are the slotted type, the following technique

should be used to remove and replace the IC. When working with

boards using the familiar round hole, use the standard technique

as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by

gently prying up on the lead with the soldering iron tip as the

solder melts.

2. Draw away the melted solder with an anti-static suction-type

solder removal device (or with solder braid) before removing

the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and

solder it.

3. Clean the soldered areas with a small wire-bristle brush.

(It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor

Removal/Replacement

1. Remove the defective transistor by clipping its leads as close

as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining

on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding

leads extending from the circuit board and crimp the "U" with

long nose pliers to insure metal to metal contact then solder

each connection.

Power Output, Transistor Device

Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit

board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as pos-

sible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit

board.

3. Observing diode polarity, wrap each lead of the new diode

around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of

the two "original" leads. If they are not shiny, reheat them and if

necessary, apply additional solder.

Fuse and Conventional Resistor

Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow

stake.

2. Securely crimp the leads of replacement component around

notch at stake top.

3. Solder the connections.

CAUTION: Maintain original spacing between the replaced

component and adjacent components and the circuit board to

prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit

board will weaken the adhesive that bonds the foil to the circuit

board causing the foil to separate from or "lift-off" the board. The

following guidelines and procedures should be followed whenever

this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the

following procedure to install a jumper wire on the copper pattern

side of the circuit board. (Use this technique only on IC connec-

tions).

1. Carefully remove the damaged copper pattern with a sharp

knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if

used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and

carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper

pattern and let it overlap the previously scraped end of the

good copper pattern. Solder the overlapped area and clip off

any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern

at connections other than IC Pins. This technique involves the

installation of a jumper wire on the component side of the circuit

board.

1. Remove the defective copper pattern with a sharp knife.

Remove at least 1/4 inch of copper, to ensure that a hazardous

condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern

break and locate the nearest component that is directly con-

nected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the

nearest component on one side of the pattern break to the lead

of the nearest component on the other side.

Carefully crimp and solder the connections.

CAUTION: Be sure the insulated jumper wire is dressed so the

it does not touch components or sharp edges.

- 6 -

Only for training and service purposes

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

1. Application range

This spec sheet is applied all of the 32”, 39”, 42”, 47”, 50”, 55”

LED TV with LT43B chassis

2. Test condition

Each part is tested as below without special notice.

1) Temperature : 25 ºC ± 5 ºC, CST : 40 ºC±5 ºC

2) Relative Humidity: 65 % ± 10 %

3) Power Voltage

Standard input voltage (100~240V@ 50/60Hz)

* Standard Voltage of each products is marked by models.

4) Specification and performance of each parts are followed

ea ch drawing and s pe cificatio n b y p art number in

accordance with BOM.

5) The receiver must be operated for about 20 minutes prior to

the adjustment.

3. Test method

1) Performance: LGE TV test method followed

2) Demanded other specification

- Safety : CE, IEC specification

- EMC: CE, IEC

4. General Specification

No Item Specication Measurement Result Remark

1. Receiving System NTSC-M, PAL-M/N, DVB-T Colombia / Panama

NTSC-M, DVB-T Only Taiwan

NTSC-M, DTMB Only Cuba

2. Available Channel 1) VHF : 2~13

2) UHF : 14~69

3) CATV : 1~125

4) DTV : 14~69

3. Input Voltage 1) AC 100 ~ 240V 50/60Hz

4. Market Colombia / Panama / Taiwan

5. Screen Size 32 inch Wide (1366 × 768) 32LB550D-DF

32LB561B-DC

32LB561D-DC

32LB620D-DD

32LB560D-DA

32 inch Wide (1920 × 1080) 32LB5610-DC

39 inch Wide (1920 × 1080) 39LB5610-DC

39LB561T-DC

42 inch Wide (1920 × 1080) 42LB550T-DF

42LB5610-DC

42LB561T-DC

42LB620T-DF

47 inch Wide (1920 × 1080) 47LB5610-DC

47LB561T-DC

49 inch Wide (1920 × 1080) 49LB550T-DF

49LB620T-DD

50 inch Wide (1920 × 1080) 50LB5610-DC

50LB561T-DC

55 inch Wide (1920 × 1080) 55LB5610-DC

55LB561T-DC

55LB620T-DC

60 inch Wide (1920 × 1080) 60LB561T-DC

- 7 -

Only for training and service purposes

No Item Specication Measurement Result Remark

6. Aspect Ratio 16:9

7. Tuning System FS

8. Module LC320DXE-FGA3

HC320DXN-ABHS1

NC320DXN-VSBP1

HD, 60Hz LGD

BOE

SHARP

32LB561D-DC

32LB561B-DC

32LB560D-DA

LC320DXE-FGA5

NC320DXN-VSBP2

HD, 60Hz LGD

SHARP

32LB550D-DF

LC320DXE-FGP1 HD, 60Hz LGD 32LB620D-DD

LC320DXE-FGA3 FHD, 60Hz LGD 32LB5610-DC

NC390DUN-VXBP1 FHD, 60Hz INX 39LB5610-DC

39LB561T-DC

LC420DUE-FGA3

T420HVF07.0

FHD, 60Hz LGD

AUO

42LB5610-DC

42LB561T-DC

LC420DUE-FGA5 FHD, 60Hz LGD 42LB550T-DF

LC420DUE-FGP1 FHD, 60Hz LGD 42LB620T-DD

LC470DUE-FGA3 FHD, 60Hz LGD 47LB561T-DC

47LB5610-DC

LC490DUE-FGA5 FHD, 60Hz LGD 49LB550T-DF

LC490DUE-FGP1 FHD, 60Hz LGD 49LB620T-DD

NC500DUN-SXBP1 FHD, 60Hz INX 50LB561T-DC

50LB5610-DC

LC550DUE-FGA3 FHD, 60Hz LGD 55LB561T-DC

55LB5610-DC

LC550DUH-FGP1 FHD, 60Hz LGD 55LB620T-DD

HC600DUF-VHHS1 FHD, 60Hz HEESUNG 60LB561T-DC

9. Operating Environment 1) Temp : 0 ~ 40 deg

2) Humidity : ~ 80 %

10. Storage Environment 1) Temp : -20 ~ 60 deg

2) Humidity : ~ 85 %

- 8 -

Only for training and service purposes

5. External Input Support Format

5.1. Component input(Y, CB/PB, CR/PR)

No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed

1. 720*576 15.625 50.000 13.5 SDTV 576I

2. 720*480 15.73 60 13.5135 SDTV ,DVD 480I

3. 720*480 15.73 59.94 13.5 SDTV ,DVD 480I

4. 720*480 31.50 60 27.027 SDTV 480P

5. 720*480 31.47 59.94 27.0 SDTV 480P

6. 720*576 31.250 50.000 27.000 SDTV 576P

7. 1280*720 37.500 50.000 74.25 HDTV 720P

8. 1280*720 45.00 60.00 74.25 HDTV 720P

9. 1280*720 44.96 59.94 74.176 HDTV 720P

10. 1920*1080 28.125 50.00 74.250 HDTV 1080I

11. 1920*1080 33.75 60.00 74.25 HDTV 1080I

12. 1920*1080 33.72 59.94 74.176 HDTV 1080I

13. 1920*1080 56.250 50.00 148.50 HDTV 1080P

14. 1920*1080 67.500 60.00 148.50 HDTV 1080P

15. 1920*1080 67.432 59.939 148.352 HDTV 1080P

16. 1920*1080 27.000 24.000 74.25 HDTV 1080P

17. 1920*1080 26.97 23.976 74.176 HDTV 1080P

18. 1920*1080 33.75 30.000 74.25 HDTV 1080P

19. 1920*1080 33.71 29.97 74.176 HDTV 1080P

- 9 -

Only for training and service purposes

5.2. HDMI Input (PC/DTV)

*HDMI PC support only Rear HDMI Input

*If use DVI to HDMI cable for PC, you have to use external SPK for PC audio sound.

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed

PC DDC

1. 640*350 31.468 70.09 25.17 EGA X

2. 720*400 31.469 70.08 28.32 DOS O

3. 640*480 31.469 59.94 25.17 VESA(VGA) O

4. 800*600 37.879 60.31 40.00 VESA(SVGA) O

5. 1024*768 48.363 60.00 65.00 VESA(XGA) O

6. 1152*864 54.348 60.053 80.00 VESA O

7. 1360*768 47.712 60.015 85.50 VESA (WXGA) O

8. 1280*1024(FHD Only) 63.981 60.02 108.00 VESA (SXGA) O

9. 1920*1080(FHD Only) 67.5 60 148.5 HDTV 1080P O

DTV

1. 720*480 31.469 59.940 27.000 SDTV 480P

2. 720*480 31.500 60.000 27.027 SDTV 480P

3. 720*576 31.250 50.000 27.000 SDTV 576P

4. 1280*720 37.500 50.000 74.25 HDTV 720P

5. 1280*720 45.00 60.00 74.25 HDTV 720P

6. 1280*720 44.96 59.94 74.176 HDTV 720P

7. 1920*1080 28.125 50.000 74.25 HDTV 1080I

8. 1920*1080 33.75 60.00 74.25 HDTV 1080I

9. 1920*1080 33.72 59.94 74.176 HDTV 1080I

10. 1920*1080 56.250 50.000 148.50 HDTV 1080P

11. 1920*1080 67.500 60.00 148.50 HDTV 1080P

12. 1920*1080 67.432 59.94 148.352 HDTV 1080P

13. 1920*1080 27.000 24.000 74.25 HDTV 1080P

14. 1920*1080 26.97 23.976 74.176 HDTV 1080P

15. 1920*1080 33.75 30.00 74.25 HDTV 1080P

16. 1920*1080 33.71 29.97 74.176 HDTV 1080P

※ HDMI Monitor Range Limits

Min Vertical Freq - 58 Hz

Max Vertical Freq - 62 Hz

Min Horiz. Freq - 30 kHz

Max Horiz. Freq - 83 kHz

Pixel Clock - 160 MHz

- 10 -

Only for training and service purposes

6. 3D Mode – DTV/HDMI/USB/DLNA/RGB/etc (Only LB620 Series)

6.1. 3D Mode

No Side by Side (HDMI 1.3) Top & Bottom (HDMI 1.3) Frame Packing (HDMI 1.4a)

6.2. 3D Input Mode

6.2.1. HDMI Input

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed 3D input proposed mode

1 1920x1080p 67.432/67.5 59.94/60 148.35/148.5 1080p Top-and-Bottom, Side-by-Side(Half),

2 1920x1080p 56.25 50 148.5 1080p Top-and-Bottom, Side-by-Side(Half)

3 1280x720p 89.9/90 59.94/60 148.35/148.5 720p Frame packing

4 1280x720p 44.96/45 59.94/60 74.17/74.25 720p Top-and-Bottom, Side-by-Side(Half)

5 1280x720p 75 50 148.5 720p Frame packing

6 1280x720p 37.5 50 74.25 720p Top-and-Bottom, Side-by-Side(Half)

7 1920x1080i 28.125 50 74.25 1080i Side-by-Side(Half)

8 1920x1080p 53.95/54 23.978/24 148.5 1080p Frame packing

9 1920x1080p 26.97/27 23.978/24 74.25 1080p Top-and-Bottom, Side-by-Side(Half)

10 1920x1080p

33.716/33.75 29.97/30 74.17/74.25 1080p

Top-and-Bottom, Side-by-Side(Half)

6.2.2. HDMI Input

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed 3D input proposed mode

1 1920*1080 33.75 30.00 74.25 HDTV 1080P Side by Side, Top & Bottom

- 11 -

Only for training and service purposes

ADJUSTMENT INSTRUCTION

1. Application

This spec sheet is applied all of the LED TV with LT43B,

chassis.

2. Designation

(1) Th e adju stment is ac cordi ng to the order which is

designated and which must be followed, according to the

plan whic al Unit: Product Specification Standard.

(2) Power adjustment : Free Voltage.

(3) Magnetic Field Condition: Nil.

(4) Input signal Unit: Product Specification Standard.

(5) Reserve after operation: Above 5 Minutes (Heat Run).

Temperature : at 25

ºC

±5

ºC

Relative humidity : 65 ± 10%

Input voltage : 100~220V, 50/60Hz

(6) Adjustment equipments : Color Analyzer (CA-210 or

CA-110), SVC remote controller

(7) Push The “IN STOP KEY” – For memory initialization.

3. Main PCB check process

* APC – After Manual-Insert, executing APC

* Boot file Download

(1) Execute ISP program “Mstar ISP Utility” and then click

“Config” tab.

(2) Set as below, and then click “Auto Detect” and check “OK”

message.

If “Error ” i s d is pl ayed, Check co nn ection betwe en

computer, jig, and set.

(3) Click “Read” tab, and then load download file (XXXX.bin)

by clicking “Read”

(4) Click “Connect” tab. If “Can’t ” is displaye d, Check

connection between computer, jig, and set.

(5) Click “Auto” tab and set as below.

(6) Click “Run”.

(7) After downloading, check “OK” message.

(1)

filexxx.bin

(2)

(3)

Please Check the Speed

To use speed between

from 200KHz to 400KHz

(4)

(5)

(6)

(7)...........OK

filexxx.bin

Case1 : Software version up

1) After downloading S/W by USB , TV set will reboot

automatically

2) Push “In-stop” key

3) Push “Power on” key

4) Function inspection

5) After function inspection, Push “In-stop” key.

Case2 : Function check at the assembly line

1) When TV set is entering on the assembly line, Push

“In-stop” key at first.

2) Push “Power on” key for turning it on.

=> If you push “Power on” key, TV set will recover channel

information by itself.

3).After function inspection, Push “In-stop” key.

- 12 -

Only for training and service purposes

* USB DOWNLOAD(*.epk file download)

(1) Put the USB Stick to the USB socket.

(2) Automatically detecting update file in USB Stick.

- If your downloaded program version in USB Stick is Low,

it didn't work. But your downloaded version is High, USB

data is automatically detecting

(3) Show the message "Copying files from memory"

(4) Updating is staring.

(5) After updating is complete, The TV will restart automatically.

(6) If TV turns on, check your updated version and Tool option.

(refer to the next page about tool option)

* If downloading version is higher than your TV have, TV

can lost all channel data. In thi s case, you have to

channel recover. If all channel data is cleared, you didn't

have a DTV/ATV test on production line.

* After downloading, have to adjust Tool

Option again.

(1) Push "IN-START" key in service remote controller.

(2) Select "Tool Option 1" and Push "OK" button.

(3) Punch in the number. (Each model has their number.)

(4) Completed selecting Tool option.

Model Module

BLU

Type

Tool op-

tion1

Tool op-

tion2

Tool op-

tion3

Tool op-

tion4

Tool op-

tion5

Tool op-

tion6

32LB550D-DF LGD /

SHARP

POLA

20 /

6164

2440 16129 14184

55298 /

51202

273

42LB550T-DF LGD POLA 23 2440 16129 14184 55298 273

49LB550T-DF LGD POLA 2440 16129 14184 55298 273

32LB561B-DC LGD /

BOE /

Sharp

POLA

4 /

6148 /

12292

2440 16129 14184

55298 /

51202 /

51202

273

32LB560D-DA

32LB561D-DC

LGD /

BOE /

Sharp

POLA

4 /

12292 /

6148

2406 16129 13136 52226 273

32LB5610-DC

LGD POLA 4 2406 16129 13136 52226 273

39LB5600-DA INX POLA 2054 2406 16129 13144 52234 273

39LB560T-DA INX POLA 2054 2406 16129 13144 52226 273

42LB5610-DC LGD /

AUO

POLA

7 /

4103

2406 16129 13136 55298 273

42LB561T-DC LGD /

AUO

POLA

7 /

4103

2406 16129 13144 52226 273

47LB5610-DC LGD POLA 8 2406 16129 13136 52226 273

47LB561T-DC LGD POLA 8 2406 16129 13144 52226 273

50LB5610-DC INX POLA 2057 2406 16129 13136 52226 273

50LB561T-DC INX POLA 2057 2406 16129 13144 52226 273

55LB5610-DC LGD POLA 10 2406 16129 13136 52226 273

55LB561T-DC LGD POLA 10 2406 16129 13144 52226 273

60LB5610-DC Sharp POLA 13136

32LB620D-DD LGD POLA 2406 16129 13144 52226 273

42LB620T-DD LGD POLA 2406 16129 13144 52226 273

49LB620T-DD LGD POLA 2406 16129 13144 52226 273

55LB620T-DD LGD POLA 2406 16129 13144 52226 273

* RS-232C Connection Method

Connection : PCBA (USB Port) -> USB to Se ri al Ada pter

(UC-232A) -> RS-232C cable -> PC(RS-232C port)

▪ Product name of USB to Serial Adapter is UC-232A.

※ Caution: LT43* chassis support only UC-232A driver. (only use

this one. )

- 13 -

Only for training and service purposes

4. Total Assembly line process

4.1. Adjustment Preparation

■ W/B Equipment condition

CA210 : CH14, Test signal : Inner pattern (80IRE) – in case of

LED back light

■ Above 5 minutes H/run in the inner pattern. (“power on” key of

adjust remote control)

► The spec of color temperature and coordinate

Model Mode Color Temp Color coordinate Remark

All

Cool (C50) 13,000k

x = 0.271 (±0.002)

y = 0.270 (±0.002)

※ Test signal

- Inner pattern for W/B adjust

- External white pattern

(80IRE, 204gray)

Medium (0) 9,300k

x = 0.286 (±0.002)

y = 0.289 (±0.002)

Warm (W50) 6,500k

x = 0.313 (±0.002)

y = 0.329 (±0.002)

► CA210 : CH 14, Test signal : Inner pattern (80IRE)

- Standard color coordinate and temperature using CA-1000 (by

H/R time)

▪ L14 LGD, INX Module

March to December & Global

Normal line (LB5500, LB5600)

H/R Time(Min)

Cool Medium Warm

x y x x y x

271 270 285 293 313 329

1 0-2 281 285 295 308 323 344

2 3-5 280 284 294 307 322 343

3 6-9 279 282 293 305 321 341

4 10-19 277 279 291 302 319 338

5 20-35 275 275 289 298 317 334

6 36-49 273 273 287 296 315 332

7 50-79 272 272 286 295 314 331

8 80-119 271 270 285 293 313 329

9 Over 120 271 270 285 293 313 329

▪ Aging chamber line (LB5500, LB5600)

H/R Time(Min)

Cool Medium Warm

x y x x y x

271 270 285 293 313 329

1 0-5 280 285 294 308 319 340

2 6-10 276 280 290 303 315 335

3 11-20 272 275 286 298 311 330

4 21-30 269 272 283 295 308 327

5 31-40 267 268 281 291 306 323

6 41-50 266 265 280 288 305 320

7 51-80 265 263 279 286 304 318

8 81-119 264 261 278 284 303 316

9 Over 120 264 260 278 283 303 315

※ Connecting picture of the measuring instrument

(On Automatic control)

Inside PATTERN is used when W/B is controlled. Connect to

auto controller or push Adjustment R/C POWER-ON -> Enter

the mode of White-Balance, the pattern will come out.

● Auto-control interface and directions

(1) Adjust in the place where the influx of light like floodlight

around is blocked. (Illumination is less than 10ux).

(2) Adhere closely the Color Analyzer ( CA210 ) to the module

less than 10cm distance, keep it with the surface of the

Module and Color Analyzer’s Prove vertically.(80~100°).

(3) Aging time

- After aging start, keep the power on (no suspension of

power supply) and heat-run over 5 minutes.

- Using ‘no signal’ or ‘full white pattern’ or the others, check

the back light on.

● Auto adjustment Map(RS-232C)

RS-232C COMMAND

[ CMD ID DATA ]

Wb 00 00 White Balance Start

Wb 00 ff White Balance End

RS-232C COMMAND

[CMD ID DATA]

MIN

CENTER

(DEFAULT)

MAX

Cool Mid Warm Cool Mid Warm

R Gain jg Ja jd 00 172 192 192 192

G Gain jh Jb je 00 172 192 192 192

B Gain ji Jc jf 00 192 192 172 192

R Cut 64 64 64 128

G Cut 64 64 64 128

B Cut 64 64 64 128

- 14 -

Only for training and service purposes

*Manual W/B process using adjusts Remote control.(TBD)

■ Color analy zer(C A100+, CA210 ) sh ould be use d in the

calibrated ch by CS-1000

■ Operate the zero-calibration of the CA100+ or CA-210, then

stick sensor to the module when adjusting.

■ After enter Service Mode by pushing “ADJ” key,

■Enter White Balance by pushing “►” key at “8. White Balance”.

■ For manual adjustment, it is also possible by the following

sequence.

(1) Set TV in Adj. mode using POWER ON

(2) Zero Calibrate the probe of Color Analyzer, then place it on

the center of LCD module within 10cm of the surface

(3) Press ADJ key -> EZ adjust using adj. R/C -> 8. White-

Balance then press the cursor to the right (KEY►). When

KEY(►) is pressed 206 Gray internal pattern will be displayed.

(4) Adjust Cool modes

(i). Fix the one of R/G/B gain to 192 (default data) and decrease

the others

(If G gain is adjusted over 172 and R and B gain less than

192, increase G gain to 192 and increase R gain and B gain

same amount of increasing G gain.)

(ii). If G gain is less than 172,

Increase G gain by up to 172, and then increase R gain and

G gain same amount of increasing G gain.

(iii). If R gain or B gain is over 255,

Readjust G gain less than 172, Conform to R gain is 255 or B

gain is 255

(5) Adjust two modes (Medium / Warm) Fix the one of R/G/B gain

to 192 (default data) and decrease the others.

(6) Adj. is completed, Exit adjust mode using “EXIT” key on

Remote controller.

▪ If internal pattern is not available, use RF input. In EZ Adj. menu

8. White Balance, you can select one of 2 Test-pattern: ON,

OFF. Default is inner (ON). By selecting OFF, you can adjust

using RF signal in 206 Gray pattern.

※ CASE Cool

First adjust the coordinate far away from the target value(x, y).

(1) x, y > target

i) Decrease the R, G.

(2) x, y < target

i) First decrease the B gain,

ii) Decrease the one of the others.

(3) x > target , y< target

i) First decrease B, so make y a little more than the target.

ii) Adjust x value by decreasing the R

(4) x < target , y >target

i) First decrease B, so make x a little more than the target.

ii) Adjust x value by decreasing the G

How to adjust

(1) . If G gain is adjusted over 172 and R gain and B gain less

than 192, increase G gain to 192 and increase R gain and B

gain DAme amount of increasing G gain

(2) If G gain is less than 172 , increase G gain by up to 172,

and then increase R gain and B gain DAme amount of

increasing G gain.

(3) If R gain or B gain is over 255 , Readjust G gain less than

172, Conform to R gain is 255 or B gain is 255

※ CASE Medium / Warm

First adjust the coordinate far away from the target value(x, y).

(1) x, y > target

i) Decrease the R, G.

(2) x, y < target

i) First decrease the B gain,

ii) Decrease the one of the others.

(3) x > target , y< target

i) First decrease B, so make y a little more than the target.

ii) Adjust x value by decreasing the R

(4) x < target , y >target

i) First decrease B, so make x a little more than the target.

ii) Adjust x value by decreasing the G

▪ After You finish all adjustments, Press “In-start” button and

compare Tool option and Area option value with its BOM, if it is

correctly same then unplug the AC cable. If it is not same, then

correct it same with BOM and unplug AC cable. For correct it to

the model’s module from factory JIG model.

▪ Push the “IN STO P KE Y” after completing the func tion

inspection.

- 15 -

Only for training and service purposes

4.2. DPM operation confirmation

(Only Apply for MNT Model)

Check if Power LED Color and Power Consumption operate

as standard.

■ Set Input to RGB and connect D-sub cable to set

■ Measurement Condition: (100~240V@ 50/60Hz)

■ Confirm DPM operation at the state of screen without Signal

4.3. EDID DATA

1) All Data : HEXA Value

2) Changeable Data :

*: Serial No : Controlled / Data:01

**: Month : Controlled / Data:00

***:Year : Controlled

****:Check sum

- Auto Download

■ After enter Service Mode by pushing “ADJ” key,

■ Enter EDID D/L mode.

■ Enter “START” by pushing “OK” key.

※ Edid data and Model option download (RS232C)

NO Item CMD 1 CMD 2 Data 0

Enter

download

MODE

Download

‘Mode In’

A A 0 0

When transfer

the ‘Mode In’,

Carry the com-

mand

Edid data

and Model

option

download

Download A E 00 10

Automatically

download

(The use of a

internal Data)

※ Caution

* Use the proper signal cable for EDID Download

- Analog EDID : Pin3 exists

- Digital EDID : Pin3 exists

For Analog EDID For HDMI EDID

D-sub to D-sub DVI-D to HDMI or HDMI to HDMI

No. Item Condition Hex Data

1 Manufacturer ID GSM 1E6D

2 Version Digital : 1 01

3 Revision Digital : 3 03

● EDID DATA

(1) HD 2D EDID Data (LB550B/560B) => TBD

Before S/W version 3.03.02

CheckSum(0xFF) Physical Address (0x1E)

HDMI 1 75 5B 10

HDMI 2 75 4B 20

HDMI1 (128/256)

HDMI1 (128(same)/256)

- 16 -

Only for training and service purposes

(2) FHD 2D EDID Data (LB5500/550T, LB5600/560T)

CheckSum(0xFF) Physical Address (0x1E)

HDMI 1 41 / 25 10

HDMI 2 41 / 15 20

HDMI1 (128/256)

HDMI1 (128(same)/256)

4.4. Outgoing condition Configuration

■ When pressing IN-STOP key by SVC remocon, Red LED

are blinked alternatively. And then automatically turn off.

(Must not AC power OFF during blinking)

4.5. GND & Hi-pot test

4.5.1. GND & HI-POT auto-check preparation

(1) Check the POWER CABLE and SIGNAL CABE insertion

condition

4.5.2. GND & HI-POT auto-check

(1) Pallet moves in the station. (POWER CORD / AV CORD is

tightly inserted)

(2) Connect the AV JACK Tester.

(3) Controller (GWS103-4) on.

(4) GND Test (Auto)

- If Test is failed, Buzzer operates.

- If Test is passed, execute next process (Hi-pot test).

(Remove A/V CORD from A/V JACK BOX)

(5) HI-POT test (Auto)

- If Test is failed, Buzzer operates.

- If Test is passed, GOOD Lamp on and move to next

process automatically.

4.5.3. Checkpoint

(1) Test voltage

① 3 Poles

- GND: 1.5KV/min at 100mA

- SIGNAL: 3KV/min at 100mA

② 2 Poles

- SIGNAL: 3KV/min at 100mA

(2) TEST time: 1 second

(3) TEST POINT

① 3 Poles

- GND Test = POWER CORD GND and SIGNAL CABLE

GND.

- Hi- po t Test = POWER COR D GND a nd L IV E &

NEUTRAL.

② 2 Poles

- Hi-pot Test = Accessible Metal and LIVE & NEUTRAL.

(4) LEAKAGE CURRENT: At 0.5mArms

5. Local Dimming Function Check

(Not require)

Step1) Turn on TV.

Step2) Press “P-only” key, enter to power only mode and

escape the “P-only” Mode by pressing “Exit” key

Step3) Press “Tilt” key, entrance to Local Dimming mode.

Step4) At the Local Dimming mode, module Edge Backlight

moving Top to bottom Back light of module moving

Step5) confirm the Local Dimming mode

Step6) Press “Exit” key

- 17 -

Only for training and service purposes

6. 3D Function Test (Only LB620)

(Pattern Genera tor MSHG-600, MSPG-6100 [SUPPORT

HDMI1.4])

* HDMI mode NO. 872 , pattern No.83

1) Please input 3D test pattern like below (HDMI mode NO.

872 , pattern No.83)

2) When 3D OSD appear automatically , then select OK

button.

3) Don’t wear a 3D Glasses, Check the picture like below

- 18 -

Only for training and service purposes

BLOCK DIAGRAM

(P1101)

30P HD LVDS wafer

51P FHD LVDS wafer

(P1100)

SIDE

USB

(JK700)

HDM I2(MHL)

(JK801)

SIDE_U SB_DM/D P

USB1_OC D/CTL

OCP IC : TPS65282

(IC400)

+5V_USB

COMP2_L /R_IN

COMP2_Y+/ AV_C VBS_IN, COM P2_Pb+/Pr+

AV2_L/R_I N

AV2_CVBS_IN

CK+/ -, D0+/-, D1+/-, D 2+/ -_HDMI 2

DDC _SCL/SDA_2, HD MI_CEC

Serial Flash

(8Mbit)

IC1300

SPI_SCK /SDI/SD O/CS

System EEPROM

(256Kbit)

IC104

I2C_SC L/SDA

NAND FLASH

(1Gbit)

IC102

PCM_A[0-7],…

DDR3 SDRAM

(2Gbit)

IC1201

A-MDQL[0-7], A-MD QU[0-7],…

RXA0+/-~RXA4+/-, RXACK+/-

RXB0+/ -~RXB4+/-, RXB CK+/-

SPK_R

SPK_L

AMP_SCL/ SDA

AUD_MASTER _CLK,

AUD_LR CH,

AUD_LR CK, AUD_SCK

TAS5733

(IC5600)

Main SOC

M1A(LGE2131)

(IC101)

With internal 128M DDR

Connector

(P4600)

Joystick & IR

REAR

HDM I1

(JK800)

TU_SC L / SDA

TDJK -T101F

HALF NI M

AV2

Comp 1 & AV1

(JK1701)

SPDIF _OUT

SPDIF (Optic)

(JK1001)

MHL _OCP_DET

AVDD5V_MH L

MHL _CD_SENSE

- 19 -

Only for training and service purposes

EXPLODED VIEW

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These

parts are identified by in the Schematic Diagram and EXPLODED VIEW.

It is essenti al that these special safet y parts shoul d be replac ed with the same compo nents as

recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.

Do not modify the original design without permission of manufacturer.

IMPORTANT SAFETY NOTICE

900

200

400

410

540

521

530

820

501

500

120

200T

310

121

LV1

A10

Set + Stand

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.

FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS

ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR

THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

CI_TS_DATA[0]

PCM_D[6]

PCM_5V_CTL

/PCM_CE

SC1_FB

CI_TS_CLK

PCM_A[10]

PCM_A[9]

HP_LOUT

CI_TS_DATA[2]

CI_TS_SYNC

PCM_A[13]

SC1_IDPCM_D[1]

HP_DET

SCART1_MUTE

PCM_D[5]

/PCM_WE

/PCM_IRQA

PCM_D[3]

PCM_D[0]

/PCM_CD

CI_TS_DATA[5]

PCM_D[2]

PCM_A[14]

CI_TS_DATA[4]

SCART1_Lout

/PCM_REG

HP_ROUT

/PCM_IOWR CI_TS_DATA[1]

PCM_RST

PCM_A[12]

CI_TS_VAL

CI_TS_DATA[3]

/PCM_WAIT

SCART1_Rout

CI_TS_DATA[6]

PCM_D[4]

PCM_A[8]

DTV/MNT_VOUT

PCM_D[7]

/PCM_OE

SIDE_HP_MUTE

CI_TS_DATA[7]

/PCM_IORD PCM_A[11]

SC1_B+/COMP1_Pb+

SC1_G+/COMP1_Y+

SC1_R+/COMP1_Pr+

SC1/COMP1_L_IN

SC1/COMP1_DET

SC1/COMP1_R_IN

FE_TS_DATA[1]

FE_TS_DATA[2]

FE_TS_DATA[3]

FE_TS_DATA[4]

FE_TS_DATA[5]

FE_TS_DATA[6]

FE_TS_DATA[7]

/CI_DET

2013.05.09

TP_NON_EN

NC5_L14

TP for Headphone

TP for S2

TP for CI slot

TP for NON-EU models(except EU and China)

TP for SCART

TP for FE_TS_DATA

Only for training and service purposes

LGE Internal Use Only

THERMAL

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.

FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS

ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR

THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

Power_PD2

2013.10.28

L14_M1A

Q403

MMBT3904(NXP)

+12V

R426

10K

+3.5V_ST

Q406

AO3435

FET_2.5V_AOS

PANEL_VCC

PWM_DIM

Q400

MMBT3904(NXP)

R420

R424

3.9K

PWM_DIM_PULL_DOWN

R401

10K

R442

10K

+24V

Q404

MMBT3904(NXP)

R441

10K

+3.5V_ST

R445

33K

R448

2.2K

C413

0.1uF

16V

OPT

C416

0.33uF

16V

R444

10K

+12V

INV_CTL

R430

2.7K

+3.5V_ST

R400

10K

OPT

+3.5V_ST

R425

10K

R435

100K

Q402

MMBT3904(NXP)

R429

10K

C415

0.1uF

16V

C417

0.1uF

16V

L410

BLM18PG121SN1D

C424

0.1uF

16V

OPT

+3.3V_Normal

Q406-*1

DMP2130L

FET_2.5V_DIODE

R432

OPT

R431

1.2K

L403

MLB-201209-0120P-N2

POWER_ON/OFF_1

C401

0.1uF

50V

+1.10V_VDDC

POWER_DET

RL_ON

+3.3V_Normal

+12V

+24V

+3.5V_ST

L402

MLB-201209-0120P-N2

C429

0.1uF

16V

R423

100

PWM2_2CH_POWER

PANEL_CTL

R443

10K

R406

10K

R419

100

+3.5V_ST

POWER_DET_RESET

+3.3V_Normal

C402

0.1uF

16V

C425

0.1uF

25V

OPT

C422

0.1uF

R436

100K

OPT

R451

5.6K

R404

4.7K

R402

10K

R452

5.6K

R412

33K

OPT

Q401

MMBT3906(NXP)

PWM1

L407

3.6uH

R454

100 5%

PD_+12V

C430

22uF

10V

C414

10uF

10V

C428

2.2uF

10V

C420

22uF

10V

C421

22uF

10V

C427

10uF

16V

ZD400

ZD402

L401

CB2012PK501T

L400

CB2012PK501T

L408

UBW2012-121F

120OHM

+3.3V_Normal

C406

10uF

16V

R418

R410

100K

L405

4.7uH

R405

4.7K

OPT

R409

10K

C408

10uF

10V

+3.3V_Normal

R416

100K

OPT

AVDD5V_MHL

+5V_Normal

USB1_OCD

C412

22uF

16V

+5V_USB

10uF

C405

R407

10K

R403

4.7K

OPT

5V_HDMI_4

USB1_CTL

+12V

/MHL_OCP_DET

C409

0.047uF

25V

L409

BLM18PG121SN1D

+3.3V_Normal

L411

CB2012PK501T

10uF

C426

10V

+1.5V_DDR

10uF

C431

10V

R455

C410

10uF

10V

ZD403

2.5V

ZD401

2.5V

R456

OPT

C432

4.7uF

50V

3216

+24V_CAP

C400

1uF

10V

1005

OPT

+24V

R457

8.2K

OPT

R458

OPT

R438

4.7K

OPT

C407

10uF

10V

2012

IC401

APX803D29

GND

VCC

RESET

IC402

APX803D29

OPT

GND

VCC

RESET

C434

390pF

50V

C419

0.039uF

50V

C423

270pF

50V

C435

0.1uF

16V

C418

0.01uF

ZD404

+3.5V_POWER_DET

+3.3V_Normal

/VBUS_EN

MHL_OCP_EN

R463

2.7K

MHL_SW_TR

R464

10K

MHL_SW_TR

Q408

MHL_SW_TR

R462

10K

MHL_SW_TR

Q407

MHL_SW_TR

Q409

MHL_SW_TR

R465

10K

MHL_SW_TR

R466

20K

R461

10K

MHL_SW_TR

R43 9

20K

R44 0

47K

R433

2.7K

R447

22K

C403

100pF

50V

OPT

R415

15K

R459

OPT

R408

4.7K

R449

1/16W

R450

200

1/16W

C411

82pF

50V

C404

4700pF

50V

D401

30V

MBR230LSFT1G

L406

CB2012PK501T

+3.5V_ST

C436

10uF

10V

OPT

C437

0.1uF

16V

Q405

DMP2130L

R427

27K

OPT

R428

5.1K

OPT

IC404

AZ1117EH-ADJTRG1

ADJ/GND

OUTIN

R437

100 5%

OPT

R454-*1

300

PD_+3.5V

IC403

TPS5432DDAR

VIN

GND

BOOT

VSENSE

COMP

[EP]GND

TPS65282REGR

IC400

FAULT2

SW_OUT2

RLIM

AGND

SW_OUT1

SW_IN_1

SW_IN_2

LX_1

LX_2

BST

PGND_1

PGND_2

VIN_1

VIN_2

PGOOD

V7V

EN_SW2

FAULT1

EN_SW1

ROSC

COMP

[EP]GND

C433

4.7uF

16V

+12V_CAP

3216

MHL_5V_EN

R421

18K

R422

3.3K

P401

SMAW200-H18S5

12V

24V

PDIM#1

GND

12V

PDMI#2

3.5V

GND

DRV ON

GND

3.5V

PWR ON

12V

24V

3.5V

R446

12K

R453

R467

OPT

PANEL_VCC

+1.10V_VDDC

+3.3V_Normal

+1.5V_DDR

Vout=0.808*(1+R1/R2)

Power_DET

FROM LIPS or POWER B/D

L14 POWER BLOCK (POWER DETECT 2)

+5V_Normal & +5V_USB with OCP

1.3A

Vout=1.25*(1+R2/R1)+Iadj*R2

Vout=0.8*(1+R1/R2)

(Active High)

(Active Low)

Ready - Dual Power Det

R432, R454-*1, R438

Now is

R457, R454

Detect Valtage

O R430, R431, R454

Use Circuit Designator

Power Detect +3.5V

Power Detect +12V

Power Detect +24V

Power Detect activity

* Notice

- Applying all inch models for LCD L14

- Dual Power Det is used

for detecting two kinds of voltage

Only for training and service purposes

LGE Internal Use Only

USB DOWN STR EAM

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.

FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS

ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR

THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

13/04/30

USB_S1

L14_M1A

JK700

3AU 04S-3 05-Z C-(LG )

1234

D700

RCLAMP0502BA

OPT

SIDE_USB1_DM

SIDE_USB1_DP

C700

22uF

10V

ZD700

OPT

SD05

C701

5pF

50V

OPT

C702

5pF

50V

OPT

C703

22uF

10V

USB_HDD_CAP

+5V_USB

USB (SIDE)

Only for training and service purposes

LGE Internal Use Only

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.

FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS

ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR

THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

2013/08/15

HDMI_R1_S1 8

L14_M1A

VA804

ESD_HDMI1

R803

D802

MMBD6100

HDMI_ARC

VA805

ESD_HDMI2

D1+_HDMI2

CEC_REMOTE_S7

+3.5V_ST

VA800

ESD_HDMI1_VARISTOR

VA808

ESD_HDMI2

R809

10K

D2-_HDMI2

VA802

ESD_HDMI1

R807

2.7K

D801

MMBD6100

CK-_HDMI4

CK-_HDMI2

R804

100

VA801

ESD_HDMI1_VARISTOR

R816 100

HDMI-2

R810 100

DDC_SCL_2

R812

1.8K

HDMI-2

DDC_SCL_2

JK800

EAG59023302

D1_GND

SHIELD

D2_GND

CK+

D1+

D2+

D0-

D0_GND

D2-

D0+

D1-

D0+_HDMI2

R811 100

VA803

ESD_HDMI1

DDC_SDA_2

5V_HDMI_2

R800

2.7K

HPD4

5V_HDMI_4

CK+_HDMI4

D800

MMBD6100

VA809

ESD_HDMI2

VA800-*1

1uF

10V

ESD_HDMI1_CAP

+5V_Normal

R805

3.3K

DDC_SCL_4

VA801-*1

1uF

10V

ESD_HDMI1_CAP

R814

HDMI-2

D1-_HDMI4

DDC_SDA_4

5V_DET_HDMI_4

5V_HDMI_4

D1-_HDMI2

HDMI_CEC

CK+_HDMI2

R806

2.7K

R817

300K

HDMI-2

5V_DET_HDMI_2

DDC_SDA_4

+5V_Normal

DDC_SCL_4

HPD2

HDMI_CEC

Q800

MMBT3904(NXP)

R801

2.7K

D0-_HDMI2

VA811

ESD_HDMI2

D0-_HDMI4

MHL_CD_SENSE

5V_HDMI_2

R813

3.3K

HDMI-2

VA810

ESD_HDMI2

D2+_HDMI4

VA807

OPT

5.6V

DDC_SDA_2

D1+_HDMI4

R815 100

HDMI-2

C800

0.047uF

25V

HDMI-2

D2-_HDMI4

R802

1.8K

D2+_HDMI2

R808

10K

HDMI_CEC

D0+_HDMI4

VA806

ESD_HDMI2

JK801

EAG62611204

HDMI-2

CE_REMOTE

D1_GND

GND

CK-

CK_GND

D2_GND

HP_DET

CK+

D1+

D2+

GND

D0-

D0_GND

D2-

DDC_DATA

D0+

D1-

DDC_CLK

D803-*2

RCLAMP0524PA

ESD_HDMI1_SEMTECH

D804-*2

RCLAMP0524PA

ESD_HDMI1_SEMTECH

D806-*2

RCLAMP0524PA

ESD_HDMI2_SEMTECH

D805-*2

RCLAMP0524PA

ESD_HDMI2_SEMTECH

JK801-*1

DAADR019A

HDMI-2_EMI_FOOSUNG

RESERVED

CEC

TMDS_DATA1_SHIELD

BODY_SHIELD

TMDS_CLK-

TMDS_CLK_SHIELD

TMDS_DATA2_SHIELD

HOT_PLUG_DETECT

VDD[+5V]

TMDS_CLK+

TMDS_DATA1+

TMDS_DATA2+

DDC/CEC_GND

TMDS_DATA0-

TMDS_DATA0_SHIELD

TMDS_DATA2-

SDA

TMDS_DATA0+

TMDS_DATA1-

SCL

D803

IP4294CZ10-TBR

ESD_HDMI1_IP4294

D803-*1

IP4283CZ10-TBA

ESD_HDMI1_IP4283

GND_1

TMDS_CH1+

TMDS_CH2-

TMDS_CH1-

TMDS_CH2+

NC_1

NC_2

GND_2

NC_3

NC_4

D804-*1

IP4283CZ10-TBA

ESD_HDMI1_IP4283

GND_1

TMDS_CH1+

TMDS_CH2-

TMDS_CH1-

TMDS_CH2+

NC_1

NC_2

GND_2

NC_3

NC_4

D805-*1

IP4283CZ10-TBA

ESD_HDMI2_IP4283

GND_1

TMDS_CH1+

TMDS_CH2-

TMDS_CH1-

TMDS_CH2+

NC_1

NC_2

GND_2

NC_3

NC_4

D806-*1

IP4283CZ10-TBA

ESD_HDMI2_IP4283

GND_1

TMDS_CH1+

TMDS_CH2-

TMDS_CH1-

TMDS_CH2+

NC_1

NC_2

GND_2

NC_3

NC_4

D804

IP4294CZ10-TBR

ESD_HDMI1_IP4294

D805

IP4294CZ10-TBR

ESD_HDMI2_IP4294

D806

IP4294CZ10-TBR

ESD_HDMI2_IP4294

HDMI (REAR 1 / SIDE 1 MHL)

HDMI_2 MHL

HDMI_1

CEC

MHL Spec

Only for training and service purposes

LGE Internal Use Only

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