LG 60LB5610, 60LB5610-SC Schematic

Internal Use Only
LED TV
SERVICE MANUAL
CHASSIS : LJ43B
MODEL : 60LB5610 60LB5610-SC
CAUTION
BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
Printed in KoreaP/NO : MFL67981612 (1403-REV01)
CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ................................................................................. 3
SPECIFICATION ....................................................................................... 4
ADJUSTMENT INSTRUCTION .............................................................. 10
BLOCK DIAGRAM .................................................................................. 17
EXPLODED VIEW .................................................................................. 18
SCHEMATIC CIRCUIT DIAGRAM ..............................................................
Only for training and service purposes
- 2 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.
It will also protect the receiver and it's components from being damaged by accidental shorts of th e cir cuitry that may be inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1 MΩ and 5.2 MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check. Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exp ose d metallic par t. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.
Leakage Current Hot Check circuit
Only for training and service purposes
- 3 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power source before;
a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explo­sion hazard.
2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture. Unless specied otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.
7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged eas­ily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component dam­age caused by static by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alter­natively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent poten­tial shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or expo­sure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classied as “anti-static” can generate electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electri­cally shorted together by conductive foam, aluminum foil or comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replace­ment ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity suf­cient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire­bristle (0.5 inch, or 1.25 cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there only until the solder ows onto and around both the compo­nent lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent at against the cir­cuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.
2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and solder it.
3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.
Power Output, Transistor Device Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as pos­sible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit board.
3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.
3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connec­tions).
1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.
1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly con­nected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.
Fuse and Conventional Resistor Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow stake.
2. Securely crimp the leads of replacement component around notch at stake top.
Only for training and service purposes
- 5 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement
.
1. Application range
This spec sheet is applied all of the 32”, 39”, 42”, 47”, 50”, 55”, 60" LED TV with LJ43B chassis
2. Test condition
Each part is tested as below without special notice.
1) Temperature : 25 ºC ± 5 ºC, CST : 40 ºC±5 ºC
2) Relative Humidity: 65 % ± 10 %
3) Power Voltage Standard input voltage (100~240V@ 50/60Hz) * Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
ea ch drawing and s pe cificatio n b y p art number in accordance with BOM.
5) The receiver must be operated for about 20 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety : CE, IEC specification
- EMC: CE, IEC
4. General Specification
No Item Specication Measurement Result Remark
1. Receiving System 1) SBTVD / NTSC / PAL-M / PAL-N
2. Available Channel 1) VHF : 02~13
2) UHF : 14~69
3) CATV : 01~135
3. Input Voltage 1) AC 100 ~ 240V 50/60Hz
4. Market Central and South AMERICA
5. Screen Size 32 inch Wide (1366 × 768) 32LB550B-SD 32LB561B-SC 32LB560B-SA 32LB620B-SD 32LB560B-SE
32 inch Wide (1920 × 1080) 32LB5600-SB
39 inch Wide (1920 × 1080) 39LB5610-SC
39LB5600-SB 39LB5610-SC
42 inch Wide (1920 × 1080) 42LB5500-SD
42LB5600-SB 42LB5610-SC 42LB6200-SD 42LB6200-SE
47 inch Wide (1920 × 1080) 47LB5600-SB
47LB5610-SC
49 inch Wide (1920 × 1080) 49LB5500-SD
49LB6200-SD 49LB6200-SE
50 inch Wide (1920 × 1080) 50LB5600-SB
50LB5610-SC
55 inch Wide (1920 × 1080) 55LB5600-SB
55LB5610-SC 55LB6200-SD 55LB6200-SE
60 inch Wide (1920 × 1080) 60LB5610-SC
Only for training and service purposes
- 6 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
No Item Specication Measurement Result Remark
6. Aspect Ratio 16:9
7. Tuning System FS
8. Module LC320DXE-FGA6 HD, 60Hz LGD 32LB550B-SF
LC420DUE-FGA6 FHD, 60Hz LGD 42LB5500-SF
LC490DUE-FGA6 FHD, 60Hz LGD 49LB5500-SF
HC320DXN-ABHS1 HD, 60Hz BOE 32LB561B-SC
LC320DXE-FGA3 LGD
NC320DXN-VSBP1 SHARP
LC320DXE-FGA4 HD, 60Hz LGD 32LB560B-SA
LC320DUE-FGA4 FHD, 60Hz LGD 32LB5600-SB
NC390DUN-VXBP1 FHD, 60Hz INX 39LB5600-SB
39LB5610-SC
LC420DUE-FGA4 FHD, 60Hz LGD 42LB5600-SB
LC420DUE-FGA3 FHD, 60Hz LGD 42LB5610-SC
T420HVF07.0 FHD, 60Hz AUO 42LB5610-SC
LC470DUE-FGA4 FHD, 60Hz LGD 47LB5600-SB
LC470DUE-FGA3 FHD, 60Hz LGD 47LB5610-SC
NC500DUN-SXBP1 FHD, 60Hz INX
LC500DUE-FGA4 FHD, 60Hz LGD
LC550DUE-FGA4 FHD, 60Hz LGD 55LB5600-SB
LC550DUE-FGA3 FHD, 60Hz LGD 55LB5610-SC
T550HVF04.1 FHD, 60Hz AUO 55LB5610-SC
HC600DUF-VHHS1 FHD, 60Hz 60LB5610-SC
LC320DXE-FGP2 FHD, 60Hz LGD 32LB620B-SD
LC420DUE-FGP2 FHD, 60Hz LGD 42LB6200-SD
LC490DUE-FGP2 FHD, 60Hz LGD 49LB6200-SD
9. Operating Environment 1) Temp : 0 ~ 40 deg
2) Humidity : ~ 80 %
10. Storage Environment 1) Temp : -20 ~ 60 deg
2) Humidity : ~ 85 %
50LB5600-SB 50LB5610-SC
32LB620B-SF
42LB6200-SE
49LB6200-SF
Only for training and service purposes
- 7 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
5. External Input Support Format
5.1. Component input(Y, CB/PB, CR/PR)
No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed
1. 720*576 15.625 50.000 13.5 SDTV 576I
2. 720*480 15.73 60 13.5135 SDTV ,DVD 480I
3. 720*480 15.73 59.94 13.5 SDTV ,DVD 480I
4. 720*480 31.50 60 27.027 SDTV 480P
5. 720*480 31.47 59.94 27.0 SDTV 480P
6. 720*576 31.250 50.000 27.000 SDTV 576P
7. 1280*720 37.500 50.000 74.25 HDTV 720P
8. 1280*720 45.00 60.00 74.25 HDTV 720P
9. 1280*720 44.96 59.94 74.176 HDTV 720P
10. 1920*1080 28.125 50.00 74.250 HDTV 1080I
11. 1920*1080 33.75 60.00 74.25 HDTV 1080I
12. 1920*1080 33.72 59.94 74.176 HDTV 1080I
13. 1920*1080 56.250 50.00 148.50 HDTV 1080P
14. 1920*1080 67.500 60.00 148.50 HDTV 1080P
15. 1920*1080 67.432 59.939 148.352 HDTV 1080P
16. 1920*1080 27.000 24.000 74.25 HDTV 1080P
17. 1920*1080 26.97 23.976 74.176 HDTV 1080P
18. 1920*1080 33.75 30.000 74.25 HDTV 1080P
19. 1920*1080 33.71 29.97 74.176 HDTV 1080P
Only for training and service purposes
- 8 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
5.2. HDMI Input (PC/DTV)
*HDMI PC support only Rear HDMI Input *If use DVI to HDMI cable for PC, you have to use external SPK for PC audio sound.
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed
PC DDC
1. 640*350 31.468 70.09 25.17 EGA X
2. 720*400 31.469 70.08 28.32 DOS O
3. 640*480 31.469 59.94 25.17 VESA(VGA) O
4. 800*600 37.879 60.31 40.00 VESA(SVGA) O
5. 1024*768 48.363 60.00 65.00 VESA(XGA) O
6. 1152*864 54.348 60.053 80.00 VESA O
7. 1360*768 47.712 60.015 85.50 VESA (WXGA) O
8. 1280*1024(FHD Only) 63.981 60.02 108.00 VESA (SXGA) O
9. 1920*1080(FHD Only) 67.5 60 148.5 HDTV 1080P O
DTV
1. 720*480 31.469 59.940 27.000 SDTV 480P
2. 720*480 31.500 60.000 27.027 SDTV 480P
3. 720*576 31.250 50.000 27.000 SDTV 576P
4. 1280*720 37.500 50.000 74.25 HDTV 720P
5. 1280*720 45.00 60.00 74.25 HDTV 720P
6. 1280*720 44.96 59.94 74.176 HDTV 720P
7. 1920*1080 28.125 50.000 74.25 HDTV 1080I
8. 1920*1080 33.75 60.00 74.25 HDTV 1080I
9. 1920*1080 33.72 59.94 74.176 HDTV 1080I
10. 1920*1080 56.250 50.000 148.50 HDTV 1080P
11. 1920*1080 67.500 60.00 148.50 HDTV 1080P
12. 1920*1080 67.432 59.94 148.352 HDTV 1080P
13. 1920*1080 27.000 24.000 74.25 HDTV 1080P
14. 1920*1080 26.97 23.976 74.176 HDTV 1080P
15. 1920*1080 33.75 30.00 74.25 HDTV 1080P
16. 1920*1080 33.71 29.97 74.176 HDTV 1080P
HDMI Monitor Range Limits Min Vertical Freq - 58 Hz Max Vertical Freq - 62 Hz Min Horiz. Freq - 30 kHz Max Horiz. Freq - 83 kHz Pixel Clock - 160 MHz
Only for training and service purposes
- 9 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
ADJUSTMENT INSTRUCTION
1. Application
This spec sheet is applied all of the LED TV with LJ43B, chassis.
2. Designation
(1) Th e adju stment is ac cordi ng to the order which is
designated and which must be followed, according to the
plan whic al Unit: Product Specification Standard. (2) Power adjustment : Free Voltage. (3) Magnetic Field Condition: Nil. (4) Input signal Unit: Product Specification Standard. (5) Reserve after operation: Above 5 Minutes (Heat Run). Temperature : at 25 ºC±5 Relative humidity : 65 ± 10% Input voltage : 100~220V, 50/60Hz (6) Adjustment equipments : Color Analyzer (CA-210 or
CA-110), SVC remote controller (7) Push The “IN STOP KEY” – For memory initialization.
Case1 : Software version up
1) After downloading S/W by USB , TV set will reboot automatically
2) Push “In-stop” key
3) Push “Power on” key
4) Function inspection
5) After function inspection, Push “In-stop” key.
ºC
3. Main PCB check process
* APC – After Manual-Insert, executing APC * Boot file Download
(1) Execute ISP program “Mstar ISP Utility” and then click
“Config” tab.
(2) Set as below, and then click “Auto Detect” and check “OK”
message.
If “Error ” i s d is pl ayed, Check co nn ection betwe en
computer, jig, and set.
(3) Click “Read” tab, and then load download file (XXXX.bin)
by clicking “Read”
(1)
filexxx.bin
(4) Click “Connect” tab. If “Can’t ” is displaye d, Check
connection between computer, jig, and set.
(2)
(3)
Case2 : Function check at the assembly line
1) When TV set is entering on the assembly line, Push
“In-stop” key at first.
2) Push “Power on” key for turning it on.
=> If you push “Power on” key, TV set will recover channel
information by itself.
3).After function inspection, Push “In-stop” key.
Please Check the Speed
To use speed between
from 200KHz to 400KHz
(5) Click “Auto” tab and set as below. (6) Click “Run”. (7) After downloading, check “OK” message.
(4)
filexxx.bin
(5)
(7)...........OK
(6)
Only for training and service purposes
- 10 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
* USB DOWNLOAD(*.epk file download)
(1) Put the USB Stick to the USB socket. (2) Automatically detecting update file in USB Stick.
- If your downloaded program version in USB Stick is Low, it didn't work. But your downloaded version is High, USB data is automatically detecting
(3) Show the message "Copying files from memory"
(4) Updating is staring.
* After downloading, have to adjust Tool
Option again.
(1) Push "IN-START" key in service remote controller. (2) Select "Tool Option 1" and Push "OK" button. (3) Punch in the number. (Each model has their number.) (4) Completed selecting Tool option.
Tool
Tool
Tool
Tool
Tool
Model Module
32LB550B-SF LGD /
42LB5500-SF LGD 23 2440 16129 14184 55298 273
49LB5500-SF LGD 2440 16129 14184 55298 273
32LB560B-SA 32LB561B-SC
32LB5600-SA LGD 4 2440 16129 14184 55298 273
39LB5600-
SA/SB
39LB5610-SC
42LB5600-SB 42LB5610-SC
47LB5600-SB 47LB5610-SC
50LB5600-SB 50LB5610-SC
55LB5600-SB 55LB5610-SC
32LB620B-SD LGD
32LB620B-SF
42LB6200-SD 42LB6200-SE
49LB6200-SD 49LB6200-SF
SHARP
CSOT /
option1
option2
option3
option4
option5
20 /
2440 16129 14184
6164
LGD /
Sharp
INX 2054 2440 16129 14184 51210 273
LGD /
AUO
LGD 8 2440 16129 14184 55298 273
INX / LGD
LGD /
AUO
LGD 23 2440 32513 46952 55298 273
LGD
4 /
14340 /
6148
7 /
4103
2057 /
9
10 /
4106
2440 16129 14184
2440 16129 14184
2440 16129 14184
2440 16129 14184
55298 /
51202
55298 / 51202 /
51202
55298 /
51202
51210 /
55298
55298 /
51202
Tool
option6
273
273
273
273
273
(5) After updating is complete, The TV will restart automatically. (6) If TV turns on, check your updated version and Tool option.
(refer to the next page about tool option)
* If downloading version is higher than your TV have, TV
can lost all channel data. In thi s case, you have to channel recover. If all channel data is cleared, you didn't have a DTV/ATV test on production line.
Only for training and service purposes
* RS-232C Connection Method Connection : PCBA (USB Port) -> USB to Se ri al Ada pter
(UC-232A) -> RS-232C cable -> PC(RS-232C port)
▪ Product name of USB to Serial Adapter is UC-232A.
Caution: LJ43* chassis support only UC-232A driver. (only use
this one. )
- 11 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
4. Total Assembly line process
4.1. Adjustment Preparation
■ W/B Equipment condition
CA210 : CH14, Test signal : Inner pattern (80IRE) – in case of
LED back light
■ Above 5 minutes H/run in the inner pattern. (“power on” key of
adjust remote control)
► The spec of color temperature and coordinate
Model Mode Color Temp Color coordinate Remark
Cool (C50) 13,000k
Medium (0) 9,300k
All
Warm (W50) 6,500k
► CA210 : CH 14, Test signal : Inner pattern (80IRE)
- Standard color coordinate and temperature using CA-1000 (by H/R time)
▪ L14 LGD, INX Module
March to December & Global Normal line (LB5500, LB5600)
H/R Time(Min)
271 270 285 293 313 329
1 0-2 281 285 295 308 323 344
2 3-5 280 284 294 307 322 343
3 6-9 279 282 293 305 321 341
4 10-19 277 279 291 302 319 338
5 20-35 275 275 289 298 317 334
6 36-49 273 273 287 296 315 332
7 50-79 272 272 286 295 314 331
8 80-119 271 270 285 293 313 329
9 Over 120 271 270 285 293 313 329
▪ Aging chamber line (LB5500, LB5600)
H/R Time(Min)
271 270 285 293 313 329
1 0-5 280 285 294 308 319 340
2 6-10 276 280 290 303 315 335
3 11-20 272 275 286 298 311 330
4 21-30 269 272 283 295 308 327
5 31-40 267 268 281 291 306 323
6 41-50 266 265 280 288 305 320
7 51-80 265 263 279 286 304 318
8 81-119 264 261 278 284 303 316
9 Over 120 264 260 278 283 303 315
x = 0.271 (±0.002) y = 0.270 (±0.002)
x = 0.286 (±0.002) y = 0.289 (±0.002)
x = 0.313 (±0.002) y = 0.329 (±0.002)
Cool Medium Warm
x y x x y x
Cool Medium Warm
x y x x y x
Test signal
- Inner pattern for W/B adjust
- External white pattern (80IRE, 204gray)
Connecting picture of the measuring instrument (On Automatic control)
Inside PATTERN is used when W/B is controlled. Connect to auto controller or push Adjustment R/C POWER-ON -> Enter the mode of White-Balance, the pattern will come out.
Auto-control interface and directions
(1) Adjust in the place where the influx of light like floodlight
around is blocked. (Illumination is less than 10ux).
(2) Adhere closely the Color Analyzer ( CA210 ) to the module
less than 10cm distance, keep it with the surface of the Module and Color Analyzer’s Prove vertically.(80~100°).
(3) Aging time
- After aging start, keep the power on (no suspension of power supply) and heat-run over 5 minutes.
- Using ‘no signal’ or ‘full white pattern’ or the others, check the back light on.
● Auto adjustment Map(RS-232C)
RS-232C COMMAND [ CMD ID DATA ] Wb 00 00 White Balance Start Wb 00 ff White Balance End
RS-232C COMMAND
[CMD ID DATA]
Cool Mid Warm Cool Mid Warm
R Gain jg Ja jd 00 172 192 192 192
G Gain jh Jb je 00 172 192 192 192
B Gain ji Jc jf 00 192 192 172 192
R Cut 64 64 64 128
G Cut 64 64 64 128
B Cut 64 64 64 128
MIN
CENTER
(DEFAULT)
MAX
Only for training and service purposes
- 12 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
*Manual W/B process using adjusts Remote control.(TBD)
■ Color analy zer(C A100+, CA210 ) sh ould be use d in the
calibrated ch by CS-1000
■ Operate the zero-calibration of the CA100+ or CA-210, then
stick sensor to the module when adjusting.
■ After enter Service Mode by pushing “ADJ” key,
■Enter White Balance by pushing “►” key at “8. White Balance”.
■ For manual adjustment, it is also possible by the following
sequence. (1) Set TV in Adj. mode using POWER ON (2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface
(3) Press ADJ key -> EZ adjust using adj. R/C -> 8. White-
Balance then press the cursor to the right (KEY►). When KEY(►) is pressed 206 Gray internal pattern will be displayed.
(4) Adjust Cool modes (i). Fix the one of R/G/B gain to 192 (default data) and decrease
the others
(If G gain is adjusted over 172 and R and B gain less than
192, increase G gain to 192 and increase R gain and B gain
same amount of increasing G gain.) (ii). If G gain is less than 172, Increase G gain by up to 172, and then increase R gain and
G gain same amount of increasing G gain. (iii). If R gain or B gain is over 255, Readjust G gain less than 172, Conform to R gain is 255 or B
gain is 255 (5) Adjust two modes (Medium / Warm) Fix the one of R/G/B gain
to 192 (default data) and decrease the others.
(6) Adj. is completed, Exit adjust mode using “EXIT” key on
Remote controller.
CASE Cool First adjust the coordinate far away from the target value(x, y). (1) x, y > target i) Decrease the R, G. (2) x, y < target i) First decrease the B gain, ii) Decrease the one of the others. (3) x > target , y< target i) First decrease B, so make y a little more than the target. ii) Adjust x value by decreasing the R (4) x < target , y >target i) First decrease B, so make x a little more than the target. ii) Adjust x value by decreasing the G
How to adjust (1) If G gain is adjusted over 172 and R gain and B gain less
than 192 , Adjust is O.K.
(2) If G gain is less than 172 , increase G gain by up to 172,
and then increase R gain and B gain same amount of increasing G gain.
(3) If R gain or B gain is over 255 , Readjust G gain less than
172, Conform to R gain is 255 or B gain is 255
CASE Medium / Warm First adjust the coordinate far away from the target value(x, y). (1) x, y > target i) Decrease the R, G. (2) x, y < target i) First decrease the B gain, ii) Decrease the one of the others. (3) x > target , y< target i) First decrease B, so make y a little more than the target. ii) Adjust x value by decreasing the R (4) x < target , y >target i) First decrease B, so make x a little more than the target. ii) Adjust x value by decreasing the G
▪ After You finish all adjustments, Press “In-start” button and
compare Tool option and Area option value with its BOM, if it is correctly same then unplug the AC cable. If it is not same, then correct it same with BOM and unplug AC cable. For correct it to the model’s module from factory JIG model.
▪ Push the “IN STO P KE Y” after completing the func tion
inspection.
▪ If internal pattern is not available, use RF input. In EZ Adj. menu
8. White Balance, you can select one of 2 Test-pattern: ON, OFF. Default is inner (ON). By selecting OFF, you can adjust using RF signal in 206 Gray pattern.
Only for training and service purposes
- 13 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
4.2. DPM operation confirmation (Only Apply for MNT Model)
Check if Power LED Color and Power Consumption operate as standard.
■ Set Input to RGB and connect D-sub cable to set
■ Measurement Condition: (100~240V@ 50/60Hz)
■ Confirm DPM operation at the state of screen without Signal
4.3. DDC EDID Write (HDMI 256Byte)
■ Connect HDMI Signal Cable to HDMI Jack.
■ Write EDID DATA to EEPROM(24C02) by using DDC2B
protocol.
■ Check whether written EDID data is correct or not.
* For SVC Ass’y, EDID have to be downloaded.
4.4. EDID DATA
1) All Data : HEXA Value
2) Changeable Data : *: Serial No : Controlled / Data:01 **: Month : Controlled / Data:00 ***:Year : Controlled ****:Check sum
- Auto Download
■ After enter Service Mode by pushing “ADJ” key,
■ Enter EDID D/L mode.
■ Enter “START” by pushing “OK” key.
Caution
* Use the proper signal cable for EDID Download
- Analog EDID : Pin3 exists
- Digital EDID : Pin3 exists
=> Caution
- Never connect HDMI & D-sub Cable at the same time.
- Use the proper cables below for EDID Writing.
- Download HDMI1, HDMI2 separately because HDMI1 is different from HDMI2.
For Analog EDID For HDMI EDID
D-sub to D-sub DVI-D to HDMI or HDMI to HDMI
No. Item Condition Hex Data
1 Manufacturer ID GSM 1E6D
2 Version Digital : 1 01
3 Revision Digital : 3 03
EDID DATA
(1) HD 2D EDID Data (32LB550B/560B) => TBD
Before S/W version 3.03.02
CheckSum(0xFF) Physical Address (0x1E)
HDMI 1 10
HDMI 2 20
Edid data and Model option download (RS232C)
NO Item CMD 1 CMD 2 Data 0
Enter download MODE
Edid data and Model option download
Download ‘Mode In’
Download A E 00 10
A A 0 0
HDMI1 (128/256)
When transfer the ‘Mode In’, Carry the com­mand
Automatically download (The use of a internal Data)
Only for training and service purposes
- 14 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
HDMI1 (128(same)/256)
(2) FHD 2D EDID Data (S/W 1.01.20) (LB5500, LB5600 except
32LB550B/LB560B)
CheckSum(0xFF) Physical Address (0x1E)
HDMI 1 41 / 25 10
HDMI 2 41 / 15 20
HDMI1 (128/256)
HDMI1 (128(same)/256)
4.5. Outgoing condition Configuration
■ When pressing IN-STOP key by SVC remocon, Red LED
are blinked alternatively. And then automatically turn off.
(Must not AC power OFF during blinking)
4.6. GND & Hi-pot test
4.6.1. GND & HI-POT auto-check preparation
(1) Check the POWER CABLE and SIGNAL CABE insertion
condition
4.6.2. GND & HI-POT auto-check
(1) Pallet moves in the station. (POWER CORD / AV CORD is
tightly inserted) (2) Connect the AV JACK Tester. (3) Controller (GWS103-4) on. (4) GND Test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, execute next process (Hi-pot test).
(Remove A/V CORD from A/V JACK BOX)
(5) HI-POT test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, GOOD Lamp on and move to next
process automatically.
4.6.3. Checkpoint
(1) Test voltage 3 Poles
- GND: 1.5KV/min at 100mA
- SIGNAL: 3KV/min at 100mA 2 Poles
- SIGNAL: 3KV/min at 100mA (2) TEST time: 1 second (3) TEST POINT 3 Poles
- GND Test = POWER CORD GND and SIGNAL CABLE
GND.
- Hi- po t Test = POWER COR D GND a nd L IV E &
NEUTRAL.
2 Poles
- Hi-pot Test = Accessible Metal and LIVE & NEUTRAL. (4) LEAKAGE CURRENT: At 0.5mArms
5. Local Dimming Function Check
(Not require)
Step1) Turn on TV. Step2) Press “P-only” key, enter to power only mode and
escape the “P-only” Mode by pressing “Exit” key Step3) Press “Tilt” key, entrance to Local Dimming mode. Step4) At the Local Dimming mode, module Edge Backlight
moving Top to bottom Back light of module moving Step5) confirm the Local Dimming mode Step6) Press “Exit” key
Only for training and service purposes
- 15 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
6. 3D Function Test (Only LB620)
(Pattern Genera tor MSHG-600, MSPG-6100 [SUPPORT HDMI1.4]) * HDMI mode NO. 872 , pattern No.83
1) Please input 3D test pattern like below (HDMI mode NO. 872 , pattern No.83)
2) When 3D OSD appear automatically , then select OK button.
3) Don’t wear a 3D Glasses, Check the picture like below
Only for training and service purposes
- 16 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
BLOCK DIAGRAM
(P1101)
30P HD LVDS wafer
51P FHD LVDS wafer
(P1100)
SIDE
USB
(JK700)
HDM I2(MHL)
(JK801)
SIDE_U SB_DM/D P
USB1_OC D/CTL
OCP IC : T PS65282
(IC400)
+5V_USB
COMP2_L /R_IN
COMP2_Y+/ AV_CVB S_IN, COM P2_Pb+/Pr+
AV2_L/R_I N
AV2_CVBS_IN
CK+/ -, D0+/-, D1+/-, D2+/-_H DMI2
DDC _SCL/SDA_2, HD MI_CEC
Serial Flash
(8Mbit)
IC1300
SPI_SCK /SDI/SD O/CS
System EEPROM
(256Kbit)
IC104
I2C_SC L/SDA
NAND FLASH
(1Gbit)
IC102
PCM_A[0-7],…
DDR3 SDRAM
(2Gbit)
IC1201
A-MDQL[0-7], A-MDQU[0-7], …
RXA0+/-~RXA4+/-, RXACK+/-
RXB0+/ -~RXB4+/-, RXB CK+/-
SPK_R
SPK_L
AMP_SCL/ SDA
AUD_MASTER _CLK,
AUD_LR CH,
AUD_LR CK, AUD_SCK
TAS5733
(IC5600)
Main SOC
M1A(LGE2131)
(IC101)
With internal 128M DDR
Connector
(P4600)
Joystick & IR
REAR
HDM I1
(JK800)
TU_SC L / SDA
IF
TDJK -T101F
HALF NI M
AV2
Comp 1 & AV1
(JK1701)
SPDIF _OUT
SPDIF (Optic)
(JK1001)
MHL _OCP_DET
AVDD5V_MH L
MHL _CD_SENSE
Only for training and service purposes
- 17 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
400
410
EXPLODED VIEW
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
900
521
350
540
121
530
LV1
820
120
A10
Set + Stand
A2
200
Only for training and service purposes
- 18 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
TP for NON-EU models(except EU and China)
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
TP for CI slot
/PCM_REG
/PCM_OE
/PCM_WE
/PCM_IORD PCM_A[11]
/PCM_IOWR CI_TS_DATA[1]
/PCM_CE
/PCM_IRQA
/PCM_CD
/PCM_WAIT
PCM_RST
PCM_5V_CTL
/CI_DET
TP for S2
PCM_D[0]
PCM_D[2]
PCM_D[3]
PCM_D[4]
PCM_D[5]
PCM_D[6]
PCM_D[7]
PCM_A[8]
PCM_A[9]
PCM_A[10]
PCM_A[12]
PCM_A[13]
PCM_A[14]
TP for FE_TS_DATA
CI_TS_CLK
CI_TS_VAL
CI_TS_SYNC
CI_TS_DATA[0]
CI_TS_DATA[2]
CI_TS_DATA[3]
CI_TS_DATA[4]
CI_TS_DATA[5]
CI_TS_DATA[6]
CI_TS_DATA[7]
TP for SCART
SCART1_MUTE
SC1_IDPCM_D[1]
SC1_FB
DTV/MNT_VOUT
SCART1_Lout
SCART1_Rout
SC1_R+/COMP1_Pr+
SC1_G+/COMP1_Y+
SC1_B+/COMP1_Pb+
SC1/COMP1_DET
SC1/COMP1_L_IN
SC1/COMP1_R_IN
TP for Headphone
HP_LOUT
HP_ROUT
SIDE_HP_MUTE
HP_DET
FE_TS_DATA[1]
FE_TS_DATA[2]
FE_TS_DATA[3]
FE_TS_DATA[4]
FE_TS_DATA[5]
FE_TS_DATA[6]
FE_TS_DATA[7]
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NC5_L14
TP_NON_EN
2013.05.09 3
L14 POWER BLOCK (POWER DETECT 2)
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
FROM LIPS or POWER B/D
+3.5V_ST
OPT
R400
10K
R402
R401
10K
C407 10uF
2012
10V
10K
+3.5V_POWER_DET
L400
CB2012PK501T
C400
+24V_CAP
C432
4.7uF
3216
+12V_CAP
C433
4.7uF
3216
RL_ON
+3.5V_ST
+24V
+12V
1005
16V
1uF 10V
OPT
50V
B
+3.5V_ST
R406 10K
R404
4.7K
C
Q400 MMBT3904(NXP)
E
R456
ZD400
5V
MLB-201209-0120P-N2
C401
0.1uF 50V
MLB-201209-0120P-N2
C402
0.1uF 16V
MMBT3906(NXP)
1
OPT
0
L401
CB2012PK501T
L402
L403
Q401
2
R455
3
0
ZD404
+1.5V_DDR
+3.3V_Normal
L409
BLM18PG121SN1D
C426
10uF
AZ1117EH-ADJTRG1
10V
1.3A
OPT
R412
33K
+3.3V_Normal
R420
1K
5V
PWR ON
3.5V
3.5V GND 24V GND 12V 12V GND
P401
SMAW200-H18S5
1 3 5 7
10
9 11
12
13
14
15
16
17
18
19
.
DRV ON
2
PDIM#1
4
3.5V
6
PDMI#2
8
24V GND 12V NC GND
R419 100
PWM_DIM_PULL_DOWN
Vout=1.25*(1+R2/R1)+Iadj*R2
+1.5V_DDR
IC404
ADJ/GND
OUTIN
R449 1K 1/16W 1%
R450 200 1/16W 1%
R1
R2
L411
CB2012PK501T
R453
0
C431 10uF
10V
ZD403
2.5V
C
B
E
Q402
MMBT3904(NXP)
R424
3.9K
+3.5V_ST
R426
10K
R425 10K
PWM2_2CH_POWER
R423
100
OPT R467 1K
INV_CTL
PWM_DIM
PWM1
C415
0.1uF
C413
0.1uF
OPT
R457
8.2K
16V
OPT
16V
+24V
1%
R427
R428
5.1K
R430
2.7K
R431
1.2K
OPT
27K
1%
OPT
+12V
1%
1%
+24V
1%
+3.5V_POWER_DET
OPT
R432
0
5%
+3.5V_POWER_DET
OPT
R458
0
5%
Ready - Dual Power Det
* Notice
- Applying all inch models for LCD L14
- Dual Power Det is used for detecting two kinds of voltage
+1.10V_VDDC
+1.10V_VDDC
ZD401
2.5V
+3.5V_ST
OPT
C424
0.1uF 16V
C437
0.1uF
CB2012PK501T
OPT C436 10uF
10V
16V
C420
C421
22uF
22uF
10V
10V
VCC
VCC
APX803D29
3
APX803D29
3
L406
C423
50V
270pF
GND
GND
R435 100K
IC401
OPT
R436
100K
OPT
IC402
C414 10uF
10V
2
1
2
1
0.1uF
R43 9
20K
1%
R44 0
47K
1%
PD_+3.5V
R454-*1 300
5%
PD_+12V
R454
RESET
RESET
100 5%
POWER_DET_RESET
OPT
R437
100 5%
Detect Valtage
Power Detect +3.5V
Power Detect +12V
Power Detect +24V
C435
16V
C417
L407
0.1uF
3.6uH 16V
R1
R2
+3.5V_ST
OPT
R438
4.7K
C422
0.1uF
Power_DET
POWER_DET
Power Detect activity
Now is
Use Circuit Designator
R432, R454-*1, R438
O R430, R431, R454
R457, R454
IC403
TPS5432DDAR
BOOT
VIN
PH
GND
1
2
3
4
3A
9
THERMAL
8
7
6
5
[EP]GND
SS
EN
COMP
VSENSE
C418
0.01uF
R433
2.7K
C419
0.039uF 50V
1%
Vout=0.808*(1+R1/R2)
C434
390pF
50V
+3.3V_Normal
R429
10K
C416
0.33uF 16V
PANEL_VCC
PANEL_CTL
+3.3V_Normal
POWER_ON/OFF_1
L408
UBW2012-121F
120OHM
OPT
C425
0.1uF 25V
R441
10K
+3.5V_ST
R443
10K
R444 10K
+12V
B
R447 22K
R448
2.2K
R442
10K
C
Q404 MMBT3904(NXP)
E
C428
2.2uF 10V
R445
R446 12K
B
33K
C427 10uF
16V
C
Q403 MMBT3904(NXP)
E
FET_2.5V_DIODE
Q406-*1 DMP2130L
S
FET_2.5V_AOS
Q406
AO3435
S
PANEL_VCC
Q405
DMP2130L
D
S
R451
R452
5.6K
L410
C430 22uF 10V
5.6K
+3.3V_Normal
ZD402
5V
G
D
G
BLM18PG121SN1D
D
C429
G
0.1uF 16V
+5V_Normal & +5V_USB with OCP
C403
100pF
R408
OPT R405
4.7K
4.7K
/VBUS_EN
(Active Low)
MHL_OCP_EN
(Active High)
+3.3V_Normal
MHL_SW_TR
MHL_SW_TR
R461 10K
MHL_SW_TR
MHL_SW_TR
R462 10K
Q407
R463
2.7K
B
C
MHL_SW_TR
E
MHL_SW_TR
Q409
MHL_SW_TR R464 10K
MHL_SW_TR
Q408
E
B
R465
10K
B
+3.3V_Normal
OPT R403
4.7K
MHL_5V_EN
USB1_CTL
C
MHL_5V_EN
R466 20K
C
E
R410
OPT
100K
50V
C404
4700pF
50V
OPT
R459
0
+3.3V_Normal
R407
10K
R409
10K
COMP
ROSC
EN_SW2
EN_SW1
[EP]GND
V7V
EN
1
2
SS
3
4
TPS65282REGR
5
6
FAULT2
+12V
C405 10uF
PGOOD
23
24
THERMAL
25
IC400
4A
7
8
FAULT1
SW_OUT2
USB1_OCD
/MHL_OCP_DET
VIN_122VIN_2
9
RLIM11AGND
C406 10uF 16V
21
10
R415 15K
5%
OPT R416 100K
PGND_1
PGND_2
19
20
12
SW_OUT1
MBR230LSFT1G
C411 82pF 50V
+5V_Normal
C412 22uF 16V
C409
L405
0.047uF
4.7uH
25V
BST
18
LX_2
17
LX_1
16
FB
15
SW_IN_2
14
SW_IN_1
13
+5V_USB
5V_HDMI_4
D401 30V
C408 10uF
10V
C410 10uF
10V
AVDD5V_MHL
R418
10
R422
3.3K
R421
18K
R1 R2
1%
1%
Vout=0.8*(1+R1/R2)
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L14_M1A
Power_PD2
2013.10.28 4
USB (SIDE)
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
JK700
1234
USB DOWN STR EAM
3AU 04S-3 05-Z C-(LG )
5
OPT C701
5pF 50V
OPT C702
5pF 50V
ZD700
SD05
5V
OPT
+5V_USB
C700 22uF 10V
OPT D700 RCLAMP0502BA
C703 22uF 10V
USB_HDD_CAP
SIDE_USB1_DM
SIDE_USB1_DP
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L14_M1A
USB_S1
13/04/30
7
HDMI (REAR 1 / SIDE 1 MHL)
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
HDMI_1
SHIELD
20
19
18
17
16
15
14
13
12
11
CK+
10
EAG59023302
JK800
9
8
7
6
5
4
3
2
1
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
5V_HDMI_2
R803
1K
R802
1.8K
VA800
ESD_HDMI1_VARISTOR
5V_DET_HDMI_2
ESD_HDMI1
R805
3.3K
VA801
ESD_HDMI1_VARISTOR
VA800-*1 1uF 10V
ESD_HDMI1_CAP
VA801-*1 1uF 10V
ESD_HDMI1_CAP
VA802
MMBT3904(NXP)
Q800
C
E
VA803
ESD_HDMI1
R808
10K
B
R809
10K
R810 100
R811 100
VA804
ESD_HDMI1
D803
1 2 3 4 5
ESD_HDMI1_IP4294
IP4294CZ10-TBR
D804
1 2 3 4 5
ESD_HDMI1_IP4294
IP4294CZ10-TBR
10 9 8 7 6
10 9 8 7 6
HPD2
DDC_SDA_2
DDC_SCL_2
HDMI_ARC HDMI_CEC
CK-_HDMI2
CK+_HDMI2
D0-_HDMI2
D0+_HDMI2
D1-_HDMI2
D1+_HDMI2
D2-_HDMI2
D2+_HDMI2
HDMI_2 MHL
VA805
ESD_HDMI2
GND
20
HP_DET
19
5V
18
GND
17
DDC_DATA
16
DDC_CLK
15
NC
14
CE_REMOTE
13
CK-
12
CK_GND
11
CK+
10
BODY_SHIELD
20
19
HOT_PLUG_DETECT
18
VDD[+5V]
17
DDC/CEC_GND
16
SDA
15
SCL
14
RESERVED
13
CEC
12
TMDS_CLK-
11
TMDS_CLK_SHIELD
10
TMDS_CLK+
9
TMDS_DATA0-
8
TMDS_DATA0_SHIELD
7
TMDS_DATA0+
6
TMDS_DATA1-
5
TMDS_DATA1_SHIELD
4
TMDS_DATA1+
3
TMDS_DATA2-
2
TMDS_DATA2_SHIELD
1
TMDS_DATA2+
JK801-*1 DAADR019A
HDMI-2_EMI_FOOSUNG
EAG62611204
JK801
HDMI-2
9
8
7
6
5
4
3
2
1
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
5V_HDMI_4
R812
1.8K
HDMI-2
5V_DET_HDMI_4
ESD_HDMI2
VA806
R813
3.3K HDMI-2
VA807
5.6V OPT
ESD_HDMI2 VA808
ESD_HDMI2
VA809
HDMI-2
R814
33
HDMI-2
R815 100
R816 100
HDMI-2
VA810
ESD_HDMI2
VA811
ESD_HDMI2
1 2 3 4 5
ESD_HDMI2_IP4294
IP4294CZ10-TBR
1 2 3 4 5
ESD_HDMI2_IP4294
IP4294CZ10-TBR
C800
0.047uF 25V
HDMI-2
D805
D806
10 9 8 7 6
10 9 8 7 6
R817 300K
MHL Spec
HDMI-2
HPD4
DDC_SDA_4
DDC_SCL_4
HDMI_CEC
CK-_HDMI4
CK+_HDMI4
D0-_HDMI4
D0+_HDMI4
D1-_HDMI4
D1+_HDMI4
D2-_HDMI4
D2+_HDMI4
MHL_CD_SENSE
CEC
R804
A2CA1
MMBD6100 D800
100
DDC_SDA_2
DDC_SCL_2
CEC_REMOTE_S7
5V_HDMI_4
R806
2.7K
+5V_Normal
A2CA1
MMBD6100 D801
R807
2.7K
+3.5V_ST
DDC_SDA_4
DDC_SCL_4
A2CA1
MMBD6100 D802
HDMI_CEC
5V_HDMI_2
R800
2.7K
+5V_Normal
R801
2.7K
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
D803-*1
TMDS_CH1-
1
2
GND_1
3
4
5
D803-*2
1 2 3 4 5
10
9
8
7
6
10 9 8 7 6
TMDS_CH1+
TMDS_CH2-
TMDS_CH2+
ESD_HDMI1_IP4283
IP4283CZ10-TBA
ESD_HDMI1_SEMTECH
RCLAMP0524PA
NC_4
NC_3
GND_2
NC_2
NC_1
D804-*1
TMDS_CH1-
1
2
GND_1
3
4
5
D804-*2
1 2 3 4 5
10
10 9 8 7 6
TMDS_CH1+
TMDS_CH2-
TMDS_CH2+
ESD_HDMI1_IP4283
IP4283CZ10-TBA
ESD_HDMI1_SEMTECH
RCLAMP0524PA
D805-*1
NC_4
NC_3
9
GND_2
8
NC_2
7
NC_1
6
TMDS_CH1-
1
2
GND_1
3
4
5
D805-*2
1 2 3 4 5
10
10 9 8 7 6
TMDS_CH1+
TMDS_CH2-
TMDS_CH2+
ESD_HDMI2_IP4283
IP4283CZ10-TBA
ESD_HDMI2_SEMTECH
RCLAMP0524PA
NC_4
NC_3
9
GND_2
8
NC_2
7
NC_1
6
D806-*1
TMDS_CH1-
1
TMDS_CH1+
2
GND_1
3
TMDS_CH2-
4
TMDS_CH2+
5
ESD_HDMI2_IP4283
IP4283CZ10-TBA
D806-*2
1 2 3 4 5
ESD_HDMI2_SEMTECH
RCLAMP0524PA
L14_M1A
NC_4
10
NC_3
9
GND_2
8
NC_2
7
NC_1
6
10 9 8 7 6
2013/08/15
HDMI_R1_S1 8
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