• There are some special components used in LCD
zmonitor that are important for safety. These parts are
marked on th e schematic diagram and the
Exploded View. It is essential that these critical parts
should be replaced with the manufacturer' s specified
parts to prevent electric shock, fire or other hazard.
• Do not modify original design without obtaining written
permission from manufacturer or you will void the
original parts and labor guarantee.
TAKE CARE DURING HANDLING THE LCD MODULE
WITH BACKLIGHT UNIT.
• Must mount the module using mounting holes arranged
in four corners.
• Do not press on the panel, edge of the frame strongly or
electric shock as this will result in damage to the
screen.
• Do not scratch or press on the panel with any sharp
objects, such as pencil or pen as this may result in
damage to the panel.
• Protect the module from the ESD as it may damage the
electronic circuit (C-MOS).
• Make certain that treatment person' s body are grounded
through wrist band.
WARNING
BE CAREFUL ELECTRIC SHOCK !
• If you want to replace with the new backlight or inverter
circuit, must disconnect the AC adapter because high
voltage appears at inverter circuit about 650Vrms.
• Handle with care wires or connectors of the inverter
circuit. If the wires are pressed cause short and may
burn or take fire.
Leakage Current Hot Check Circuit
Good Earth Ground
such as WATER PIPE,
To Instrument's
exposed
METALLIC PARTS
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1
*Base on Adjustment standard
0.15µF
1.5 Kohm/10W
CONDUIT etc.
• Do not leave the module in high temperature and in
areas of high humidity for a long time.
• The module not be exposed to the direct sunlight.
• Avoid contact with water as it may a short circuit within
the module.
• If the surface of panel become dirty, please wipe it off
with a softmaterial. (Cleaning with a dirty or rough cloth
may damage the panel.)
CAUTION
Please use only a plastic screwdriver to protect yourself
from shock hazard during service operation.
• Replaceable batteries
CAUTION
RISK OF EXPLOSION IF BATTERY IS REPLACED BY
AN INCORRECT TYPE.
DISPOSE OF USED BATTERIES ACCORDING TO
THE INSTRUCTIONS.
REPLACE ONLY WITH THE SAME OR EQUIVALENT
TYPE.
ADVARSEL
Lithiumbatteri - Eksplosionsfare ved fejlagtig
håndtering.
Udskiftning må kun ske med batteri af samme
fabrikat og type.
Levér det brugte batteri tilbage til leverandøren.
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unl ess specified othe rwise in this service manua l, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components com monly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" compon ents. The following techniques
should be used to help reduce the incide nce of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alter natively, obtain and wear a comme rcially availab le
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most re pla cem ent ES dev ice s are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Mi nimiz e bodil y motio ns wh en h andli ng u npack ag ed
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carp eted floor can ge ner ate st atic electricit y
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 ˚F to 600 ˚F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 ˚F to 600 ˚F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 ˚F to 600 ˚F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only un til the solder fl ows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
si de of the circuit board. (Use this techniq ue onl y on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break an d loc ate the nearest component that is dir ect ly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
This spec sheet is applied all of the Digital Signage Product
with LW36D chassis.
2. Designation
1) The adjustment is according to the order which is designated and which must be followed, according to the plan which
can be changed only on agreeing.
2) Power adjustment : Free Voltage.
3) Magnetic Field Condition: Nil.
4) Input signal Unit: Product Specication Standard.
5) Reserve after operation: Above 5 Minutes (Heat Run)
Temperature : at 25 °C ± 5 °C
Relative humidity : 65 % ± 10 %
Input voltage : 220V, 60Hz
6) Adjustment equipments : Color Analyzer (CA-210 or CA-
· Above 5 minutes H/run in the inner pattern. (“power on” key
of adjust remote control)
Color
Temperature
CA210 : CH 14, Test signal : Inner pattern (80IRE)
- W/B Table
Color
Temperature
* Connecting picture of the measuring instrument
(On Automatic control)
- Inside PATTERN is used when W/B is controlled. Connect
to auto controller or push Adjustment R/C POWER-ON →
Enter the mode of White-Balance, the pattern will come out.
Cool13,000k °K X=0.270 (±0.002)
Medium9,300k°K X=0.285 (±0.002)
Warm6,500k°K X=0.313 (±0.002)
Time
0-2 Minute279280293303314330
3-5 Minute278278292301313328
6-9 Minute276276290299311326
10-19 Minute275274289297310324
20-35 Minute274273288296309323
36-49 Minute273272287295308322
50-79 Minute272271286294307321
More than 80 Minute271270285293306320
Y=0.271 (±0.002)
Y=0.293 (±0.002)
Y=0.329 (±0.002)
CoolMediumWarm
XYXYXY
<Test Signal>
Inner pattern
(216gray,85IRE)
* Auto-control interface and directions
1) Adjust in the place where the inux of light like oodlight
around is blocked. (Illumination is less than 100Lux).
2) Adhere closely the Color Analyzer ( CA210 ) to the module
less than 10cm distance, keep it with the surface of the
Module and Color Analyzer’s Prove vertically.(80° ~ 100°).
3) Aging time
- After aging start, keep the power on (no suspension of power
supply) and heat-run over 5 minutes.
- Using ‘no signal’ or ‘full white pattern’ or the others, check
the back light on.
* Auto adjustment Map(RS-232C)
RS-232C COMMAND
[ CMD ID DATA ]
Wb 00 00 White Balance Start
Wb 00 ff White Balance End
RS-232C COMMAND
[CMD ID DATA]
CoolMidWarmCoolMidWarm
R GainjgJajd00172192192192
G GainjhJbje00172192192192
B GainjiJcjf00192192172192
R Cut646464128
G Cut646464128
B Cut646464128
MIN
CENTER
(DEFAULT)
MAX
** Caution **
Color Temperature : COOL, Medium, Warm.
One of R Gain/G Gain/ B Gain should be kept on 0xC0, and
adjust other two lower than C0. (when R/G/B Gain are all C0,
it is the FULL Dynamic Range of Module)
* Manual W/B process using adjusts Remote con-
trol.
· After enter Service Mode by pushing “ADJ” key,
· Enter White Balance by pushing “►” key at “White Balance”.
* After You nish all adjustments, Press “In-start” button and
compare Tool option and Area option value with its BOM, if it
is correctly same then unplug the AC cable. If it is not same,
then correct it same with BOM and unplug AC cable. For correct it to the model’s module from factory JIG model.
* Push The “IN STOP KEY” after completing the function
inspection. And Mechanical Power Switch must be set “ON”.
LGE Internal Use Only
4.2. DPM operation conrmation
Check if Power LED Color and Power Consumption operate
as standard for RGB/HDMI/DP/DVI Input
· Set Input to RGB/HDMI/DP/DVI and connect D-sub/
HDMI/DP/DVI cable to set
· Measurement Condition: (100~240V@ 50/60Hz)
· Conrm DPM operation at the state of screen without
Signal
* Because 42/47/55WT30 have no LED Indicator, check DPM
through conrming “Power Saving Mode” OSD after disconnecting the cable
4.3. Model name & Serial number Download
4.3.1. Model name & Serial number D/L
· Press “Power on” key of service remocon.(Baud rate :
115200 bps)
· Connect RS232 Signal Cable to RS-232 Jack.
· Write Serial number by use RS-232.
4.3.2. Signal TABLE
CMDLENGTH ADH ADLDATA_1. . .Data_nCSDELAY
CMD : A0h
LENGTH : 85~94h (1~16 bytes)
ADH : EEPROM Sub Address high (00~1F)
ADL : EEPROM Sub Address low (00~FF)
Data : Write data
CS : CMD + LENGTH + ADH + ADL + Data_1 + … + Data_n
Delay : 20 ms
4.3.3. Command Set
No.Adjust modeCMD(hex)LENGTH(hex)Description
1EEPROM
WRITE
A0h84h+nn-bytes Write (n = 1~16)
* Manual Download (Model Name and Serial
Number)
If the TV set is downloaded By OTA or Service man,
Sometimes model name or serial number is initialized.( Not
always) There is impossible to download by bar code scan,
so It need Manual download.
1) Press the ‘instart’ key of ADJ remote controller.
2) Go to the menu ‘Model Number D/L’ like below photo.
3) Input the Factory model name(ex 42LD450-ZA) or Serial
number like photo.
4) Check the model name Instart menu → Factory name
displayed (ex 42LD450-ZA)
4.5. LAN Port check → Ping Test
* If it is NG , conrm PC IP setting.
→ IP : 12.12.2.3
→ Sub Net : 255.255.255.0
→ Gate way : 12.12.2.1
Power Only Mode Monitor Side IP Default Conguration
→ IP : 12.12.2.2
→ Sub Net : 255.255.255.0
→ Gate way : 12.12.2.1
* Description
FOS Default write : <7mode data> write
Vtotal, V_Frequency, Sync_Polarity, Htotal, Hstart, Vstart,
0, Phase
Data write : Model Name and Serial Number write in EEPROM,.
4.3.4. Method & notice
1) Serial number D/L is using of scan equipment.
2) Setting of scan equipment operated by Manufacturing
Technology Group.
3) Serial number D/L must be conformed when it is produced
in production line, because serial number D/L is mandatory
by D-book 4.0