LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 3 -
SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument’s
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
IMPORTANT SAFETY NOTICE
0.15uF
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 4 -
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500°F to 600°F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500°F to 600°F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. Application range
This spec sheet is applied LCD TV with LA02R chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
1) Temperature: 20±5ºC
2) Relative Humidity: 65±10%
3) Power Voltage : Standard input voltage(100-240V~, 50/60Hz)
* Standard Voltage of each product is marked by models
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 20 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety : UL, CSA, IEC specification
- EMC: FCC, ICES, IEC specification
- Wireless : WirelessHD Specification (Option)
ModelMarketAppliance
42/47/55LXLE6500-UB
North America Safety : UL1492, CSA C22.2.No.1,
47/55LX9500-UAEMC : FCC Class B, IEC Class B
- 6 -
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
9. 3D Mode
9.1. HDMI Input
No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed Remark
11280x72045.0060.0074.25HDTV 720PSide by Side
Top&Bottom
HDMI1.4 Frame Packing
21920x108033.7560.0074.25HDTV 1080ISide by Side
Top&Bottom
31920x108067.50060148.50HDTV 1080PSide by Side
Top&Bottom
Checkerboard
Single Frame Sequential
HDMI1.4 Frame Packing
41920x108027.0024.00074.25HDTV 1080PSide by Side
Top&Bottom
Checkerboard
HDMI1.4 Frame Packing
51920x108033.7530.00074.25HDTV 1080PSide by Side
Top&Bottom
Checkerboard
9.2. USB Input
9.3. 3D Input mode
No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed Remark
51920x108033.7530.00074.25HDTV 1080PSide by Side
Top&Bottom
Checkerboard
No
1
Side by SideTop&BottomCheckerboardSingle Frame SequentialFrame Packing
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 11 -
ADJUSTMENT INSTRUCTION
1. Application range
This spec sheet is applied to LA02R Chassis applied LCD TV
all models manufactured in TV factory
2. Specification
2.1 Because this is not a hot chassis, it is not necessary
to use an isolation transformer. However, the use of
isolation transformer will help protect test instrument.
2.2 Adjustment must be done in the correct order.
2.3 The adjustment must be performed in the
circumstance of 25±5°C of temperature and 65±10%
of relative humidity
2.4 The input voltage of the receiver must keep
100~240V, 50/60Hz.
2.5 The receiver must be operated for about 5 minutes
prior to the adjustment when module is in the
circumstance of over 15. In case of keeping module
is in the circumstance of 0°C, it should be placed in
the circumstance of above 15°C for 2 hours In case
of keeping module is in the circumstance of below 20°C, it should be placed in the circumstance of
above 15°C for 3 hours.
Caution) When still image is displayed for a period of 20
minutes or longer (especially where W/B scale is
strong. Digital pattern 13ch and/or Cross hatch
pattern 09ch), there can some afterimage in the
black level area.
3. Adjustment items
3.1. Main PCB check process
• Adjust 480i Comp1
Remark) Above adjustment items can be also performed in
Final Assembly if needed. Adjustment items in
both PCBA and final assembly stages can be
checked by using the INSTART Menu
1.ADJUST CHECK.
Component 1080p and RGB-PC Adjust will be
calculated by 480i adjust value.
3.2 Final assembly adjustment
•EDID/DDC download
•White Balance adjustment
•RS-232C functionality check
•Factory Option setting per destination
•Ship-out mode setting (In-Stop)
3.3 ETC
• Ship-out mode
• Tool option menu
• USB Download(S/W Update, Option, Service only)
4. Automatic Adjustments
4.1. ADC Calibration(GP2 BCM3549)
(1) Overview
ADC adjustment is needed to find the optimum black level
and gain in Analog-to-Digital device and to compensate
RGB deviation.
- Port connection button click(1)
Load button click(2) for MAC Address write.
2) Start MAC Address write button(3)
3) Check the OK Or NG
5.1.2 Download ESN Key
1. Input the ESN Key
• Download Model sending Key file
• input by 1 by SET so as not to be duplicated
5.2 LAN PORT + ESN INSPECTION (Automatic IP)
5.2.1 Equipment & Condition
• Each other connection to LAN Port of IP Hub and Jig
5.2.2 LAN inspection solution
• LAN Port connection with PCB
• Network setting at MENU Mode of TV
• setting automatic IP
• Setting state confirmation
- If automatic setting is finished, you confirm IP and MAC
Address.
5.2.3 ESN Key confirmation
• confirm Key input Data at ESN MENU Mode
PCBA
PC(RS-232C)
RS-232C Port
- 13 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
5.3 LAN PORT INSPECTION(PING TEST)
5.3.1. Equipment setting
1) Play the LAN Port Test PROGRAM.
2) Input IP set up for an inspection to Test
Program.
*IP Number : 12.12.2.2
5.3.2. LAN PORT inspection (PING TEST)
1) Play the LAN Port Test Program.
2) connect each other LAN Port Jack.
3) Play Test (F9) button and confirm OK Message.
4) remove LAN CABLE
5.4 EDID/DDC Download
(1) Overview
It is a VESA regulation. A PC or a MNT will display an
optimal resolution through information sharing without any
necessity of user input. It is a realization of “Plug and Play”.
(2) Equipment
• Since embedded EDID data is used, EDID download JIG,
HDMI cable and D-sub cable are not need.
• Adjust by using remote controller.
(3) Download method
1) Press Adj. key on the Adj. R/C,
2) Select EDID D/L menu.
3) By pressing Enter key, EDID download will begin
4) If Download is successful, OK is display, but If
Download is failure, NG is displayed.
5) If Download is failure, Re-try downloads.
Caution) When EDID Download, must remove RGB/HDMI
Cable.
(4) EDID DATA
- 14 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 15 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
5.5. White Balance Adjustment
(1) Overview
• W/B adj. Objective & How-it-works
- Objective: To reduce each Panel’s W/B deviation
- How-it-works: When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic
Range. In order to prevent saturation of
Full Dynamic range and data, one of
R/G/B is fixed at 192, and the other two is
lowered to find the desired value.
- Adj. condition : normal temperature
1) Surrounding Temperature: 25±5ºC
2) Warm-up time: About 5 Min
3) Surrounding Humidity: 20% ~ 80%
(2) Equipment
1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 /
LED : CH14)
2) Adj. Computer (During auto adj., RS-232C protocol is
needed)
3) Adjust Remocon
4) Video Signal Generator MSPG-925F 720p/216-Gray
(Model:217, Pattern:78)
-> Only when internal pattern is not available
• Color Analyzer Matrix should be calibrated using CS-1000
(3) Equipment connection MAP
(4) Adj. Command (Protocol)
•
RS-232C Command used during auto-adj.
Ex) wb 00 00 -> Begin White balance auto-adj.
wb 00 10 -> Gain adj.
ja 00 ff -> Adj. data
jb 00 c0
...
...
wb 00 1f -> Gain adj. complete
2) Zero calibrate probe then place it on the center of the
Display
3) Connect Cable(RS-232C)
4) Select mode in adj. Program and begin adj.
5) When adj. is complete (OK Sing), check adj. status pre
mode (Warm, Medium, Cool)
6) Remove probe and RS-232C cable to complete adj.
• W/B Adj. must begin as start command “wb 00 00”, and
finish as end command “wb 00 ff”. and Adj. offset if need
(6) Manual adj. method
1) Set TV IN Adj. mode using POWER ON
2) Zero Calibrate the probe of Color Analyzer, then place in
on the center of LCD module within 10cm of the surface.
3) Press ADJ KEY -> EZ adjust using adj. R/C -> 6. White
Balance then press the cursor th the right (KEY
G),
When Key(
G) is pressed 216 Gray internal pattern will
be displayed.
4) One of R Gain / G Gain / B Gain should be fixed at 192,
and the rest will be lowered to meet the desired value.
5) Adj. is performed in COOL, MEDIUM, WARM 3 modes
of color temperature.
• If internal pattern is not available, use RF input. In EZ Adj.
menu 6. White Balance, you can select one of 2 Testpattern. ON, OFF. Default is inner(ON). By selection OFF,
you can adjust using RF signal in 216 Gray pattern.
• Adj. condition and cautionary items
1) Lighting cndition in surrounding area.
Surrounding lighting should be lower 10 lux. Try to isolate
adj. area into dark surrounding.
2) Probe location : Color Snalyzer (CA-210) probe should be
within 10cm and perpendicular of the module surface
(80
º~100º)
3) Aging time
-After Aging Start, Keep the Power ON status during 5
Minutes.
- In case of LCD, Back-light on should be checked using
no signal or Full-white pattern.
Colo r Analyzer
Comp ut er
Pattern Ge n e r ator
RS-232C
RS-232C
RS-232C
Probe
Signal Source
* If TV internal pattern is used, not needed
Connection Diagram of Automatic Adjustment
- 16 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
(7) Reference (White Balance Adj. coordinate and color
temperature)
• Luminance: 216 Gray
• Standard color coordinate and temperature using CS1000
• Standard color coordinate and temperature using CA-210
(CH 14)
• Standard color coordinate and temperature using CA210(CH 14) – by aging time
1) Edge/IOP LED models : 42/47/55LX6500-UB
2) IOP LED models : 47/55LX9500-UA
(8) THX Adjustment (THX certified model only)
Several THX certified model have to adjust White Balance
5 point at warm mode only.
1) Adjust 100 IRE White Balance
2) Adjust Max Brightness of Back Light Unit to approach
120cd.
3) Adjust Gamma 2.2 IRE(80,60,40,20) with Max Brightness.
4) Set R,G,B Gain at 10 IRE to 0,0,0
5) Complete 5 point Gamma and White Balance Adjustment.
5.6. Option selection per countries
(1) Overview
(2) Method
• Press ADJ key on the Adj. R/C, and then select Country
Group Menu
• Depending on destination, select KR or US, then on the
lower Country option, select US, CA, MX. Selection is
done using +, - KEY
(3) Tool Option Inspection
• Press Adj. key on the Adj. R/C, and then check Tool
option.
5.7. Local dimming inspection (Optional)
5.7.1. Edge LED models with local dimming
(1) Press ‘TILT” key of the Adj. R/C and check moving
patterns. The black bar patterns moves from left to right.
If local dimming function does not work, a whole screen
shows full white.
5.7.2. IOP LED models with local dimming
(1) Press ‘TILT” key of the Adj. R/C and check moving
patterns. The black cross-bar patterns moves from top-left to
Bottom-right. If local dimming function does not work, a whole
screen shows full white.
1) Input the below pattern for 3D test.
(HDMI mode No.371, Pattern No. 81)
2) Enter 3D mode, then select °∞side by side°±.
It is shown like the below example without wearing 3D
glasses.
3) It is a normal screen if the middle section is red checked by
the left side of 3D glass like the below example.
4) It is a normal screen if the middle section is blue checked
by the right side of 3D glass like the below example.
NoItemMinTypMaxUnit
1.Audio practical max 4.556WMeasurement
Output, L/R8.496.339.80Vrmscondition
(Distortion=10% EQ Off
max Output)AVL Off
Clear Voice Off
2.Speaker 57WMeasurement
(8Ω Impedance)condition
EQ On
AVL On
Clear Voice On
- 19 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. USB S/W Download (option)
(1) Put the USB Stick to the USB socket
(2) Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is Low,
it didn’t work.
But your downloaded version is High, USB data is
automatically detecting
(3) Show the message “Copying files from memory”
(4) Updating is staring.
(5) Updating Completed, The TV will restart automatically
(6) If your TV is turned on, check your updated version and
Tool option. (explain the Tool option, next stage)
* If downloading version is more high than your TV have,
TV can lost all channel data. In this case, you have to
channel recover. if all channel data is cleared, you didn’t
have a DTV/ATV test on production line.
* After downloading, have to adjust TOOL OPTION again.
1) Push "IN-START" key in service remote controller.
2) Select "Tool Option 1" and Push “OK” button.
3) Punch in the number. (Each model has their number
300
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is esse ntia l that t hese speci al safety parts shoul d be repla ced with the same compo nent s as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
570
LV1
200
IMPORTANT SAFETY NOTICE
830
500
120
A2
A9
800
A10
530
840
810
850
540
520
880
541
400
920
710
A5
Only for training and service purposes
- 20 -
910
900
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
COMPONENT/AV
REAR JACK
REAR AV
COMPONENT2
COMPONENT1
REAR AV
COMPONENT2
COMPONENT1
JK100
PPJ237-01
DEV
[RD1]E-LUG
6C
[RD1]O-SPRING
5C
[RD1]CONTACT
4C
[WH1]O-SPRING
5B
[YL1]CONTACT
4A
[YL1]O-SPRING
5A
[YL1]E-LUG
6A
[RD2]E-LUG
6H
[RD2]O-SPRING_2
5H
[RD2]CONTACT
4H
[WH2]O-SPRING
5G
[RD2]O-SPRING_1
5F
[RD2]E-LUG-S
7F
[BL2]O-SPRING
5E
[BL2]E-LUG-S
7E
[GN2]CONTACT
4D
[GN2]O-SPRING
5D
[GN2]E-LUG
6D
[RD3]E-LUG
6N
[RD3]O-SPRING_2
5N
[RD3]CONTACT
4N
[WH3]O-SPRING
5M
[RD3]O-SPRING_1
5L
[RD3]E-LUG-S
7L
[BL3]O-SPRING
5K
[BL3]E-LUG-S
7K
[GN3]CONTACT
4J
[GN3]O-SPRING
5J
[GN3]E-LUG
6J
D104
5.6V
D105
5.6V
D106
5.6V
D107
5.5V
D3.3V
C104
R104
470K
C101
R108
2.7K
C105
100pF
50V
R103
470K
AV
COMPONENT2
R119
1K
C123
100pF
C124
100pF
R100
0
R101
0
R102
10
COMPONENT1
R129
1K
C137
100pF
C136
100pF
R106
0
R107
0
COMP2_DET
009:G5
COMP2_R_IN
010:B5
COMP2_L_IN
010:B5
COMP2_Pr
011:D3
COMP2_Pb
011:D3
COMP2_Y
011:D3
COMP1_DET
009:G5
COMP1_R_IN
010:B5
COMP1_L_IN
010:B5
COMP1_Pr
011:D4
COMP1_Pb
011:D4
D108
5.6V
D109
5.6V
D110
5.5V
D111
5.5V
D112
5.5V
D114
5.6V
D119
5.6V
D115
5.6V
D116
5.5V
D117
5.5V
D113
5.6V
D3.3V
R114
470K
R115
470K
C114
27pF
50V
C112
27pF
50V
C113
27pF
50V
R124
470K
R123
470K
R116
2.7K
C127
27pF
50V
C128
27pF
50V
C115
100pF
50V
C116
1uF
25V
C117
1uF
25V
D3.3V
C132
1uF
25V
1uF
25V
L103
270nH
L104
270nH
L102
270nH
L100
270nH
L101
270nH
C131
R125
2.7K
C130
100pF
50V
R117
0
R118
0
R127
0
R126
0
C122
27pF
50V
C120
27pF
50V
C121
27pF
50V
C133
27pF
50V
C134
27pF
50V
R113
1K
1uF
25V
1uF
25V
R110
0
R109
0
R105
0
C109
100pF
50V
C108
100pF
50V
C106
47pF
50V
REAR_AV_DET
009:G3
REAR_AV_R_IN
010:B5
REAR_AV_L_IN
010:B5
REAR_AV_CVBS
011:C4
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
D118
5.5V
C129
27pF
50V
GP2_BCM_ATSC
COMPONENT / AV REAR
L105
270nH
C135
27pF
50V
R131
10
COMP1_Y
011:D4
09/10/xx
1 100
HDMI SWITCH 1.8V POWER
1.8V FOR HDMI SW
R202
+1.8V_HDMI
OPT
C201
10K
4.7uF
POWER_ON/OFF2_1
D1.8V
R200
120K
OPT
C200
4.7uF
10V
OPT
DEV
Q200
AO3438
EBK60752601
D
S
G
R201
0
Seperated from Common sheet83
N.America & Korea only use 1.8V control
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2_BCM_ATSC
HDMI_POWER
09/10/xx
2 100
EARPHONE BLOCK
USB BLOCK
EARPHONE AMP
HP/BT_LOUT_N
011:F2
HP/BT_LOUT_P
011:F2
HP/BT_ROUT_N
011:F2
HP/BT_ROUT_P
011:F2
EARPHONE JACK SIDE
HP_L_OUT
003:Q26
HP_R_OUT
003:Q21
R300
R301
4.7K
OPT
C307
1uF
+3.3V_NORMAL
L302
10uH
C317
C315
0.1uF
10uF
16V
10V
SGND
15
IC300
TPA6132A2
EAN60724701
C308
1uF
10V
EN13VDD
14
8
HPVSS
12
11
10
C316
2.2uF
10V
C318
2.2uF
10V
HPVDD
CPP
C319
2.2uF
PGND
10V
CPN
9
R306
100K
OPT
Close to the IC
4.7K
INR+
INL+
INR-
INL-
OUTL
16
1
2
3
4
5G06G17
OUTR
C304
1uF
10V
C305
1uF
10V
C306
1uF
10V
10V
R302
OPT
R303
R308
0
1/16W
R307
0
1/16W
EMS_KOREA
BG2012B080TF
C321
22000pF
50V
EMS_Default
+3.3V_NORMAL
Q308EB
2SC3052
BG2012B080TF
C320
22000pF
50V
EMS_Default
C321-*1
0.22uF
16V
C
R309
4.7K
L304
L303
EMS_KOREA
OPT
R310
0
R311
1K
C320-*1
0.22uF
16V
HP_L_OUT
SIDE_HP_MUTE
HP_R_OUT
USB2
+5V_USB
010:D4
C313
0.1uF
USB_PWRFLT2
C311
10uF
+3.3V_NORMAL
IC301
AP2191SG-13
USB_DM2
USB_DP2
GND
IN_1
IN_2
EN
0 R318
1
2
3
4
EAN60921001
DEV
CDS3C05HDMI1
R320
4.7K
OPT
10V
USB_PWRON2
R321
010:D4
2.7K
010:D4
010:D4
NC
8
OUT_2
7
OUT_1
6
FLG
5
ESD_USB
D303
5.6V
L301
MLB-201209-0120P-N2
120-ohm
C310
100uF
16V
CDS3C05HDMI1
ESD_USB
D301
5.6V
JK302
KJA-UB-4-0004
USB DOWN STREAM
1234
EAG41945401
5
USB
USB(DVR Ready)
CHANGE USB_PWRFLT PULL-UP FROM 5V TO 3.3V
USB1 (DVR Ready)
+3.3V_NORMAL
GND
IN_1
IN_2
EN
IC302
AP2191SG-13
1
2
3
4
EAN60921001
DEV
NC
8
OUT_2
7
OUT_1
6
FLG
5
0 R317
CDS3C05HDMI1
ESD_USB
L300
MLB-201209-0120P-N2
120-ohm
D302
CDS3C05HDMI1
5.6V
C309
100uF
16V
ESD_USB
D300
5.6V
JK301
KJA-UB-4-0004
USB DOWN STREAM
1234
EAG41945401
5
MMBT3904-(F)
MMBT3904-(F)
Q300
Q301
+5V_USB
C
B
OPT
E
C
B
OPT
E
009:G3
B
SIDE_HP_DET
B
E
Q303
MMBT3904-(F)
OPT
C
E
Q302
MMBT3904-(F)
OPT
C
JK300
KJA-PH-0-0177
5GND
R314
120
+3.5V_ST
E
C
Q306
ISA1530AC1
OPT
B
R315
C
150
OPT
Q307
2SC3052
OPT
E
4L
3DETECT
DEV
1R
EAG61030001
B
SIDE_HP_MUTE
003:Q23;081:I4
010:D4
C314
0.1uF
USB_PWRFLT1
C312
10uF
10V
010:D4
010:D4
R322
2.7K
USB_DM1
USB_DP1
USB_PWRON1
R319
4.7K
OPT
010:D4
WIRELESS I2C LEVEL SHIFTER
LEVEL SHIFTER
+3.3V_NORMAL
R324
10K
OPT
Q304
G
FDV301N
WIRELESS_SCL
WIRELESS_SDA
OPT
S
D
D
Q305
FDV301N
OPT
G
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
SCL3_3.3V
SDA3_3.3V
S
GP2_BCM_ATSC
USB/EAR-PHONE
09/10/xx
3 100
SIDE COMPONENT LINE
086:M25
086:M21
086:M22
SIDE_COMP_Y
SIDE_COMP_Pr
SIDE_COMP_Pb
CLOSE TO MAIN IC
0.1uFC400
0.1uFC401
0.1uFC402
R401-*1
82
75
75
82
R400
R401
KOREA_ESD
R402
KOREA_ESD
US_ESD
R402-*1
82
US_ESD
SIDE_COMP-Y
SIDE_COMP-Pr
SIDE_COMP-Pb
011:C4;011:D4
011:C4;011:D4
011:C4;011:D4
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
SIDE GENDER LINE
09/10/xx
SIDE_GENDER_LINE4 1 0 0
SMD GASKET FOR EMI (8*6*5.5 FOR LE5400/5500/7500)
SMD GASKET FOR EMI (8*6*12.5T)
GASKET on the Bottom
DEV
GAS1
GAS2
GAS3
GAS4
GAS5
GAS6
GAS7
GAS8
GAS9
GAS10
GAS11
GAS12
SMD GASKET FOR EMI (8*6*7.5 FOR LE8500)
GASKET on the Bottom
DEV
GAS1-*1
GAS2-*1
GAS3-*1
GAS4-*1
GAS5-*1
GAS6-*1
GAS7-*1
GAS8-*1
GAS9-*1
GAS10-*1
GAS11-*1
GAS12-*1
Draw bottom location when make a new pcb
GAS11
GASKET_12.5T
GAS3-*2
GAS5-*2
GAS1-*2
MDS61887708
MDS61887708
GAS2-*2
MDS61887708
MDS61887708
GAS4-*2
MDS61887708
MDS61887708
GAS6-*2
GAS7-*2
MDS61887708
MDS61887708
GAS8-*2
GAS9-*2
MDS61887708
MDS61887708
GAS10-*2
MDS61887708
GAS11-*2
MDS61887708
GAS12-*2
SMD GASKET FOR EMI (8*6* 9.5T)
GASKET_9.5T
GAS1-*3
MDS61887710
MDS61887710
GAS2-*3
GAS3-*3
MDS61887710
MDS61887710
GAS4-*3
MDS61887710
GAS5-*3
MDS61887710
GAS6-*3
GAS7-*3
MDS61887710
MDS61887710
GAS8-*3
GAS9-*3
MDS61887710
MDS61887710
GAS10-*3
MDS61887710
GAS11-*3
MDS61887710
GAS12-*3
SMD GASKET FOR EMI (8*6*6.5 FOR 32LE7500)
GASKET_6.5T
GAS5
GAS3
GAS6
GAS8
GAS2
GAS1
EAX61538101
GAS12
GAS4
GAS9
GAS10
GAS7
GAS5
GAS11
GAS3
GAS6
GAS8
GAS1
EAX61746401
GAS12
GAS2
GAS4
GAS9
GAS10
GAS7
GAS1-*4
MDS62110206
GAS2-*4
MDS62110206
GAS3-*4
MDS62110206
GAS4-*4
MDS62110206
GAS5-*4
MDS62110206
GAS6-*4
MDS62110206
GAS7-*4
MDS62110206
GAS8-*4
MDS62110206
GAS9-*4
MDS62110206
GAS10-*4
MDS62110206
GAS11-*4
MDS62110206
GAS12-*4
MDS62110206
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Place Caps close to DRAM pin
GP2_BCM_ATSC
BCM-DDR
Place Caps close to DRAM pin
09/10/xx
6 100
ATSC TUNER
CHB OPTION
+5V_TU
TUNER TYPE
TU700
TDVJ-H031F
TUNER_NON_CHB_V
DEV
DEV
Vertical
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
SHIELD
TU700-*1
TDVJ-H001F
ANT_PWR[OPT]
1
BST_CNTL
2
+B
3
NC[RF_AGC]
4
AS
5
SCL
6
SDA
7
NC(IF_TP)
8
SIF
9
NC
10
TUNER_NON_CHB_H
VIDEO
11
GND
12
1.2V
13
3.3V
14
RESET
15
IF_AGC_CNTL
16
DIF_1
17
DIF_2
18
19
SHIELD
N.C
N.C
+5V
N.C
N.C
SCL
SDA
N.C
SIF
N.C
CVBS
GND
1.2V
3.3V
RESET
IF_AGC
IF_N
IF_P
Horizon
DEV
TUNER_CHB_H
22
TDTD-V055F
TU701-*1
TDTD-V035F
+B1[1.8V]
1
SCL[SUB]
2
SDA[SUB]
3
RESET[SUB]
4
DIF_2[SUB]
5
DIF_1[SUB]
6
IF_AGC[SUB]
7
CVBS[SUB]
8
SCL[MAIN]
9
SDA[MAIN]
10
+B2[5V]
11
+B3[32V]
12
SIF
13
CVBS[MAIN]
14
GND
15
+B4[1.2V][MAIN]
16
+B5[3.3V][MAIN]
17
RESET[MAIN]
18
IF_AGC[MAIN]
19
DIF_1[MAIN]
20
DIF_2[MAIN]
21
SHIELD
TU701
TUNER_CHB_V
DEV
22
SHIELD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
1.8V
SCL[SUB]
SDA[SUB]
RESET[SUB]
IF_N[SUB]
IF_P[SUB]
IF_AGC[SUB]
CVBS[SUB]
SCL[MAIN]
SDA[MAIN]
5V
+32V_TU
32V
SIF
CVBS[MAIN]
GND
1.2V[MAIN]
3.3V[MAIN]
RESET[MAIN]
IF_AGC[MAIN]
IF_N[MAIN]
IF_P[MAIN]
TU701-*2
TDTD-V056F
+B1[1.8V]
1
SCL[SUB]
2
SDA[SUB]
3
RESET[SUB]
4
DIF_2[SUB]
5
DIF_1[SUB]
6
IF_AGC[SUB]
7
CVBS[SUB]
8
SCL[MAIN]
9
SDA[MAIN]
10
+B2[5V]
11
+B3[32V]
12
SIF
13
CVBS[MAIN]
14
GND
15
+B4[1.2V][MAIN]
16
+B5[3.3V][MAIN]
17
RESET[MAIN]
18
IF_AGC[MAIN]
19
DIF_1[MAIN]
20
DIF_2[MAIN]
21
22
SHIELD
CHB OPTION
+1.8V_TU
+1.26V_TU
60mA
R701
200mA
R702
R738
200
OPT
B
E
C
Q703
ISA1530AC1
OPT
R739
200
OPT
CVBS_CHB_SEARCH
011:C4;007:AI6
+3.3V_TU
+5V_TU
CHB
R713
R712
3.3K
3.3K
R705
100
CHB
100
R706
CHB
C714
C710
47pF
47pF
50V
50V
CHB
CHB
+3.3V_TU
OPT
R704
R703
100K
100
CHB
TUNER_SUB_RESET
C713
009:G5
0.1uF
16V
CHB
+5V_TU
CHB
0
C700
C706
100pF
50V
CHB
0
0.1uF
16V
CHB
+3.3V_TU
+5V_TU
C702
22uF
16V
OPT
C703
100pF
50V
C704
22uF
16V
C709
0.1uF
16V
+5V_NORMAL
L700
BLM18PG121SN1D
C707
0.1uF
16V
C711
0.1uF
16V
C715
0.1uF
16V
OPT
R707
100
R708
R709
R710
0
0
+3.3V_NORMAL
C701
22uF
16V
OPT
+3.3V_TU
BLM18PG121SN1D
C705
22uF
16V
16V
C708
0.1uF
L701
C712
0.1uF
16V
+3.3V_TU
16V
R711
100K
OPT
C716
0.1uF
0
CHB
SCL0_3.3V
SDA0_3.3V
C727
10pF
50V
CHB
R714
TUNER_MAIN_RESET
009:G4
M_IF_AGC
011:D1
M_IF_N
011:D2
M_IF_P
011:D2
NON_CHB
R731
200
CHB
R726
1K
OPT
R724
0
CHB
300
R715
CHB
300
R716
+5V_TU
CHB
16V
0.1uF
C719
OPT
R717
CHB
C726
10pF
50V
CHB
0
IF_N_CHB
015:A3
IF_P_CHB
015:A3
0
IF_AGC_CHB
015:A2
C720
47pF
50V
C721
47pF
50V
+3.3V_TU
R722
3.3K
100
R719
100
R720
R723
3.3K
SCL0_3.3V
SDA0_3.3V
C725
100pF
50V
TU_CVBS_BYPASS
R741
0
TU_CVBS_TR
R725
R727
R728
4.7K
0
R729
B
OPT
1K
+5V_TU
B
R733
220
1K
TU_CVBS_TR
OPT
R730
1K
OPT
R732
470
+5V_TU
B
E
CHB
C
E
C
E
TU_CVBS_TR
C
R735
200
CHB
Q700
ISA1530AC1
Q701
ISA1530AC1
R736
220
TU_CVBS_TR
Q702
ISA1530AC1
R737
82
CVBS_CHB
015:B5;007:AI7
TU_SIF
011:C5
TU_CVBS
011:C4
NON CHB OPTION
+3.3V_TU
C717
2.2uF
16V
IC700
AP1117EG-13
L702
500
ADJ/GND
C718
2.2uF
16V
VOUT = VREF *(1+R2/R1)
+1.26V_TU
L703
C722
22uF
BLM18PG121SN1D
C723
22uF
C724
0.1uF
16V
50V
LE5500 EXCEPT DTV Measure OPTION
OUTIN
R1
120
R718
R2
R721
1
NON_CHB
0
R734
NON_CHB
0
R740
LE5500 EXCEPT DTV Measure
LE5500 EXCEPT DTV Measure
R742
R743
0
0
CVBS_CHB
CVBS_CHB_SEARCH
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2_BCM_ATSC
ATSC_TUNER
09/10/xx
7 100
009:I4
009:I4
009:I4
009:A5;009:I4
009:A5;009:I4
009:I4
081:I5
FLASH_WP
NAND_RBb
NAND_REb
NAND_CEb
NAND_CLE
NAND_ALE
NAND_WEb
Open Drain
D3.3V
R995
10K
B
C
E
R994
2.7K
C958
0.1uF
Q901
KRC103S
C963
4700pF
D3.3V
NC_1
NC_2
NC_3
NC_4
NC_5
NC_6
RB
R
E
NC_7
NC_8
VDD_1
VSS_1
NC_9
NC_10
CL
AL
W
WP
NC_11
NC_12
NC_13
NC_14
NC_15
IC901
NAND04GW3B2DN6E
1
2
3
4
5
DEV
6
7
8
9
10
11
12
13
14
15
16
17
4G8G
18
19
20
21
22
23
24
NC_29
48
NC_28
47
NC_27
46
NC_26
45
I/O7
I/O6
I/O5
I/O4
NC_25
NC_24
NC_23
VDD_2
VSS_2
NC_22
NC_21
NC_20
I/O3
I/O2
I/O1
I/O0
NC_19
NC_18
NC_17
NC_16
NAND_IO[7]
NAND_IO[6]
NAND_IO[5]
NAND_IO[4]
C959
0.1uF
NAND_IO[3]
NAND_IO[2]
NAND_IO[1]
NAND_IO[0]
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
EAN61009301
MAIN_FLASH_4G_NUMONYX
BCM3549 Boot Strap
Boot Strap
Default Res. of all NAND pin is Pull-down
NAND_IO[0] : Flash Select (1)
0 : Boot From Serial Flash
1 : Boot From NAND Flash
NAND_IO[1] : NAND Block 0 Write (DNS)
0 : Enable Block 0 Write
1 : Disable Block 0 Write
NAND_IO[3:2] : NAND ECC (1, DNS)
NAND_IO[4] : CPU Endian (0)
NAND_IO[6:5] : Xtal Bias Control (1, DNS)
00 : 1.2mA (Fundmental Recommand)
10 : 2.4mA (3rd over tune Recommand)
NAND_IO[7] : MIPS Frequency (DNS)
NAND_ALE : I2C Level (DNS)
0 : Enable D2CDIFF AC (DNS)
1 : Disabe D2CDIFF AC
00 : No ECC
01 : 1 ECC Bit
10 : 4 ECC Bit
11 : 8 ECC Bit
0 : Little Endian
1 : Big Endian
01 : 1.8mA
11 : 3.0mA
0 : 405MHz
1 : 378MHz
0 : 3.3V Switching
1 : 5V Switching
NAND_CLE
009:C1;009:I4
009:C1;009:I4
009:C1;009:I4
009:C1;009:I4
009:C1;009:I4
009:C1;009:I4
009:C1;009:I4
009:C1;009:I4
009:A2;009:I4
009:A2;009:I4
NAND_IO[0]
NAND_IO[1]
NAND_IO[3]
NAND_IO[2]
NAND_IO[4]
NAND_IO[6]
NAND_IO[5]
NAND_IO[7]
NAND_ALE
NAND_CLE
R607
R602
R631
2.7K
R609
OPT
R610
OPT
R604
R606
R601
OPT
R603
OPT
R605
D3.3V
2.7K
2.7K
OPT
2.7K
2.7K
OPT
2.7K
2.7K
2.7K
2.7K
2.7K
OPT
R627
2.7K
OPT
R628
2.7K
OPT
R629
2.7K
R630
2.7K
2.7KR608
OPT
R632
2.7K
R633
2.7K
R634
2.7K
R635
2.7K
R636
2.7K
MODEL OPTION
PIN NAME
MODEL_OPT_0
MODEL_OPT_1
MODEL_OPT_2
MODEL_OPT_3
MODEL_OPT_4
MODEL_OPT_5
MODEL_OPT_6G 25OLEDNON_OLED
*MODEL_OPT_0 & MODEL_OPT_4
REFER TO THIS OPTION
MODEL_OPT_0 MODEL_OPT_4
LOWLOW
HIGHLOW
HIGHHIGH
LOWHIG H
2.7K
FRC
R642
2.7K
NON_FRC
R643
OPT
2.7KR645
2.7K
R646
+3.3V_NORMAL
2.7KR647
MAIN_MINI_LVDS
2.7KR648
OPT
MAIN_LVDS
2.7K
R649
2.7K
R650
2.7K
URSA3
R651
2.7K
R652
NON_URSA3
MODEL_OPT_0
MODEL_OPT_1
MODEL_OPT_2
MODEL_OPT_3
MODEL_OPT_4
MODEL_OPT_5
MODEL_OPT_6
R600
R637
R638
R639
D3.3V
2.7K
2.7K
GIP
OPT
R641
R6602.7KR659
100
OPT
100
OPT
100
OPT
100
OPT
2.7K
NON_GIP
R640
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2_BCM_ATSC
BCM-VIDEO
09/10/xx
11 100
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