Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument's
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500
°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500
°F to 600°F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500
°F to 600°F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
This specification sheet applied to LC91E Chassis applied
LCD TV all models manufactured in TV factory.
2. Notes
(1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test equipment.
(2) Adjustments must be done in the correct order.
(3) The adjustments must be performed in the circumstance of
25±5°C of temperature and 65±10% of relative humidity if
there is no specific designation.
(4) The input voltage of the receiver be must kept 100V-240V,
50/60Hz when adjusting.
(5) The receiver must be operated for about 5 minutes prior to
the adjustment when module is in the circumstance of over
15ºC.
In case of keeping module is in the circumstance of 0°C, it
should be placed in the circumstance of above 15°C for 2
hours
In case of keeping module is in the circumstance of below
-20°C, it should be placed in the circumstance of above
15°C for 3 hours,.
(6) The TV and the Media-box must be connected by Wireless
or Wire. : Even if there is only the TV set, it is possible to
adjust the White-balance
- Entry process of White Pattern
1) Press the POWER ON key on R/C for adjustment.
2) Press the ADJ key on R/C and enter EZ ADJUST.
3) Select ‘7. Test Pattern’ by using CH +/- key and select
“White” by using VOL +/-.
* Set is activated HEAT RUN without signal generator in this
mode.
* Single color pattern (RED/BLUE/GREEN) of HEAT RUN
mode uses to check panel.
Caution : If the still image is displayed more than 20
minutes(Especially digital, cross hatch pattern), an afterimage in the black level area.
3. Adjustment items
- Check the TOOL OPTION prior to adjustment. If the TOOL
OPTION is incorrect, correct it then execute the power off/on
to apply the modification (refer to 7.3 TOOL OPTION)
- In case of this chassis,
Set the Media-box option in connection with Wireless or
Wire.
Set the TV option in HDMI5 mode.(remove the wired HDMI
cable)
- Using RS-232, adjust items listed in 3.1 in the other
shown in “4.1.3.3”
2) Adj. protocol
Ref.) ADC Adj. RS232C Protocol_Ver1.0
3) Adj. order
- aa 00 00 [Enter ADC adj. mode]
- xb 00 40 [Change input source to Component1(480i)]
- ad 00 10 [Adjust 480i Comp1]
- xb 00 60 [Change input source to RGB(1024*768)]
- ad 00 10 [Adjust 1024*768 RGB]
- ad 00 90 End adj.
4.2. EDID(The Extended Display Identification
Data)/DDC(Display Data Channel) download
(1) Overview
It is a VESA regulation. A PC or a MNT will display an
optimal resolution through information sharing without any
necessity of user input. It is a realization of “Plug and Play”.
(2) Equipment
- Adjust remote control
- Since embedded EDID data is used, EDID download JIG,
HDMI cable and D-sub cable are not need.
(3)Download method
1) Press Adj. key on the Adj. R/C, then select “8.EDID
D/L”, By pressing Enter key, enter EDID D/L menu.
2) Select [Start] button by pressing Enter key, HDMI1 /
HDMI2 / HDMI3 / HDMI4 / RGB are Writing and display
OK or NG.
* For HDMI5 EDID D/L, Change the TV input mode into
HDMI5 mode then using Adj. R/C, download the HDMI5
EDID.
* HDMI5 / RGB can be downloaded by JIG and cable.
(4) EDID DATA
1) RGB EDID data
2) HDMI EDID data
* Detail EDID Options are below
ⓐ Product ID
ⓑ Serial No: Controlled on production line.
ⓒ Week, Year: Fixed as S/W released day
- In the data of EDID, bellows may be different by S/W or
Input mode.
G VV: Week Manufacture
G WW: Year Manufacture
G XX: C/S
G YY: Physical address
(Generally, HDMI1 : 10 00, HDMI2 : 20 00 ¶)
5. Final assembly adjustment
5.1. White Balance Adjustment
5.1.1. Overview
• W/B adj. Objective & How-it-works
- Objective: To reduce each Panel’s W/B deviation
- How-it-works : When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic Range. In order to
prevent saturation of Full Dynamic range and data, one of
R/G/B is fixed at 192, and the other two is lowered to find
the desired value.
5.1.2. Equipment
(1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 / LED
Module : CH14)
(2) Adj. Computer(During auto adj., RS-232C protocol is
needed)
(3) Adjust Remote control
(4) Video Signal Generator MSPG-925F 720p/216-Gray
(Model:217, Pattern:78)
-> Only when internal pattern is not available
• Color Analyzer Matrix should be calibrated using CS-1000
- Check that Power Cord is fully inserted to the SET.
(If loose, re-insert)
2) Perform GND & Internal Pressure auto-check
- Unit fully inserted Power cord, Antenna cable and A/V
arrive to the auto-check process.
- Connect D-terminal to AV JACK TESTER
- Auto CONTROLLER(GWS103-4) ON
- Perform GND TEST
- If NG, Buzzer will sound to inform the operator.
- If OK, changeover to I/P check automatically.
(Remove CORD, A/V form AV JACK BOX)
- Perform I/P test
- If NG, Buzzer will sound to inform the operator.
- If OK, Good lamp will lit up and the stopper will allow the
pallet to move on to next process.
6.2. Checkpoint
• TEST voltage
- GND: 1.5KV/min at 100mA
- SIGNAL: 3KV/min at 100mA
• TEST time: 1 second
• TEST POINT
- GND TEST = POWER CORD GND & SIGNAL CABLE
METAL GND
- Internal Pressure TEST = POWER CORD GND & LIVE &
NEUTRAL
• LEAKAGE CURRENT: At 0.5mArms
7. ETC.
7.1. USB S/W Download (option)
(1) Overview
USB download allows fast S/W upgrade in SVC areas or
during Board-level production.
(2) Dowunload method
1) After Set on, confirm that image is displayed. (For
updating Monitor, first input change to HDMI5)
2) Insert USB memory stick that contains the S/W and after
a few seconds, Upgrade OSD is displayed.
(If the version of download file in USB is lower than the
current version, Upgrade OSD is not displayed)
3) After download is finished, automatically Power off/on is
executed.
(If auto power on/off is not executed, perform the power
off/on manually)
4) S/W upgrade is completed and eject USB Memory Stick
form USB jack.
5) By pressing IN-START key on the adj. R/C, check the
S/W version.
7.2. TOOL OPTION
(1) Overview
- The model name and spec. will be confirmed and
modified by adj. menu.
- No Modification at discretion
(2) Confirm/Modify method
1) By Pressing ADJ key, [EZ ADJUST] -> [0.Tool Option1].
2) In the Tool Option1, It is possible to modify the Inch/
Tool/ Module maker/ Module revision.
3) Contents of Tool Option 1~4 are like the section 7.2.(3)
* Entering into IN-START mode, [1.Adjust Check] shows
Tool Options.
(3) Contents of Tool Option
1) Tool Option1
- Inch
- Tool
- Maker
- Module Rev.
2) Tool Option2
- HDMI Count
- HDMI Switch IC
- Component Count
- S-Video
- RCA AV Count
- Scart Count
3) Tool Option3
- EMF(JPEG,MP3)
- Divx
- Bluetooth
- Digital Eye.
- Headphone
- OPC
- EPA
- e-Manual
- Audio Amp
- LED Type
- New E-Con
4) Tool Option4
- Clear QAM
- Local Dimming
- THX
- Digital Demod
- Analog Demod
- THX Media Director
7.3. Tool Option Setting
Tool Option4 should be set to TV ‘51840’, Media-Box ‘51872’ as
a manufacturing default.
By ‘IN-STOP’ to make shipping condition, it will be set to TV
‘19072’, Media-Box ‘19104’ automatically.
1. When setting up Media-Box at the cabinet and on th surface, etc
(1) If the surface distance becomes more than 20cm at [fig. 1],
wireless connection difficulty could be happened.
(2) Set up Media-Box making the surface distance as less than
20cm as possible.
(3) If the surface distance becomes more than 20cm unavoidably at
[fig. 2], a noise could be generated on the screen due to the drop
of wireless connection sensitivity.
(4) Improve wireless connection sensitivity by raising a wireless
emission angle using rubber (providing accessory).
2. When setting up Media-Box and TV, facing each other
If the surface distance on which Media-Box is placed becomes more than
20cm, wireless connection sensitivity could be dropped, and it is
recommended to use rubber.
3. In case setting up by using a reflection
The whole reflected distance shouldn’t be over 10m, and if
using a rubber according to the condition how Media-Box is
placed, wireless connection sensitivity improves. (a+b
distance should be smaller than 10m.)
[Fig. 3] Attach rubber to the lower part of Media-Box.
Page 15
- 15 -
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
300
200
200N
501
510
511
900
A10
531
530
400
800
801
802
541
540
542
803
550
500
310
120
121
590
532
700
710
770
780
790
720
730
750
740
760
804
543
A2
A22
LV1
LV2
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
In case of 2Vrms INPUT, Voltage divider for Mstar(3.3Vp-p ADC) * PC sound input & AV audio input voltage divider value is different so we need cordinate it in next model
D3.3V_2
R1237
4.7K
R1240 1K
D3.3V_2
R1277
4.7K
R1283 1K
D3.3V_2
R1204
4.7K
SYS_UART_RXD
SYS_UART_TXD
R1056
4.7K
220pF
C1114
C1252
47pF
50V
C1227
47pF
50V
C1229
47pF
50V
C1230
47pF
50V
50V
R1212 1K
R1060 1K
D3.3V_2
R1248
4.7K
AV1_CVBS_IN
AV2_CVBS_IN
AV1_Y_IN
AV1_C_IN
D3.3V_L
014:C5;014:F5
014:F5
220pF
C1115
50V
D3.3V_2
L1103 BLM18PG121SN1D
C1112
0.1uF
16V
OPT
OPT
6
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
AV1_SVIDEO_DET
R1254 1K
001:B2;009:B4
001:B2;009:B4
OPT
AV1_CVBS_DET
AV2_CVBS_DET
001:B2;009:B4
001:B2;009:B4
D1101
ADUC30S03010L
COMP1_DET
COMP2_DET
OPT
001:B3;009:I4
009:F5
C1130
47pF
50V
D1102
ADUC30S03010L
001:B2;009:I4
001:B2;009:I4
001:B3;009:I4
TXD
RXD
C1131
47pF
50V
R1133
220
R1134
220
001:B2
GND_CONTACT
R_CONTACT
T_CONTACT
SWITCH_A
SWITCH_B
SWITCH_C
SWITCH_F
SWITCH_E
001:B3
001:B3
001:B3
001:B3
001:B2
001:B2
001:B2
AV1_AUDIO_L
AV1_AUDIO_R
AV2_AUDIO_L
AV2_AUDIO_R
COMP1_AUDIO_L
COMP1_AUDIO_R
COMP2_AUDIO_L
COMP2_AUDIO_R
J1100
KJA-PH-1-0107
5
1
4
6
SHIELD
R1211 10K
R1205 10K
R125 9 1 0K
R125 8
R1252 10K
R1251 10K
R129 2 1 0K
R129 1 1 0K
AV1_L_IN
R1210
C1251
12K
1000pF
50V
AV1_R_IN
R1207
C1250
12K
1000pF
50V
Lowpass filter Fc=29Khz
AV2_L_IN
R1264
C1224
12K
1000pF
50V
10K
AV2_R_IN
C1243
R1263
1000pF
12K
50V
COMP1_L_IN
R1256
12K
COMP1_R_IN
C1221
R1255
1000pF
12K
50V
COMP2_L_IN
C1237
R1294
1000pF
12K
50V
COMP2_R_IN
C1238
R1293
1000pF
12K
50V
C1225
1000pF
50V
009:D3
009:D3
009:D3
009:D3
009:D3
009:D3
009:D3
009:D3
F
RGB PC
009:B3
009:B3
009:B3
009:B3
009:B3
DSUB_VSYNC
DSUB_HSYNC
DSUB_B
C1231
68pF
DSUB_G
DSUB_R
C1232
68pF
R1232 68
R1233 68
R1234
75
R1235
75
R1236
75
AT24C02BN-10SU-1.8
A0
1
A1
2
A2
3
GND
4
IC1200
8
7
2mA
6
5
D1207
ADUC30S03010L
C1216
OPT
C1217
OPT
C1218
OPT
VCC
WP
SCL
SDA
D1217
ADUC30S03010L
D1218
ADUC30S03010L
D1219
ADUC30S03010L
GD
C1222
18pF
50V
D1216
ADUC30S03010L
R1249
R1253
4.7K
4.7K
C1223
18pF
50V
R1257
22
111213
6
7
1
2
JK1201
KCN-DS-3-0054
D1223
ENKMC2838-T112
C
R1262
10K
R1269
D1222
ADMC5M03200L
OPT
8
9
3
A1
A2
100
14
4
C1228
0.1uF
16V
HE
D5.0V_VGA
P5.0V_ST
009:I5
VGA_EEPROM_WP
009:A6;009:F4
ISP_RXD
ISP_TXD
R1238 0
R1239 0
R1265
22
D1224
ADMC5M03200L
OPT
D5.0V_1
R1270
10K
R1271 1K
D1225
ADMC5M03200L
OPT
R1268 0
OPT
15
16
10
5
RGB_DDC_SCL
RGB_DDC_SDA
D5.0V_VGA
C1226
0.1uF
16V
009:A6;009:F4
012:F3
012:F3
DSUB_DET
PC AUDIO
JK1205
KJA-PH-1-0107
GND_CONTACT
5
R_CONTACT
1
T_CONTACT
4
SWITCH_A
SWITCH_B
A
B
SWITCH_C
C
DSWITCH_D
SWITCH_F
F
E
SWITCH_E
6
SHIELD
A
B
C
DSWITCH_D
F
E
SPDIF OPTIC JACK
NAND GATE FOR INVERTING
SPDIF_OUT
017:A2;009:E3
R1381
4.7K
A
B
GND
NL17SZ00DFT2G
1
2
3
In case of 2Vrms INPUT, Voltage divider for Mstar(3.3Vp-p ADC)
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
D3.3V_2
R1500
47K
OPT
0
R513
OPT
VR503
AVRL161A1R1NT
OPT
R516 1K
OPT
0
002:B3;002:B5;002:D1;002:E1;002:H5
0
HDMI_PORT3
D3.3V_2
R1503
47K
R514
OPT
0
OPT
VR504
OPT
R517 1K
AVRL161A1R1NT
002:B1;002:B5;002:D1;002:E1;002:H5
0
0
0
0
0
0
0
0
HDMI_PORT2
D3.3V_2
R1507
OPT
47K
0
HPD4
002:G3
R521
1K
OPT
0
002:B1;002:B3;002:D1;002:E1;002:H5
0
0
0
0
0
0
0
0
HDMI_PORT4
JP506
JP507
JP505
002:F6
JP502
JP503
002:C4;002:G6
002:C4;002:G6
002:G6
002:G6
002:G6
002:G6
002:G6
002:G6
002:G6
002:G6
002:H5
JP504
002:D3;002:H4
002:D3;002:H4
002:H4
002:H4
002:H4
002:H4
002:H4
002:H4
002:H4
002:H4
002:D4;002:G3
002:D4;002:G3
002:G3
002:G3
002:G3
002:G3
002:G3
002:G3
002:G3
002:G3
HPD3
DDC_SDA_3
DDC_SCL_3
CEC_REMOTE
CK-_HDMI3
CK+_HDMI3
D0-_HDMI3
D0+_HDMI3
D1-_HDMI3
D1+_HDMI3
D2-_HDMI3
D2+_HDMI3
HPD2
DDC_SDA_2
DDC_SCL_2
CEC_REMOTE
CK-_HDMI2
CK+_HDMI2
D0-_HDMI2
D0+_HDMI2
D1-_HDMI2
D1+_HDMI2
D2-_HDMI2
D2+_HDMI2
DDC_SDA_4
DDC_SCL_4
CEC_REMOTE
CK-_HDMI4
CK+_HDMI4
D0-_HDMI4
D0+_HDMI4
D1-_HDMI4
D1+_HDMI4
D2-_HDMI4
D2+_HDMI4
GND
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
JK500
KJA-ET-0-0032
5V_HDMI_1
R533R545
R534
47K
5V_HDMI_3
R536
IF HDMI 15M TEST FAIL, CHANGE 47K PULL UP RESISTOR VALUE TO 4.7K
VARISTORS(VR500/501/502/503/504/505/506/507) on lines-HPD1/2/3/4 are all options
in case HDMI Switch doesn’t support ’ESD protection’
5V_HDMI_1
R500 3.6K
OPT
R1504
1K
OPT
OPT
VR502
R503 0
R504 0
AVRL161A1R1NT
R505
R577 0
R579
R580
R581 0
R578
R582
R583
R584
FRONT_HDMI_PORT1
DDC_SDA_1
DDC_SCL_1
DDC_SDA_3
DDC_SCL_3
C500
0.1uF
16V
OPT
0
5V_HDMI_2
5V_HDMI_4
HP_DET
5V
GND
DDC_DATA
DDC_CLK
NC
CE_REMOTE
CK-
CK_GND
CK+
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
GND
R535
47K
R538
R537
47KR559
47K
DEH
D3.3V_2
R1505
R512
47K
0
OPT
OPT
VR505
OPT
R515 1K
AVRL161A1R1NT
JP500
JP501
002:C3;002:E4
002:B1;002:B3;002:B5;002:E1;002:H5
0
0
0
0
0
0
R547
R546
47K
47K
R558
R561
47K
47K
EDID Pull-up
* HDMI CEC
Protect reverse current from external device to TV set When Set Power off
002:F4
HPD1
DDC_SDA_1
002:C3;002:E4
DDC_SCL_1
CEC_REMOTE
CK-_HDMI1
002:F4
CK+_HDMI1
002:F4
D0-_HDMI1
002:F4
D0+_HDMI1
002:F4
D1-_HDMI1
002:F5
D1+_HDMI1
002:F5
D2-_HDMI1
002:F5
D2+_HDMI1
002:F5
DDC_SDA_2
DDC_SCL_2
DDC_SDA_4
DDC_SCL_4
002:B1;002:B3;002:B5;002:D1;002:H5
CEC_REMOTE
0
GND
DDC_SDA_1
DDC_SCL_1
HDMI 1
For Only TDA9996 ES3
R520
VR508
AVRL161A1R1NT
D3.3V_HDMI
The Value is nedd to be adjustable for External Load in case of HDMI regualtion test
If there is problem about DCDC BS, then change to R742 0ohm
GND
D5.0V_W
L700
OPT
C720
10uF
OPT
C721
0.1uF
16V
C722
8.0PI
OPT
3.9K
L710
3.6uH
NR8040T3R6N
D704
SML-512UW
PV
D3.3V_1
C751
10uF
6.3V
GND
L720
BLM18PG121SN1D
C746
0.1uF
L701
CB3216UA121
Q701
SI4925BDY
1S1
2G1
3S2
4G2
8 D1_2
7 D1_1
6 D2_2
5 D2_1
BLM18PG121SN1D
C750
22uF
16V
GNDGND
L727
C780
OPT
0.1uF
16V
6
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
0.1uF
0.1uF
10uF
16V
10V
C1014
C1015
Close to IC
R1003
1K
1/16W
5%
C1006
0.1uF
16V
+3.3V_DTMB
R1005
R1004
4.7K
4.7K
OPT
OPT
009:G20
009:G21
FE_DEMOD_SCL
001:D21
FE_DEMOD_SDA
001:D21
001:X26
A1[RD]
C
A2[GN]
LDPC ERR
LD1200
SAM2333
R1006
200
A1[RD]
C
A2[GN]
LOCK
LD1201
SAM2333
IC1000
BA50BC0WFP-E2
2
4
1
3
5
NC
CTL
GND
+3.3V/+1.2V_DTMB
C1011
C1008
0.1uF
100uF
16V
16V
C1009
C1012
0.1uF
100uF
16V
16V
IC1002
SC4215ISTRT
NC_1
1
EN
2
C1004
VIN
3
10uF
10V
NC_2
4
16V
SYNCLOCK
/FE_RESET
OUT
16V
0.01uF25V
0.01uF25V
+3.3V_DTMB
BLKERR
C1033
C1029
C1022
0.1uF
0.1uF
0.1uF
16V
16V
16V
+1.2V_DTMB
C1021
C1028
C1032
16V
0.1uF
R1007
4.7K
R1008 100
R1009 100
BLKERR
SYNCLOCK
C1038
0.1uF
0.1uF
16V
16V
16V
+3.3VA_DTMB
C1034
0.1uF
0.1uF
16V
16V
C1023
1uF
OPT
R1010
100
C1025
C1035
22pF
22pF
50V
50V
R1011
100
C1036
C1026
22pF
22pF
50V
50V
R1012
100
C1027
C1037
22pF
22pF
50V
50V
009:H27
009:H27
0.1uF
C1019
0.1uF
16V
C1020
0.1uF
16V
+5V_TUNER
+5V_TUNER
C1031
C1024
100uF
4.7uF
16V
10V
IC1001
KIA78R033F
VIN
1
VC
2
VOUT
3
NC
4
GND1
5
GND
8
ADJ
7
VO
6
NC_3
5
+1.2V_DTMB
R1014
5.1K
C1040
R1013
0.1uF
10K
16V
No more production TXC, China local cyristal will be used at MP
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
3V US OPTION ( TV, COMP1/2, AV1(SVIDEO), AV2, HDMI1/2/3/4, RGB, POWER ON/OFF
CHINA FOLOW US OPTION / SVIDEO HAS PRIOTY THAN AV1
EEPROMMICOM RESET
M24C16-WMN6T
1
1
2
2
3
3
4
4
TP400
R400
47K
5
6
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
pAY ATTEMTION ABOUT TTL LINE BOARD DESIGNE TO DEDUCE EMI
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
1
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
1
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
1
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
1
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
1
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
1
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
1
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
1
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
1
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
▶ Check the EDID of HDMI & RGB
▶ Check cable & contact error
TV SET
LCD
MODULE
LGD V4
bBad image
- IC’s cold soldering or memory defect accompanied noise on osd
Bad sound / No sound
Wireless connecting osd is displayed continually
- There is no video signal from Rx module to TV main ic, so TV
understand this time like disconnection state and display connecting
osd continually. And then, if TV is not activated rightly within 15min,
it will go to st-by mode.
CBad image / Bad or No sound
Wireless connecting osd is displayed continually
-No image
*Focused on Wireless connecti on
No effect directly
No effect directly
No connection
No effect directly
No connection
▶ Check main ic basic power & power
sequence
▶ Control line check (I2C & etc)
▶ Check input/output video & audio
signal
▶ Check power & control line
▶ Check input/output signal
▶ Check inner HDMI cable connection
status
(There can be cable’s defect.)
Page 64
Trouble shooting
WIRELESS LH95
WIRELESS MODEL
abcdefg
INPUTMAIN IC
Analog
Digital
AV
Component
HDMI
OSDOSD
Wireless
RX MODULE
SB9111 +
SB9121 +
SIL9134
HDMI
LGE3159
LVDS
DTC30LM36 +
SIL9134
SIGNAL
CONVERTER
HDMI
TX MODULE
SIL9125 +
SB9120 +
SB9110
MAIN IC
LGE3369 +
LGE7329
LVDS
RGB
MEDIA-BOX
Service
only
HDMI JACK
Defect blockSymptomsWireless connectionCheck
d
e
Wireless connection osd is displayed continually
- That osd can be appeared by HDMI cable or Jack defect even
though wireless connection is completed.
(only Rx module)
- IC’s cold soldering or memory defect accompanied noise on osd
Bad sound / No sound
gBad image or No imageNo effect directly▶ Ticon b/d or Inverter check
*Defect block means from itself to ahead of next part.
*Wireless TV is similar with the model usi n g LGE3 15 9 o r LGE3 36 9 e xce pt fo r w ire les s pa r ts.
No effect directly▶ Check main ic basic power & power
sequence
▶ Check control line (I2C & etc)
▶ Check input/output video & audio
signal
▶ Check LVDS cable & wafer locking
(There can be cable’s defect.)
▶ Check power
Page 65
Trouble shooting
WIRELESS LH95
WIRELESS MODEL
abcdefg
INPUTMAIN IC
Analog
Digital
AV
Component
HDMI
OSDOSD
Wireless
RX MODULE
SB9111 +
SB9121 +
SIL9134
HDMI
LGE3159
LVDS
DTC30LM36 +
SIL9134
SIGNAL
CONVERTER
HDMI
TX MODULE
SIL9125 +
SB9120 +
SB9110
MAIN IC
LGE3369 +
LGE7329
LVDS
RGB
MEDIA-BOX
Service
only
HDMI JACK
Wired
HDMI CABLE
HDMI5
HDMI JACK
TV SET
※ Check first when Wireless connection is disable!
- Pairing
- S/W version check
- Fan defect
▷ TV Rx module fan defect: Check Fan error of TV In-start menu
▷ Media-Box fan defect: Check the red led’s blinking of Media-Box front
- Wireless interference check
▷ Refer to the installation method guide
- Inner HDMI cable’s connection status (From Rx/Tx module to Main)
LCD
MODULE
LGD V4
※ Check Tip
- In some cases, TV only or Wired mode make easy to check.
※ Caution & Information
- TV set & Media-Box is just 1:1 connection. (No multiple device connection)
- In order to download TV set, you must change the mode to HDMI5 or turn off Media-Box.
- Rx/Tx module’s performance is very sensitive to temperature. So, When you repair the defect, should keep up with
the original assembly state.
Page 66
Trouble shooting
Pairing for SVC
1. Turn on the TV SET & Media-Box
2. Connect TV HDMI5 Jack & Media-Box rear [Service only] Jack with HDMI cable
HDMI CABLE
3. Enter the [IN START(Media Box)] menu and go to sub-title [9.Wireless check]
Enter menu and Push the left or right remote-controller button.
WIRELESS LH95
Check the Paired Status if changed from NG to OK
※ If s/w version of Tx/Rx module & TV/Media-box main isn’t matched, Wireless can’t be
connected, So at that time check the version and upgrade by usb
If there are 2 or more wireless tv set, it’s need to be set
channel respectively. (Must separate them more than 10m)
4. Remove HDMI cable & check wireless connection.
If connection is not completed, power off and on the TV & Media-Box.
Page 67
About Wireless TV
NORMAL MODEL
WIRELESS LH95
INPUTMAIN IC
AV
Component
Analog
Digital
MSTAR
BCM
HDMI
RGB
WIRELESS MODEL
INPUTMAIN IC
AV
Analog
Digital
LGE3159
Component
HDMI
RGB
TV SET
LVDS
LVDS
SIGNAL
CONVERTER
DTC30LM36 +
SIL9134
LGD
AUO
CMO
HDMI
LCD
MODULE
SIL9125 +
SB9120 +
SB9110
TX MODULE
Wireless
RX MODULE
SB9111 +
SB9121 +
SIL9134
HDMI
MAIN IC
LGE3369 +
LGE7329
LVDS
LCD
MODULE
LGD V4
MEDIA-BOX
TV SET
Page 68
About Wireless TV
WIRELESS LH95
TX Module
From Media-Box Main b/d
To TV Main b/d
Media-Box
HDMI Cable
HDMI Cable
RX Module
SIL9125
SIL9134
PIC32MX
[MICOM]
SB9120
[B/B]
SB9121
[B/B]
TV SET
SB9110
[RF]
SB9111
[RF]
TX module
RX module
Page 69
About Wireless TV
Top view of RF IC (Antenna)
WIRELESS LH95
SB9110
HRP Channel
LR
HR
Unused
SB9111
LR
HR
Unused
LRP Channel
F
c(HRP)
= 60.48㎓
Page 70
About Wireless TV
WIRELESS LH95
Wireless
LRP
TX moduleRX module
HRP
LRP: Control data
HRP: Video & Audio data
Wireless TV is similar to the walkie-talkie. We mu st m atch the cha nn el of Tx & Rx module.
There are 4 HRP channel(A1~A4). We use only A2 channel and 3 LRP channel like this [60 .32㎓],
[60.48㎓],[60.64㎓].
First thing, the LRP channel setting has to be matched in wired mode. There are not only channel
but also mac address that Tx/Rx modules have it’ s own for prev e nting wir ele ss int erf er ence .
Set the LRP channel and share the mac address each other, that’s called pairing.
After pairing, Antenna search and set the wireless path by LRP and then send video & audio data to
HRP channel.
Page 71
Block DiagramTV SET
NOT FOR USER
Connect to Rx b/d
HDMI CABLE
5.0V
8p wafer
JK505
HDMI
Transmitter
[SiI9134]
24
IC103
NAND-Flash
X100
X-tal(12㎒)
JK300
IC300
EEPROM
3.3V_L
1.8V_L
IC104
KIA7427F
IC102
S-Flash
(32Mb)
(512Mb)
For wireless
For wired
& 범용
IC101
NVRAM
24C512
R
e
s
e
t
IC200,201
(512Mb X 2)
(512Mb X 2)
IC100
LGE3159GV
Saturn5
DDR2
DDR2
MCLK
IC400
IC800,801
DDR2
DDR2
(512Mb X 2)
(512Mb X 2)
IC701
LGE7329A
Ursa
IC901
24C32
IC900
LG5110
Local dimming
MODULE
NTP3100L
I2S
(D-AMP)
HDMI_3
HDMI_2
IC1000
JK500JK504
24C16
IC1002
WT61P8
USB
Micom
IR & Local KEY
RS-232
Only for service
X1000
X-tal(24㎒)
MICOM
[PIC32]
Network
Processor
[SB9121]
RF
Transceiver
[SB9111]
Wireless RX Module
3.3V_L
2.5V_L
1.0V_L
2.5V_L
1.5V_L
1.2V_L
1.0V_L
Page 72
MEDIA-BOX(SIMPLE)Block Diagram
Can Tuner
(TDFR-Z751D)
Rear jack b’d
AV1
AV2
COMPONENT1
COMPONENT2
RGB
SPDIF
Demodulator
IF
(LG3900)
31P Wafer : rear jack
b’d & main b’d
(P1200)
RS-232C
(MAX3232CDR)
FE_TS_SERIAL
FE_VMAIN
FE_SIF
AV1_CVBS_IN
AV2_CVBS_IN
COMP1_Y/Pb/Pr
COMP2_Y/Pb/Pr
DSUB_ R/G/B
DSUB_H/VSYNC
AUDIO IN
IR (For test)
DGB_TX/RX
SPDIF_OUT
MSTAR
SATURN6
[MSD3369GV]
I2S
LVDS
USB_DM/DP
LVDS Receiver
(THC63LVD1024
/ DTC30LM36)
SPI_CK/CS/D0/D1
ADDR_D[0:15]
ADDR_A[0:12]
BDDR_D[0:15]
BDDR_A[0:12]
I2C
PCM_A[0:7]
I2C
TMDS[0:7]
HDMI_CEC
HPD
5V_HDMI
USB
TTL
USB Power
HDMI
4:1 Switch
(TDA9996)
HDMI Splitter
(PI3HDMI1210)
HDMI
Transmitter
(SiI9134)
Serial Flash
For Boot
DDR2 SDRAM
(1Gbit)
HYNIX/ELPIDA
DDR2 SDRAM
(512Mbit)
HYNIX/ELPIDA
MICOM
Weltrend
NAND Flash
HYNIX
(64MB)
EEPROM
AT24C512
MIC2009YM6-TR
USB Power
To TV
For
wireless
HDMI
Out
HDMI
1/2/3/4
Rear : 3
Front :1
HDMI
In
Page 73
Block DiagramMEDIA-BOX(VIDEO)
ANT/
CABLE
IN
Composite
Video
IN
Component
(Y,Pb,Pr)
IN
RGB
IN
HDMI
IN
(x4)
5.0V_TU
Analog/D
TMB
Half-NIM
TUNER
FRONT
BACK
I2C_CH2(Demod
repeater
DDC_RGB
AV1_Y/C_IN
CEC_RX
HDMI
Switch
(4-to-1)
[TDA9996]
I2C_CH2
+3.3V_DTMB
DTMB/DVB-C
IF
Demodulator
ANALOG
VIDEO
INPUT
FE_VMAIN
AV1_CVBS_IN
AV2_CVBS_IN
COMP1-Y/Pb/Pr
COMP2-Y/Pb/Pr
DSUB-R/G/B
HDMI
DIGITAL
VIDEO
INPUT
D3.3V_HDMI
D1.8V_HDMI
+1.2V_DTMB
[LG3900]
TS
+3.3VA_DTMB
I2C_CH2
I2C_CH1
I2C_CH2
I2C_CH4
LCD/PDP
DIGITAL TV
PROCESSOR
[MSD3369GV]
D1.26V
D1.8V_DDR3.3V_V
_VDDC
I2C_CH4
CEC_RX
DDC_RGB
MiCOM
[WT61P8S]
DDP
D3.3V_L
D3.3V_
1
CEC_TX
DUAL
LVDS
D3.3V_2
Receiver
[DTC30LM36]
HDMI
TX_SEL
LVDS
D3.3V_2
30
Transmitter
[SiI9134]
D1.8V_1
HDMI
I2C_CH2
HDMI
I2C_CH4
D5.0V_W
D3.3V_3 D5.0V_1
HDMI
DeMUX
[PI3HDMI1210]
HDMI
TX_SEL
WiHD TX I/F
Wireless Module
CEC_TX
HDMI
Receiver
[SiI9125]
24
Network
Processor
[SB9120]
RF
Transceiver
[SB9110]
HDMI
OUT
3.3V_L
1.8V_L
3.3V_L
2.5V_L
1.0V_L
2.5V_L
1.5V_L
1.2V_L
1.0V_L
Page 74
MEDIA-BOX(AUDIO)Block Diagram
ANT/
CABLE
IN
Composite
Video
IN
Component
(Y,Pb,Pr)
IN
RGB
IN
5.0V_TU
Analog/D
TMB
Half-NIM
TUNER
I2C_CH2(Demod
repeater
+3.3V_DTMB
DTMB/DVB-C
IF
Demodulator
ANALOG
AUDIO
INPUT
FE_SIF
A/V Audio-1
A/V Audio-2
COMP Audio-1
COMP Audio-2
RGB Audio
HDMI
DIGITAL
AUDIO
INPUT
+1.2V_DTMB
[LG3900]
TS
+3.3VA_DTMB
I2C_CH2
I2C_CH1
I2C_CH2
I2C_CH4
LCD/PDP
DIGITAL TV
PROCESSOR
[MSD3369GV]
D1.26V
D1.8V_DDR3.3V_V
_VDDC
DDP
D3.3V_
1
S/PDIF
I2S
HDMI
TX_SEL
D3.3V_2
Transmitter
[SiI9134]
D1.8V_1
HDMI
I2C_CH2
HDMI
I2C_CH4
D5.0V_W
D3.3V_3 D5.0V_1
HDMI
DeMUX
[PI3HDMI1210]
TX_SEL
WiHD TX I/F
HDMI
Receiver
[SiI9125]
S/PDIF
OUT
HDMI
OUT
3.3V_L
1.8V_L
HDMI
IN
(x4)
FRONT
BACK
HDMI
Switch
(4-to-1)
[TDA9996]
I2C_CH2
D3.3V_HDMI
D1.8V_HDMI
I2C_CH4
MiCOM
[WT61P8S]
D3.3V_L
Network
Processor
[SB9120]
RF
Transceiver
[SB9110]
Wireless Module
3.3V_L
2.5V_L
1.0V_L
2.5V_L
1.5V_L
1.2V_L
1.0V_L
Page 75
ADCI_P/N
TX MODULEBlock Diagram
HDMI
CABLE
Control
&
Power
CABLE
(12p)
DDC(2line)
TMDS(8line)
XTAL
(28.322MHz)
HDMI_INT
HDMI_RST#
SiI9125
HDMI
Receiver
D[35:0]
H/VSYNC
DE
IDCK
MCLK/SCK/W
S
I2S
SPDIFI
I2C(2line)
SiBEAM_INT
SiBEAM_RST#
SB9120
Network
Processor
Embedded
CPU
ADCQ_P/N
PCLK_P/N
OSC
(54MHz)
SLEEP
XTAL
(3.6864MHz)
DACI_P/
N
DACQ_P/N
RF Control
SPI Bus(4line)
MX1605
Serial Flash
SB9110
Transceiver
3.3V
2.5V
1.5V
1.2V
1.0V
RF
Power
Power Source
(5V)
Page 76
RX MODULEBlock Diagram
HDMI
CABLE
Power
CABLE
(8p)
DDC(2line)
TMDS(8line)
SiI9134
HDMI
Transceiver
XTAL
(27MHz)
D[35:0]
H/VSYNC
DE
IDCK
MCLK/SCK/W
S
I2S(4line)
SPDIFO
VCXOVCXO
Video
PLL
Video
DAC
Audio
SB9121
Network
Processor
Embedded
CPU
PLL
XTAL
(27MHz)
Audio
DAC
I2CI2CACLKVCLK
ADCI_P/N
ADCQ_P/N
PCLK_P/N
(3.6864MHz)
DACI_P/N
DACQ_P/N
RF Control
OSC
(54MHz)
SLEEP
XTAL
SB9111
RF
Receiver
I2C(2line)
RST#
I2C(2line)
INT
Micom
(PIC32MX340F256H)
INT
RST#
SPI Bus
MX1605
Serial Flash
3.3V
2.5V
1.5V
1.2V
1.0V
Power
Power
Source
(5V)
Loading...
+ hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.